Zhanga et al., 2014 - Google Patents
Epitaxial Lift-Off of GaN FilmsZhanga et al., 2014
- Document ID
- 15201618983091145063
- Author
- Zhanga K
- Chuaa S
- Publication year
- Publication venue
- Handbook of Optical Microcavities
External Links
Snippet
III-nitride based materials system, having a wide and direct band gap, good thermal stability, and conductivity, is a prominent compound semiconductor for applications in optoelectronics, that is, light-emitting diodes (LEDs) and laser diodes (LDs), high power …
- 229910002601 GaN 0 title abstract description 225
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0079—Processes for devices with an active region comprising only III-V compounds wafer bonding or at least partial removal of the growth substrate
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02516—Crystal orientation
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI520206B (en) | Method of at least partially releasing an epitaxial layer | |
US9396943B2 (en) | Method for the reuse of gallium nitride epitaxial substrates | |
KR101038923B1 (en) | Light emitting diode having improved light emission efficiency and method for fabricating the same | |
KR101227724B1 (en) | Light emitting element and method of manufacturing the same | |
US9000464B2 (en) | Semiconductor structure for substrate separation and method for manufacturing the same | |
EP2423982A2 (en) | Light-emitting devices with two-dimensional composition-fluctuation active-region and method for fabricating the same | |
US20110042718A1 (en) | Nitride semiconductor layer-containing structure, nitride semiconductor layer-containing composite substrate and production methods of these | |
TW201118946A (en) | Method for manufacturing free-standing substrate and free-standing light-emitting device | |
TW201020206A (en) | Defect-free group III-nitride nanostructures and devices using pulsed and non-pulsed growth techniques | |
TW200921764A (en) | Non-polar III-V nitride material and production method | |
US20130207237A1 (en) | Method for producing gallium nitride substrates for electronic and optoelectronic devices | |
CN115244717A (en) | Semiconductor structure and method of manufacture | |
TWI582825B (en) | High quality devices growth on pixelated patterned templates | |
JPWO2011013363A1 (en) | Microstructure manufacturing method | |
Fu et al. | Progress and prospects of III-nitride optoelectronic devices adopting lift-off processes | |
KR101245509B1 (en) | Method for preparing porous substrate and light emitting diode thereof | |
US8026155B2 (en) | Method for producing semiconductor device | |
van Look et al. | Laser scribing for facet fabrication of InGaN MQW diode lasers on sapphire substrates | |
Liou et al. | Implementation of a high-performance GaN-based light-emitting diode grown on a nanocomb-shaped patterned sapphire substrate | |
Zhanga et al. | Epitaxial Lift-Off of GaN Films | |
US20240162377A1 (en) | Substrate for semiconductor device, semiconductor component and method of manufacturing same | |
KR101112118B1 (en) | Method for preparing freestanding group iii nitride substrate | |
EP4420203A1 (en) | Methods for fabricating a vertical cavity surface emitting laser | |
CN115513342A (en) | Method for producing a relaxed epitaxial InGaN layer from a GaN/InGaN substrate, substrate and light-emitting diode | |
Dai et al. | GaN-based light emitting diodes with large area surface nano-structures patterned by anodic aluminum oxide templates |