Ayazi, 2002 - Google Patents
The HARPSS process for fabrication of precision MEMS inertial sensorsAyazi, 2002
View PDF- Document ID
- 16359864843648574374
- Author
- Ayazi F
- Publication year
- Publication venue
- Mechatronics
External Links
Snippet
The high aspect-ratio combined poly-and single-crystal silicon micromachining technology (HARPSS) and its application to fabrication of precision MEMS inertial sensors are presented. HARPSS is a single wafer, all silicon, front-side release process which is capable …
- 238000000034 method 0 title abstract description 25
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0817—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for pivoting movement of the mass, e.g. in-plane pendulum
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Ayazi et al. | High aspect-ratio combined poly and single-crystal silicon (HARPSS) MEMS technology | |
CN103363978B (en) | Gyroscope apparatus and the method manufacturing micro-electro-mechanical gyroscope | |
US9448069B2 (en) | Microelectromechanical bulk acoustic wave devices and methods | |
US7043985B2 (en) | High-resolution in-plane tuning fork gyroscope and methods of fabrication | |
Lee et al. | Surface/bulk micromachined single-crystalline-silicon micro-gyroscope | |
US6988408B2 (en) | Surface/bulk micromachined single-crystalline silicon micro-gyroscope | |
EP1762823A2 (en) | Combined sensor and its fabrication method | |
JP4643578B2 (en) | Z-axis angular velocity sensor | |
US7337671B2 (en) | Capacitive microaccelerometers and fabrication methods | |
JP2007210083A (en) | Mems element and its manufacturing method | |
TWI637900B (en) | A manufacturing method of a multi-level micromechanical structure | |
JP6893179B2 (en) | MEMS inertial measuring device with tilted electrodes for orthogonal tuning | |
US20010042404A1 (en) | Single-side microelectromechanical capacitive accelerometer and method of making same | |
Ayazi et al. | High aspect-ratio polysilicon micromachining technology | |
Wen et al. | Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip | |
Ayazi | The HARPSS process for fabrication of precision MEMS inertial sensors | |
JP4362877B2 (en) | Angular velocity sensor | |
JP6558495B2 (en) | Multi-level micro mechanical structure | |
US20080190204A1 (en) | Variable-Capacity Capacitor Having A Specific Shape, Gyrometer Comprising One Such Capacitor And Accelerometer Comprising One Such Capacitor | |
Ayazi et al. | A high aspect-ratio polysilicon vibrating ring gyroscope | |
JP7196891B2 (en) | MEMS elements with increased density | |
Kim et al. | Robust SOI process without footing and its application to ultra high-performance microgyroscopes | |
Ayazi et al. | High aspect-ratio dry-release poly-silicon MEMS technology for inertial-grade microgyroscopes | |
CN116086420B (en) | Vibrating ring MEMS gyroscope and manufacturing method thereof | |
Garcia et al. | Sub-micron mems accelerometer with handle-layer patterning for damping enhancement using time transduction |