WO2024187427A1

WO2024187427A1 - Heating body and manufacturing method therefor

Info

Publication number: WO2024187427A1
Application number: PCT/CN2023/081732
Authority: WO
Inventors: 周波; 邵鹏飞; 黄惠华; 韦成志; 朱伟
Original assignee: 深圳十商科技有限公司
Priority date: 2023-03-15
Filing date: 2023-03-15
Publication date: 2024-09-19

Abstract

A manufacturing method for a heating body. The manufacturing method comprises the following steps: S1, providing a heating body substrate (11); S2, setting a corresponding cutting trajectory into a laser cutting device according to the shape of a heating body; and S3, transferring the substrate to the laser cutting device, and by means of a laser, cutting the substrate according to the cutting trajectory, so as to form the heating body (12). In the manufacturing method, laser cutting technology is used to cut a substrate according to a set cutting trajectory, such that the substrate forms a heating body having a predetermined shape. Compared with a conventional etching process, the method involves a simple and fast process, requires no chemical agents and is therefore safe, achieves relatively high levels of precision, has a low cost, and is more beneficial to automated production. The present application further relates to a heating body.

Description

Heater and method for making the same

Technical Field

The present invention relates to the field of heating technology, and in particular to a heating element and a manufacturing method thereof.

Background Art

The heating element in the existing atomizer assembly is usually made by etching process to make it have a set heating circuit. However, the etching process has the following disadvantages:

The whole process is complicated and consumes a lot of manpower and material resources;

A variety of chemical reagents are needed in the production process, which not only cause pollution but also pose safety risks;

There are many factors that affect etching accuracy, resulting in relatively poor product consistency.

In order to solve the above problems, it is necessary to improve the manufacturing method of the heating element.

Summary of the invention

The technical problem to be solved by the present invention is to provide a method for manufacturing a heating element with simple process and improved product consistency, and the heating element obtained.

The technical solution adopted by the present invention to solve the technical problem is: to provide a method for manufacturing a heating element, comprising the following steps:

S1. Provide a heating element substrate;

S2. Setting the corresponding cutting track into the laser cutting device according to the shape of the heating element;

S3, transferring the substrate to the laser cutting device, and cutting the substrate according to the cutting track by laser to form a heating element.

Preferably, in step S1, the substrate is a plate having a thickness of 0.02 mm to 0.5 mm;

In step S3, a plurality of heating elements are formed on the substrate, and the plurality of heating elements are arranged in a plurality of rows and columns.

Preferably, in step S1, the substrate is a coil formed by rolling up a strip, and the strip thickness is 0.02 mm-0.5 mm;

In step S3, the coiled material is unwound to form a straightened strip and then enters the laser cutting device, and a plurality of heating elements arranged along the length direction of the strip are formed on the strip by laser cutting.

Preferably, in step S1, the substrate is a tube, and the tube wall thickness is 0.02 mm-0.5 mm;

In step S3, the tube is cut along the cutting track by laser to form a hollow structure, thereby obtaining a heating element.

Preferably, the material of the substrate is pure nickel, nickel-chromium, pure titanium, stainless steel or iron-chromium-aluminum.

Preferably, in step S3, the substrate is placed within a range of ±2 mm from the focal position of the laser cutting device;

The laser cutting parameters of the laser cutting equipment are as follows: laser wavelength is 1064μm, spot diameter is 20μm-50μm, laser power is 15w-1000w, cutting speed is 2m/min-36m/min, cooling air pressure is 0.1Mpa-2Mpa, and motion accuracy is 1μm.

Preferably, in step S1, the substrate is a film material with a thickness of 1 μm-5 μm;

The material of the film is Pt, AgPd, AuPd, PtRh, PtRu, NiCr or NiCrAlY.

Preferably, in step S3, the film material is placed within a range of ±2 mm from the focal position of the laser cutting device;

The laser cutting parameters of the laser cutting equipment are as follows: laser wavelength is 1064μm, spot diameter is 20μm-50μm, laser power is 5w-100w, pulse frequency is 0.1kHz-100kHz, cutting speed is 2m/min-36m/min, cooling air pressure is 0.1Mpa-2Mpa, imaging system dimensional accuracy is 1μm-10μm, resistance measurement system accuracy is 1mΩ, and motion accuracy is 1μm.

Preferably, the method for manufacturing the heating element further comprises the following steps:

S4. Connect a lead wire to each of the heating elements.

The present invention also provides a heating element, which is made by any of the above-mentioned manufacturing methods.

The beneficial effects of the present invention are as follows: laser cutting technology is used to cut the substrate according to the set cutting trajectory, so that the substrate is formed into a heating element with a predetermined shape. Compared with the traditional etching process, the process is simple and fast, does not require any chemical reagents, has good safety, high precision, low cost, is more conducive to automated production, and is more competitive in the production of heating elements.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

FIG1 is a schematic structural diagram of a heating element formed on a substrate in a method for manufacturing a heating element according to a first embodiment of the present invention;

FIG2 is a side view of a substrate in a method for manufacturing a heating element according to a second embodiment of the present invention;

3 is a schematic structural diagram of a heating element formed on a substrate in a method for manufacturing a heating element according to a second embodiment of the present invention;

4 is a schematic diagram of the structure of connecting leads on a heating element in a method for manufacturing a heating element according to a second embodiment of the present invention;

5 is a schematic structural diagram of a heating element manufactured by a method for manufacturing a heating element according to a second embodiment of the present invention;

6 is a schematic structural diagram of a substrate in a method for manufacturing a heating element according to a third embodiment of the present invention;

7 is a schematic structural diagram of a heating element obtained by a method for manufacturing a heating element according to a third embodiment of the present invention;

8 is a schematic structural diagram of a substrate on a liquid guide member in a method for manufacturing a heating element according to a fourth embodiment of the present invention;

FIG. 9 is a schematic structural diagram of a heating element on a liquid guide member obtained by a method for manufacturing a heating element according to a fourth embodiment of the present invention.

Implementation

In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific embodiments of the present invention are now described in detail with reference to the accompanying drawings.

Referring to FIG1 , a method for manufacturing a heating element according to a first embodiment of the present invention comprises the following steps:

S1. Provide a heating element substrate 11.

In this embodiment, the substrate 11 is a plate, and its length and width are not limited. Its thickness is consistent with the thickness of the heating element to be manufactured, that is, 0.02 mm-0.5 mm.

According to the application and requirements of the heating element, the material of the substrate 11 is pure nickel, nickel-chromium, pure titanium, stainless steel or iron-chromium-aluminum, that is, the plate material can be a nickel plate, a nickel-chromium plate, a titanium plate, a stainless steel plate or an iron-chromium-aluminum plate.

S2. Setting the corresponding cutting track in the laser cutting device according to the shape of the heating element.

S3, transferring the substrate 11 to a laser cutting device, and cutting the substrate 11 according to a cutting track by laser to form a heating element 12.

According to the length and width of the substrate 11 and the area of each heating element 12 on the substrate 11, a plurality of heating elements 12 can be cut on one substrate 11. Along the length and width of the substrate 11, the plurality of heating elements 12 are arranged in a plurality of rows and columns.

Specifically, in step S3 , the substrate 11 is placed within a range of ±2 mm of the focal position of the laser cutting device, so that the laser can accurately cut the substrate 11 .

Among them, the laser cutting parameters of the laser cutting equipment are as follows: laser wavelength is 1064μm, spot diameter is 20μm-50μm, laser power is 15w-1000w, cutting speed is 2m/min-36m/min, cooling air pressure is 0.1Mpa-2Mpa, and motion accuracy is 1μm.

To obtain a better laser cutting effect, specific laser cutting parameters can be adjusted according to the actual thickness of the substrate 11 .

As shown in FIG. 1 , each heating element 12 has a plurality of heating lines. The side lines on two opposite sides of the heating element 12 are wider than the heating lines between the two sides, and can be used as lead welding positions.

S4. Connect leads (not shown) to both sides of each heating element 12.

Before connecting the leads, positioning holes 13 are cut on opposite sides of the substrate 11 by laser for positioning the leads. As shown in FIG1 , multiple positioning holes 13 are cut on the long sides of the substrate 11, and the multiple positioning holes 13 on each long side are arranged at intervals, and each positioning hole 13 corresponds to a row of heating elements 12.

Specifically, in this embodiment, multiple rows and columns of heating elements 12 formed by laser cutting are distributed on the substrate 11, and a cutting line 14 is formed in advance between two adjacent rows of heating elements 12 by punching, laser or other methods, so that the substrate 11 with the heating elements 12 can be split into units according to rows. There are positioning holes 13 on the opposite sides of the substrate 11 where each row of heating elements is located.

When connecting the leads, the substrate 11 with the heating element 12 is positioned according to the positioning holes 13 on the opposite sides of the substrate 11, and then the leads are welded on both sides of each heating element 12 by welding equipment; the welding method can be butt welding, laser welding, etc., and of course other methods such as riveting can also be used.

Combined with the positioning assistance of the positioning holes 13, it is convenient to complete the connection of the leads on multiple heating elements 12 at one time, which is conducive to automation.

After the lead connection is completed, the waste material can be removed and the heating element 12 can be separated from the substrate 11. For example, the connection between the heating element 12 and the frame material around it can be cut off by a stamping method, and the heating element 12 can be separated from the frame material, and the frame material can be discharged and collected as waste material.

When the heating element 12 is used, it can be fixed on the surface of the liquid guide member in a straight manner according to the specific requirements of the atomization component, or it can be bent into a tubular structure and sleeved on the outer periphery of the liquid guide member.

2 to 5 , a method for manufacturing a heating element according to a second embodiment of the present invention comprises the following steps:

S1. Provide a heating element substrate 21.

In this embodiment, the substrate 21 is a coil formed by rolling up a strip 211. The strip 211 is not limited, and its width is set according to the width of the heating element, and is larger than the width of the heating element. The thickness of the strip 211 is consistent with the thickness of the heating element to be manufactured, that is, 0.02mm-0.5mm.

According to the application and requirements of the heating element, the material of the substrate 21 is pure nickel, nickel-chromium, pure titanium, stainless steel or iron-chromium-aluminum, that is, the strip 211 can be a nickel strip, a nickel-chromium strip, a titanium strip, a stainless steel strip or an iron-chromium-aluminum strip.

S3, conveying the substrate 21 to a laser cutting device via rollers, conveyor belts, etc., and cutting the substrate 21 along a cutting track by laser to form a heating element.

Specifically, in this embodiment, the coil is unwound to form a straightened strip 211 and then enters the laser cutting device, and a plurality of heating elements 22 arranged along the length direction of the strip 211 are formed on the strip 211 by laser cutting.

Specifically, in step S3 , the substrate 21 is placed within a range of ±2 mm of the focal position of the laser cutting device, so that the laser can accurately cut the substrate 11 .

Each heating element 22 can be a mesh structure as a whole. As shown in Figures 3 and 5, each heating element 22 has a plurality of heating lines, and the side lines on the opposite sides of the heating element 22 are wider than the heating lines between the two sides, which can be used as lead welding positions.

S4. Connect the lead wires 24 to both sides of each heating element 22.

Before connecting the lead wires 24 , positioning holes 23 are cut on opposite sides (long sides) of the strip 211 of the substrate 21 by laser for positioning the lead wires.

As shown in Fig. 3-Fig. 4, there are corresponding positioning holes 23 on the strip 211 of the substrate 21 at the two ends of each heating element 22. When connecting the lead 24, the strip 211 with the heating element 22 is positioned according to the positioning holes 23 on the opposite sides of the strip 211 of the substrate 21, and then the lead 24 is welded on the two ends of each heating element 22 by welding equipment; the welding method can be butt welding, laser welding, etc., and the lead 24 can of course also be riveted or other methods.

Combined with the positioning assistance of the positioning holes 23, it is convenient to complete the connection of the leads 24 on multiple heating elements 22 at one time, which is conducive to automation.

After completing the connection of the lead 24, the waste material can be removed and the heating element 22 can be separated from the substrate 21. For example, the connection between the heating element 22 and the frame material around it can be disconnected by a stamping method, and the heating element 22 can be separated from the frame material. The frame material becomes waste material for discharge and collection.

The formed single heating element 22 and its upper lead 24 are shown in FIG. 5 .

When the heating element 22 is used, it can be flatly laid and fixed on the surface of the liquid guide member.

6-7, a method for manufacturing a heating element according to a third embodiment of the present invention comprises the following steps:

S1. Provide a heating element substrate 31.

In this embodiment, the substrate 31 is a tube, and its length, inner diameter and outer diameter are set according to the heating element to be manufactured, that is, consistent with the length, inner diameter and outer diameter of the heating element. Combined with the setting of the inner diameter and outer diameter, the tube wall thickness of the tube is 0.02mm-0.5mm.

According to the application and requirements of the heating element, the material of the substrate 31 is pure nickel, nickel-chromium, pure titanium, stainless steel or iron-chromium-aluminum, that is, the tube can be a nickel tube, a nickel-chromium tube, a titanium tube, a stainless steel tube or an iron-chromium-aluminum tube.

S3, the substrate 31 is transferred to a laser cutting device, and the substrate 31 is cut by laser according to a cutting track, and after the waste is removed, the heating element 32 is formed.

The laser is used to cut the tube along the cutting track, so that the tube forms a hollow structure, and the heating element 32 is obtained.

Specifically, in step S3, the substrate 21 is placed within the focal position of the laser cutting device within the range of ±2 mm, so that the laser can accurately cut on the substrate 11. The laser cutting parameters of the laser cutting device are as follows: the laser wavelength is 1064 μm, the spot diameter is 20 μm-50 μm, the laser power is 15w-1000w, the cutting speed is 2m/min-36m/min, the cooling air pressure is 0.1Mpa-2Mpa, and the motion accuracy is 1μm.

The heating element 32 has a plurality of heating lines. The lines at two opposite ends of the heating element 32 are wider than the heating lines between the two ends, and can be used as lead welding positions.

S4. Connect lead wires (not shown) to both ends of each heating element 32.

The connection method of the lead includes welding, and the welding method can be butt welding, laser welding, etc., and of course, other methods such as riveting can also be used.

When the heating element 32 is used, it is sleeved on the outer periphery of the liquid guiding member and forms an atomizing assembly together with the liquid guiding member.

8 and 9 , the method for manufacturing a heating element according to the fourth embodiment of the present invention comprises the following steps:

S1. Provide a heating element substrate 41.

In this embodiment, the substrate 41 is a film material with a thickness of 1 μm-5 μm.

The material of the membrane is Pt, AgPd, AuPd, PtRh, PtRu, NiCr or NiCrAlY.

The cutting track can be set according to the distribution of resistance values on the film material, for example, it can be a plurality of loops of different sizes and shapes.

S3, the substrate 41 is transferred to a laser cutting device, and the laser is used to cut the substrate according to the cutting track, and the heating element 42 is formed after the waste is removed.

In this embodiment, since the substrate 41 is a film material, it needs to be placed on a carrier before laser cutting. Preferably, the film material is directly positioned on the liquid guide 40 and sent to the laser cutting device together with the liquid guide 40. The liquid guide 40 can be made of high-temperature porous ceramic material.

Among them, the film material is placed within the focus position of the laser cutting equipment within ±2mm. The laser cutting parameters of the laser cutting equipment are as follows: laser wavelength is 1064μm, spot diameter is 20μm-50μm, laser power is 5w-100w, pulse frequency is 0.1kHz-100kHz, cutting speed is 2m/min-36m/min, cooling air pressure is 0.1Mpa-2Mpa, imaging system size accuracy is 1μm-10μm, resistance measurement system accuracy is 1mΩ, and motion accuracy is 1μm.

To obtain a better laser cutting effect, specific laser cutting parameters can be adjusted according to the actual thickness of the substrate 41 .

The laser cutting equipment is preferably a high-precision laser cutting machine.

As shown in FIG. 9 , laser cutting is performed on the film material along a cutting track, so that the film material forms a hollow structure, thereby obtaining a heating element 42 .

The heating element 42 is covered on the liquid guiding member 40 , and together with the liquid guiding member 40 forms an atomizing assembly.

The manufacturing method of the heating element of the fourth embodiment may further include the following steps:

S4. Connect lead wires (not shown) to both ends of the heating element 42.

In the manufacturing methods of the first to fourth embodiments described above, the lead wire is used to be electrically connected to the power supply device to achieve power-on heating of the heating element.

In addition, in the manufacturing methods of the above-mentioned embodiments, the lead wire can also be replaced by a metal electrode contact. For example, when the heating element is used and assembled, the metal electrode is conductively connected to the two ends of the heating element in a direct contact manner. In order to achieve stable contact conduction, the metal electrode is elastically contacted with the heating element by an elastic electrode or an elastic member, and the elastic restoring force of the elastic electrode or the elastic member always maintains a sufficient area of contact with the end of the heating element to achieve a stable conductive connection.

In summary, the manufacturing method of the heating element of the present invention is realized by laser cutting, and the cutting trajectory of the laser cutting can be set according to the various heating circuits of the heating element actually required, which is not only flexible and diverse, but also can achieve higher precision; it is convenient for automated production, and the obtained heating element has high consistency. The heating element prepared by the present invention is suitable for the atomization component of the atomizer, and the atomization effect is achieved by heating and atomizing the liquid.

The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

A method for manufacturing a heating element, characterized in that it comprises the following steps:

S1. Provide a heating element substrate;

S2. Setting the corresponding cutting track into the laser cutting device according to the shape of the heating element;

S3, transferring the substrate to the laser cutting device, and cutting the substrate according to the cutting track by laser to form a heating element.
The method for manufacturing a heating element according to claim 1, characterized in that, in step S1, the substrate is a plate having a thickness of 0.02 mm to 0.5 mm;

In step S3, a plurality of heating elements are formed on the substrate, and the plurality of heating elements are arranged in a plurality of rows and columns.
The method for manufacturing a heating element according to claim 1, characterized in that in step S1, the substrate is a coil formed by rolling up a strip, and the strip thickness is 0.02 mm-0.5 mm;

In step S3, the coiled material is unwound to form a straightened strip and then enters the laser cutting device, and a plurality of heating elements arranged along the length direction of the strip are formed on the strip by laser cutting.
The method for manufacturing a heating element according to claim 1, characterized in that, in step S1, the substrate is a tube, and the tube wall thickness is 0.02 mm-0.5 mm;

In step S3, the tube is cut along the cutting track by laser to form a hollow structure, thereby obtaining a heating element.
The method for manufacturing a heating element according to any one of claims 2 to 4 is characterized in that the material of the substrate is pure nickel, nickel-chromium, pure titanium, stainless steel or iron-chromium-aluminum.
The method for manufacturing a heating element according to any one of claims 2 to 4, characterized in that in step S3, the substrate is placed within a range of ±2 mm of a focal position of the laser cutting device;

The laser cutting parameters of the laser cutting equipment are as follows: laser wavelength is 1064μm, spot diameter is 20μm-50μm, laser power is 15w-1000w, cutting speed is 2m/min-36m/min, cooling air pressure is 0.1Mpa-2Mpa, and motion accuracy is 1μm.
The method for manufacturing a heating element according to claim 1, characterized in that, in step S1, the substrate is a film material, and its thickness is 1 μm-5 μm;

The material of the film is Pt, AgPd, AuPd, PtRh, PtRu, NiCr or NiCrAlY.
The method for manufacturing a heating element according to claim 7, characterized in that in step S3, the film material is placed within a range of ±2 mm of the focal position of the laser cutting device;

The laser cutting parameters of the laser cutting equipment are as follows: laser wavelength is 1064μm, spot diameter is 20μm-50μm, laser power is 5w-100w, pulse frequency is 0.1kHz-100kHz, cutting speed is 2m/min-36m/min, cooling air pressure is 0.1Mpa-2Mpa, imaging system dimensional accuracy is 1μm-10μm, resistance measurement system accuracy is 1mΩ, and motion accuracy is 1μm.
The method for manufacturing a heating element according to claim 1, characterized in that the method for manufacturing a heating element further comprises the following steps:

S4. Connect a lead wire to each of the heating elements.
A heating element, characterized in that it is made by the manufacturing method according to any one of claims 1 to 9.