CN117715330A - Middle frame of mobile terminal, mobile terminal and preparation method of middle frame - Google Patents
Middle frame of mobile terminal, mobile terminal and preparation method of middle frame Download PDFInfo
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- CN117715330A CN117715330A CN202211102132.6A CN202211102132A CN117715330A CN 117715330 A CN117715330 A CN 117715330A CN 202211102132 A CN202211102132 A CN 202211102132A CN 117715330 A CN117715330 A CN 117715330A
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000010410 layer Substances 0.000 claims abstract description 154
- 238000005260 corrosion Methods 0.000 claims abstract description 68
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 230000007797 corrosion Effects 0.000 claims abstract description 29
- 230000005611 electricity Effects 0.000 claims abstract description 26
- 239000011241 protective layer Substances 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 238000005536 corrosion prevention Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 11
- 238000010329 laser etching Methods 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 8
- 229910000733 Li alloy Inorganic materials 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- 238000005137 deposition process Methods 0.000 claims description 6
- 239000001989 lithium alloy Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910000676 Si alloy Inorganic materials 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- MKPXGEVFQSIKGE-UHFFFAOYSA-N [Mg].[Si] Chemical compound [Mg].[Si] MKPXGEVFQSIKGE-UHFFFAOYSA-N 0.000 claims description 3
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 claims description 3
- GCICAPWZNUIIDV-UHFFFAOYSA-N lithium magnesium Chemical compound [Li].[Mg] GCICAPWZNUIIDV-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims 1
- 230000036961 partial effect Effects 0.000 description 6
- 229910000861 Mg alloy Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
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- 238000001125 extrusion Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
Abstract
The application relates to the technical field of terminals, in particular to a middle frame of a mobile terminal, the mobile terminal and a preparation method of the middle frame. The middle frame of the mobile terminal comprises a metal main body and a protective layer for wrapping the metal main body, wherein the inner side of the metal main body is used for accommodating components of the mobile terminal, and the protective layer is provided with a hollowed-out part so that part of the metal main body is exposed, and the exposed metal main body forms a power-on area; wherein, the surface of the electricity guiding area is provided with a conductive anti-corrosion layer. The conductive anticorrosive coating is arranged at the electricity guiding area of the middle frame of the mobile terminal, so that the electricity guiding area can be conductive, the mobile terminal also has good corrosion resistance, and the reliability of the middle frame is improved.
Description
Technical Field
The application relates to the technical field of terminals, in particular to a middle frame of a mobile terminal, the mobile terminal and a preparation method of the middle frame.
Background
The magnesium alloy has good stability and lighter weight, and in order to realize the light weight of the product, the magnesium alloy is used as a middle frame in many mobile terminal equipment. The middle frame needs to be provided with a metal exposed area to meet the requirement of electrostatic discharge (ESD) detection, however, the exposed metal is easily corroded, and thus the reliability of the middle frame is affected.
Disclosure of Invention
The application provides a middle frame of a mobile terminal, the mobile terminal and a preparation method of the middle frame, so that corrosion resistance of a power-on area of the middle frame is improved, and reliability of the middle frame is improved.
In a first aspect, the present application provides a middle frame of a mobile terminal, where the mobile terminal may be a mobile phone, a notebook computer, a tablet computer, or a wearable device. The middle frame of the mobile terminal can comprise a metal main body and a protective layer, the metal main body is wrapped by the protective layer, the inner side of the metal main body can be used for accommodating components of the mobile terminal, and a hollowed-out part can be arranged on the protective layer, so that the metal main body wrapped by the protective layer is partially exposed, the exposed part of the metal main body can form a power-on area, and when the power-on area is used for conducting electrostatic detection on the mobile terminal, electrostatic charges reach the power-on area first, so that the components in the mobile terminal are prevented from being damaged by the impact. In order to ensure that the electricity guiding area can not be corroded, a conductive anti-corrosion layer can be arranged on the surface of the electricity guiding area, the electricity guiding area can also have a conductive function, the electricity guiding area can be prevented from being corroded, and the reliability of the middle frame is ensured.
Wherein the protective layer is a plastic protective layer.
Specifically, a plurality of holes may be formed on a side wall of the middle frame, the hollowed-out portion may be located on an inner wall of the hole, so that the power-on area is formed on the inner wall of the hole, and the power-on area may be disposed at other positions of the middle frame, so that when the mobile terminal having the middle frame is subjected to ESD electrostatic detection, the electrostatic charge may reach the power-on area first, so as to avoid damage to components, and the following description will be given by taking the inner wall of the hole where the power-on area is disposed as an example:
when the power-on area is arranged on the inner wall of the opening, the conductive anti-corrosion layer is also arranged on the inner wall of the opening, and one side of the conductive anti-corrosion layer, deviating from the power-on area, is not protruded out of the hollowed-out part, so that when the card holder, the universal serial bus (universal serial bus, USB for short), the earphone, the side key and other parts are matched with the opening, the conductive anti-corrosion layer can not block the card holder, the USB, the earphone, the side key and other parts, and normal use of the side key, the USB, the earphone, the card holder and other parts is guaranteed.
In one possible embodiment, in order to ensure that the conductive anti-corrosion layer disposed on the electricity guiding region may not protrude from one side of the hollowed-out portion away from the metal body, a concave portion may be disposed on the surface of the electricity guiding region, at this time, the surface of the concave portion may be the electricity guiding region, the conductive anti-corrosion layer may be at least partially disposed on the concave portion, and the conductive anti-corrosion layer covers the electricity guiding region, where, for convenience in setting, the electricity guiding region is formed at the bottom of the concave portion, the conductive anti-corrosion layer is disposed on one side of the electricity guiding region away from the bottom of the concave portion, and the conductive anti-corrosion layer does not protrude from the concave portion, so as to ensure that the conductive anti-corrosion layer is disposed, and does not interfere with the card holder and the side key with the hole matching.
When the conductive anticorrosive layer is specifically arranged, the conductive anticorrosive layer and the inner wall of the opening can be positioned in one surface, and the conductive anticorrosive layer can be positioned in the concave part or one side of the conductive anticorrosive layer, which is away from the power-on area, is positioned in the protective layer.
When the conductive anticorrosive coating is specifically arranged, the conductive anticorrosive coating can comprise at least two conductive anticorrosive sublayers which are arranged in a laminated manner, and the standard electrode potential of each conductive anticorrosive sublayer is sequentially reduced from a direction away from the power-on area to a direction close to the power-on area, wherein the conductive anticorrosive sublayer at one side away from the power-on area can be directly and electrically connected with other structures for detection; and the larger value of the standard electrode potential of the conductive corrosion prevention sub-layer far away from the power-on region indicates that the metal of the conductive corrosion prevention sub-layer has smaller activity and is not easy to corrode.
Specifically, the conductive anticorrosive layer may include a first conductive anticorrosive sub-layer and a second conductive anticorrosive sub-layer, where the first conductive anticorrosive sub-layer and the second conductive anticorrosive sub-layer may be stacked, and a side of the first conductive anticorrosive sub-layer away from the second conductive anticorrosive sub-layer corresponds to the power-on region, that is, the first conductive anticorrosive sub-layer and the power-on region are also stacked, where the first conductive anticorrosive sub-layer may include one or more of aluminum, titanium, zinc, nickel, or molybdenum, and the second conductive anticorrosive sub-layer includes one of copper or lead. The stability of copper layer and lead layer is good to make the corrosion resistance of second electrically conductive anticorrosive sub-layer better, and copper does not influence electric connectivity, the detection of being convenient for.
In the above embodiment, in order to improve the electrical connection performance between the first conductive corrosion prevention sub-layer and the second conductive corrosion prevention sub-layer, the impedance between the first conductive corrosion prevention sub-layer and the second conductive corrosion prevention sub-layer may be set to be less than 1Ω, and the resistance impedance between the first conductive corrosion prevention sub-layer and the middle frame is also less than 1Ω, which may be understood that the impedance between any two metals in the metal body is less than 1Ω. Specifically, the impedance between any two metals within the metal body may be 0.6Ω, 0.5Ω, or 0.8Ω.
The middle frame in the above implementation may include a non-corrosion-resistant metal material, and specifically, the metal body may be a magnesium-aluminum alloy body or a magnesium-lithium alloy body or a magnesium-silicon alloy body.
In a second aspect, the present application further provides a method for preparing the middle frame in any one of the first aspect, where a shielding layer is coated on a surface of the middle frame; etching part of the shielding layer on the middle frame to form a power-on region; forming a conductive anticorrosive layer on the surface of the power-on area through a composite deposition process; and removing the residual shielding layer on the middle frame, so that the middle frame with the conductive anti-corrosion layer can be formed.
The step of etching the part of the shielding layer on the middle frame side to form the power-on region may include various forms, such as: and etching part of the shielding layer at the opening of the side wall of the middle frame through a laser etching process so as to form a concave part on the surface of the metal main body and form the electricity guiding region on the surface of the concave part. Or etching the local position of the shielding layer at the opening of the side wall of the middle frame through a laser etching process so as to expose part of the metal main body and form a power-on region of the exposed metal main body.
Specifically, when etching the shielding layer through the laser etching process, the deviation of the size is smaller, and a workpiece with a complex shape can be processed, namely, the shielding layer at the opening of the side wall of the middle frame can be processed through the laser etching process, wherein the opening of the side wall of the middle frame can be a USB hole, a side key mounting hole, a card support hole and the like.
In one possible embodiment, the composite deposition process described above includes spraying, electroplating, electroless plating, or electrochemical plating, and the specific process used may be adjusted according to actual needs.
In a third aspect, a mobile terminal includes the middle frame in any one of the first aspects, and further includes a display screen, a rear shell, side keys and a card holder, where the middle frame has a first face and a second face that are set oppositely, the display screen is set on the first face of the middle frame, the rear shell is set on the second face of the middle frame, the number of the side keys may be more than one, and the side keys, the USB, the earphone and the card holder are respectively set in different openings of the middle frame. Because the conductive anticorrosive coating is arranged at the position of the electricity guiding area arranged in the opening on the middle frame, the electricity guiding area can be prevented from being corroded, the conductive anticorrosive coating does not protrude out of the surface of the inner wall of the opening, interference between the conductive anticorrosive coating and the clamping support matched with the opening, the side key and the like can be prevented, and normal use of the side key, USB, earphone, clamping support and other parts is ensured.
Drawings
Fig. 1 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application;
fig. 2 is a partial cross-sectional view of a mobile terminal according to an embodiment of the present application;
fig. 3 is a partial cross-sectional view of a mobile terminal provided in an embodiment of the present application, where a conductive anticorrosive layer is not provided at a center opening;
fig. 4 is a partial cross-sectional view of a conductive anticorrosive layer disposed at a center hole of a mobile terminal according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a middle frame of a mobile terminal according to an embodiment of the present application;
FIG. 6 is an enlarged view of a portion of FIG. 5A;
fig. 7 is a partial cross-sectional view of a mobile terminal according to an embodiment of the present application, where a conductive anticorrosive layer is not provided at a center opening;
fig. 8 is a further partial cross-sectional view of a conductive corrosion protection layer disposed at a center opening of a mobile terminal according to an embodiment of the present application;
fig. 9 is a middle frame preparation flow of a mobile middle terminal according to an embodiment of the present application;
fig. 10a to 10d are process diagrams showing the fabrication of a middle frame in the embodiment of the present application.
Reference numerals:
1-a middle frame; a 2-side bond; 10-perforating; 11-a power-on region; 12-a depression; 101-a metal body; 102-a protective layer; 103-a hollowed-out part; 20-a conductive corrosion protection layer; 21-a first conductive corrosion protection sub-layer; 22-a second conductive corrosion protection sub-layer; 30-a shielding layer.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, a mobile terminal generally includes a middle frame 1, a housing 3, and a display screen 4, the display screen 4 and the housing 3 being disposed at both sides of the middle frame 1, and in order to achieve light weight of the mobile terminal, the middle frame 1 of the mobile terminal may be manufactured using a magnesium alloy or a lithium alloy, and in particular, the middle frame 1 may be manufactured by an extrusion profile, die casting, or metal injection molding (metal injection molding, abbreviated as MIM) process. More specifically, when the middle frame 1 is specifically disposed, the middle frame 1 is provided with an opening 10 for matching with other components, such as: the metal body of the magnesium alloy or the lithium alloy of the inner wall of the middle frame needs to be exposed on the inner wall of the opening of the middle frame 1 in order to meet the requirement of ESD detection of the middle frame when the opening is specifically arranged, however, the properties of the magnesium element and the lithium element in the magnesium alloy and the lithium alloy are active and are easy to corrode and damage, and the normal use of the side key and the card support can be affected.
In view of this, the present application provides a new middle frame of a mobile terminal, which solves the above-mentioned problems by providing a conductive anti-corrosion layer at a place where the middle frame is provided with an opening.
The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include, for example, "one or more" such forms of expression, unless the context clearly indicates to the contrary.
Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.
The middle frame of the mobile terminal can be applied to the mobile terminal, wherein the mobile terminal can be a mobile phone, a tablet computer, a wearable device, a notebook computer and the like. When the middle frame is applied to a mobile terminal, with continued reference to fig. 1, a display screen 4 and a housing 3 of the mobile terminal may be respectively disposed on a first surface and a second surface of the middle frame 1, that is, the middle frame 1 may serve as a supporting structure for the display screen 4 and the housing 3, and in addition, an opening 10 on the middle frame 1 may be used to cooperate with a side key 2 and a card holder included in the mobile terminal. Referring to fig. 2, the inner space of the middle frame 1 is for accommodating components on the mobile terminal, and the middle frame 1 may include a metal body and a protective layer covering the surface of the metal body 101. The metal main body in the middle frame 1 is partially exposed, the exposed metal main body part can carry out electrostatic detection, the exposed metal main body part forms a power-on area, specifically, the power-on area can be arranged in an opening 10 on the middle frame 1, and the power-on area can be further provided with a conductive anti-corrosion layer 20, so that the power-on area can be prevented from being corroded, and the normal use of the components such as the card holder, the side key 2 and the like is ensured. Wherein, the conductive anti-corrosion layer 20 does not protrude from the surface of the inner wall of the opening 10, which can prevent the conductive anti-corrosion layer 20 from obstructing the card holder and the side key 2 which are matched with the opening, so as to ensure that the arrangement of the conductive anti-corrosion layer 20 does not affect the normal operation of the card holder, the side key and other components.
Referring to fig. 3 and 4, a middle frame 1 of a mobile terminal may include a metal body 101 and a protective layer 102, the protective layer 102 may encapsulate the metal body 101, the inner side of the metal body 101 may be used to accommodate components of the mobile terminal, and a hollowed-out portion 103 may be provided at a portion of the protective layer 102 located outside the components, so that at least a portion of the metal body 101 encapsulated by the protective layer 102 is exposed, the exposed portion of the metal body 101 may form a power-on region 11, where the power-on region 11 is used to conduct electricity, so as to perform ESD detection on the mobile terminal, in order to ensure that the power-on region 11 is not corroded, a conductive anti-corrosion layer 20 may be provided on a surface of the power-on region 11, where the conductive anti-corrosion layer 20 may not only enable the power-on region 11 to have a conductive function, but also prevent the power-on region 11 from being corroded, and ensure reliability of the middle frame.
Referring to fig. 3, 4, 5 and 6, the metal body 101 in the middle frame of the mobile terminal may be a metal body that is easy to corrode, such as a magnesium aluminum alloy body or a magnesium lithium alloy body, a magnesium silicon alloy body, etc., the side wall of the middle frame 1 may have a plurality of openings 10, and a power-on region 11 is formed on the inner wall of the opening 10 (the power-on region 11 is a portion of the metal body 101 exposed to the outside, i.e., the protection layer 102 of the middle frame 1 has a hollowed-out portion 103), where static charges reach the power-on region 11 first when ESD detection is performed on the mobile terminal, so as to avoid the components in the mobile terminal from being damaged. In order to ensure that the power-on region 11 can work stably and continuously, a conductive anti-corrosion layer 20 can be arranged on the surface of the power-on region 11, and the arrangement of the conductive anti-corrosion layer 20 can ensure the conductivity of the power-on region 11, prevent the power-on region 11 from being corroded and further ensure the stability of the middle frame 1; the conductive anti-corrosion layer 20 can ensure normal use of the parts such as the card holder, USB, earphone, side key and the like matched with the opening 10 of the middle frame 1.
When the conductive anti-corrosion layer 20 is specifically disposed, the conductive anti-corrosion layer 20 does not protrude from the surface of the inner wall of the opening 10, so as to ensure that interference is not generated to the use of the card support, the side key and other components after the conductive anti-corrosion layer 20 is disposed.
Referring to fig. 7 and 8, in the foregoing embodiment, when the current guiding region 11 is specifically formed, a concave portion 12 may be disposed on the surface of the exposed metal body 101, where the surface of the concave portion 12 may also be the exposed metal body 101, that is, the bottom surface of the concave portion 12 may also form the current guiding region 11, the conductive anti-corrosion layer 20 may be at least partially disposed in the concave portion 12, and when the conductive anti-corrosion layer 20 is disposed, the conductive anti-corrosion layer 20 may cover the current guiding region 11, so as to ensure that the current guiding region 11 is not corroded. More specifically, the current guiding region 11 may be formed at the bottom of the recess 12, the conductive anti-corrosion layer 20 is disposed on a side of the current guiding region 11 away from the bottom of the recess 12, and when at least a portion of the conductive anti-corrosion layer 20 is disposed in the recess 12, as long as the side of the conductive anti-corrosion layer 20 away from the current guiding region 11 does not protrude from the inner wall of the opening, it will be understood that the thickness of the conductive anti-corrosion layer 20 may be smaller than the depth of the recess 12, or the thickness of the conductive anti-corrosion layer 20 is smaller than the sum of the depth of the recess 12 and the height of the hollowed-out portion.
For example, the surface of the conductive anti-corrosion layer 20 may be in the same plane as the surface of the inner wall of the opening 10, or the conductive anti-corrosion layer 20 may be located in the recess 12, so that the parts such as the card holder and the side key matched with the opening 10 may not interfere with the middle frame.
With continued reference to fig. 7 and 8, the conductive corrosion prevention layer 20 may include at least two conductive corrosion prevention sub-layers, where a plurality of conductive corrosion prevention sub-layers are sequentially disposed along a direction away from the power-guiding region 11, and in the adjacent two conductive corrosion prevention sub-layers, a standard electrode potential of the conductive corrosion prevention sub-layer close to the power-guiding region 11 is smaller than a standard electrode potential of the conductive corrosion prevention sub-layer far from the power-guiding region 11, and a standard electrode potential of the power-guiding region 11 is smaller than a standard electrode potential of the conductive corrosion prevention sub-layer adjacent to the power-guiding region 11, that is, a value of the standard electrode potential of the conductive corrosion prevention sub-layer far from the power-guiding region is larger, so as to indicate that a metal of the conductive corrosion prevention sub-layer far from the power-guiding region 11 is less active and is not easily corroded.
In a possible implementation manner, the conductive anticorrosive layer may include only two layers, that is, the conductive anticorrosive layer 20 includes a first conductive anticorrosive sub-layer 21 and a second conductive anticorrosive sub-layer 22, where the first conductive anticorrosive sub-layer 21 is disposed on the surface of the power guiding region 11, and the second conductive anticorrosive sub-layer 22 is disposed on a side of the first conductive anticorrosive sub-layer 21 facing away from the power guiding region 11, where the first conductive anticorrosive sub-layer 21 may be one or several of aluminum, titanium, zinc, nickel or molybdenum, and the second conductive anticorrosive sub-layer 22 may be one of copper or lead. The stability of the copper and lead layers is good, thereby making the corrosion resistance of the second conductive corrosion protection sub-layer 22 good, and the copper does not affect the electrical connectivity, facilitating detection.
Specifically, the first conductive corrosion protection sub-layer 21 may be an aluminum material, the second conductive corrosion protection sub-layer 22 may be a copper layer, where the corrosion resistance of copper is relatively good, and the copper layer has conductivity, and the aluminum layer is disposed between the copper layer and the lead-in area, so that the potential difference between the copper layer and the lead-in area 11 can be prevented from being too large, and a galvanic reaction is generated, thereby accelerating corrosion.
In the above embodiment, in order to improve the electrical connection performance between the first conductive corrosion prevention sub-layer 21 and the second conductive corrosion prevention sub-layer 22, the impedance between the first conductive corrosion prevention sub-layer 21 and the second conductive corrosion prevention sub-layer 22 may be set to be less than 1Ω, and the resistance impedance between the first conductive corrosion prevention sub-layer 21 and the middle frame 1 is also less than 1Ω, which may be understood as that the impedance between any two metals in the middle frame is less than 1Ω.
Based on the same technical concept, the present application provides a method for manufacturing the middle frame, please refer to fig. 9, fig. 9 shows a process for manufacturing the middle frame of the mobile terminal in the application embodiment, and fig. 10a to 10d show schematic diagrams of a middle frame manufacturing process in the application embodiment, which may specifically include the following steps:
s201: coating a shielding layer 30 on the surface of the middle frame 1;
fig. 10a is a schematic partial view of the middle frame 1 provided with the shielding layer 30 in the embodiment of the present application, and in the step S201, the shielding layer 30 on the surface of the middle frame 1 may be, but is not limited to, a mask plate provided on the surface of the middle frame 1, or a coating layer such as ink provided on the surface of the middle frame 1.
S202: etching part of the shielding layer 30 on the middle frame to form a power-on region 11;
referring to fig. 10b, the etching of the shielding layer 30 may be specifically performed by a laser etching process, where the shielding layer 30 may be etched at a side wall opening of the middle frame 1 or other positions to form the power guiding region 11, where the specific position of the power guiding region is not limited, where only a part of the main body in the middle frame 1 may be exposed during the etching process, or a part of the surface of the main body may be etched, and a concave portion 12 may be formed on the surface of the main body to form the power guiding region 11 on the surface of the concave portion 12.
The size deviation of the power-on region 11 can be controlled to be about 0.1mm by adopting a laser etching process, and then the power-on region 11 with a complex shape can be processed by adopting the laser etching process.
S203: forming a conductive anticorrosive layer on the surface of the power-on region 11 through a composite deposition process;
referring to fig. 10c, the composite deposition process includes spraying, electroplating, electroless plating or electrochemical plating, and the specific process can be adjusted according to actual needs. Specifically, the conductive anticorrosive layer may include a first conductive anticorrosive sub-layer 21 and a second conductive anticorrosive sub-layer 22, and the first conductive anticorrosive sub-layer 21 may be formed on the surface of the power-on area 11 by spraying, and then the second conductive anticorrosive sub-layer 22 may be formed on the surface of the first conductive anticorrosive sub-layer 21 by spraying, so as to form the conductive anticorrosive layer; of course, the conductive anticorrosive layer may also include a third conductive anticorrosive sub-layer, a fourth conductive anticorrosive sub-layer, and so on, that is, the conductive anticorrosive layer may be formed in multiple layers based on processes such as spraying, electroplating, electroless plating, or electrochemical plating, and only two layers are taken as an example.
The conductive corrosion-resistant sub-layer formed on the surface of the power-on area 11 by adopting the spraying process has larger surface adhesion, so that the adhesion between two adjacent conductive corrosion-resistant sub-layers can be improved, and the separation between the two adjacent conductive corrosion-resistant sub-layers is prevented. Specifically, the surface roughness of the conductive corrosion prevention sub-layer formed by spraying is large, and the adhesive force is generally greater than or equal to 4B.
S204: and removing the residual shielding layer 30 on the middle frame.
Referring to fig. 10d, after removing the shielding layer 30 in other areas of the middle frame 1, a first conductive anti-corrosion sub-layer 21 and a second conductive anti-corrosion sub-layer 22 can be formed on the surface of the electricity guiding region 11 to prevent the electricity guiding region 11 from being corroded, and the electricity guiding region 11 also has a conductive function, which is beneficial to improving the stability of the middle frame 1.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes or substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (12)
1. The middle frame of the mobile terminal is characterized by comprising a metal main body and a protective layer, wherein the protective layer is used for wrapping the metal main body, the inner side of the metal main body is used for accommodating components of the mobile terminal, the protective layer is provided with a hollowed-out part so that part of the metal main body is exposed, the exposed metal main body forms a power-on area, and the power-on area is used for enabling static charge to reach the power-on area when the mobile terminal is subjected to static electricity detection;
wherein, the surface of the electricity guiding area is provided with a conductive anti-corrosion layer.
2. The middle frame according to claim 1, wherein the side wall of the middle frame is provided with a plurality of openings, the hollowed-out parts are positioned on the inner wall of the openings so that the inner wall of the openings is provided with the electricity guiding area, and one side of the conductive anticorrosive layer positioned on the electricity guiding area, which is away from the electricity guiding area, does not protrude out of the hollowed-out parts.
3. The middle frame according to claim 2, wherein the surface of the power guiding area is provided with a concave part, and at least part of the conductive anti-corrosion layer is arranged in the concave part.
4. The middle frame according to claim 1, wherein the conductive corrosion protection layer comprises at least two stacked conductive corrosion protection sublayers, and the standard electrode potential of each conductive corrosion protection sublayer sequentially decreases from a direction away from the power-on region to a direction close to the power-on region.
5. The middle frame of claim 4, wherein the conductive corrosion protection layer comprises a first conductive corrosion protection sub-layer and a second conductive corrosion protection sub-layer, the second conductive corrosion protection sub-layer being disposed on a first side of the first conductive corrosion protection sub-layer facing away from the power-on region;
wherein the first conductive corrosion prevention sub-layer comprises one or more of aluminum, titanium, zinc, nickel or molybdenum, and the second conductive corrosion prevention sub-layer comprises one of copper or lead.
6. The mullion of claim 5, wherein the resistive impedance between the metal body and the first conductive corrosion protection sublayer is less than 1 Ω, and the resistive impedance between the second conductive corrosion protection sublayer and the first conductive corrosion protection sublayer is less than 1 Ω.
7. The center of any of claims 1-6, wherein the metal body comprises a non-corrosion resistant metal material.
8. The middle frame of claim 7, wherein the metal body comprises a magnesium aluminum alloy body or a magnesium lithium alloy body or a magnesium silicon alloy body.
9. A method for manufacturing a center for a mobile terminal according to any one of claims 1 to 8, comprising:
coating a shielding layer on the surface of the middle frame;
etching part of the shielding layer on the middle frame to form a power-on region;
forming a conductive anticorrosive layer on the surface of the electricity guiding area through a composite deposition process;
and removing the residual shielding layer on the middle frame.
10. The method of claim 9, wherein the composite deposition process comprises spray coating, electroplating, electroless plating, or electrochemical plating.
11. The method of claim 9, wherein the step of etching the portion of the shielding layer on the middle frame to form the lead-in region comprises:
and etching the shielding layer at the opening of the side wall of the middle frame through a laser etching process so as to enable the surface of the metal main body to form a concave part, and forming the power-on area on the surface of the concave part.
12. A mobile terminal comprising a center according to any one of claims 1 to 8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211102132.6A CN117715330A (en) | 2022-09-09 | 2022-09-09 | Middle frame of mobile terminal, mobile terminal and preparation method of middle frame |
| PCT/CN2023/116544 WO2024051602A1 (en) | 2022-09-09 | 2023-09-01 | Middle frame of mobile terminal, mobile terminal, and preparation method for middle frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211102132.6A CN117715330A (en) | 2022-09-09 | 2022-09-09 | Middle frame of mobile terminal, mobile terminal and preparation method of middle frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117715330A true CN117715330A (en) | 2024-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211102132.6A Pending CN117715330A (en) | 2022-09-09 | 2022-09-09 | Middle frame of mobile terminal, mobile terminal and preparation method of middle frame |
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| Country | Link |
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| CN (1) | CN117715330A (en) |
| WO (1) | WO2024051602A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW565745B (en) * | 1997-10-07 | 2003-12-11 | Ibm | Compositions of matter, resist structures including a layer of electrically conductive polymer having controlled pH and methods of fabrication thereof |
| CN207249290U (en) * | 2017-09-18 | 2018-04-17 | 信利半导体有限公司 | A kind of backlight module and liquid crystal display die set |
| CN210156563U (en) * | 2019-08-30 | 2020-03-17 | 北京小米移动软件有限公司 | Grounding structure and electronic equipment |
| CN212569814U (en) * | 2020-02-18 | 2021-02-19 | 神盾股份有限公司 | Fingerprint sensing device |
| CN113593409B (en) * | 2021-07-09 | 2022-09-09 | 武汉华星光电半导体显示技术有限公司 | Display module and display device |
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2022
- 2022-09-09 CN CN202211102132.6A patent/CN117715330A/en active Pending
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| WO2024051602A1 (en) | 2024-03-14 |
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