Ballarini, 1998 - Google Patents
Recent developments in experimental and theoretical studies of the mechanical behavior of polycrystalline silicon for microelectromechanical systemsBallarini, 1998
- Document ID
- 14931526087411007730
- Author
- Ballarini R
- Publication year
- Publication venue
- MRS Online Proceedings Library (OPL)
External Links
Snippet
A review of recent developments in experimental and theoretical studies of the mechanicalbehavior of polycrystalline silicon structures whose dimensions are comparable to those of typicalmicro electromechanical systems devices is presented. It is concluded that …
- 229910021420 polycrystalline silicon 0 title abstract description 27
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0286—Miniature specimen; Testing on micro-regions of a specimen
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/0617—Electrical or magnetic indicating, recording or sensing means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/0202—Control of the test
- G01N2203/0212—Theories, calculations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0016—Tensile or compressive
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02827—Elastic parameters, strength or force
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/40—Investigating hardness or rebound hardness
- G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/04—Chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/12—Analysing solids by measuring frequency or resonance of acoustic waves
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Yi et al. | Measurement of mechanical properties for MEMS materials | |
Kahn et al. | Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens | |
Sharpe Jr et al. | New test structures and techniques for measurement of mechanical properties of MEMS materials | |
Bhalla et al. | Structural health monitoring by piezo-impedance transducers. I: Modeling | |
Chasiotis et al. | A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy | |
Lu et al. | A multi-step method for in situ mechanical characterization of 1-D nanostructures using a novel micromechanical device | |
Chasiotis et al. | Mechanical properties of thin polysilicon films by means of probe microscopy | |
Saif et al. | Measurement of forces and spring constants of microinstruments | |
Kotian et al. | Stress averaging in PVDF sensors for in-plane sinusoidal and impact-induced stresses | |
Jonestt et al. | Fracture strength of polycrystalline silicon | |
Herbert et al. | Measuring the elastic modulus and residual stress of freestanding thin films using nanoindentation techniques | |
Ballarini | Recent developments in experimental and theoretical studies of the mechanical behavior of polycrystalline silicon for microelectromechanical systems | |
Chen et al. | A novel flexure-based uniaxial force sensor with large range and high resolution | |
Sienkiewicz et al. | Identification of the mechanical properties of the skin by electromechanical impedance analysis of resonant piezoelectric actuator | |
Pustan et al. | Nanomechanical studies and materials characterization of metal/polymer bilayer MEMS cantilevers | |
Vidic et al. | Observations of contact measurements using a resonance-based touch sensor | |
Pustan et al. | Nanomechanical and nanotribological characterization of microelectromechanical system | |
Somà | MEMS design for reliability: Mechanical failure modes and testing | |
Najafi et al. | Thermo-elastic damping in a capacitive micro-beam resonator considering hyperbolic heat conduction model and modified couple stress theory | |
White et al. | Dynamic MEMS devices for multiaxial fatigue and elastic modulus measurement | |
Camarda et al. | Complete determination of the local stress field in epitaxial thin films using single microstructure | |
Sharon et al. | Assessing the dynamic failure response of MEMS structures | |
Zhang et al. | Mechanical characterization of released thin films by contact loading | |
Morozov et al. | Mechanical strength study of SiO2 isolation blocks merged in silicon substrate | |
Schiltges et al. | Failure behaviour of microstructures under torsional loads |