CN107094361B - A kind of flat-plate minitype loop circuit heat pipe of upper cover plate setting chamber - Google Patents
A kind of flat-plate minitype loop circuit heat pipe of upper cover plate setting chamber Download PDFInfo
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- CN107094361B CN107094361B CN201710081973.6A CN201710081973A CN107094361B CN 107094361 B CN107094361 B CN 107094361B CN 201710081973 A CN201710081973 A CN 201710081973A CN 107094361 B CN107094361 B CN 107094361B
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- porous media
- upper cover
- cover plate
- cavity
- mainboard
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of flat-plate minitype loop circuit heat pipes, including mainboard and upper cover plate, the upper cover plate is packaged together with mainboard, the mainboard includes vaporization chamber, condensation chamber, jet chimney and fluid pipeline are connected between vaporization chamber and condensation chamber, and porous media thin slice is set in the vaporization chamber, cavity is set on upper cover plate, the cavity is connected to jet chimney, and the position opposite in porous media thin slice is arranged in the cavity.The present invention on upper cover plate by being arranged cavity, the steam evaporated convenient for working solution heat in capillary wick porous media quickly overflows, and avoids steam from being trapped at capillary wick, to block entire porous media structure, cause capillary wick to be evaporated, entire miniature loop hot-pipe system is made to paralyse.The quick discharge of steam can accelerate the cycle inside whole device simultaneously, improve heat transfer radiating efficiency.
Description
Technical field
The invention belongs to field of heat exchangers more particularly to flat-plate minitype loop circuit heat pipe systems.
Background technology
With the rapid development of microelectronics and information technology, the Highgrade integration and miniaturization of device and circuit become important
Development trend, but integrated level improve caused by chip unit area calorific intensity it is soaring and temperature raising will seriously threaten dress
Set the reliability with equipment.Studies have found that microelectronic chip has the characteristics that surface heat is unevenly distributed, certain parts
Heat flow rate per unit area even up to 1000w/cm2 at hot spot, is considered as causing chip failure or even the key reason of damage.
For this purpose, exploitation, which cool down directly to chip and improves the micro cooler of its whole uniform temperature, has become the research of thermal control in recent years pass
The hot spot of note.
Miniature loop circuit heat pipe is exactly a kind of important micro cooler developed in recent years in order to adapt to this needs.Make
For gas-liquid two-phase phase-change heat-exchange device, micro heat pipe has compact structure and can carry out larger heat in smaller temperature gradient
The characteristics of amount transmission.
The minitype flat plate hot pipe of currently available technology, after capillary wick porous media is arranged in evaporation ends, porous Jie of capillary wick
The steam that working solution heat is evaporated in matter quickly overflows, and a large amount of steam are trapped at capillary wick, to block entire porous media
Structure causes capillary wick to be evaporated, and entire miniature loop hot-pipe system is made to paralyse.
Invention content
The present invention is intended to provide a kind of efficient and small structure flat-plate minitype loop circuit heat pipe system, is improved to minicore
The heat-sinking capability of piece.
To achieve the goals above, technical scheme is as follows：A kind of flat-plate minitype loop circuit heat pipe, including mainboard
And upper cover plate, the upper cover plate are packaged together with mainboard, the mainboard includes vaporization chamber, condensation chamber, vaporization chamber and condensation chamber
Between connection jet chimney and fluid pipeline, porous media thin slice is set in the vaporization chamber, cavity is set on upper cover plate, it is described
Cavity is connected to jet chimney, and the cavity is arranged in the position opposite with porous media thin slice.
Preferably, sheet thickness is identical as mainboard vaporization chamber conduit thickness, porous media thin slice upper surface is no more than
Mainboard upper surface.
Preferably, connecting capillary hydraulic piping between fluid pipeline and vaporization chamber.
Preferably, the porosity of the porous media thin slice is K, the thickness of porous media is H1, the cavity
Thickness is H2, then meets following condition：H2=a*Ln (K*H1)-b, wherein 200<a<210,760<b<770；
140μm<H2<240μm；80μm<K*H1<130μm.
Preferably, 60%<K<80%, 100 μm<H1<200μm.
Preferably, H1=c*H2,0.7<c<0.8.
Preferably, jet chimney width is 2-5 times of fluid pipeline width.
Preferably, jet chimney width is 3 times of fluid pipeline width.
Preferably, further including compensating liquid room, the compensating liquid room is connected to vaporization chamber and fluid pipeline joint.
Compared with prior art, the present invention has the advantage that：
1) by the way that cavity is arranged on upper cover plate, the steam evaporated convenient for working solution heat in capillary wick porous media is quick
It overflows, avoids steam from being trapped at capillary wick, to block entire porous media structure, capillary wick is caused to be evaporated, make entire micro-
Type ring road hot-pipe system paralyses.The quick discharge of steam can accelerate the cycle inside whole device simultaneously, improve heat transfer
Radiating efficiency.
2) by setting heat insulation path, gas-liquid is separated into transmission, the heat transfer phenomenon avoided in vapour-liquid flow process occurs,
To influence the transmission of gas and liquid, flow resistance is reduced, avoids the obstruction in channel, increases hot-fluid transmission range.
3) loop heat pipe structure is minimized, microchip surface can be directly attached to, heat is directly taken away, radiated
It is efficient.
4) capillary wick uses Ni-based porous media structure, is capable of providing larger capillary force, is able to maintain that whole device
Fast turn-around, and take away a large amount of heat using the latent heat of working solution.
5) present invention obtains an optimal plate miniature loop circuit heat pipe optimum results, and lead to by test of many times
Overtesting is verified, to demonstrate the accuracy of result.
Description of the drawings
Fig. 1 is the schematic diagram of the plate miniature loop circuit heat pipe mainboard of the present invention；
Fig. 2 is the plate miniature loop circuit heat pipe cover plate schematic diagram of the present invention；
Fig. 3 is the plate miniature loop circuit heat pipe vaporization chamber Section A-A schematic diagram of the present invention；
Fig. 4 is the plate miniature loop heat pipe air liquid pipe road C-C schematic cross-sections of the present invention；
Fig. 5 is the plate miniature loop circuit heat pipe section B-B schematic diagram of the present invention；
Fig. 6 is the plate miniature loop circuit heat pipe porous media capillary wick schematic diagram of the present invention；
Fig. 7 is the plate miniature loop circuit heat pipe schematic three dimensional views of the present invention.
Reference numeral is as follows：
Reference numeral is as follows：1 mainboard, 2 vaporization chambers, 3 compensating liquid rooms, 4 fluid injection exhaust holes, 5 heat-insulated through-holes, 6 liquid
Pipeline, 7 jet chimneys, 8 condensation chambers, 9 upper cover plate shallow cavity positions, 10 upper cover plates, 11 sheet type porous media capillary wicks
Specific implementation mode
The specific implementation mode of the present invention is described in detail below in conjunction with the accompanying drawings.
A kind of flat-plate minitype loop circuit heat pipe, including mainboard 1 and upper cover plate 10, the upper cover plate 10 are encapsulated in mainboard 1
Together, the mainboard 1 includes vaporization chamber 2, condensation chamber 8, and jet chimney 7 and fluid pipeline are connected between vaporization chamber 2 and condensation chamber 8
6, it is separated by heat-insulated through-hole 5 between the jet chimney 7 and fluid pipeline 6.
The loop circuit heat pipe of the present invention, jet chimney 7 and fluid pipeline 6 is provided entirely on one piece of mainboard 1 so that structure
Miniaturization, can be directly attached to microchip surface, heat is directly taken away, and radiating efficiency is high, can be widely applied to electricity
The heat dissipation of the micro-elements such as sub- chip.
Gas-liquid is separated transmission, can heat be effectively gathered in evaporator by the present invention by the way that heat-insulated through-hole 5 is arranged
Place radiates to which heat is efficiently transferred to condensation chamber by air-liquid pipeline.It avoids heat diffusion to fluid pipeline, makes
Liquid evaporation in fluid pipeline forms bubble, to hinder the smooth operation entirely recycled, to can not achieve liquid phase point
Open this initial principle.
Preferably, the heat-insulated through-hole 5 is the channel slot being arranged on mainboard 1.
Preferably, the channel slot runs through entire mainboard 1 in a thickness direction.I.e. as shown in Figure 4.By in mainboard
Entire mainboard is penetrated through on thickness, can thoroughly to separate between jet chimney 7 and fluid pipeline 6, be further increased steam
Heat-proof quality between pipeline 7 and fluid pipeline 6.
Preferably, channel slot corresponding with 1 upper channel slot of mainboard is arranged on the upper cover plate 10.
Preferably, heat-insulating material is arranged in heat-insulated through-hole 5, further hinder heat in jet chimney 7 and liquid line
It is transmitted between road 6.
Preferably, the width of heat-insulated through-hole 5 is 0.5mm.
Preferably, the vaporization chamber 2 is located at the side of the jet chimney of heat-insulated through-hole 5.By so set, can protect
It is directly entered jet chimney after demonstrate,proving the evaporation of steam, ensure that the conveying of gas, flow resistance is reduced, avoids the obstruction in channel,
Increase hot-fluid transmission range.
Preferably, setting porous media thin slice 11 in the vaporization chamber 2, thin slice 11 is installed to by interference fit micro-
At the vaporization chamber 2 of type loop circuit heat pipe mainboard 1.
Preferably, 11 thickness of thin slice is identical as 2 conduit thickness of mainboard vaporization chamber, 11 upper surface of porous media thin slice cannot
More than 1 upper surface of mainboard.By so set, avoid generating gap due to upper cover plate and mainboard cannot combine closely, making entire
Failure of apparatus.
The porous media thin slice 11 generates capillary force by porous media capillary wick.
Vaporization chamber 2 absorbs the heat of microchip, and heated porous medium capillary wick position makes surface working solution evaporate, steam
The condensation chamber for entering miniature loop circuit heat pipe by jet chimney carries out heat release and liquefies to be working solution, in condensation chamber in condensation chamber
The evaporator that working solution after the completion of heat release is recycled into miniature loop circuit heat pipe by fluid pipeline again carries out heating evaporation, to
Complete a cycle.Whole device provides a part of power by the capillary force that porous media structure capillary wick generates, and reaches cycle.
Capillary wick be arranged in evaporator, evaporator not only connects with jet chimney but also connects with fluid pipeline, fluid pipeline, capillary wick with
And compensating liquid room is connected by a small chamber, specifically sees Fig. 1.
Connecting pipe between fluid pipeline 6 and vaporization chamber 2, as shown in Figure 1, the pipeline also has capillary force, by steam
Liquid in pipeline 7 is drawn onto in vaporization chamber 2.By the capillary force of porous media thin slice capillary wick by liquid edge in the vaporization chamber 2
It porous media sheet length direction (i.e. the upper and lower directions of Fig. 1) and liquid is drawn onto to the different location of vaporization chamber 2, then enter back into
Jet chimney 7, to form a cycle.
It finds under study for action, along the upper and lower directions of vaporization chamber 2, the fluid distrbution in jet chimney is uneven, wherein under
Part cloth fluid is more, and top is distributed less fluid, therefore causes Local Heat Transfer uneven, while causing different location jet chimney 7
Fluid distrbution it is uneven and temperature distribution is non-uniform, to cause local temperature excessively high or too low, be easy to cause heat pipe
Damage.For above-mentioned situation, the present invention is improved, and reaches even fluid distribution, uniformity of temperature profile.
Along the direction (i.e. the lower part of Fig. 1 to top) of porous media capillary wick capillary force, different location it is described porous
The capillary force of medium capillary wick gradually increases.It is gradually increased by the capillary force along lower part to top, capillary wick so that top
Quickly liquid can be sucted, increase the quantity of the fluid on top, to enter the steam pipe on top after top is evaporated
Road 7, to reach even fluid distribution, the purpose of uniformity of temperature profile.It is found through experiments that, above-mentioned setting achieves very well
Technique effect.
Further preferably, along the direction of porous media capillary wick capillary force, width that the capillary force of capillary wick gradually increases
It spends increasing.It is found through experiments that, above-mentioned setting can preferably reach the mesh of even fluid distribution, uniformity of temperature profile
's.
Preferably, can porous media capillary wick be divided into polylith along upper and lower directions, every piece of capillary force is different,
In along porous media capillary wick capillary force direction (i.e. the lower part of Fig. 1 to top), the capillary force of different masses gradually increases.Into
One step is preferred, and the amplitude of the capillary force enhancing of different masses is increasing.
But if the capillary force of top capillary wick is excessive, and lower flow flow can be caused too small, it is new to cause
It is uneven, therefore the present invention obtains the relationship of the capillary force of best capillary wick through a large number of experiments.
Preferably, the length (i.e. Fig. 1 upper and lower directionss) of porous media thin slice 11 is LAlways, most upper in porous media thin slice 11
The capillary force of side is FOn, then the capillary force distribution of porous media thin slice 11 is as follows：F=FOn*(L/LAlways)a, wherein a is coefficient,
1.24<a<1.33.L is 11 the lowermost distance of positional distance porous media thin slice in porous media thin slice 11.
Above-mentioned relationship is obtained by a large amount of numerical simulation and its experiment, is tested through a large number of experiments
Card.Capillary force distribution is carried out by above-mentioned relationship, fluid distrbution is enabled to reach most uniformly.
Preferably, 1.27<a<1.29.
Preferably, with L/LAlwaysIncrease, a is gradually increased.
Preferably, porous media thin slice 11 is sintered to be formed by punching press using nickel powder as base.
Preferably, the size of Ni-based porous media thin slice 11 is length 5.15mm, width 3.8mm, thickness is 150 μ
M, the length is along the direction perpendicular to jet chimney 7 and fluid pipeline.
Preferably, cavity 9 is arranged on upper cover plate 10, the position opposite in porous media thin slice 11 is arranged in the cavity 9,
The cavity 10 is connected to jet chimney 7.
It manufactures the steam that the purpose of this cavity is evaporated for ease of working solution heat in capillary wick porous media quickly to overflow, keep away
Non-evaporating vapour is trapped at capillary wick, to block entire porous media structure, capillary wick is caused to be evaporated, and makes entire miniature loop heat
Guard system paralyses.The quick discharge of steam can accelerate the cycle inside whole device simultaneously, improve heat transfer radiating efficiency.
Preferably, capillary wick is not connected to directly with jet chimney, connected by cavity 9 between capillary wick and jet chimney
It is logical.Mainly there is following reason：Working solution can generally be walked to enter in upper cover plate shallow cavity upwards by thermal evaporation, steam in capillary wick,
It is entered back into jet chimney by shallow cavity, the resistance that this mode steam receives is smaller, is conducive to improve efficiency.It is directly connected to not
The efficiency of whole device can be improved, and the flowing of capillary wick internal liquid can be interfered.
It is found by experiment and numerical analysis, cavity is compared with vaporization chamber, cannot be excessive, excessive to lead to a large amount of steam meeting
It accumulates in cavity, condensation chamber can not be transmitted in time and exchanged heat, same cavity is compared with vaporization chamber, cannot be too small, too small
Steam is also resulted in be trapped at capillary wick, to block entire porous media structure, therefore by a large amount of numerical analysis and
It is largely tested, and the optimum size relationship for coming cavity 10 and vaporization chamber is summed up.
Preferably, the porosity of the porous media thin slice 11 is K, the thickness of porous media thin slice 11 is H1, institute
The depth for stating cavity 10 is H2, then meets following condition：H2=a*Ln (K*H1)-b, wherein 200<a<210,760<b<770；
140μm<H2<240μm；80μm<K*H1<130μm.
Preferably, 60%<K<80%, 100 μm<H1<200μm.
Preferably, H1=c*H2,0.7<c<0.8.
Preferably, the loop circuit heat pipe further includes compensating liquid room 3, the compensating liquid room 3 and vaporization chamber 2 and liquid
6 joint of pipeline is connected to.Mainly there are following two effects in compensating liquid room：1. we can be real by the aperture of compensating liquid room
Now exhaust and the big crucial step of fluid injection two.2. the working solution for being stored in compensating liquid room can effectively feed in capillary wick because
It overheats and evaporates working solution rapidly, preventing liquid to be evaporated two completely causes capillary wick failure that whole device is made to paralyse.
Size as the preferred Ni-based porous media capillary wick of sheet type as shown in Figure 5 is length 5.15mm, and width is
3.8mm, thickness are 150 μm.Capillary force is larger when wherein Ni-based porosity of porous medium is 60%~80%, device running efficiency
It is higher.
Preferably, 7 width of jet chimney is 400-500 μm, as preferably 450 μm, preferably there are 10.It is preferred that
Jet chimney 7 from each other between be divided into 200 μm, length 43mm, depth is 150 μm.By processing rectangular channel on mainboard
Road, and upper cover plate is engaged to form pipeline with mainboard.
Preferably, 7 width of jet chimney is 2-5 times, preferably 3 times of fluid pipeline width.By increasing steam pipe
The quantity in road is more, it is therefore intended that the pressure drop for reducing steam increases the transmission range of steam, improves the operational efficiency of device.
Preferably, 6 width of fluid pipeline is 150 μm, length 43mm, depth is 150 μm, designs four liquid altogether
Pipeline is divided into 75 μm between intermediate.
By fluid pipeline design it is such it is narrow be because：1. slype can provide prodigious capillary force, by liquid from cold
Evaporation ends are sucked back in solidifying room, become the auxiliary power of whole device, and guiding role is generated to the flowing of liquid.2. narrow is logical
Road can bear the pressure of bigger.
Preferably, it is 8.9mm, the shallow cavity that depth is 150 μm that the size of condensation chamber 8, which is length and width,.The mesh so selected
It is increasing heat radiation area, improves radiating efficiency.Many kinds can also be arranged in the condensation chamber type of cooling, such as air-cooled or water is arranged
Cool equipment, we realize the cooling of condensation chamber used here as electronic semi-conductor's cooling element.
For flat-plate minitype loop circuit heat pipe, ensures that vaporization chamber porous media capillary wick is not evaporated, do not generated
Vapor lock, fluid pipeline by bubble obstruction be the key that maintain whole device trouble-free operation.It is understood that containing in air
There are many non-condensable gas, and when working solution evaporates in flat-plate minitype loop circuit heat pipe, non-condensable gas can be combined production with steam
Raw a large amount of bubble, and then block duct and the block liquid pipeline of porous media capillary wick, to which whole device starts not
Or device is paralysed after starting.So the non-condensable gas of discharge whole device is the premise of whole device operation.
Preferably, fluid injection and gas vent 4 is arranged in compensating liquid room, it is respectively used to fluid injection and exhaust, fluid injection and exhaust
Hole 4 can connect with extraneous fine copper pipe, and control valve is housed on copper pipe, control Liquid Flow to complete exhaust fluid injection.Fluid injection is complete
At it is rear we aperture is sealed, to form the flat-plate minitype loop circuit heat pipe system of a set of sealing.Internal system is followed in taking
Ring.
Of course, it is possible to selection, in order to increase the accuracy of measuring temperature, temperature can be arranged in we at exhaust hole
Air pressure monitoring device is spent, comes the temperature and operating condition of monitoring device, and by the air pressure of gas and temperature calculating apparatus
The volume of gas, and then the exhaust fluid injection of control device.
For plate miniature loop circuit heat pipe, heat is concentrated at vaporization chamber absorbing, passes through two phase transformations of working solution
The latent heat for changing i.e. liquid takes away heat.So ensureing that heat concentration acts on the pass that evaporation ends are also device Effec-tive Function
Key.
Preferably, working solution we there are many selection, main working solution has following several：Water, ammonia, acetone, methanol,
Toluene, freon.Select which kind of working solution mainly related with required operating temperature, different liquids are in different operating temperatures
The advantages of performance, is different, so selection working solution also needs to determine according to actual conditions.
Although the present invention has been disclosed in the preferred embodiments as above, present invention is not limited to this.Any art technology
Personnel can make various changes or modifications, therefore protection scope of the present invention is answered without departing from the spirit and scope of the present invention
When being subject to claim limited range.
Claims (3)
1. a kind of flat-plate minitype loop circuit heat pipe, including mainboard and upper cover plate, the upper cover plate is packaged together with mainboard, described
Mainboard includes vaporization chamber, condensation chamber, and jet chimney and fluid pipeline are connected between vaporization chamber and condensation chamber, is set in the vaporization chamber
Porous media thin slice is set, cavity is set on upper cover plate, the cavity is arranged in the position opposite with porous media thin slice, the sky
Chamber is connected to jet chimney；The porosity of the porous media thin slice is K, and the thickness of porous media thin slice is H1, the sky
The thickness of chamber is H2, then meets following condition：H2=a*Ln (K*H1)-b, wherein 200<a<210,760<b<770；
140μm<H2<240μm；80μm<K*H1<130μm.
2. loop circuit heat pipe as described in claim 1, which is characterized in that 60%<K<80%, 100 μm<H1<200μm.
3. loop circuit heat pipe as described in claim 1, which is characterized in that H1=c*H2,0.7<c<0.8.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810548167.XA CN108709443B (en) | 2017-02-15 | 2017-02-15 | A kind of micro channel flat plate loop circuit heat pipe |
| CN201810549790.7A CN108766950B (en) | 2017-02-15 | 2017-02-15 | Penetrate through the flat panel microchannel loop circuit heat pipe of mainboard channel slot |
| CN201710081973.6A CN107094361B (en) | 2017-02-15 | 2017-02-15 | A kind of flat-plate minitype loop circuit heat pipe of upper cover plate setting chamber |
| CN201810549829.5A CN108695281B (en) | 2017-02-15 | 2017-02-15 | The flat panel microchannel loop circuit heat pipe of fluid line width optimal setting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710081973.6A CN107094361B (en) | 2017-02-15 | 2017-02-15 | A kind of flat-plate minitype loop circuit heat pipe of upper cover plate setting chamber |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810549829.5A Division CN108695281B (en) | 2017-02-15 | 2017-02-15 | The flat panel microchannel loop circuit heat pipe of fluid line width optimal setting |
| CN201810549790.7A Division CN108766950B (en) | 2017-02-15 | 2017-02-15 | Penetrate through the flat panel microchannel loop circuit heat pipe of mainboard channel slot |
| CN201810548167.XA Division CN108709443B (en) | 2017-02-15 | 2017-02-15 | A kind of micro channel flat plate loop circuit heat pipe |
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| Publication Number | Publication Date |
|---|---|
| CN107094361A CN107094361A (en) | 2017-08-25 |
| CN107094361B true CN107094361B (en) | 2018-09-04 |
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| CN201810548167.XA Active CN108709443B (en) | 2017-02-15 | 2017-02-15 | A kind of micro channel flat plate loop circuit heat pipe |
| CN201710081973.6A Active CN107094361B (en) | 2017-02-15 | 2017-02-15 | A kind of flat-plate minitype loop circuit heat pipe of upper cover plate setting chamber |
| CN201810549790.7A Active CN108766950B (en) | 2017-02-15 | 2017-02-15 | Penetrate through the flat panel microchannel loop circuit heat pipe of mainboard channel slot |
| CN201810549829.5A Active CN108695281B (en) | 2017-02-15 | 2017-02-15 | The flat panel microchannel loop circuit heat pipe of fluid line width optimal setting |
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| CN201810549790.7A Active CN108766950B (en) | 2017-02-15 | 2017-02-15 | Penetrate through the flat panel microchannel loop circuit heat pipe of mainboard channel slot |
| CN201810549829.5A Active CN108695281B (en) | 2017-02-15 | 2017-02-15 | The flat panel microchannel loop circuit heat pipe of fluid line width optimal setting |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110470069A (en) * | 2019-08-22 | 2019-11-19 | 上海理工大学 | Porous type microchannel throttling refrigerator |
| CN114518044B (en) * | 2020-11-18 | 2023-11-21 | 山东大学 | Loop heat pipe of silicon-based evaporator |
| CN114791237B (en) * | 2021-01-26 | 2024-05-17 | 山东大学 | Loop heat pipe |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1318114C (en) * | 2003-04-11 | 2007-05-30 | 中国科学院工程热物理研究所 | Evaporator for separated heat tube |
| TWI318679B (en) * | 2007-05-16 | 2009-12-21 | Ind Tech Res Inst | Heat dissipation system with an plate evaporator |
| CN103629963B (en) * | 2013-12-16 | 2015-06-24 | 华北电力大学 | Multi-scale capillary core flat plate loop heat pipe type heat-dissipation device |
| CN204285855U (en) * | 2014-12-09 | 2015-04-22 | 广东工业大学 | Loop heat pipe type photovoltaic and photothermal integral wall |
| CN205228243U (en) * | 2015-11-04 | 2016-05-11 | 天津商业大学 | Flat loop heat pipe |
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- 2017-02-15 CN CN201810548167.XA patent/CN108709443B/en active Active
- 2017-02-15 CN CN201710081973.6A patent/CN107094361B/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108766950A (en) | 2018-11-06 |
| CN107094361A (en) | 2017-08-25 |
| CN108766950B (en) | 2019-04-19 |
| CN108695281A (en) | 2018-10-23 |
| CN108695281B (en) | 2019-04-19 |
| CN108709443B (en) | 2019-04-19 |
| CN108709443A (en) | 2018-10-26 |
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