Wang et al., 2010 - Google Patents
Fabrication of piezoelectric MEMS devices-from thin film to bulk PZT waferWang et al., 2010
- Document ID
- 5753237118188906406
- Author
- Wang Z
- Miao J
- Tan C
- Xu T
- Publication year
- Publication venue
- Journal of electroceramics
External Links
Snippet
Integrating patterned functional piezoelectric layer onto silicon substrate is a key technique challenge in fabrication of piezoelectric Micro Electro Mechanical System (pMEMS) devices. Different device applications have different requirements on the thickness and in-plane …
- 239000010409 thin film 0 title abstract description 23
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
- H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
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