CN108031981A - Laser etching method and device for forming curved surface structure - Google Patents
Laser etching method and device for forming curved surface structure Download PDFInfo
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- CN108031981A CN108031981A CN201711369382.5A CN201711369382A CN108031981A CN 108031981 A CN108031981 A CN 108031981A CN 201711369382 A CN201711369382 A CN 201711369382A CN 108031981 A CN108031981 A CN 108031981A
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- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000010329 laser etching Methods 0.000 title claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 70
- 210000000746 body region Anatomy 0.000 claims abstract description 42
- 238000005530 etching Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000007789 gas Substances 0.000 claims description 23
- 238000007493 shaping process Methods 0.000 claims description 17
- 239000001301 oxygen Substances 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 238000005259 measurement Methods 0.000 claims description 9
- 229910052756 noble gas Inorganic materials 0.000 claims description 9
- 238000000608 laser ablation Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 230000003628 erosive effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 11
- 238000003754 machining Methods 0.000 description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 9
- 229910052786 argon Inorganic materials 0.000 description 5
- 238000001459 lithography Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010892 electric spark Methods 0.000 description 2
- 238000004663 powder metallurgy Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D5/00—Control of dimensions of material
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D5/00—Control of dimensions of material
- G05D5/02—Control of dimensions of material of thickness, e.g. of rolled material
- G05D5/03—Control of dimensions of material of thickness, e.g. of rolled material characterised by the use of electric means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention belongs to the technical field of laser processing, and particularly relates to a laser etching method and device for forming a curved surface structure. Firstly, dividing materials to be removed into a main body area and a shell area, and selecting characteristic points in the main body area and the shell area; then, etching the main body region by adopting a gradient layered etching method according to the three-dimensional structure characteristics of the curved surface to be processed; when the positions of the characteristic points are etched, measuring the coordinates of the characteristic points, finishing the processing of the main body area when the errors between the measured coordinates of all the characteristic points in the main body area and the theoretical coordinates are within a set range, and entering the processing of the shell area; finally, etching the shell area by adopting a fine three-dimensional scanning method according to the three-dimensional structure characteristics of the curved surface to be processed; and when the positions of the characteristic points are etched, measuring the coordinates of the characteristic points, and finishing the processing of the shell area when the average value of the difference values of the measured coordinates and the theoretical coordinates of all the characteristic points is less than a set value. The precision is ensured and the efficiency is improved in the forming process of the curved surface structure.
Description
Technical field
It is more particularly to a kind of to realize that hard brittle material is three-dimensional bent using ultrafast laser the invention belongs to technical field of laser processing
The Efficient Process Technology method and device of face fine structure shaping.
Background technology
The processing of three-dimension curved surface fine structure is the neck such as single crystal blade micro-structure, special type knife, semiconductor devices, high-end watch
The key technology in domain, and as the personalized designs of electronic consumer products, the processing of hard brittle material three-dimensional fine structure need
Asking to sharply increase.Current hard brittle material curved-surface structure part forming relies primarily on the skills such as powder metallurgy, electric spark, numerically-controlled machine tool
Art means are completed.But the method for powder metallurgy needs to mold and the cycle is grown, electric spark can only process metal material and processing effect
Rate is not high, and digital control laser processing hard brittle material cutter consume is serious and the cutter material such as CBN can not be processed substantially.
Coordinating light beam using ultrafast laser, successively scanning machining can process fine three-dimensional structure, but be layered process
The more few then precision of the middle number of plies is poorer, or even can bring obvious " step ", but the number of plies then causes efficiency too low too much, in addition swashs
When light is with material effects, inevitably there are certain oxidative phenomena, so the processing for three-dimensional fine structure, ensures to add
It is the key issue for needing to solve that processing efficiency is improved on the premise of working medium amount.
The content of the invention
The object of the present invention is to provide a kind of laser etching method and device for curved-surface structure shaping, in etching process
In can take into account processing efficiency and machining accuracy.
The technical solution of the present invention is to provide a kind of laser etching method for curved-surface structure shaping, including following
Step：
Step 1：Material need to be removed and be divided into body region and housing area, in body region and housing area selected characteristic point；
Step 2：According to the Three Dimensions Structure of curved surface to be processed, lithographic method is layered to body region using gradient type
Perform etching；
Step 3：When being etched to characteristic point position, the coordinate of characteristic point is measured, when the measurement of all characteristic points in body region is sat
When the error of mark and theoretical coordinate is in setting range, terminate the processing of body region, processed into housing area；
Step 4：According to the Three Dimensions Structure of curved surface to be processed, subtle three-dimensional scan method is used (to ensure precision
And the low-power that uses, small light spot, the small depth amount of feeding are processed) processing is performed etching to housing area；
Step 5：When being etched to characteristic point position, the coordinate of characteristic point is measured, when the measuring coordinate and reason of all characteristic points
When being less than setting value by the average value of coordinate difference, terminate the processing in housing area.
Preferably, in order to improve processing efficiency, oxygen is blowed in the etching process of step 2.
Preferably, finished surface aoxidizes in order to prevent, and noble gas is blowed in the etching process of step 4.
Preferably, according to the complexity of main body plot structure, body region can be divided into multilayer in step 2, layering
Thickness is gradually reduced from top to bottom or each layer thickness is equal, is successively scanned etching from top to bottom.
Preferably, step 2 further includes the step of body region is divided into some main body list areas, each will use ladder in single area
Degree formula layering lithographic method performs etching body region.
Preferably, filled in step 2 in each layer of etching process using " returning " font.
Preferably, it using the curved surface finally shaped is the sheet entity of bottom surface and thickness as 0.03-0.1mm that above-mentioned housing area, which is,
Region.
The present invention also provides a kind of laser ablation device for curved-surface structure shaping, it is characterized in that：Including fortune
Dynamic system, laser scanning system, range-measurement system and data processing and control system；
Above-mentioned kinematic system includes being used for the three-dimensional mobile platform for fixing workpiece to be processed；
Above-mentioned laser scanning system includes laser, 3-D scanning module and the telecentricity field set gradually along laser optical path
Mirror；Above-mentioned laser is used to launch laser, and above-mentioned 3-D scanning module and telecentricity field lens are used to be processed according to workpiece to be processed bent
Laser is focused on workpiece to be processed surface by the Three Dimensions Structure in face；
Above-mentioned range-measurement system includes laser range finder, and above-mentioned laser range finder is used for the coordinate for measuring selected characteristic point,
And the coordinate data of measurement is fed back into data processing and control system；
Above-mentioned data processing and control system are used for the three-dimensional structure for storing workpiece to be processed processing curve, and and laser
Device, 3-D scanning module and laser range finder connection, control laser, 3-D scanning module and laser range finder work and progress
Data processing.
Preferably, which further includes gas shield system, and above-mentioned gas guard system includes noble gas source, source of oxygen, gas
Body converter and the nozzle being coaxially disposed with 3-D scanning module, above-mentioned gas converter include three ports, noble gas source and oxygen
The port of source of the gas is connected by gas converter and appendix with nozzle, another port of gas converter and data processing and
Control system connects.
Preferably, above-mentioned 3-D scanning module is scanlab three-dimensional galvanometers, and above-mentioned data processing and control system include work
Control machine.
The beneficial effects of the invention are as follows：
The present invention devises the operation break-down of feature based spot size extraction, subregion, the processing method of layering, in curved-surface structure
It ensure that precision in forming process and improve efficiency, surface precision error ensures within 0.1mm, curved surface roughness≤
Ra1.6um, efficiency improve nearly 50% than current process.
Brief description of the drawings
Fig. 1 is the laser ablation device structure diagram for curved-surface structure shaping；
Fig. 2 a are Three-dimension process regional compartmentalization schematic diagram one；
Fig. 2 b are Three-dimension process regional compartmentalization schematic diagram two；
Fig. 3 a are body region processing layering and scanning schematic diagram；
Fig. 3 b process every layer of scanning schematic diagram for body region；
Fig. 4 chooses schematic diagram for body region bottom surface characteristic point；
Fig. 5 a are housing area cross machine scan mode schematic diagram；
Fig. 5 b process longitudinal scanning schematic diagram for housing area；
Fig. 6 processes bottom surface characteristic point for housing area and chooses schematic diagram；
Fig. 7 is embodiment air discharge duct three-dimensional structure；
Fig. 8 a need to remove material three-dimensional structure for air discharge duct body region；
Fig. 8 b need to remove material three-dimensional structure for exhaust slot shell area；
Fig. 9 chooses schematic diagram for exhaust groove processing body region characteristic point；
Figure 10 chooses schematic diagram for exhaust groove processing housing area characteristic point；
Figure 11 a are air discharge duct processing entity design sketch one；
Figure 11 b are air discharge duct processing entity design sketch two；
Reference numeral is in figure：1- industrial personal computers, 2- lasers, 3- light beams, 5- laser range finders, 6- three-dimensional mobile platforms,
7- workpieces to be processed, 8-X axis, 9-Y axis, 10- machining areas, 11- focus on light beam, 12- nozzles, 13- telecentricity field lenses, 14- are three-dimensional
Scan module, 15- appendixs, 16- gas converters, 17- oxygen cylinders, 18- argon bottles, 19- housings area bottom curved surface, 20- shells
Body area, 21- body regions.
Embodiment
Below in conjunction with drawings and the specific embodiments, the present invention will be further described.
The present invention provides a kind of laser etching method for curved-surface structure shaping, can specifically be realized by following steps：
(1) material need to be removed to be divided into body region and housing area and be divided into two stage process, according to song to be processed
Face Three Dimensions Structure, selectes 5-8 characteristic point on curved surface.
(2) body region mainly uses gradient type to be layered lithography mode to improve processing efficiency, and in process
It is middle that efficiency is improved using comburant oxygen, each characteristic point is added respectively according to work flow laser range finder during lithography
Chinese musical scale cun measures, so that ensure the timely control of process mesoprosopy precision, and the control of final type face precision, when
When all characteristic points machine and precision is in certain scope, it is determined as three-dimensional structure body region and machines and precision
Qualification, into housing manufacturing procedure.
(3) corresponding with body region layering processing is that housing area uses subtle three-dimensional scanning to improve surface precision
And machined surface quality, i.e., using smaller power.Compared with small light spot.The smaller amount of feeding carries out high accuracy three-dimensional scanning to eliminate point
" step " problem for occurring in layer highly-efficient processing, while average using the collection of 5-10 characteristic point data and judge that curved surface adds
Work precision it is whether up to standard and processing start and stop.
To realize the above method, following system is devised, it will be seen from figure 1 that the system mainly includes kinematic system, number
According to processing and control system, optical beam scanning system, gas shield system and range-measurement system.
Kinematic system includes three-dimensional mobile platform 6, and workpiece to be processed 7 is fixed in three-dimensional mobile platform 6, by adjusting three
Dimension mobile platform 6 can adjust workpiece to be processed 7 and be moved along XYZ directions.
Optical beam scanning system include along laser optical path set laser 2,3-D scanning module 14 and telecentricity field lens 13, three
The laser that scan module 14 adjusts laser 2 is tieed up, workpiece to be processed 7 is scanned according to the curved surface Three Dimensions Structure to be shaped, far
Psychological field mirror 13 focuses on laser beam 3.
Gas shield system includes source of oxygen, noble gas source and nozzle coaxial mounted with 3-D scanning module 12, herein, oxygen
Source of the gas and noble gas source use oxygen cylinder 17 and argon bottle 18, and oxygen cylinder 17 and argon bottle 18 pass through gas converter 16 and appendix
15 are connected with nozzle 12, and gas converter 16 includes three ports, and the port of noble gas source and source of oxygen passes through gas converter 16
And appendix 15 is connected with nozzle 12, another port of gas converter 16 is connected with data processing and control system.
Range-measurement system includes laser range finder 5, for measuring the three-dimensional coordinate of characteristic point.
Data processing and control system be used for the three-dimensional structure for storing workpiece to be processed processing curve and respectively with laser
2nd, the 3-D scanning module 14 and connection control of laser range finder 5 laser 2,3-D scanning module 14 and laser range finder 5 work
And carry out data processing..
The processing of three-dimension curved surface structure is realized using the system：
First, as shown in Fig. 2 a and Fig. 2 b, data processing and control system are transfused to the threedimensional model number to be shaped
According to, then by needed on workpiece to be processed 7 remove machining area 10 be divided into body region 21 and housing area 20, its middle casing area 20
To be the sheet entity area of bottom surface and thickness as 0.03-0.1mm using the curved surface 19 finally shaped.If 21 structure of body region is answered
It is miscellaneous, then according to the corresponding curved surface face type situation in 21 bottom of body region, obtained body region 21 is subjected to further division and is obtained
Some main body list areas, each single other places of distinguishing are managed, and all single areas are subordinated to same housing area 20.
By each Rotating fields characteristic storage of three-dimension curved surface to data processing and control system after subregion.
Data processing and control system are according to each Rotating fields character control ultrafast laser 2 of three-dimension curved surface, 3-D scanning mould
Block 14 and telecentricity field lens 13 work, and are equipped with paraxonic laser range finder 5, with high power, high speed, large spot (adjustment defocusing amount),
The mode of the big depth amount of feeding carries out each main body list area layering filling lithography, while uses comburant oxygen, air pressure
0.1-0.3MPa。
As shown in figs. 3 a and 3b, carried out in process by the way of successively scanning from top to bottom, the thickness of layering from
Top to bottm is gradually reduced, and ensures to use low-power, small light spot, the small depth amount of feeding to be processed to close to during housing area 20.
" returning " font is used to fill in each layer of scanning process, in each layer of process, the filling guarantee of " returning " font is outer close interior thin,
Density degree optimizes adjustment, and the scanning direction in different paths and sweep speed according to spot size and size of finished face
It is also required to be adjusted according to technological requirement.
As shown in figure 4, data processing and control system set several in body region 21 (or each main body list area) bottom
Characteristic point (general features point value is arranged to 5-8), makes afterwards to a certain extent according to the good technique of initial workpiece processing and debugging in processing
These feature spot sizes are detected with laser range finder 5, the average value of each characteristic point difference is normal model less than 10um
Enclose, stop processing body region 21 (or the main body list area) after last characteristic point machines, it is believed that all characteristic points
Think that the processing request of 21 bottom curved surface of body region is completed when position is in the error range of setting.
21 bottom curved surface features point detection prediction surface machining accuracy method of body region is as follows：
1), as shown in figure 4, the theoretical Z coordinate of C1, C2, C3, C4, C5 point work in-process is respectively m1, m2, m3, m4, m5,
And m1 ＞ m2 ＞ m3 ＞ m4 ＞ m5.It is m1 to extract C1 points position Z-direction coordinate, and the actual bit of C1 points is measured using laser range finder 5
C1' is put in Z-direction coordinate m1', when | during m1-m1'|≤10 μm, it is believed that surface machining accuracy of the curved surface more than C1' points is qualified.
2) it is m2, to extract C2 point Z-direction theoretical coordinate values, and measure actual C2' positions using laser range finder 5 sits in Z-direction
M2' is marked, when | during m1-m1'|≤10 μm, it is believed that surface machining accuracy of the curved surface more than C2' points is qualified.
3), the processing mode of C3, C4, C5 and C1 and C2 point processing methods are consistent.When C5 points after treatment stops
Processing, then it is assumed that 21 bottom surface machining accuracy of body region is qualified.
After body region 21 machines, using 3-D scanning module 14, can quickly it be changed in three dimensions using its focus
Characteristic the alternating 3-D scanning of the longitudinal direction (e to) shown in transverse direction (d to) and Fig. 5 b as shown in Figure 5 a is carried out to housing area 20,
Successively to remove housing area material, and obtain final required face type.Protected at the same time using inert gases such as argon gas (or nitrogen)
Shield, prevents surface oxidation, air pressure 0.1-0.3MPa.
During processing housing area 20, as shown in fig. 6, set in 20 bottom of housing area several characteristic points F1, F2,
F3, F4, F5, F6, it is respectively n1, n2, n3, n4, n5, n6 in the theoretical coordinate value of Z-direction.(every layer of processing after 10 layers of processing
3-5um), sat using the corresponding Z-direction of actual point F1', F2', F3', F4', F5', F6' in stadia surveying housing area 20 is actual
Scale value n1', n2', n3', n4', n5', n6'.As Σ | think that surface machining accuracy closes during ni-ni'|/6 ＜ 10 μm (i=1-6)
Lattice, measure again after otherwise continuing 10 layers of processing, until processing qualification then thinks that whole surface machining accuracy is up to standard.
Below using the lithography of curved surface groove as specific embodiment, the present invention is further elaborated.
1st, processing request：
For Fig. 7 to need processing curve groove three-dimensional structure, surface precision requires 20 μm,.
2nd, working position
As shown in Fig. 8 a and Fig. 8 b, curved surface groove to be processed is divided into body region and housing area；
3rd, procedure of processing
(1), processing unit (plant) prepares
Workpiece to be processed is fixed using three-dimensional mobile platform, uses ultraviolet nanosecond laser as light source, it is three-dimensional by scanlab
Laser is focused on workpiece surface and carries out curved surface groove processing by galvanometer and sill telecentricities field lens, beside galvanometer for laser range finder and and
The coaxial nozzle of galvanometer.Laser focal 100-200mm, scanning breadth 150mm are adjusted according to the theoretical parameter of curved surface groove to be processed
×150mm。
(2), body region 21 processes
As shown in figure 9, the maximum gauge that body region needs to process is 2.5mm, body region is divided into 100 layers, every layer
0.025mm；5 points, C1 (the 20th layer), C2 (the 40th layer), C3 (the 60th layer), C4 the (the 80th are selected on the boundary surface of body region
Layer), C5 (the 100th layer).Start successively rectangular-ambulatory-plane to scan, sweep speed 500-1500mm/s, Laser Negative defocus 2mm, coaxially
Blow oxygen, air pressure 0.1-0.3MPa.
Verify C1 points height when being worked into 18-21 layers, 39-41 layer when verifies C2 points highly, and 60-63 layers of when verifies
C3 points height, verifies C4 points height at 80-85 layer, and verification C5 points highly, are tied when being worked into 110 layers at 95-100 layer
Beam, C5 point tolerances value are 0.08mm.
(3), housing area processes
As shown in Figure 10, housing area thickness is 0.5mm, shell area is divided into 50 layers, every layer of 0.01mm, at housing area bottom
Portion's curved surface looks for 6 characteristic points (F1, F2, F3, F4, F5, F6).Start successively three-dimensional curve to scan, sweep speed 500-
1500mm/s, Laser Negative defocus 2mm, coaxially blows argon gas, air pressure 0.1-0.3MPa.5 are verified when scanning is to 45 layers
The average value of the height of a characteristic point, its height and theoretical level difference is 0.015mm；2 layers are continued to scan on, its height and theory are high
The average value of degree difference is 0.009mm, stops scanning.
Figure 11 a and Figure 11 b show the sterogram of processing curve groove, through examining its surface precision to reach 10-20 μm, song
Surface roughness is Ra3.2um.
Claims (10)
1. a kind of laser etching method for curved-surface structure shaping, it is characterised in that comprise the following steps：
Step 1：Material need to be removed and be divided into body region and housing area, in body region and housing area selected characteristic point；
Step 2：According to the Three Dimensions Structure of curved surface to be processed, lithographic method is layered using gradient type body region is carried out
Etching；
Step 3：When being etched to characteristic point position, measure the coordinate of characteristic point, when all characteristic points in body region measuring coordinate with
When the error of theoretical coordinate is in setting range, terminate the processing of body region, processed into housing area；
Step 4：According to the Three Dimensions Structure of curved surface to be processed, housing area is carved using subtle three-dimensional scan method
Erosion processing；
Step 5：When being etched to characteristic point position, the coordinate of characteristic point is measured, when the measuring coordinate of all characteristic points is sat with theoretical
When the average value of mark difference is less than setting value, terminate the processing in housing area.
2. the laser etching method according to claim 1 for curved-surface structure shaping, it is characterised in that：In step 2
Oxygen is blowed in etching process.
3. the laser etching method according to claim 1 or 2 for curved-surface structure shaping, it is characterised in that：In step
Noble gas is blowed in four etching process.
4. the laser etching method according to claim 3 for curved-surface structure shaping, it is characterised in that：Step 2 is specific
For body region is divided into multilayer, the thickness of layering is gradually reduced from top to bottom or each layer thickness is equal, from top to bottom successively into
Row scanning etching.
5. the laser etching method according to claim 4 for curved-surface structure shaping, it is characterised in that：Step 2 is also wrapped
Include the step of body region is divided into some main body list areas, will each single area using gradient type layering lithographic method to body region into
Row etching.
6. the laser etching method according to claim 5 for curved-surface structure shaping, it is characterised in that：In step 2
Filled in each layer of etching process using " returning " font.
7. the laser etching method according to claim 6 for curved-surface structure shaping, it is characterised in that：The housing area
To be the sheet entity area of bottom surface and thickness as 0.03-0.1mm using the curved surface finally shaped.
A kind of 8. laser ablation device for curved-surface structure shaping, it is characterised in that：Including kinematic system, laser scanning system
System, range-measurement system and data processing and control system；
The kinematic system includes being used for the three-dimensional mobile platform (6) for fixing workpiece to be processed (7)；
The laser scanning system includes laser (2), 3-D scanning module (14) and the telecentricity set gradually along laser optical path
Field lens (13)；The laser (2) is used to launch laser, and the 3-D scanning module (14) and telecentricity field lens (13) are used for basis
Laser is focused on workpiece to be processed (7) surface by the Three Dimensions Structure of workpiece to be processed (7) processing curve；
The range-measurement system includes laser range finder (5), and the laser range finder (5) is used for the seat for measuring selected characteristic point
Mark, and the coordinate data of measurement is fed back into data processing and control system；
The data processing and control system are used for the three-dimensional structure for storing workpiece to be processed processing curve, and with laser (2),
3-D scanning module (14) and laser range finder (5) connection, control laser (2), 3-D scanning module (14) and laser ranging
Instrument (5) works and carries out data processing.
9. the laser ablation device according to claim 8 for curved-surface structure shaping, it is characterised in that：Further include gas
Guard system, the gas shield system include noble gas source, source of oxygen, gas converter (16) and with 3-D scanning module (14)
The nozzle (12) being coaxially disposed, the gas converter (16) include three ports, and the port of noble gas source and source of oxygen passes through gas
Body converter (16) and appendix (15) are connected with nozzle (12), another port of gas converter (16) and data processing and
Control system connects.
10. the laser ablation device according to claim 9 for curved-surface structure shaping, it is characterised in that：The three-dimensional
Scan module (14) is scanlab three-dimensional galvanometers, and the data processing and control system include industrial personal computer (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711369382.5A CN108031981A (en) | 2017-12-18 | 2017-12-18 | Laser etching method and device for forming curved surface structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711369382.5A CN108031981A (en) | 2017-12-18 | 2017-12-18 | Laser etching method and device for forming curved surface structure |
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| Publication Number | Publication Date |
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| CN108031981A true CN108031981A (en) | 2018-05-15 |
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ID=62099670
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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