CN105185507B - Chip electronic device and the plate for installing chip electronic device - Google Patents
Chip electronic device and the plate for installing chip electronic device Download PDFInfo
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- CN105185507B CN105185507B CN201410465055.XA CN201410465055A CN105185507B CN 105185507 B CN105185507 B CN 105185507B CN 201410465055 A CN201410465055 A CN 201410465055A CN 105185507 B CN105185507 B CN 105185507B
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- electrodeposited coating
- conductor pattern
- coil conductor
- electronic device
- chip electronic
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- 239000011248 coating agent Substances 0.000 claims abstract description 137
- 238000000576 coating method Methods 0.000 claims abstract description 137
- 239000004020 conductor Substances 0.000 claims abstract description 99
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 22
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 19
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
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- 229910052759 nickel Inorganic materials 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
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- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 238000000034 method Methods 0.000 description 21
- 239000010408 film Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
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- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 239000000696 magnetic material Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
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- 239000004593 Epoxy Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
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- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- KOMIMHZRQFFCOR-UHFFFAOYSA-N [Ni].[Cu].[Zn] Chemical compound [Ni].[Cu].[Zn] KOMIMHZRQFFCOR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
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- 239000000428 dust Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
A kind of chip electronic device, it includes：Magnet, the magnet include dielectric base and coil conductor pattern, and the coil conductor pattern is arranged at least one surface of the dielectric base；And outer electrode, the outer electrode are arranged on two ends of the magnet to be connected to the end of the coil conductor pattern.The coil conductor pattern includes pattern coating, the electrodeposited coating being arranged on the pattern coating and the anisotropy electrodeposited coating being arranged on the electrodeposited coating, in the cross section along length thickness direction of the magnet, the downside of the adjoining dielectric base of the electrodeposited coating is longer than the upside of the electrodeposited coating.
Description
The cross reference of related application
This application claims the korean patent application No.10-2014- for being committed to Korean Intellectual Property Office on June 2nd, 2014
0066924 priority, disclosure of which are incorporated by reference so far.
Background technology
Plate the present invention relates to chip electronic device and for installing chip electronic device.
As chip electronic device, inductor is typical passive element, and it forms electricity together with resistor and capacitor
Sub-circuit is to abate the noise.Inductor and capacitor bank are combined to form to the letter in special frequency band using electromagnetic property
Number resonance circuit being amplified, filter circuit etc..
Recently, with the miniaturization and thinning of for example various communication equipments, display device etc. information technology (IT) equipment
Accelerate, constantly carried out to the small-sized of the various elements such as inductor, capacitor, transistor that are used in these information technoloy equipments
Change the technical research with thinning.Inductor also rapidly by small size, high density and be capable of automatic surface installation chip take
Generation, and thin-film electro sensor is have developed, in thin-film electro sensor, the mixture of Magnaglo and resin is formed in coil
On pattern, coil pattern is formed in the upper and lower surface of film-insulated substrate by plating.
By forming coil pattern on a dielectric base, and it is thin with the outside of same material coil pattern to manufacture this
Membrane type inductor.
Especially, D.C. resistance (Rdc) characteristic can be improved by increasing the area of coil, the area of coil is to film
The efficiency of formula inductor has material impact.
The technology of D.C. resistance (Rdc) characteristic for improving thin-film electro sensor is studied, the technology using it is each to
Method of the different in nature galvanoplastic as the area of increase coil.
Anisotropy galvanoplastic are designed such as plated parts and only grown to the top of coil, and this will be attributed to the fact that high current
Density.
But due to being to perform electro-plating method with of a relatively high current density, copper (Cu) ion depending on speed
Short supply causes to form burnt deposit on the distal end of coil pattern, in addition, the thickness deviation between coil pattern is big, so
Need a kind of method for solving these problems.
Therefore, it is necessary to persistently to for solving such as coil pattern burnt deposit, electroplating thickness deviation and circuit defect
The technology of so the problem of is studied, it is also necessary to which the technology for reducing inductor DC resistance (Rdc) is studied.
[relevant technical literature]
Japanese patent application publication No. 1999-204337.
The content of the invention
Some embodiments of the present invention can provide a kind of chip electronic device and one kind is used to install the chip electronic
The plate of device.
According to certain embodiments of the present invention, chip electronic device can include：Magnet, the magnet include dielectric base
And coil conductor pattern, the coil conductor pattern are formed at least one surface of the dielectric base；And external electrical
Pole, the outer electrode is formed on two ends of the magnet to be connected to the end of the coil conductor pattern, described
Coil conductor pattern includes pattern coating, the electrodeposited coating formed on the pattern coating and formed on the electrodeposited coating
Anisotropy electrodeposited coating, in the magnet along in the cross section of length-thickness direction, the electrodeposited coating it is neighbouring it is described absolutely
The downside of edge substrate is longer than the upside of the electrodeposited coating.
Electrodeposited coating can have trapezoidal cross section.
Electrodeposited coating can have flat upper surface.
Anisotropy electrodeposited coating can be formed by dielectric base.
The depth-width ratio (A/R) of coil conductor pattern may range from 1.5 to 5.5.
Coil conductor pattern part can contain one or more of group formed selected from following material：Silver-colored (Ag),
Palladium (Pd), aluminium (Al), nickel (Ni), titanium (Ti), golden (Au), copper (Cu) and platinum (Pt).
According to certain embodiments of the present invention, can include for installing the plate of chip electronic device：Printed circuit board (PCB),
The printed circuit board (PCB) has the first electrode pad and second electrode pad being formed on printed circuit board (PCB)；And installed in printing electricity
Chip electronic device on the plate of road, wherein chip electronic device include magnet, and the magnet includes dielectric base and coil-conductor figure
Case, the coil conductor pattern are formed at least one surface of the dielectric base；And outer electrode, the external electrical
Pole is formed on two ends of the magnet to be connected to the end of the coil conductor pattern, the coil conductor pattern bag
Include pattern coating, the electrodeposited coating formed on the pattern coating and the anisotropy plating formed on the electrodeposited coating
Layer, in the magnet along in the cross section of length-thickness direction, the downside of the neighbouring dielectric base of the electrodeposited coating
Upside than the electrodeposited coating is long.
Electrodeposited coating can have trapezoidal cross section.
Electrodeposited coating can have flat upper surface.
Anisotropy electrodeposited coating can be formed by dielectric base.
The depth-width ratio (A/R) of coil conductor pattern may range from 1.5 to 5.5.
Coil conductor pattern part can contain one or more of group formed selected from following material：Silver-colored (Ag),
Palladium (Pd), aluminium (Al), nickel (Ni), titanium (Ti), golden (Au), copper (Cu) and platinum (Pt).
Brief description of the drawings
By the specific descriptions below with reference to the accompanying drawings done, above-mentioned and other side of the invention, feature and other excellent
Point can be more clearly understood, in the drawings：
Fig. 1 is the schematical perspective view for showing chip electronic device according to an illustrative embodiment of the invention,
Which show Inside coil pattern；
Fig. 2 is the profile along I-I ' the line cuttings in Fig. 1；
Fig. 3 shows the enlarged diagram of the part A in Fig. 2 by way of example；And
Fig. 4 is to show that the chip electronic device in Fig. 1 installs the stereogram of state when on a printed circuit.
Embodiment
The illustrative embodiments of the present invention are described in detail referring now to accompanying drawing.
But the present invention can be confined to this specification with many different forms for example, should not be construed
Described in particular implementation.Conversely, there is provided the purpose of these embodiments is in order that the present invention is comprehensively and complete, and incites somebody to action
The scope of the present invention is fully conveyed to those skilled in the art.
In the accompanying drawings, perhaps to exaggerating the shape and size of element for the sake of clear, and identical reference is complete
It is used to represent same or analogous element in text.
The chip electronic device according to an exemplary embodiment of the present invention is described below.Specifically, will describe
Thin-film electro sensor, but the present invention is not limited to this.
Fig. 1 is the schematical perspective view for showing chip electronic device according to an illustrative embodiment of the invention,
Which show Inside coil pattern, Fig. 2 is the profile along I-I ' the line cuttings in Fig. 1, and Fig. 3 is shown by way of example
The enlarged diagram of part A in Fig. 2.
Referring to figs. 1 to Fig. 3, an example as chip electronic device, there is provided used in the power transmission line of power supply circuit
Thin film chip inductor device 100.Chip electronic device can function properly as chip magnetic bead, chip-type filter etc..
Thin-film electro sensor 100 can include magnet 50, dielectric base 23 and coil conductor pattern 42 and coil-conductor figure
Case 44.
Magnet 50 can be formed by unrestricted any material, as long as the material can form thin-film electro sensor 100
Outward appearance and show magnetic properties.For example, magnet 50 can be by filling ferrite or Metal Substrate soft magnetic materials and shape
Into.For ferrite, can use known Mn-Zn base ferrite, nickel-zinc based ferrite, nickel-zinc-copper-based ferrite,
Manganese-Mg-based ferrite, barium based ferrite, lithium based ferrite etc., for Metal Substrate soft magnetic materials, can use iron-silicon-boron-
Cu-base amorphous alloy state metal dust, but the present invention is not limited to this.
Magnet 50 can have hexahedral shape, will limit hexahedral direction below, to be explicitly described the present invention's
Illustrative embodiments.L, W and T shown in Fig. 1 divide table to refer to length direction, width and thickness direction.The shape of magnet 50
Shape can be cuboid.
The material of the dielectric base 23 formed in magnet 50 is not particularly limited, as long as dielectric base 23 can be formed as thin
Film, and coil conductor pattern 42 and coil conductor pattern 44 can be formed on a dielectric base by electroplating.For example, absolutely
Edge substrate can be PCB (printed circuit board (PCB)), ferrite base, Metal Substrate soft magnetism substrate etc..
The core of dielectric base 23 can be hollow to form cavity, and cavity can by such as ferrite,
The same materials such as Metal Substrate soft magnetic materials, so as to form core.By the core for forming filling magnetic material
Point, inductance L can be improved.
Coil conductor pattern 42 with coil shape pattern can be formed on a surface of dielectric base 23, have line
The coil conductor pattern 44 of cast pattern is additionally formed on another surface of dielectric base 23.
Coil conductor pattern 42 and coil conductor pattern 44 can include spiral coil pattern, and in dielectric base
The coil conductor pattern 42 and coil conductor pattern 44 formed on 23 surface and another surface can be by forming
Pathway electrode 46 in dielectric base 23 and be electrically connected to each other.
It can form coil conductor pattern 42 and coil conductor pattern 44 using the excellent metal of electric conductivity and lead to
Path electrode 46.It is, for example, possible to use silver-colored (Ag), palladium (Pd), aluminium (Al), nickel (Ni), titanium (Ti), golden (Au), copper (Cu), platinum (Pt)
And their mixture etc. forms coil conductor pattern 42 and coil conductor pattern 44 and pathway electrode 46.
Dielectric film can be formed on the surface of coil conductor pattern 42 and coil conductor pattern 44.
Dielectric film, such as silk screen print method, photoresist (PR) exposure imaging method, spray can be formed by known method
Spill method, infusion process etc..
The material of dielectric film is not particularly limited, as long as thin dielectric membrane can be formed.It is, for example, possible to use photoresist
(PR), epoxy etc. forms dielectric film.
One end of the coil conductor pattern 42 being formed on a surface of dielectric base 23 can be exposed to magnet
An end face on 50 length direction, one of the coil conductor pattern 44 being formed on another surface of dielectric base 23
End can be exposed to another end face on the length direction of magnet 50.
Outer electrode 31 and outer electrode 32 can be formed on two on the length direction of magnet 50 end faces, with connection
To coil conductor pattern 42 and coil conductor pattern 44, coil conductor pattern 42 and 44 is exposed on the length direction of magnet 50
Two end faces.
Upper and lower surface that outer electrode 31 and outer electrode 32 can be extended on the thickness direction of magnet 50 and/
Or two side surfaces on width.
Outer electrode 31 and outer electrode 32 can be formed using the excellent metal of electric conductivity.For example, can be independent
Outer electrode 31 and outer electrode are formed using nickel (Ni), copper (Cu), tin (Sn), silver-colored (Ag) etc., or using their alloy etc.
32。
According to an illustrative embodiment of the invention, coil conductor pattern 42 and coil conductor pattern 44 can include pattern
Coating 42a and pattern coating 44a, the electrodeposited coating 42b and electrodeposited coating 44b formed on pattern coating 42a and pattern coating 44a,
And anisotropy electrodeposited coating 42c and anisotropy electrodeposited coating 44c on electrodeposited coating 42b and electrodeposited coating 44b are formed, also,
In magnet 50 along in the cross section of length-thickness direction, electrodeposited coating 42b and electrodeposited coating 44b adjoining dielectric base 23
Downside can be longer than electrodeposited coating 42b and electrodeposited coating 44b upside.
In general, the technology of D.C. resistance (Rdc) characteristic to improving thin-film electro sensor is studied, the technology
It is used as the method for increase area coil using anisotropy galvanoplastic.
Anisotropy galvanoplastic are designed such as plated parts and only grown to the top of coil, and this will be attributed to the fact that high current
Density.
But due to being to perform electro-plating method with of a relatively high current density in this case, depending on speed
The short supply of copper (Cu) ion causes to form burnt deposit on the distal end of coil pattern, and the thickness between coil pattern
Deviation is relatively large, it is possible that producing circuit defect.
Meanwhile according to an illustrative embodiment of the invention, due to electrodeposited coating 42b and electrodeposited coating 44b adjacent insulation base
The downside at bottom 23 is longer than electrodeposited coating 42b and electrodeposited coating 44b upside, can solve because the thickness between coil conductor pattern is inclined
It is poor big and caused by circuit defect.
For example, due to electrodeposited coating 42b and electrodeposited coating 44b close dielectric base 23 downside than electrodeposited coating 42b's and 44b
Upside is grown, so anisotropy electrodeposited coating 42c and anisotropy electrodeposited coating 44c gives birth to from electrodeposited coating 42b and electrodeposited coating 44b bottom
It is long, so as to reduce the thickness deviation between coil conductor pattern 42 and coil conductor pattern 44, thus prevent adjacent
Short circuit occurs between coil conductor pattern.
Further, since it can be prevented by reducing the thickness deviation between coil conductor pattern 42 and coil conductor pattern 44
Short circuit only occurs between adjacent coil conductor pattern, anisotropy electrodeposited coating 42c and anisotropy electrodeposited coating 44c can give birth to
Grow of a relatively high so that the depth-width ratio (A/R) of coil conductor pattern can improve, and thus reduce D.C. resistance (Rdc).
In addition, in chip electronic device according to an illustrative embodiment of the invention, can be led by reducing coil
The size of body pattern 42 and coil conductor pattern 44 and by anisotropy plating stably apply to small-size chips.
Electrodeposited coating 42b and electrodeposited coating 44b shape of cross section are not particularly limited, but can be-for example-trapezoidal.
Because the electrodeposited coating 42b and electrodeposited coating 44b of coil conductor pattern 42 and coil conductor pattern 44 have trapezoidal cross-section
Face, compared with the circular cross section of existing electrodeposited coating, it can greatly reduce circuit defect.
For example, because electrodeposited coating 42b and electrodeposited coating 44b have trapezoidal cross-section, the circular cross section with existing electrodeposited coating
Compare, anisotropy electrodeposited coating 42c and anisotropy electrodeposited coating 44c can be from the bottom growns of electrodeposited coating, and along vertical side
Grown to stable.
Therefore, the thickness deviation of coil conductor pattern 42 and coil conductor pattern 44 can be reduced, thus it can be prevented that
Short circuit is produced between adjacent windings conductive pattern.
Further, since anisotropy electrodeposited coating 42c and anisotropy electrodeposited coating 44c can give birth to along vertical direction is stable
It is long, the depth-width ratio (A/R) of coil conductor pattern can be increased, thus reduce D.C. resistance (Rdc).
Electrodeposited coating 42b and electrodeposited coating 44b can have flat upper surface, but be not limited to this.
Because electrodeposited coating 42b and electrodeposited coating 44b have flat upper surface, the circular cross section phase with existing electrodeposited coating
Than anisotropy electrodeposited coating 42c and anisotropy electrodeposited coating 44c can stably give birth to from the bottom of electrodeposited coating along vertical direction
It is long.
It is thus possible to increase the depth-width ratio of coil conductor pattern 42 and coil conductor pattern 44 (A/R), thus reduces direct current
Resistance (Rdc).
Anisotropy electrodeposited coating 42c and anisotropy electrodeposited coating 44c can be formed by dielectric base 23.
As noted previously, as anisotropy electrodeposited coating 42c and anisotropy electrodeposited coating 44c can be by the shape of dielectric base 23
Into for example, from the bottom grown of electrodeposited coating, so anisotropy electrodeposited coating 42c and anisotropy electrodeposited coating 44c can be along vertical
Direction is stable to be grown.
The method to form coil conductor pattern is provided by way of example.Therefore, the present invention is not limited to this, can make
With various methods.
According to an illustrative embodiment of the invention, the depth-width ratio (A/ of coil conductor pattern 42 and coil conductor pattern 44
R can be) 1.5 to 5.5.
In chip electronic device according to an illustrative embodiment of the invention, in order to greatly reduce coil-conductor figure
The D.C. resistance of case 42 and coil conductor pattern 44 (Rdc), the cross-sectional area of coil can be increased.Therefore, can apply makes
The anisotropy galvanoplastic of coil through-thickness growth.
Using anisotropy galvanoplastic make coil conductor pattern thickness direction grow it is relatively thick in the case of, can
To increase the cross-sectional area of coil, D.C. resistance (Rdc) is thus reduced.
For example, according to an illustrative embodiment of the invention, the height of coil conductor pattern 42 and coil conductor pattern 44 is wide
1.5 to 5.5 are adjusted to than (A/R), it is possible thereby to increase the cross-sectional area of coil, so as to reduce D.C. resistance (Rdc).
In the case where the depth-width ratio of coil conductor pattern 42 and coil conductor pattern 44 (A/R) is less than 1.5, due to high wide
Than (A/R) close to 1, the effect for increasing coil section area in the confined space may be little, therefore, reduces D.C. resistance
(Rdc) effect may be less.
On the other hand, 5.5 situation is more than in the depth-width ratio of coil conductor pattern 42 and coil conductor pattern 44 (A/R)
Under, due to the cross-sectional area increase of coil, D.C. resistance (Rdc) can be reduced, still, because the growth of plated parts differs
Cause, it is possible to create circuit defect, also, the possible basis of D.C. resistance (Rdc) can when the supply rate of copper (Cu) ion is relatively low
Can generation thickness burnt deposit and reduce.
According to an illustrative embodiment of the invention, coil conductor pattern can contain one or more in the following group
Material：Silver-colored (Ag), palladium (Pd), aluminium (Al), nickel (Ni), titanium (Ti), golden (Au), copper (Cu) and platinum (Pt), but be not limited to
This.
The manufacturing process of chip electronic device according to an illustrative embodiment of the invention will be described herein.
It is possible, firstly, to coil conductor pattern 42 and coil conductor pattern 44 are formed in dielectric base 23.
The methods of plating can be passed through, forms coil conductor pattern 42 and coil conductor pattern 44 in thin dielectric base
On 23.In this case, dielectric base 23 is not particularly limited.It is, for example, possible to use PCB, ferrite base, Metal Substrate are soft
Magnetic substrate etc., the thickness of dielectric base 23 can be 40 to 100 μm.
For example, the method for forming coil conductor pattern 42 and coil conductor pattern 44 is galvanoplastic, but this
Invention is not limited to this.Coil conductor pattern 42 and coil conductor pattern can be formed using the excellent metal of electric conductivity
44.It is, for example, possible to use silver-colored (Ag), palladium (Pd), aluminium (Al), nickel (Ni), titanium (Ti), golden (Au), copper (Cu) or platinum (Pt), or on
State mixture of material etc..
The cavity is filled by forming cavity in the part of dielectric base 23, and with conductive material, path can be formed
Electrode 46, the coil conductor pattern 42 and coil conductor pattern being formed on the surface and another surface of dielectric base 23
44 can be electrically connected to each other by pathway electrode 46.
Penetrating the cavity of dielectric base 23 can be formed in dielectric base by drilling, laser, sandblasting or Sheet Metal Forming Technology
In 23 core.
Forming coil conductor pattern 42 and during coil conductor pattern 44, by print process formed pattern coating 42a and
Pattern coating 44a and formed by isotropism galvanoplastic on pattern coating after electrodeposited coating 42b and pattern coating 44b,
, can be along the thickness direction growth anisotropy of coil by applying high-density current to coil to carry out anisotropy plating
Electrodeposited coating 42c and anisotropy electrodeposited coating 44c.
Because electrodeposited coating is typically formed by isotropism galvanoplastic, the upper surface of electrodeposited coating can be cheese or ball
Shape.
But according to an illustrative embodiment of the invention, electrodeposited coating 42b and electrodeposited coating 44b are by isotropism galvanoplastic
Formed, it may form part of to be trapezoidal, wherein, by adjusting applied electric current, under the adjoining dielectric base 23 of electrodeposited coating
Side is longer than the upside of electrodeposited coating.
More specifically, applied by increase on the bottom of electrodeposited coating 42b and electrodeposited coating 44b adjoining dielectric base 23
Current density, and can make electrodeposited coating by reducing the current density applied to electrodeposited coating 42b and electrodeposited coating 44b top
42b and electrodeposited coating 44b is formed as electrodeposited coating 42b and electrodeposited coating 44b trapezoidal longer than upside in downside.
Next, opposite sex electricity can be formed on electrodeposited coating 42b and electrodeposited coating 44b by application anisotropy galvanoplastic
Coating 42c and different in nature electrodeposited coating 44c.In this case, as noted previously, as anisotropy electrodeposited coating 42c and anisotropy
Electrodeposited coating 44c is formed by dielectric base 23, for example, from electrodeposited coating 42b and electrodeposited coating 44b bottom grown, so anisotropy
Electrodeposited coating 42c and anisotropy electrodeposited coating 44c can vertically stablize growth.
Next, dielectric film can be formed on the surface of coil conductor pattern 42 and coil conductor pattern 44.With regard to being formed
For the method for dielectric film, known silk screen print method, photoresist (PR) exposure imaging method, spraying process, infusion process can be used
Deng.
The material of dielectric film is not particularly limited, as long as thin dielectric membrane can be formed.It is, for example, possible to use photoresist
(PR), epoxy etc. forms dielectric film.
Dielectric film shape can turn into 1 to 3 μm of thickness.In the case where the thickness of dielectric film is less than 1 μm, due to exhausted
Velum damage may produce leakage current, it is possible to create inductance HFS reduce as between waveform defect or coil
Circuit defect, in the case where thickness is more than 3 μm, inductance characteristic may deteriorate.
Next, magnet 50, coil can be formed by stacking magnetosphere on the upper and lower part of dielectric base 23
Conductive pattern 42 and coil conductor pattern 44 are formed in dielectric base 23.
Magnet 50 can be formed in the following manner：Magnetosphere is stacked on two surfaces of dielectric base 23, and is passed through
Laminating or isostatic pressing method are compressed to the magnetosphere of stacking.In such a case, it is possible to by filling magnetic material
Cavity forms core.
Furthermore, it is possible to form the coil conductor pattern 42 and coil conductor pattern 44 being connected to exposed to the end face of magnet 50
Outer electrode 31 and outer electrode 32.
The slurry containing the excellent metal of conductance can be used to form outer electrode 31 and outer electrode 32, citing comes
Say, electrocondution slurry can individually contain nickel (Ni), copper (Cu), tin (Sn) or silver-colored (Ag), or the alloy containing them.Outer electrode
31 and outer electrode 32 can be formed by infusion process etc., and by according to the shape of outer electrode 31 and outer electrode 32
Print process is formed.
Those features with the above-mentioned chip electronic device of the foregoing exemplary embodiment according to the present invention are omitted herein
The feature repeated.
For installing the plate of chip electronic device
Fig. 4 is to show that the chip electronic device in Fig. 1 installs the stereogram of state when on a printed circuit.
With reference to figure 4, the plate 200 for installing chip electronic device 100 according to an illustrative embodiment of the invention can
To be horizontally mounted at including printed circuit board (PCB) 210, first electrode pad 221 and second electrode pad 222, chip electronic device 100
On printed circuit board (PCB) 210, first electrode pad 221 and second electrode pad 222 are set on the printed circuit board 210 spaced apart relation to each other.
In this case, chip electronic device 100 can be electrically connected to printed circuit by solder flux 230 with following state
Plate 210：First outer electrode 31 and the second outer electrode 32 respectively on first electrode pad 221 and second electrode pad 222 with
Contact with each other.
, will omission pair and the above-mentioned chip electronic of the foregoing exemplary embodiment according to the present invention except above description
The description for the feature that the feature of device mutually repeats
According to an illustrative embodiment of the invention, it is similar to trapezoidal horizontal stroke because the electrodeposited coating of coil conductor pattern has
Cross sectional shape, compared with the circular cross section of existing electrodeposited coating, it can greatly reduce the generation of circuit defect.
Further, since electrodeposited coating, which has, is similar to trapezoidal shape of cross section, the circular cross section phase with existing electrodeposited coating
Than anisotropy electrodeposited coating is formed from the bottom of electrodeposited coating, it is possible thereby to increase the depth-width ratio (A/R) of coil conductor pattern, is dropped
Low D.C. resistance (Rdc).
In addition, in chip electronic device according to an illustrative embodiment of the invention, can be led by reducing coil
The size of body pattern and by anisotropy plating stably apply to small-size chips.
Although illustrative embodiments shown and described above, it is obvious for those skilled in the art that can be with
Modification and variation are made in the case of without departing from the spirit and scope of the present invention defined by the claims.
Claims (8)
1. a kind of chip electronic device, it includes：
Magnet, the magnet include dielectric base and coil conductor pattern, and the coil conductor pattern is arranged on the dielectric base
At least one surface on；And
Outer electrode, the outer electrode are arranged on two ends of the magnet to be connected to the coil conductor pattern
End,
Wherein, the coil conductor pattern includes pattern coating, the electrodeposited coating being arranged on the pattern coating and is arranged on
Anisotropy electrodeposited coating on the electrodeposited coating, in the magnet along in the cross section of length-thickness direction, the plating
The downside of the neighbouring dielectric base of layer is longer than the upside of the electrodeposited coating, and the anisotropy electrodeposited coating is from the electrodeposited coating
Bottom grown, the electrodeposited coating has trapezoidal cross section.
2. chip electronic device as claimed in claim 1, wherein, the electrodeposited coating has flat upper surface.
3. chip electronic device as claimed in claim 1, wherein, the depth-width ratio A/R of coil conductor pattern scope is
1.5 to 5.5.
4. chip electronic device as claimed in claim 1, wherein, the coil conductor pattern includes being selected from by following material institute
One or more of group of composition：Silver, palladium, aluminium, nickel, titanium, gold, copper and platinum.
5. a kind of plate for being used to install chip electronic device, the plate include：
Printed circuit board (PCB), the printed circuit board (PCB) have first electrode pad and the second electrode being arranged on the printed circuit board (PCB)
Pad；And
The chip electronic device of installation on the printed circuit board,
Wherein, the chip electronic device includes：Magnet, the magnet include dielectric base and coil conductor pattern, the coil
Conductive pattern is arranged at least one surface of the dielectric base；And outer electrode, the outer electrode are arranged on institute
State to be connected to the end of the coil conductor pattern on two ends of magnet, the coil conductor pattern is plated including pattern
Layer, the electrodeposited coating being arranged on the pattern coating and the anisotropy electrodeposited coating being arranged on the electrodeposited coating, described
Magnet along in the cross section of length-thickness direction, the downside of the neighbouring dielectric base of the electrodeposited coating is than the electricity
The upside length of coating, the anisotropy electrodeposited coating have trapezoidal horizontal stroke from the bottom grown of the electrodeposited coating, the electrodeposited coating
Section.
6. the plate as claimed in claim 5 for being used to install chip electronic device, wherein, the electrodeposited coating has flat upper table
Face.
7. the plate as claimed in claim 5 for being used to install chip electronic device, wherein, the depth-width ratio of the coil conductor pattern
(A/R) scope is 1.5 to 5.5.
8. the plate as claimed in claim 5 for being used to install chip electronic device, wherein, the coil conductor pattern includes being selected from
One or more of group that following material is formed：Silver, palladium, aluminium, nickel, titanium, gold, copper and platinum.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140066924A KR101532172B1 (en) | 2014-06-02 | 2014-06-02 | Chip electronic component and board having the same mounted thereon |
| KR10-2014-0066924 | 2014-06-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105185507A CN105185507A (en) | 2015-12-23 |
| CN105185507B true CN105185507B (en) | 2017-11-14 |
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ID=53519973
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410465055.XA Active CN105185507B (en) | 2014-06-02 | 2014-09-12 | Chip electronic device and the plate for installing chip electronic device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6121371B2 (en) |
| KR (1) | KR101532172B1 (en) |
| CN (1) | CN105185507B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101719908B1 (en) * | 2015-07-01 | 2017-03-24 | 삼성전기주식회사 | Coil electronic component and manufacturing method thereof |
| KR101751117B1 (en) * | 2015-07-31 | 2017-06-26 | 삼성전기주식회사 | Coil electronic part and manufacturing method thereof |
| KR102632366B1 (en) * | 2016-09-01 | 2024-02-02 | 삼성전기주식회사 | Coil component |
| KR101981466B1 (en) * | 2016-09-08 | 2019-05-24 | 주식회사 모다이노칩 | Power Inductor |
| KR101862503B1 (en) * | 2017-01-06 | 2018-05-29 | 삼성전기주식회사 | Inductor and method for manufacturing the same |
| KR20190038972A (en) * | 2017-10-02 | 2019-04-10 | 엘지이노텍 주식회사 | Wireless charging coil, manufacturing method thereof and wireless charging apparatus having the same |
| KR102475201B1 (en) * | 2017-10-24 | 2022-12-07 | 삼성전기주식회사 | Coil component and manufacturing method for the same |
| KR102232600B1 (en) * | 2017-12-15 | 2021-03-26 | 삼성전기주식회사 | Coil electronic part and manufacturing method thereof |
| KR102381269B1 (en) * | 2020-04-27 | 2022-03-30 | 삼성전기주식회사 | Coil component |
| TWI760275B (en) | 2021-08-26 | 2022-04-01 | 奇力新電子股份有限公司 | Inductive device and manufacturing method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2015228479A (en) | 2015-12-17 |
| CN105185507A (en) | 2015-12-23 |
| JP6121371B2 (en) | 2017-04-26 |
| KR101532172B1 (en) | 2015-06-26 |
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