CN108611016A - Multi-layered bonded protective film and preparation method thereof - Google Patents
Multi-layered bonded protective film and preparation method thereof Download PDFInfo
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- CN108611016A CN108611016A CN201611177948.XA CN201611177948A CN108611016A CN 108611016 A CN108611016 A CN 108611016A CN 201611177948 A CN201611177948 A CN 201611177948A CN 108611016 A CN108611016 A CN 108611016A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
- C09J2477/006—Presence of polyamide in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
The present invention relates to a kind of multi-layered bonded protective films; wherein; caking property protective film includes the adhesive phase of substrate layer and ultraviolet hardening; substrate layer includes polyethylene layer, ethylene methyl acrylate copolymer layer and aramid layer successively; for polyethylene layer between the adhesive phase and ethylene methyl acrylate copolymer layer of ultraviolet hardening, polyethylene layer includes the raw material of following mass parts：20~100 parts of polyethylene, 10~30 parts of plasticizer, 0.1~1 part of antioxidant, 0.5~1.5 part of ultraviolet absorber, polyethylene layer, ethylene methyl acrylate copolymer layer and aramid layer are after coextrusion casting film forming through electron irradiation equipment cross-linking radiation.The present invention also provides the preparation methods of said protection film.Protective film using the present invention, reduces production cost；Base material has higher surface energy, stronger with the bonding force of pressure sensitive adhesive, may make that adhesive phase is relatively low with the bonding force of silicon chip after ultra-violet curing, reduces residual silkgum content.
Description
Technical field
The present invention relates to the technical fields of protective film, the more particularly to technical field of caking property protective film, in particular to one
Kind multi-layered bonded protective film and preparation method thereof.
Background technology
In the past, in the manufacturing process of semiconductor device, semiconductor chip is protected in grinding, cutting process using caking property
Cuticula.This caking property protective film needs higher cleanliness factor and extremely low ionic impurity content, and equal with excellent thickness
Even property, time stability, adhesiveness, extensibility, make to easily pick up chip in cutting processing.
Invention content
The purpose of the invention is to overcome the disadvantages of the prior art mentioned above, provide it is a kind of squeeze out, curtain coating, irradiate same
One assembly line molding, greatly shorten technological process, base material by irradiation crosslinking technological, formed tridimensional network, improve it is heat-resisting
Property and ageing-resistant performance, enhance chemical-resistant stability and solvent resistance multi-layered bonded protective film and preparation method thereof.
To achieve the goals above, one aspect of the present invention provides a kind of multi-layered bonded protective film, the caking property
Protective film includes the adhesive phase of substrate layer and ultraviolet hardening, and the substrate layer includes polyethylene layer, ethylene-the third successively
E pioic acid methyl ester copolymer layer and aramid layer, the polyethylene layer between the ultraviolet hardening adhesive phase and
Between the ethylene-methyl acrylate copolymer layer, the polyethylene layer includes the raw material of following mass parts：Polyethylene 20
~100 parts, 10~30 parts of plasticizer, 0.1~1 part of antioxidant, 0.5~1.5 part of ultraviolet absorber, the polyethylene layer, second
Alkene-methyl acrylate copolymer layer and aramid layer are after coextrusion casting film forming through electron irradiation equipment cross-linking radiation.
Preferably, the plasticizer is dioctyl phthalate, dibutyl phthalate, phthalic acid fourth benzyl
Ester, dicyclohexyl phthalate, diisobutyl phthalate, repefral, diethyl phthalate, neighbour
One or more of phthalic acid dinonyl, diisooctyl phthalate, the antioxidant be phenolic antioxidant,
Phosphite ester system antioxidant, amine system of being obstructed antioxidant, the ultraviolet absorber are to Benzophenone class, benzotriazole, water
At least one of poplar esters of gallic acid, group-substituted acrylonitrile, triazines ultraviolet absorber.
Preferably, including the ethylene-acrylic acid first of 1~50 mass parts in the ethylene-methyl acrylate copolymer layer
Ester copolymer resin, the aramid layer include 20~100 parts of polyamide, 0.1~1 part of antioxidant.
Preferably, the adhesive phase includes the raw material of following mass parts：1~100 part of acrylic resin, ethyl acetate
1~100 part, 1~100 part of response type diluting monomer, 0.01~50 part of curing agent, 0.01~30 part of curing accelerator is light-initiated
1~80 part of agent.
Preferably, the thickness of the adhesive phase is 10~50 μm, the thickness of the polyethylene layer is 1~120 μm,
The thickness of the ethylene-methyl acrylate copolymer layer is 1~10 μm, and the thickness of the aramid layer is 1~120 μm,
The thickness of the substrate layer is 80~120 μm.
Preferably, the acrylic resin is the acrylate of homopolymerization or the C of copolymerization1-C20One kind in Arrcostab or
A variety of, the acrylate of homopolymerization includes methyl acrylate, ethyl acrylate, butyl acrylate, 2- ethylhexyl acrylates, third
One kind in olefin(e) acid monooctyl ester or the substitution of its methyl, the Arrcostab of copolymerization include alkyl acrylate or alkyl methacrylate and
Copolymerizable monomer.
Preferably, the irradiation dose is 1~300KGy.
The present invention also provides a kind of preparation methods of multi-layered bonded protective film, including the following steps：
Step (1)：By 20~100 parts of polyethylene, 10~30 parts of plasticizer, 0.1~1 part of antioxidant, ultraviolet absorber 0.5
~1.5 parts uniform in high-speed mixer and mixing, carries out extruding pelletization, and polyethylene pellet is made；By 20~100 parts of polyamide resin
Fat, 0.1~1 part of antioxidant are uniform in high-speed mixer and mixing, carry out extruding pelletization, and polyamide pellet is made；
Step (2)：The polyethylene pellet made, the EMA resins of 1~50 mass parts, the polyamide pellet made are put into
Into multi-layer co-extruded extruder, through curtain coating, cooling, traction, winding, substrate layer is made；
Step (3)：The substrate layer is put into electron irradiation equipment and carries out cross-linking radiation；
Step (4)：Base material layer coiled material after irradiation is put on coating machine, one is coated on the cross-linking radiation face of substrate layer
Layer ultraviolet curing type adhesive phase, through hot drying tunnel, the multi-layered bonded protective film of the present invention is made in winding.
Multi-layered bonded protective film using the present invention and preparation method thereof, substrate layer are that transparent or white plastics are thin
Film, the film can expeditiously penetrate ultraviolet light, and one layer of ultraviolet hardening acrylate pressure sensitive adhesive is coated on the plastic film,
With good thermal stability and higher bonding force, and rapid curing, cohesive force are greatly reduced after ultraviolet light, raw
Production. art is extremely simple, at low cost；It squeezes out, curtain coating, irradiate in the molding of same assembly line, substantially reduce technological process, reduce
Production cost has higher industrial production value；Base material is by irradiation crosslinking technological, the height sent out using electron accelerator
Energy electron line, ionization and excitation macromolecular chain, so that it is interrupted and is generated free radicals, because free radical is unstable, mutually it
Between to reconfigure, the macromolecular chain after reconfiguring is entangled to each other, forms tridimensional network, improves heat resistance and resistance to old
Change performance, enhance the properties such as chemical-resistant stability and solvent resistance, film after crosslinking have stronger mechanical performance and
Weather-proof water preventing ability, have higher surface energy, it is stronger with the bonding force of pressure sensitive adhesive, may make adhesive phase after ultra-violet curing with
The bonding force of silicon chip is relatively low, reduces residual silkgum content.
Description of the drawings
Fig. 1 is the structural schematic diagram of the multi-layered bonded protective film of the present invention.
Reference numeral
1 aramid layer
2 EMA layers
3 polyethylene layers
4 adhesive phases
Specific implementation mode
In order to be more clearly understood that the technology contents of the present invention, the specific implementation method of the present invention is made into one below
Walk explanation.
As shown in Figure 1, multi-layered bonded protective film provided by the invention includes the bonding of substrate layer and ultraviolet hardening
Oxidant layer 4, the substrate layer include polyethylene layer 3, ethylene-methyl acrylate copolymer layer 2 and aramid layer 1, institute successively
The polyethylene layer stated between the adhesive phase of the ultraviolet hardening and the ethylene-methyl acrylate copolymer layer it
Between, the polyethylene layer includes the raw material of following mass parts：20~100 parts of polyethylene, 10~30 parts of plasticizer, antioxidant
0.1~1 part, 0.5~1.5 part of ultraviolet absorber, the polyethylene layer 3, ethylene-methyl acrylate copolymer layer 2 and poly-
For amide layer 1 through electron irradiation equipment cross-linking radiation after coextrusion casting film forming, the irradiation dose is 1~300KGy.
The wherein described plasticizer be dioctyl phthalate, dibutyl phthalate, BBP(Butyl Benzyl Phthalate,
Dicyclohexyl phthalate, diisobutyl phthalate, repefral, diethyl phthalate, adjacent benzene
One or more of dioctyl phthalate dinonyl, diisooctyl phthalate, the antioxidant are phenolic antioxidant, Asia
Phosphate system antioxidant, amine system of being obstructed antioxidant, the ultraviolet absorber are to Benzophenone class, benzotriazole, bigcatkin willow
At least one of esters of gallic acid, group-substituted acrylonitrile, triazines ultraviolet absorber.
Wherein, the ethylene-methyl acrylate of 1~50 mass parts is included in the ethylene-methyl acrylate copolymer layer
Copolymer resin, the aramid layer include 20~100 parts of polyamide, 0.1~1 part of antioxidant.
Wherein the adhesive phase includes the raw material of following mass parts：1~100 part of acrylic resin, ethyl acetate 1~
100 parts, 1~100 part of response type diluting monomer, 0.01~50 part of curing agent, 0.01~30 part of curing accelerator, photoinitiator 1
~80 parts；The thickness of the adhesive phase is 10~50 μm, and the thickness of the polyethylene layer is 1~120 μm, the second
The thickness of alkene-methyl acrylate copolymer layer is 1~10 μm, and the thickness of the aramid layer is 1~120 μm, the base
The thickness of material layer is 80~120 μm；The acrylic resin is the acrylate of homopolymerization or the C of copolymerization1-C20In Arrcostab
One or more, the acrylate of homopolymerization includes methyl acrylate, ethyl acrylate, butyl acrylate, 2- ethylhexyl propylene
One kind in acid esters, 2-ethyl hexyl acrylate or the substitution of its methyl, the Arrcostab of copolymerization includes alkyl acrylate or methacrylic acid
Arrcostab and copolymerizable monomer.
The ultraviolet-curing adhesive be by be basic polymer comprising acrylic monomers, crosslinking agent is additive
The acrylic acid adhesive composition of composition, preferably (methyl) acrylate of homopolymerization or the C of copolymerization1-C20One in Arrcostab
Kind is a variety of, wherein (methyl) acrylate of homopolymerization includes (methyl) methyl acrylate, (methyl) ethyl acrylate, (first
Base) butyl acrylate, 2- ethylhexyls (methyl) acrylate, one kind in (methyl) 2-ethyl hexyl acrylate；The Arrcostab of copolymerization
Including (methyl) alkyl acrylate and another copolymerizable monomer, and the thickness control of ultraviolet-curing adhesive is 10
~50 μm.
Embodiment 1
Film raw material by weight, by 50 parts of high density polyethylene (HDPE) (HDPE) weight resin, antioxidant 1010 weight 0.1
Part, 0.2 part of irgasfos 168 weight, 1 part of 774 weight of ultraviolet absorber, 30 parts of dioctyl phthalate (DOP) weight, three hydroxyls
2 parts of propane tri (TMPTA) weight in high-speed mixer after mixing, under 150 DEG C of extrusion temperature
It is granulated；By 50 parts of polyamide 66 (PA66) weight resin, 0.2 part of antioxidant 1010 weight, 0.2 part of irgasfos 168 weight in height
In fast mixing machine after mixing, it is granulated under 250 DEG C of extrusion temperature；Again by HDPE pellets, EMA resins, PA66 pellets point
It is not put into multi-layer co-extruded extruder, extruded machine curtain coating, is made HDPE/PA66 films at 250 DEG C after drawing-off.
The HDPE/PA66 films made are put into electron beam irradiation cross-linking apparatus and are irradiated, irradiation dose is
60KGy。
HDPE/PA66 film coils after irradiation are put into scraper coating machine, are coated on outer layer cross-linking radiation face
One layer of ultraviolet curing acrylic pressure sensitive adhesive, 27 μm of coating layer thickness, through hot drying tunnel, winding.
Embodiment 2
Film raw material by weight, by 60 parts of low density polyethylene (LDPE) (LDPE) weight resin, antioxidant 1010 weight 0.1
Part, 0.2 part of irgasfos 168 weight, 1 part of 774 weight of ultraviolet absorber, 30 parts of dibutyl phthalate (DBP) weight, three hydroxyls
2 parts of propane tri (TMPTA) weight is granulated after high-speed mixer and mixing is uniform under 145 DEG C of extrusion temperature；
By 50 parts of polyamide 66 (PA66) weight resin, 0.2 part of antioxidant 1010 weight, 0.2 part of irgasfos 168 weight in mixed at high speed
In machine after mixing, it is granulated under 250 DEG C of extrusion temperature；LDPE pellets, EMA resins, PA66 pellets are respectively put into again
In multi-layer co-extruded extruder, extruded machine curtain coating, is made LDPE/PA66 films at 250 DEG C after drawing-off.
The LDPE/PA66 films made are put into electron beam irradiation cross-linking apparatus and are irradiated, irradiation dose is
50KGy。
LDPE/PA66 film coils after irradiation are put into scraper coating machine, are coated on outer layer cross-linking radiation face
One layer of ultraviolet curing acrylic pressure sensitive adhesive, 20 μm of coating layer thickness, through hot drying tunnel, winding.
Embodiment 3
Film raw material by weight, by 50 parts of linear low density polyethylene (LLDPE) weight resin, antioxidant 1010 weight
0.1 part of amount, 0.2 part of irgasfos 168 weight, 1 part of 774 weight of ultraviolet absorber, dibutyl phthalate (DBP) weight 30
Part, 2 parts of trimethylolpropane trimethacrylate (TMPTA) weight are after high-speed mixer and mixing is uniform, in 145 DEG C of extrusion temperature
Lower granulation；By 50 parts of polyamide 1010 (PA1010) weight resin, 0.2 part of antioxidant 1010 weight, irgasfos 168 weight 0.2
Part after mixing, is granulated in high-speed mixer under 250 DEG C of extrusion temperature；Again by LLDPE pellets, EMA resins,
PA1010 pellets are respectively put into multi-layer co-extruded extruder, and extruded machine curtain coating, is made LLDPE/PA1010 at 250 DEG C after drawing-off
Film.
The LLDPE/PA1010 films made are put into electron beam irradiation cross-linking apparatus and are irradiated, irradiation dose is
50KGy。
LLDPE/PA1010 film coils after irradiation are put into scraper coating machine, are applied on outer layer cross-linking radiation face
One layer of ultraviolet curing acrylic pressure sensitive adhesive of cloth, 20 μm of coating layer thickness, through hot drying tunnel, winding.
Multi-layered bonded protective film using the present invention and preparation method thereof, substrate layer are that transparent or white plastics are thin
Film, the film can expeditiously penetrate ultraviolet light, and one layer of ultraviolet hardening acrylate pressure sensitive adhesive is coated on the plastic film,
With good thermal stability and higher bonding force, and rapid curing, cohesive force are greatly reduced after ultraviolet light, raw
Production. art is extremely simple, at low cost；It squeezes out, curtain coating, irradiate in the molding of same assembly line, substantially reduce technological process, reduce
Production cost has higher industrial production value；Base material is by irradiation crosslinking technological, the height sent out using electron accelerator
Energy electron line, ionization and excitation macromolecular chain, so that it is interrupted and is generated free radicals, because free radical is unstable, mutually it
Between to reconfigure, the macromolecular chain after reconfiguring is entangled to each other, forms tridimensional network, improves heat resistance and resistance to old
Change performance, enhance the properties such as chemical-resistant stability and solvent resistance, film after crosslinking have stronger mechanical performance and
Weather-proof water preventing ability, have higher surface energy, it is stronger with the bonding force of pressure sensitive adhesive, may make adhesive phase after ultra-violet curing with
The bonding force of silicon chip is relatively low, reduces residual silkgum content.
In this description, the present invention is described with reference to its specific embodiment.But it is clear that can still make
Various modifications and alterations are without departing from the spirit and scope of the invention.Therefore, the description and the appended drawings should be considered as illustrative
And not restrictive.
Claims (8)
1. a kind of multi-layered bonded protective film, which is characterized in that the caking property protective film includes that substrate layer and ultraviolet light are solid
The adhesive phase of change type, the substrate layer include polyethylene layer, ethylene-methyl acrylate copolymer layer and polyamide successively
Layer, the polyethylene layer are copolymerized between the adhesive phase of the ultraviolet hardening and the ethylene-methyl acrylate
Between nitride layer, the polyethylene layer includes the raw material of following mass parts：20~100 parts of polyethylene, resists 10~30 parts of plasticizer
0.1~1 part of oxygen agent, 0.5~1.5 part of ultraviolet absorber, the polyethylene layer, ethylene-methyl acrylate copolymer layer and
Aramid layer is after coextrusion casting film forming through electron irradiation equipment cross-linking radiation.
2. multi-layered bonded protective film according to claim 1, which is characterized in that the plasticizer is phthalic acid
Dioctyl ester, dibutyl phthalate, BBP(Butyl Benzyl Phthalate, dicyclohexyl phthalate, two isobutyl of phthalic acid
In ester, repefral, diethyl phthalate, diisononyl phthalate, diisooctyl phthalate
One or more, the antioxidant be phenolic antioxidant, phosphite ester system antioxidant, amine system of being obstructed antioxidant, institute
The ultraviolet absorber stated is to Benzophenone class, benzotriazole, salicylic acid esters, group-substituted acrylonitrile, triazines UV absorption
At least one of agent.
3. multi-layered bonded protective film according to claim 1, which is characterized in that the ethylene-methyl acrylate is total
Include the ethylene-methyl acrylate copolymer resin of 1~50 mass parts in polymers layer, the aramid layer includes 20~100
The polyamide, 0.1~1 part of antioxidant of part.
4. multi-layered bonded protective film according to claim 1, which is characterized in that the adhesive phase includes following matter
Measure the raw material of part：1~100 part of acrylic resin, 1~100 part of ethyl acetate, 1~100 part of response type diluting monomer, curing agent
0.01~50 part, 0.01~30 part of curing accelerator, 1~80 part of photoinitiator.
5. multi-layered bonded protective film according to claim 1, which is characterized in that the thickness of the adhesive phase is 10
~50 μm, the thickness of the polyethylene layer is 1~120 μm, and the thickness of the ethylene-methyl acrylate copolymer layer is 1
~10 μm, the thickness of the aramid layer is 1~120 μm, and the thickness of the substrate layer is 80~120 μm.
6. multi-layered bonded protective film according to claim 4, which is characterized in that the acrylic resin is homopolymerization
Acrylate or the C of copolymerization1-C20One or more in Arrcostab, the acrylate of homopolymerization includes methyl acrylate, acrylic acid
One kind in ethyl ester, butyl acrylate, 2- ethylhexyl acrylates, 2-ethyl hexyl acrylate or the substitution of its methyl, the alkyl of copolymerization
Ester includes alkyl acrylate or alkyl methacrylate and copolymerizable monomer.
7. multi-layered bonded protective film according to claim 1, which is characterized in that the irradiation dose be 1~
300KGy。
8. a kind of preparation method of multi-layered bonded protective film according to any one of claim 1 to 7, feature exist
In including the following steps：
Step (1)：By 20~100 parts of polyethylene, 10~30 parts of plasticizer, 0.1~1 part of antioxidant, ultraviolet absorber 0.5~
1.5 parts uniform in high-speed mixer and mixing, carries out extruding pelletization, and polyethylene pellet is made；By 20~100 parts of polyamide,
0.1~1 part of antioxidant is uniform in high-speed mixer and mixing, carries out extruding pelletization, and polyamide pellet is made；
Step (2)：The polyethylene pellet made, the EMA resins of 1~50 mass parts, the polyamide pellet made are put into more
In layer co-extrusion extruder, through curtain coating, cooling, traction, winding, substrate layer is made；
Step (3)：The substrate layer is put into electron irradiation equipment and carries out cross-linking radiation；
Step (4)：Base material layer coiled material after irradiation is put on coating machine, one layer of purple is coated on the cross-linking radiation face of substrate layer
Outer Photocurable pressure-sensitive adhesive layer, through hot drying tunnel, the multi-layered bonded protective film of the present invention is made in winding.
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| CN201611177948.XA CN108611016A (en) | 2016-12-19 | 2016-12-19 | Multi-layered bonded protective film and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114407463A (en) * | 2021-12-22 | 2022-04-29 | 北京工商大学 | Anti-ultraviolet multilayer protective film for pipeline repair by in-situ curing method for trenchless repair and preparation method thereof |
| WO2023179492A1 (en) * | 2022-03-25 | 2023-09-28 | 上海海优威新材料股份有限公司 | Adhesive film for photovoltaic assembly and preparation method therefor, adhesive film, and complex |
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| CN114407463B (en) * | 2021-12-22 | 2023-04-11 | 北京工商大学 | Anti-ultraviolet multilayer protective film for pipeline repair by in-situ curing method for trenchless repair and preparation method thereof |
| WO2023179492A1 (en) * | 2022-03-25 | 2023-09-28 | 上海海优威新材料股份有限公司 | Adhesive film for photovoltaic assembly and preparation method therefor, adhesive film, and complex |
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