CN105552225B - 用于制造柔性基板的方法、柔性基板和显示装置 - Google Patents

用于制造柔性基板的方法、柔性基板和显示装置 Download PDF

Info

Publication number
CN105552225B
CN105552225B CN201610038781.2A CN201610038781A CN105552225B CN 105552225 B CN105552225 B CN 105552225B CN 201610038781 A CN201610038781 A CN 201610038781A CN 105552225 B CN105552225 B CN 105552225B
Authority
CN
China
Prior art keywords
film layer
film
coating
flexible substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610038781.2A
Other languages
English (en)
Other versions
CN105552225A (zh
Inventor
谢明哲
刘陆
谢春燕
王和金
郭远征
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201610038781.2A priority Critical patent/CN105552225B/zh
Publication of CN105552225A publication Critical patent/CN105552225A/zh
Priority to PCT/CN2016/084935 priority patent/WO2017124682A1/zh
Priority to US15/503,994 priority patent/US10319924B2/en
Application granted granted Critical
Publication of CN105552225B publication Critical patent/CN105552225B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7244—Oxygen barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B32B2307/7265—Non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明公开了一种用于制造柔性基板的方法、使用该方法制成的柔性基板和包括所述柔性基板的显示装置。所述方法包括步骤：在玻璃载体上涂布多层膜层，其中所述多层膜层中的至少一对相邻膜层中的每一对相邻膜层以如下方式形成：涂布第一膜层，和在所述第一膜层上涂布第二膜层，使所述第二膜层覆盖所述第一膜层，其中所述第二膜层的面积大于所述第一膜层的面积；和将所形成的膜层结构从所述玻璃载体上剥离，形成柔性基板。

Description

用于制造柔性基板的方法、柔性基板和显示装置
技术领域
本发明涉及柔性基板领域，尤其涉及一种用于制造柔性基板的方法、通过该方法制成的柔性基板和包括该柔性基板的显示装置。
背景技术
与传统的硬质基板相比，能够弯曲的柔性基板以其重量轻、厚度薄、柔软等优点被越来越广泛地应用于薄膜印刷电路板、可弯曲显示面板等领域中。在柔性基板的制造技术中，通常是在玻璃载体上多次涂布聚酰亚胺或聚醚醚酮等材料而形成多层膜层，并且将所形成的多层膜层剥离，从而形成最终的柔性基板。然而，如图1所示，在涂布膜层的过程中，在涂膜的周围会有突起的膜厚不稳定区，而且这个膜厚不稳定区随着膜厚的增高而变大，随着膜层的增多而变高。
发明内容
为了克服或者至少缓解上述缺点，本发明提供一种新颖的用于制造柔性基板的方法。具体地，根据本发明的一方面，提供一种用于制造柔性基板的方法，包括步骤：在玻璃载体上涂布多层膜层，其中所述多层膜层中的至少一对相邻膜层中的每一对相邻膜层以如下方式形成：涂布第一膜层；在所述第一膜层上涂布第二膜层，使所述第二膜层覆盖所述第一膜层，其中所述第二膜层的面积大于所述第一膜层的面积；和将所形成的多层膜层结构从所述玻璃载体上剥离，形成柔性基板。
在根据本发明的用于制造柔性基板的方法中，虽然在第一次涂布中在第一膜层的边缘处形成了厚度不稳定部分，但是通过在第一膜层上涂布第二膜层，使得第二膜层覆盖第一膜层，即第二膜层的面积大于第一膜层，可以使该厚度不稳定部分被随后涂布的第二膜层覆盖而实现平坦化，从而仅仅在第二膜层的边缘处形成厚度不稳定部分。这样，增大了工艺使用区域，消除了双层涂布所带来的可用涂布面积小、膜厚不稳定区域大的问题。
优选地，在所述第一膜层上涂布第二膜层，使所述第二膜层覆盖所述第一膜层的步骤中，所述第一膜层的边缘与所述第二膜层的边缘之间相距5mm或大于5mm。
优选地，在所述第一膜层上涂布第二膜层，使所述第二膜层覆盖所述第一膜层的步骤之前，在所述第一膜层上设置阻隔层，用于阻隔水和/或氧，且在所述玻璃载体上涂布第二膜层，使所述第二膜层覆盖所述第一膜层的步骤之后，所述第二膜层覆盖所述阻隔层。
在一实施例中，通过夹缝挤出式涂布方式涂布所述第一膜层和所述第二膜层。
在一实施例中，所述至少一对相邻膜层包括一对相邻膜层，并且第一膜层被涂布设置在所述玻璃载体上。
在一实施例中，所述第一膜层和所述第二膜层是聚酰亚胺膜层。
根据本发明的另一方面，提供一种通过上述方法制作的柔性基板。优选地，所述第二膜层的厚度至少大于或等于所述第一膜层的厚度的10％。
根据本发明的还一方面，提供一种包括上述柔性基板的显示装置。
附图说明
通过下面结合附图说明本发明的优选实施例，将使本发明的上述及其它目的、特征和优点更加清楚，其中：
图1示意性地示出涂布膜层时涂膜周围的突起的膜厚不稳定区随着膜厚的增高而变大的原理图；和
图2A-2C示意性地示出根据本发明实施例的用于制作柔性基板的方法的一个示例的各个步骤所对应的结构示意图。
在本发明的所有附图中，相同或相似的结构均以相同或相似的附图标记标识。另外，本发明的附图仅为示意目的，并非按比例绘制。
具体实施方式
下面参照附图对本发明的优选实施例进行详细说明，在描述过程中省略了对于本发明来说是不必要的细节和功能，以防止对本发明的理解造成混淆。此外，应该指出的是，本发明中所用的“第一”和“第二”仅仅是为了便于在描述过程中进行区别，而并没有任何限定作用。
如图2A-2C所示，根据本发明实施例的用于制造柔性基板的方法的一个示例包括步骤：在玻璃载体1上涂布第一膜层2；在玻璃载体1上涂布第二膜层4，使第二膜层4覆盖第一膜层2，其中第二膜层4的面积大于第一膜层2的面积；和将所形成的膜层结构从玻璃载体1上剥离，形成柔性基板。
在根据本发明的用于制造柔性基板的方法中，虽然在第一次涂布中在第一膜层的边缘处形成了厚度不稳定部分2a，但是通过在第一膜层上涂布第二膜层，使得第二膜层覆盖第一膜层，即第二膜层的面积大于第一膜层，可以使该厚度不稳定部分2a被随后涂布的第二膜层覆盖而实现平坦化，从而仅仅在第二膜层的边缘处形成厚度不稳定部分4a。这样，增大了工艺使用区域，消除了双层涂布所带来的问题。
在一可选或优选实施例中，在玻璃载体1上涂布第二膜层4，使第二膜层4覆盖第一膜层2的步骤之前，在第一膜层2上设置阻隔层3(例如由能够阻隔水和/或氧的无机材料形成)，用于阻隔水和/或氧，且在玻璃载体1上涂布第二膜层4，使第二膜层4覆盖第一膜层2的步骤之后，第二膜层4覆盖阻隔层3。
应该指出的是，本发明不局限于涂布两层膜层，可以涂布多个膜层，只要多个膜层中的至少一对相邻膜层以与上述第一膜层和第二膜层的形成方式相同的方式形成即可。可选地，所述至少一对相邻膜层之间可以设置阻隔层(例如由能够阻隔水和/或氧的无机材料形成)，用于阻隔水和/或氧。在上述实例中，所述至少一对相邻膜层包括一对相邻膜层，其中第一膜层被涂布设置在玻璃载体上。
在一实施例中，第一膜层2和第二膜层4是聚酰亚胺膜层。然而，本发明不局限于此。可以使用适于形成柔性基板的任何材料。
此外，在一实施例中，可以通过夹缝挤出式涂布方式涂布第一膜层2和第二膜层4。采用这种方式能够实现面积大、厚度厚的膜层，并且节省材料。而且，由于厚度不稳定区域的问题主要出现在夹缝挤出式涂布方式中，因此，本发明的用于制作柔性基板的方法尤其适用此种涂布方式。此外，阻隔层3可以使用现有的任何适当的方式和材料形成。
在一个优选实施例中，在第一膜层2或玻璃载体1上涂布第二膜层4，使第二膜层4覆盖第一膜层2的步骤中，第一膜层2的边缘与第二膜层4的边缘之间相距5mm或大于5mm，即第一膜层2的边缘与第二膜层4的边缘之间的距离d为大于或等于5mm。应该指出的是，可以通过调整工艺参数等方法，例如修改输入工艺加工软件中的工艺参数，容易地利用现有设备实现上述涂布第二膜层、使第一膜层的边缘与第二膜层的边缘相距一段距离，例如等于或大于5mm的步骤，而不需要额外的设备和工艺。
在一优选实施例中，第二膜层4的厚度至少大于或等于第一膜层2的厚度的10％。这样设置的原因在于，发明人发现：膜层的厚度不稳定区域的厚度突起部分的高度一般是膜层厚度的10％。因此，设置第二膜层的厚度至少大于或等于第一膜层的厚度的10％能够保证第二膜层必然覆盖第一膜层的厚度不稳定区域，实现该处的平坦化。
以上参考具体实施例描述了根据本发明的用于制作柔性基板的方法。本发明还提供一种通过如上所述方法制作的柔性基板和包括所述柔性基板的显示装置。
至此已经结合优选实施例对本发明进行了描述。应该理解，本领域技术人员在不脱离本发明的精神和范围的情况下，可以进行各种其它的改变、替换和添加。因此，本发明的范围不局限于上述特定实施例，而应由所附权利要求所限定。

Claims (6)

1.一种用于制造柔性基板的方法，包括步骤：
在玻璃载体上涂布多层膜层，其中所述多层膜层中的至少一对相邻膜层中的每一对相邻膜层以如下方式形成：
涂布第一膜层；
在所述第一膜层上涂布第二膜层，使所述第二膜层覆盖所述第一膜层，其中所述第二膜层的面积大于所述第一膜层的面积；和
将所形成的多层膜层结构从所述玻璃载体上剥离，形成柔性基板，
其中在第一膜层的涂布中在第一膜层的边缘处形成厚度不稳定部分，并且该厚度不稳定部分被随后涂布的第二膜层覆盖而仅在第二膜层的边缘处形成厚度不稳定部分，
其中通过夹缝挤出式涂布方式涂布所述第一膜层和所述第二膜层，并且
其中第二膜层的平整部分超出第一膜层的边缘。
2.根据权利要求1所述的方法，其中在所述第一膜层上涂布第二膜层，使所述第二膜层覆盖所述第一膜层的步骤中，所述第一膜层的边缘与所述第二膜层的边缘之间相距5mm或大于5mm。
3.根据权利要求1或2所述的方法，还包括：在所述第一膜层上涂布第二膜层，使所述第二膜层覆盖所述第一膜层的步骤之前，在所述第一膜层上设置阻隔层，用于阻隔水和/或氧，且在所述第一膜层上涂布第二膜层，使所述第二膜层覆盖所述第一膜层的步骤之后，所述第二膜层覆盖所述阻隔层。
4.根据权利要求1或2所述的方法，其中所述至少一对相邻膜层包括一对相邻膜层，并且第一膜层被涂布设置在玻璃载体上。
5.根据权利要求4所述的方法，还包括步骤：在所述一对相邻膜层之间设置阻隔层，用于阻隔水和/或氧。
6.根据权利要求1或2所述的方法，其中所述第一膜层和所述第二膜层是聚酰亚胺膜层。
CN201610038781.2A 2016-01-20 2016-01-20 用于制造柔性基板的方法、柔性基板和显示装置 Active CN105552225B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201610038781.2A CN105552225B (zh) 2016-01-20 2016-01-20 用于制造柔性基板的方法、柔性基板和显示装置
PCT/CN2016/084935 WO2017124682A1 (zh) 2016-01-20 2016-06-06 用于制造柔性基板的方法、柔性基板和显示装置
US15/503,994 US10319924B2 (en) 2016-01-20 2016-06-06 Method for manufacturing flexible substrate, flexible substrate and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610038781.2A CN105552225B (zh) 2016-01-20 2016-01-20 用于制造柔性基板的方法、柔性基板和显示装置

Publications (2)

Publication Number Publication Date
CN105552225A CN105552225A (zh) 2016-05-04
CN105552225B true CN105552225B (zh) 2020-04-17

Family

ID=55831299

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610038781.2A Active CN105552225B (zh) 2016-01-20 2016-01-20 用于制造柔性基板的方法、柔性基板和显示装置

Country Status (3)

Country Link
US (1) US10319924B2 (zh)
CN (1) CN105552225B (zh)
WO (1) WO2017124682A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105552225B (zh) * 2016-01-20 2020-04-17 京东方科技集团股份有限公司 用于制造柔性基板的方法、柔性基板和显示装置
CN106024830B (zh) * 2016-05-27 2019-12-06 京东方科技集团股份有限公司 柔性显示面板的制造方法、柔性显示面板和显示装置
CN106601771A (zh) * 2016-12-09 2017-04-26 武汉华星光电技术有限公司 柔性基板及其制作方法
CN108062914B (zh) * 2018-01-05 2019-09-10 京东方科技集团股份有限公司 显示基板及其制造方法、显示装置
CN108539051A (zh) * 2018-03-20 2018-09-14 武汉华星光电半导体显示技术有限公司 显示面板及其制作方法
CN109301066B (zh) * 2018-10-24 2022-08-12 武汉天马微电子有限公司 柔性基板、显示装置以及柔性基板的制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1392615A (zh) * 2001-06-20 2003-01-22 株式会社半导体能源研究所 发光装置及其制造方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4197447B2 (ja) * 2003-03-31 2008-12-17 富士フイルム株式会社 有機電界発光素子の製造方法及びその有機電界発光素子
KR100529846B1 (ko) * 2003-12-26 2005-11-22 엘지.필립스 엘시디 주식회사 듀얼패널타입 유기전계발광 소자 및 그 제조방법
US20070241665A1 (en) * 2006-04-12 2007-10-18 Matsushita Electric Industrial Co., Ltd. Organic electroluminescent element, and manufacturing method thereof, as well as display device and exposure apparatus using the same
TWI306364B (en) * 2006-12-29 2009-02-11 Ind Tech Res Inst Flexible display panel device
KR20090095026A (ko) * 2008-03-04 2009-09-09 삼성전자주식회사 표시 장치 제조 방법
US8182633B2 (en) * 2008-04-29 2012-05-22 Samsung Electronics Co., Ltd. Method of fabricating a flexible display device
JP2011227369A (ja) * 2010-04-22 2011-11-10 Hitachi Displays Ltd 画像表示装置及びその製造方法
WO2012021196A2 (en) * 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method for manufacturing electronic devices and electronic devices thereof
TWI445626B (zh) * 2011-03-18 2014-07-21 Eternal Chemical Co Ltd 製造軟性元件的方法
JP5224011B2 (ja) * 2011-04-15 2013-07-03 東洋紡株式会社 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法
KR101774278B1 (ko) * 2011-07-18 2017-09-04 엘지디스플레이 주식회사 플렉서블 표시장치의 제조방법
TWI539414B (zh) * 2011-09-21 2016-06-21 友達光電股份有限公司 可撓式顯示器的製作方法
JP5902312B2 (ja) * 2012-05-31 2016-04-13 エルジー・ケム・リミテッド 有機発光素子およびその製造方法
KR102198316B1 (ko) * 2012-06-19 2021-01-04 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 표시장치 및 그 제조방법, 그리고 표시장치 지지기재용 폴리이미드 필름 및 그 제조방법
US9419065B2 (en) * 2012-08-07 2016-08-16 Apple Inc. Flexible displays
CN103515313B (zh) * 2012-10-29 2015-10-28 Tcl集团股份有限公司 一种显示器用柔性基板的剥离方法
KR20150120376A (ko) * 2013-02-20 2015-10-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법, 반도체 장치, 및 박리 장치
KR102113174B1 (ko) * 2013-04-30 2020-05-21 삼성디스플레이 주식회사 플렉시블 디스플레이 장치의 제조방법
CN103413775B (zh) * 2013-07-19 2016-04-06 京东方科技集团股份有限公司 一种柔性显示器件的制备方法及装置
KR20150056316A (ko) * 2013-11-15 2015-05-26 삼성디스플레이 주식회사 소자 기판 제조 방법 및 상기 방법을 이용하여 제조한 표시 장치
JP6561399B2 (ja) * 2013-11-20 2019-08-21 株式会社Ｊｏｌｅｄ 表示装置、およびその製造方法
JP6722980B2 (ja) * 2014-05-09 2020-07-15 株式会社半導体エネルギー研究所 表示装置および発光装置、並びに電子機器
KR102147672B1 (ko) * 2014-05-26 2020-08-26 스미또모 가가꾸 가부시키가이샤 조성물
EP3157984A1 (en) * 2014-06-19 2017-04-26 Inkron Oy Transparent siloxane encapsulant and adhesive
TWI561325B (en) * 2014-08-01 2016-12-11 Au Optronics Corp Display module manufacturing method and display module
CN104503122B (zh) * 2014-12-25 2018-05-18 上海天马微电子有限公司 一种显示面板、显示器及其制作方法
US10544266B2 (en) * 2015-03-05 2020-01-28 Lg Chem, Ltd. Composition for the production of polyimide film for flexible board of photoelectronic device
KR102288354B1 (ko) * 2015-08-10 2021-08-11 삼성디스플레이 주식회사 플렉서블 디스플레이 장치의 제조 방법
CN105552225B (zh) * 2016-01-20 2020-04-17 京东方科技集团股份有限公司 用于制造柔性基板的方法、柔性基板和显示装置
US10288974B2 (en) * 2016-04-06 2019-05-14 Amazon Technologies, Inc. Borderless display with curved edges
CN105702625B (zh) * 2016-04-12 2017-11-03 武汉华星光电技术有限公司 柔性基板的剥离方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1392615A (zh) * 2001-06-20 2003-01-22 株式会社半导体能源研究所 发光装置及其制造方法

Also Published As

Publication number Publication date
WO2017124682A1 (zh) 2017-07-27
CN105552225A (zh) 2016-05-04
US20180108850A1 (en) 2018-04-19
US10319924B2 (en) 2019-06-11

Similar Documents

Publication Publication Date Title
CN105552225B (zh) 用于制造柔性基板的方法、柔性基板和显示装置
US10562273B2 (en) Cover glass lamination structure and manufacturing method thereof
US9773855B2 (en) Array substrate, fabricating method thereof, and display device
US10526237B2 (en) Cover glass lamination structure and manufacturing method thereof
US8536460B2 (en) Composite double-sided copper foil substrates and flexible printed circuit board structures using the same
US20180212015A1 (en) Display panel and display device
US20200227681A1 (en) Array substrates, manufacturing methods thereof and display panels
US20140104511A1 (en) Touch panel and a manufacturing method thereof
EP3444845B1 (en) Method for manufacturing a display substrate
US11005069B2 (en) Display panel and display device
US9807877B1 (en) Method for making a multilayer flexible printed circuit board
CN102129318A (zh) 触控面板及其制造方法
US20190196549A1 (en) Touch sensor, touch panel and method for manufacturing the same
WO2007008866A3 (en) Static and addressable emissive displays
JP2016522518A (ja) タッチスクリーン用ディスプレーユニット及びその製造方法
CN104123022B (zh) 触控面板及其盖板结构
US11227877B2 (en) Array substrates and manufacturing methods thereof and display screens
CN104656980B (zh) 触控面板结构与其制造方法
US9282643B2 (en) Core substrate and method for fabricating circuit board
CN107155259B (zh) 一种柔性电路板及其制备方法
KR20170026020A (ko) 유기 발광 표시장치 및 이의 제조 방법
US10033010B2 (en) OLED substrate and preparation method thereof, OLED panel, and display apparatus
CN109742118B (zh) 显示面板、阵列基板及其制备方法
CN104951141A (zh) 一种触控模组、其制作方法、触摸屏及显示装置
CN106843603B (zh) 一种柔性触控屏的制备方法和柔性触控屏

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant