CN109411430A - Intelligent power module and preparation method, electric appliance - Google Patents
Intelligent power module and preparation method, electric appliance Download PDFInfo
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- CN109411430A CN109411430A CN201811287321.9A CN201811287321A CN109411430A CN 109411430 A CN109411430 A CN 109411430A CN 201811287321 A CN201811287321 A CN 201811287321A CN 109411430 A CN109411430 A CN 109411430A
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- heat
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- power module
- intelligent power
- dissipating pipe
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses intelligent power module and preparation methods, electric appliance.The intelligent power module includes: circuit substrate, and the circuit substrate is metal substrate；The front of the circuit substrate is arranged in circuit unit, the circuit unit；And sealing structure, the sealing structure wrap up the front of the circuit unit and the circuit substrate, and expose the back side of the circuit substrate, the back side is provided with heat-dissipating pipe array.The outer back side is exposed in circuit substrate, and heat-dissipating pipe array is set, heat-dissipating pipe can be with the contact area of increasing circuit substrate and air, enhance the direct convection current of circuit substrate and air, and heat-dissipating pipe could be formed with the passage of heat of effect, so as to improve the capacity of heat transmission of circuit substrate, and then the radiating efficiency of the intelligent power module is improved, so that the intelligent power module has good heat dissipation performance, to meet the demand for development of the intelligent power module of high integration.
Description
Technical field
The present invention relates to electrical device manufacturing fields, and in particular, to intelligent power module and preparation method, electric appliance.
Background technique
Intelligent power module (IPM) is a kind of power drive class product for combining power electronics and integrated circuit technique.
Intelligent power module integrates device for power switching and high-voltage driving circuit, and interior equipped with overvoltage, overcurrent and mistake
The fault detection circuits such as heat.On the one hand intelligent power module receives the control signal of micro-control unit (MCU), drive subsequent conditioning circuit
Work, on the other hand sends the state detection signal of system back to micro-control unit.Intelligent power module has high integration, Gao Ke
By advantages such as property, be suitable for the frequency converter and various inverters of driving motor, be frequency control, metallurgical machinery, electric propulsion,
A kind of desired power level electronic device of servo-drive, frequency-conversion domestic electric appliances.
However, current intelligent power module and preparation method, electric appliance still have much room for improvement.
Summary of the invention
The application is to be made based on inventor to the discovery of following facts and problem and understanding:
Currently, intelligent power module has that heat dissipation performance is poor.Inventors have found that this is mainly due to current
Intelligent power module is caused by total incapsulation module.Specifically, on the one hand, total incapsulation module is by the way of being fully sealed, no
Conducive to the conduction of intelligent power module internal heat, easily formation heat localization, on the other hand, the resin of sealing is high molecular polymerization
Object, the thermal conductivity of itself is poor, can not be conducted effectively to outside so as to cause the heat inside intelligent power module, cause intelligence
It can the poor problem of power module thermal diffusivity.In addition, in order to improve the heat-sinking capability of intelligent power module, current intelligent power
Module using half encapsulating structure, the back side of Intelligent power module circuit substrate is exposed to it is outer, however inventors have found that with
The raising of intelligent power module integrated level, the internal heat generated is more and more, and half encapsulating structure has been unable to meet highly integrated
The demand for development of intelligent power module is spent, there are still the problems that heat dissipation performance is poor.
The present invention is directed to alleviate or solve the problems, such as above-mentioned at least one of refer at least to some extent.
In one aspect of the invention, the invention proposes a kind of intelligent power module.The intelligent power module includes: electricity
Base board, the circuit substrate are metal substrate；The front of the circuit substrate is arranged in circuit unit, the circuit unit；
And sealing structure, the sealing structure wrap up the front of the circuit unit and the circuit substrate, and expose
The back side of the circuit substrate, the back side are provided with heat-dissipating pipe array.Outer back side setting heat dissipation is exposed in circuit substrate
Pipe array, heat-dissipating pipe can enhance the direct convection current of circuit substrate and air with the contact area of increasing circuit substrate and air, and
Heat-dissipating pipe could be formed with the passage of heat of effect, so as to improve the capacity of heat transmission of circuit substrate, and then improve the intelligence function
The radiating efficiency of rate module, so that the intelligent power module has good heat dissipation performance, to meet the intelligent function of high integration
The demand for development of rate module.
According to an embodiment of the invention, the heat-dissipating pipe is arranged perpendicular to the plane where the circuit substrate.Have as a result,
Outside is transmitted to by heat-dissipating pipe conducive to by the heat inside intelligent power module, improves radiating efficiency.
According to an embodiment of the invention, the back side has pit, the heat-dissipating pipe is arranged in the pit.As a result,
Pit is set at the back side of circuit substrate, is conducive to the orderly formation and distribution of heat-dissipating pipe array, and electricity can be further increased
The contact area of base board and air enhances the direct convection current of circuit substrate and air, improves radiating efficiency.
According to an embodiment of the invention, the size of the pit is nanometer scale.The size of pit is smaller as a result, recessed
The size for the heat-dissipating pipe being arranged in hole is also smaller, can further increase the contact area of circuit substrate and air, enhances circuit
The direct convection current of substrate and air improves the heat transfer efficiency of circuit substrate, and then improves radiating efficiency.
According to an embodiment of the invention, the vertical section of the pit is semicircle, inverted trapezoidal, triangle or rectangle.By
This, can further increase the contact area of circuit substrate and air, improve radiating efficiency.
According to an embodiment of the invention, the circuit substrate is aluminum substrate, the heat-dissipating pipe is alumina tube.Aluminum substrate tool
Having the advantages that at low cost, thermal capacitance is low, on the one hand the heat transfer efficiency of intelligent power module can be improved as heat-dissipating pipe for alumina tube,
On the other hand it can protect aluminum substrate not by the corrosion of steam and soda acid, improve the service performance of intelligent power module.
According to an embodiment of the invention, the alumina tube further comprises: copper radiating piece.The capacity of heat transmission of copper is stronger,
Thus, it is possible to further increase the heat-sinking capability of intelligent power module.
According to an embodiment of the invention, the copper radiating piece covers the inner surface of the alumina tube, or it is filled in described
Inside alumina tube.Thus, it is possible to the capacity of heat transmission of circuit substrate be further enhanced, to further increase intelligent power module
Heat-sinking capability.
In another aspect of this invention, the invention proposes a kind of electric appliances.According to an embodiment of the invention, the electric appliance includes
Mentioned-above intelligent power module, the electric appliance has whole features of mentioned-above intelligent power module and excellent as a result,
Point, details are not described herein.Generally speaking, which has good service performance.
In another aspect of this invention, the invention proposes a kind of methods for preparing intelligent power module.According to the present invention
Embodiment, this method comprises: circuit substrate the back side formed heat-dissipating pipe array, the circuit substrate be metal substrate；?
The front setting circuit unit of the circuit substrate；And the circuit unit and the circuit base are wrapped up using sealing structure
The front of plate, and expose the back side of the circuit substrate.It can be obtained as a result, using simple method with good
The intelligent power module of good heat dissipation performance, to meet the demand for development of the intelligent power module of high integration.
According to an embodiment of the invention, this method further comprises: pit is formed at the back side of the circuit substrate,
The heat-dissipating pipe is formed in the pit, the heat-dissipating pipe is arranged perpendicular to the plane where the circuit substrate.As a result, one
Aspect, heat-dissipating pipe can enhance the direct convection current of circuit substrate and air, heat dissipation with the contact area of increasing circuit substrate and air
Pipe can also form effective passage of heat, and heat-dissipating pipe is arranged perpendicular to the plane where circuit substrate, and being conducive to will be final
Heat inside the intelligent power module of formation is transmitted to outside by heat-dissipating pipe, improves finally formed intelligent power module
Heat transfer efficiency, on the other hand, pit are conducive to the orderly formation and distribution of heat-dissipating pipe array, and can further increase circuit base
The contact area of plate and air enhances the direct convection current of circuit substrate and air, further increases finally formed intelligent power
The heat-sinking capability of module.
According to an embodiment of the invention, the pit and the heat-dissipating pipe array are formed by anodic oxidation.
Pit and heat-dissipating pipe array can be formed using simple method as a result,.
According to an embodiment of the invention, the circuit substrate is aluminum substrate, the heat-dissipating pipe is alumina tube.Aluminum substrate tool
Have the advantages that at low cost, thermal capacitance is low, on the one hand finally formed intelligent power module can be improved as heat-dissipating pipe in alumina tube
Heat transfer efficiency, on the other hand can protect aluminum substrate not by the corrosion of steam and soda acid, improve finally formed intelligent power
The service performance of module.
According to an embodiment of the invention, this method further comprises: inner surface or inside in the alumina tube, if
Set copper radiating piece.The capacity of heat transmission of copper is stronger, thus, it is possible to further increase the heat radiation energy of finally formed intelligent power module
Power.
Detailed description of the invention
Fig. 1 shows the structural schematic diagram of intelligent power module according to an embodiment of the invention；
Fig. 2 shows the structural schematic diagram of intelligent power module in the prior art；
Fig. 3 shows the structural schematic diagram of intelligent power module according to an embodiment of the invention；
Fig. 4 shows the partial structure diagram of intelligent power module according to an embodiment of the invention；
Fig. 5 shows the top view of intelligent power module part-structure according to an embodiment of the invention；
Fig. 6 shows the structural schematic diagram of intelligent power module according to an embodiment of the invention；
Fig. 7 shows the top view of intelligent power module part-structure according to an embodiment of the invention；
Fig. 8 shows the structural schematic diagram of intelligent power module according to an embodiment of the invention；
Fig. 9 shows the top view of intelligent power module part-structure according to an embodiment of the invention；And
Figure 10 shows the flow diagram of preparation intelligent power module method according to an embodiment of the invention.
Appended drawing reference:
100: circuit substrate；200: circuit unit；210: insulating layer；220: wiring；230: power component；240: non-
Power component；250: metal wire；300: sealing structure；10: heat-dissipating pipe array；11: pit；12: heat-dissipating pipe；13: copper radiating piece.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings.Below with reference to
The embodiment of attached drawing description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In one aspect of the invention, the invention proposes a kind of intelligent power module.According to an embodiment of the invention, ginseng
Fig. 1 is examined, which includes: circuit substrate 100, circuit unit 200 and sealing structure 300.Wherein, circuit substrate
100 be metal substrate, and circuit unit 200 is arranged in the front of circuit substrate 100, sealing structure 300 wrap up circuit unit 200 with
And the front of circuit substrate 100, and the back side of circuit substrate 100 is exposed, and the back side of circuit substrate 100 is provided with heat-dissipating pipe
Array 10 (dotted portion as shown in the figures).The outer back side is exposed in circuit substrate, and heat-dissipating pipe array, heat-dissipating pipe are set
The direct convection current of circuit substrate and air can be enhanced, and heat-dissipating pipe can be with shape with the contact area of increasing circuit substrate and air
At effective passage of heat, so as to improve the capacity of heat transmission of circuit substrate, and then the heat dissipation of the intelligent power module is improved
Efficiency, so that the intelligent power module has good heat dissipation performance, to meet the development of the intelligent power module of high integration
It is required that.
According to an embodiment of the invention, the intelligent power module of high integration, which can be, is integrated with pfc circuit (removing inductance
And capacitor), blower IPM, compressor IPM, sampling resistor, the elements such as thermistor, said elements quantity of heat production is larger, by above-mentioned height
The circuit substrate of the intelligent power module of integrated level is designed as circuit substrate according to an embodiment of the present invention, and above-mentioned height can be improved
The heat dissipation performance of the intelligent power module of integrated level, to meet the demand for development of the intelligent power module of high integration.
In order to make it easy to understand, intelligent power module according to an embodiment of the present invention is briefly described first below:
As previously mentioned, existing intelligent power module is usually total incapsulation module, specifically, with reference to Fig. 2, total incapsulation module
It include: circuit substrate 100, circuit unit 200 and sealing structure 300, wherein circuit unit 200 is arranged in circuit substrate 100
Front, the fully wrapped around circuit unit 200 of sealing structure 300 and circuit substrate 100.In other words, circuit unit 200 and
Circuit substrate 100 is disposed entirely in sealing structure 300.Above-mentioned total incapsulation structure is unfavorable for intelligent power module internal heat
Conduction, easily formation heat localization, and the resin of sealing is high molecular polymer, the thermal conductivity of itself is poor, so as to cause intelligence
Heat inside energy power module can not be conducted effectively to outside, the problem for causing intelligent power module thermal diffusivity poor.In addition,
Existing half encapsulating structure, even if the back side of Intelligent power module circuit substrate is exposed to it is outer, but its there are still heat dissipation performances
Poor problem: with the raising of intelligent power module integrated level, the internal heat generated is more and more, therefore, even
Half encapsulating structure also has been unable to meet the demand for development of high integration intelligent power module.
According to an embodiment of the invention, being exposed to the outer back side on the basis of half encapsulating structure in circuit substrate and being arranged
Heat-dissipating pipe array can use the contact area of heat-dissipating pipe array increasing circuit substrate and air, enhance circuit substrate and air
Direct convection current, and heat-dissipating pipe could be formed with the passage of heat of effect, to improve the capacity of heat transmission of circuit substrate, and then improve
The radiating efficiency of intelligent power module, so that intelligent power module has good heat dissipation performance, to meet the intelligence of high integration
The demand for development of energy power module.
Below according to specific embodiments of the present invention, each structure of the intelligent power module is described in detail:
According to an embodiment of the invention, heat-dissipating pipe array 10 is by multiple 12 structures of heat-dissipating pipe being arranged in array with reference to Fig. 1
At.As a result, for plane is contacted with air, the contact area of heat-dissipating pipe and air is bigger, thus increasing circuit substrate
With the contact area of air, enhance the direct convection current of circuit substrate and air, and heat-dissipating pipe could be formed with the passage of heat of effect,
To improve the capacity of heat transmission of circuit substrate, the heat-sinking capability of the intelligent power module is improved.According to an embodiment of the invention, dissipating
Heat pipe 12 is arranged perpendicular to the plane where circuit substrate 100.Be conducive to pass through the heat inside intelligent power module as a result,
Heat-dissipating pipe is transmitted to outside, improves radiating efficiency.
According to an embodiment of the invention, the back side of circuit substrate 100 can also have multiple be arranged in array with reference to Fig. 3
Pit 11, heat-dissipating pipe 12 be arranged in pit 11.As a result, for heat-dissipating pipe is set in the plane, set in pit
Heat-dissipating pipe is set, the contact area of circuit substrate and air can be further increased, enhances the direct convection current of circuit substrate and air,
Radiating efficiency is improved, and heat-dissipating pipe is set in pit, is conducive to the orderly formation and distribution of heat-dissipating pipe array.
According to an embodiment of the invention, the size of pit 11 is nanometer scale.The size of pit is smaller as a result, in pit
The size of the heat-dissipating pipe of middle setting is also smaller, can further increase the contact area of circuit substrate and air, enhances circuit base
The direct convection current of plate and air improves radiating efficiency.Specific size about pit is not particularly limited, as long as meeting above-mentioned item
Part, those skilled in the art can be designed as the case may be.
Concrete shape about pit is also not particularly limited, as long as can be with the contact area of increasing circuit substrate and air
, those skilled in the art can be designed as the case may be.For example, according to an embodiment of the invention, with reference to Fig. 4,
The vertical section of pit 11 can be semicircle, inverted trapezoidal, triangle or rectangle.Thus, it is possible to further increase heat-dissipating pipe with
The contact area of air, and then the contact area of increasing circuit substrate and air improve radiating efficiency.
According to an embodiment of the invention, with reference to Fig. 5, multiple heat-dissipating pipes 12 form heat-dissipating pipe array, specifically, can be six
Square heat-dissipating pipe array.The contact area of heat-dissipating pipe and air is further increased as a result, to improve the thermally conductive energy of circuit substrate
Power improves radiating efficiency.
According to an embodiment of the invention, circuit substrate 100 is metal substrate, specifically, can be aluminum substrate, heat-dissipating pipe 12
It can be alumina tube.Aluminum substrate has the advantages that at low cost, thermal capacitance is low, on the one hand alumina tube can be improved as heat-dissipating pipe
On the other hand the heat transfer efficiency of intelligent power module can protect aluminum substrate not by the corrosion of steam and soda acid, improve intelligent function
The service performance of rate module.
According to an embodiment of the invention, circuit unit includes: insulating layer 210, wiring 220, power member with reference to Fig. 3
Part 230, non-power element 240, metal wire 250 and pin (not shown).Wherein, insulating layer 210 is arranged in circuit base
The front of plate 100, wiring 220 are arranged in side of the insulating layer 210 far from circuit substrate 100, power component 230 and non-
The pre-position of wiring 220 is arranged in power component 240, and is side of the wiring 220 far from insulating layer 210,
Power component 230 and wiring 220 and non-power element 240 and wiring 220, realize electricity by metal wire 250
Connection, pin are arranged on the predetermined position of wiring 220, and are located at the edge of circuit substrate 100.Wherein, insulating layer
For completely cutting off metal circuit base board and wiring.Intelligent power mould may be implemented by the way that foregoing circuit unit is arranged as a result,
The use function of block.
According to an embodiment of the invention, wiring and pin can be and formed by copper, thus, it is possible to make circuit cloth
Line and pin have good conductive property.According to an embodiment of the invention, insulating layer 210 can be by being compounded with ceramics
What the resin material of grain was formed, thus, it is possible to make insulating layer that there is good insulation performance.
According to an embodiment of the invention, power component 230 and non-power element 240 can be made of active component, also
It can be made of passive element, active component can be transistor or diode, and passive element can be capacitor or resistance.By
This, may be constructed power component and non-power element.According to an embodiment of the invention, power component 230 passes through wiring
220 are fixed on circuit substrate 100, other embodiments according to the present invention, can also be by copper radiator by power component
230 are fixed on circuit substrate 100.Thus, it is possible to utilize copper radiator effectively element that the calorific values such as power component are big
The heat of generation is transmitted on circuit substrate, and then is transmitted to above-mentioned heat by circuit substrate according to an embodiment of the present invention
The outside of intelligent power module further increases the heat dissipation performance of intelligent power module.
According to an embodiment of the invention, sealing structure 300 can be and be formed by resin, specifically, sealing structure 30 can
To be formed by thermosetting resin, it can also be and formed by thermoplastic resin, thus, it is possible to which it is good to have sealing structure
Good sealing effect.
According to an embodiment of the invention, alumina tube (i.e. heat-dissipating pipe 12) can also be dissipated including copper with reference to Fig. 6 and Fig. 8
Warmware 13.The capacity of heat transmission of copper is stronger, thus, it is possible to further increase the heat-sinking capability of intelligent power module.According to the present invention
Embodiment, with reference to Fig. 6 and Fig. 7, copper radiating piece 13 can cover the inner surface of alumina tube, alternatively, according to the present invention
Other embodiments, with reference to Fig. 8 and Fig. 9, copper radiating piece 13 can be filled in the inside of alumina tube.Thus, it is possible into one
The capacity of heat transmission of step enhancing circuit substrate, to further increase the heat-sinking capability of intelligent power module.
In another aspect of this invention, the invention proposes a kind of electric appliances.According to an embodiment of the invention, the electric appliance includes
Previously described intelligent power module, the electric appliance has whole features of previously described intelligent power module and excellent as a result,
Point, details are not described herein.Generally speaking, which has good service performance.
According to an embodiment of the invention, the electric appliance can be air-conditioning, washing machine, refrigerator, electromagnetic oven etc., and in above-mentioned electric appliance
Intelligent power module can be realized function possessed by intelligent power module described in preceding sections.Above-mentioned electric appliance as a result,
Can have good service performance.
In another aspect of this invention, the invention proposes a kind of methods for preparing intelligent power module.According to the present invention
Embodiment, this method preparation intelligent power module can be previously described intelligent power module, as a result, this method prepare
Intelligent power module can have feature identical with previously described intelligent power module and advantage, it is no longer superfluous herein
It states.
According to an embodiment of the invention, with reference to Figure 10, this method comprises:
S100: heat-dissipating pipe array is formed at the back side of circuit substrate
According to an embodiment of the invention, in this step, forming heat-dissipating pipe array at the back side of circuit substrate.According to this hair
The heat-dissipating pipe of bright embodiment, formation is arranged perpendicular to the plane where circuit substrate.Heat-dissipating pipe can be with increasing circuit base as a result,
The contact area of plate and air, enhances the direct convection current of circuit substrate and air, and heat-dissipating pipe can also form effective thermally conductive logical
Road, and heat-dissipating pipe is arranged perpendicular to the plane where circuit substrate, being conducive to will be inside finally formed intelligent power module
Heat is transmitted to outside by heat-dissipating pipe, improves the heat transfer efficiency of finally formed intelligent power module.
According to an embodiment of the invention, circuit substrate is metal substrate, specifically, can be aluminum substrate.Aluminum substrate has
Advantage at low cost, thermal capacitance is low has intelligent power module good thus, it is possible to reduce the cost of intelligent power module
Service performance.Shape and size about circuit substrate are not particularly limited, and those skilled in the art can be according to specific feelings
Condition is selected.For example, according to an embodiment of the invention, circuit substrate can be rectangular plate.
According to an embodiment of the invention, circuit substrate is aluminum substrate, heat-dissipating pipe can be alumina tube.Alumina tube conduct
On the one hand the heat transfer efficiency of finally formed intelligent power module can be improved in heat-dissipating pipe, on the other hand can protect aluminum substrate not
By the corrosion of steam and soda acid, the service performance of finally formed intelligent power module is improved.
According to an embodiment of the invention, before the circuit substrate back side forms heat-dissipating pipe array, it can also be in circuit substrate
The back side is initially formed multiple pits being arranged in array, and then forms heat-dissipating pipe in above-mentioned pit.Pit is conducive to dissipate as a result,
The orderly formation and distribution of heat pipe array, and for heat-dissipating pipe is set in the plane, heat-dissipating pipe is set in pit, it can
To further increase the contact area of circuit substrate and air, enhances the direct convection current of circuit substrate and air, further increase
The heat-sinking capability of finally formed intelligent power module.
According to an embodiment of the invention, the pit and heat-dissipating pipe array at the circuit substrate back side can pass through anodic oxygen
Change formation.Pit and heat-dissipating pipe array can be formed using simple method as a result,.According to an embodiment of the invention,
The back side setting pit and heat-dissipating pipe array of aluminum substrate, can be through the following steps that realize:
Firstly, aluminum substrate is made annealing treatment to improve the crystal situation of aluminum metal, prevent inside aluminum metal further
Oxidation.Then, aluminum substrate is cleaned by ultrasonic to remove the greasy dirt on surface.Then, using lye or alkali metal soln to aluminium
Substrate performs etching processing to remove the natural oxidizing layer on surface.Then, the aluminum substrate cleaned up placement is soaked in ethanol
Steep certain time.
According to an embodiment of the invention, carrying out anodic oxidation to aluminum substrate to form the preferable oxidation film of order
Before processing, electrobrightening processing can also be carried out to aluminum substrate, to eliminate the mechanical defect of aluminium base plate surface, reduce aluminum substrate
Surface roughness.Electrobrightening is carried out specifically, the aluminum substrate impregnated in ethanol, graphite are put into polishing electrolytic cell
Processing, wherein aluminum substrate is as anode, and graphite is as cathode, the mixed solution conduct polishing electrolyte of ethyl alcohol and perchloric acid.By
This, can obtain that surface mechanical defect is few, the small aluminum substrate of surface roughness, convenient for subsequent step at the back side of above-mentioned aluminum substrate
Form the preferable oxidation film of order.
According to an embodiment of the invention, then anodic oxidation electrolytic cell will be put by aluminum substrate, the graphite of electrobrightening
Middle carry out anodized, wherein aluminum substrate is as anode, and graphite is as cathode, sulfuric acid or oxalic acid as anodic oxidation electricity
Solve liquid.Thus, it is possible to the microporous aluminum oxide being arranged in array, i.e. pit are formed on the surface of aluminum substrate side, consequently facilitating
Subsequent step forms heat-dissipating pipe in above-mentioned pit, can be with increasing circuit substrate using heat-dissipating pipe to form heat-dissipating pipe array
With the contact area of air, enhance the direct convection current of circuit substrate and air, and heat-dissipating pipe can be used as effective passage of heat,
To improve radiating efficiency, and using above-mentioned surface as the back side of aluminum substrate, in the next steps in the not set pit of aluminum substrate
And the surface of heat-dissipating pipe array, the i.e. front of aluminum substrate, setting circuit unit have the intelligence of excellent heat dispersion performance with acquisition
Power module.
About the conditions such as concentration of electrolyte, oxidation voltage, oxidization time during the anodized for forming pit
It is not particularly limited, as long as the aluminum substrate that surface has multiple pits being arranged in array can be obtained, art technology
Personnel can be designed as the case may be.
About the size and shape of pit, before detailed description has been carried out, details are not described herein.For example, according to this
The size of the embodiment of invention, pit can be nanometer scale, and the vertical section of pit can be semicircle, inverted trapezoidal, triangle
Or rectangle.Thus, it is possible to further increase the contact area of the heat-dissipating pipe and air that are formed in subsequent step, and then increase electricity
The contact area of base board and air enhances the direct convection current of circuit substrate and air, improves radiating efficiency.
According to an embodiment of the invention, dimpled aluminum substrate will be arranged and be placed on after aluminium base back forms pit
Certain time is impregnated in the mixed solution of phosphoric acid and chromic acid, soaking temperature can be 60 DEG C, and pit surface is primary to remove
Oxidation film.The mixed solution of phosphoric acid and chromic acid has very strong dissolution to oxidation film, but corrosivity is weaker, by
This, can be completely dissolved once oxidation film, only the metallic aluminium below remaining oxidation film, and there are have in above-mentioned metallic aluminum surface
The pit of sequence arrangement, so that being conducive to two-step anodization processing forms the alumina tube being orderly distributed.
Then, aluminum substrate is cleaned, and aluminum substrate, the graphite after cleaning is put into anodic oxidation electrolytic cell and carried out
Two-step anodization processing, wherein aluminum substrate is electrolysed as cathode, sulfuric acid or oxalic acid as anodic oxidation as anode, graphite
Liquid.Thus, it is possible to form alumina tube in pit, to form alumina tube array, the capacity of heat transmission of aluminum substrate is improved, into
And improve the heat dissipation performance of finally formed intelligent power module.
About conditions such as concentration of electrolyte, oxidation voltage, oxidization times in two-step anodization treatment process not by spy
It does not limit, as long as alumina tube can be formed in pit, those skilled in the art can set as the case may be
Meter.
About the dimension and shape of alumina tube, before detailed description has been carried out, details are not described herein.For example,
According to an embodiment of the invention, the size of alumina tube can be nanometer scale, shape can be six side's alumina tubes.As a result,
The contact area of alumina tube and air is further increased, to improve the capacity of heat transmission of circuit substrate, improves radiating efficiency.
According to an embodiment of the invention, in order to further increase radiating efficiency, can also alumina tube inner surface or
Inside person, copper radiating piece is set.The capacity of heat transmission of copper is stronger, thus, it is possible to further increase finally formed intelligent power mould
The heat-sinking capability of block.
According to an embodiment of the invention, can be and pass through in the inner surface or internal setting copper radiating piece of alumina tube
The aluminum substrate for being provided with alumina tube is put into plating cell and carries out electrochemical plating processing and realizes.Specifically, setting
There is the aluminum substrate of alumina tube as cathode, graphite is as anode, and copper ions substance is as electrolyte, for example, copper sulphate, chlorine
Change copper etc..According to an embodiment of the invention, pass through the conditions such as voltage, time, the concentration of electrolyte during control electrochemical plating,
The copper radiating piece inside the copper radiating piece of covering alumina tube inner surface, or filling alumina tube can be obtained.
Specific value about above-mentioned parameter during electrochemical plating is not particularly limited, as long as can be in alumina tube
Surface or internal formation copper radiating piece, those skilled in the art can be designed as the case may be.
S200: in the front setting circuit unit of circuit substrate
According to an embodiment of the invention, in this step, in the front setting circuit unit of circuit substrate.According to the present invention
Embodiment, circuit unit includes insulating layer, wiring, power component, non-power element, metal wire and pin, in electricity
Circuit unit is arranged in the front of base board
Firstly, in the front setting insulating layer of circuit substrate.Then, copper is set far from the side of circuit substrate in insulating layer
Layer, and wiring is formed using etching technics based on above-mentioned layers of copper.Then, by stencil printer, using steel mesh, to circuit
The presumptive area of wiring carries out tin cream coating, and the setting of power component, non-power element and pin is coated in wiring
Have at the position of tin cream, and is side of the wiring far from insulating layer.Wherein, the thickness of 0.13mm can be used in steel mesh.Then,
Carrying out Reflow Soldering to foregoing circuit substrate solidifies tin cream, and power component, non-power element and pin are fixed on circuit cloth
On the predetermined position of line, wherein the edge of circuit substrate is arranged in pin.
Then, foregoing circuit substrate is put into cleaning machine and is cleaned, remaining rosin etc. helps when cleaning Reflow Soldering
The foreign matters such as remaining aluminum steel when solder flux and punching press.It is close according to the arrangement of power component and non-power element on wiring
It spends, cleaning can carry out by way of spray, ultrasound or both combine, and when cleaning, pass through mechanical arm and clamp two or more
Pin, circuit substrate is placed in rinse bath, since pin is connected with each other without reinforcing rib independently of one another, even if
Mechanical arm is uneven to the clamping force of each pin, and the vibration in cleaning process will not generate power transmitting between pin, in turn
The separation of part pin and pad is not will cause.
Then, in the specific position bonding metal wire of power component, non-power element and wiring, to realize function
Rate element and wiring and non-power element are electrically connected with wiring.Thus, it is possible in the positive shape of circuit substrate
At circuit unit.
S300: the front of circuit unit and circuit substrate is wrapped up using sealing structure, and exposes the back of circuit substrate
Face
According to an embodiment of the invention, in this step, circuit unit and circuit substrate are wrapped up using sealing structure
Front, and expose the back side of circuit substrate.It is formed according to an embodiment of the invention, sealing structure can be by thermosetting resin
, it can also be and formed by thermoplastic resin.Thus, it is possible to make sealing structure that there is good sealing effect.
According to an embodiment of the invention, being sealed to the front of circuit unit and circuit substrate can be by following
What step was realized:
Firstly, the circuit substrate for being provided with circuit unit is placed in oxygen-free environment, and foregoing circuit substrate is carried out
Baking processing, baking time are not less than 2 hours, and baking temperature can be 125 DEG C.Then, foregoing circuit substrate is put into model
Middle molding, and the resin for being used to form sealing structure is injected by sprue gate.According to an embodiment of the invention, the model being sealed
For half encapsulating model, the sealed rear available circuit substrate back side is exposed to half outer encapsulating structure as a result,.
According to an embodiment of the invention, the method being sealed can be to be moulded or made using the transmitting mould of thermosetting resin
It is moulded with the injection mould of thermoplastic resin.It can be realized using the above method as a result, positive to circuit unit and circuit substrate
Sealing.
According to an embodiment of the invention, after completing the procedure, it is also necessary to carry out forming processes to pin, i.e., in pin
Predetermined position pin is bent, formed have certain bending shape pin, in order to subsequent assembly.About bending
Specific location be not particularly limited, those skilled in the art can be designed as the case may be.Thus, it is possible to obtain root
According to the intelligent power module of the embodiment of the present invention.
According to an embodiment of the invention, the service efficiency in order to guarantee finally formed product, is preparing intelligent power
After module, above-mentioned intelligent power module is put into test equipment, carries out conventional electric parameters testing, test passes person is
Finished product.Electric parameters testing may include the test items such as insulation pressure resistance, quiescent dissipation, delay time.
To sum up, pit can be formed at the back side of circuit substrate using simple method, and forms heat dissipation in pit
Pipe array, or in the structures such as heat dissipation pipe internal surface or internal formation copper radiating piece, and then obtain with excellent heat dispersion performance
Intelligent power module, to meet the demand for development of the intelligent power module of high integration.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (14)
1. a kind of intelligent power module characterized by comprising
Circuit substrate, the circuit substrate are metal substrate；
The front of the circuit substrate is arranged in circuit unit, the circuit unit；And
Sealing structure, the sealing structure wrap up the front of the circuit unit and the circuit substrate, and expose
The back side of the circuit substrate, the back side are provided with heat-dissipating pipe array.
2. intelligent power module according to claim 1, which is characterized in that the heat-dissipating pipe is perpendicular to the circuit substrate
The plane at place is arranged.
3. intelligent power module according to claim 1 or 2, which is characterized in that the back side has pit, the heat dissipation
Pipe is arranged in the pit.
4. intelligent power module according to claim 3, which is characterized in that the size of the pit is nanometer scale.
5. intelligent power module according to claim 3, which is characterized in that the vertical section of the pit is semicircle, falls
Trapezoidal, triangle or rectangle.
6. intelligent power module according to claim 1, which is characterized in that the circuit substrate is aluminum substrate, described to dissipate
Heat pipe is alumina tube.
7. intelligent power module according to claim 6, which is characterized in that the alumina tube further comprises: copper dissipates
Warmware.
8. intelligent power module according to claim 7, which is characterized in that the copper radiating piece covers the alumina tube
Inner surface, or be filled in inside the alumina tube.
9. a kind of electric appliance, which is characterized in that including the described in any item intelligent power module of claim 1-8.
10. a kind of method for preparing intelligent power module characterized by comprising
Heat-dissipating pipe array is formed at the back side of circuit substrate, the circuit substrate is metal substrate；
In the front setting circuit unit of the circuit substrate；And
The front of the circuit unit and the circuit substrate is wrapped up using sealing structure, and exposes the circuit base
The back side of plate.
11. according to the method described in claim 10, it is characterized in that, further comprising:
Pit is formed at the back side of the circuit substrate, forms the heat-dissipating pipe in the pit, the heat-dissipating pipe hangs down
Directly it is arranged in the plane where the circuit substrate.
12. according to the method for claim 11, which is characterized in that the pit and the heat-dissipating pipe array pass through
What anodic oxidation was formed.
13. according to the method for claim 11, which is characterized in that the circuit substrate is aluminum substrate, and the heat-dissipating pipe is
Alumina tube.
14. according to the method for claim 13, which is characterized in that further comprise:
Copper radiating piece is arranged in inner surface or inside in the alumina tube.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811287321.9A CN109411430A (en) | 2018-10-31 | 2018-10-31 | Intelligent power module and preparation method, electric appliance |
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| CN201811287321.9A CN109411430A (en) | 2018-10-31 | 2018-10-31 | Intelligent power module and preparation method, electric appliance |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110829733A (en) * | 2019-10-24 | 2020-02-21 | 珠海凯邦电机制造有限公司 | Control panel, motor and air conditioning system |
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