WO2022262033A1 - 显示面板及移动终端 - Google Patents

显示面板及移动终端 Download PDF

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Publication number
WO2022262033A1
WO2022262033A1 PCT/CN2021/105901 CN2021105901W WO2022262033A1 WO 2022262033 A1 WO2022262033 A1 WO 2022262033A1 CN 2021105901 W CN2021105901 W CN 2021105901W WO 2022262033 A1 WO2022262033 A1 WO 2022262033A1
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WO
WIPO (PCT)
Prior art keywords
unit
array
display panel
layer
packaging
Prior art date
Application number
PCT/CN2021/105901
Other languages
English (en)
French (fr)
Inventor
张兴永
Original Assignee
武汉华星光电技术有限公司
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司, 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US17/598,266 priority Critical patent/US20240047378A1/en
Publication of WO2022262033A1 publication Critical patent/WO2022262033A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3192—Multilayer coating

Definitions

  • the present application relates to the display field, in particular to a display panel and a mobile terminal.
  • the service life of the display panel has received more and more attention.
  • the inorganic packaging layer in the edge area of the display panel is easily damaged and cracks are generated.
  • the extension of the crack to the display area will lead to poor packaging.
  • the encapsulation layer usually includes multiple inorganic layers, and the thicker the inorganic encapsulation layer is more likely to be damaged and cracks are generated.
  • Embodiments of the present invention provide a display panel and a mobile terminal, which can alleviate the current technical problem that when the display panel is cut, the inorganic packaging layer is easily damaged to cause cracks, and the cracks extend to the display area and cause poor packaging.
  • An embodiment of the present application provides a display panel, including a display area and an edge area located on the periphery of the display area;
  • the display panel includes a substrate disposed in the edge region and a package component located on the substrate, the package component includes a plurality of barrier units separately arranged, a package component, and a package component located between two adjacent barrier units.
  • the opening between them, the packaging member includes a first array packaging unit located on the barrier unit and a second array packaging unit located in the opening;
  • the first array packaging unit and the second array packaging unit are arranged separately, and the area of the end surface of the barrier unit close to the substrate is smaller than the area of the end surface of the barrier unit away from the substrate.
  • the barrier unit includes a first inorganic layer on the substrate and a second inorganic layer on the first inorganic layer; wherein, the thickness of the first array packaging unit is the same as the thickness of the first inorganic layer The thicknesses of the packaging units in the second array are the same.
  • the display panel further includes a cover unit located on the plurality of barrier units, and the cover unit fills the opening between two adjacent barrier units.
  • the display panel further includes an array substrate encapsulation layer disposed in the display area; the thickness of the array substrate encapsulation layer is the same as the thickness of the first array encapsulation unit, and the array substrate encapsulation layer The thickness of the layer is the same as that of the second array packaging unit.
  • the display panel further includes a plurality of dams located between the second inorganic layer and the array substrate encapsulation layer on a side close to the edge area in the display area.
  • the packaging member further includes a touch encapsulation layer on the cover unit, the touch encapsulation layer is also located in the display area, and the touch encapsulation layer in the edge area
  • the orthographic projection onto the covering unit is located within the covering unit.
  • the package member further includes a first touch package unit located on the first array package unit and a second touch package unit located on the second array package unit, the first The touch package unit is set separately from the second touch package unit.
  • the barrier unit includes a side wall, the side wall is disposed corresponding to the opening, and the side wall is an arc surface that is concave toward the center of the barrier unit.
  • the size of the opening gradually increases in a direction away from the display area.
  • the encapsulation component near the display area is arranged in connection with the encapsulation film layer in the display area.
  • the embodiment of the present application also provides a mobile terminal, including a display panel and a terminal body, the terminal body is integrated with the display panel, and the display panel includes a display area and an edge area located at the periphery of the display area;
  • the display panel includes a substrate disposed in the edge region and a package component located on the substrate, the package component includes a plurality of barrier units separately arranged, a package component, and a package component located between two adjacent barrier units.
  • the opening between them, the packaging member includes a first array packaging unit located on the barrier unit and a second array packaging unit located in the opening;
  • the first array packaging unit and the second array packaging unit are arranged separately, and the area of the end surface of the barrier unit close to the substrate is smaller than the area of the end surface of the barrier unit away from the substrate.
  • the barrier unit includes a first inorganic layer on the substrate and a second inorganic layer on the first inorganic layer; wherein, the thickness of the first array packaging unit is the same as the thickness of the first inorganic layer The thicknesses of the packaging units in the second array are the same.
  • the display panel further includes a cover unit located on the plurality of barrier units, and the cover unit fills the opening between two adjacent barrier units.
  • the display panel further includes an array substrate encapsulation layer disposed in the display area; the thickness of the array substrate encapsulation layer is the same as the thickness of the first array encapsulation unit, and the array substrate encapsulation layer The thickness of the layer is the same as that of the second array packaging unit.
  • the display panel further includes a plurality of dams located between the second inorganic layer and the array substrate encapsulation layer on a side close to the edge area in the display area.
  • the packaging member further includes a touch encapsulation layer on the cover unit, the touch encapsulation layer is also located in the display area, and the touch encapsulation layer in the edge area
  • the orthographic projection onto the covering unit is located within the covering unit.
  • the package member further includes a first touch package unit located on the first array package unit and a second touch package unit located on the second array package unit, the first The touch package unit is set separately from the second touch package unit.
  • the barrier unit includes a side wall, the side wall is disposed corresponding to the opening, and the side wall is an arc surface that is concave toward the center of the barrier unit.
  • the size of the opening gradually increases in a direction away from the display area.
  • the encapsulation component near the display area is arranged in connection with the encapsulation film layer in the display area.
  • barrier units with different upper and lower end surfaces are arranged in the edge region, so that when the encapsulation film layer is formed, the encapsulation film layer is broken in the opening between two adjacent barrier units, and when the display panel is cut, Even if a crack occurs, the crack will not extend to the display area, which ensures the packaging effect and improves the yield rate of the display panel.
  • FIG. 1 is a schematic structural diagram of a first structure of a display panel provided by an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a second structure of a display panel provided by an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a third structure of a display panel provided by an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a fourth structure of a display panel provided by an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a fifth structure of a display panel provided by an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a sixth structure of a display panel provided by an embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a seventh structure of a display panel provided by an embodiment of the present invention.
  • FIG. 8 is a flowchart of steps of a method for manufacturing a display panel provided by an embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of a mobile terminal provided by an embodiment of the present invention.
  • the present application provides a display panel and a mobile terminal.
  • a display panel and a mobile terminal.
  • the present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.
  • Embodiments of the present application provide a display panel and a manufacturing method thereof. Each will be described in detail below. It should be noted that the description sequence of the following embodiments is not intended to limit the preferred sequence of the embodiments.
  • an embodiment of the present invention provides a display panel 100, including a display area A and an edge area B located on the periphery of the display area A;
  • the display panel 100 includes a substrate 200 disposed in the edge area B and a packaging component 300 located on the substrate 200, the packaging component 300 includes a plurality of barrier units 310 separately arranged, packaging components and The opening 330 between two adjacent barrier units 310, the package member includes a first array package unit 341 located on the barrier unit 310 and a second array package unit 342 located in the opening 330;
  • the first array package unit 341 and the second array package unit 342 are arranged separately, and the area of the end surface of the barrier unit 310 close to the substrate 200 is smaller than the area of the barrier unit 310 away from the substrate 200 The area of the end face.
  • barrier units with different upper and lower end surfaces are arranged in the edge region, so that when the encapsulation film layer is formed, the encapsulation film layer is broken in the opening between two adjacent barrier units, and when the display panel is cut, Even if a crack occurs, the crack will not extend to the display area, which ensures the packaging effect and improves the yield rate of the display panel.
  • the display panel 100 includes a display area A and an edge area B located on the periphery of the display area A; the display panel 100 includes a substrate 200 disposed in the edge area B and a package located on the substrate 200 Component 300, the package component 300 includes a plurality of barrier units 310 arranged separately, a package component and an opening 330 between two adjacent barrier units 310, the package component includes a first barrier unit 310 located on the barrier unit 310 An array packaging unit 341 and a second array packaging unit 342 located between two adjacent barrier units 310, the second array packaging unit 342 is located in the opening 330; wherein, the first array packaging unit 341 Separate from the second array package unit 342 , the area of the end surface of the barrier unit 310 close to the substrate 200 is smaller than the area of the end surface of the barrier unit 310 away from the substrate 200 , please refer to FIG. 1 for details.
  • the barrier unit 310 includes a first inorganic layer 311 on the substrate 200 and a second inorganic layer 312 on the first inorganic layer 311; wherein, the first array packaging unit
  • the thickness of 341 is the same as that of the second array packaging unit 342 , please refer to FIG. 1 for details.
  • the first array encapsulation unit 341 and the second array encapsulation unit 342 are formed by breaking the encapsulation film layer at the barrier unit 310 and the opening 330 to form the first array separately.
  • the packaging unit 341 and the second array packaging unit 342 so the thickness of the first array packaging unit 341 is the same as the thickness of the second array packaging unit 342 .
  • the first inorganic layer 311 and the second inorganic layer 312 can be inorganic film layers in the array substrate of the display panel 100, for example, the first inorganic layer 311 can be an insulating layer, and the material can be a silicon nitride compound or/and an oxygen silicon compound, the second inorganic layer 312 may be a passivation layer, and the material may be a nitrogen silicon compound or/and an oxygen silicon compound, which is not specifically limited here.
  • the substrate 200 is located in the display area A and the edge area B, and the first inorganic layer 311 and the second inorganic layer 312 extend into the display area A.
  • the display panel 100 further includes an array substrate on the substrate 200 and an array substrate encapsulation layer 210 on the array substrate, and the array substrate and the array substrate encapsulation layer 210 are on the in display area A.
  • the array substrate includes the first inorganic layer 311 and the second inorganic layer 312 , please refer to FIG. 1 for details.
  • the display panel 100 further includes a cover unit 400 located on a plurality of the barrier units 310, and the cover unit 400 fills the opening 330 between two adjacent barrier units 310, specifically See Figure 2.
  • the covering unit 400 can be made of an organic material, which can provide a certain flexibility of the edge region B and reduce the risk of crack transmission, and can also improve the packaging effect of the packaging component 300 .
  • the display panel 100 further includes an array substrate encapsulation layer 210 disposed in the display area A; the thickness of the array substrate encapsulation layer 210 is the same as that of the first array encapsulation unit 341, so The thickness of the array substrate packaging layer 210 is the same as that of the second array packaging unit 342 , please refer to FIG. 1 and FIG. 2 for details.
  • the first array packaging unit 341 and the second array packaging unit 342 can be formed at the same time as the array substrate packaging layer 210, so the thicknesses of the three are the same, and the first array packaging unit 341 remains in the On the barrier unit 310 , the first array packaging unit 341 may be disposed on the same layer as the array substrate packaging layer 210 near the edge region B.
  • the packaging member further includes a touch encapsulation layer 500 on the cover unit 400, the touch encapsulation layer 500 is also located in the display area A, and the touch encapsulation layer 500 in the edge area B
  • the orthographic projection of the touch encapsulation layer 500 on the cover unit 400 is located inside the cover unit 400 , please refer to FIG. 3 for details.
  • the display panel 100 also includes a related structure of a touch encapsulation layer 500, the touch encapsulation layer 500 is located on the cover unit 400 and extends into the display area A, and the touch control structure of the display panel 100
  • the touch encapsulation layer 500 is etched, and the part of the touch encapsulation layer 500 away from the display area A is etched away, so that when the display panel 100 is cut, The risk of cracking of the touch encapsulation layer 500 at the cut site is reduced, and the transmission of cracks to the display area A of the display panel 100 is reduced from the root.
  • the package member further includes a first touch package unit 510 located on the first array package unit 341 and a second touch package unit 520 located on the second array package unit 342, so The first touch encapsulation unit 510 and the second touch encapsulation unit 520 are disposed separately, please refer to FIG. 4 for details.
  • the touch packaging layer 500 is formed. At this time, due to the barrier unit 310 and the opening 330, the touch packaging The layer 500 will also be naturally broken into the first touch package unit 510 located on the first array package unit 341 and the second touch package unit 520 located in the opening 330.
  • the covering unit 400 may be formed on the first touch package unit 510 and fill the opening 330 , and the covering unit 400 may not be manufactured again.
  • the step of etching the touch encapsulation layer 500 may not be performed, and even if there is a crack when cutting the display panel 100 , the crack will not be transmitted to the display area A.
  • the barrier unit 310 includes a side wall, the side wall is set corresponding to the opening 330 , and the side wall is an arc surface that is concave toward the center corresponding to the barrier unit 310 , please refer to FIG. 5 for details.
  • This structure can increase the probability of the encapsulation film layer breaking naturally in the opening 330 , thereby ensuring that the encapsulation film layer in the edge area B can be separated from the encapsulation film layer in the display area A.
  • the size of the opening 330 gradually increases, please refer to FIG. 6 for details.
  • the larger the size of the opening 330 the probability of natural fracture of the encapsulation film layer in the opening 330 can be increased, thereby ensuring that the encapsulation film layer in the edge area B can be connected with the encapsulation film layer in the display area A. Partition settings.
  • the packaging component near the display area A is connected to the packaging film layer in the display area A.
  • FIG. 6 it is inconvenient to distinguish between the display area A and the edge area B, but It can be seen that the packaging member on the side close to the display area A, taking the first packaging film layer 320 as an example, is arranged in connection with the array substrate packaging layer 210 in the display area A.
  • the encapsulation component can be formed through a photomask in the same process as the corresponding film layer in the display area A, and the encapsulation component can be formed through different light transmittances of the photomask.
  • the cross-sectional area of the barrier unit 310 becomes larger and larger, and the first cross-section is parallel to the substrate. Bottom 200.
  • the sidewall of the barrier unit 310 is a plane, and in the direction away from the display area A, the angle between the sidewall of the barrier unit 310 and the substrate 200 gradually increases, Please refer to FIG. 6 for details, which can increase the probability of natural fracture of the encapsulation film layer in the opening 330 , thereby ensuring that the encapsulation film layer in the edge area B can be separated from the encapsulation film layer in the display area A.
  • the number density of the openings 330 gradually increases, which can increase the probability of natural fracture of the packaging film layer in the openings 330, thereby ensuring that the edge area B
  • the encapsulation film layer in the display area A may be separated from the encapsulation film layer in the display area A.
  • the display panel 100 further includes a plurality of dams located between the second inorganic layer 312 and the array substrate encapsulation layer 210
  • the body 220, the side of the barrier unit 310 close to the side away from the display area A is perpendicular to the substrate 200, which can better block the intrusion of water and oxygen.
  • the dam body 220 can be made of organic materials. In the direction from the center of the display panel 100 to the edge region B, the thickness of the dam body 220 gradually increases, and the dam body 220 can provide a better effect of blocking water and oxygen.
  • barrier units with different upper and lower end surfaces are arranged in the edge region, so that when the encapsulation film layer is formed, the encapsulation film layer is broken in the opening between two adjacent barrier units, and when the display panel is cut, Even if a crack occurs, the crack will not extend to the display area, which ensures the packaging effect and improves the yield rate of the display panel.
  • the embodiment of the present invention also provides a method for manufacturing a display panel 100, the display panel 100 includes a display area A and an edge area B located on the periphery of the display area A, the manufacturing of the display panel 100 Methods include:
  • the area of the end surface of the barrier unit 310 close to the substrate 200 is smaller than the area of the end surface of the barrier unit 310 away from the substrate 200, the first array package unit 341 and the second array package unit 342 separate settings.
  • barrier units with different upper and lower end surfaces are arranged in the edge region, so that when the encapsulation film layer is formed, the encapsulation film layer is broken in the opening between two adjacent barrier units, and when the display panel is cut, Even if a crack occurs, the crack will not extend to the display area, which ensures the packaging effect and improves the yield rate of the display panel.
  • the manufacturing method of the display panel 100 includes:
  • step S100 includes:
  • step S200 includes:
  • the first inorganic layer 311 and the second inorganic layer 312 may be inorganic film layers in the array substrate of the display panel 100, for example, the first inorganic layer 311 may be an insulating layer, and the material It may be a silicon nitride compound or/and an oxygen silicon compound, and the second inorganic layer 312 may be a passivation layer, and the material may be a silicon nitrogen compound or/and an oxygen silicon compound, which is not specifically limited here.
  • the inorganic material film layer on the substrate 200 in the edge region B may form the first layer and the second layer, that is, the barrier unit 310 .
  • step S210 includes:
  • the barrier unit 310 includes a first inorganic layer 311 on the substrate 200 and a second inorganic layer 312 on the first inorganic layer 311; wherein, the first array packaging unit
  • the thickness of 341 is the same as that of the second array packaging unit 342 , please refer to FIG. 1 for details.
  • the first array encapsulation unit 341 and the second array encapsulation unit 342 are formed by breaking the encapsulation film layer at the barrier unit 310 and the opening 330 to form the first array separately.
  • the packaging unit 341 and the second array packaging unit 342 so the thickness of the first array packaging unit 341 is the same as the thickness of the second array packaging unit 342 .
  • the first inorganic layer 311 and the second inorganic layer 312 can be inorganic film layers in the array substrate of the display panel 100, for example, the first inorganic layer 311 can be an insulating layer, and the material can be a silicon nitride compound or/and an oxygen silicon compound, the second inorganic layer 312 may be a passivation layer, and the material may be a nitrogen silicon compound or/and an oxygen silicon compound, which is not specifically limited here.
  • the substrate 200 is located in the display area A and the edge area B, and the first inorganic layer 311 and the second inorganic layer 312 extend into the display area A.
  • the display panel 100 further includes an array substrate on the substrate 200 and an array substrate encapsulation layer 210 on the array substrate, and the array substrate and the array substrate encapsulation layer 210 are on the in display area A.
  • the array substrate includes the first inorganic layer 311 and the second inorganic layer 312 , please refer to FIG. 1 for details.
  • the display panel 100 further includes a cover unit 400 located on a plurality of the barrier units 310, and the cover unit 400 fills the opening 330 between two adjacent barrier units 310, specifically See Figure 2.
  • the covering unit 400 can be made of an organic material, which can provide a certain flexibility of the edge region B and reduce the risk of crack transmission, and can also improve the packaging effect of the packaging component 300 .
  • the display panel 100 further includes an array substrate encapsulation layer 210 disposed in the display area A; the thickness of the array substrate encapsulation layer 210 is the same as that of the first array encapsulation unit 341, so The thickness of the array substrate packaging layer 210 is the same as that of the second array packaging unit 342 , please refer to FIG. 1 and FIG. 2 for details.
  • the first array packaging unit 341 and the second array packaging unit 342 can be formed at the same time as the array substrate packaging layer 210, so the thicknesses of the three are the same, and the first array packaging unit 341 remains in the On the barrier unit 310 , the first array packaging unit 341 may be disposed on the same layer as the array substrate packaging layer 210 near the edge region B.
  • the packaging member further includes a touch encapsulation layer 500 on the cover unit 400, the touch encapsulation layer 500 is also located in the display area A, and the touch encapsulation layer 500 in the edge area B
  • the orthographic projection of the touch encapsulation layer 500 on the cover unit 400 is located inside the cover unit 400 , please refer to FIG. 3 for details.
  • the display panel 100 also includes a related structure of a touch encapsulation layer 500, the touch encapsulation layer 500 is located on the cover unit 400 and extends into the display area A, and the touch control structure of the display panel 100
  • the touch encapsulation layer 500 is etched, and the part of the touch encapsulation layer 500 away from the display area A is etched away, so that when the display panel 100 is cut, The risk of cracking of the touch encapsulation layer 500 at the cut site is reduced, and the transmission of cracks to the display area A of the display panel 100 is reduced from the root.
  • the package member further includes a first touch package unit 510 located on the first array package unit 341 and a second touch package unit 520 located on the second array package unit 342, so The first touch encapsulation unit 510 and the second touch encapsulation unit 520 are disposed separately, please refer to FIG. 4 for details.
  • the touch packaging layer 500 is formed. At this time, due to the barrier unit 310 and the opening 330, the touch packaging The layer 500 will also be naturally broken into the first touch package unit 510 located on the first array package unit 341 and the second touch package unit 520 located in the opening 330.
  • the covering unit 400 may be formed on the first touch package unit 510 and fill the opening 330 , and the covering unit 400 may not be manufactured again.
  • the step of etching the touch encapsulation layer 500 may not be performed, and even if there is a crack when cutting the display panel 100 , the crack will not be transmitted to the display area A.
  • the barrier unit 310 includes a side wall, the side wall is set corresponding to the opening 330 , and the side wall is an arc surface that is concave toward the center corresponding to the barrier unit 310 , please refer to FIG. 5 for details.
  • This structure can increase the probability of the encapsulation film layer breaking naturally in the opening 330 , thereby ensuring that the encapsulation film layer in the edge area B can be separated from the encapsulation film layer in the display area A.
  • the size of the opening 330 gradually increases, please refer to FIG. 6 for details.
  • the larger the size of the opening 330 the probability of natural fracture of the encapsulation film layer in the opening 330 can be increased, thereby ensuring that the encapsulation film layer in the edge area B can be connected with the encapsulation film layer in the display area A. Partition settings.
  • the packaging component 300 includes a plurality of barrier units 310 and packaging components that are separately arranged, and the packaging components include a first array packaging unit 341 located on the barrier unit 310 and two adjacent barrier units The second array packaging unit 342 in the opening 330 between 310, please refer to FIG. 1 for details.
  • the display panel 100 further includes an array substrate encapsulation layer 210 disposed in the display area A; the thickness of the array substrate encapsulation layer 210 is the same as that of the first array encapsulation unit 341, so The thickness of the array substrate packaging layer 210 is the same as the thickness of the second array packaging unit 342 , please refer to FIG. 1 for details.
  • the first array packaging unit 341 and the second array packaging unit 342 can be formed at the same time as the array substrate packaging layer 210, so the thicknesses of the three are the same, and the first array packaging unit 341 remains in the On the barrier unit 310 , the first array packaging unit 341 may be disposed on the same layer as the array substrate packaging layer 210 near the edge region B.
  • the manufacturing method of the display panel 100 further includes:
  • the display panel 100 further includes a cover unit 400 located on a plurality of the barrier units 310, and the cover unit 400 fills the opening 330 between two adjacent barrier units 310, specifically See Figure 2.
  • the covering unit 400 can be made of an organic material, which can provide a certain flexibility of the edge region B and reduce the risk of crack transmission, and can also improve the packaging effect of the packaging component 300 .
  • step S500 includes:
  • the package member further includes a first touch package unit 510 located on the first array package unit 341 and a second touch package unit 520 located on the second array package unit 342, so The first touch encapsulation unit 510 and the second touch encapsulation unit 520 are disposed separately, please refer to FIG. 4 for details.
  • the touch packaging layer 500 is formed. At this time, due to the barrier unit 310 and the opening 330, the touch packaging The layer 500 will also be naturally broken into the first touch package unit 510 located on the first array package unit 341 and the second touch package unit 520 located in the opening 330.
  • the covering unit 400 may be formed on the first touch package unit 510 and fill the opening 330 , and the covering unit 400 may not be manufactured again.
  • the step of etching the touch encapsulation layer 500 may not be performed, and even if there is a crack when cutting the display panel 100 , the crack will not be transmitted to the display area A.
  • step S510 may or may not be executed, and step S520 may or may not be executed, and the matching steps may be combined into: 1. S510; 2. S510, S520; 3. S500.
  • the manufacturing method of the display panel 100 further includes:
  • step S600 includes:
  • the packaging member further includes a touch encapsulation layer 500 on the cover unit 400, the touch encapsulation layer 500 is also located in the display area A, and the touch encapsulation layer 500 in the edge area B
  • the orthographic projection of the touch encapsulation layer 500 on the cover unit 400 is located inside the cover unit 400 , please refer to FIG. 3 for details.
  • the display panel 100 also includes a related structure of a touch encapsulation layer 500, the touch encapsulation layer 500 is located on the cover unit 400 and extends into the display area A, and the touch control structure of the display panel 100
  • the touch encapsulation layer 500 is etched, and the part of the touch encapsulation layer 500 away from the display area A is etched away, so that when the display panel 100 is cut, The risk of cracking of the touch encapsulation layer 500 at the cut site is reduced, and the transmission of cracks to the display area A of the display panel 100 is reduced from the root.
  • barrier units with different upper and lower end surfaces are arranged in the edge region, so that when the encapsulation film layer is formed, the encapsulation film layer is broken in the opening between two adjacent barrier units, and when the display panel is cut, Even if a crack occurs, the crack will not extend to the display area, which ensures the packaging effect and improves the yield rate of the display panel.
  • an embodiment of the present invention also provides a mobile terminal 10 , including any one of the above-mentioned display panels 100 and a terminal body 20 , where the terminal body 20 is combined with the display panel 100 .
  • the terminal body 20 may include a middle frame, a frame glue, etc., which are not specifically limited here.
  • the embodiment of the present invention discloses a display panel and a mobile terminal; the display panel includes a display area and an edge area; the display panel includes a substrate arranged in the edge area and a packaging component, and the packaging component includes a plurality of A barrier unit, a package member and an opening between two adjacent barrier units, the package member includes a first array package unit located on the barrier unit and a second array package unit located in the opening; the first array package The unit and the second array packaging unit are arranged separately, and the area of the end surface of the barrier unit close to the substrate is smaller than the area of the end surface away from the substrate; in the embodiment of the present invention, barrier units with different upper and lower end surface areas are provided in the edge region When forming the encapsulation film layer, the encapsulation film layer is broken in the opening between two adjacent barrier units, even if a crack occurs, it will not extend into the display area, thus ensuring the encapsulation effect.

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Abstract

本发明实施例公开了一种显示面板及移动终端；显示面板包括设置于边缘区内的衬底、分离设置的多个阻隔单元、位于相邻两个阻隔单元之间的开口及分离设置的第一阵列封装单元和第二阵列封装单元，阻隔单元的端面的面积相异；本发明实施例通过上下端面的面积不同的阻隔单元，在封装成膜时，使封装膜在开口内断裂，避免裂纹延伸。

Description

显示面板及移动终端 技术领域
本申请涉及显示领域，尤其涉及一种显示面板及移动终端。
 背景技术
近些年，显示面板的使用寿命越来越收到关注，在切割显示面板时，显示面板在边缘区的无机封装层容易受到破坏而产生裂纹，裂纹延伸至显示区会导致封装不良，由于无机封装层通常包括多层无机层，厚度加大，更容易导致无机封装层容易受到破坏而产生裂纹。
因此，亟需一种显示面板及移动终端以解决上述技术问题。
 技术问题
本发明实施例提供一种显示面板及移动终端，可以缓解目前在切割显示面板时，无机封装层容易受到破坏而产生裂纹，裂纹延伸至显示区会导致封装不良的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请实施例提供了一种显示面板，包括显示区及位于所述显示区外围的边缘区；
所述显示面板包括设置于所述边缘区内的衬底和位于所述衬底上的封装部件，所述封装部件包括分离设置的多个阻隔单元、封装构件及位于相邻两个阻隔单元之间的开口，所述封装构件包括位于所述阻隔单元上的第一阵列封装单元及位于所述开口内的第二阵列封装单元；
其中，所述第一阵列封装单元和所述第二阵列封装单元分离设置，所述阻隔单元靠近所述衬底的端面的面积小于所述阻隔单元远离所述衬底的端面的面积。
在一实施例中，所述阻隔单元包括位于所述衬底上的第一无机层及位于所述第一无机层上的第二无机层；其中，所述第一阵列封装单元的厚度与所述第二阵列封装单元的厚度相同。
在一实施例中，所述显示面板还包括位于多个所述阻隔单元上的覆盖单元，所述覆盖单元填充相邻两个所述阻隔单元之间的所述开口。
在一实施例中，所述显示面板还包括设置于所述显示区内的阵列基板封装层；所述阵列基板封装层的厚度与所述第一阵列封装单元的厚度相同，所述阵列基板封装层的厚度与所述第二阵列封装单元的厚度相同。
在一实施例中，在所述显示区内靠近所述边缘区一侧，所述显示面板还包括位于所述第二无机层与所述阵列基板封装层之间的多个坝体。
在一实施例中，所述封装构件还包括位于所述覆盖单元上的触控封装层，所述触控封装层还位于所述显示区内，所述边缘区内的所述触控封装层在所述覆盖单元上的正投影位于所述覆盖单元内。
在一实施例中，所述封装构件还包括位于所述第一阵列封装单元上的第一触控封装单元及位于所述第二阵列封装单元上的第二触控封装单元，所述第一触控封装单元和所述第二触控封装单元分离设置。
在一实施例中，所述阻隔单元包括侧壁，所述侧壁对应所述开口设置，所述侧壁为向对应所述阻隔单元中心凹陷的弧面。
在一实施例中，在远离所述显示区的方向上，所述开口的尺寸逐渐增大。
在一实施例中，靠近所述显示区一侧的所述封装构件与所述显示区内的封装膜层连接设置。
本申请实施例还提供了一种移动终端，包括显示面板及终端主体，所述终端主体与所述显示面板组合为一体，所述显示面板包括显示区及位于所述显示区外围的边缘区；
所述显示面板包括设置于所述边缘区内的衬底和位于所述衬底上的封装部件，所述封装部件包括分离设置的多个阻隔单元、封装构件及位于相邻两个阻隔单元之间的开口，所述封装构件包括位于所述阻隔单元上的第一阵列封装单元及位于所述开口内的第二阵列封装单元；
其中，所述第一阵列封装单元和所述第二阵列封装单元分离设置，所述阻隔单元靠近所述衬底的端面的面积小于所述阻隔单元远离所述衬底的端面的面积。
在一实施例中，所述阻隔单元包括位于所述衬底上的第一无机层及位于所述第一无机层上的第二无机层；其中，所述第一阵列封装单元的厚度与所述第二阵列封装单元的厚度相同。
在一实施例中，所述显示面板还包括位于多个所述阻隔单元上的覆盖单元，所述覆盖单元填充相邻两个所述阻隔单元之间的所述开口。
在一实施例中，所述显示面板还包括设置于所述显示区内的阵列基板封装层；所述阵列基板封装层的厚度与所述第一阵列封装单元的厚度相同，所述阵列基板封装层的厚度与所述第二阵列封装单元的厚度相同。
在一实施例中，在所述显示区内靠近所述边缘区一侧，所述显示面板还包括位于所述第二无机层与所述阵列基板封装层之间的多个坝体。
在一实施例中，所述封装构件还包括位于所述覆盖单元上的触控封装层，所述触控封装层还位于所述显示区内，所述边缘区内的所述触控封装层在所述覆盖单元上的正投影位于所述覆盖单元内。
在一实施例中，所述封装构件还包括位于所述第一阵列封装单元上的第一触控封装单元及位于所述第二阵列封装单元上的第二触控封装单元，所述第一触控封装单元和所述第二触控封装单元分离设置。
在一实施例中，所述阻隔单元包括侧壁，所述侧壁对应所述开口设置，所述侧壁为向对应所述阻隔单元中心凹陷的弧面。
在一实施例中，在远离所述显示区的方向上，所述开口的尺寸逐渐增大。
在一实施例中，靠近所述显示区一侧的所述封装构件与所述显示区内的封装膜层连接设置。
 有益效果
本发明实施例通过在边缘区内设置上下端面的面积不同的阻隔单元，在形成封装膜层时，使封装膜层在相邻两个阻隔单元之间的开口内断裂，在切割显示面板时，即使产生裂纹，裂纹不会延伸至显示区内，保证了封装效果，提高了显示面板良率。
 附图说明
图1是本发明实施例提供的显示面板的第一种结构的结构示意图；
图2是本发明实施例提供的显示面板的第二种结构的结构示意图；
图3是本发明实施例提供的显示面板的第三种结构的结构示意图；
图4是本发明实施例提供的显示面板的第四种结构的结构示意图；
图5是本发明实施例提供的显示面板的第五种结构的结构示意图；
图6是本发明实施例提供的显示面板的第六种结构的结构示意图；
图7是本发明实施例提供的显示面板的第七种结构的结构示意图；
图8是本发明实施例提供的显示面板的制作方法的步骤流程图；
图9是本发明实施例提供的移动终端的结构示意图。
 本发明的实施方式
本申请提供一种显示面板及移动终端，为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
本申请实施例提供一种显示面板及其制备方法。以下分别进行详细说明。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
请参阅图1至图7，本发明实施例提供一种显示面板100，包括显示区A及位于所述显示区A外围的边缘区B；
所述显示面板100包括设置于所述边缘区B内的衬底200和位于所述衬底200上的封装部件300，所述封装部件300包括分离设置的多个阻隔单元310、封装构件及位于相邻两个阻隔单元310之间的开口330，所述封装构件包括位于所述阻隔单元310上的第一阵列封装单元341及位于所述开口330内的第二阵列封装单元342；
其中，所述第一阵列封装单元341和所述第二阵列封装单元342分离设置，所述阻隔单元310靠近所述衬底200的端面的面积小于所述阻隔单元310远离所述衬底200的端面的面积。
本发明实施例通过在边缘区内设置上下端面的面积不同的阻隔单元，在形成封装膜层时，使封装膜层在相邻两个阻隔单元之间的开口内断裂，在切割显示面板时，即使产生裂纹，裂纹不会延伸至显示区内，保证了封装效果，提高了显示面板良率。
现结合具体实施例对本发明的技术方案进行描述。
所述显示面板100包括显示区A及位于所述显示区A外围的边缘区B；所述显示面板100包括设置于所述边缘区B内的衬底200和位于所述衬底200上的封装部件300，所述封装部件300包括分离设置的多个阻隔单元310、封装构件及位于相邻两个阻隔单元310之间的开口330，所述封装构件包括位于所述阻隔单元310上的第一阵列封装单元341及位于相邻两个所述阻隔单元310之间的第二阵列封装单元342，所述第二阵列封装单元342位于所述开口330内；其中，所述第一阵列封装单元341和所述第二阵列封装单元342分离设置，所述阻隔单元310靠近所述衬底200的端面的面积小于所述阻隔单元310远离所述衬底200的端面的面积，具体请参阅图1。
本实施例中，所述阻隔单元310包括位于所述衬底200上的第一无机层311及位于所述第一无机层311上的第二无机层312；其中，所述第一阵列封装单元341的厚度与所述第二阵列封装单元342的厚度相同，具体请参阅图1。所述第一阵列封装单元341与所述第二阵列封装单元342是在形成封装膜层时，封装膜层在所述阻隔单元310及所述开口330处断裂形成分离设置的所述第一阵列封装单元341及所述第二阵列封装单元342，所以所述第一阵列封装单元341的厚度与所述第二阵列封装单元342的厚度相同。所述第一无机层311及所述第二无机层312可以为所述显示面板100的阵列基板中的无机膜层，例如所述第一无机层311可以为绝缘层，材料可以为氮硅化合物或/和氧硅化合物，所述第二无机层312可以为钝化层，材料可以为氮硅化合物或/和氧硅化合物，在此不做具体限制。
本实施例中，所述衬底200位于所述显示区A及所述边缘区B内，所述第一无机层311及所述第二无机层312向所述显示区A内延伸，具体请参阅图1，所述显示面板100还包括位于所述衬底200上的阵列基板及位于所述阵列基板上的阵列基板封装层210，所述阵列基板及所述阵列基板封装层210位于所述显示区A内。
本实施例中，所述阵列基板包括所述第一无机层311及所述第二无机层312，具体请参阅图1。
本实施例中，所述显示面板100还包括位于多个所述阻隔单元310上的覆盖单元400，所述覆盖单元400填充相邻两个所述阻隔单元310之间的所述开口330，具体请参阅图2。所述覆盖单元400可以为有机材料，可以提供所述边缘区B一定的柔性及降低裂纹传递的风险，还可以提高所述封装部件300的封装效果。
本实施例中，所述显示面板100还包括设置于所述显示区A内的阵列基板封装层210；所述阵列基板封装层210的厚度与所述第一阵列封装单元341的厚度相同，所述阵列基板封装层210的厚度与所述第二阵列封装单元342的厚度相同，具体请参阅图1、图2。所述第一阵列封装单元341及所述第二阵列封装单元342可以与所述阵列基板封装层210是同时形成的，所以三者的厚度相同，所述第一阵列封装单元341留在所述阻隔单元310上，所述第一阵列封装单元341可以与靠近所述边缘区B的所述阵列基板封装层210同层设置。
本实施例中，所述封装构件还包括位于所述覆盖单元400上的触控封装层500，所述触控封装层500还位于所述显示区A内，所述边缘区B内的所述触控封装层500在所述覆盖单元400上的正投影位于所述覆盖单元400内，具体请参阅图3。所述显示面板100还包括触控封装层500的相关结构，所述触控封装层500位于所述覆盖单元400上并向所述显示区A内延伸，对所述显示面板100的触控结构进行封装保护，在制作显示面板100时，对所述触控封装层500做刻蚀，刻蚀掉远离所述显示区A的部分所述触控封装层500，从而在切割显示面板100时，降低所述触控封装层500在切割处的破裂风险，从根源上减少了破裂的裂纹传递给显示面板100的显示区A。
本实施例中，所述封装构件还包括位于所述第一阵列封装单元341上的第一触控封装单元510及位于所述第二阵列封装单元342上的第二触控封装单元520，所述第一触控封装单元510和所述第二触控封装单元520分离设置，具体请参阅图4。在形成所述第一阵列封装单元341及所述第二阵列封装单元342后，形成所述触控封装层500，此时，由于所述阻隔单元310及所述开口330，所述触控封装层500也会自然断裂成位于所述第一阵列封装单元341上的所述第一触控封装单元510及位于所述开口330内的所述第二触控封装单元520，在后续制作时，所述覆盖单元400可以形成在所述第一触控封装单元510及填充所述开口330，所述覆盖单元400也可以不用再制作。刻蚀所述触控封装层500的步骤也可以不做，在切割所述显示面板100时，即使有裂纹，裂纹也不会传递至所述显示区A。
本实施例中，所述阻隔单元310包括侧壁，所述侧壁对应所述开口330设置，所述侧壁为向对应所述阻隔单元310中心凹陷的弧面，具体请参阅图5。该结构可以提高封装膜层在所述开口330内自然断裂的几率，从而保证所述边缘区B内的封装膜层可以与所述显示区A内的封装膜层可以隔断设置。
本实施例中，在远离所述显示区A的方向上，所述开口330的尺寸逐渐增大，具体请参阅图6。越大尺寸的所述开口330，可以提高封装膜层在所述开口330内自然断裂的几率，从而保证所述边缘区B内的封装膜层可以与所述显示区A内的封装膜层可以隔断设置。
本实施例中，靠近所述显示区A一侧所述封装构件与所述显示区A内的封装膜层连接设置，具体请参阅图6，在显示区A及边缘区B界限不便区分，但可以看出靠近所述显示区A一侧所述封装构件，以第一封装膜层320为例，是与显示区A内的阵列基板封装层210连接设置的。所述封装构件是同显示区A内的相应膜层可以在一道工艺，通过一个光罩形成的，通过光罩的不同光透过率，可以形成所述封装构件。
本实施例中，在第一截面上，在所述衬底200至所述覆盖单元400的方向上，所述阻隔单元310的截面积越来越大，所述第一截面平行与所述衬底200。
本实施例中，所述阻隔单元310的侧壁为平面，在远离所述显示区A的方向上，所述阻隔单元310的侧壁与所述衬底200之间的夹角逐渐增大，具体请参阅图6，可以提高封装膜层在所述开口330内自然断裂的几率，从而保证所述边缘区B内的封装膜层可以与所述显示区A内的封装膜层可以隔断设置。
本实施例中，在远离所述显示区A的方向上，所述开口330的数量密度逐渐增大，可以提高封装膜层在所述开口330内自然断裂的几率，从而保证所述边缘区B内的封装膜层可以与所述显示区A内的封装膜层可以隔断设置。
本实施例中，在所述显示区A内靠近所述边缘区B一侧，所述显示面板100还包括位于所述第二无机层312与所述阵列基板封装层210之间的多个坝体220，靠近远离所述显示区A一侧的阻隔单元310的侧面与所述衬底200垂直，可以更好阻挡水氧入侵，具体请参阅图7，所述坝体220可以为有机材料，在所述显示面板100的中心至所述边缘区B的方向上，所述坝体220的厚度逐渐增大，所述坝体220可以提供更好的阻隔水氧的效果。
本发明实施例通过在边缘区内设置上下端面的面积不同的阻隔单元，在形成封装膜层时，使封装膜层在相邻两个阻隔单元之间的开口内断裂，在切割显示面板时，即使产生裂纹，裂纹不会延伸至显示区内，保证了封装效果，提高了显示面板良率。
请参阅图8，本发明实施例还提供了一种显示面板100的制作方法，所述显示面板100包括显示区A及位于所述显示区A外围的边缘区B，所述显示面板100的制作方法包括：
S100、在所述边缘区B内形成衬底200。
S200、在所述衬底200上形成无机材料膜层。
S300、对所述无机材料膜层进行图案化处理，形成分离设置的多个阻隔单元310及位于相邻两个所述阻隔单元310之间的开口330。
S400、在所述阻隔单元310上沉积封装材料膜层，形成位于所述阻隔单元310上的第一阵列封装单元341及位于所述开口330内的第二阵列封装单元342；
其中，所述阻隔单元310靠近所述衬底200的端面的面积小于所述阻隔单元310远离所述衬底200的端面的面积，所述第一阵列封装单元341和所述第二阵列封装单元342分离设置。
本发明实施例通过在边缘区内设置上下端面的面积不同的阻隔单元，在形成封装膜层时，使封装膜层在相邻两个阻隔单元之间的开口内断裂，在切割显示面板时，即使产生裂纹，裂纹不会延伸至显示区内，保证了封装效果，提高了显示面板良率。
现结合具体实施例对本发明的技术方案进行描述。
所述显示面板100的制作方法包括：
S100、在所述边缘区B内形成衬底200。
本实施例中，步骤S100包括：
S110、在所述边缘区B及所述显示区A内形成衬底200。
S200、在所述衬底200上形成无机材料膜层。
本实施例中，步骤S200包括：
S210、在所述衬底200上形成阵列基板。
本实施例中，所述第一无机层311及所述第二无机层312可以为所述显示面板100的阵列基板中的无机膜层，例如所述第一无机层311可以为绝缘层，材料可以为氮硅化合物或/和氧硅化合物，所述第二无机层312可以为钝化层，材料可以为氮硅化合物或/和氧硅化合物，在此不做具体限制。
本实施例中，位于所述边缘区B内所述衬底200上的所述无机材料膜层可以形成所述第一层及所述第二层，即所述阻隔单元310。
本实施例中，步骤S210包括：
S211、在所述衬底200上形成无机材料膜层。
S300、对所述无机材料膜层进行图案化处理，形成分离设置的多个阻隔单元310及位于相邻两个所述阻隔单元310之间的开口330。
本实施例中，所述阻隔单元310包括位于所述衬底200上的第一无机层311及位于所述第一无机层311上的第二无机层312；其中，所述第一阵列封装单元341的厚度与所述第二阵列封装单元342的厚度相同，具体请参阅图1。所述第一阵列封装单元341与所述第二阵列封装单元342是在形成封装膜层时，封装膜层在所述阻隔单元310及所述开口330处断裂形成分离设置的所述第一阵列封装单元341及所述第二阵列封装单元342，所以所述第一阵列封装单元341的厚度与所述第二阵列封装单元342的厚度相同。所述第一无机层311及所述第二无机层312可以为所述显示面板100的阵列基板中的无机膜层，例如所述第一无机层311可以为绝缘层，材料可以为氮硅化合物或/和氧硅化合物，所述第二无机层312可以为钝化层，材料可以为氮硅化合物或/和氧硅化合物，在此不做具体限制。
本实施例中，所述衬底200位于所述显示区A及所述边缘区B内，所述第一无机层311及所述第二无机层312向所述显示区A内延伸，具体请参阅图1，所述显示面板100还包括位于所述衬底200上的阵列基板及位于所述阵列基板上的阵列基板封装层210，所述阵列基板及所述阵列基板封装层210位于所述显示区A内。
本实施例中，所述阵列基板包括所述第一无机层311及所述第二无机层312，具体请参阅图1。
本实施例中，所述显示面板100还包括位于多个所述阻隔单元310上的覆盖单元400，所述覆盖单元400填充相邻两个所述阻隔单元310之间的所述开口330，具体请参阅图2。所述覆盖单元400可以为有机材料，可以提供所述边缘区B一定的柔性及降低裂纹传递的风险，还可以提高所述封装部件300的封装效果。
本实施例中，所述显示面板100还包括设置于所述显示区A内的阵列基板封装层210；所述阵列基板封装层210的厚度与所述第一阵列封装单元341的厚度相同，所述阵列基板封装层210的厚度与所述第二阵列封装单元342的厚度相同，具体请参阅图1、图2。所述第一阵列封装单元341及所述第二阵列封装单元342可以与所述阵列基板封装层210是同时形成的，所以三者的厚度相同，所述第一阵列封装单元341留在所述阻隔单元310上，所述第一阵列封装单元341可以与靠近所述边缘区B的所述阵列基板封装层210同层设置。
本实施例中，所述封装构件还包括位于所述覆盖单元400上的触控封装层500，所述触控封装层500还位于所述显示区A内，所述边缘区B内的所述触控封装层500在所述覆盖单元400上的正投影位于所述覆盖单元400内，具体请参阅图3。所述显示面板100还包括触控封装层500的相关结构，所述触控封装层500位于所述覆盖单元400上并向所述显示区A内延伸，对所述显示面板100的触控结构进行封装保护，在制作显示面板100时，对所述触控封装层500做刻蚀，刻蚀掉远离所述显示区A的部分所述触控封装层500，从而在切割显示面板100时，降低所述触控封装层500在切割处的破裂风险，从根源上减少了破裂的裂纹传递给显示面板100的显示区A。
本实施例中，所述封装构件还包括位于所述第一阵列封装单元341上的第一触控封装单元510及位于所述第二阵列封装单元342上的第二触控封装单元520，所述第一触控封装单元510和所述第二触控封装单元520分离设置，具体请参阅图4。在形成所述第一阵列封装单元341及所述第二阵列封装单元342后，形成所述触控封装层500，此时，由于所述阻隔单元310及所述开口330，所述触控封装层500也会自然断裂成位于所述第一阵列封装单元341上的所述第一触控封装单元510及位于所述开口330内的所述第二触控封装单元520，在后续制作时，所述覆盖单元400可以形成在所述第一触控封装单元510及填充所述开口330，所述覆盖单元400也可以不用再制作。刻蚀所述触控封装层500的步骤也可以不做，在切割所述显示面板100时，即使有裂纹，裂纹也不会传递至所述显示区A。
本实施例中，所述阻隔单元310包括侧壁，所述侧壁对应所述开口330设置，所述侧壁为向对应所述阻隔单元310中心凹陷的弧面，具体请参阅图5。该结构可以提高封装膜层在所述开口330内自然断裂的几率，从而保证所述边缘区B内的封装膜层可以与所述显示区A内的封装膜层可以隔断设置。
本实施例中，在远离所述显示区A的方向上，所述开口330的尺寸逐渐增大，具体请参阅图6。越大尺寸的所述开口330，可以提高封装膜层在所述开口330内自然断裂的几率，从而保证所述边缘区B内的封装膜层可以与所述显示区A内的封装膜层可以隔断设置。
S400、在所述阻隔单元310上沉积封装材料膜层，形成位于所述阻隔单元310上的第一阵列封装单元341及位于所述开口330内的第二阵列封装单元342。
本实施例中，封装部件300包括分离设置的多个阻隔单元310及封装构件，所述封装构件包括位于所述阻隔单元310上的第一阵列封装单元341及位于相邻两个所述阻隔单元310之间的开口330内的第二阵列封装单元342，具体请参阅图1。
本实施例中，所述显示面板100还包括设置于所述显示区A内的阵列基板封装层210；所述阵列基板封装层210的厚度与所述第一阵列封装单元341的厚度相同，所述阵列基板封装层210的厚度与所述第二阵列封装单元342的厚度相同，具体请参阅图1。所述第一阵列封装单元341及所述第二阵列封装单元342可以与所述阵列基板封装层210是同时形成的，所以三者的厚度相同，所述第一阵列封装单元341留在所述阻隔单元310上，所述第一阵列封装单元341可以与靠近所述边缘区B的所述阵列基板封装层210同层设置。
本实施例中，所述显示面板100的制作方法还包括：
S500、在所述第一阵列封装单元341及所述第二阵列封装单元342上形成覆盖材料膜层，以形成覆盖单元400。
本实施例中，所述显示面板100还包括位于多个所述阻隔单元310上的覆盖单元400，所述覆盖单元400填充相邻两个所述阻隔单元310之间的所述开口330，具体请参阅图2。所述覆盖单元400可以为有机材料，可以提供所述边缘区B一定的柔性及降低裂纹传递的风险，还可以提高所述封装部件300的封装效果。
本实施例中，步骤S500包括：
S510、在所述第一阵列封装单元341及所述第二阵列封装单元342上形成触控封装材料膜层，以形成包括第一触控封装单元510及第二触控封装单元520的触控封装层500。
本实施例中，所述封装构件还包括位于所述第一阵列封装单元341上的第一触控封装单元510及位于所述第二阵列封装单元342上的第二触控封装单元520，所述第一触控封装单元510和所述第二触控封装单元520分离设置，具体请参阅图4。在形成所述第一阵列封装单元341及所述第二阵列封装单元342后，形成所述触控封装层500，此时，由于所述阻隔单元310及所述开口330，所述触控封装层500也会自然断裂成位于所述第一阵列封装单元341上的所述第一触控封装单元510及位于所述开口330内的所述第二触控封装单元520，在后续制作时，所述覆盖单元400可以形成在所述第一触控封装单元510及填充所述开口330，所述覆盖单元400也可以不用再制作。刻蚀所述触控封装层500的步骤也可以不做，在切割所述显示面板100时，即使有裂纹，裂纹也不会传递至所述显示区A。
S520、在所述第一触控封装单元510及所述第二触控封装单元520上形成覆盖材料膜层，以形成覆盖单元400。
本实施例中，步骤S510可执行，也可不执行，步骤S520可以执行，也可以不执行，可组成搭配步骤组合为：一、S510；二、S510、S520；三、S500。
本实施例中，当采用组合三时，所述显示面板100的制作方法还包括：
S600、在所述覆盖单元400上形成触控封装层500。
本实施例中，步骤S600包括：
S610、在所述覆盖单元400上形成触控封装材料膜层。
S620、对所述触控封装材料膜层进行蚀刻处理，形成触控封装层500。
本实施例中，所述封装构件还包括位于所述覆盖单元400上的触控封装层500，所述触控封装层500还位于所述显示区A内，所述边缘区B内的所述触控封装层500在所述覆盖单元400上的正投影位于所述覆盖单元400内，具体请参阅图3。所述显示面板100还包括触控封装层500的相关结构，所述触控封装层500位于所述覆盖单元400上并向所述显示区A内延伸，对所述显示面板100的触控结构进行封装保护，在制作显示面板100时，对所述触控封装层500做刻蚀，刻蚀掉远离所述显示区A的部分所述触控封装层500，从而在切割显示面板100时，降低所述触控封装层500在切割处的破裂风险，从根源上减少了破裂的裂纹传递给显示面板100的显示区A。
S700、对所述显示面板100进行切割。
本发明实施例通过在边缘区内设置上下端面的面积不同的阻隔单元，在形成封装膜层时，使封装膜层在相邻两个阻隔单元之间的开口内断裂，在切割显示面板时，即使产生裂纹，裂纹不会延伸至显示区内，保证了封装效果，提高了显示面板良率。
请参阅图9，本发明实施例还提供了一种移动终端10，包括如任一上述的显示面板100及终端主体20，所述终端主体20与所述显示面板100组合为一体。
所述显示面板100的具体结构请参阅任一上述的显示面板100的实施例及，图1至图7，在此不再赘述。
本实施例中，所述终端主体20可以包括中框、框胶等，在此不做具体限定。
本发明实施例公开了一种显示面板及移动终端；该显示面板包括显示区及边缘区；该显示面板包括设置于该边缘区内的衬底和封装部件，该封装部件包括分离设置的多个阻隔单元、封装构件及位于相邻两个阻隔单元之间的开口，该封装构件包括位于该阻隔单元上的第一阵列封装单元及位于该开口内的第二阵列封装单元；该第一阵列封装单元和该第二阵列封装单元分离设置，该阻隔单元靠近该衬底的端面的面积小于远离该衬底的端面的面积；本发明实施例通过在边缘区内设置上下端面的面积不同的阻隔单元，在形成封装膜层时，使封装膜层在相邻两个阻隔单元之间的开口内断裂，即使产生裂纹，也不会延伸至显示区内，保证了封装效果。
可以理解的是，对本领域普通技术人员来说，可以根据本申请的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本申请所附的权利要求的保护范围。

Claims (20)

  1. 一种显示面板，其中，包括显示区及位于所述显示区外围的边缘区；
    所述显示面板包括设置于所述边缘区内的衬底和位于所述衬底上的封装部件，所述封装部件包括分离设置的多个阻隔单元、封装构件及位于相邻两个阻隔单元之间的开口，所述封装构件包括位于所述阻隔单元上的第一阵列封装单元及位于所述开口内的第二阵列封装单元；
    其中，所述第一阵列封装单元和所述第二阵列封装单元分离设置，所述阻隔单元靠近所述衬底的端面的面积小于所述阻隔单元远离所述衬底的端面的面积。
  2. 根据权利要求1所述的显示面板，其中，所述阻隔单元包括位于所述衬底上的第一无机层及位于所述第一无机层上的第二无机层；
    其中，所述第一阵列封装单元的厚度与所述第二阵列封装单元的厚度相同。
  3. 根据权利要求2所述的显示面板，其中，所述显示面板还包括位于多个所述阻隔单元上的覆盖单元，所述覆盖单元填充相邻两个所述阻隔单元之间的所述开口。
  4. 根据权利要求3所述的显示面板，其中，所述显示面板还包括设置于所述显示区内的阵列基板封装层；
    所述阵列基板封装层的厚度与所述第一阵列封装单元的厚度相同，所述阵列基板封装层的厚度与所述第二阵列封装单元的厚度相同。
  5. 根据权利要求4所述的显示面板，其中，在所述显示区内靠近所述边缘区一侧，所述显示面板还包括位于所述第二无机层与所述阵列基板封装层之间的多个坝体。
  6. 根据权利要求3所述的显示面板，其中，所述封装构件还包括位于所述覆盖单元上的触控封装层，所述触控封装层还位于所述显示区内，所述边缘区内的所述触控封装层在所述覆盖单元上的正投影位于所述覆盖单元内。
  7. 根据权利要求1所述的显示面板，其中，所述封装构件还包括位于所述第一阵列封装单元上的第一触控封装单元及位于所述第二阵列封装单元上的第二触控封装单元，所述第一触控封装单元和所述第二触控封装单元分离设置。
  8. 根据权利要求1所述的显示面板，其中，所述阻隔单元包括侧壁，所述侧壁对应所述开口设置，所述侧壁为向对应所述阻隔单元中心凹陷的弧面。
  9. 根据权利要求1所述的显示面板，其中，在远离所述显示区的方向上，所述开口的尺寸逐渐增大。
  10. 根据权利要求1所述的显示面板，其中，靠近所述显示区一侧的所述封装构件与所述显示区内的封装膜层连接设置。
  11. 一种移动终端，其中，包括显示面板及终端主体，所述终端主体与所述显示面板组合为一体，所述显示面板包括显示区及位于所述显示区外围的边缘区；
    所述显示面板包括设置于所述边缘区内的衬底和位于所述衬底上的封装部件，所述封装部件包括分离设置的多个阻隔单元、封装构件及位于相邻两个阻隔单元之间的开口，所述封装构件包括位于所述阻隔单元上的第一阵列封装单元及位于所述开口内的第二阵列封装单元；
    其中，所述第一阵列封装单元和所述第二阵列封装单元分离设置，所述阻隔单元靠近所述衬底的端面的面积小于所述阻隔单元远离所述衬底的端面的面积。
  12. 根据权利要求11所述的移动终端，其中，所述阻隔单元包括位于所述衬底上的第一无机层及位于所述第一无机层上的第二无机层；
    其中，所述第一阵列封装单元的厚度与所述第二阵列封装单元的厚度相同。
  13. 根据权利要求12所述的移动终端，其中，所述显示面板还包括位于多个所述阻隔单元上的覆盖单元，所述覆盖单元填充相邻两个所述阻隔单元之间的所述开口。
  14. 根据权利要求13所述的移动终端，其中，所述显示面板还包括设置于所述显示区内的阵列基板封装层；
    所述阵列基板封装层的厚度与所述第一阵列封装单元的厚度相同，所述阵列基板封装层的厚度与所述第二阵列封装单元的厚度相同。
  15. 根据权利要求14所述的移动终端，其中，在所述显示区内靠近所述边缘区一侧，所述显示面板还包括位于所述第二无机层与所述阵列基板封装层之间的多个坝体。
  16. 根据权利要求13所述的移动终端，其中，所述封装构件还包括位于所述覆盖单元上的触控封装层，所述触控封装层还位于所述显示区内，所述边缘区内的所述触控封装层在所述覆盖单元上的正投影位于所述覆盖单元内。
  17. 根据权利要求11所述的移动终端，其中，所述封装构件还包括位于所述第一阵列封装单元上的第一触控封装单元及位于所述第二阵列封装单元上的第二触控封装单元，所述第一触控封装单元和所述第二触控封装单元分离设置。
  18. 根据权利要求11所述的移动终端，其中，所述阻隔单元包括侧壁，所述侧壁对应所述开口设置，所述侧壁为向对应所述阻隔单元中心凹陷的弧面。
  19. 根据权利要求11所述的移动终端，其中，在远离所述显示区的方向上，所述开口的尺寸逐渐增大。
  20. 根据权利要求11所述的移动终端，其中，靠近所述显示区一侧的所述封装构件与所述显示区内的封装膜层连接设置。
PCT/CN2021/105901 2021-06-16 2021-07-13 显示面板及移动终端 WO2022262033A1 (zh)

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