Li et al., 2021 - Google Patents
Design of wideband dielectric resonator antenna for d-band applicationsLi et al., 2021
View PDF- Document ID
- 1947881750780395480
- Author
- Li T
- Disch K
- Haag A
- Visweswaran A
- Bhutani A
- Zwick T
- Publication year
- Publication venue
- 2021 International Symposium on Antennas and Propagation (ISAP)
External Links
Snippet
In this paper, a wideband dielectric resonator antenna (DRA) is proposed for the D-band antenna-in-package (AiP) solution. A low-cost AiP solution based on the high density interconnect (HDI) printed circuit board (PCB) process is proposed for the first time for D …
- 238000000034 method 0 abstract description 4
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01Q—AERIALS
- H01Q9/00—Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant aerials
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01Q—AERIALS
- H01Q1/00—Details of, or arrangements associated with, aerials
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01Q—AERIALS
- H01Q1/00—Details of, or arrangements associated with, aerials
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. supraconductor
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H01Q21/00—Aerial arrays or systems
- H01Q21/06—Arrays of individually energised active aerial units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
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