AU2001232914A1 - Process and apparatus for cleaning silicon wafers - Google Patents

Process and apparatus for cleaning silicon wafers

Info

Publication number
AU2001232914A1
AU2001232914A1 AU2001232914A AU3291401A AU2001232914A1 AU 2001232914 A1 AU2001232914 A1 AU 2001232914A1 AU 2001232914 A AU2001232914 A AU 2001232914A AU 3291401 A AU3291401 A AU 3291401A AU 2001232914 A1 AU2001232914 A1 AU 2001232914A1
Authority
AU
Australia
Prior art keywords
silicon wafers
cleaning silicon
cleaning
wafers
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001232914A
Inventor
Ted Albert Loxley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2001232914A1 publication Critical patent/AU2001232914A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AU2001232914A 2000-01-22 2001-01-19 Process and apparatus for cleaning silicon wafers Abandoned AU2001232914A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US49016200A 2000-01-22 2000-01-22
US09490162 2000-01-22
PCT/US2001/002119 WO2001054181A2 (en) 2000-01-22 2001-01-19 Process and apparatus for cleaning silicon wafers

Publications (1)

Publication Number Publication Date
AU2001232914A1 true AU2001232914A1 (en) 2001-07-31

Family

ID=23946860

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001232914A Abandoned AU2001232914A1 (en) 2000-01-22 2001-01-19 Process and apparatus for cleaning silicon wafers

Country Status (4)

Country Link
EP (1) EP1250712A2 (en)
JP (1) JP2003522406A (en)
AU (1) AU2001232914A1 (en)
WO (1) WO2001054181A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100672754B1 (en) * 2004-05-10 2007-01-22 주식회사 하이닉스반도체 Method for making semiconductor device having trench isolation
JP2006319282A (en) * 2005-05-16 2006-11-24 Fuji Electric Device Technology Co Ltd Manufacturing method of semiconductor device
CN109158373B (en) * 2018-11-09 2023-10-10 江苏德润光电科技有限公司 Intelligent belt cleaning device of polycrystalline silicon piece
CN111063609A (en) * 2019-12-18 2020-04-24 武汉百臻半导体科技有限公司 Semiconductor chip cleaning method
CN114670352B (en) * 2022-05-26 2022-08-12 广东高景太阳能科技有限公司 Real-time automatic control silicon wafer production method, system, medium and equipment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01255226A (en) * 1988-04-04 1989-10-12 Matsushita Electric Ind Co Ltd Substrate cleaning apparatus
JPH0382029A (en) * 1989-08-24 1991-04-08 Nec Corp Wet type treatment equipment
JP2920165B2 (en) * 1991-11-29 1999-07-19 エス・イー・エス株式会社 Overflow tank for single wafer cleaning
EP0567939A3 (en) * 1992-04-29 1993-12-15 Texas Instruments Inc Method of removing small particles from a surface
JP3036990B2 (en) * 1992-08-28 2000-04-24 広島日本電気株式会社 Semiconductor substrate cleaning equipment
JPH09120952A (en) * 1995-10-25 1997-05-06 Sony Corp Surface treatment method for wafer
JP2834097B2 (en) * 1996-09-03 1998-12-09 山口日本電気株式会社 Reticle cleaning equipment
US5887607A (en) * 1997-07-07 1999-03-30 Micron Technology, Inc. Wafer processing apparatus
JPH11288908A (en) * 1998-04-02 1999-10-19 Komatsu Ltd Method and device for cleaning semiconductor wafer and wafer cassette

Also Published As

Publication number Publication date
EP1250712A2 (en) 2002-10-23
JP2003522406A (en) 2003-07-22
WO2001054181A2 (en) 2001-07-26
WO2001054181A3 (en) 2002-01-03

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