Zhang et al., 2010 - Google Patents

Fast preparation of printable highly conductive polymer nanocomposites by thermal decomposition of silver carboxylate and sintering of silver nanoparticles

Zhang et al., 2010

Document ID
8496837720130245712
Author
Zhang R
Lin W
Moon K
Wong C
Publication year
Publication venue
ACS applied materials & interfaces

External Links

Snippet

We show the fast preparation of printable highly conductive polymer nanocomposites for future low-cost electronics. Highly conductive polymer nanocomposites, consisting of an epoxy resin, silver flakes, and incorporated silver nanoparticles, have been prepared by fast …
Continue reading at pubs.acs.org (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected

Similar Documents

Publication Publication Date Title
Zhang et al. Fast preparation of printable highly conductive polymer nanocomposites by thermal decomposition of silver carboxylate and sintering of silver nanoparticles
Kanzaki et al. Fabrication of conductive copper films on flexible polymer substrates by low-temperature sintering of composite Cu ink in air
Aradhana et al. A review on epoxy-based electrically conductive adhesives
Jiang et al. Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites
Chen et al. Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
Liu et al. Highly conductive Cu–Cu joint formation by low-temperature sintering of formic acid-treated Cu nanoparticles
Chang et al. Recoverable liquid metal paste with reversible rheological characteristic for electronics printing
TWI651149B (en) Metal bonding composition
Wu et al. Properties investigation on isotropical conductive adhesives filled with silver coated carbon nanotubes
Joo et al. A highly reliable copper nanowire/nanoparticle ink pattern with high conductivity on flexible substrate prepared via a flash light-sintering technique
Li et al. Printable and flexible copper–silver alloy electrodes with high conductivity and ultrahigh oxidation resistance
Vaseem et al. Robust design of a particle-free silver-organo-complex ink with high conductivity and inkjet stability for flexible electronics
Hwang et al. Intensive plasmonic flash light sintering of copper nanoinks using a band-pass light filter for highly electrically conductive electrodes in printed electronics
Suganuma et al. Low-temperature low-pressure die attach with hybrid silver particle paste
Ji et al. Ternary Ag/epoxy adhesive with excellent overall performance
JP4973830B2 (en) Conductive composition, conductive paste and conductive film
WO2020199638A1 (en) Multi-sized nanoparticle mixed metal film and manufacturing method therefor
TWI669722B (en) Silver paste and semiconductor device using the same
Zhang et al. PVP-mediated galvanic replacement synthesis of smart elliptic Cu–Ag nanoflakes for electrically conductive pastes
TW201013704A (en) Conductive inks and pastes
Shao et al. Facile synthesis of low temperature sintering Ag nanopaticles for printed flexible electronics
Kwon et al. Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs)
Meng et al. Interface modified flexible printed conductive films via Ag2O nanoparticle decorated Ag flake inks
JP7131908B2 (en) Metal-containing particles, connecting material, connected structure, and method for producing connected structure
JP2015082385A (en) Silver paste and semiconductor device made using the same, and method of producing silver paste