Zhou et al., 2003 - Google Patents

Three-dimensional kinematical analyses for surface grinding of large scale substrate

Zhou et al., 2003

Document ID
780857354575206782
Author
Zhou L
Shimizu J
Shinohara K
Eda H
Publication year
Publication venue
Precision Engineering

External Links

Snippet

Sponsored by New Energy and Industrial Technology Development Organization (NEDO) and the Ministry of Education, Science and Culture (MESC) of Japan, this project has developed an advanced machining system for∅ 300mm silicon wafer, using fixed abrasive …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports

Similar Documents

Publication Publication Date Title
Zhou et al. Three-dimensional kinematical analyses for surface grinding of large scale substrate
Guo et al. Ultrasonic vibration assisted grinding of hard and brittle linear micro-structured surfaces
Brinksmeier et al. Ultra-precision grinding
Dong et al. Study on removal mechanism and removal characters for SiC and fused silica by fixed abrasive diamond pellets
Bingham et al. Novel automated process for aspheric surfaces
Wang et al. Ultra-precision machining of Fresnel microstructure on die steel using single crystal diamond tool
Guo et al. Finishing of rectangular microfeatures by localized vibration-assisted magnetic abrasive polishing method
Arif et al. An experimental investigation into micro ball end-milling of silicon
Suzuki et al. Precision grinding of structured ceramic molds by diamond wheel trued with alloy metal
Riemer Advances in ultra precision manufacturing
Chen et al. Three-dimensional modelling and simulation of vibration marks on surface generation in ultra-precision grinding
Doi et al. Advances in CMP polishing technologies
CN102909610A (en) Five-axis linkage ultra-precise machine tool
CN102794697A (en) Method of manufacturing workpiece
CN106826474A (en) Small size thin wall complex structure part superfine grinding lathe
CN101176923B (en) Processing device of micro optical elements with Fresnel structure
Chen et al. Ductile cutting of silicon microstructures with surface inclination measurement and compensation by using a force sensor integrated single point diamond tool
Wang et al. Design and development of a precision machine tool using counter motion mechanisms
Chen et al. An investigation into parallel and cross grinding of aspheric surface on monocrystal silicon
Wu et al. High efficiency precision grinding of micro-structured SiC surface using laser micro-structured coarse-grain diamond grinding wheel
Li et al. Micro cutting of V-shaped cylindrical grating template for roller nano-imprint
Sun et al. Fine grinding of silicon wafers: a mathematical model for the wafer shape
Chen et al. Self-evaluation of the cutting edge contour of a microdiamond tool with a force sensor integrated fast tool servo on an ultra-precision lathe
Luo et al. Uniformity of cluster magnetorheological finishing with dynamic magnetic fields formed by multi-magnetic rotating poles based on the cluster principle
Zhou et al. State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer