CN102937594B - Defect detecting system and method - Google Patents
Defect detecting system and method Download PDFInfo
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- CN102937594B CN102937594B CN201210432399.1A CN201210432399A CN102937594B CN 102937594 B CN102937594 B CN 102937594B CN 201210432399 A CN201210432399 A CN 201210432399A CN 102937594 B CN102937594 B CN 102937594B
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Abstract
The invention relates to the field of semiconductor fabrication and particularly relates to a defect detecting system and a method. According to the defect detecting system and the method, servers for performing defect data processing on each process device are integrated into a high-performance data base concentration server, so that defect information data processing speeds are greatly increased, a chip can enter a corresponding next process according to defect conditions after the chip is subjected to defect detecting, waiting time of the chip in a defect detection device is effectively reduced, efficiencies of the defect detecting process are greatly improved, the probability that wafers produce new defects is reduced, yield of products is increased, and production costs are reduced.
Description
Technical field
The present invention relates to field of semiconductor manufacture, particularly relate to a kind of defect detecting system and method.
Background technology
Along with the integrated level of semi-conductor chip improves constantly, integrated circuit (IC) design develops into the integrated of logic gate from the integrated of transistor, develops into again the integrated of IP now, makes the integrated level of chip more and more higher, and then causes the distribution of the circuit on chip to become increasingly complex.The circuit distribution of chip is more complicated, defect in chip manufacturing proces will be larger to the function effect of whole chip, even some defect can cause the breaking-up completely of whole chip, think the defect that can find chip timely, to prevent a large amount of generations of bad chip, corresponding defect detection equipment generally can be configured in prior art on a production line to carry out defects detection technique to chip.
At present, the principle in defects detection technique is by first being projected by light beam after on chip, utilizes detector to accept the light signal of reflection and/or scattering, then the light signal accepted is converted into the datagraphic of different bright dark distribution; As illustrated by figures 1 a-1 c, optical signal launcher is first adopted to launch sensed light signal to the figure under die circuit features 1(optical microscope) on, then utilize detector to accept die circuit features 1 to reflect and/or the light signal figure 2 of bounce back, again light signal figure 2 is converted to gray-scale graphical 3 afterwards, finally again the gray-scale graphical data of adjacent chips group are compared, to determine the particular location of defect on chip.
But, in the production technology of reality, when the defects count in detection chip is greater than some, the server that checkout equipment is arranged will be serious to the processing speed of data the speed lagging behind signals collecting, and then cause detection chip needs to stop long time in the cavity of checkout equipment, after waiting for that the process of defective data completes, just can carry out next step technique.
As shown in Figure 2, first, the wafer after process equipment is placed in the cavity of checkout equipment, to carry out defects detection technique to it; Then, the information of this wafer detected can be generated defective data by checkout equipment, and be sent in server and carry out data processing, if the quantity of information of this defective data is larger, server will need the regular hour to carry out analyzing and processing to this defective data, because next step technique of wafer sets the result that defective data processes according to server, so this wafer just needs to rest on completing of waiting for server process data in the cavity of checkout equipment; Finally, export defect report after the complete defective data of server process, according to this defect report, system judges whether the defective value of this wafer meets technological requirement, if meet technological requirement, then automatically carry out next processing step, otherwise, be then responsible for the further analyzing and processing of this wafer by slip-stick artist; Because wafer can stay for some time when carrying out defects detection in the cavity of checkout equipment, the detection efficiency of checkout equipment will be reduced like this, and wafer rests in the cavity of checkout equipment and also can increase the probability that wafer produces new defect, reduce further the yield of product, increase production cost.
Summary of the invention
For above-mentioned Problems existing, present invention is disclosed a kind of defect detecting system and method, mainly carrying out the technique of defects detection by presetting chip circuit density profile.
The object of the invention is to be achieved through the following technical solutions:
A kind of defect detecting system, is applied on chip production line, comprises multiple process equipment, each described process equipment is provided with pick-up unit, wherein, also comprise a centralized database server, each described pick-up unit is all connected with described centralized database server.
Above-mentioned defect detecting system, wherein, described chip production line is provided with system judge module, described system judge module is connected with described centralized database server.
A kind of defect inspection method, comprises above-mentioned defect detecting system, wherein,
Multiple chip is placed into respectively after carrying out PROCESS FOR TREATMENT in corresponding process equipment, and the utilization pick-up unit be arranged on process equipment detects the defect situation on each chip after this process equipment, and the corresponding defect information generating each chip;
Judge whether corresponding chip after treatment meets process requirements according to described defect information; If meet, then continue next processing step; If do not meet, then carry out slip-stick artist's treatment process.
By system judge module, above-mentioned defect inspection method, wherein, judges whether chip meets process requirements.
Above-mentioned defect inspection method, wherein, described system module, by comparing to the chip information data of adjacent chips group, judges whether chip meets process requirements.
In sum, a kind of defect detecting system of the present invention and method, by by the Server Consolidation each process equipment carrying out defective data process being the centralized database server of a superior performance, thus substantially increase the speed of defect information data processing, chip can enter next step technique corresponding according to defect situation immediately after carrying out defects detection, effectively reduce the stand-by period of chip in defect detection equipment, while improve the efficiency of defects detection technique greatly, also reduce the probability that wafer produces new defect, improve the yield of product, reduce production cost.
Accompanying drawing explanation
Fig. 1 a-1c is the schematic diagram in background technology of the present invention, the optical picture of circuit being converted to data gray-scale graphical;
Fig. 2 is the schematic flow sheet of defect inspection method in background technology of the present invention;
Fig. 3 is the structural representation of defect detecting system in the embodiment of the present invention one;
Fig. 4 is the schematic flow sheet of defect inspection method in the embodiment of the present invention two.
embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is further described:
Embodiment one:
Fig. 3 is the structural representation of defect detecting system in the embodiment of the present invention one; As shown in Figure 3, a kind of defect detecting system of the present invention, be applied in wafer production line, comprise multiple process equipment carrying out wafer production, each process equipment is provided with pick-up unit, and multiple pick-up unit all communicates to connect with a database centralized servers, the wafer defect information generated with receiving detection device, and after this defect information is compared, control wafer in pick-up unit by system judge module and carry out next step technique corresponding.
Concrete, multiple wafer is placed into respectively after carrying out PROCESS FOR TREATMENT in multiple process equipment, the pick-up unit that each process equipment is arranged detects the defect situation on the wafer after this process equipment, as passed through light characterization processes, change the optical imagery dress on wafer into data image feature, with production defect information, and the defect information of corresponding wafer that each pick-up unit is all generated is sent to centralized database server; This centralized database server carries out analyzing and processing to the defect information of each wafer, compare as the data message of collection carried out adjacent wafers information on same row or column, generate the defect report of each wafer, and this defect report is sent to system judge module judges, if meet process requirements, then subsequent technique is continued, if do not meet process requirements to this wafer, then enter slip-stick artist's treatment process, eliminate the defect etc. on this wafer by manual operation.
Embodiment two:
Fig. 4 is the schematic flow sheet of defect inspection method in the embodiment of the present invention two; As shown in Figure 4, on the basis of embodiment one, a kind of defect inspection method of the present invention, be applied in wafer production line, first, multiple wafer is placed in multiple process equipment respectively and carries out PROCESS FOR TREATMENT, and by being arranged on the pick-up unit that technique is arranged, and generate defects detection information, and this defect information is sent to centralized database server.
Secondly, centralized database server, according to the defect information of all wafers received, adjacent wafers information is compared by same row or column, generates the defect report of each wafer, and this defect report is sent to system judge module judges.
Finally, system judge module is according to the wafer parameters preset within it, judge whether each wafer meets process requirements, if meet process requirements, then subsequent technique is continued to this wafer, if do not meet process requirements, then enter slip-stick artist's treatment process, eliminate the defect etc. on this wafer by manual operation.
Wherein, the technique that the wafer parameters preset in system judge module carries out according to process equipment and original wafer setting parameter.
In sum, owing to have employed technique scheme, the embodiment of the present invention proposes a kind of defect detecting system and method, by by the Server Consolidation each process equipment carrying out defective data process being the centralized database server of a superior performance, thus substantially increase the speed of defect information data processing, chip can enter next step technique corresponding according to defect situation immediately after carrying out defects detection, effectively reduce the stand-by period of chip in defect detection equipment, while improve the efficiency of defects detection technique greatly, also reduce the probability that wafer produces new defect, improve the yield of product, reduce production cost.
By illustrating and accompanying drawing, giving the exemplary embodiments of the ad hoc structure of embodiment, based on the present invention's spirit, also can do other conversion.Although foregoing invention proposes existing preferred embodiment, but these contents are not as limitation.
For a person skilled in the art, after reading above-mentioned explanation, various changes and modifications undoubtedly will be apparent.Therefore, appending claims should regard the whole change and correction of containing true intention of the present invention and scope as.In Claims scope, the scope of any and all equivalences and content, all should think and still belong to the intent and scope of the invention.
Claims (5)
1. a defect detecting system, be applied on chip production line, comprise multiple process equipment, each described process equipment is provided with pick-up unit, it is characterized in that, also comprise a centralized database server, each described pick-up unit is all connected with described centralized database server, described centralized database server receives the chip defect information that described pick-up unit generates, and compares to this defect information.
2. defect detecting system according to claim 1, is characterized in that, described chip production line is provided with system judge module, and described system judge module is connected with described centralized database server.
3. a defect inspection method, comprises as the defect detecting system in claim 1 or 2, it is characterized in that,
Multiple chip is placed into respectively after carrying out PROCESS FOR TREATMENT in corresponding process equipment, and the utilization pick-up unit be arranged on process equipment detects the defect situation on each chip after this process equipment, and the corresponding defect information generating each chip;
Judge whether corresponding chip after treatment meets process requirements according to described defect information; If meet, then continue next processing step; If do not meet, then carry out slip-stick artist's treatment process.
4. defect inspection method according to claim 3, is characterized in that, judges whether chip meets process requirements by system judge module.
5. defect inspection method according to claim 4, is characterized in that, described system module, by comparing to the chip information data of adjacent chips group, judges whether chip meets process requirements.
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| CN201210432399.1A CN102937594B (en) | 2012-11-02 | 2012-11-02 | Defect detecting system and method |
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| CN102937594B true CN102937594B (en) | 2015-01-21 |
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| CN103196922B (en) * | 2013-04-09 | 2015-06-10 | 上海华力微电子有限公司 | Defect checking load counting system and method |
| CN103295930B (en) * | 2013-06-04 | 2017-07-07 | 上海华力微电子有限公司 | A kind of brilliant back of the body defect identification method rapidly and efficiently |
| CN103346105B (en) * | 2013-06-27 | 2015-09-30 | 上海华力微电子有限公司 | A kind of can according to the defect sampling observation method of technique wafer number load dynamic conditioning |
| CN103645692B (en) * | 2013-11-26 | 2016-04-27 | 上海华力微电子有限公司 | Wafer operation control system |
| CN105096021B (en) * | 2014-05-23 | 2019-06-04 | 中芯国际集成电路制造(上海)有限公司 | A kind of system and method for tracking semiconductor product Queue time |
| CN105204377A (en) * | 2014-06-18 | 2015-12-30 | 上海华力微电子有限公司 | Method for improving product standard |
| CN106898563B (en) * | 2015-12-18 | 2019-12-27 | 中芯国际集成电路制造(上海)有限公司 | Product acceptance system and product acceptance method |
| CN108802047A (en) * | 2018-06-05 | 2018-11-13 | 安徽得亿文教用品有限公司 | A kind of detecting system of pencil-lead transmission process |
| CN110646167A (en) * | 2019-09-20 | 2020-01-03 | 珠海京天世纪科技有限公司 | Printer selenium drum component detection method |
| CN112082760A (en) * | 2020-08-25 | 2020-12-15 | 耒阳金悦科技发展有限公司 | Bearing detection method for compression mechanism |
| CN115358914B (en) * | 2022-10-20 | 2023-01-20 | 深圳市壹倍科技有限公司 | Data processing method and device for visual detection, computer equipment and medium |
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