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LED, BGA, and QFN
Assembly and Inspection
Defect Inspection Examples
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NOT FOR DISTRIBUTION
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Where Are Defects Introduced?
Counterfeit*
Components
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Defects associated with paste application
Excess solder
Solder bridges
Insufficient solder
Solder Paste Application Defects
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Component Placement Defects
Defects associated with component placement
Misalignment
Polarity
Missing component
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Reflow Oven Defects
Defects associated with the reflow profile
Voiding
Bridging
Solder balls
Excess solder
Insufficient solder
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Statistical Process Control
Manufacturing process quality assurance.
Solder joint measurement data,collected during x-ray
test, can be statistically analyzed to identify
manufacturing drifts,trends and other relevant process
quality issues.
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BGA Head In Pillow Visual Inspection
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Thanks for your time!

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