Kondoh, 2000 - Google Patents

Material characterization of Cu (Ti)–polyimide thin film stacks

Kondoh, 2000

Document ID
4657578912092442269
Author
Kondoh E
Publication year
Publication venue
Thin Solid Films

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Snippet

Copper films alloyed with 1wt.% of Ti are metallized on polyimide (PI) films. The surface of the PI is treated with an O2-containing plasma prior to Cu (Ti) deposition in order to modify the Cu (Ti)/PI interface. The stacked films are characterized, in view of the Ti incorporation …
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