Dong et al., 2018 - Google Patents
Parylene-MEMS technique-based flexible electronicsDong et al., 2018
- Document ID
- 6399599298609597146
- Author
- Dong X
- Zhang M
- Lei Y
- Li Z
- Jin Y
- Wang W
- Publication year
- Publication venue
- Science China Information Sciences
External Links
Snippet
This paper reports a novel fabrication strategy for flexible electronics based on the parylene- MEMS (micro-electromechanical system) technique. A set of parylene-filled trenches is used to mechanically connect silicon-based functional units and realize a flexible 4× 6 …
- 238000000034 method 0 title abstract description 31
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device; Multistep manufacturing processes therefor
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