CN110769657A

CN110769657A - Integrated uniform temperature plate radiator

Info

Publication number: CN110769657A
Application number: CN201911092536.XA
Authority: CN
Inventors: 许智伟
Original assignee: No1 Middle School Of Jianou Fujian Province
Current assignee: No1 Middle School Of Jianou Fujian Province
Priority date: 2019-11-11
Filing date: 2019-11-11
Publication date: 2020-02-07

Abstract

The invention discloses an integrated temperature-equalizing plate radiator, which comprises a radiator main body, wherein the radiator main body is formed by sealing a first temperature-equalizing plate and a second temperature-equalizing plate, a hollow cavity is formed between the first temperature-equalizing plate and the second temperature-equalizing plate, a radiating fan is arranged in the hollow cavity, and the wind direction of the radiating fan is blown to a condensation end from the hot end of the radiator main body; the heat radiator comprises a radiator body and is characterized in that a cooling fin is arranged at a condensation end outside the radiator body, a first extension piece and a second extension piece are arranged at a hot end outside the radiator body, copper substrates used for being electrically connected with an external heat source are respectively arranged at the other ends of the first extension piece and the second extension piece, and a soldering tin layer and an insulating layer are respectively arranged on the copper substrates. The invention can accelerate the heat diffusion of the heat source, has strong temperature uniformity, can be simultaneously applied to a plurality of heat sources, and has strong reliability and good heat dissipation effect.

Description

Integrated uniform temperature plate radiator

Technical Field

The invention relates to the technical field of heat dissipation, in particular to an integrated uniform temperature plate radiator.

Background

The radiator is widely applied to various fields in daily life, such as a CPU radiator, an automobile radiator, a lamp radiator, a high heat flow density device radiator and the like, and has important significance for ensuring the reliability and stability of devices and equipment. The existing heat radiators in the market are various in types, and include low-end heat radiators made of pure aluminum or pure copper and the like, middle-end heat radiators made of embedded copper aluminum, die-cast copper aluminum and heat pipes, and high-end heat radiators made of liquid cooling and semiconductor refrigeration. The pure aluminum heat sink has the highest utilization rate because it absorbs heat slowly, but releases heat quickly, and has a lower cost, but has the worst heat dissipation effect compared with other heat sinks, and is not suitable for high-power devices. The heat pipe radiating system is different from the radiator, transfers heat by utilizing the change of the state of a liquid medium in a closed pipe, has high heat transfer efficiency and simple production and manufacture, but belongs to one-dimensional heat transfer, has certain radial thermal resistance, and has limited liquid absorption capacity of a capillary core, so the height of a radiating fin is limited. The semiconductor refrigeration can accurately adjust the temperature to reduce the temperature to be lower than the room temperature, but condensed water can appear around a heat source, a mainboard can be short-circuited, and the installation is difficult.

In addition, the temperature-equalizing plate has the characteristics of no shape and size limitation, perforation design, stronger isothermal property and the like, and the performance of the radiator using the temperature-equalizing plate can be improved by 15-30% compared with that of a radiator using a heat pipe, so that the temperature-equalizing plate is widely applied to various heat-radiating fields, but the traditional single temperature-equalizing plate radiator still has the problems of uneven distribution of heated flow density, overhigh local temperature, extremely high local heat flow density and the like. The Chinese patent with the publication number of CN109906025A is a U-shaped temperature-uniforming plate and a radiator, which realizes the effects of increasing the contact area between the U-shaped temperature-uniforming plate and a heat source and improving the heat dissipation performance, but the connection mode of the connecting plates has large use risk and is easy to cause the problems of leakage and the like. The patent publication No. CN106090646A discloses a Chinese invention patent of a radiator with a hidden temperature-equalizing plate, wherein a groove is formed on the radiator, and a temperature-equalizing cavity is formed by processing, so that the heat of a heat source can be quickly and evenly diffused, but the application occasion is limited, the radiator is only suitable for a single heat source, and the variability is poor.

Disclosure of Invention

In view of the above, the present invention provides an integrated uniform temperature plate heat sink which can accelerate heat diffusion of heat sources, has a strong temperature uniformity, can be applied to multiple heat sources, and has a strong reliability and a good heat dissipation effect.

In order to achieve the purpose, the invention adopts the following technical scheme:

an integrated temperature-equalizing plate radiator comprises a radiator main body, wherein the radiator main body is formed by sealing a first temperature-equalizing plate and a second temperature-equalizing plate, a hollow cavity is formed between the first temperature-equalizing plate and the second temperature-equalizing plate, a radiating fan is arranged in the hollow cavity, and the wind direction of the radiating fan is blown to a condensation end from the hot end of the radiator main body; the heat radiator comprises a radiator body and is characterized in that a cooling fin is arranged at a condensation end outside the radiator body, a first extension piece and a second extension piece are arranged at a hot end outside the radiator body, copper substrates used for being electrically connected with an external heat source are respectively arranged at the other ends of the first extension piece and the second extension piece, and a soldering tin layer and an insulating layer are respectively arranged on the copper substrates. The shapes and the curvatures of the first epitaxial part and the second epitaxial part can be adjusted according to the positions of the heat sources, and the first epitaxial part and the second epitaxial part can be simultaneously used for one or more heat sources, so that the reliability is high, and the heat dissipation effect is good; the first temperature equalizing plate and the second temperature equalizing plate can quickly and evenly diffuse heat of a heat source, and local overheating and other phenomena cannot be caused; the heat dissipation fan blows to the heat dissipation fins, so that the convection heat transfer is accelerated, and the heat uniformity is improved; the copper substrate is used for realizing electrical connection with a heat source and accelerating the heat absorption rate.

Preferably, the heat-conducting cooling device comprises a first temperature equalizing plate, a heat-conducting insulating sheet is arranged at the hot end of the first temperature equalizing plate, a cooling fin is arranged at the condensation end of the first temperature equalizing plate, a cooling fan is arranged on the outer side of the cooling fin, and the wind direction of the cooling fan blows towards the cooling fin. The first temperature equalizing plate is in contact with a heat source, so that the contact area is large, and the heat dissipation area is increased; the heat-conducting insulating sheet can avoid unevenness of a direct contact surface of the first temperature equalizing plate, and is used for filling the gap to minimize the thermal impedance of the contact surface; the cooling fan ensures that the surfaces of the cooling fins and the first temperature-equalizing plate cannot form heat accumulation, and meanwhile, the heat convection is accelerated, the temperature equalization of the system is good, and the cooling efficiency is improved.

Preferably, the thickness of the heat-conducting insulation sheet is 0.2 mm.

Preferably, the first temperature equalizing plate and the second temperature equalizing plate are both sealing cavity structures formed by overlapping and sealing a copper or aluminum bottom plate and a cover plate, supporting convex bodies are respectively arranged on the inner walls of the bottom plate and the cover plate, and sintered layers made of copper powder are arranged on the supporting convex bodies. The supporting convex body improves the supporting strength of the temperature equalizing plate and ensures that the accommodating cavity cannot crack; the sintering layer greatly improves the radial thermal resistance and gives consideration to the capillary force and permeability of the phase-change working medium.

Preferably, a phase change working medium is arranged in the cavity formed by the bottom plate and the cover plate, and the phase change working medium is acetone, methanol or water. The boiling point of acetone is 56.3 ℃ and can be used for heat dissipation of a CPU of a computer, the working temperature of the CPU cannot be 90 ℃, and the temperature is safe within 35-70 ℃, so that the temperature should be quickly reduced, and the acetone can be continuously reduced and disperse local high heat through the circulating processes of heat absorption, heat conduction, heat dissipation and backflow; the boiling point of the methanol is 64.5 ℃, and the methanol can be used for heat dissipation of a high-power semiconductor device IGBT module.

Preferably, the supporting convex body is in a semi-cone shape and is formed by direct punching. The supporting strength of the temperature equalizing plate is improved, and the cavity is prevented from cracking.

Preferably, the heat dissipation fan is installed at the lower end of the heat dissipation fin, and the wind direction of the heat dissipation fan is upward.

Preferably, a metal layer and two insulating layers are sequentially arranged on the outer side of the radiator main body.

Preferably, the connection mode of the radiating fins adopts flat seamless integrated welding. The heat transfer is accelerated without the influence of interface thermal resistance.

The invention has the beneficial effects that:

the support convex body can improve the support strength of the uniform temperature plate, ensure that the cavity is not cracked, the surface is a sintered layer sintered by copper powder, the radial thermal resistance is greatly improved, the capillary force and the permeability of a phase change working medium are considered, the phase change working medium filled in different working environments is different, the phase change working medium has different phase change temperatures, and the working temperature can be controlled to be 15-45 ℃. The soldering tin layer, the insulating layer and the copper substrate are welded at the end parts of the first extending part and the second extending part and are used for realizing electrical connection with a heat source, and the welding position is flat and seamless, so that the heat of the heat source can be rapidly dissipated; the heat dissipation fan accelerates heat dissipation and improves heat uniformity.

The invention adopts an integrated structure, which can effectively and rapidly reduce the temperature of the used devices or equipment, accelerate the heat transfer, improve the system reliability and prolong the service life; the heat dissipation device can be simultaneously applied to a single heat source or a plurality of heat sources, and has high reliability and good heat dissipation effect; the first extension piece and the second extension piece are free of length and shape constraints, can be adjusted according to the position of a heat source, and are high in flexibility, the structure variability can be suitable for different environments, and the application range is wide.

Drawings

Fig. 1 is a schematic structural diagram of a heat sink in accordance with an embodiment;

fig. 2 is a left side view of a heat sink in a second embodiment;

fig. 3 is a top view of a heat sink in a second embodiment;

fig. 4 is a front view of a heat sink in a third embodiment;

FIG. 5 is a side sectional view of a heat sink in a third embodiment;

FIG. 6 is a partial cross-sectional view of a first vapor chamber and a second vapor chamber.

In the figure: 1: a copper substrate; 2: a first extension member; 3: a first vapor chamber; 4: an insulating layer; 5: a second extension member; 6: a heat radiation fan; 7: a heat dissipating fin; 8: a thermally conductive insulating sheet; 9: a first insulating layer; 10: a second insulating layer; 11: a second temperature equalization plate; 12: a sintered layer; 13: a cover plate; 14: a base plate; 15: and supporting the convex body.

Detailed Description

The invention is further described below with reference to the figures and examples.

Example 1

As shown in fig. 1 and 6, an integrated vapor chamber heat sink includes a heat sink main body, the heat sink main body is formed by sealing a first vapor chamber 3 and a second vapor chamber 11, a hollow cavity is formed between the first vapor chamber 3 and the second vapor chamber 11, a heat dissipation fan 6 is arranged in the hollow cavity, and the wind direction of the heat dissipation fan 6 is blown from the hot end of the heat sink main body to a condensation end; the heat radiator comprises a radiator body, and is characterized in that a heat radiating fin 7 is welded at a condensation end outside the radiator body in a flat and seamless integrated mode, a first extension piece 2 and a second extension piece 5 are arranged at a hot end outside the radiator body, a copper substrate 1 used for being electrically connected with an external heat source is arranged at the other end of each of the first extension piece 2 and the second extension piece 5, and a soldering tin layer and an insulating layer 4 are arranged on each of the copper substrates 1.

First temperature-uniforming plate 3 and second temperature-uniforming plate 11 are the bottom plate 14 and the apron 13 splice closure that are made by copper or aluminium and hold the chamber structure sealed be equipped with respectively on the inner wall of bottom plate 14 and apron 13 and adopt direct stamping forming be half cone shape support convex body 15, its whole expression is the wave form be equipped with the sinter layer 12 of being made by the copper powder on the support convex body 15. A phase change working medium is arranged in the cavity formed by the bottom plate 14 and the cover plate 13, and the phase change working medium is acetone.

The integrated uniform temperature plate radiator prepared by the embodiment can be used for radiating heat of a computer, because the working temperature of a CPU (Central processing Unit) cannot be 90 ℃ and the working temperature is within 35-70 ℃ as a safe temperature when the computer works, the temperature of the CPU cannot be cooled rapidly, the temperature of the CPU cannot be overhigh, acetone with the boiling point of 56.3 ℃ is selected as a phase change working medium, the acetone can be continuously cooled and disperse local high heat through the cycle process of heat absorption, heat conduction, heat radiation and backflow, one part of heat reaching the condensation end of the radiator main body can flow back to the hot end of the radiator main body along a sintering layer 12, the other part of heat can be transmitted to the outside through the radiating fins 7, because the radiator is integrated, the longitudinal thermal resistance can be greatly reduced, interface contact thermal resistance does not exist, the heat transmission rate can be greatly improved, and the wind direction of the radiating fan 6 blows to the radiating fins 7, so, the heat transfer is accelerated, and the reliability and the service life of the equipment are also ensured. Example 2

As shown in fig. 2, 3 and 6, the integrated vapor chamber radiator comprises a first vapor chamber 3, a heat conducting insulating sheet 8 with the thickness of 0.2mm is arranged at the hot end of the first vapor chamber 3, a heat radiating fin 7 is welded at the condensation end of the first vapor chamber by adopting a flat seamless integrated welding mode, a heat radiating fan 6 is welded at the outer side of the heat radiating fin 7 by adopting a flat seamless integrated welding mode, and the wind direction of the heat radiating fan 6 blows towards the heat radiating fin 7.

The first temperature equalizing plate 3 is a sealed cavity structure formed by copper or aluminum bottom plate 14 and cover plate 13 in a lap joint sealing mode, and the inner walls of the bottom plate 14 and the cover plate 13 are respectively provided with a semi-cone-shaped supporting convex body 15 formed by direct punch forming, the whole body of the supporting convex body is in a wave shape, and a sintering layer 12 made of copper powder is arranged on the supporting convex body 15. A phase change working medium is arranged in the cavity formed by the bottom plate 14 and the cover plate 13, and the phase change working medium is methanol.

The integrated uniform temperature plate radiator prepared by the embodiment can be used for radiating a high-power semiconductor device IGBT module, except the heat generated by the work of the whole machine, the IGBT module has certain power and can also generate heat, the integral performance and the reliability of the IGBT module are affected by the temperature, the whole IGBT module is not suitable for working at a higher temperature for a long time, therefore, the contact area of the IGBT module is increased when the IGBT module radiates, the copper plate can not be utilized to contact with a small area, the radiator prepared by the embodiment can increase the heat radiation area, the good effect of accelerating the heat convection and ensuring the temperature uniformity of the system is realized simultaneously, the heat radiation efficiency is improved, the structure is simple, and the reliability is high.

Example 3

As shown in fig. 4-6, compared with embodiment 1, the integrated vapor chamber radiator is different in the installation position of a heat dissipation fan 6, the radiator main body and a phase change working medium, wherein the heat dissipation fan 6 is installed at the lower end of the heat dissipation fin 7, and the wind direction of the heat dissipation fan 6 is upward; a metal layer, a first insulating layer 9 and a second insulating layer 10 are sequentially arranged on the outer side of the radiator main body; the phase change working medium is water.

The integrated temperature-equalizing plate radiator prepared by the embodiment can be used for automobile headlamps, the working environment of the automobile headlamps is narrow and closed, heat is easy to gather, and the LED chips are arranged on the soldering tin layer and the insulating layer 4, so that the heat generated by the LED chips can be quickly transferred to the first temperature-equalizing plate and the second temperature-equalizing plate; the heat radiation fan 6 is arranged at the end part of the heat radiation fin 7, and the wind direction blows to the heat radiation fin 7 and the first and second temperature equalizing plates, so that the heat convection of the vehicle headlamp is accelerated, and the use reliability of the vehicle headlamp is ensured. The working temperature of the LED lamp is between 80 ℃ and 90 ℃, so purified and degassed water can be selected as a phase change working medium, the liquid is formed after the purified and degassed water reaches a condensation end and is cooled, the sintering layer 12 has certain liquid absorption capacity, the liquid working medium can flow back to the hot ends of the first temperature equalizing plate and the second temperature equalizing plate, the process is recycled, heat is continuously transferred, heat cannot be gathered, and the radiator is integrated, so that interface contact thermal resistance does not exist, and the heat transfer rate of the automobile lamp can be accelerated by the heat radiating fan 6 and the heat radiating fins 7.

The embodiment of the invention has the advantages that all parts of the radiator are integrated, so that the temperature of a used device or equipment can be effectively and quickly reduced, the heat transfer is accelerated, the system reliability is improved, and the service life is prolonged; the heat dissipation device can be simultaneously applied to a single heat source or a plurality of heat sources, and has high reliability and good heat dissipation effect; the first extension piece and the second extension piece are free of length and shape constraints, can be adjusted according to the position of a heat source, and are high in flexibility, the structure variability can be suitable for different environments, and the application range is wide.

Finally, the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and other modifications or equivalent substitutions made by the technical solutions of the present invention by those of ordinary skill in the art should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solutions of the present invention.

Claims

1. An integrated temperature-equalizing plate radiator is characterized by comprising a radiator main body, wherein the radiator main body is formed by sealing a first temperature-equalizing plate and a second temperature-equalizing plate, a hollow cavity is formed between the first temperature-equalizing plate and the second temperature-equalizing plate, a radiating fan is arranged in the hollow cavity, and the wind direction of the radiating fan is blown to a condensation end from the hot end of the radiator main body; the heat radiator comprises a radiator body and is characterized in that a cooling fin is arranged at a condensation end outside the radiator body, a first extension piece and a second extension piece are arranged at a hot end outside the radiator body, copper substrates used for being electrically connected with an external heat source are respectively arranged at the other ends of the first extension piece and the second extension piece, and a soldering tin layer and an insulating layer are respectively arranged on the copper substrates.

2. The integrated vapor-panel heat sink according to claim 1, comprising a first vapor-panel, wherein a heat-conducting insulating sheet is disposed at a hot end of the first vapor-panel, a heat-dissipating fin is disposed at a condensing end of the first vapor-panel, and a heat-dissipating fan is disposed outside the heat-dissipating fin, and a wind direction of the heat-dissipating fan is directed toward the heat-dissipating fin.

3. The integrated vapor plate heat sink of claim 2, wherein the thermally conductive insulating sheet has a thickness of 0.2 mm.

4. The integrated temperature-equalizing plate radiator of claim 1 or 2, wherein the first temperature-equalizing plate and the second temperature-equalizing plate are both sealed cavity structures formed by overlapping and sealing a copper or aluminum bottom plate and a copper or aluminum cover plate, supporting protrusions are respectively arranged on the inner walls of the bottom plate and the cover plate, and sintered layers made of copper powder are arranged on the supporting protrusions.

5. The integrated temperature-uniforming plate radiator of claim 3, wherein a phase-change working medium is arranged in the cavity formed by the bottom plate and the cover plate, and the phase-change working medium is acetone, methanol or water.

6. The integrated vapor plate radiator of claim 3, wherein the supporting protrusions are in the shape of a semi-cone and are formed by direct stamping.

7. The integrated vapor plate heat sink of claim 1, wherein the heat dissipation fan is mounted at a lower end of the heat dissipation fin, and a wind direction of the heat dissipation fan is upward.

8. The integrated vapor-panel heat sink of claim 1, wherein a metal layer and two insulating layers are sequentially disposed on the outer side of the heat sink body.

9. The integrated uniform temperature plate radiator of claim 1 or 2, wherein the connection mode of the radiating fins adopts flat seamless integrated welding.