CN114828546B - Heat radiation module and heat radiation assembly thereof - Google Patents
Heat radiation module and heat radiation assembly thereof Download PDFInfo
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- CN114828546B CN114828546B CN202210182944.XA CN202210182944A CN114828546B CN 114828546 B CN114828546 B CN 114828546B CN 202210182944 A CN202210182944 A CN 202210182944A CN 114828546 B CN114828546 B CN 114828546B
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- 230000005855 radiation Effects 0.000 title abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 64
- 238000001704 evaporation Methods 0.000 claims abstract description 37
- 230000008020 evaporation Effects 0.000 claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims description 35
- 230000004308 accommodation Effects 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000004907 flux Effects 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 description 15
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application discloses a heat radiation module and a heat radiation component thereof, wherein the heat radiation component comprises a cover plate, a base plate, a containing groove and a flow guide piece, wherein the base plate is connected with the cover plate, the base plate is used for forming a closed cavity with the cover plate, the containing groove is arranged on the base plate, the containing groove is used for containing liquid working medium, the flow guide piece is arranged on the containing groove, and the flow guide piece is used for collecting the liquid working medium and allowing the liquid working medium to flow into the containing groove; the air guide piece is provided with an air guide hole and an air vent, wherein the air guide hole is used for allowing liquid working medium to flow into the accommodating groove, the air vent is arranged at intervals with the air guide hole, and the air vent is used for allowing gaseous working medium formed after the liquid working medium in the accommodating groove is heated to overflow out of the accommodating groove. The heat radiation assembly can effectively solve the problem of supply of liquid working medium in the center of the evaporation surface, and avoid the problem of working medium backflow limit of the traditional temperature equalization plate, so that the working efficiency of the heat radiation assembly can be effectively improved, and the heat radiation assembly can meet the heat radiation requirements of higher heat radiation power and higher heat flux density.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to a heat dissipation assembly. The application also relates to a heat radiation module with the heat radiation component.
Background
Some devices with high power and high heat flux density in electronic equipment such as switches and servers gradually become design bottlenecks.
In the existing heat dissipation technology, a vapor chamber (vapor chamber) is generally used for heat dissipation, the vapor chamber is generally a plate-shaped device, a sealed vacuum cavity is arranged inside the vapor chamber, a capillary structure such as a sintered capillary layer is arranged on the inner wall surface of the cavity, and a phase change working medium such as water or glycol is filled in the cavity. When the lower surface of the evaporation end is heated by a heat source, the internal working medium in the cavity is heated, the internal working medium can be quickly evaporated under the vacuum negative pressure condition and becomes a gaseous state, the temperature of the gaseous working medium is higher, the temperature in the cavity at the far end side is lower, the saturation pressure of the working medium is different, the gaseous working medium can quickly flow to a position with lower temperature under the action of saturation pressure difference, the gaseous working medium is condensed into a liquid state after being radiated at the cold end, and the liquid working medium flows back to the evaporation end along the wall surface in a capillary way under the action of capillary force. The whole process forms circulation, and heat is conducted to the whole plate through the evaporation end, so that the whole temperature of the plate is uniform, and heat transfer is realized. From the above, the qi isThe flow of the state working medium and the flow of the liquid working medium are mutually reversed, the mutual interference is small under the condition of lower power consumption and heat flow density, and the whole device can normally operate, however, when the power consumption reaches higher level, the heat flow density is higher (generally reaches 80W/cm) 2 ) The flow speed of the gaseous working medium is too high, larger resistance is generated to the backflow of the liquid working medium, the liquid working medium can be carried to a place far away from a heat source and gradually developed, the liquid working medium on the surface of an evaporator flows back, the evaporated working medium cannot be supplemented, no liquid working medium can be evaporated in a circular area in the center of an evaporation surface, the evaporation phase change process only occurs in a surrounding annular area, at the moment, the surface center of the power device cannot generate phase change to carry a large amount of heat flow, the heat flow is transferred to the surrounding evaporation phase change area to dissipate heat only by virtue of heat conduction of a substrate, and the center temperature of a chip is rapidly increased and even burnt. The above-described phenomenon of the working fluid drying out is referred to as "working fluid reflux limit". In addition, because the liquid working medium flows from the periphery to the center along the wall capillary structure, the liquid working medium can not flow back to the center under the high power condition and is completely evaporated, and the liquid working medium is also one reason for forming a 'working medium backflow limit'.
Therefore, how to avoid the situation that the heat dissipation requirement cannot be met by the temperature equalization plate due to the occurrence of the limit of the backflow of the working medium under the conditions of high power and high heat flux density is a technical problem that needs to be solved currently by the person skilled in the art.
Disclosure of Invention
The application aims to provide a heat radiation assembly which can effectively solve the problem of supply of liquid working medium in the center of an evaporation surface and avoid the occurrence of the working medium backflow limit of a traditional temperature equalizing plate. Another object of the present application is to provide a heat dissipating module including the above heat dissipating assembly.
In order to achieve the above object, the present application provides a heat dissipating assembly, comprising:
a cover plate;
the base plate is connected with the cover plate and is used for forming a closed cavity with the cover plate;
the accommodating groove is arranged on the base plate and is used for accommodating liquid working medium;
the water conservancy diversion spare is located on the holding tank, be used for collecting liquid working medium, the water conservancy diversion spare is equipped with:
the diversion hole is used for allowing the liquid working medium to flow into the accommodating groove;
the vent holes are arranged at intervals with the diversion holes and are used for allowing gaseous working media formed after the liquid working media in the accommodating groove are heated to overflow the accommodating groove.
Optionally, the flow guiding piece includes a flow guiding surface, the flow guiding hole is arranged in the center of the flow guiding surface, and the plurality of vent holes are arranged on the flow guiding surface and surround the flow guiding hole.
Optionally, a plurality of baffle rings are arranged on the flow guide surface, the baffle rings are arranged in one-to-one correspondence with the air holes, and the baffle rings are used for blocking the liquid working medium from flowing into the accommodating groove along the air holes.
Optionally, the guide piece further includes a positioning ring located at the periphery of the guide surface, the substrate is further provided with a positioning groove located at the periphery of the accommodating groove, and the positioning ring is located in the positioning groove to position the guide piece.
Optionally, the positioning ring is provided with a plurality of protrusions, and the protrusions are arranged towards the cover plate.
Optionally, the base plate is equipped with the boss, the holding tank is located the boss, the boss is used for with generating heat the piece contact offset, be equipped with in the boss and strengthen evaporation structure, strengthen evaporation structure and be located the center of holding tank, just strengthen evaporation structure stretches out the water conservancy diversion hole.
Optionally, a plurality of rib structures are further arranged in the boss, and the rib structures are radial and are arranged around the enhanced evaporation structure.
Optionally, the inner surface of the substrate is provided with a capillary structure layer.
The application also provides a heat radiation module, which comprises any one of the heat radiation components.
Optionally, the method further comprises:
the heat pipe is connected with the cover plate and used for conducting heat of the heat radiating component;
and the radiating fin is connected with the cover plate and is contacted with the heat pipe, and is used for radiating heat of the radiating component.
Compared with the background art, the heat radiation assembly provided by the embodiment of the application comprises the cover plate, the base plate, the containing groove and the flow guide piece, wherein the base plate is connected with the cover plate, the base plate and the cover plate form a closed cavity, the closed cavity is used for circularly supplying working media to realize heat radiation, the containing groove is arranged on the base plate and used for containing liquid working media, the flow guide piece is arranged on the containing groove and used for collecting the liquid working media and allowing the liquid working media to flow into the containing groove; further, the flow guiding piece is provided with a flow guiding hole and a vent hole, wherein the flow guiding hole is used for allowing liquid working medium to flow into the accommodating groove, the vent hole and the flow guiding hole are arranged at intervals, and the vent hole is used for allowing gaseous working medium formed after the liquid working medium in the accommodating groove is heated to overflow out of the accommodating groove. Compared with a common temperature equalizing plate, the heat radiating component provided by the embodiment of the application is provided with the flow guide piece, the water collecting structure is formed through the flow guide piece to collect liquid working medium, the liquid working medium flows into the accommodating groove on the substrate through the flow guide hole on the flow guide piece, meanwhile, gaseous working medium formed after the liquid working medium in the accommodating groove is heated can overflow the accommodating groove through the vent hole on the flow guide piece, and the liquid working medium and the gaseous working medium circularly flow to realize heat radiation.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a heat dissipating assembly according to an embodiment of the present application;
FIG. 2 is a schematic view of a partial structure of a substrate in the heat dissipating assembly shown in FIG. 1;
FIG. 3 is a schematic view of a flow guide in the heat dissipating assembly shown in FIG. 1;
FIG. 4 is a schematic cross-sectional view of a heat dissipating assembly according to an embodiment of the present application;
FIG. 5 is an exploded view of a heat dissipating module according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of the assembled heat dissipation module shown in fig. 5.
Wherein:
1-heat dissipation module,
10-heat dissipation assembly,
101-cover plate,
102-base plate, 1021-containing groove, 1022-boss, 1023-enhanced evaporation structure, 1024-rib structure, 1025-capillary structure layer, 1026-structure mounting round hole, 1027-positioning groove,
103-flow guiding piece, 1031-flow guiding hole, 1032-vent hole, 1033-flow guiding surface, 1034-baffle ring, 1035-positioning ring, 1036-bulge,
11-heat pipe,
12-heat sink,
13-structural reinforcing plate,
14-riveting columns.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The present application will be further described in detail below with reference to the drawings and detailed description for the purpose of enabling those skilled in the art to better understand the aspects of the present application.
The terms "upper end, lower end, left side, right side" and the like are defined based on the drawings of the specification.
Referring to fig. 1 to 6, fig. 1 is a schematic structural diagram of a heat dissipating assembly according to an embodiment of the application; FIG. 2 is a schematic view of a partial structure of a substrate in the heat dissipating assembly shown in FIG. 1; FIG. 3 is a schematic view of a flow guide in the heat dissipating assembly shown in FIG. 1; FIG. 4 is a schematic cross-sectional view of a heat dissipating assembly according to an embodiment of the present application; FIG. 5 is an exploded view of a heat dissipating module according to an embodiment of the present application; fig. 6 is a schematic structural diagram of the assembled heat dissipation module shown in fig. 5.
The heat dissipation assembly 10 provided by the embodiment of the application comprises a cover plate 101, a substrate 102, a containing groove 1021 and a flow guide member 103, wherein the substrate 102 is connected with the cover plate 101, the substrate 102 is used for forming a closed cavity with the cover plate 101, the closed cavity is used for enabling working media to circulate to achieve heat dissipation, the containing groove 1021 is arranged on the substrate 102, the containing groove 1021 is used for containing liquid working media, the flow guide member 103 is arranged on the containing groove 1021, and the flow guide member 103 is used for collecting the liquid working media and enabling the liquid working media to flow into the containing groove 1021.
Further, the flow guiding member 103 is provided with a flow guiding hole 1031 and a vent hole 1032, wherein the flow guiding hole 1031 is used for allowing the liquid working medium to flow into the accommodating groove 1021, the vent hole 1032 is arranged at intervals with the flow guiding hole 1031, and the vent hole 1032 is used for allowing the gaseous working medium formed after the liquid working medium in the accommodating groove 1021 is heated to overflow out of the accommodating groove 1021.
When the liquid working substance changes its phase into a gaseous state by evaporation on the inner surface of the accommodation groove 1021, the volume expands sharply, overflows through the vent hole 1032 and flows to a colder portion between the base plate 102 and the cover plate 101 under the action of the internal vapor saturation pressure. Of course, the shape of the vent 1032 includes, but is not limited to, circular, square, triangular, and the like.
In this way, when the liquid working medium in the accommodation groove 1021 is heated to form a gaseous working medium, the gaseous working medium overflows from the accommodation groove 1021 through the vent hole 1032 on the flow guiding member 103 and enters the space between the base plate 102 and the cover plate 101, the temperature of the gaseous working medium is higher, the temperature in the cavity at the far end side is lower, the saturation pressure of the working medium is different, the gaseous working medium can quickly flow to the position with lower temperature under the effect of the saturation pressure difference, the gaseous working medium is condensed into a liquid state after the cold end dissipates heat, the liquid working medium is collected under the flow guiding effect of the flow guiding member 103 and flows into the accommodation groove 1021 through the flow guiding hole 1031 of the flow guiding member 103, and the heat dissipation is realized in turn.
Compared with a common temperature equalizing plate, the heat dissipating assembly 10 provided by the embodiment of the application is provided with the flow guiding member 103, a water collecting structure is formed by the flow guiding member 103 to collect liquid working medium, the liquid working medium flows into the accommodating groove 1021 on the substrate 102 through the flow guiding hole 1031 on the flow guiding member 103, meanwhile, gaseous working medium formed after the liquid working medium in the accommodating groove 1021 is heated can overflow the accommodating groove 1021 through the air vent 1032 on the flow guiding member 103, and the circulation flow of the liquid working medium and the gaseous working medium realizes heat dissipation.
It should be noted that, the substrate 102 and the cover plate 101 are metal (copper aluminum) thin plates, the cover plate 101 is used for brazing with the substrate 102 to form a closed cavity, and in order to improve the condensation efficiency of the gaseous working medium on the inner surface of the cover plate 101, the inner surface of the cover plate 101 can be sintered with a capillary structure so as to facilitate the flow of the liquid working medium.
The above-mentioned setting mode can change the route that liquid working medium backward flow for liquid working medium passes through the collection of water conservancy diversion spare 103, directly flows the evaporation face center of base plate 102, can effectively solve the supply problem of evaporation face center liquid working medium, avoids appearing the working medium backward flow limit problem of traditional samming board, thereby can effectively promote the work efficiency of radiator unit 10, makes radiator unit 10 can satisfy the heat dissipation demand of higher heat dissipation power and higher heat flux.
In this embodiment, the flow guiding member 103 includes a flow guiding surface 1033, a flow guiding hole 1031 is disposed at the center of the flow guiding surface 1033, and a plurality of air holes 1032 are disposed on the flow guiding surface 1033 and surrounding the flow guiding hole 1031.
Of course, according to actual needs, the number and shape of the air holes 1032 may be adjusted according to specific application situations, and as preferred, the number of the air holes 1032 is four, and accordingly, the flow guiding surface 1033 includes four flow guiding facets, the flow guiding facets are arranged in one-to-one correspondence with the air holes 1032, any flow guiding facet is an inclined plane, and the four flow guiding facets form the main body of the flow guiding element 103 and the flow guiding hole 1031.
In addition, a diversion trench can be arranged between any two adjacent diversion facets, and any diversion trench extends to the diversion hole 1031 for diversion.
In order to ensure that the liquid working medium and the gaseous working medium are not interfered with each other, and all the liquid working medium flows into the accommodating groove 1021 through the flow guide hole 1031, a plurality of baffle rings 1034 are arranged on the flow guide surface 1033, the baffle rings 1034 are arranged in one-to-one correspondence with the vent holes 1032, the baffle rings 1034 are arranged on the vent holes 1032, and any baffle ring 1034 has the function of preventing the liquid working medium from directly flowing into the vent holes 1032 in the flowing process of the flow guide hole 1031.
In order to facilitate positioning of the flow guiding element 103, the flow guiding element 103 further comprises a positioning ring 1035, the flow guiding surface 1033 is arranged on the inner side of the positioning ring 1035, that is, the positioning ring 1035 is arranged on the periphery of the flow guiding surface 1033, and the top surface of the baffle ring 1034 is flush with the positioning ring 1035; correspondingly, the base plate 102 is further provided with a positioning groove 1027, the positioning groove 1027 is arranged on the periphery of the accommodating groove 1021, and the positioning ring 1035 is arranged on the positioning groove 1027, so that the positioning of the flow guiding piece 103 is realized.
In this way, during installation, the positioning ring 1035 of the flow guiding element 103 is aligned with the positioning groove 1027 and placed in the positioning groove 1027, so that the flow guiding element 103 can be positioned in the horizontal direction, then the cover plate 101 is additionally arranged, and the cover plate 101 presses the flow guiding element 103, so that the flow guiding element 103 can be positioned in the vertical direction.
Of course, according to the installation requirement, the positioning ring 1035 is provided with a plurality of protrusions 1036, the protrusions 1036 are arranged towards the cover plate 101, and after the cover plate 101 is additionally arranged, the cover plate 101 is contacted and abutted with the protrusions 1036, so that the stability and reliability of the installation of the flow guide piece 103 are ensured.
It should be noted that, during the whole assembly and welding process of the heat dissipation assembly 10, the cover plate 101 contacts and abuts against the plurality of protrusions 1036, and the protrusions 1036 can limit the flow guiding member 103 to a desired position under the pressure of the cover plate 101.
In this embodiment, the base plate 102 is provided with a boss 1022, the boss 1022 protrudes out of the base plate 102 toward a side far away from the flow guiding member 103, the accommodating groove 1021 is provided in the boss 1022, the boss 1022 is used for contacting and propping against the heating member, and the size and shape of the flow guiding member 103 are matched with those of the boss 1022, provided that the realization of liquid flow collection can be ensured.
The boss 1022 functions to form a concave receiving groove 1021 in the base plate 102, so that the liquid working substance can be converged into the receiving groove 1021 by gravity, and the receiving groove 1021 functions to form a concave region. The outer surface of the boss 1022 contacts the heat generating chip, which facilitates placement of the heat spreader in the system, and may keep the heat spreader away from areas of some electronic devices.
The flow guiding member 103 is specifically a concave groove-shaped thin plate, and the flow guiding hole 1031 in the center of the flow guiding member 103 is opposite to the center of the evaporation surface in the boss 1022.
In this embodiment, the boss 1022 is square, and correspondingly, the flow guiding member 103 is also square, but this structure is not necessarily square, and may be designed into other shapes such as a circle, which are beneficial to collecting the liquid working medium.
In order to optimize the above embodiment, the boss 1022 is provided with the enhanced evaporation structure 1023, the enhanced evaporation structure 1023 is located at the center of the receiving slot 1021, and the enhanced evaporation structure 1023 protrudes upwards out of the diversion hole 1031.
Specifically, the enhanced evaporation structure 1023 is a cylindrical or conical or rectangular fin structure, and because the central part of the boss 1022 has concentrated heat flux, the heat exchange area of evaporation is increased by the cylindrical or conical structure or rectangular fin, so as to achieve the effect of increasing the evaporation surface and reducing the heat flux.
Meanwhile, the enhanced evaporation structure 1023 is configured to extend upwards out of the diversion hole 1031, so that when the liquid working medium flows into the diversion hole 1031, the liquid working medium can impact the enhanced evaporation structure 1023, thereby further improving the effect of evaporation and heat dissipation.
It should be noted that, the direct impact of the liquid working fluid flow can enhance the effect of evaporation heat exchange, and of course, even if the evaporation surface reaches film boiling, the impact of the liquid working fluid flow can still realize the maximum cooling of the center of the evaporation surface.
In addition, the boss 1022 is further provided with a plurality of rib structures 1024, and the plurality of rib structures 1024 are radially arranged around the enhanced evaporation structure 1023.
It should be noted that, the rib structure 1024 is mainly used for performing thermal expansion, that is, when the power consumption of the chip is high, the rib structure 1024 can conduct the heat of the chip near the center of the boss 1022 to the whole boss 1022 through thermal conduction, so that the space for evaporation phase change can be increased, the heat flow density of the evaporation surface in the middle of the chip can be reduced, and meanwhile, the rib structure 1024 also has the effect of reinforcing the structural strength of the boss 1022.
In order to improve evaporation efficiency and enhance flow of liquid working medium, a capillary structure layer 1025 may be sintered on the inner surface of the substrate 102, the capillary structure layer 1025 is distributed on the inner surface of the boss 1022 and the inner surface of the substrate 102 except the boss 1022, and the capillary structure layer 1025 is formed by sintering metal powder. The sintering method is consistent with the conventional Wen Bangong process.
The heat dissipation module 1 provided by the application comprises the heat dissipation assembly 10 described in the above specific embodiment; the heat dissipation module 1 further comprises a heat pipe 11 and a heat dissipation fin 12, wherein the heat pipe 11 and the heat dissipation fin 12 are arranged outside the cover plate 101, the heat pipe 11 is connected with the cover plate 101, the heat pipe 11 is used for conducting heat of the heat dissipation assembly 10, the heat dissipation fin 12 is connected with the cover plate 101, the heat dissipation fin 12 is in contact with the heat pipe 11, and the heat dissipation fin 12 is used for dissipating the heat of the heat dissipation assembly 10.
It should be noted that the heat sink 12 and the heat pipe 11 are condensation heat dissipation components of the heat dissipation module 1, the heat sink 12 dissipates heat under the blowing of external air flow, and the heat pipe 11 is used as a component for improving the efficiency of the heat sink 12, so as to enhance the heat exchange efficiency of the heat sink 12.
In addition, the heat dissipation module 1 further includes a structural reinforcing plate 13 assembled on two sides of the heat dissipation assembly 10 for enhancing structural strength of the heat dissipation assembly 10, so as to avoid deformation of the heat dissipation assembly 10 caused by locking the heat dissipation module 1.
To meet the structural requirements, a structural mounting round hole 1026 for riveting the rivet 14 is also left in the base plate 102. The structural mounting round hole 1026 is used for assembling the rivet column 14, the rivet column 14 is used for providing threads required for structural assembly, and the rivet column 14 is riveted into the structural mounting round hole 1026, so that the heat radiation module 1 can be assembled.
It should be noted that in this specification relational terms such as first and second are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities.
The heat dissipation module and the heat dissipation assembly provided by the application are described in detail above. The principles and embodiments of the present application have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the inventive arrangements and their core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the application can be made without departing from the principles of the application and these modifications and adaptations are intended to be within the scope of the application as defined in the following claims.
Claims (6)
1. A heat dissipating assembly (10), comprising:
a cover plate (101);
a base plate (102) connected with the cover plate (101) and used for forming a closed cavity with the cover plate (101);
the accommodating groove (1021) is arranged on the base plate (102) and is used for accommodating liquid working medium;
the guide piece (103) is arranged on the accommodating groove (1021) and is used for collecting the liquid working medium, and the guide piece (103) is provided with:
a diversion hole (1031) for allowing the liquid working medium to flow into the accommodation groove (1021);
the vent holes (1032) are arranged at intervals with the diversion holes (1031) and are used for allowing gaseous working media formed after the liquid working media in the accommodating groove (1021) are heated to overflow the accommodating groove (1021);
the flow guide piece (103) comprises a flow guide surface (1033), the flow guide hole (1031) is arranged in the center of the flow guide surface (1033), and a plurality of vent holes (1032) are arranged on the flow guide surface (1033) and are arranged around the flow guide hole (1031);
a plurality of baffle rings (1034) are arranged on the flow guide surface (1033), the baffle rings (1034) are arranged in one-to-one correspondence with the vent holes (1032), and the baffle rings (1034) are used for blocking the liquid working medium from flowing into the accommodating groove (1021) along the vent holes (1032);
the base plate (102) is provided with a boss (1022), the accommodating groove (1021) is arranged on the boss (1022), the boss (1022) is used for being contacted and propped against a heating piece, the boss (1022) is internally provided with a reinforced evaporation structure (1023), the reinforced evaporation structure (1023) is positioned at the center of the accommodating groove (1021), and the reinforced evaporation structure (1023) extends out of the flow guide hole (1031);
a plurality of rib structures (1024) are further arranged in the boss (1022), and the rib structures (1024) are radial and are arranged around the enhanced evaporation structure (1023).
2. The heat dissipating assembly (10) of claim 1, wherein the deflector (103) further comprises a positioning ring (1035) located at the periphery of the deflector surface (1033), the base plate (102) further comprises a positioning groove (1027) located at the periphery of the receiving groove (1021), and the positioning ring (1035) is located in the positioning groove (1027) to position the deflector (103).
3. The heat dissipating assembly (10) of claim 2, wherein the positioning ring (1035) is provided with a plurality of protrusions (1036), and wherein the plurality of protrusions (1036) are disposed towards the cover plate (101).
4. The heat dissipating assembly (10) of claim 2, wherein the positioning ring (1035) is provided with a plurality of protrusions (1036), and wherein the plurality of protrusions (1036) are disposed towards the cover plate (101).
5. A heat dissipating module (1) comprising a heat dissipating assembly (10) according to any of claims 1-4.
6. The heat dissipation module (1) of claim 5, further comprising:
a heat pipe (11) connected to the cover plate (101) for conducting heat of the heat dissipation assembly (10);
and the radiating fin (12) is connected with the cover plate (101) and is contacted with the heat pipe (11) for radiating heat of the radiating assembly (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210182944.XA CN114828546B (en) | 2022-02-25 | 2022-02-25 | Heat radiation module and heat radiation assembly thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210182944.XA CN114828546B (en) | 2022-02-25 | 2022-02-25 | Heat radiation module and heat radiation assembly thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114828546A CN114828546A (en) | 2022-07-29 |
| CN114828546B true CN114828546B (en) | 2023-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210182944.XA Active CN114828546B (en) | 2022-02-25 | 2022-02-25 | Heat radiation module and heat radiation assembly thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114828546A (en) | 2022-07-29 |
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