CN104378909A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
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- CN104378909A CN104378909A CN201310349958.7A CN201310349958A CN104378909A CN 104378909 A CN104378909 A CN 104378909A CN 201310349958 A CN201310349958 A CN 201310349958A CN 104378909 A CN104378909 A CN 104378909A
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- layer
- circuit board
- printed circuit
- impedance
- pcb
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Abstract
A printed circuit board comprises a body, a first signal layer and a first impedance test unit. The body is provided with a first surface and a second surface which are located on the two opposite faces of the body respectively. The first signal layer is arranged in the body and relatively close to the second surface. The first impedance test unit is located on the first surface and comprises a grounding point and at least one measuring point. The grounding point is coupled to a first conductor through hole penetrating through the first surface and the second surface and the first conductor through hole is coupled to the grounding layer. The measuring points are coupled to the first signal layer. When the impedance of the first signal layer needs to be measured, a measurement tool is coupled to the corresponding measuring point and the grounding point for measurement.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), and in particular to a kind of printed circuit board (PCB) reducing stub effect.
Background technology
Printed circuit board (PCB) (printed circuit board, PCB) be a kind of according to circuit design, and the electric wiring between the multiple electronic components for arranging thereon is depicted as wiring pattern, and formed via specifically making mode (such as subraction or addition process).In other words, printed circuit board (PCB) is the substrate for electronic component of arranging in pairs or groups, and to make the electronic component be arranged on printed circuit board (PCB) be played its function, reaches the object of signal transacting.
Be to cross-sectional schematic according to the side of existing printed circuit board (PCB) please with reference to Fig. 1, Fig. 1.As shown in Figure 1, printed circuit board (PCB) 9 is a kind of multi-layer sheet (multi-layer boards) with six layers, and it mainly comprises body 90, four layer signal transport layer 92, ground plane 94, bus plane 96.Body 90 has first surface 900, relative to the second surface 902 of first surface 900 and through hole (via, through hole, also known as through hole) 904, is wherein provided with conductor 906 in through hole 904.Described multiple signal transmitting layer 92 includes signals layer 920, signals layer 922, signals layer 924 and signals layer 926, wherein signals layer 920 and signals layer 926 are exposed to first surface 900 and second surface 902 respectively, and ground plane 94 is between signals layer 920 and signals layer 922, bus plane 96 is between signals layer 924 and signals layer 926.
Please refer to Fig. 2 A, Fig. 2 A be according to Fig. 1 printed circuit board (PCB) in detect impedance time side to cross-sectional schematic.As shown in Figure 2 A, if during resistance value for the wiring of detection signal layer 920, survey tool 2 in order to testing printed circuit board 9 can be arranged on closest on (i.e. signals layer 920) on the surface of detection layers, and the two ends of survey tool 2 are coupled with the first wire (not being illustrated in accompanying drawing) and the second wire 3b respectively, wherein the first wire and the second wire 3b are all coupled to signals layer 920, to detect the resistance value of the wiring of signals layer 920.But, this detection mode but can make conductor 906 part (the i.e. section 91a beyond signals layer 920, also can be considered the section of ground plane 94 to signals layer 926) be not signal must through path, and cause stub effect (stub effect) and the accuracy of resistance value of the wiring of signals layer 920 detected by reducing.
Similarly, if during resistance value for the wiring of detection signal layer 926 (not being illustrated in accompanying drawing), can the survey tool 2 in order to testing printed circuit board 9 be arranged on signals layer 926, make conductor 906 part (can be considered the section of signals layer 920 to bus plane 96) beyond signals layer 926 be not signal must through path, and cause stub effect and the accuracy of resistance value of the wiring of signals layer 926 detected by reducing.
Please refer to Fig. 2 B, Fig. 2 B be according to Fig. 1 printed circuit board (PCB) in detect impedance time opposite side to cross-sectional schematic.As shown in Figure 2 B, if during resistance value for the wiring of detection signal layer 922, can the survey tool 2 in order to testing printed circuit board 9 be arranged on signals layer 920, and the two ends of survey tool 2 respectively coupling all have the first wire (not being illustrated in accompanying drawing) and the second wire 3b, wherein the first wire couples signals layer 920 second wire 3b and then couples signals layer 922 by through hole 904, to detect the resistance value of the wiring of signals layer 922.But, this detection mode but can make conductor 906 part (the i.e. section 91b beyond signals layer 920 to signals layer 922, also can be considered the section of signals layer 924 to signals layer 926) be not signal must through path, and cause stub effect and the accuracy of resistance value of the wiring of signals layer 922 detected by reducing.
Similarly, if during resistance value for the wiring of detection signal layer 924 (not being illustrated in accompanying drawing), can the survey tool 2 in order to testing printed circuit board 9 be arranged on signals layer 926, make conductor 906 part (can be considered the section of signals layer 920 to signals layer 922) beyond signals layer 924 to signals layer 926 be not signal must through path, and cause stub effect and the accuracy of resistance value of the wiring of signals layer 924 detected by reducing.
Summary of the invention
Because above problem, the object of the invention is to propose a kind of printed circuit board (PCB), reduce residual disconnected effect by the design utilizing the measurement point in impedance measuring unit optionally can couple any one signal transmitting layer, improve the accuracy of the resistance value of the wiring for the signal transmitting layer detected.
According to a kind of printed circuit board (PCB) in one embodiment of the invention, this printed circuit board (PCB) comprises body, the first signals layer and the first impedance measuring unit.Body has the first surface and second surface that lay respectively at the relative two sides of body.First signals layer is arranged in body, and this first signals layer is relatively near second surface.First impedance measuring unit is positioned at first surface, and this first impedance measuring unit more includes earth point and at least one measurement point.Earth point is coupled to the first conductor through hole running through first surface and second surface, and this first conductor through hole couples ground plane.Described at least one measurement point coupled with first signal layer.Wherein, when needing the impedance of measurement first signals layer, couple described at least one measurement point with survey tool and earth point is measured.
In one embodiment, printed circuit board (PCB) more comprises the second impedance measuring unit, and this second impedance measuring unit is positioned at second surface, is suitable for measuring relatively near the secondary signal layer of first surface.
In one embodiment, the first signals layer is electrically connected the second conductor through hole, and runs through the body of printed circuit board (PCB) by this second conductor through hole.
In one embodiment, the earth point of the first impedance measuring unit is just to the first conductor through hole, and described at least one measurement point is connected to the second conductor through hole by wire.
In one embodiment, in body, be provided with ground plane, bus plane and multiple signal transmitting layer, the first signals layer be described multiple signal transmitting layer one of them.
According to a kind of printed circuit board (PCB) in one embodiment of the invention, this printed circuit board (PCB) comprises body, surface signal layer and the first impedance measuring unit.Body has the first surface and second surface that lay respectively at the relative two sides of body.Surface signal layer is arranged at first surface or second surface.First impedance measuring unit is positioned at the surface at surface signal layer place, and this first impedance measuring unit more includes earth point and at least one measurement point.Earth point is coupled to the first conductor through hole running through first surface and second surface, and this first conductor through hole couples ground plane.Described at least one measurement point coupling surfaces signals layer.Wherein, when needing the impedance of measured surface signals layer, couple described at least one measurement point with survey tool and earth point is measured.
In one embodiment, printed circuit board (PCB) more comprises the second impedance measuring unit, and this second impedance measuring unit is positioned at another surface, is suitable for the impedance of measuring another surface signal layer.
In one embodiment, the earth point of the first impedance measuring unit is just to the first conductor through hole, and described at least one measurement point is connected to surface signal layer by wire.
In one embodiment, this ground plane, bus plane and multiple signal transmitting layer is provided with in body.
Comprehensive the above, the invention provides a kind of printed circuit board (PCB), by two testing impedance unit being arranged at respectively the design on the relative two sides of body, make the testing impedance unit that tester can connect to select survey tool wish according to the signal transmitting layer for detecting, and can optionally couple any one signal transmitting layer by wire by the measurement point on testing impedance unit, to detect the resistance value of the wiring for the signal transmitting layer detected.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is to cross-sectional schematic according to the side of existing printed circuit board (PCB);
Fig. 2 A be according to Fig. 1 printed circuit board (PCB) in detect impedance time side to cross-sectional schematic;
Fig. 2 B be according to Fig. 1 printed circuit board (PCB) in detect impedance time opposite side to cross-sectional schematic;
Fig. 3 is that the side of printed circuit board (PCB) is according to an embodiment of the invention to cross-sectional schematic;
Fig. 4 is a vertical view of the first impedance measurement unit according to Fig. 3;
Fig. 5 A be according to Fig. 3 printed circuit board (PCB) in detect impedance time side to cross-sectional schematic;
Fig. 5 B be according to Fig. 3 printed circuit board (PCB) in detect impedance time opposite side to cross-sectional schematic;
Fig. 5 C is according to the another cross-sectional side schematic diagram of Fig. 3 printed circuit board (PCB) in time detecting impedance.
Wherein, Reference numeral
1,9 printed circuit board (PCB)s
10,90 bodies
100,900 first surfaces
102,902 second surfaces
104,904 through holes
106,906 conductors
12,92 signal transmitting layer
120,122,124,126,920,922,924,926 signals layers
14,94 ground planes
16,96 bus planes
18 first impedance measuring unit
180 first earth points
182 first measurement points
184 second measurement points
19 second impedance measuring unit
2 survey tools
3a, 3b wire
91a, 91b, 11a, 11b section
Embodiment
Below detailed features of the present invention and advantage is described in embodiments in detail, its content is enough to make any relevant art of haveing the knack of understand technology contents of the present invention and implement according to this, and according to content, right and accompanying drawing that this specification is invented, any relevant art of haveing the knack of can understand the object and advantage that the present invention is correlated with easily.Following embodiment further describes viewpoint of the present invention, but non-to limit category of the present invention anyways.
It is noted that appended accompanying drawing is the schematic diagram of simplification, only basic structure of the present invention and method are described in a schematic way.Therefore, only the element relevant with the present invention is indicated in those accompanying drawings, and the number, shape, dimension scale etc. of shown element when not implementing with reality are drawn, specification during its actual enforcement is real optionally to be designed for one, and its component placement form may be more complicated, first give chat bright.
Please refer to Fig. 3, Fig. 3 is that the side of printed circuit board (PCB) is according to an embodiment of the invention to cross-sectional schematic.As shown in Figure 3, printed circuit board (PCB) 1 mainly comprises body 10, multiple signal transmitting layer 12, ground plane 14, bus plane 16, first impedance measurement unit 18 and the second impedance measurement unit 19.To be described in detail with regard to each portion element in printed circuit board (PCB) 1 respectively below.
Body 10 has the first surface 100 and second surface 102 and through hole (via, through hole, also known as through hole) 104 that lay respectively at the relative two sides of body 10, is wherein provided with conductor 106 in through hole 104.In practical application, body 10 can be a kind of bakelite plate, glass mat and various plastic plate, but not as limit.In addition, the present invention is not limited at this material that mode of making of through hole 104, the pore size of through hole 104 and conductor 106 use.
Described multiple signal transmitting layer 12 includes signals layer 120, signals layer 122, signals layer 124 and signals layer 126, wherein signals layer 120 and signals layer 126 are arranged at first surface 100 and second surface 102 respectively, therefore signals layer 120 and signals layer 126 also can be described as surface signal layer.Signals layer 122 and signals layer 124 are arranged in body 10, and signals layer 124 is relatively near second surface 102, and signals layer 122 is relatively near first surface 100.In addition, signals layer 120, signals layer 122, signals layer 124 are coupled mutually by conductor 106 with signals layer 126, in other words, signals layer 120, signals layer 122, signals layer 124 are couple ground plane 14 and bus plane 16 by conductor 106 with signals layer 126.In the present embodiment, ground plane 14 is between signals layer 120 and signals layer 122, and bus plane 16 is between signals layer 124 and signals layer 126, but the present invention is not limited at this physical location that ground plane 14 and bus plane 16 are positioned at printed circuit board (PCB) 1.
It should be noted that, although the printed circuit board (PCB) 1 of the present embodiment is a kind of multi-layer sheet (multi-layer boards) with six layers, but the present invention is not limited the number of plies number in printed circuit board (PCB) at this, also and the present invention do not limited the number of the signal transmitting layer in printed circuit board (PCB) at this.In practical application, a layer insulating (also known as dielectric layer) can be provided with between every one deck of described multiple signal transmitting layer 12, ground plane 14 and bus plane 16, it can be glass fibre, the not dielectric material such as fabric material and resin, and the present invention is not limited at this.
On the first surface 100 that first impedance measurement unit 18 and the second impedance measurement unit 19 lay respectively at body 10 and second surface 102 (namely the first impedance measurement unit 18 and the second impedance measurement unit 19 lay respectively at the surface at above-mentioned two surface signal layer places), and the second impedance measurement unit 19 corresponds to the first impedance measurement unit 18 and arranges.In more detail, first impedance measurement unit 18 is arranged at the opening part of the through hole 104 being positioned at first surface 100, and the second impedance measurement unit 19 is arranged at the opening part of the through hole 104 being positioned at second surface 102, that is first impedance measurement unit 18 be arranged at the opening part wherein of through hole 104, and the second impedance measurement unit 19 is arranged at another opening part of through hole 104.The present invention is not limited at this mode that the first impedance measurement unit 18 and the second impedance measurement unit 19 are arranged at the opening part of through hole 104, and whether the first impedance measurement unit 18 and the second impedance measurement unit 19 need to cover through hole 104 completely.
In order to more clearly demonstrate the first impedance measurement unit 18 and the second impedance measurement unit 19, please with reference to Fig. 3 and Fig. 4, Fig. 4 is a vertical view of the first impedance measurement unit according to Fig. 3.Must first one carry, the structure due to the second impedance measurement unit 19 is same as the first impedance measurement unit 18, therefore illustrates no longer especially.As shown in Figure 4, the first impedance measurement unit 18 has the first earth point 180, first measurement point 182 and the second measurement point 184.First earth point 180 is coupled to the first conductor through hole running through first surface 100 and second surface 102, and this first conductor through hole couples ground plane 14.First measurement point 182 optionally can couple signals layer 120 or signals layer 124.Similarly, the second impedance measurement unit 19 has the second earth point, the 3rd measurement point and the 4th measurement point.In the operation of reality, the second earth point is coupled to the first conductor through hole running through first surface 100 and second surface 102, and the 3rd measurement point optionally can couple signals layer 126 or signals layer 122.
The second earth point and the 3rd measurement point system two ends for survey tool (not being illustrated in Fig. 3 and Fig. 4) in the first earth point 180 in first impedance measurement unit 18 and the first measurement point 182 and the second impedance measurement unit 19 couple.Specifically, when needing the impedance of measuring-signal layer 120 or signals layer 124, survey tool can be arranged on the first surface 100 of body 10 usually, and one end of survey tool can couple the first earth point 180 of the first impedance measurement unit 18, the other end of survey tool then can couple the first measurement point 182 of the first impedance measurement unit 18, to measure; When needing the impedance of measuring-signal layer 122 or signals layer 126; survey tool can be arranged on the second surface 102 of body 10 usually; and one end of survey tool can couple the second earth point of the second impedance measurement unit 19; the other end of survey tool then can couple the 3rd measurement point of the second impedance measurement unit 19, to measure.In practical application, survey tool is a kind of instrument in order to detection resistance value, can be such as ohmmeter (ohmmeter, also known as ohmmeter), avometer (multimeter) or measuring instrument (measuring instrument), the present invention is not limited at this.
In addition, signals layer 122 and signals layer 124 are electrically connected the second conductor through hole, and run through the body 10 of printed circuit board (PCB) 1 by the second conductor through hole.Therefore, when needing the impedance of measuring-signal layer 124, the first earth point 180 of the first impedance measurement unit 18 is just to the first above-mentioned conductor through hole, and the first measurement point 182 is connected to the second above-mentioned conductor through hole by wire.When needing the impedance of measuring-signal layer 122, the second earth point of the second impedance measurement unit 19 is just to the first above-mentioned conductor through hole, and the 3rd measurement point is connected to the second above-mentioned conductor through hole by wire.When needing the impedance of measuring-signal layer 120, the first earth point 180 of the first impedance measurement unit 18 is just to the first above-mentioned conductor through hole, and the first measurement point 182 is connected to signals layer 120 by wire.When needing the impedance of measuring-signal layer 126, the second earth point of the second impedance measurement unit 19 is just to the first above-mentioned conductor through hole, and the 3rd measurement point is connected to signals layer 126 by wire.In other words, the first impedance measurement unit 18, except being suitable for the impedance of measuring-signal layer 120, also can be suitable for measuring relatively near the impedance of the signals layer 124 of second surface 102; Second impedance measurement unit 19, except being suitable for the impedance of measuring-signal layer 126, also can be suitable for measuring relatively near the impedance of the signals layer 122 of first surface 100.
Please refer to Fig. 5 A, Fig. 5 A be according to Fig. 3 printed circuit board (PCB) in detect impedance time side to cross-sectional schematic.As shown in Figure 5A, if during resistance value for the wiring of detection signal layer 120, survey tool 2 can be arranged on the first surface 100 of body 10, and the two ends of survey tool 2 respectively coupling all have the first wire (not being illustrated in accompanying drawing) and the second wire 3b, and be coupled to the first earth point 180 in the first impedance measurement unit 18 and the first measurement point 182 (now the first measurement point 182 is selected to be coupled to signals layer 120 by a wherein wire) respectively by the first wire and the second wire 3b, the two ends of survey tool 2 are made to be coupled to signals layer 120 respectively, and then detect the resistance value of wiring of signals layer 120.In addition, due to the relation of being undertaken detecting by the first impedance measurement unit 18, make detection signal only can through signals layer 120, and the transmission path do not had except signals layer 120, and then stub effect (stub effect) can not be caused, and very accurately can detect the resistance value of the wiring of signals layer 120.
Similarly, if during resistance value for the wiring of detection signal layer 126 (not being illustrated in accompanying drawing), survey tool 2 can be arranged on the second surface 102 of body 10, and the two ends of survey tool 2 are coupled to the second earth point in the second impedance measurement unit 19 and the 3rd measurement point (now the 3rd measurement point is selected to be coupled to signals layer 126 by a wherein wire) respectively by the first wire and the second wire 3b, make the two ends of survey tool 2 be coupled to signals layer 126 respectively, and then detect the resistance value of wiring of signals layer 126.Due to the relation of being undertaken detecting by the second impedance measurement unit 19, make detection signal only can through signals layer 126, and the transmission path do not had except signals layer 126, and then stub effect can not be caused, and very accurately can detect the resistance value of the wiring of signals layer 126.
Please refer to Fig. 5 B, Fig. 5 B be according to Fig. 3 printed circuit board (PCB) in detect impedance time opposite side to cross-sectional schematic.As shown in Figure 5 B, if during resistance value for the wiring of detection signal layer 124, survey tool 2 can be arranged on the surface (i.e. the first surface 100 of body 10) away from wish detection layers, the two ends of survey tool 2 are coupled to the first earth point 180 in the first impedance measurement unit 18 and the first measurement point 182 (now the first measurement point 182 selects to be coupled to by a wherein wire the second conductor through hole being electrically connected signals layer 124) respectively by the first wire and the second wire 3b, and then detect the resistance value of wiring of signals layer 124.Due to the relation of being undertaken detecting by the first impedance measurement unit 18, conductor 106 part (the i.e. section 11a beyond signals layer 120 to signals layer 124 can be made, also can be considered the section of bus plane 16 to signals layer 126) for forming the region of stub effect, it is little that the more existing detection mode of this section 11a is come, and then the resistance value that the more existing detection mode of resistance value by the wiring of detected signals layer 124 of the present invention is detected has higher accuracy.
Please refer to Fig. 5 C, Fig. 5 C is according to the another cross-sectional side schematic diagram of Fig. 3 printed circuit board (PCB) in time detecting impedance.As shown in Figure 5 C, if during resistance value for the wiring of detection signal layer 122, survey tool 2 can be arranged on the surface (i.e. the second surface 102 of body 10) away from wish detection layers, the two ends of survey tool 2 are coupled to the second earth point in the second impedance measurement unit 19 and the 3rd measurement point (now the 3rd measurement point selects to be coupled to by a wherein wire the second conductor through hole being electrically connected signals layer 122) respectively by the first wire and the second wire 3b, and then detect the resistance value of wiring of signals layer 122.Due to the relation of being undertaken detecting by the second impedance measurement unit 19, conductor 106 part (the i.e. section 11b beyond signals layer 122 to signals layer 126 can be made, also can be considered the section of signals layer 120 to ground plane 14) for forming the region of stub effect, it is little that the more existing detection mode of this section 11b (section 91b as shown in Figure 2 B) is come, and then the resistance value that the more existing detection mode of resistance value by the wiring of detected secondary signal layer 124 of the present invention is detected has higher accuracy.
Comprehensive the above, the embodiment of the present invention provides a kind of impedance test system for printed circuit board (PCB) and printed circuit board (PCB) thereof, by two testing impedance unit being arranged at respectively the design on the relative two sides of body, make the testing impedance unit that tester can connect to select survey tool wish according to the signal transmitting layer for detecting, and can optionally couple any one signal transmitting layer by wire by the measurement point on testing impedance unit, to detect the resistance value of the wiring for the signal transmitting layer detected.By this, the impedance test system for printed circuit board (PCB) of the present invention and printed circuit board (PCB) thereof can reduce stub effect effectively, and then lifting is for the accuracy of the resistance value of the wiring of the signal transmitting layer of detection, extremely has practicality.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection range that all should belong to the claim appended by the present invention.
Claims (9)
1. a printed circuit board (PCB), is characterized in that, comprising:
One body, has the first surface and a second surface that lay respectively at the relative two sides of this body;
One first signals layer, is arranged in this body, and this first signals layer is relatively near this second surface; And
One first impedance measuring unit, is positioned at this first surface, and this first impedance measuring unit comprises:
One earth point, is coupled to the one first conductor through hole running through this first surface and this second surface, and this first conductor through hole couples a ground plane; And
At least one measurement point, couples this first signals layer;
Wherein, when needing the impedance of measuring this first signals layer, couple this at least one measurement point with a survey tool and this earth point is measured.
2. printed circuit board (PCB) according to claim 1, is characterized in that, this printed circuit board (PCB) more comprises one second impedance measuring unit, and this second impedance measuring unit is positioned at this second surface, is suitable for measuring relatively near a secondary signal layer of this first surface.
3. printed circuit board (PCB) according to claim 1, is characterized in that, this first signals layer is electrically connected one second conductor through hole, and is run through this body of this printed circuit board (PCB) by this second conductor through hole.
4. printed circuit board (PCB) according to claim 3, is characterized in that, this earth point of this first impedance measuring unit is just to this first conductor through hole, and this at least one measurement point is connected to this second conductor through hole by a wire.
5. printed circuit board (PCB) according to claim 1, is characterized in that, is provided with this ground plane, a bus plane and multiple signal transmitting layer in this body, this first signals layer be those signal transmitting layer one of them.
6. a printed circuit board (PCB), is characterized in that, comprising:
One body, has the first surface and a second surface that lay respectively at the relative two sides of this body;
One surface signal layer, is arranged at this first surface or this second surface; And
One first impedance measuring unit, is positioned at the surface at this surface signal layer place, and this first impedance measuring unit comprises:
One earth point, is coupled to the one first conductor through hole running through this first surface and this second surface, and this first conductor through hole couples a ground plane; And
At least one measurement point, couples this surface signal layer;
Wherein, when needing the impedance of measuring this surface signal layer, couple this at least one measurement point with a survey tool and this earth point is measured.
7. printed circuit board (PCB) according to claim 6, is characterized in that, this printed circuit board (PCB) more comprises one second impedance measuring unit, and this second impedance measuring unit is positioned at another surface, is suitable for the impedance of measuring another surface signal layer.
8. printed circuit board (PCB) according to claim 6, is characterized in that, this earth point of this first impedance measuring unit is just to this first conductor through hole, and this at least one measurement point is connected to this surface signal layer by a wire.
9. printed circuit board (PCB) according to claim 6, is characterized in that, is provided with this ground plane, a bus plane and multiple signal transmitting layer in this body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310349958.7A CN104378909A (en) | 2013-08-12 | 2013-08-12 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310349958.7A CN104378909A (en) | 2013-08-12 | 2013-08-12 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104378909A true CN104378909A (en) | 2015-02-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310349958.7A Pending CN104378909A (en) | 2013-08-12 | 2013-08-12 | Printed circuit board |
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| CN (1) | CN104378909A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019019339A1 (en) * | 2017-07-28 | 2019-01-31 | 胜宏科技（惠州）股份有限公司 | Multi-functional circuit board detection module and detection method |
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| CN201639854U (en) * | 2009-11-30 | 2010-11-17 | 英业达股份有限公司 | Multilayer printed circuit board structure for testing impedance value of high-speed signal line |
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| WO2019019339A1 (en) * | 2017-07-28 | 2019-01-31 | 胜宏科技（惠州）股份有限公司 | Multi-functional circuit board detection module and detection method |
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