CN102623623A - Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber - Google Patents
Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber Download PDFInfo
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- CN102623623A CN102623623A CN2012100814778A CN201210081477A CN102623623A CN 102623623 A CN102623623 A CN 102623623A CN 2012100814778 A CN2012100814778 A CN 2012100814778A CN 201210081477 A CN201210081477 A CN 201210081477A CN 102623623 A CN102623623 A CN 102623623A
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- Prior art keywords
- flexible glue
- transparent
- type led
- inner core
- bowl cup
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The invention discloses a surface-mounted type LED (light-emitting diode) device with an inner core protected by flexible rubber. The surface-mounted type LED device comprises injection plastic-rubber, transparent flexible rubber, transparent hard rubber, an LED wafer, a conductive wire, and binding glue. The surface-mounted type LED device with the inner core protected by flexible rubber is characterized in that the injection plastic-rubber wraps part of a metal conductive wire frame; a light-condensing cup is arranged in a plastic-rubber body, and part of the metal conductive wire frame is exposed on the bottom of the cup; the LED wafer is installed on the metal conductive wire frame on the bottom of the light-condensing cup; one end of the conductive wire is connected with an electrode point of the LED wafer, and the other end of the conductive wire is connected with an electrode point on the metal conductive wire frame; the transparent flexible rubber is arranged in a cup interior space above the bottom in the light-condensing cup; and the transparent hard rubber is covered above the transparent flexible rubber and adequately bounded with the injection plastic-rubber. A plurality of step planes are arranged on the inner wall of the light-condensing cup. With the adoption of the surface-mounted type LED device with the inner core protected by flexible rubber disclosed by the invention, the problem that the conductive wire connected with the LED wafer in the previous LED device is easy to fall off is effectively solved; and the interior combination of the surface-mounted type LED device is more compact and firmer, and the surface-mounted type LED device is durable.
Description
Technical field
The present invention relates to the paster LED technical field, particularly a kind of surface-adhered type LED matrix of flexible glue protection inner core.
Background technology
Existing paster class LED resistance to elevated temperatures is poor; Because of injection moulding plastic cement and transparent filler are the bondings of face and face; It is different that they belong to the cold and hot shrinkage ratio of inhomogeneity material again; Binding site cracking segregation phenomenon will appear in the binding site stress difference of using injection moulding plastic cement, transparent filler, conductive silver glue, gold solder point and conductive metal frames under the adverse circumstances out of doors of a specified duration, causes problems such as paster apparatus inside led circuit broken string, water inlet.
Summary of the invention
In order to overcome the defective that above-mentioned prior art exists, the present invention provides a kind of surface-adhered type LED matrix of flexible glue protection inner core, efficiently solves the phenomenon that occurs coming off owing to the plain conductor binding site, and the structure secure is durable in use.
To achieve these goals, technical scheme of the present invention is following:
A kind of surface-adhered type LED matrix of flexible glue protection inner core; Comprise conductive metal frames, injection moulding plastic cement, transparent ebonite, LED wafer, bonder and lead; Be characterized in that said injection moulding plastic cement wrapping portion conductive metal frames is provided with the convergent bowl cup in the said injection moulding plastic body; Bowl cup bottom exposes the part metals lead frame is arranged; Said LED wafer is bonded on the exposed conductive metal frames in convergent bowl cup bottom through bonder, and said lead one end connects the electrode points of LED wafer, and the other end connects the electrode points on the conductive metal frames.
Be characterized in; Also comprise transparent flexible glue; Said transparent flexible glue is arranged in the interior space of bowl cup of convergent bowl cup inner bottom part top, fills in the convergent bowl cup and the space between LED wafer, bonder and the lead, and said transparent ebonite covers transparent flexible glue top and well-bonded with the injection moulding plastic cement.
Further, said convergent bowl cup inwall is provided with a plurality of cascaded surfaces, angle 0-360 degree in two adjacent cascaded surfaces are mutually arbitrarily on the said convergent bowl cup inwall, and the angle of angle is not necessarily identical between the different cascaded surfaces.
The effect that above-mentioned inwall is arranged to cascaded surface is: can prevent that transparent flexible glue from lying prone glue to a bowl rim of a cup position; Make the transparent flexible glue upper surface in the bowl cup certain distance arranged with the bowl rim of a cup; The top has the inwall of certain altitude not have the transparency protected flexible glue of bonding in the bowl cup simultaneously; The transparency protected ebonite that conveniently covers transparent flexible glue top is well-bonded with the cascaded surface of bowl cup inwall, and the lead difficult drop-off that transparent flexible glue can protect the LED wafer to link to each other.
Further, the hardness number of said transparent flexible glue is in Shao's 0-100 formula A scope.
The hardness number of said transparent ebonite is in Shao's 0-100 formula D scope.
The transparent flexible glue height that is higher than bowl cup baseplane in the said convergent bowl cup is in the 0-100mm scope, and the lead that can effectively wrap up the LED wafer and link to each other prevents to pull and impaired through stress.
Further, the transparent ebonite profile above the said transparent flexible glue is drawing pin bodies, bamboo hat bodies, mushroom shaped body, the irregular umbrella bodies in outer width of cloth shirt rim, cylinder form body, trapezoidal cylinder or ladder post shapes body.
Angle was the 0-360 degree in the conductive metal frames plane of the conductive metal frames plane of said convergent bowl cup inner bottom part and injection moulding plastic cement lateral surface was mutually; Behind quadric injection mould, the conductive metal frames part-structure of plastic cement lateral surface is wrapped in the injection moulding plastic body.
Said transparent ebonite covers above the transparent flexible glue, and said transparent ebonite is silica gel, epoxy resin or silicones, and transparent flexible glue is silica gel, epoxy resin or silicones etc.
Said injection moulding plastic cement color can be dark color, mainly outstanding black, navy blue, dark brown etc.; Further injection moulding plastic cement color also can be a light tone, mainly outstanding pure white, silvery white, silver gray etc.; Further injection moulding plastic cement color can also be dark cover light tone again, is light tone like the convergent bowl cup inwall in the plastic body, and plastic cement outer surface color is dark.
The invention has the beneficial effects as follows; Fill the lead difficult drop-off that flexible glue protection LED wafer connects; Through the convergent bowl cup inwall is set cascaded surface is set; Efficiently solve the transparent flexible glue glue of lying prone and cause ebonite and convergent bowl cup inwall untight problem that bonds to a bowl rim of a cup position, make this LED paster apparatus structure secure, durable in use.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention one.
Fig. 2 is for implementing not fill in one the structural representation of transparent flexible glue.
Fig. 3 is the structural representation of the embodiment of the invention two.
Fig. 4 is not for filling the structural representation of transparent adhesive tape in the embodiment of the invention three.
Fig. 5 is the structural representation of embodiment three.
Fig. 6 is the another kind of structural representation of figure spike for ebonite profile among the embodiment three.
Among the figure, 01, the injection moulding plastic cement, 02, conductive metal frames, 03, conductive metal frames; 04, injection moulding plastic cement, 05, transparent flexible glue, 06, transparent ebonite, 07, the LED wafer; 08, lead, 09, bonder, 10, cascaded surface, 11, the transparent ebonite body of drawing pin shape; 12, the transparent ebonite body of bar shape, 13, the transparent ebonite body of profile bamboo hat shape body, 14, the convergent bowl cup, 15, convergent bowl cup inwall.
Embodiment:
Be easy to understand understanding in order to make creation characteristic of the present invention, technological means and to reach purpose, further set forth the present invention below in conjunction with specific embodiment.
Embodiment one:
Referring to Fig. 1 and Fig. 2; A kind of surface-adhered type LED matrix of flexible glue protection inner core; Comprise that conductive metal frames 02 and 03, injection moulding plastic cement 01, side are the transparent ebonite body of step-like bar shape 12, LED wafer 07, bonder 09 and lead 08; Injection moulding plastic cement 01 coated metal lead frame 02; In the said injection moulding plastic cement 01 convergent bowl cup 14 is set, convergent bowl cup 14 bottoms expose has part metals lead frame 02, and said LED wafer 07 is bonded on the exposed conductive metal frames 02 in convergent bowl cup 14 bottoms through bonder 09; Lead 08 1 ends connect the electrode points of LED wafer 07, and the other end connects the electrode points on the conductive metal frames 02.
Wherein, This design feature is that convergent bowl cup inwall 15 is provided with a plurality of cascaded surfaces 10; The lead 08 of filling transparent flexible glue 05 parcel LED wafer 07 in the convergent bowl cup 14 and linking to each other, the transparent ebonite 06 in the transparent ebonite body 12 of bar shape covers transparent flexible glue 05 top and well-bonded with injection moulding plastic cement 01.
This structural design can prevent effectively that transparent flexible glue 05 from lying prone glue to a bowl rim of a cup position; Make transparent flexible glue 05 upper surface in the bowl cup certain distance arranged with the bowl rim of a cup; The top has the inwall of certain altitude not have the transparent flexible glue 05 of bonding in the bowl cup simultaneously; The cascaded surface 10 of transparent ebonite 06 and convergent bowl cup inwall 15 that conveniently covers transparent flexible glue top is well-bonded, and lead 08 difficult drop-off that transparent flexible glue 05 can protect LED wafer 07 to link to each other.
Embodiment two:
Referring to Fig. 3, a kind of surface-adhered type LED matrix of flexible glue protection inner core comprises conductive metal frames 02 and 03, injection moulding plastic cement 01, transparent ebonite 06, transparent flexible glue 05, LED wafer 07, bonder 09, lead 08 and the transparent ebonite body 13 of profile bamboo hat shape body.
With the difference of embodiment one be; Convergent bowl cup 14 inwalls are trapezoidal faces; In the trapezoidal faces inner space, fill transparent flexible glue 05, be used to wrap up LED wafer 07 and lead 08, the transparent ebonite body 13 of profile bamboo hat shape body is covered in transparent flexible glue 05 top and well-bonded with injection moulding plastic cement 01.
Embodiment three:
Referring to Fig. 4 and Fig. 5; Mounted type LED matrix shown in this embodiment and embodiment one are roughly the same; Also be to comprise that conductive metal frames 02 and 03, injection moulding plastic cement 01, side are the transparent ebonite body of step-like bar shape 12, LED wafer 07, bonder 09 and lead 08; Convergent bowl cup 14 is moulded in injection moulding; Convergent bowl cup inwall 15 is provided with a plurality of cascaded surfaces 10, the lead 08 of filling transparent flexible glue 05 parcel LED wafer 07 in the convergent bowl cup 14 and linking to each other, and the transparent ebonite 06 in the transparent ebonite body 12 of bar shape covers transparent flexible glue 05 top and well-bonded with injection moulding plastic cement 01.
The difference of structure shown in this embodiment three and embodiment one is an injection moulding plastic cement structure; Comprise injection moulding plastic cement 01 and injection moulding plastic cement 04, promptly conductive metal frames 03 has in part is wrapped in by the injection moulding plastic cement 04 in the outside, and effect is: the metallic conduction face of LED lateral surface is exposed still less; Thereby fluid sealant can have a lot of contact-making surfaces and LED tight bond to reach higher protective during the product treatment waterproof that this LED of usefulness makes; Especially LED display aspect, not only can obtain higher water resistance can also have more space to give the sunshade face shield, makes the thickness thicker of sunshade face shield; The sunshade face shield can not arch upward because of temperature distortion under the environment of high temperature out of doors; The outer surface evenness that has guaranteed LED display is higher, and the led light source rising angle is unaffected, obtains more perfectly display effect.
Referring to Fig. 6, structure shown in this figure and embodiment three differences are, what the ebonite body structure adopted is the transparent ebonite body 11 of drawing pin shape, the transparent ebonite body 12 of bar shape before having replaced, all the other structures all with enforcement in three identical.
Adopt the advantage of the transparent ebonite body 11 of drawing pin shape to be: the light refraction angle is openr, and brightness is higher in the LED optimum physical angle.
More than show and described basic principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; The present invention also has various changes and modifications under the prerequisite that does not break away from spirit and scope of the invention, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.
Claims (8)
1. the surface-adhered type LED matrix of a flexible glue protection inner core comprises conductive metal frames, injection moulding plastic cement, transparent ebonite, LED wafer, bonder and lead, said injection moulding plastic cement wrapping portion conductive metal frames; In the said injection moulding plastic body convergent bowl cup is set; Convergent bowl cup bottom exposes the part metals lead frame is arranged, and said LED wafer is bonded on the exposed conductive metal frames in convergent bowl cup bottom through bonder, and said lead one end connects the electrode points of LED wafer; The other end connects the electrode points on the conductive metal frames; It is characterized in that, also comprise transparent flexible glue, said transparent flexible glue is arranged in the interior space of bowl cup of convergent bowl cup inner bottom part top; Fill in the convergent bowl cup and the space between LED wafer, bonder and the lead, said transparent ebonite covers transparent flexible glue top and well-bonded with the injection moulding plastic cement.
2. the surface-adhered type LED matrix of a kind of flexible glue protection inner core according to claim 1; It is characterized in that; Said convergent bowl cup inwall is provided with a plurality of cascaded surfaces, and angle was the 0-360 degree in two adjacent cascaded surfaces were mutually arbitrarily on the said convergent bowl cup inwall.
3. the surface-adhered type LED matrix of a kind of flexible glue protection inner core according to claim 1 is characterized in that the hardness number of said transparent flexible glue is in Shao's 0-100 formula A scope.
4. the surface-adhered type LED matrix of a kind of flexible glue protection inner core according to claim 1 is characterized in that the hardness number of said transparent ebonite is in Shao's 0-100 formula D scope.
5. the surface-adhered type LED matrix of a kind of flexible glue protection inner core according to claim 1 is characterized in that, the transparent flexible glue height that is higher than bowl cup baseplane in the said convergent bowl cup is in the 0-100mm scope.
6. the surface-adhered type LED matrix of a kind of flexible glue protection inner core according to claim 1; It is characterized in that the transparent ebonite profile of said transparent flexible glue top is drawing pin bodies, bamboo hat bodies, mushroom shaped body, the irregular umbrella bodies in outer width of cloth shirt rim, cylinder form body, trapezoidal cylinder or ladder post shapes body.
7. the surface-adhered type LED matrix of a kind of flexible glue protection inner core according to claim 1; It is characterized in that; Angle was in the 0-360 degree scope in the conductive metal frames plane of the conductive metal frames plane of said convergent bowl cup inner bottom part and injection moulding plastic cement lateral surface was mutually, and the conductive metal frames part-structure of said injection moulding plastic cement lateral surface is wrapped in the plastic body.
8. the surface-adhered type LED matrix of a kind of flexible glue protection inner core according to claim 1; It is characterized in that; Said transparent ebonite covers above the transparent flexible glue, and said transparent ebonite is silica gel, epoxy resin or silicones, and transparent flexible glue is silica gel, epoxy resin or silicones.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100814778A CN102623623A (en) | 2012-03-26 | 2012-03-26 | Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100814778A CN102623623A (en) | 2012-03-26 | 2012-03-26 | Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber |
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| Publication Number | Publication Date |
|---|---|
| CN102623623A true CN102623623A (en) | 2012-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100814778A Pending CN102623623A (en) | 2012-03-26 | 2012-03-26 | Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber |
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| CN (1) | CN102623623A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1380704A (en) * | 2001-04-09 | 2002-11-20 | 株式会社东芝 | Luminescent device |
| CN101015071A (en) * | 2004-09-10 | 2007-08-08 | 首尔半导体株式会社 | Light emitting diode package having multiple molding resins |
| CN101364629A (en) * | 2007-08-07 | 2009-02-11 | 斯坦雷电气株式会社 | Semiconductor light emitting apparatus |
| CN101867008A (en) * | 2010-05-17 | 2010-10-20 | 中山大学佛山研究院 | LED packaging module capable of releasing stress |
| CN201699012U (en) * | 2010-04-14 | 2011-01-05 | 盈胜科技股份有限公司 | Packaging structure of multi-layer array type light-emitting diode |
| CN102347430A (en) * | 2011-09-07 | 2012-02-08 | 李海涛 | Surface-mounted LED (Light-Emitting Diode) device |
| CN202474034U (en) * | 2012-03-26 | 2012-10-03 | 李海涛 | Surface-mounted LED (light emitting diode) device adopting flexible rubbers to protect inner core |
-
2012
- 2012-03-26 CN CN2012100814778A patent/CN102623623A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1380704A (en) * | 2001-04-09 | 2002-11-20 | 株式会社东芝 | Luminescent device |
| CN101015071A (en) * | 2004-09-10 | 2007-08-08 | 首尔半导体株式会社 | Light emitting diode package having multiple molding resins |
| CN101364629A (en) * | 2007-08-07 | 2009-02-11 | 斯坦雷电气株式会社 | Semiconductor light emitting apparatus |
| CN201699012U (en) * | 2010-04-14 | 2011-01-05 | 盈胜科技股份有限公司 | Packaging structure of multi-layer array type light-emitting diode |
| CN101867008A (en) * | 2010-05-17 | 2010-10-20 | 中山大学佛山研究院 | LED packaging module capable of releasing stress |
| CN102347430A (en) * | 2011-09-07 | 2012-02-08 | 李海涛 | Surface-mounted LED (Light-Emitting Diode) device |
| CN202474034U (en) * | 2012-03-26 | 2012-10-03 | 李海涛 | Surface-mounted LED (light emitting diode) device adopting flexible rubbers to protect inner core |
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Application publication date: 20120801 |
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