Li et al., 2021 - Google Patents

Design of wideband dielectric resonator antenna for d-band applications

Li et al., 2021

View PDF
Document ID
1947881750780395480
Author
Li T
Disch K
Haag A
Visweswaran A
Bhutani A
Zwick T
Publication year
Publication venue
2021 International Symposium on Antennas and Propagation (ISAP)

External Links

Snippet

In this paper, a wideband dielectric resonator antenna (DRA) is proposed for the D-band antenna-in-package (AiP) solution. A low-cost AiP solution based on the high density interconnect (HDI) printed circuit board (PCB) process is proposed for the first time for D …
Continue reading at www.ieice.org (PDF) (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QAERIALS
    • H01Q9/00Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant aerials
    • H01Q9/0407Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QAERIALS
    • H01Q1/00Details of, or arrangements associated with, aerials
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QAERIALS
    • H01Q1/00Details of, or arrangements associated with, aerials
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/364Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. supraconductor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QAERIALS
    • H01Q21/00Aerial arrays or systems
    • H01Q21/06Arrays of individually energised active aerial units similarly polarised and spaced apart
    • H01Q21/061Two dimensional planar arrays
    • H01Q21/065Patch antenna array
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QAERIALS
    • H01Q23/00Aerials with active circuits or circuit elements integrated within them or attached to them
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Similar Documents

Publication Publication Date Title
CN108428693B (en) Integrated circuit package
Lamminen et al. Patch antenna and antenna array on multilayer high-frequency PCB for D-band
Kam et al. Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets
US7342299B2 (en) Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
Fischer et al. A 77-GHz antenna in package
Heinrich et al. Connecting chips with more than 100 GHz bandwidth
Chi et al. A 60 GHz PCB wideband antenna-in-package for 5G/6G applications
Zhang et al. A $ D $-Band Packaged Antenna on Organic Substrate With High Fault Tolerance for Mass Production
Tong et al. Radiation performance enhancement of E-band antenna in package
Zhang et al. A low-cost and high-gain 60-GHz differential phased array antenna in PCB process
Hsieh et al. Advanced thin-profile fan-out with beamforming verification for 5G wideband antenna
Bakshi et al. Low-cost packaging of 300 GHz integrated circuits with an on-chip patch antenna
Bhutani et al. 140 GHz broadband antenna in embedded wafer-level ball grid array technology
Tsutsumi et al. Bonding wire loop antenna in standard ball grid array package for 60-GHz short-range wireless communication
Ho et al. A low-cost antenna-in-package solution for 77GHz automotive radar applications
Govindarajulu et al. A 60 GHz millimeter-wave antenna array for 3D antenna-in-package applications
Kamgaing et al. Investigation of a photodefinable glass substrate for millimeter-wave radios on package
Huang et al. A low cost 60GHz antenna in Fan-Out Panel Level Package for millimeter-wave radar application
Luna et al. Hybrid on-chip/in-package integrated antennas for millimeter-wave short-range communications
Li et al. Design of wideband dielectric resonator antenna for d-band applications
Zhang et al. Fan-out antenna-in-package integration using heatsink antenna
Hwangbo et al. Millimeter-wave wireless chip-to-chip (c2c) communications in 3d system-in-packaging (sip) using compact through glass via (tgv)-integrated antennas
Pinel et al. 60 GHz Linearly And Circularly Polarized Antenna Arrays On Liquid Crystal Polymer Substrate.
Aslam et al. Multi Glass-Wafer Stacked Technology for 3D Heterogeneously-Integrated Scalable 6G Arrays
Ishibashi et al. Integrated module structure of fan-out wafer level package for terahertz antenna