CN103165284B - A kind of manufacture method with the film capacitor of composite base plate - Google Patents
A kind of manufacture method with the film capacitor of composite base plate Download PDFInfo
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- CN103165284B CN103165284B CN201310065917.5A CN201310065917A CN103165284B CN 103165284 B CN103165284 B CN 103165284B CN 201310065917 A CN201310065917 A CN 201310065917A CN 103165284 B CN103165284 B CN 103165284B
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- 239000002131 composite material Substances 0.000 title claims abstract description 30
- 239000003990 capacitor Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000137 annealing Methods 0.000 claims abstract description 49
- 238000005096 rolling process Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims abstract description 5
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000011888 foil Substances 0.000 claims description 28
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 28
- 238000004544 sputter deposition Methods 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 229910020684 PbZr Inorganic materials 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000001354 calcination Methods 0.000 claims description 8
- 239000011261 inert gas Substances 0.000 claims description 8
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 4
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910000464 lead oxide Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 239000011572 manganese Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000004062 sedimentation Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 18
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
The invention discloses a kind of manufacture method with the film capacitor of composite base plate, the method is first through three rollings and the obtained composite base plate having copper base and ni substrate and combine of three annealing, then on this composite base plate, deposit the dielectric layer of Tetragonal lead zirconate titanate PbZr1-xTixO3, last depositing electrode layers on this dielectric layer again, thus there is described in being formed the film capacitor of composite base plate.
Description
Technical field
The invention belongs to film capacitor field, particularly relate to a kind of manufacture method with the film capacitor of composite base plate.
Background technology
In existing film capacitor, owing to having higher requirement to the capacitance of capacitor.In prior art, film capacitor generally comprises substrate, dielectric layer and electrode layer.The microstructure of dielectric layer is the key factor determining capacitor performance.Therefore, the material structure for film capacitor substrate has strict requirement.
Existing film capacitor substrate has employing metallic nickel to form more.In order to not affect the performance of capacitor while improving capacitance, the purity of ni substrate and impurity are formed just can not be ignored.If containing less desirable impurity in ni substrate, or its purity is not enough, the capacitance of restriction film capacitor is improved, and may increase its Leakage Current, thus affect the quality of film capacitor.
And film capacitor generally all combines on a printed circuit by embedding form, and the line pattern of existing printed circuit board (PCB) is generally all made up of metallic copper, and therefore, existing ni substrate film capacitor is combined with printed circuit board (PCB) still has defect.
Summary of the invention
The present invention is directed in prior art the film capacitor Problems existing adopting metallic nickel as substrate, propose a kind of manufacture method with the film capacitor of composite base plate, thus improve the performance of film capacitor, and can better be combined with printed circuit board (PCB).
The manufacture method with the film capacitor of composite base plate in turn includes the following steps:
(1) raw material of following proportioning is prepared: be more than or equal to the nickel of 99.98 % by weight.All the other 0.02 % by weight are plurality of impurities.Described plurality of impurities comprises: the manganese of 0.0005-0.0008 % by weight, the chromium of the aluminium of 0.005-0.008 % by weight, the silver of 0.001-0.002 % by weight, 0.0005-0.001 % by weight, the iron of 0.004-0.006 % by weight, the silicon of 0.0005-0.0012 % by weight and the antimony of 0.001-0.002 % by weight and the tantalum of 0.001-0.002 % by weight;
(2) first time rolling: after above-mentioned raw materials melting, carry out first time rolling to it, the ni substrate of this first time rolling gained is foil-like, and its thickness is 3-5 millimeter;
(3) first time thermal annealing, the ni substrate paillon foil of step (2) gained carries out first time thermal annealing, and annealing temperature is 650-800 DEG C, and annealing time is 60 minutes;
(4) second time rolling, carries out second time rolling to the ni substrate paillon foil of step (3) gained, and obtain the less paillon foil of thickness after second time rolling, its thickness is 1-2 millimeter;
(5) second time thermal annealing, the ni substrate paillon foil of step (4) gained is carried out second time thermal annealing, and annealing temperature is 650-800 DEG C, and annealing time is 40 minutes;
(6) ni substrate of step (5) gained is fitted to purity be 99.999% copper base on carry out third time rolling, form the composite base plate paillon foil that thickness is 200-300 micron after rolling;
(7) third time thermal annealing, the composite base plate paillon foil of step (6) gained is carried out third time thermal annealing, and annealing temperature is 700-800 DEG C, and annealing time is 30 minutes;
(8) according to Tetragonal lead zirconate titanate PbZr
1-xti
xo
3molar ratio be configured lead oxide PbO, zirconium dioxide ZrO
2with titanium dioxide TiO
2powder is calcined, thus sinters PZT target into, and wherein x value is: 0<x<1, and preferred x is 0.05≤x≤0.85; Wherein calcining heat is 950 DEG C-1200 DEG C, and calcination time is 2.5-3 hour;
(9) in magnetron sputtering reative cell, utilize radio frequency magnetron sputtering method, PZT target as sputter is deposited on the composite base plate paillon foil of step (7) gained in inert gas environment; Thus form PbZr
1-xti
xo
3dielectric layer; The thickness of this dielectric layer is 1-5 micron, preferably 2 microns;
(10) in magnetron sputtering reative cell, utilize radio frequency magnetron sputtering method, thus form electrode layer, the thickness of this electrode layer is 100-200 micron, preferably 120 microns in inert gas environment by metal material sputtering sedimentation on said dielectric layer;
Wherein, in step (9) and (10), the vacuum degree of rf magnetron sputtering reative cell is all 10
-5pascal; And in step (9), the radio-frequency power of rf magnetron sputtering is 150-200W, sputtering time is 60 minutes; In step (10), the radio-frequency power 100-150W of rf magnetron sputtering, sputtering time is 120 minutes.
Accompanying drawing explanation
The structural representation with the film capacitor of composite base plate of Fig. 1 obtained by the manufacture method that proposes for the present invention.
Embodiment
Below by embodiment, the present invention is described in detail.
Embodiment 1:
See Fig. 1, the manufacture method with the film capacitor of composite base plate in turn includes the following steps:
(1) raw material of following proportioning is prepared: be more than or equal to the nickel of 99.98 % by weight.All the other 0.02 % by weight are plurality of impurities.Described plurality of impurities comprises: the manganese of 0.0005-0.0008 % by weight, the chromium of the aluminium of 0.005-0.008 % by weight, the silver of 0.001-0.002 % by weight, 0.0005-0.001 % by weight, the iron of 0.004-0.006 % by weight, the silicon of 0.0005-0.0012 % by weight and the antimony of 0.001-0.002 % by weight and the tantalum of 0.001-0.002 % by weight;
(2) first time rolling: after above-mentioned raw materials melting, carry out first time rolling to it, the ni substrate of this first time rolling gained is foil-like, and its thickness is 3-5 millimeter;
(3) first time thermal annealing, the ni substrate paillon foil of step (2) gained carries out first time thermal annealing, and annealing temperature is 650-800 DEG C, and annealing time is 60 minutes;
(4) second time rolling, carries out second time rolling to the ni substrate paillon foil of step (3) gained, and obtain the less paillon foil of thickness after second time rolling, its thickness is 1-2 millimeter;
(5) second time thermal annealing, the ni substrate paillon foil of step (4) gained is carried out second time thermal annealing, and annealing temperature is 650-800 DEG C, and annealing time is 40 minutes;
(6) ni substrate of step (5) gained is fitted to purity be 99.999% copper base on carry out third time rolling, form the composite base plate paillon foil that thickness is 200-300 micron after rolling;
(7) third time thermal annealing, the composite base plate paillon foil of step (6) gained is carried out third time thermal annealing, and annealing temperature is 700-800 DEG C, and annealing time is 30 minutes;
(8) according to Tetragonal lead zirconate titanate PbZr
1-xti
xo
3molar ratio be configured lead oxide PbO, zirconium dioxide ZrO
2with titanium dioxide TiO
2powder is calcined, thus sinters PZT target into, and wherein x value is: 0<x<1, and preferred x is 0.05≤x≤0.85; Wherein calcining heat is 950 DEG C-1200 DEG C, and calcination time is 2.5-3 hour;
(9) in magnetron sputtering reative cell, utilize radio frequency magnetron sputtering method, PZT target as sputter is deposited on the composite base plate paillon foil of step (7) gained in inert gas environment; Thus form PbZr
1-xti
xo
3dielectric layer; The thickness of this dielectric layer is 1-5 micron, preferably 2 microns;
(10) in magnetron sputtering reative cell, utilize radio frequency magnetron sputtering method, thus form electrode layer, the thickness of this electrode layer is 100-200 micron, preferably 120 microns in inert gas environment by metal material sputtering sedimentation on said dielectric layer;
Wherein, in step (9) and (10), the vacuum degree of rf magnetron sputtering reative cell is all 10
-5pascal; And in step (9), the radio-frequency power of rf magnetron sputtering is 150-200W, sputtering time is 60 minutes; In step (10), the radio-frequency power 100-150W of rf magnetron sputtering, sputtering time is 120 minutes.
It should be noted that, in the composite base plate for thin-film capacitor that the present invention proposes, do not limit the thickness proportion of copper base and ni substrate, various thickness proportion is all suitable (thickness proportion of such as copper base and ni substrate is 1:1,1:2,1:3,2:3 etc.), as long as this composite base plate is combined into by copper base and ni substrate.That is, as long as the thickness of composite base plate reaches requirement, it accounts for the percentage of composite base plate gross thickness respectively without the need to specifically limiting copper base and ni substrate, because those skilled in the art can distribute the thickness of copper base and ni substrate according to actual needs, to tackle various different occasion.
Embodiment 2:
See Fig. 1, the manufacture method with the film capacitor of composite base plate in turn includes the following steps:
(1) raw material of following proportioning is prepared: be more than or equal to the nickel of 99.98 % by weight.All the other 0.02 % by weight are plurality of impurities.Described plurality of impurities comprises: the manganese of 0.0005-0.0008 % by weight, the chromium of the aluminium of 0.005-0.008 % by weight, the silver of 0.001-0.002 % by weight, 0.0005-0.001 % by weight, the iron of 0.004-0.006 % by weight, the silicon of 0.0005-0.0012 % by weight and the antimony of 0.001-0.002 % by weight and the tantalum of 0.001-0.002 % by weight;
(2) first time rolling: after above-mentioned raw materials melting, carry out first time rolling to it, the ni substrate of this first time rolling gained is foil-like, and its thickness is 4 millimeters;
(3) first time thermal annealing, the ni substrate paillon foil of step (2) gained carries out first time thermal annealing, and annealing temperature is 700 DEG C, and annealing time is 60 minutes;
(4) second time rolling, carries out second time rolling to the ni substrate paillon foil of step (3) gained, and obtain the less paillon foil of thickness after second time rolling, its thickness is 1.8 millimeters;
(5) second time thermal annealing, the ni substrate paillon foil of step (4) gained is carried out second time thermal annealing, and annealing temperature is 700 DEG C, and annealing time is 40 minutes;
(6) ni substrate of step (5) gained is fitted to purity be 99.999% copper base on carry out third time rolling, form the composite base plate paillon foil that thickness is 240 microns after rolling;
(7) third time thermal annealing, the composite base plate paillon foil of step (6) gained is carried out third time thermal annealing, and annealing temperature is 750 DEG C, and annealing time is 30 minutes;
(8) according to Tetragonal lead zirconate titanate PbZr
1-xti
xo
3molar ratio be configured lead oxide PbO, zirconium dioxide ZrO
2with titanium dioxide TiO
2powder is calcined, thus sinters PZT target into, and wherein x value is: 0<x<1, and preferred x is 0.05≤x≤0.85; Wherein calcining heat is 1100 DEG C, and calcination time is 160 minutes;
(9) in magnetron sputtering reative cell, utilize radio frequency magnetron sputtering method, PZT target as sputter is deposited on the composite base plate paillon foil of step (7) gained in inert gas environment; Thus form PbZr
1-xti
xo
3dielectric layer; The thickness of this dielectric layer is 1-5 micron, preferably 2 microns;
(10) in magnetron sputtering reative cell, utilize radio frequency magnetron sputtering method, thus form electrode layer, the thickness of this electrode layer is 100-200 micron, preferably 120 microns in inert gas environment by metal material sputtering sedimentation on said dielectric layer;
Wherein, in step (9) and (10), the vacuum degree of rf magnetron sputtering reative cell is all 10
-5pascal; And in step (9), the radio-frequency power of rf magnetron sputtering is 150-200W, sputtering time is 60 minutes; In step (10), the radio-frequency power 100-150W of rf magnetron sputtering, sputtering time is 120 minutes.
Above execution mode is to invention has been detailed introduction, but above-mentioned execution mode is not intended to limit scope of the present invention, and protection scope of the present invention is defined by the appended claims.
Claims (2)
1. there is a manufacture method for the film capacitor of composite base plate, in turn include the following steps:
(1) raw material of following proportioning is prepared: be more than or equal to the nickel of 99.98 % by weight, all the other are less than or equal to 0.02 % by weight for plurality of impurities, and described plurality of impurities comprises: the tantalum of the iron of the silver of the manganese of 0.0005-0.0008 % by weight, the aluminium of 0.005-0.008 % by weight, 0.001-0.002 % by weight, the chromium of 0.0005-0.001 % by weight, 0.004-0.006 % by weight, the silicon of 0.0005-0.0012 % by weight, the antimony of 0.001-0.002 % by weight and 0.001-0.002 % by weight;
(2) first time rolling: after above-mentioned raw materials melting, carry out first time rolling to it, the ni substrate of this first time rolling gained is foil-like, and its thickness is 3-5 millimeter;
(3) first time thermal annealing, the ni substrate paillon foil of step (2) gained carries out first time thermal annealing, and annealing temperature is 650-800 DEG C, and annealing time is 60 minutes;
(4) second time rolling, carries out second time rolling to the ni substrate paillon foil of step (3) gained, and obtain the less paillon foil of thickness after second time rolling, its thickness is 1-2 millimeter;
(5) second time thermal annealing, the ni substrate paillon foil of step (4) gained is carried out second time thermal annealing, and annealing temperature is 650-800 DEG C, and annealing time is 40 minutes;
(6) ni substrate of step (5) gained is fitted to purity be 99.999% copper base on carry out third time rolling, form the composite base plate paillon foil that thickness is 200-300 micron after rolling;
(7) third time thermal annealing, the composite base plate paillon foil of step (6) gained is carried out third time thermal annealing, and annealing temperature is 700-800 DEG C, and annealing time is 30 minutes;
(8) according to Tetragonal lead zirconate titanate PbZr
1-xti
xo
3molar ratio be configured lead oxide PbO
2, zirconium dioxide ZrO
2with titanium dioxide TiO
2powder is calcined, thus sinters PZT target into;
(9) in magnetron sputtering reative cell, utilize radio frequency magnetron sputtering method, PZT target as sputter is deposited on the composite base plate paillon foil of step (7) gained in inert gas environment; Thus form PbZr
1-xti
xo
3dielectric layer; The thickness of this dielectric layer is 1-5 micron;
(10) in magnetron sputtering reative cell, utilize radio frequency magnetron sputtering method, thus form electrode layer, the thickness of this electrode layer is 100-200 micron in inert gas environment by metal material sputtering sedimentation on said dielectric layer;
Wherein in step (8), x value is: 0.05≤x≤0.85; Wherein calcining heat is 950 DEG C-1200 DEG C, and calcination time is 2.5-3 hour.
2. there is the manufacture method of the film capacitor of composite base plate as claimed in claim 1, it is characterized in that:
Wherein, in step (9) and (10), the vacuum degree of rf magnetron sputtering reative cell is all 10
-5pascal; And in step (9), the radio-frequency power of rf magnetron sputtering is 150-200W, sputtering time is 60 minutes; In step (10), the radio-frequency power 100-150W of rf magnetron sputtering, sputtering time is 120 minutes.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310065917.5A CN103165284B (en) | 2013-03-01 | 2013-03-01 | A kind of manufacture method with the film capacitor of composite base plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310065917.5A CN103165284B (en) | 2013-03-01 | 2013-03-01 | A kind of manufacture method with the film capacitor of composite base plate |
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|---|---|
| CN103165284A CN103165284A (en) | 2013-06-19 |
| CN103165284B true CN103165284B (en) | 2016-02-17 |
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| CN110660584B (en) * | 2018-06-29 | 2023-06-27 | 浙江清华柔性电子技术研究院 | Preparation method of flexible energy storage film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1254934A (en) * | 1998-11-23 | 2000-05-31 | 微涂层技术公司 | Formation of thin-film capacitor |
| CN1974118A (en) * | 2005-11-28 | 2007-06-06 | 镇江鼎胜铝业有限公司 | Aluminium strip for capacitor shell |
| CN202218478U (en) * | 2011-08-30 | 2012-05-09 | 徐卓辉 | Composite metal connecting piece capable of being mounted on PCB |
| CN101047067B (en) * | 2006-03-30 | 2012-06-20 | Tdk株式会社 | Thin film capacitor and method of manufacturing the thin film capacitor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8414962B2 (en) * | 2005-10-28 | 2013-04-09 | The Penn State Research Foundation | Microcontact printed thin film capacitors |
-
2013
- 2013-03-01 CN CN201310065917.5A patent/CN103165284B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1254934A (en) * | 1998-11-23 | 2000-05-31 | 微涂层技术公司 | Formation of thin-film capacitor |
| CN1974118A (en) * | 2005-11-28 | 2007-06-06 | 镇江鼎胜铝业有限公司 | Aluminium strip for capacitor shell |
| CN101047067B (en) * | 2006-03-30 | 2012-06-20 | Tdk株式会社 | Thin film capacitor and method of manufacturing the thin film capacitor |
| CN202218478U (en) * | 2011-08-30 | 2012-05-09 | 徐卓辉 | Composite metal connecting piece capable of being mounted on PCB |
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| CN103165284A (en) | 2013-06-19 |
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Effective date of registration: 20241018 Address after: Chishan town (Shangli Industrial Park), Shangli County, Pingxiang City, Jiangxi Province Patentee after: Pingxiang Qilong New Material Technology Co.,Ltd. Country or region after: China Address before: 233000 Room 102 north, No.11, No.2 building, liukm Huayuan commercial building, Changqing Township, Yuhui District, Bengbu City, Anhui Province Patentee before: Anhui Licha Information Technology Co.,Ltd. Country or region before: China |