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CC256XQFNEM

Dual-mode Bluetooth® CC2564 evaluation board

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CC256XQFNEM

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Overview

The CC256XQFNEM evaluation board contains the CC2564B device and is intended for evaluation and design purposes for the CC256x devices.

For a complete evaluation solution, the CC256XQFNEM board plugs directly into the TI hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and other MCUs. Moreover, a certified and royalty-free TI Bluetooth Stack is available for the MSP430 (CC256XMSPBTBLESW), TM4C12x MCUs (CC256XM4BTBLESW) and other MCUs (CC256XSTBTBLESW).

The CC256XQFNEM hardware design files (schematics, layout and BOM) are provided as a reference to aid in the implementation of the CC256x devices.

Features
  • CC2564B device (QFN package)
  • Bluetooth Specification v4.1
  • Dual Mode - Bluetooth & Bluetooth low energy
  • FCC, IC, CE certified
  • Class 1.5 Transmit Power (+12dBm)
  • High sensitivity (-93 dBm typ.)
  • UART Interface - Control and Data
  • PCM/I2S Interface - Voice and Audio
  • 4 Layer PCB design
  • 1.8 LDO (LP2985-18)
  • 3 Voltage level translators (SN74AVC4T774)
  • PCB antenna
  • EM connectors that plug directly into the TI hardware development kits:
    • MSP-EXP430F5529
    • MSP-EXP430F5438
    • DK-TM4C123G
    • DK-TM4C129X
  • COM connector
  • Certified and royalty-free TI Bluetooth Stack

  • 1 CC256x EM board with TI CC256x device with QFN package
  • 1 Jumper for MSP-EXP430F5438 board
  • 4 Jumpers for MSP-EXP430F5529 board
  • Experimenter boards sold separately

Wi-Fi products
CC2560 — Bluetooth® 4.0 with enhanced data rate (EDR) CC2564 — Bluetooth® 4.0 with Enhanced Data Rate (EDR), Low Energy (LE) and ANT CC2564MODA — Bluetooth® 4.1 with Basic Rate, enhanced data rate, Low Energy (LE) module with integrated antenna CC2564MODN — Bluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) module
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Evaluation board

CC256XQFNEM — Dual-mode Bluetooth® CC2564 evaluation board

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Certification

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

Supported products & hardware
Download options

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

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Latest version
Version: 5.20.00.00
Release date: 14 Apr 2021
open-in-new Release notes
open-in-new View all versions
Products
Wi-Fi products
CC2564 — Bluetooth® 4.0 with Enhanced Data Rate (EDR), Low Energy (LE) and ANT CC2564C — Bluetooth® 5.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) CC2564MODA — Bluetooth® 4.1 with Basic Rate, enhanced data rate, Low Energy (LE) module with integrated antenna CC2564MODN — Bluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) module
Hardware development
Evaluation board
BOOST-CC2564MODA — TMP107 temperature sensor daisy-chain BoosterPack™ plug-in module CC2564MODAEM — Dual-mode Bluetooth® CC2564 Module with Integrated Antenna Evaluation Board CC2564MODNEM — Dual-mode Bluetooth® CC2564 module evaluation board CC256XCQFN-EM — CC2564C Dual-Mode Bluetooth® Controller Evaluation Module CC256XQFNEM — Dual-mode Bluetooth® CC2564 evaluation board

Documentation

open-in-new CC2564MODN Module Certification Reports

Link to FCC, ISED, & Certification Reports

open-in-new CC2564MODA Module Certification Reports

Link to FCC, ISED, & Certification Reports

open-in-new CC2564MODNEM

Link to CC2564MODNEM Reference Only Certification Reports

open-in-new CC2564MODAEM

Link to CC2564MODAEM Reference Only Certification Reports

open-in-new CC256xQFNEM

Link to CC256xQFNEM Reference Only Certification Reports

open-in-new CC256xCQFN-EM

Link to CC256xCQFN-EM Reference Only Certification Reports

open-in-new BOOST-CC2564MODA

Link to BOOST-CC2564MODA Reference Only Certification Reports

Release Infomation

This page provides access to the Dual Mode BT certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.

What's new

  • Updated CE certification reports for CC2564 Modules
TI's Standard Terms and Conditions for Evaluation Items apply.

Design files

download CC256x Bluetooth Reference Design Design Files
TIDC065.ZIP (2429 KB)

Technical documentation

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Type Title Date
Application note DN035 -- Antenna Quick Guide (Rev. B) 09 Feb 2022
Certificate CC256xQFNEM EU Declaration of Conformity (DoC) (Rev. B) 02 Jan 2019
White paper Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 16 Oct 2017
Application note CC256XQFN PCB Guidelines (Rev. B) 28 Oct 2016
User guide CC256x Hardware Design Checklist (Rev. A) 28 Oct 2016
More literature Dual-mode Bluetooth CC256x solutions (Rev. C) 03 Feb 2016
User guide Dual-Mode Bluetooth CC2564 Evaluation Board User Guide 28 Dec 2015
User guide Dual-Mode Bluetooth CC2564 Evaluation Board Quick Start Guide 01 Oct 2015
User guide TI Dual-mode Bluetooth Stack on STM32F4 MCUs User Guide PDF | HTML 08 Jul 2015
User guide CC256xEM Bluetooth Adapter Kit Quick Start Guide 21 May 2015
User guide CC256xEM Bluetooth Adapter Kit User Guide 19 May 2015
White paper Three Flavors of Bluetooth: Which One to Choose? 25 Mar 2014
Application note AN058 -- Antenna Selection Guide (Rev. B) 06 Oct 2010

Related design resources

Hardware development

EVALUATION BOARD
CC2564MODNEM — Dual-mode Bluetooth® CC2564 module evaluation board
INTERFACE ADAPTER
CC256XSTBTBLESW — TI Dual-mode Bluetooth® Stack on STM32F4 MCUs

Software development

SOFTWARE DEVELOPMENT KIT (SDK)
TIBLUETOOTHSTACK-SDK — TI Dual-Mode Bluetooth® Stack
DRIVER OR LIBRARY
CC256XM4BTBLESW — TI dual-mode Bluetooth® stack on TM4C MCUs CC256XMSPBTBLESW — TI Dual-mode Bluetooth® stack on MSP430™ MCUs

Reference designs

REFERENCE DESIGN
CC256XEM-RD — CC256x Bluetooth® Reference Design

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

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