CN113566804A - Four-mass optical-electromechanical three-axis gyroscope of three-dimensional photonic crystal and processing method thereof - Google Patents
Four-mass optical-electromechanical three-axis gyroscope of three-dimensional photonic crystal and processing method thereof Download PDFInfo
- Publication number
- CN113566804A CN113566804A CN202110638234.9A CN202110638234A CN113566804A CN 113566804 A CN113566804 A CN 113566804A CN 202110638234 A CN202110638234 A CN 202110638234A CN 113566804 A CN113566804 A CN 113566804A
- Authority
- CN
- China
- Prior art keywords
- axis
- mass
- angular velocity
- dimensional photonic
- photonic crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004038 photonic crystal Substances 0.000 title claims abstract description 56
- 238000003672 processing method Methods 0.000 title abstract description 7
- 239000011521 glass Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 238000001514 detection method Methods 0.000 claims abstract description 18
- 238000005259 measurement Methods 0.000 claims abstract description 12
- 244000126211 Hericium coralloides Species 0.000 claims abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 36
- 229910052710 silicon Inorganic materials 0.000 claims description 36
- 239000010703 silicon Substances 0.000 claims description 36
- 229920002120 photoresistant polymer Polymers 0.000 claims description 30
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 24
- 238000001020 plasma etching Methods 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 238000001259 photo etching Methods 0.000 claims description 18
- 238000012545 processing Methods 0.000 claims description 15
- 238000011161 development Methods 0.000 claims description 13
- 238000013016 damping Methods 0.000 claims description 12
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 12
- 238000005406 washing Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- 230000001133 acceleration Effects 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000002834 transmittance Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 210000001520 comb Anatomy 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
- G01C19/5691—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional vibrators, e.g. wine glass-type vibrators
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Gyroscopes (AREA)
Abstract
The invention discloses a four-mass optical-electromechanical three-axis gyroscope of a three-dimensional photonic crystal and a processing method thereof, wherein the gyroscope sequentially comprises a glass cap, a device layer and a glass substrate from top to bottom, and the glass cap and the glass substrate are bonded with the device layer through an anode; the device layer comprises a supporting outer frame, a central mass block positioned in the center of the supporting outer frame, four public mass blocks and a driving beam for connecting the four public mass blocks with the supporting outer frame, driving comb teeth are respectively arranged on the periphery of the central driving mass block and the upper parts and the lower parts of the four public mass blocks, the periphery of the four public mass blocks and the driving comb teeth are pulled through resonant beams, two sides of one side, close to the supporting outer frame, of the four public mass blocks are respectively connected with a Z-axis mechanical structure detection module comb tooth structure through the resonant beams, and the upper parts and the lower parts of the four public mass blocks are respectively covered with a three-dimensional photonic crystal structure layer; the invention realizes the measurement of the angular velocity of three axes in a single device and has simple structure.
Description
Technical Field
The invention relates to the fields of micro-electromechanical and inertial navigation, in particular to a four-mass optical-electromechanical three-axis gyroscope based on a three-dimensional photonic crystal and a processing method thereof.
Background
The Micro Electro Mechanical System (MEMS) gyroscope is a key device which is manufactured by adopting an MEMS processing technology and is used for measuring the angular velocity of the motion of an object, has the characteristics of small size, low power consumption, low cost, convenience for batch production and the like compared with the traditional inertial device, and has wide application prospects in various fields of space technology, geodetic survey, geological exploration, tunnel engineering, oil exploration, mine exploitation, ocean development, automobile industry, national defense industry and the like, so that great amounts of manpower and material resources are put into research in colleges and universities, research institutes and commercial institutions at home and abroad. At present, in the multi-flow micromechanical gyroscope on the market, the micromechanical gyroscope has poor precision and is obviously influenced by temperature and humidity, and the micromechanical gyroscope is difficult to be applied to a high-precision measurement system.
To this end, researchers have integrated various MEMS structures with micro-optical devices, and designed micro-opto-electro-mechanical (MOEMS) gyroscopes. Compared with an MEMS gyroscope for capacitance detection, the novel gyroscope inherits the advantages of small size, light weight, low cost, easy realization of system integration and batch production and the like of the MEMS gyroscope; meanwhile, an optical detection method is adopted to replace capacitance detection, so that the contradiction that the precision and the dynamic performance are difficult to be considered is avoided, and the detection precision is higher; in addition, optical signals are adopted to replace electric signals for detection, photoelectric separation can be achieved, and the adaptability of the MOEMS inertial device to radiation, high temperature, strong electromagnetic interference and other environments is greatly improved.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects of the prior art, the invention aims to provide a four-mass optical-electromechanical three-axis gyroscope based on a three-dimensional photonic crystal and a processing method thereof.
The technical scheme is as follows: in order to realize the purpose, the invention adopts the following technical scheme:
a four-mass optical-electromechanical three-axis gyroscope based on three-dimensional photonic crystals comprises a glass cap, a device layer and a glass substrate from top to bottom in sequence, wherein the glass cap and the glass substrate are bonded with the device layer through an anode;
the device layer comprises a supporting outer frame, a central mass block positioned in the center of the supporting outer frame, four public mass blocks respectively positioned in a 0-degree position, a 90-degree position, a 180-degree position and a 270-degree position of the whole structure, and driving beams for connecting the four public mass blocks with the supporting outer frame, wherein driving comb teeth are respectively arranged on the periphery of the central driving mass block and the upper parts and the lower parts of the four public mass blocks, the periphery of the four public mass blocks and the driving comb teeth are pulled through resonant beams, two sides of one side, close to the supporting outer frame, of the four public mass blocks are respectively connected with a Z-axis mechanical structure detection module comb tooth structure through the resonant beams, and the upper parts and the lower parts of the four public mass blocks are respectively covered with a three-dimensional photonic crystal structure layer;
the glass cap is positioned right above the device layer, and light guide holes are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass cap and used for detecting light;
the glass substrate is located under the device layer, and light guide holes are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass substrate and used for detecting light.
Further, the outer side of each common mass block is connected with the mass block outer frame through a detection beam.
The invention also provides a method for measuring the angular velocity by using the four-mass optical-electromechanical three-axis gyroscope based on the three-dimensional photonic crystal, which comprises the following steps:
when the four-mass optical-electromechanical three-axis gyroscope of the three-dimensional photonic crystal is stabilized in a driving mode, the four public mass blocks are driven by the driving beam to perform 'push-pull' motion, so that the capacitance in the driving comb teeth is changed, the capacitance is converted into voltage through an external circuit, and the angular velocity can be conveniently measured at any time;
when the X axis receives the angular velocity, the public mass block at the 0-degree position and the 180-degree position performs up-and-down resonant motion along the surface, and the measurement of the X axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Y axis receives the angular velocity, the public mass blocks at the 90-degree position and the 270-degree position perform up-and-down resonant motion along the surface, and the measurement of the Y axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Z axis receives the angular velocity, the four public mass blocks perform resonant motion in the plane, so that the comb tooth structure of the eight Z axis mechanical structure detection modules changes, and the angular velocity of the Z axis is obtained through measurement.
Further, the specific algorithm of the magnitude of the angular velocity is as follows:
let the angular velocity of the X-axis be omegaxAngular velocity of Y-axis is ΩyThus, the respective coriolis forces experienced by the X and Y axes are:
Fcx＝2m1Ωxx'+2m2Ωxx' (1)
Fcy＝2m3Ωyy'+2m4Ωyy' (2)
wherein m is1Mass of a common mass block at 0 DEG, m1Mass of a common mass block located at 180 DEG, m3Mass of a common mass at 90 DEG, m4Is the mass of the common mass at a position of 270 deg., x 'is the first derivative of the vector in the x direction and y' is the first derivative of the vector in the y direction;
according to the kinetic equation:
(m1+m3)x”+cxx'+kxx＝Fcx (3)
(m2+m4)y”+cyy'+kyy＝Fcy (4)
wherein, cxDamping coefficient, k, for the X-axisxElastic coefficient of X-axis, cyDamping coefficient, k, for the Y-axisyThe elastic coefficient of the Y axis is shown, x 'is the second derivative of the vector in the x direction, and Y' is the second derivative of the vector in the Y direction;
can be obtained from the equations (3) and (4)
Wherein B isxIs the amplitude of the X-axis and,
is the phase of the X axis, ByAmplitude of Y-axis
Is the phase of the Y axis, wxIs the vibration frequency of the X axis, wyIs the vibration frequency of the Y axis, wdXi X is the damping coefficient of the X axis, xi Y is the damping coefficient of the Y axis, t is the corresponding time, Ax is the coefficient of the X axis amplitude, Ay is the coefficient of the Y axis amplitude,
by simplification, the expression of the Coriolis force of the X axis and the Y axis can be obtained
Where Ω X is the angular velocity received on the X axis, Ω Y is the angular velocity received on the Y axis,
further, an expression of the acceleration of the Coriolis force can be obtained
By using the above formula and combining with the internal structure of the gyroscope, the relational expression of Coriolis acceleration, input angular velocity and transmittance is obtained:
wherein T is the transmittance, b0Is a node, E is the Young's modulus of the material, bxWidth of the X-axis resonance beam, byWidth of the Y-axis resonance beam, hxIs the height h of the X-axis resonant beamyIs the height of the Y-axis resonance beam, and rho is the mesoscopic press polish coefficient and is LxLength of the X-axis resonant beam, LyThe length of the Y-axis resonance beam;
because the transmissivity and the angular velocity have a certain proportional relation, the magnitude of the input angular velocity can be obtained through the change of the transmissivity by substituting each parameter through the designed gyroscope.
The invention also provides a processing method of the four-mass optical-electromechanical three-axis gyroscope based on the three-dimensional photonic crystal, which comprises the following steps:
(1) cleaning a silicon wafer, drying, uniformly coating photoresist on the upper surface of the silicon wafer, and photoetching an anchor point position by using a No. 1 mask after curing;
(2) processing anchor points on the upper surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(3) cleaning the silicon wafer (1), drying, uniformly coating photoresist on the lower surface of the silicon wafer (1), and photoetching a mechanical structure by using a No. 2 mask after curing;
(4) processing a mechanical structure on the lower surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(5) depositing silicon nitride on the lower surface of the silicon wafer, uniformly coating photoresist on the lower surface of the silicon wafer (1), and photoetching a mechanical structure by using a No. 3 mask after curing;
(6) processing a three-dimensional photonic crystal structure on a silicon nitride structure by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(7) depositing silicon nitride on the upper surface of the silicon chip, uniformly coating photoresist on the upper surface of the silicon chip, and photoetching the three-dimensional photonic crystal structure by using a No. 4 mask after curing;
(8) processing a three-dimensional photonic crystal structure on a silicon nitride structure by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(9) taking a clean glass substrate, uniformly coating photoresist on the surface of the glass substrate, and photoetching the substrate structure by using a No. 5 mask;
(10) carrying out anodic bonding on the glass substrate in the step (9) and the lower surface of the silicon wafer (1) in the step (6);
(11) taking clean glass, uniformly coating photoresist on the surface of the glass, and photoetching a cap structure by using a No. 6 mask;
(12) and (3) carrying out anodic bonding on the glass substrate in the step (11) and the upper surface of the silicon wafer (1) in the step (4) to obtain the four-mass optical-electro-mechanical triaxial gyroscope based on the three-dimensional photonic crystal.
Has the advantages that: compared with the prior art, the invention provides a novel three-axis gyroscope by utilizing the form of combining the three-dimensional photonic crystal and the mechanical structure, and the gyroscope adopts a brand-new detection mode and a single-chip integration mode and has the characteristics of small volume, high precision, wide application range and the like.
Drawings
FIG. 1 is an exploded view of a four-mass opto-electro-mechanical triaxial gyroscope based on a three-dimensional photonic crystal;
FIG. 2 is a top view of a mechanical structure of a four-mass opto-electro-mechanical triaxial gyroscope based on a three-dimensional photonic crystal;
FIG. 3 is an overall structure diagram of a four-mass opto-electro-mechanical triaxial gyroscope device layer based on three-dimensional photonic crystals;
FIG. 4 is a glass cap of a four-mass opto-electro-mechanical triaxial gyroscope based on a three-dimensional photonic crystal;
FIG. 5 is a glass substrate structure diagram of a four-mass opto-electro-mechanical triaxial gyroscope based on three-dimensional photonic crystals;
FIG. 6 is a three-dimensional photonic crystal structure diagram of a four-mass photo-electro-mechanical triaxial gyroscope based on a three-dimensional photonic crystal;
FIG. 7 is a four-mass photo-electro-mechanical triaxial gyroscope light detection method based on three-dimensional photonic crystals;
FIG. 8 is a flow chart of a four-mass opto-electro-mechanical triaxial gyroscope processing based on three-dimensional photonic crystals;
the device comprises a substrate, a substrate layer and a substrate, wherein 1, the substrate comprises a glass cap, 2, the device layer and 3, and the substrate layer comprises a glass substrate; 201. the system comprises a supporting outer frame, 202, a central mass block, 203, a common mass block, 204, driving beams, 205, driving combs, 206, resonant beams, 207, a Z-axis mechanical structure detection module comb structure, 208, a three-dimensional photonic crystal structure layer, 209, a mass block outer frame, 210, detection beams, 101, 301 and light guide holes.
Detailed Description
For better understanding of the present invention, the following embodiments are provided to further explain the technical solutions of the present invention in conjunction with the accompanying drawings, but the present invention is not limited to the following embodiments. The following are only preferred embodiments of the invention, it being noted that: it will be apparent to those skilled in the art that the location of each facility can be adjusted without departing from the principles of the invention, and such adjustments should be considered within the scope of the invention.
A four-mass optical-mechanical-electrical three-axis gyroscope based on three-dimensional photonic crystals comprises a glass cap 1, a device layer 2 and a glass substrate 3 from top to bottom in sequence, wherein the glass cap and the glass substrate are bonded with the device layer through an anode;
the device layer comprises a supporting outer frame 201, a central mass block 202 located in the center of the supporting outer frame, four public mass blocks 203 located in 0-degree position, 90-degree position, 180-degree position and 270-degree position of the whole structure respectively, and a driving beam 204 connecting the four public mass blocks with the supporting outer frame, wherein driving comb teeth 205 are arranged on the periphery of the central driving mass block and on the upper portions and the lower portions of the four public mass blocks respectively, the periphery of the four public mass blocks and the driving comb teeth are pulled through a resonance beam 206, two sides of one side, close to the supporting outer frame, of the four public mass blocks are connected with a Z-axis mechanical structure detection module comb tooth structure 207 through the resonance beam respectively, and the upper portions and the lower portions of the four public mass blocks are covered with three-dimensional photonic crystal structure layers 208 respectively;
the glass cap is positioned right above the device layer, and light guide holes 101 are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass cap and used for detecting light;
the glass substrate is located under the device layer, and light guide holes 301 are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass substrate and used for detecting light.
Further, the outer side of each of said common masses is connected to the outer mass frame 209 via sensing beams 210.
The invention also provides a method for measuring the angular velocity by using the four-mass optical-electromechanical three-axis gyroscope based on the three-dimensional photonic crystal, which comprises the following steps:
when the four-mass optical-electromechanical three-axis gyroscope of the three-dimensional photonic crystal is stabilized in a driving mode, the four public mass blocks are driven by the driving beam to perform 'push-pull' motion, so that the capacitance in the driving comb teeth is changed, the capacitance is converted into voltage through an external circuit, and the angular velocity can be conveniently measured at any time; in an initial state, the three-dimensional photonic crystal structures are arranged horizontally and vertically, the distances among the spherical photonic crystals are kept consistent, the path of a light path is shown in fig. 7(a), when an angular velocity is generated on an X axis or a Y axis, the distances among the spherical photonic crystals of the three-dimensional photonic crystal structures are changed as shown in fig. 7(b), so that the initial light path is changed, and the angular velocity can be obtained through the change of the light path.
When the X axis receives the angular velocity, the public mass block at the 0-degree position and the 180-degree position performs up-and-down resonant motion along the surface, and the measurement of the X axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Y axis receives the angular velocity, the public mass blocks at the 90-degree position and the 270-degree position perform up-and-down resonant motion along the surface, and the measurement of the Y axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Z axis receives the angular velocity, the four public mass blocks perform resonant motion in the plane, so that the comb tooth structure of the eight Z axis mechanical structure detection modules changes, and the angular velocity of the Z axis is obtained through measurement.
Further, the specific algorithm of the magnitude of the angular velocity is as follows:
let the angular velocity of the X-axis be omegaxAngular velocity of Y-axis is ΩyThus, the respective coriolis forces experienced by the X and Y axes are:
Fcx＝2m1Ωxx'+2m2Ωxx' (1)
Fcy＝2m3Ωyy'+2m4Ωyy' (2)
wherein m is1Mass of a common mass block at 0 DEG, m1Mass of a common mass block located at 180 DEG, m3Mass of a common mass at 90 DEG, m4Is the mass of the common mass at a position of 270 deg., x 'is the first derivative of the vector in the x direction and y' is the first derivative of the vector in the y direction;
according to the kinetic equation:
(m1+m3)y”+cyy'+kyy＝Fcy (3)
(m2+m4)y”+cyy'+kyy＝Fcy (4)
wherein, cxDamping coefficient, k, for the X-axisxElastic coefficient of X-axis, cyDamping coefficient, k, for the Y-axisyIs the elastic coefficient of the Y axis, x "is the second derivative of the vector in the x direction, and Y" is the second derivative of the vector in the Y direction;
can be obtained from the equations (3) and (4)
Wherein B isxIs the amplitude of the X-axis and,
is the phase of the X axis, ByAmplitude of Y-axis
Is the phase of the Y axis, wxIs the vibration frequency of the X axis, wyIs the vibration frequency of the Y axis, wdXi X is the damping coefficient of the X axis, xi Y is the damping coefficient of the Y axis, t is the corresponding time, Ax is the coefficient of the X axis amplitude, Ay is the coefficient of the Y axis amplitude,
by simplification, the expression of the Coriolis force of the X axis and the Y axis can be obtained
Where Ω X is the angular velocity received on the X axis, Ω Y is the angular velocity received on the Y axis,
further, an expression of the acceleration of the Coriolis force can be obtained
By using the above formula and combining with the internal structure of the gyroscope, the relational expression of Coriolis acceleration, input angular velocity and transmittance is obtained:
wherein T is the transmittance, b0Is a node, E is the Young's modulus of the material, bxWidth of the X-axis resonance beam, byWidth of the Y-axis resonance beam, hxIs the height h of the X-axis resonant beamyIs the height of the Y-axis resonance beam, and rho is the mesoscopic press polish coefficient and is LxLength of the X-axis resonant beam, LyThe length of the Y-axis resonance beam;
because the transmissivity and the angular velocity have a certain proportional relation, the magnitude of the input angular velocity can be obtained through the change of the transmissivity by substituting each parameter through the designed gyroscope.
The invention also provides a processing method of the four-mass optical-electromechanical three-axis gyroscope based on the three-dimensional photonic crystal, which comprises the following steps:
(1) cleaning a silicon wafer, drying, uniformly coating photoresist on the upper surface of the silicon wafer, and photoetching an anchor point position by using a No. 1 mask after curing;
(2) processing anchor points on the upper surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(3) cleaning the silicon wafer (1), drying, uniformly coating photoresist on the lower surface of the silicon wafer (1), and photoetching a mechanical structure by using a No. 2 mask after curing;
(4) processing a mechanical structure on the lower surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(5) depositing silicon nitride on the lower surface of the silicon wafer, uniformly coating photoresist on the lower surface of the silicon wafer (1), and photoetching a mechanical structure by using a No. 3 mask after curing;
(6) processing a three-dimensional photonic crystal structure on a silicon nitride structure by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(7) depositing silicon nitride on the upper surface of the silicon chip, uniformly coating photoresist on the upper surface of the silicon chip, and photoetching the three-dimensional photonic crystal structure by using a No. 4 mask after curing;
(8) processing a three-dimensional photonic crystal structure on a silicon nitride structure by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(9) taking a clean glass substrate, uniformly coating photoresist on the surface of the glass substrate, and photoetching the substrate structure by using a No. 5 mask;
(10) carrying out anodic bonding on the glass substrate in the step (9) and the lower surface of the silicon wafer (1) in the step (6);
(11) taking clean glass, uniformly coating photoresist on the surface of the glass, and photoetching a cap structure by using a No. 6 mask;
(12) and (3) carrying out anodic bonding on the glass substrate in the step (11) and the upper surface of the silicon wafer (1) in the step (4) to obtain the four-mass optical-electro-mechanical triaxial gyroscope based on the three-dimensional photonic crystal.
Claims (5)
1. A four-mass optical-electromechanical three-axis gyroscope based on three-dimensional photonic crystals is characterized in that: the device comprises a glass cap, a device layer and a glass substrate from top to bottom in sequence, wherein the glass cap and the glass substrate are bonded with the device layer through an anode;
the device layer comprises a supporting outer frame, a central mass block positioned in the center of the supporting outer frame, four public mass blocks respectively positioned in a 0-degree position, a 90-degree position, a 180-degree position and a 270-degree position of the whole structure, and driving beams for connecting the four public mass blocks with the supporting outer frame, wherein driving comb teeth are respectively arranged on the periphery of the central driving mass block and the upper parts and the lower parts of the four public mass blocks, the periphery of the four public mass blocks and the driving comb teeth are pulled through resonant beams, two sides of one side, close to the supporting outer frame, of the four public mass blocks are respectively connected with a Z-axis mechanical structure detection module comb tooth structure through the resonant beams, and the upper parts and the lower parts of the four public mass blocks are respectively covered with a three-dimensional photonic crystal structure layer;
the glass cap is positioned right above the device layer, and light guide holes are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass cap and used for detecting light;
the glass substrate is located under the device layer, and light guide holes are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass substrate and used for detecting light.
2. The four-mass opto-electro-mechanical triaxial gyroscope based on a three-dimensional photonic crystal according to claim 1, wherein: the outer side of each public mass block is connected with the mass block outer frame through a detection beam.
3. The method for measuring the angular velocity by using the four-mass optical-electromechanical three-axis gyroscope based on the three-dimensional photonic crystal is characterized by comprising the following steps of: the method comprises the following steps:
when the four-mass optical-electromechanical three-axis gyroscope of the three-dimensional photonic crystal is stabilized in a driving mode, the four public mass blocks are driven by the driving beam to perform 'push-pull' motion, so that the capacitance in the driving comb teeth is changed, the capacitance is converted into voltage through an external circuit, and the angular velocity can be conveniently measured at any time;
when the X axis receives the angular velocity, the public mass block at the 0-degree position and the 180-degree position performs up-and-down resonant motion along the surface, and the measurement of the X axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Y axis receives the angular velocity, the public mass blocks at the 90-degree position and the 270-degree position perform up-and-down resonant motion along the surface, and the measurement of the Y axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Z axis receives the angular velocity, the four public mass blocks perform resonant motion in the plane, so that the comb tooth structure of the eight Z axis mechanical structure detection modules changes, and the angular velocity of the Z axis is obtained through measurement.
4. The method of angular velocity measurement of a four-mass opto-electro-mechanical tri-axial gyroscope based on three-dimensional photonic crystals as claimed in claim 3, wherein: the specific algorithm of the magnitude of the angular velocity is as follows:
let the angular velocity of the X-axis be omegaxAngular velocity of Y-axis is ΩyThus, the respective coriolis forces experienced by the X and Y axes are:
Fcx＝2m1Ωxx'+2m2Ωxx' (1)
Fcy＝2m3Ωyy'+2m4Ωyy' (2)
wherein m is1Mass of a common mass block at 0 DEG, m1Mass of a common mass block located at 180 DEG, m3Mass of a common mass at 90 DEG, m4Is the mass of the common mass at 270 deg. 'is the first derivative of the x-direction vector, and y' is the first derivative of the y-direction vector;
according to the kinetic equation:
(m1+m3)x”+cxx'+kxx＝Fcx (3)
(m2+m4)y”+cyy'+kyy＝Fcy (4)
wherein, cxDamping coefficient, k, for the X-axisxElastic coefficient of X-axis, cyDamping coefficient, k, for the Y-axisyThe elastic coefficient of the Y axis is shown, x 'is the second derivative of the vector in the x direction, and Y' is the second derivative of the vector in the Y direction;
can be obtained from the equations (3) and (4)
Wherein B isxIs the amplitude of the X-axis and,
is the phase of the X axis, ByIs the amplitude of the Y-axis and,
is the phase of the Y axis, wxIs the vibration frequency of the X axis, wyIs the vibration frequency of the Y axis, wdXi X is the damping coefficient of the X axis, xi Y is the damping coefficient of the Y axis, t is the corresponding time, Ax is the coefficient of the X axis amplitude, Ay is the coefficient of the Y axis amplitude,
by simplification, the expression of the Coriolis force of the X axis and the Y axis can be obtained
Where Ω X is the angular velocity received on the X axis, Ω Y is the angular velocity received on the Y axis,
further, an expression of the acceleration of the Coriolis force can be obtained
By using the above formula and combining with the internal structure of the gyroscope, the relational expression of Coriolis acceleration, input angular velocity and transmittance is obtained:
wherein T is the transmittance, b0Is a node, E is the Young's modulus of the material, bxWidth of the X-axis resonance beam, byWidth of the Y-axis resonance beam, hxIs the height h of the X-axis resonant beamyIs the height of the Y-axis resonance beam, and rho is the mesoscopic press polish coefficient and is LxLength of the X-axis resonant beam, LyThe length of the Y-axis resonance beam;
because the transmissivity and the angular velocity have a certain proportional relation, the magnitude of the input angular velocity can be obtained through the change of the transmissivity by substituting each parameter through the designed gyroscope.
5. The method for processing the four-mass optical-electromechanical three-axis gyroscope based on the three-dimensional photonic crystal as claimed in any one of claims 1 to 2, wherein the method comprises the following steps:
(1) cleaning a silicon wafer, drying, uniformly coating photoresist on the upper surface of the silicon wafer, and photoetching an anchor point position by using a No. 1 mask after curing;
(2) processing anchor points on the upper surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(3) cleaning the silicon wafer (1), drying, uniformly coating photoresist on the lower surface of the silicon wafer (1), and photoetching a mechanical structure by using a No. 2 mask after curing;
(4) processing a mechanical structure on the lower surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(5) depositing silicon nitride on the lower surface of the silicon wafer, uniformly coating photoresist on the lower surface of the silicon wafer (1), and photoetching a mechanical structure by using a No. 3 mask after curing;
(6) processing a three-dimensional photonic crystal structure on a silicon nitride structure by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(7) depositing silicon nitride on the upper surface of the silicon chip, uniformly coating photoresist on the upper surface of the silicon chip, and photoetching the three-dimensional photonic crystal structure by using a No. 4 mask after curing;
(8) processing a three-dimensional photonic crystal structure on a silicon nitride structure by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(9) taking a clean glass substrate, uniformly coating photoresist on the surface of the glass substrate, and photoetching the substrate structure by using a No. 5 mask;
(10) carrying out anodic bonding on the glass substrate in the step (9) and the lower surface of the silicon wafer (1) in the step (6);
(11) taking clean glass, uniformly coating photoresist on the surface of the glass, and photoetching a cap structure by using a No. 6 mask;
(12) and (3) carrying out anodic bonding on the glass substrate in the step (11) and the upper surface of the silicon wafer (1) in the step (4) to obtain the four-mass optical-electro-mechanical triaxial gyroscope based on the three-dimensional photonic crystal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110638234.9A CN113566804B (en) | 2021-06-08 | 2021-06-08 | Four-mass optical-electromechanical three-axis gyroscope of three-dimensional photonic crystal and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110638234.9A CN113566804B (en) | 2021-06-08 | 2021-06-08 | Four-mass optical-electromechanical three-axis gyroscope of three-dimensional photonic crystal and processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113566804A true CN113566804A (en) | 2021-10-29 |
| CN113566804B CN113566804B (en) | 2023-01-13 |
Family
ID=78161743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110638234.9A Expired - Fee Related CN113566804B (en) | 2021-06-08 | 2021-06-08 | Four-mass optical-electromechanical three-axis gyroscope of three-dimensional photonic crystal and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113566804B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114459450A (en) * | 2022-02-21 | 2022-05-10 | 东南大学 | Novel MOEMS gyroscope based on electrostatic driving and processing method thereof |
| CN116907463A (en) * | 2023-09-08 | 2023-10-20 | 华芯拓远(天津)科技有限公司 | High-precision full-decoupling triaxial MEMS gyroscope |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202793402U (en) * | 2012-07-19 | 2013-03-13 | 水木智芯科技（北京）有限公司 | Full-decoupling capacitive uniaxial micromechanical gyroscope with four mass blocks |
| DE102016208926A1 (en) * | 2016-05-24 | 2017-11-30 | Robert Bosch Gmbh | MOEMS device and corresponding manufacturing method |
| CN108716914A (en) * | 2018-05-29 | 2018-10-30 | 东南大学 | A kind of MOEMS gyroscopes and its processing method based on nanometer grating |
| CN110308306A (en) * | 2019-06-28 | 2019-10-08 | 东南大学 | A kind of MOEMS accelerometer and its processing method based on fully differential 2 D photon crystal cavity body structure |
| CN110342453A (en) * | 2019-06-20 | 2019-10-18 | 东南大学 | A kind of micro-electro-mechanical gyroscope and its processing packaging method based on double grating detection |
| CN110631568A (en) * | 2019-09-10 | 2019-12-31 | 东南大学 | Novel MOEMS (metal oxide semiconductor energy management system) double-shaft gyroscope based on two-dimensional photonic crystal cavity structure and processing method thereof |
| CN111623762A (en) * | 2020-05-25 | 2020-09-04 | 东南大学 | Annular array type four-mass coupling six-axis micro-inertial sensor and processing method thereof |
| CN112747731A (en) * | 2020-12-28 | 2021-05-04 | 北京航空航天大学 | Five-mass-block double-axis detection silicon micro-resonant gyroscope based on out-of-plane vibration |
-
2021
- 2021-06-08 CN CN202110638234.9A patent/CN113566804B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202793402U (en) * | 2012-07-19 | 2013-03-13 | 水木智芯科技（北京）有限公司 | Full-decoupling capacitive uniaxial micromechanical gyroscope with four mass blocks |
| DE102016208926A1 (en) * | 2016-05-24 | 2017-11-30 | Robert Bosch Gmbh | MOEMS device and corresponding manufacturing method |
| CN108716914A (en) * | 2018-05-29 | 2018-10-30 | 东南大学 | A kind of MOEMS gyroscopes and its processing method based on nanometer grating |
| CN110342453A (en) * | 2019-06-20 | 2019-10-18 | 东南大学 | A kind of micro-electro-mechanical gyroscope and its processing packaging method based on double grating detection |
| CN110308306A (en) * | 2019-06-28 | 2019-10-08 | 东南大学 | A kind of MOEMS accelerometer and its processing method based on fully differential 2 D photon crystal cavity body structure |
| CN110631568A (en) * | 2019-09-10 | 2019-12-31 | 东南大学 | Novel MOEMS (metal oxide semiconductor energy management system) double-shaft gyroscope based on two-dimensional photonic crystal cavity structure and processing method thereof |
| CN111623762A (en) * | 2020-05-25 | 2020-09-04 | 东南大学 | Annular array type four-mass coupling six-axis micro-inertial sensor and processing method thereof |
| CN112747731A (en) * | 2020-12-28 | 2021-05-04 | 北京航空航天大学 | Five-mass-block double-axis detection silicon micro-resonant gyroscope based on out-of-plane vibration |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114459450A (en) * | 2022-02-21 | 2022-05-10 | 东南大学 | Novel MOEMS gyroscope based on electrostatic driving and processing method thereof |
| CN114459450B (en) * | 2022-02-21 | 2024-02-23 | 东南大学 | Novel MOEMS gyroscope based on electrostatic drive and processing method thereof |
| CN116907463A (en) * | 2023-09-08 | 2023-10-20 | 华芯拓远(天津)科技有限公司 | High-precision full-decoupling triaxial MEMS gyroscope |
| CN116907463B (en) * | 2023-09-08 | 2023-12-15 | 华芯拓远(天津)科技有限公司 | High-precision full-decoupling triaxial MEMS gyroscope |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113566804B (en) | 2023-01-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8950257B2 (en) | Integrated microelectromechanical gyroscope with improved driving structure | |
| US7017410B2 (en) | Isolated resonator gyroscope with a drive and sense plate | |
| Tang et al. | Silicon bulk micromachined vibratory gyroscope for microspacecraft | |
| US6539801B1 (en) | Z-axis vibratory gyroscope | |
| CN110631568B (en) | Novel MOEMS (metal oxide semiconductor energy management system) double-shaft gyroscope based on two-dimensional photonic crystal cavity structure and processing method thereof | |
| CN113566804B (en) | Four-mass optical-electromechanical three-axis gyroscope of three-dimensional photonic crystal and processing method thereof | |
| CN111623762B (en) | Annular array type four-mass coupling six-axis micro-inertial sensor and processing method thereof | |
| CN112747731B (en) | Five-mass-block double-axis detection silicon micro-resonant gyroscope based on out-of-plane vibration | |
| CN104501792A (en) | Double-shaft split type differential silicon micromachined resonant accelerometer | |
| CN113203404A (en) | Three-axis gyroscope | |
| CN111551161A (en) | MEMS vibrating gyroscope structure and manufacturing method thereof | |
| CN113686326A (en) | Fused quartz micromechanical gyroscope with in-plane sensitive axis and preparation method thereof | |
| CN113203405A (en) | Three-axis gyroscope | |
| CN113607152B (en) | Three-axis micro-electromechanical gyroscope and preparation and packaging method thereof | |
| CN109579811B (en) | Butterfly wing type micro gyroscope adopting polygonal vibrating beam and preparation method thereof | |
| CN112014597A (en) | Triaxial resonance capacitance type micro-electromechanical accelerometer | |
| CN104215231B (en) | A kind of MEMS high accuracy resonance beam closed loop control gyroscope and manufacturing process thereof | |
| CN113607153B (en) | Two-axis MEMS (micro-electromechanical system) ring gyroscope and preparation and packaging method thereof | |
| CN215338350U (en) | Three-axis gyroscope | |
| CN113218381A (en) | Three-axis gyroscope | |
| CN106441260B (en) | Silicon-on-silicon piezoelectric film multi-supporting-beam MEMS gyroscope and preparation method thereof | |
| CN204255365U (en) | The split type difference silicon micro-resonance type accelerometer of a kind of twin shaft | |
| CN113916208A (en) | Nano-grating triaxial MEMS gyroscope for reducing cross-coupling crosstalk | |
| Yang et al. | High-Sensitivity MOEMS Gyroscope Based on Photonic Crystal Wavelength Modulation | |
| CN216049919U (en) | Three-axis gyroscope |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Cui Ying Inventor after: Wang Xinwang Inventor after: Sun Xiuying Inventor before: Wang Xinwang Inventor before: Cui Ying Inventor before: Sun Xiuying |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20221228 Address after: 214121 No. 1600 West high wave road, Jiangsu, Wuxi Applicant after: WUXI INSTITUTE OF TECHNOLOGY Address before: No. 122, Taiping North Road, Xuanwu District, Nanjing, Jiangsu 210018 Applicant before: Wang Xinwang |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20230113 |