WO2022038865A1 - ポリアミド樹脂 - Google Patents
ポリアミド樹脂 Download PDFInfo
- Publication number
- WO2022038865A1 WO2022038865A1 PCT/JP2021/021855 JP2021021855W WO2022038865A1 WO 2022038865 A1 WO2022038865 A1 WO 2022038865A1 JP 2021021855 W JP2021021855 W JP 2021021855W WO 2022038865 A1 WO2022038865 A1 WO 2022038865A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyamide resin
- mol
- group
- derived
- acid
- Prior art date
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- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 119
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 76
- 125000003118 aryl group Chemical group 0.000 claims abstract description 63
- 150000004985 diamines Chemical class 0.000 claims abstract description 58
- 230000009477 glass transition Effects 0.000 claims abstract description 22
- 239000000470 constituent Substances 0.000 claims description 50
- 125000004432 carbon atom Chemical group C* 0.000 claims description 38
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 38
- 125000001931 aliphatic group Chemical group 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 16
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 16
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 12
- FVHFDNYRMIWPRS-UHFFFAOYSA-N 2-[4-(2-aminoethyl)phenyl]ethanamine Chemical compound NCCC1=CC=C(CCN)C=C1 FVHFDNYRMIWPRS-UHFFFAOYSA-N 0.000 claims description 10
- 229920006020 amorphous polyamide Polymers 0.000 claims description 10
- MMEDJBFVJUFIDD-UHFFFAOYSA-N 2-[2-(carboxymethyl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=CC=C1CC(O)=O MMEDJBFVJUFIDD-UHFFFAOYSA-N 0.000 claims description 7
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 38
- 238000010521 absorption reaction Methods 0.000 abstract description 28
- 239000003963 antioxidant agent Substances 0.000 description 65
- -1 aromatic dicarboxylic acids Chemical class 0.000 description 64
- 230000003078 antioxidant effect Effects 0.000 description 50
- 150000001875 compounds Chemical class 0.000 description 50
- 239000011342 resin composition Substances 0.000 description 47
- 239000003063 flame retardant Substances 0.000 description 37
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 36
- 239000000047 product Substances 0.000 description 34
- 150000003839 salts Chemical class 0.000 description 34
- 239000000835 fiber Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 30
- 229910052751 metal Inorganic materials 0.000 description 26
- 239000002184 metal Substances 0.000 description 26
- 239000002667 nucleating agent Substances 0.000 description 24
- 239000000203 mixture Substances 0.000 description 23
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 20
- 239000012779 reinforcing material Substances 0.000 description 20
- 125000001424 substituent group Chemical group 0.000 description 19
- 125000000217 alkyl group Chemical group 0.000 description 18
- 229910052698 phosphorus Inorganic materials 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 17
- 238000000465 moulding Methods 0.000 description 17
- 239000003365 glass fiber Substances 0.000 description 15
- 150000001412 amines Chemical class 0.000 description 13
- 239000011521 glass Substances 0.000 description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 12
- 125000004122 cyclic group Chemical group 0.000 description 12
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 12
- 239000002530 phenolic antioxidant Substances 0.000 description 12
- 239000011574 phosphorus Substances 0.000 description 12
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 12
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 12
- 229920005992 thermoplastic resin Polymers 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 239000003513 alkali Substances 0.000 description 10
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 238000006116 polymerization reaction Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 10
- 239000011734 sodium Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 9
- 150000002430 hydrocarbons Chemical group 0.000 description 9
- 229920002647 polyamide Polymers 0.000 description 9
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 8
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 8
- 239000007983 Tris buffer Substances 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 8
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 8
- 229910052783 alkali metal Inorganic materials 0.000 description 8
- 239000000446 fuel Substances 0.000 description 8
- 150000004820 halides Chemical class 0.000 description 8
- 229910052700 potassium Inorganic materials 0.000 description 8
- 239000011591 potassium Substances 0.000 description 8
- 229910052708 sodium Inorganic materials 0.000 description 8
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 7
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 7
- 239000005749 Copper compound Substances 0.000 description 6
- 239000004952 Polyamide Substances 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 125000000304 alkynyl group Chemical group 0.000 description 6
- 150000001880 copper compounds Chemical class 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 125000000753 cycloalkyl group Chemical group 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 125000004437 phosphorous atom Chemical group 0.000 description 6
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 6
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical compound NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 description 5
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 5
- 229910019142 PO4 Inorganic materials 0.000 description 5
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 5
- 125000003342 alkenyl group Chemical group 0.000 description 5
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 5
- 229910052794 bromium Inorganic materials 0.000 description 5
- 229910001382 calcium hypophosphite Inorganic materials 0.000 description 5
- 229940064002 calcium hypophosphite Drugs 0.000 description 5
- 150000001721 carbon Chemical group 0.000 description 5
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 239000006082 mold release agent Substances 0.000 description 5
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 5
- 125000000962 organic group Chemical group 0.000 description 5
- 239000010452 phosphate Substances 0.000 description 5
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 5
- 238000006068 polycondensation reaction Methods 0.000 description 5
- 239000001632 sodium acetate Substances 0.000 description 5
- 235000017281 sodium acetate Nutrition 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- CNALVHVMBXLLIY-IUCAKERBSA-N tert-butyl n-[(3s,5s)-5-methylpiperidin-3-yl]carbamate Chemical compound C[C@@H]1CNC[C@@H](NC(=O)OC(C)(C)C)C1 CNALVHVMBXLLIY-IUCAKERBSA-N 0.000 description 5
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 4
- 229920002302 Nylon 6,6 Polymers 0.000 description 4
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000001361 adipic acid Substances 0.000 description 4
- 235000011037 adipic acid Nutrition 0.000 description 4
- 150000001340 alkali metals Chemical group 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 239000004760 aramid Substances 0.000 description 4
- 229920003235 aromatic polyamide Polymers 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 150000001722 carbon compounds Chemical class 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 4
- 125000001624 naphthyl group Chemical group 0.000 description 4
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 4
- 150000003014 phosphoric acid esters Chemical class 0.000 description 4
- 239000012783 reinforcing fiber Substances 0.000 description 4
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 4
- 239000001488 sodium phosphate Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004953 Aliphatic polyamide Substances 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- 239000005819 Potassium phosphonate Substances 0.000 description 3
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 3
- 229920003231 aliphatic polyamide Polymers 0.000 description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 3
- 125000002877 alkyl aryl group Chemical group 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052792 caesium Inorganic materials 0.000 description 3
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- VSGNNIFQASZAOI-UHFFFAOYSA-L calcium acetate Chemical compound [Ca+2].CC([O-])=O.CC([O-])=O VSGNNIFQASZAOI-UHFFFAOYSA-L 0.000 description 3
- 239000001639 calcium acetate Substances 0.000 description 3
- 235000011092 calcium acetate Nutrition 0.000 description 3
- 229960005147 calcium acetate Drugs 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 3
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 3
- YXXXKCDYKKSZHL-UHFFFAOYSA-M dipotassium;dioxido(oxo)phosphanium Chemical compound [K+].[K+].[O-][P+]([O-])=O YXXXKCDYKKSZHL-UHFFFAOYSA-M 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004817 gas chromatography Methods 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 150000008301 phosphite esters Chemical class 0.000 description 3
- 235000011056 potassium acetate Nutrition 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- LVTHXRLARFLXNR-UHFFFAOYSA-M potassium;1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate Chemical compound [K+].[O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F LVTHXRLARFLXNR-UHFFFAOYSA-M 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- JOXIMZWYDAKGHI-UHFFFAOYSA-M toluene-4-sulfonate Chemical compound CC1=CC=C(S([O-])(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-M 0.000 description 3
- VMFOHNMEJNFJAE-UHFFFAOYSA-N trimagnesium;diphosphite Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])[O-].[O-]P([O-])[O-] VMFOHNMEJNFJAE-UHFFFAOYSA-N 0.000 description 3
- XIJOOHYOHDBKCR-UHFFFAOYSA-N (2-tert-butylphenyl) bis(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)C(C)(C)C)OC1=CC=CC=C1CCCCCCCCC XIJOOHYOHDBKCR-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- SLWIPPZWFZGHEU-UHFFFAOYSA-N 2-[4-(carboxymethyl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=C(CC(O)=O)C=C1 SLWIPPZWFZGHEU-UHFFFAOYSA-N 0.000 description 2
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- POZODAZKTCILOO-UHFFFAOYSA-N 4-(4-aminocyclohexyl)sulfanylcyclohexan-1-amine Chemical compound C1CC(N)CCC1SC1CCC(N)CC1 POZODAZKTCILOO-UHFFFAOYSA-N 0.000 description 2
- CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 2
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
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- QOQNJVLFFRMJTQ-UHFFFAOYSA-N trioctyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OCCCCCCCC QOQNJVLFFRMJTQ-UHFFFAOYSA-N 0.000 description 1
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- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
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- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
Definitions
- the present invention relates to a polyamide resin.
- Polyamide resins are widely used as various industrial materials from the viewpoints of their excellent processability, durability, heat resistance, gas barrier properties, chemical resistance and the like.
- a polyamide resin an aliphatic polyamide resin typified by polyamide 6 and polyamide 66 has been used for a long time.
- aromatic polyamide resins using aromatic dicarboxylic acids and / or aromatic diamines as raw materials for polyamide resins have also come to be used.
- aromatic polyamide resins are described in, for example, Patent Documents 1, 2 and the like.
- amorphous polyamide resins have also been synthesized and their research is underway.
- Achromatic polyamide resin is highly transparent, and by taking advantage of its characteristics, it can be used for various packaging containers, switch covers, lenses, eyeglass frames, and other everyday items, industrial products, and applications that require design. It is beginning to be widely used.
- polyamide resins are widely used in various fields.
- the polyamide resin is often required to have a high glass transition temperature and a low water absorption rate, although it depends on the application.
- the amorphous polyamide resin does not have a clear melting point, the shape of the molded product cannot be maintained when the glass transition temperature is low, so that there is a high demand for a high glass transition temperature.
- the polyamide resin in addition to having a low water absorption rate, the polyamide resin also has a problem that the deformation of the molded product after water absorption is small.
- An object of the present invention is to solve such a problem, and an object of the present invention is to provide a polyamide resin having a high glass transition temperature, a low water absorption rate, and a small deformation of a molded product after water absorption. And.
- R 1 to R 8 each independently represent a hydrogen atom or an aliphatic group having 1 to 5 carbon atoms, and at least one of R 1 to R 4 and at least R 5 to R 8 are represented.
- One is an aliphatic group having 1 to 5 carbon atoms.
- ⁇ 3> The polyamide resin according to ⁇ 1>, wherein more than 30 mol% of the constituent unit derived from the aromatic dicarboxylic acid is a constituent unit derived from isophthalic acid.
- ⁇ 4> The polyamide resin according to any one of ⁇ 1> to ⁇ 3>, wherein 55 mol% or more of the constituent unit derived from the dicarboxylic acid is a constituent unit derived from an aromatic dicarboxylic acid.
- ⁇ 5> The polyamide resin according to any one of ⁇ 1> to ⁇ 3>, wherein 90 mol% or more of the constituent unit derived from the dicarboxylic acid is a constituent unit derived from an aromatic dicarboxylic acid.
- ⁇ 6> More than 30 mol% and 100 mol% or less of the constituent unit derived from the diamine is derived from the diamine represented by the formula (1), and 70 mol% to 0 mol% is derived from p-benzenediethaneamine.
- ⁇ 7> The polyamide resin according to any one of ⁇ 1> to ⁇ 6>, wherein R 1 to R 8 independently represent a hydrogen atom or a methyl group in the formula (1).
- R 1 , R 2 , R 7 and R 8 are hydrogen atoms
- R 3 , R 4 , R 5 and R 6 are methyl groups, ⁇ 1> to ⁇ .
- the present embodiment will be described in detail.
- the following embodiments are examples for explaining the present invention, and the present invention is not limited to the present embodiment.
- "-" is used in the meaning which includes the numerical values described before and after it as the lower limit value and the upper limit value.
- various physical property values and characteristic values shall be at 23 ° C. unless otherwise specified.
- the polyamide resin of the present embodiment is composed of a diamine-derived structural unit and a dicarboxylic acid-derived structural unit, and more than 30 mol% of the diamine-derived structural unit is derived from the diamine represented by the formula (1). It is characterized in that more than 30 mol% of the constituent unit derived from the dicarboxylic acid is a polyamide resin derived from the aromatic dicarboxylic acid.
- R 1 to R 8 each independently represent a hydrogen atom or an aliphatic group having 1 to 5 carbon atoms, and at least one of R 1 to R 4 and at least R 5 to R 8 are represented.
- One is an aliphatic group having 1 to 5 carbon atoms.) With such a configuration, a polyamide resin having a high glass transition temperature and a low water absorption rate can be obtained. Further, a polyamide resin having a small deformation after water absorption can be obtained. Further, since the polyamide resin of the present embodiment is usually an amorphous polyamide resin, it is preferably used for applications where transparency is required.
- the diamine-derived structural unit represented by the formula (1) is more than 30 mol%, preferably 35 mol% or more.
- the proportion of the constituent unit derived from the compound represented by the formula (1) in the constituent unit derived from diamine is 100 mol% or less.
- the diamine represented by the formula (1) in the diamine-derived structural unit may be only one kind or two or more kinds. When two or more kinds are contained, it is preferable that the total amount is within the above range.
- the diamine represented by the formula (1) in the diamine represented by the formula (1), at least one aliphatic group having 1 to 5 carbon atoms is substituted in the ethylene chain portion of p-benzenedietanamine.
- the concentration of the amide group per volume is lowered without significantly changing the distance between the amide groups in the molecular chain, and the water absorption rate is increased while having high Tg and high rigidity. It is speculated that it can be lowered.
- R 1 to R 8 each independently represent a hydrogen atom or an aliphatic group having 1 to 5 carbon atoms, and at least one of R 1 to R 4 and at least 1 of R 5 to R 8 are represented.
- One is an aliphatic group having 1 to 5 carbon atoms.
- the aliphatic group having 1 to 5 carbon atoms is preferably an aliphatic group having 1 to 3 carbon atoms, and more preferably an aliphatic group having 1 or 2 carbon atoms.
- Examples of the aliphatic group include an alkyl group, an alkenyl group and an alkynyl group, and an alkyl group is preferable, and a linear alkyl group is more preferable.
- alkyl group examples include a methyl group, an ethyl group, an i-propyl group, an i-butyl group, and a t-butyl group, and a methyl group and an ethyl group are preferable, and a methyl group is more preferable.
- at least two of R 1 to R 4 and at least two of R 5 to R 8 are preferably aliphatic groups having 1 to 5 carbon atoms, and two of R 1 to R 4 and the like. It is more preferable that two of R5 to R8 are aliphatic groups having 1 to 5 carbon atoms. Further, in the formula (1), it is preferable that R 1 to R 8 each independently represent a hydrogen atom or a methyl group.
- R 1 and / or R 2 , and R 7 and / or R 8 are hydrogen atoms, and among R 1 , R 2 , R 7 and R 8 , those that are not hydrogen atoms are methyl groups.
- R 3 , R 4 , R 5 and R 6 are hydrogen atoms or methyl groups (preferably methyl groups). More preferably, R 1 , R 2 , R 7 and R 8 are hydrogen atoms, and R 3 , R 4 , R 5 and R 6 are hydrogen atoms or methyl groups (preferably methyl groups).
- At least two (preferably two) of R 1 to R 4 and at least two (preferably two) of R 5 to R 8 have 1 carbon atom.
- the compound (Compound 1-1) which is an aliphatic group of to 5 and one of R 1 to R 4 and one of R 5 to R 8 in the formula (1) are aliphatic groups having 1 to 5 carbon atoms. It may be a mixture with a certain compound (Compound 1-2). In the case of a mixture, the mass ratio of the compound 1-1 to the compound 1-2 is preferably 1: 0.1 to 1.
- the diamine-derived structural unit may include other structural units other than the diamine-derived structural unit represented by the formula (1).
- Such other constituent units include p-benzenedietaneamine, m-benzenedietaneamine, o-benzenedietaneamine, aliphatic diamines, alicyclic diamines and benzenedietaneamines, and formula (1). Building blocks derived from aromatic diamines other than the represented diamines are exemplified, and p-benzenedietanamine is preferable from the viewpoint of high rigidity and flame retardancy.
- aliphatic diamine known aliphatic diamines can be widely adopted, and aliphatic diamines having 6 to 12 carbon atoms are preferable, 1,6-hexanediamine, 1,7-heptanediamine, 1,8-octanediamine, and the like.
- Linear aliphatic diamines of 1,9-nonandiamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, 2-methyl-1,8-octanediamine, 4-methyl-1 , 8-octanediamine, 5-methyl-1,9-nonandiamine, 2,2,4- / 2,4,4-trimethylhexamethylenediamine, 2-methyl-1,5-pentanediamine, 2-methyl-1 , 6-Hexanediamine, 2-methyl-1,7-heptanediamine and other branched chain aliphatic diamines are exemplified.
- alicyclic diamine known alicyclic diamines can be widely adopted, and 1,2-bis (aminomethyl) cyclohexane, 1,3-bis (aminomethyl) cyclohexane, and 1,4-bis (aminomethyl) cyclohexane can be widely used.
- Isophorone diamine, 4,4'-thiobis (cyclohexane-1-amine), 4,4'-thiobis (cyclohexane-1-amine) and the like are exemplified.
- the description in paragraph 0052 of WO 2017/126409 can be referred to, the contents of which are incorporated herein.
- more than 30 mol% and 100 mol% or less of the diamine-derived constituent unit is derived from the diamine represented by the formula (1), and 70 mol% to 0 mol% is p-benzenediethaneamine. It is preferably derived, and more than 30 mol% and 100 mol% or less of the constituent unit derived from diamine is derived from the diamine represented by the formula (1), and 70 mol% to 0 mol% is p-benzenediethaneamine.
- the polyamide resin of the present embodiment may contain only one kind of constituent units derived from other diamines, or may contain two or more kinds.
- more than 30 mol% of the constituent units derived from the dicarboxylic acid are derived from the aromatic dicarboxylic acid.
- a polyamide resin having a higher glass transition temperature tends to be obtained.
- the ratio of the constituent unit derived from aromatic dicarboxylic acid to the constituent unit derived from dicarboxylic acid is more than 30 mol%, preferably 40 mol% or more, and more preferably 45 mol% or more.
- the upper limit of the ratio of the aromatic dicarboxylic acid-derived structural unit to the dicarboxylic acid-derived structural unit is 100 mol% or less.
- a preferred example of the aromatic dicarboxylic acid in this embodiment is a phenylenedicarboxylic acid.
- Another preferred example of the aromatic dicarboxylic acid in the present embodiment is the aromatic dicarboxylic acid represented by the formula (FC).
- FC HOOC- (CH 2 ) m -aromatic ring structure- (CH 2 ) m -COOH (In the formula (FC), m indicates 0, 1 or 2.)
- M is preferably 0 or 1, and more preferably 0.
- the aromatic ring structure is a structure including an aromatic ring, preferably a structure consisting only of an aromatic ring, or a structure consisting only of an aromatic ring and a substituent thereof, and a structure consisting only of an aromatic ring. Is more preferable.
- the substituent that the aromatic ring may have are an alkyl group having 1 to 3 carbon atoms or a halogen atom.
- the aromatic ring structure may be either a monocyclic ring or a condensed ring, and a monocyclic ring is preferable. Further, the number of carbon atoms constituting the aromatic ring is not particularly determined, but a 6 to 15-membered ring is preferable.
- the aromatic ring structure is preferably a benzene ring, a naphthalene ring, a benzene ring having a substituent, a naphthalene ring having a substituent, and more preferably a benzene ring or a benzene ring having a substituent, benzene. Rings are more preferred.
- aromatic dicarboxylic acid isophthalic acid, terephthalic acid, orthophthalic acid, phenylene diacetic acid (o-phenylene diacetic acid, p-phenylene diacetic acid, m-phenylene diacetic acid), Naphthalenedicarboxylic acid (1,2-naphthalenedicarboxylic acid, 1,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 1,7-naphthalenedicarboxylic acid Acids, 1,8-naphthalenedicarboxylic acids, 2,3-naphthalenedicarboxylic acids, 2,6-naphthalenedicarboxylic acids and 2,7-naphthalenedicarboxylic acids) are exemplified.
- isophthalic acid, terephthalic acid, and phenylene diacetic acid are preferably selected, isophthalic acid and phenylene diacetic acid are more preferable, and isophthalic acid is further preferable.
- isophthalic acid By using isophthalic acid, cyclic monomers are less likely to be formed, and the amount of outgas generated tends to decrease. By reducing the amount of outgas generated, the stain on the mold during injection molding is reduced, the frequency of cleaning the mold is reduced, and the productivity tends to be improved.
- the proportion of the constituent unit derived from the aromatic dicarboxylic acid (preferably isophthalic acid) selected from isophthalic acid, terephthalic acid, and phenylene diacetic acid in the constituent unit derived from the aromatic dicarboxylic acid is , 30 mol% or more, more preferably 40 mol% or more, further preferably 45 mol% or more, still more preferably 55 mol% or more, and more than 60 mol%. It is even more preferably 80 mol% or more, further preferably 90 mol% or more, further preferably 95 mol% or more, and even more preferably 99 mol% or more. Is the most preferable.
- the upper limit is 100 mol% or less.
- the polyamide resin of the present embodiment may contain a structural unit derived from a dicarboxylic acid other than the structural unit derived from the aromatic dicarboxylic acid.
- the dicarboxylic acid constituting a structural unit derived from a dicarboxylic acid other than the structural unit derived from the aromatic dicarboxylic acid include an aliphatic dicarboxylic acid.
- the number of carbon atoms of the aliphatic carboxylic acid is exemplified by 2 to 20, preferably 4 to 18, and more preferably 8 to 14.
- aliphatic dicarboxylic acid examples include succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, and dodecanedioic acid, with sebacic acid and dodecanedioic acid being preferred. , Dodecanedioic acid is more preferred.
- the ratio thereof is preferably 60 mol% or less, preferably 55 mol% or less of the constituent unit derived from the total dicarboxylic acid. It is more preferably 45 mol% or less, further preferably 40 mol% or less, further preferably 20 mol% or less, still more preferably 10 mol% or less.
- the polyamide resin of the present embodiment contains a structural unit derived from an aliphatic dicarboxylic acid, the lower limit of the ratio thereof is more than 5 mol%.
- the polyamide resin of the present embodiment can be configured to substantially contain no structural unit derived from an aliphatic dicarboxylic acid.
- substantially free means that the ratio of the constituent unit derived from the aliphatic dicarboxylic acid to the constituent units derived from the dicarboxylic acid is 5 mol% or less, preferably 3 mol% or less, and 1 mol. It is more preferably% or less. Only one kind of constituent unit derived from an aliphatic dicarboxylic acid may be contained, or two or more kinds may be contained.
- the polyamide resin of the present embodiment includes the following. Needless to say, the polyamide resin of the present embodiment is not limited to the following. (1) More than 30 mol% and 100 mol% or less of the constituent unit derived from diamine are derived from the diamine represented by the formula (1), and 70 mol% to 0 mol% are derived from p-benzenediethaneamine. More than 30 mol% of the constituent unit derived from dicarboxylic acid is derived from aromatic dicarboxylic acid (preferably isophthalic acid), and more than 30 mol% of the constituent unit derived from polyamide resin (2) diamine is represented by the formula (1).
- Diamine is derived from dicarboxylic acid, and more than 30 mol% and 100 mol% or less of the constituent unit derived from dicarboxylic acid is derived from aromatic dicarboxylic acid (preferably isophthalic acid), and 70 mol% to 0 mol% is aliphatic dicarboxylic acid (preferably). Is a polyamide resin derived from dodecanedioic acid). (3) More than 30 mol% and 100 mol% or less of the constituent unit derived from diamine are derived from the diamine represented by the formula (1), and 70 mol% to 0 mol% are derived from p-benzenediethaneamine.
- More than 30 mol% and 100 mol% or less of the constituent unit derived from dicarboxylic acid is derived from aromatic dicarboxylic acid (preferably isophthalic acid), and 70 mol% to 0 mol% is derived from aliphatic dicarboxylic acid (preferably dodecanedioic acid). Derived polyamide resin.
- More than 30 mol% and 100 mol% or less of the constituent units derived from diamine are derived from the diamine represented by the formula (1), and 70 mol% to 0 mol% are derived from p-benzenediethaneamine.
- the total of the diamine-derived structural unit represented by the formula (1) and the p-benzenediethaneamine-derived structural unit is 100 mol% or less, and 95 to 100 mol%. It is preferably present, and more preferably 98 to 100 mol%.
- the total of the structural unit derived from the aromatic dicarboxylic acid (preferably isophthalic acid) and the structural unit derived from the aliphatic dicarboxylic acid (preferably dodecanedioic acid) is 100 mol% or less, and is 95 to 100 mol%. Is preferable, and it is more preferably 98 to 100 mol%.
- the polyamide resin of the present embodiment is composed of a dicarboxylic acid-derived structural unit and a diamine-derived structural unit, but a structural unit other than the dicarboxylic acid-derived structural unit and the diamine-derived structural unit, terminal groups, and the like are used. It may include other parts. Examples of other structural units include lactams such as ⁇ -caprolactam, valerolactam, laurolactam, and undecalactam, and structural units derived from aminocarboxylic acids such as 11-aminoundecanoic acid and 12-aminododecanoic acid. It is not limited to these. Further, the polyamide resin of the present embodiment may contain trace components such as additives used for synthesis.
- the polyamide resin of the present embodiment is preferably 70% by mass or more, more preferably 80% by mass or more, further preferably 90% by mass or more, still more preferably 95% by mass or more, still more preferably 98% by mass or more. Consists of a constituent unit derived from a dicarboxylic acid and a constituent unit derived from a diamine.
- the polyamide resin of the present embodiment preferably has a glass transition temperature (Tg) of 90 ° C. or higher, more preferably 110 ° C. or higher, and even more preferably 120 ° C. or higher according to the differential scanning calorimetry. , 130 ° C. or higher, more preferably 140 ° C. or higher, even more preferably 145 ° C. or higher, and even more preferably 148 ° C. or higher. Since a normal polyamide resin is a crystalline resin having a melting point, the shape of the molded product can be maintained even in a high temperature environment even if the glass transition temperature is low.
- Tg glass transition temperature
- the amorphous polyamide resin does not have a clear melting point, the shape of the molded product cannot be maintained in a high temperature environment when the glass transition temperature is low. Further, since the glass transition temperature of the polyamide resin is lowered by water absorption, the amorphous polyamide resin having high water absorption cannot maintain the shape of the molded product in a high temperature environment. Since the polyamide resin of the present embodiment has a high glass transition temperature and low water absorption, it is possible to effectively suppress the retention of the molded product, particularly the shape change of the molded product after water absorption, even if it is an amorphous polyamide resin. ..
- the glass transition temperature is also preferably 200 ° C. or lower, more preferably 180 ° C.
- the fluidity at the time of melting tends to be high, and the moldability tends to be further improved.
- the glass transition temperature is measured according to the method described in Examples described later.
- the polyamide resin of the present embodiment preferably has a low water absorption rate.
- the water absorption rate is preferably 6% or less, and more preferably 5% or less.
- the lower limit is ideally 0%, but for example, 1.0% or more, further 2.5% or more, and 3.5% or more are practically significant.
- the water absorption rate is measured according to the method described in Examples described later.
- the polyamide resin of the present embodiment is usually an amorphous polyamide resin.
- the amorphous polyamide resin is a polyamide resin having no clear melting point, and specifically, it means that the crystal melting enthalpy ⁇ Hm is less than 5 J / g, preferably 3 J / g or less, and 1 J / g or less. Is even more preferable.
- the crystal melting enthalpy ⁇ Hm follows the method described in Examples described later.
- the polyamide resin of the present embodiment is preferably produced by a melt polycondensation (melt polymerization) method or a pressurized salt method using a phosphorus atom-containing compound as a catalyst, and more preferably produced by a pressurized salt method. ..
- a melt polycondensation method a method is preferable in which the temperature is raised under pressure while dropping the raw material diamine onto the melted raw material dicarboxylic acid, and the polymerization is carried out while removing the condensed water.
- the pressurized salt method a method in which a salt composed of a raw material diamine and a raw material dicarboxylic acid is heated in the presence of water under pressure and polymerized in a molten state while removing the added water and condensed water is preferable.
- the phosphorus atom-containing compound include phosphinic acid compounds such as dimethylphosphinic acid and phenylmethylphosphinic acid; hypophosphorous acid, sodium hypophosphite, potassium hypophosphite, lithium hypophosphite, and the following.
- Hypophosphorous acid compounds such as magnesium phosphite, calcium hypophosphite, ethyl hypophosphite; phosphonic acid, sodium phosphonate, lithium phosphonate, potassium phosphonate, magnesium phosphonate, calcium phosphonate, phenylphosphonic acid, ethyl Phosphonic acid compounds such as phosphonic acid, sodium phenylphosphonate, potassium phenylphosphonate, lithium phenylphosphonate, diethyl phenylphosphonate, sodium ethylphosphonate, potassium ethylphosphonate; phosphonic acid, sodium phosphonate, phosphonic acid Hypophosphorous acids such as lithium, potassium phosphonate, magnesium phosphonate, calcium phosphonate, phenyl phosphonic acid, sodium phenyl phosphite, potassium phenyl phosphite, lithium phenyl phosphite, ethyl phenyl phosphi
- the heat resistance of the obtained polyamide resin tends to be further improved by using calcium hypophosphite.
- These phosphorus atom-containing compounds can be used alone or in combination of two or more.
- the amount of the phosphorus atom-containing compound added is preferably an amount such that the phosphorus atom concentration in the polyamide resin is 0.001 to 0.1% by mass. Within such a range, the heat resistance of the polyamide resin tends to be improved.
- a polymerization rate adjusting agent may be added in addition to the phosphorus atom-containing compound.
- the polymerization rate adjusting agent include alkali metal hydroxides, alkaline earth metal hydroxides, alkali metal acetates and alkaline earth metal acetates, and alkali metal acetates are preferable.
- the alkali metal atom include sodium, potassium and lithium, and sodium is preferable.
- alkaline earth metal atoms include calcium and magnesium.
- the polymerization rate adjuster include lithium hydroxide, sodium hydroxide, potassium hydroxide, rubidium hydroxide, cesium hydroxide, magnesium hydroxide, calcium hydroxide, strontium hydroxide, barium hydroxide, lithium acetate, and acetic acid.
- examples thereof include sodium, potassium acetate, rubidium acetate, cesium acetate, magnesium acetate, calcium acetate, strontium acetate and barium acetate.
- at least one selected from sodium hydroxide, potassium hydroxide, magnesium hydroxide, calcium hydroxide, sodium acetate, potassium acetate and calcium acetate is preferable, and at least one selected from sodium acetate, potassium acetate and calcium acetate.
- Seeds are more preferred, and sodium acetate is even more preferred.
- These polymerization rate adjusting agents may be used alone or in combination of two or more.
- the amount of the polymerization rate adjusting agent added is preferably 0.001 to 0.5% by mass of the total amount of the raw material diamine and the dicarboxylic acid.
- the polyamide resin of the present embodiment is a composition containing the polyamide resin of the present embodiment (hereinafter, may be referred to as "resin composition of the present embodiment"), and further, as a molded product obtained by molding the composition. Can be used.
- the composition may contain only one type or two or more types of the polyamide resin of the present embodiment, or may contain other components. Examples of other components include polyamide resins other than the polyamide resin of the present embodiment, thermoplastic resins other than polyamide resins, fillers, matting agents, heat-resistant stabilizers, weather-resistant stabilizers, ultraviolet absorbers, plasticizers, and difficulties.
- Additives such as a fueling agent, an antistatic agent, an anticoloring agent, and an antigelling agent can be added as needed.
- Each of these additives may be one kind or two or more kinds.
- Other components include polyamide resins other than the polyamide resin of the present embodiment, thermoplastic resins other than polyamide resins, reinforcing materials (fillers), heat-resistant stabilizers, and antioxidants such as weather-resistant stabilizers (particularly heat-resistant stability). Agent), flame retardant, flame retardant aid, mold release agent, dripping inhibitor, matting agent, ultraviolet absorber, plasticizer, antistatic agent, anticoloring agent, antigelling agent, etc. as needed Can be added.
- Each of these additives may be one kind or two or more kinds.
- the other polyamide resin that can be contained in the resin composition of the present embodiment may be an aliphatic polyamide resin or a semi-aromatic polyamide resin.
- the aliphatic polyamide resin include polyamide 6, polyamide 66, polyamide 46, polyamide 6/66 (a copolymer composed of polyamide 6 component and polyamide 66 component), polyamide 610, polyamide 612, polyamide 410, polyamide 1010, and polyamide 11.
- polyamide 12 and polyamide 9C polyamide composed of a mixed diamine composed of 1,9-nonanediamine and 2-methyl-1,8-octanediamine and 1,4-cyclohexanedicarboxylic acid).
- the semi-aromatic polyamide resin includes polyamide 4T, polyamide 6T, polyamide 6I, polyamide 6T / 6I, polyamide 9T, polyamide 10T, and polyamide 9N (a mixture of 1,9-nonanediamine and 2-methyl-1,8-octanediamine).
- Polyamide consisting of diamine and 2,6-naphthalenedicarboxylic acid) and the like are exemplified.
- the semi-aromatic polyamide resin is composed of a diamine-derived structural unit and a dicarboxylic acid-derived structural unit, and 70 mol% or more of the diamine-derived structural unit is contained in at least one of m-xylylenediamine and paraxylylenediamine.
- An example thereof is a xylylenediamine-based polyamide resin derived from an ⁇ , ⁇ -linear aliphatic dicarboxylic acid having 4 to 20 carbon atoms in which 70 mol% or more of the constituent unit derived from the dicarboxylic acid is derived.
- MXD6 is a polycondensate of methylylenediamine and adipic acid
- MXD6I is a polycondensate of methylylenediamine, adipic acid and isophthalic acid
- methylylenediamine, paraxylylenediamine and adipic acid methylylenediamine, paraxylylenediamine and adipic acid.
- MP6 which is a polycondensation product of, MXD10 which is a polycondensation product of metaxylylenediamine and sebacic acid
- MP10 which is a polycondensation product of metaxylylenediamine and paraxylylenediamine and sebacic acid, paraxylylenediamine and sebacic acid.
- PXD10 which is a polycondensate of the above, is exemplified.
- the semi-aromatic polyamide resin at least one of 1,9-nonanediamine, 2-methyl-1,8-octanediamine, and 1,10-decanediamine and terephthalic acid and / or naphthalene dicarboxylic acid
- Polyamide resins which are polycondensates, are also exemplified.
- a polyamide resin which is a polycondensate of 1,9-nonanediamine, 2-methyl-1,8-octanediamine and naphthalenedicarboxylic acid is preferable.
- the content thereof is preferably 1 part by mass or more, preferably 10 parts by mass or more, based on 100 parts by mass of the polyamide resin of the present embodiment. It may be 100 parts by mass or less, more preferably 50 parts by mass or less, and further preferably 30 parts by mass or less.
- the resin composition of the present embodiment may contain only one type of other polyamide resin, or may contain two or more types. When two or more kinds are contained, it is preferable that the total amount is within the above range.
- thermoplastic resin other than polyamide resin examples include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polybutylene naphthalate. Each of these thermoplastic resins other than the polyamide resin may be one kind or two or more kinds.
- the resin composition of the present embodiment may further contain an antioxidant.
- an antioxidant By containing the antioxidant, a molded product having excellent heat resistance can be obtained.
- the antioxidant include an embodiment including an organic antioxidant, and more specifically, an embodiment including a primary antioxidant and a secondary antioxidant. Further, as the antioxidant, an embodiment including an inorganic antioxidant is exemplified. Further, it may contain both an organic antioxidant and an inorganic antioxidant.
- the primary antioxidant acts as a so-called radical scavenger, and for example, plays a role of capturing various radicals generated by autoxidation to generate hydroperoxide.
- the primary antioxidant include a phenol-based antioxidant (preferably a hindered phenol-based antioxidant) and an amine-based antioxidant.
- the secondary antioxidant acts as a so-called peroxide decomposing agent, and for example, plays a role of decomposing the generated hydroperoxide and converting it into a stable alcohol compound.
- Examples of the secondary antioxidant include phosphorus-based antioxidants and sulfur-based antioxidants.
- a phenol-based antioxidant preferably a hindered phenol-based antioxidant
- a phosphorus-based antioxidant in combination.
- the ratio is preferably a mixture of 1: 0.1 to 1:10 (mass ratio), preferably 1: 0.5 to 1: 2. It is more preferably a mixture.
- the phenolic antioxidant is preferably a hindered phenolic antioxidant.
- the hindered phenol-based antioxidant is, for example, a compound having a hindered phenol structure having a bulky substituent at at least one of the carbon atoms on both sides of the carbon atom to which the OH group of the phenyl group is bonded.
- a bulky substituent a t-butyl group is generally used.
- the hindered phenolic antioxidant is usually classified into a hindered type and a less hindered type, and the hindered type is preferable.
- the hindered type is a compound having a bulky substituent at each of the carbon atoms on both sides of the carbon atom to which the OH group of the phenyl group is bonded.
- the less hindered type is a hindered phenolic antioxidant having a bulky substituent on only one of the carbon atoms on both sides of the carbon atom to which the OH group of the phenyl group is bonded, or both of the carbon atoms on both ends. It is a hindered phenolic antioxidant that does not have bulky substituents.
- a hindered phenolic antioxidant having 2 to 6 hindered phenolic structures is preferable, and a hindered phenolic antioxidant having two hindered phenolic structures is more preferable.
- a hindered phenolic antioxidant having an amide bond is preferable, a hindered type hindered phenolic antioxidant having an amide bond is more preferable, and 2 to 6 amide bonds and 2 to 6 amide bonds are more preferable.
- a hindered phenolic antioxidant having a hindered hindered phenolic structure is more preferred, and a hindered phenolic antioxidant having 2 to 6 di-tert-butyl-4 hydroxyphenylalkylcarbonylamide groups (of the alkyl chain moiety).
- the number of carbon atoms is preferably 1 to 5, more preferably 2 to 4), more preferably N, N'-hexane-1,6 diylbis [3- (3,5-di-tert-butyl-4hydroxyphenylpropionamide). ] Is particularly preferable.
- antioxidants sold by BASF as the Irganox series and ADEKA to the ADEKA stub series (eg, AO-20, AO-50, AO-50F, etc.).
- Antioxidants sold as AO-60, AO-60G, AO-330) are preferred, and Irganox 1098 is preferred.
- the antioxidants preferably used in the present embodiment will be exemplified, but it goes without saying that the present embodiment is not limited thereto.
- amine-based antioxidants include N, N'-di-2-naphthyl-p-phenylenediamine, N, N-diphenylethylenediamine, N, N-diphenylacetoamidine, N, N-diphenylformamidine, and N-phenyl.
- Piperidine dibenzylethylenediamine, triethanolamine, phenothiazine, N, N'-di-sec-butyl-p-phenylenediamine, 4,4'-tetramethyl-diaminodiphenylmethane, P, P'-dioctyl-diphenylamine, N, N'-bis (1,4-dimethyl-pentyl) -p-phenylenediamine, phenyl- ⁇ -naphthylamine, phenyl- ⁇ -naphthylamine, 4,4'-bis ( ⁇ , ⁇ -dimethyl-benzyl) diphenylamine, p- (P-Toluenesulfonylamide) amines such as diphenylamine, N-phenyl-N'-isopropyl-p-phenylenediamine, amines such as N-phenyl-N'-(1,3-dimethylbutyl)
- an amine-based antioxidant containing an aromatic ring is particularly preferable, and an amine-based antioxidant containing two or more (preferably 2 to 5) benzene rings is more preferable.
- the amine-based antioxidant represented by the following formula (A) and the amine-based antioxidant represented by the formula (B) are preferable.
- Equation (A) (In the formula ( A ), RA1 and RA2 are each independently a hydrocarbon group.) RA1 and RA2 are preferably alkyl or aryl groups, and more preferably at least one of RA1 and RA2 is an aryl group. The alkyl group and the aryl group may have a substituent.
- the aryl group is exemplified by a phenyl group and a naphthyl group.
- Equation (B) (In the formula ( B ), RB1 and RB2 are each independently a hydrocarbon group containing an aromatic ring.)
- RB1 and RB2 are preferably hydrocarbon groups containing two or more aromatic rings, more preferably hydrocarbon groups containing two aromatic rings, and are hydrocarbon groups containing two benzene rings. More preferably, it is a hydrocarbon group in which two benzene rings are linked by an alkylene group having 1 to 4 carbon atoms.
- the amine-based antioxidant represented by the formula (A) and the amine-based antioxidant represented by the formula (B) preferably have a molecular weight of 200 to 1200, and more preferably 300 to 600.
- the antioxidant represented by the formula (A) has two amines as active sites, and it is considered that the effect of the present embodiment is effectively exhibited. Further, other compounds may be copolymerized as long as the gist of the present embodiment is not deviated.
- the phosphorus-based antioxidant examples include phosphite esters and phosphite esters, and phosphite esters are more preferable. Specific examples of the phosphorus-based antioxidant include monosodium phosphate, disodium phosphate, trisodium phosphate, sodium phosphite, calcium phosphite, magnesium phosphite, manganese phosphite, and pentaerythritol-type phos.
- Tridecyl Phosphite Triphenylphosphite, Trioctadecylphosphite, Tridecylphosphite, Tri (nonylphenyl) Phosphite, Tris (2,4-di-tert-butylphenyl) Phosphite, Tris (2,4-) Di-tert-butyl-5-methylphenyl) phosphite, tris (butoxye
- a phosphorus-based antioxidant represented by the following formula (P) is particularly preferable.
- Equation (P) (In the formula ( P ), RP1 and RP2 are each independently a hydrocarbon group.) RP1 and RP2 are preferably aryl groups, more preferably phenyl groups. The aryl group may have a substituent. As the substituent, a hydrocarbon group is exemplified, and an alkyl group is preferable. The substituent may further have a substituent such as a hydrocarbon group.
- the compound represented by the formula (P) preferably has a molecular weight of 400 to 1200, and more preferably 500 to 800.
- Sulfur-based antioxidants include dilaurylthiodipropionate, distearylthiodipropionate, dimyristylthiodipropionate, laurylstearylthiodipropionate, pentaerythritol tetrakis (3-dodecylthiopropionate), and penta.
- examples thereof include erythritol tetrakis (3-laurylthiopropionate), for example, DSTP "Yoshitomi", DLTP “Yoshitomi”, DLTOIB, DMTP "Yoshitomi” (all manufactured by AP Corporation), Seenox 412S (Cipro Kasei).
- Commercial products such as Cyanox 1212 (manufactured by Sianamid) and SUMILIZER TP-D (manufactured by Sumitomo Chemical Co., Ltd.) can be used (all are trade names).
- Examples of the inorganic antioxidant include copper compounds and alkali halides.
- Examples of the copper compound used in the present embodiment include copper halide (for example, copper iodide, copper bromide, copper chloride) and copper acetate, such as cuprous iodide, cupric iodide, and bromide. It is preferably selected from copper, cupric bromide, cuprous acetate and cupric acetate, cuprous chloride, cupric chloride and from copper iodide, copper acetate and cuprous chloride. Is more preferable.
- the alkali halide used in this embodiment means a halide of an alkali metal.
- the alkali metal potassium and sodium are preferable, and potassium is more preferable.
- the halogen atom iodine, bromine and chlorine are preferable, and iodine is more preferable.
- Specific examples of the alkali halide used in the present embodiment include potassium iodide, potassium bromide, potassium chloride and sodium chloride.
- the copper compound and the alkali halide in combination.
- the copper compound and the alkali halide when the copper compound and the alkali halide are combined, it is preferably a mixture of the copper compound: the alkali halide in a ratio of 1: 3 to 1:15 (mass ratio), and the mixture is preferably a mixture of 1: 4 to 1: 8. Is even more preferable.
- the description in paragraphs 0046 to 0048 of JP-A-2013-513681 can also be taken into consideration, and these contents are incorporated in the present specification.
- an antioxidant other than the above a mixture of a copper complex and a halogen-containing phosphate can be used, and a mixture of the copper complex and the halogen-containing phosphate and the above-mentioned antioxidant can also be used.
- the antioxidants described in paragraphs 0025-0039 of JP-352168 can be employed and their contents are incorporated herein.
- a polyhydric alcohol can be used as an antioxidant other than the above, and a mixture of the polyhydric alcohol and the above-mentioned antioxidant can also be used.
- the antioxidants described in paragraphs 0083 to 856 of JP-A-2014-525506 can be employed and their contents are incorporated herein.
- a metal cyanide salt can be used as an antioxidant other than the above, and a mixture of this metal cyanide salt and the above-mentioned antioxidant can also be used.
- the described antioxidants can be employed and their content is incorporated herein.
- examples of the antioxidant include the antioxidant described in paragraphs 0025 to 0030 of Japanese Patent No. 6466632, the antioxidant described in paragraphs 0017 to 0020 of JP-A-2016-074804, and JP-A-2021-038370.
- the content thereof is preferably 0.01 part by mass or more, and preferably 0.05 part by mass or more with respect to 100 parts by mass of the polyamide resin. It is more preferably 0.1 part by mass or more, further preferably 0.2 part by mass or more, and further preferably 0.4 part by mass or more.
- the content is preferably 10.0 parts by mass or less, more preferably 5.0 parts by mass or less, and more preferably 3.0 parts by mass or less with respect to 100 parts by mass of the polyamide resin.
- the resin composition of the present embodiment may contain only one kind of antioxidant, or may contain two or more kinds of antioxidants. When two or more kinds are contained, it is preferable that the total amount is within the above range.
- the resin composition of the present embodiment may contain a flame retardant.
- a flame retardant By including a flame retardant, the flame retardancy can be improved.
- the flame retardant include a phosphorus-based flame retardant, a halogen-based flame retardant, and an organic metal salt-based flame retardant, and a phosphorus-based flame retardant and a halogen-based flame retardant are preferable, and a phosphorus-based flame retardant is more preferable.
- the phosphorus-based flame retardant examples include ethylphosphinic acid metal salt, diethylphosphinic acid metal salt, polyphosphate melamine, condensed phosphoric acid ester, phosphazene compound and the like, and among them, condensed phosphoric acid ester or phosphazene is preferable.
- a thermoplastic resin having excellent compatibility with the phosphorus-based flame retardant may be blended.
- the thermoplastic resin is preferably a polyphenylene ether resin, a polycarbonate resin, or a styrene resin.
- the condensed phosphoric acid ester is preferably a compound represented by the following formula (FP1). Equation (FP1) (In formula (FP1), R f1 , R f2 , R f3 and R f4 each independently represent a hydrogen atom or an organic group, where R f1 , R f2 , R f3 and R f4 are all hydrogen atoms. Except for the case. X represents a divalent organic group, p is 0 or 1, q is an integer of 1 or more, and r is an integer of 0 or 1 or more.)
- examples of the organic group include an alkyl group, a cycloalkyl group and an aryl group. Further, it may have a substituent such as an alkyl group, an alkoxy group, an alkylthio group, an aryl group, an aryloxy group, an arylthio group, a halogen atom, or an aryl halide group. Further, a group in which these substituents are combined, or a group in which these substituents are bonded and combined with an oxygen atom, a sulfur atom, a nitrogen atom or the like may be used.
- the divalent organic group means a divalent or higher valent group formed by removing one carbon atom from the above organic group.
- an alkylene group a phenylene group, a substituted phenylene group, a polynuclear phenylene group derived from bisphenols, and the like can be mentioned.
- the formula amount of each of these groups is preferably 15 to 300, more preferably 15 to 200, and even more preferably 15 to 100.
- condensed phosphate ester represented by the above formula (FP1) include trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, and tricre.
- condensed phosphoric acid esters examples include “CR733S” (resorcinol bis (diphenyl phosphate)), “CR741” (bisphenol A bis (diphenyl phosphate)), and “PX-200” from Daihachi Chemical Industry Co., Ltd. (Resolsinol bis (dixylenyl phosphate)), “Adecastab FP-700” from Asahi Denka Kogyo Co., Ltd. (2,2-bis (p-hydroxyphenyl) propane / trichlorophosphine oxide polycondensate (polymerization degree 1 to 1) It is sold under a trade name such as 3) phenol condensate) and is easily available.
- C733S resorcinol bis (diphenyl phosphate)
- CR741 bisphenol A bis (diphenyl phosphate)
- PX-200 from Daihachi Chemical Industry Co., Ltd.
- FP2 cyclic phosphazene compound represented by the formula (FP2)
- FP3 chain phosphazene compound represented by the formula (FP3)
- FP3 a chain phosphazene compound.
- Equation (FP2) (In formula (FP2), a is an integer of 3 to 25, and R f5 and R f6 may be the same or different, and may be the same or different, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an aryloxy group, an amino group. , A hydroxy group, an aryl group or an alkylaryl group.)
- Equation (FP3) (In formula (FP3), b is an integer of 3 to 10000, and R f7 and R f8 may be the same or different, and may be the same or different, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an allyloxy group, an amino group. , A hydroxy group, an aryl group or an alkylaryl group.)
- R f10 has 4 -P (OR f7 ), 4 -P (OR f8 ), 2 -P (O) (OR f7 ), and -P (O) ( OR f8 ) 2 . Shows at least one selected from the group.
- examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a t-butyl group, a pentyl group, a hexyl group, an octyl group and a decyl group.
- Examples thereof include a dodecyl group, and an alkyl group having 1 to 6 carbon atoms such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a t-butyl group, a pentyl group and a hexyl group is preferable, and a methyl group and an ethyl group are preferable.
- Alkyl groups having 1 to 4 carbon atoms such as propyl groups are particularly preferable.
- cycloalkyl group examples include a cycloalkyl group having 5 to 14 carbon atoms such as a cyclopentyl group and a cyclohexyl group, and a cycloalkyl group having 5 to 8 carbon atoms is preferable.
- alkenyl group examples include an alkenyl group having 2 to 8 carbon atoms such as a vinyl group and an allyl group.
- cycloalkenyl group examples include a cycloalkenyl group having 5 to 12 carbon atoms such as a cyclopentyl group and a cyclohexyl group.
- alkynyl group examples include an alkynyl group having 2 to 8 carbon atoms such as an ethynyl group and a propynyl group, and an alkynyl group having an aryl group such as an ethynylbenzene group as a substituent.
- aryl group examples include aryl groups having 6 to 20 carbon atoms such as phenyl group, methylphenyl (that is, tolyl) group, dimethylphenyl (that is, xylyl) group, trimethylphenyl group, and naphthyl group.
- aryl group having 6 to 10 carbon atoms is preferable, and a phenyl group is particularly preferable.
- alkylaryl group examples include an aralkyl group having 6 to 20 carbon atoms such as a benzyl group, a phenethyl group and a phenylpropyl group, and among them, an aralkyl group having 7 to 10 carbon atoms is preferable, and a benzyl group is particularly preferable. ..
- R f5 and R f6 in the formula (FP2) and R f7 and R f8 in the formula (FP3) are preferably an aryl group or an arylalkyl group, more preferably an aryl group, and a phenyl group. It is more preferable to have.
- an aromatic phosphazene By using such an aromatic phosphazene, the thermal stability of the obtained resin composition can be effectively enhanced.
- Cyclic and / or chain phosphazene compounds represented by the formulas (FP2) and (FP3) include, for example, phenoxyphosphazene, o-tolyloxyphosphazene, m-tolyloxyphosphazene, p-tolyloxyphosphazene and the like (poly). ) (Poly) xsilyloxyphosphazene, o, m, p-trimethylphenyloxy, such as trilloxyphosphazene, o, m-xylyloxyphosphazene, o, p-xylyloxyphosphazene, m, p-xylyloxyphosphazene.
- phenoxytriloxyphosphazene such as phosphazene, phenoxyo-tolyloxyphosphazene, phenoxym-tolyloxyphosphazene, phenoxyp-tolyloxyphosphazene, phenoxyo, m-xylyloxyphosphazene, phenoxyo, p-xysilyloxy Phosphazene, phenoxym, p-kisilyloxyphosphazene and the like
- phenoxytriloxyxysilyloxyphosphazene, phenoxyo, m, p-trimethylphenyloxyphosphazene and the like can be exemplified, preferably cyclic and / or chain phenoxyphosphazene and the like. Is.
- cyclic phosphazene compound represented by the formula (FP2) cyclic phenoxyphosphazene in which R f5 and R f6 are phenyl groups is particularly preferable.
- examples of such a cyclic phenoxyphosphazene compound include hexachlorocyclotriphosphazene and octachloro from a cyclic and linear chlorophosphazene mixture obtained by reacting ammonium chloride and phosphorus pentoxide at a temperature of 120 to 130 ° C.
- Examples thereof include compounds such as phenoxycyclotriphosphazene, octaphenoxycyclotetraphosphazene, and decaffenoxycyclopentaphosphazene obtained by taking out cyclic chlorphosphazene such as cyclotetraphosphazene and decachlorocyclopentaphosphazene and then substituting them with a phenoxy group. .. Further, the cyclic phenoxyphosphazene compound is preferably a compound in which a in the formula (FP2) is an integer of 3 to 8, and may be a mixture of compounds having different a.
- FP2 in the formula (FP2) is an integer of 3 to 8
- chain phosphazene compound represented by the formula (FP3) chain phenoxyphosphazene in which R f7 and R f8 are phenyl groups is particularly preferable.
- chain phenoxyphosphazene compound for example, hexachlorocyclotriphosphazene obtained by the above method is reverse-polymerized at a temperature of 220 to 250 ° C. to obtain a linear dichlorophosphazene having a degree of polymerization of 3 to 10000. Examples thereof include compounds obtained by substituting with a phenoxy group.
- the b in the formula (FP3) of the linear phenoxyphosphazene compound is preferably 3 to 1000, more preferably 3 to 100, still more preferably 3 to 25.
- Examples of the cross-linked phosphazen compound include a compound having a cross-linked structure of 4,4'-sulfonyldiphenylene (that is, a bisphenol S residue) and a cross-linked structure of a 2,2- (4,4'-diphenylene) isopropanol group.
- Compounds having a 4,4'-diphenylene group cross-linking structure such as a compound having a 4,4'-oxydiphenylene group cross-linking structure, a compound having a 4,4'-thiodiphenylene group cross-linking structure, and the like. And so on.
- the crosslinked phosphazene compound is a crosslinked phenoxyphosphazene compound in which a cyclic phenoxyphosphazene compound in which R f7 and R f8 are phenyl groups in the formula (FP3) is crosslinked by the above bridging group, or R f7 in the formula (FP3).
- a cross-linked phenoxyphosphazene compound in which a chain phenoxyphosphazene compound in which R f8 is a phenyl group is cross-linked by the above-mentioned cross-linking group is preferable from the viewpoint of flame retardancy, and a cross-linked phenoxy in which a cyclic phenoxyphosphazene compound is cross-linked by the above-mentioned cross-linking group is preferable.
- Phosphazene compounds are more preferred.
- the content of the phenylene group in the crosslinked phenoxyphosphazene compound is the total number of phenyl groups and phenylene groups in the cyclic phosphazene compound represented by the formula (FP2) and / or the chain phenoxyphosphazene compound represented by the formula (FP3). It is usually 50 to 99.9%, preferably 70 to 90% based on the above. Further, it is particularly preferable that the crosslinked phenoxyphosphazene compound is a compound having no free hydroxyl group in its molecule.
- the phosphazene compound is a cyclic phenoxyphosphazene compound represented by the formula (FP2) and a crosslinked phenoxyphosphazene compound in which the cyclic phenoxyphosphazene compound represented by the above formula (FP2) is crosslinked by a crosslinking group.
- FP2 cyclic phenoxyphosphazene compound represented by the formula (FP2)
- FP2 crosslinked phenoxyphosphazene compound in which the cyclic phenoxyphosphazene compound represented by the above formula (FP2) is crosslinked by a crosslinking group.
- At least one selected from the group consisting of the above is preferable from the viewpoint of flame retardancy and mechanical properties of the resin composition.
- Examples of commercially available phosphazene compounds include FP-110 and Fushimi Pharmaceutical Co., Ltd.
- halogen-based flame retardant a bromine-based flame retardant and a chlorine-based flame retardant are preferable, and a bromine-based flame retardant is more preferable.
- the bromine-based flame retardant include hexabromocyclododecane, decabromodiphenyl oxide, octabromodiphenyl oxide, tetrabromobisphenol A, bis (tribromophenoxy) ethane, bis (pentabromophenoxy) ethane, and tetrabromobisphenol A epoxy resin.
- Tetrabromobisphenol A carbonate ethylene (bistetrabromophthal) imide, ethylenebispentabromodiphenyl, tris (tribromophenoxy) triazine, bis (dibromopropyl) tetrabromobisphenol A, bis (dibromopropyl) tetrabromobisphenol S, bromine
- examples thereof include polyphenylene ether (including poly (di) bromophenylene ether), brominated polystyrene (polydibromostyrene, polytribromostyrene, crosslinked brominated polystyrene, brominated polycarbonate and the like).
- an organic alkali metal salt compound and an organic alkaline earth metal salt compound are preferable (hereinafter, the alkali metal and the alkaline earth metal are referred to as "alkali (earth) metal").
- the organic metal salt-based flame retardant include sulfonic acid metal salt, carboxylic acid metal salt, borate metal salt, phosphoric acid metal salt and the like, but in terms of thermal stability when added to an aromatic polycarbonate resin. Therefore, a sulfonic acid metal salt is preferable, and a perfluoroalkane sulfonic acid metal salt is particularly preferable.
- Examples of the sulfonic acid metal salt include lithium sulfonate (Li) salt, sodium sulfonate (Na) salt, potassium sulfonate (K) salt, rubidium sulfonate (Rb) salt, cesium sulfonate (Cs) salt, and magnesium sulfonate.
- Examples thereof include (Mg) salt, calcium sulfonate (Ca) salt, strontium sulfonate (Sr) salt, barium sulfonate (Ba) salt and the like, and among these, sodium sulfonate (Na) salt and potassium sulfonate (K). ) Salt is preferred.
- sulfonic acid metal salts examples include diphenylsulfon-3,3'-dipotassium sulfonic acid, diphenylsulfon-3-potassium sulfonate, sodium benzenesulfonate, sodium (poly) styrene sulfonate, and paratoluene sulfonic acid.
- diphenylsulfone-3,3'-dipotassium disulfonate potassium diphenylsulfone-3-sulfonate, sodium paratoluenesulfonate, potassium paratoluenesulfonate, and potassium perfluorobutanesulfonate are transparent and flame-retardant.
- Perfluoroalkane sulfonic acid metal salts such as potassium perfluorobutane sulfonate are particularly preferable because they are excellent in balance.
- the content thereof is preferably 0.01 part by mass or more, more preferably 1 part by mass or more, based on 100 parts by mass of the polyamide resin. It is more preferably 5 parts by mass or more, particularly preferably 6 parts by mass or more, and further preferably 7 parts by mass or more.
- the content of the flame retardant is more preferably 50 parts by mass or less, further preferably 40 parts by mass or less, and particularly preferably 35 parts by mass or less with respect to 100 parts by mass of the polyamide resin. , 30 parts by mass or less is more preferable.
- the resin composition of the present embodiment may contain only one kind of flame retardant, or may contain two or more kinds of flame retardants. When two or more kinds are contained, it is preferable that the total amount is within the above range.
- the resin composition of the present embodiment may also contain a flame retardant aid.
- the flame retardant aid include antimony compounds, zinc oxide, copper oxide, magnesium oxide, zinc oxide, molybdenum oxide, zirconium oxide, tin oxide, iron oxide, titanium oxide, aluminum oxide, zinc borate and the like.
- the system compound, zinc sulfate, is preferable.
- zinc tintate is preferable, and when a halogen-based flame retardant is used, an antimony-based compound is preferable.
- the zinc tinate at least one of zinc trioxide (ZnSnO 3 ) and zinc hexahydride (ZnSn (OH) 6 ) is preferable.
- the antimony-based compound is a compound containing antimony and contributes to flame retardancy. Specific examples thereof include antimony oxide such as antimony trioxide (Sb 2 O 3 ), antimony tetroxide and antimony pentoxide (Sb 2 O 5 ), sodium antimonate and antimony phosphate. Of these, antimony oxide is preferable because it has excellent moisture and heat resistance. More preferably, antimony trioxide is used.
- the flame retardant: flame retardant aid in a ratio of 1: 0.05 to 2.0 (mass ratio), and a ratio of 1: 0.2 to 1.0. It is more preferable to use in.
- the resin composition of the present embodiment may contain only one kind of flame retardant aid, or may contain two or more kinds of flame retardant aids. When two or more kinds are contained, it is preferable that the total amount is within the above range.
- the resin composition of the present embodiment may contain a reinforcing material, and it is preferable that the reinforcing material is contained in the resin composition in a proportion of 5.0 to 60.0% by mass.
- the reinforcing material that can be used in the present embodiment is not particularly specified in terms of its type and the like, and may be any of fibers, fillers, flakes, beads and the like, but fibers are preferable.
- the reinforcing material when it is a fiber, it may be a short fiber or a long fiber.
- the reinforcing material is a short fiber, a filler, beads, or the like
- examples of the resin composition of the present embodiment include pellets, powdered pellets, and a film formed from the pellets.
- the reinforcing material is a long fiber, the reinforcing material is exemplified by a so-called long fiber for a UD material (Uni-Directional), a sheet-shaped long fiber such as a woven fabric or a knitted fabric, or the like.
- a component other than the reinforcing material of the resin composition of the present embodiment is impregnated into the reinforcing material which is the sheet-shaped long fibers to obtain a sheet-shaped resin composition (for example, prepreg). can do.
- the raw materials for the reinforcing material are glass, carbon (carbon fiber, etc.), alumina, boron, ceramic, metal (steel, etc.), asbestos, clay, zeolite, potassium titanate, barium sulfate, titanium oxide, silicon oxide, aluminum oxide, and water.
- examples thereof include inorganic substances such as magnesium oxide, and organic substances such as plants (including Kenaf, bamboo), aramid, polyoxymethylene, aromatic polyamide, polyparaphenylene benzobisoxazole, and ultra-high molecular weight polyethylene. Glass is preferred.
- the resin composition of the present embodiment preferably contains glass fiber as a reinforcing material.
- the glass fiber is selected from a glass composition such as A glass, C glass, E glass, R glass, D glass, M glass, and S glass, and E glass (non-alkali glass) is particularly preferable.
- Glass fiber refers to a fibrous material having a perfect circular or polygonal cross-sectional shape cut at a right angle in the length direction.
- the number average fiber diameter of the glass fiber is usually 1 to 25 ⁇ m, preferably 5 to 17 ⁇ m. By setting the number average fiber diameter to 1 ⁇ m or more, the molding processability of the resin composition tends to be further improved.
- the glass fiber may be a single fiber or a single twist of a plurality of single fibers.
- the morphology of the glass fiber is glass roving, which is made by continuously winding a single fiber or a plurality of twisted fibers, chopped strands cut into lengths of 1 to 10 mm (that is, glass fibers having a number average fiber length of 1 to 10 mm).
- the glass fiber may be any of milled fibers crushed to a length of about 10 to 500 ⁇ m (that is, glass fibers having a number average fiber length of 10 to 500 ⁇ m), but chopped strands cut to a length of 1 to 10 mm are preferable.
- the glass fiber those having different morphologies can be used in combination.
- one having an irregular cross-sectional shape is also preferable. In this irregular cross-sectional shape, the flatness represented by the major axis / minor axis ratio of the cross section perpendicular to the length direction of the fiber is, for example, 1.5 to 10, among which 2.5 to 10, and even 2. It is preferably 5 to 8, especially 2.5 to 5.
- the glass fiber is surface-treated with, for example, a silane compound, an epoxy compound, a urethane compound, or the like in order to improve the affinity with the resin component as long as the characteristics of the resin composition of the present embodiment are not significantly impaired. , It may be oxidized.
- the reinforcing material used in this embodiment may be a reinforcing material having conductivity.
- Specific examples thereof include metals, metal oxides, conductive carbon compounds and conductive polymers, and conductive carbon compounds are preferable.
- the metal include those made of copper, nickel, silver and stainless steel, and metal fillers, stainless fibers and magnetic fillers are preferable.
- the metal oxide include alumina and zinc oxide, and alumina fibers and zinc oxide nanotubes are preferable.
- the conductive carbon compound carbon black, Ketjen carbon, graphene, graphite, fullerene, carbon nanocoil, carbon nanotube, and carbon fiber are preferable, and carbon nanotube is more preferable.
- a fiber coated with a metal, a metal oxide, or a conductive carbon compound is also preferable.
- carbon-coated potassium titanate whiskers, metal-coated fibers, and the like are exemplified.
- the description in paragraphs 0033 to 0041 of Japanese Patent Application Laid-Open No. 2021-031633 can be referred to, and this content is incorporated in the present specification.
- the content thereof is preferably 10 parts by mass or more, preferably 20 parts by mass or more, based on 100 parts by mass of the polyamide resin. It is more preferably 30 parts by mass or more, further preferably 40 parts by mass or more. By setting the value to the lower limit or more, the mechanical strength of the obtained molded product tends to be further increased.
- the content of the reinforcing material (preferably glass fiber) is preferably 100 parts by mass or less, more preferably 90 parts by mass or less, and 85 parts by mass or less with respect to 100 parts by mass of the polyamide resin. It is even more preferably 80 parts by mass or less, and even more preferably 75 parts by mass or less.
- the resin composition of the present embodiment may contain only one type of reinforcing material (preferably glass fiber), or may contain two or more types. When two or more kinds are contained, it is preferable that the total amount is within the above range.
- the resin composition of the present embodiment may contain a nucleating agent. By including the nucleating agent, the crystallization rate can be increased.
- the nucleating agent is not particularly limited as long as it is unmelted at the time of melt processing and can become a crystal nucleus in the cooling process, and may be an organic nucleating agent or an inorganic nucleating agent, and an inorganic nucleating agent is preferable.
- the inorganic nucleating agent include graphite, molybdenum disulfide, barium sulfate, talc, calcium carbonate, sodium phosphate, mica and kaolin, and more preferably at least one selected from talc and calcium carbonate. More preferred.
- the organic nucleating agent is not particularly limited, and a known nucleating agent can be used.
- the nucleating agent is dibenzylideneacetone sorbitol-based nucleating agent, nonitol-based nucleating agent, phosphate ester salt-based nucleating agent, and rosin-based nucleating agent. It is preferably at least one selected from agents, benzoic acid metal salt-based nucleating agents and the like.
- the lower limit of the number average particle size of the nucleating agent is preferably 0.1 ⁇ m or more.
- the upper limit of the number average particle size of the nucleating agent is preferably 40 ⁇ m or less, more preferably 30 ⁇ m or less, further preferably 28 ⁇ m or less, further preferably 15 ⁇ m or less, and even more preferably 10 ⁇ m. The following is even more preferable.
- the number of nucleating agents to be nucleated is larger than the blending amount of the nucleating agent, so that the crystal structure tends to be more stable.
- the content of the nucleating agent in the resin composition of the present embodiment is more than 0.01 part by mass, preferably 0.05 part by mass or more, and 0.1 part by mass or more with respect to 100 parts by mass of the polyamide resin. It is more preferably 0.3 parts by mass or more, and even more preferably 0.7 parts by mass or more. By setting the value to the lower limit or more, the crystalline state of the resin composition can be more sufficiently stabilized.
- the content of the nucleating agent in the resin composition of the present embodiment is 10 parts by mass or less, preferably 5 parts by mass or less, and preferably 3 parts by mass or less with respect to 100 parts by mass of the polyamide resin. More preferably, it may be 2 parts by mass or less.
- the resin composition of the present embodiment contains a nucleating agent, it may contain only one kind of nucleating agent, or may contain two or more kinds of nucleating agents. When two or more kinds are contained, it is preferable that the total amount is within the above range.
- the resin composition of the present embodiment may contain a mold release agent.
- the release agent include an aliphatic carboxylic acid, a salt of an aliphatic carboxylic acid, an ester of an aliphatic carboxylic acid and an alcohol, an aliphatic hydrocarbon compound having a number average molecular weight of 200 to 15,000, and a polysiloxane-based silicone oil. , Ketone wax, light amide and the like, preferably an aliphatic carboxylic acid, a salt of an aliphatic carboxylic acid, an ester of an aliphatic carboxylic acid and an alcohol, and more preferably a salt of an aliphatic carboxylic acid.
- the details of the release agent can be referred to in paragraphs 0055 to 0061 of JP-A-2018-095706, and these contents are incorporated in the present specification.
- the content thereof is preferably 0.05 to 3% by mass, preferably 0.1 to 0.8% by mass in the resin composition. Is more preferable, and 0.2 to 0.6% by mass is further preferable.
- the resin composition of the present embodiment may contain only one type of mold release agent, or may contain two or more types of mold release agent. When two or more kinds are contained, it is preferable that the total amount is within the above range.
- the method for producing the resin composition of the present embodiment is not particularly specified, and a known method for producing a thermoplastic resin composition can be widely adopted. Specifically, each component is premixed using various mixers such as a tumbler and a Henshell mixer, and then melt-kneaded with a Banbury mixer, a roll, a brabender, a single-screw extruder, a twin-screw extruder, a kneader, or the like.
- the resin composition can be produced by the above method.
- the resin composition of the present embodiment is produced by premixing each component without premixing, or premixing only a part of the components, supplying the mixture to an extruder using a feeder, and melt-kneading the mixture. You can also do it. Further, for example, a resin composition obtained by premixing some components and supplying them to an extruder to be melt-kneaded is used as a masterbatch, and this masterbatch is mixed with the remaining components again and melt-kneaded. The resin composition of the present embodiment can also be produced.
- a molded product is formed from the polyamide resin of the present embodiment or the resin composition of the present embodiment.
- the method for molding the molded product is not particularly limited, and a conventionally known molding method can be adopted.
- a conventionally known molding method can be adopted.
- the molded product formed from the composition of the present embodiment includes an injection molded product, a thin-walled molded product, a hollow molded product, a film (including a plate and a sheet), a cylindrical shape (hose, tube, etc.), an annular shape, and a circular shape.
- Elliptical shape, gear shape, polygonal shape, deformed product, hollow product, frame shape, box shape, panel shape extruded product, fiber and the like are exemplified.
- the polyamide resin or polyamide resin composition of the present embodiment is further preferably used as the following materials.
- a non-woven fabric composed of a thermoplastic resin fiber containing a polyamide resin or a polyamide resin composition of the present embodiment and a reinforcing fiber is exemplified.
- Molded products include films, seats, tubes, pipes, gears, cams, various housings, rollers, impellers, bearing retainers, spring holders, clutch parts, chain tensioners, tanks, wheels, connectors, switches, sensors, sockets, condensers, etc.
- Automotive parts such as moving parts and electrical parts, electrical parts / electronic parts, surface mount type connectors, sockets, camera modules, power supply parts, switches, sensors, condenser seat plates, hard disk parts, relays, resistors, fuse holders, coil bobbins. , IC housing and other surface mount components, fuel caps, fuel tanks, fuel sender modules, fuel cutoff valves, canisters, fuel piping and other fuel system components.
- the fuel system parts can be suitably used for various devices equipped with an engine that uses fuel such as gasoline and light oil such as automobiles, tractors, cultivators, brush cutters, lawn mowers, chainsaws, and the like. ..
- the description in paragraphs 0057 to 0061 of International Publication No. 2012/098840 can be referred to, and the contents thereof are incorporated in the present specification.
- p-BDEA p-benzenediethaneamine was synthesized according to the following synthetic example.
- ⁇ P-BDEA synthesis example >> p-Xylylene diocyanide (manufacturer: Tokyo Chemical Industry Co., Ltd.) was reduced under a hydrogen atmosphere, and the obtained product was distilled and purified to obtain p-benzenediethaneamine.
- the purity was 99.7%.
- p-BDEA-4Me Organic synthesis was carried out according to Example 3 of JP-A-2004-503527, and after neutralizing the obtained hydrochloride of p-BDEA-4Me, p-BDEA-4Me was extracted. The following compounds were obtained by distillation and purification of the obtained extract. As a result of analysis using gas chromatography, the purity was 99.7%.
- p-BDEA-2Me Organic synthesis was carried out according to the description of Example 1 of JP-A-2004-503527, and after neutralizing the obtained hydrochloride of p-BDEA-2Me, p-BDEA-2Me was extracted. , The obtained extract was distilled and purified to obtain p-BDEA-2Me (the following compound).
- Isophthalic acid Manufacturer: Tokyo Chemical Industry Sebacic acid: Manufacturer: Tokyo Chemical Industry Dodecanedioic acid: Manufacturer: Tokyo Chemical Industry Calcium hypophosphite: Manufacturer: Wako Pure Chemical Industries, Ltd. Sodium acetate: Manufacturer: Wako Pure Chemical Industries, Ltd.
- Example 1 Synthesis of Polyamide Resin >> In a flat bottom test tube, p-BDEA 0.00204 mol (0.3351 g), p-BDEA-4Me 0.00136 mol (0.2997 g), isophthalic acid 0.00340 mol (0.5648 g), calcium hypophosphite 0.3 mg (polyamide resin).
- the phosphorus concentration in the mixture is 0.01% by mass)
- 0.2 mg of sodium acetate is added
- 7.0 g of pure water is added
- the test tube is placed in a reaction can having a volume of 20 mL equipped with a thermometer, a pressure gauge and a pressure control valve. I prepared it.
- the reaction vessel was sufficiently replaced with nitrogen, the pressure inside the reaction vessel was returned to normal pressure, and then the pressure control valve was closed.
- the reaction can was heated with an aluminum block heater, and the internal pressure of the reaction can was held at 1.9 MPa and 210 ° C. for 20 minutes, and then at 2.8 MPa and 230 ° C. for 40 minutes.
- the pressure control valve was slightly opened while raising the temperature to 260 ° C., and water was drained from the pressure control valve while lowering the pressure to normal pressure over 30 minutes. Then, the temperature of the reaction can was raised to 300 ° C. and held for 10 minutes while appropriately draining water from the pressure control valve. After cooling the reaction can to room temperature, the test tube was taken out to obtain a polyamide resin.
- the crystal melting enthalpy ⁇ Hm of the polyamide resin measured according to the following method was 1 J / g or less.
- Glass transition temperature (Tg) and crystal melting enthalpy ( ⁇ H) >> The glass transition temperature is measured by heating from room temperature to 250 ° C. at a heating rate of 10 ° C./min using a differential scanning calorimeter (DSC), immediately cooling to room temperature or lower, and then from room temperature to 250 ° C. again.
- the glass transition temperature (unit: ° C.) when heated at a room temperature of 10 ° C./min was measured.
- DSC-60 manufactured by Shimadzu Corporation was used as the differential scanning calorimetry.
- the crystal melting enthalpy ⁇ Hm of the polyamide resin was measured in the temperature rising process according to JIS K7121 and K7122.
- the water absorption rate was determined by storing 0.2 g of the above-mentioned polyamide resin in an environment of 85 ° C. and a relative humidity of 85% for 20 days, and then measuring the water content.
- the water content (unit: mass%) was determined by measuring at 235 ° C. for 20 minutes according to JIS K 0068.
- CA-310 / VA-236S manufactured by Nittoseiko Analytech Co., Ltd. was used.
- ⁇ Deformation after water absorption For deformation after water absorption, add 0.5 g of the polyamide resin obtained above to a flat-bottomed test tube, heat it in a nitrogen atmosphere at 300 ° C. for 10 minutes, cool it to room temperature, and then take it out to form a plate. After molding, the obtained molded product was stored in an environment of 85 ° C. and a relative humidity of 85% for 20 days, and then the shape was visually confirmed. Those that were visually deformed were considered to be deformed, and those that were not deformed were considered to be not deformed. The deformed one was deformed into a rounded shape as compared with that before storage.
- Example 1 ⁇ Examples 2 to 6, Comparative Examples 1 and 2>
- Example 1 the types and / or amounts of diamines and dicarboxylic acids were changed as shown in Table 1, and the others were carried out in the same manner.
- the polyamide resin of the present invention has a sufficiently high glass transition temperature, a low water absorption rate, and the molded product is effectively suppressed from being deformed after water absorption (Examples 1 to 6).
- the aromatic dicarboxylic acid was not used as the raw material of the polyamide resin (Comparative Examples 1 and 2), the glass transition temperature became low. In addition, deformation of the molded product was observed after water absorption.
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Abstract
Description
そのようなポリアミド樹脂としては、古くから、ポリアミド6やポリアミド66に代表される脂肪族ポリアミド樹脂が用いられてきた。さらに、ポリアミド樹脂の原料に芳香族ジカルボン酸および/または芳香族ジアミンを用いた芳香族ポリアミド樹脂も用いられるようになってきている。このような芳香族ポリアミド樹脂は、例えば、特許文献1、2等に記載がある。
また、近年、非晶性のポリアミド樹脂も合成され、その研究が進められている。非晶性ポリアミド樹脂は透明性が高く、その特徴をいかして、各種の包装容器や、スイッチカバー、レンズ用やメガネフレームなど、生活用品から、工業製品、意匠性の要求される用途に至るまで広く使用され始めている。
ここで、ポリアミド樹脂は、用途にもよるが、ガラス転移温度が高く、かつ、低吸水率であることが求められることが多い。特に、非晶性ポリアミド樹脂は、明確な融点を持たないことから、ガラス転移温度が低くなると成形品の形状が保持できなくなってしまうため、高いガラス転移温度に対する要求が高い。また、ポリアミド樹脂は、低吸水率であることに加え、吸水後の成形品の変形が小さいものにすることも課題となっている。
本発明はかかる課題を解決することを目的とするものであって、ガラス転移温度が高く、かつ、吸水率が低く、さらに、吸水後の成形品の変形が小さいポリアミド樹脂を提供することを目的とする。
具体的には、下記手段により、上記課題は解決された。
<1>ジアミン由来の構成単位と、ジカルボン酸由来の構成単位から構成され、前記ジアミン由来の構成単位の30モル%超が、式(1)で表されるジアミンに由来し、前記ジカルボン酸由来の構成単位の30モル%超が芳香族ジカルボン酸に由来する、ポリアミド樹脂。
<2>前記芳香族ジカルボン酸由来の構成単位の30モル%超が、イソフタル酸、テレフタル酸、および、フェニレン二酢酸から選択される芳香族ジカルボン酸由来の構成単位である、<1>に記載のポリアミド樹脂。
<3>前記芳香族ジカルボン酸由来の構成単位の30モル%超が、イソフタル酸由来の構成単位である、<1>に記載のポリアミド樹脂。
<4>前記ジカルボン酸由来の構成単位の55モル%以上が芳香族ジカルボン酸由来の構成単位である、<1>~<3>のいずれか1つに記載のポリアミド樹脂。
<5>前記ジカルボン酸由来の構成単位の90モル%以上が芳香族ジカルボン酸由来の構成単位である、<1>~<3>のいずれか1つに記載のポリアミド樹脂。
<6>前記ジアミン由来の構成単位の30モル%超100モル%以下が、式(1)で表されるジアミンに由来し、70モル%~0モル%がp-ベンゼンジエタンアミンに由来する、<1>~<5>のいずれか1つに記載のポリアミド樹脂。
<7>式(1)中、R1~R8は、それぞれ独立に、水素原子またはメチル基を表す、<1>~<6>のいずれか1つに記載のポリアミド樹脂。
<8>式(1)中、R1、R2、R7およびR8は、水素原子であり、R3、R4、R5およびR6は、メチル基である、<1>~<6>のいずれか1つに記載のポリアミド樹脂。
<9>前記ポリアミド樹脂の示差走査熱量測定に従ったガラス転移温度が90℃以上である、<1>~<8>のいずれか1つに記載のポリアミド樹脂。
<10>前記ポリアミド樹脂は非晶性ポリアミド樹脂である、<1>~<9>のいずれか1つに記載のポリアミド樹脂。
なお、本明細書において「~」とはその前後に記載される数値を下限値および上限値として含む意味で使用される。
本明細書において、各種物性値および特性値は、特に述べない限り、23℃におけるものとする。
このような構成とすることにより、ガラス転移温度が高く、吸水率が低いポリアミド樹脂が得られる。さらに、吸水後の変形が小さいポリアミド樹脂が得られる。また、本実施形態のポリアミド樹脂は、通常、非晶性ポリアミド樹脂であることから、透明性が求められる用途に好ましく用いられる。
本実施形態において、ジアミン由来の構成単位の30モル%超が、式(1)で表されるジアミンに由来する。本実施形態において、ジアミン由来の構成単位における式(1)で表されるジアミン由来の構成単位の割合は、30モル%超であり、35モル%以上であることが好ましい。前記下限値以上とすることにより、得られるポリアミド樹脂の吸水率を低くできる傾向にある。本実施形態において、ジアミン由来の構成単位における式(1)で表される化合物由来の構成単位の割合は、100モル%以下である。
本実施形態において、ジアミン由来の構成単位における式(1)で表されるジアミンは1種のみであってもよいし、2種以上であってもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。
式(1)において、R1~R4の少なくとも2つおよびR5~R8の少なくとも2つは炭素数1~5の脂肪族基であることが好ましく、R1~R4の2つおよびR5~R8の2つが炭素数1~5の脂肪族基であることがより好ましい。
また、式(1)において、R1~R8は、それぞれ独立に、水素原子またはメチル基を表すことが好ましい。より好ましくは、R1および/またはR2、ならびに、R7および/またはR8は、水素原子であり、R1、R2、R7およびR8のうち、水素原子でないものは、メチル基であり、R3、R4、R5およびR6は、水素原子またはメチル基(好ましくはメチル基)である。さらに好ましくは、R1、R2、R7およびR8は、水素原子であり、R3、R4、R5およびR6は、水素原子またはメチル基(好ましくはメチル基)である。このような化合物を用いることで、式(1)で表されるジアミンにおけるアミノ基の反応性が高くなり、それによって重合が進行しやすくなり、生産性が高くなる傾向にある。
脂環式ジアミンとしては、公知の脂環式ジアミンを広く採用でき、1,2-ビス(アミノメチル)シクロヘキサン、1,3-ビス(アミノメチル)シクロヘキサン、1,4-ビス(アミノメチル)シクロヘキサン、イソホロンジアミン、4,4’-チオビス(シクロヘキサン-1-アミン)、4,4’-チオビス(シクロヘキサン-1-アミン)等が例示される。
他の芳香族ジアミンについては、国際公開第2017/126409号の段落0052の記載を参酌でき、これらの内容は本明細書に組み込まれる。
本実施形態のポリアミド樹脂は、ジカルボン酸由来の構成単位の30モル%超が芳香族ジカルボン酸に由来する。芳香族ジカルボン酸由来の構成単位を含むことにより、ガラス転移温度がより高いポリアミド樹脂が得られる傾向にある。
本実施形態において、ジカルボン酸由来の構成単位における芳香族ジカルボン酸由来の構成単位の割合は、30モル%超であり、40モル%以上であることが好ましく、45モル%以上であることがより好ましく、55モル%以上であることがさらに好ましく、60モル%超であることが一層好ましく、80モル%以上であることがより一層好ましく、90モル%以上であることがさらに一層好ましく、95モル%以上であることが特に一層好ましく、99モル%以上であることがより特に一層好ましい。前記下限値以上とすることにより、高温成形したときの強度が向上する傾向にある。本実施形態において、ジカルボン酸由来の構成単位における芳香族ジカルボン酸由来の構成単位の割合の上限は、100モル%以下である。
本実施形態における芳香族ジカルボン酸の好ましい他の一例は、式(FC)で表される芳香族ジカルボン酸である。
式(FC)
HOOC-(CH2)m-芳香環構造-(CH2)m-COOH
(式(FC)中、mは0、1または2を示す。)
芳香環構造は、単環または縮合環のいずれであってもよく、単環が好ましい。また、芳香環を構成する炭素数も特に定めるものではないが、6~15員環が好ましい。
前記芳香環構造は、より具体的には、ベンゼン環、ナフタレン環、置換基を有するベンゼン環、置換基を有するナフタレン環が好ましく、ベンゼン環、または、置換基を有するベンゼン環がより好ましく、ベンゼン環がさらに好ましい。
この中でも、イソフタル酸、テレフタル酸、および、フェニレン二酢酸(好ましくはp-フェニレン二酢酸)から選択されることが好ましく、イソフタル酸およびフェニレン二酢酸がより好ましく、イソフタル酸がさらに好ましい。イソフタル酸を用いることにより、サイクリックモノマーがより形成されにくくなり、アウトガスの発生量が減少する傾向にある。アウトガスの発生量が減少することで、射出成形時の金型汚れが減少し、金型の清掃頻度が減少して生産性が向上する傾向にある。
本実施形態のポリアミド樹脂において、芳香族ジカルボン酸由来の構成単位中のイソフタル酸、テレフタル酸、および、フェニレン二酢酸から選択される芳香族ジカルボン酸(好ましくはイソフタル酸)由来の構成単位の割合は、30モル%超であることが好ましく、40モル%以上であることがより好ましく、45モル%以上であることがさらに好ましく、55モル%以上であることが一層好ましく、60モル%超であることがより一層好ましく、80モル%以上であることがさらに一層好ましく、90モル%以上であることが特に一層好ましく、95モル%以上であることがより特に一層好ましく、99モル%以上であることが最も好ましい。上限は、100モル%以下である。
また、本実施形態のポリアミド樹脂は、脂肪族ジカルボン酸由来の構成単位を実質的に含まない構成とすることができる。実質的に含まないとは、ジカルボン酸由来の構成単位中、脂肪族ジカルボン酸由来の構成単位の割合が、5モル%以下であることをいい、3モル%以下であることが好ましく、1モル%以下であることがさらに好ましい。
脂肪族ジカルボン酸由来の構成単位は1種のみ含まれていてもよいし、2種以上含まれていてもよい。
(1)ジアミン由来の構成単位の30モル%超100モル%以下が、式(1)で表されるジアミンに由来し、70モル%~0モル%がp-ベンゼンジエタンアミンに由来し、ジカルボン酸由来の構成単位の30モル%超が芳香族ジカルボン酸(好ましくはイソフタル酸)に由来する、ポリアミド樹脂
(2)ジアミン由来の構成単位の30モル%超が、式(1)で表されるジアミンに由来し、ジカルボン酸由来の構成単位の30モル%超100モル%以下が芳香族ジカルボン酸(好ましくはイソフタル酸)に由来し、70モル%~0モル%が脂肪族ジカルボン酸(好ましくはドデカン二酸)に由来する、ポリアミド樹脂。
(3)ジアミン由来の構成単位の30モル%超100モル%以下が、式(1)で表されるジアミンに由来し、70モル%~0モル%がp-ベンゼンジエタンアミンに由来し、ジカルボン酸由来の構成単位の30モル%超100モル%以下が芳香族ジカルボン酸(好ましくはイソフタル酸)に由来し、70モル%~0モル%が脂肪族ジカルボン酸(好ましくはドデカン二酸)に由来する、ポリアミド樹脂。
(4)ジアミン由来の構成単位の30モル%超100モル%以下が、式(1)で表されるジアミンに由来し、70モル%~0モル%がp-ベンゼンジエタンアミンに由来し、ジカルボン酸由来の構成単位の55モル%~100モル%が芳香族ジカルボン酸(好ましくはイソフタル酸)に由来する、ポリアミド樹脂。
上記(1)~(4)において、式(1)で表されるジアミン由来の構成単位とp-ベンゼンジエタンアミン由来の構成単位の合計は100モル%以下であり、95~100モル%であることが好ましく、98~100モル%であることがより好ましい。また、芳香族ジカルボン酸(好ましくはイソフタル酸)由来の構成単位と脂肪族ジカルボン酸(好ましくはドデカン二酸)由来の構成単位の合計は100モル%以下であり、95~100モル%であることが好ましく、98~100モル%であることがより好ましい。
本実施形態のポリアミド樹脂は、好ましくは70質量%以上、より好ましくは80質量%以上が、さらに好ましくは90質量%以上が、一層好ましくは95質量%以上が、より一層好ましくは98質量%以上がジカルボン酸由来の構成単位およびジアミン由来の構成単位からなる。
次に、本実施形態のポリアミド樹脂の物性について述べる。
本実施形態のポリアミド樹脂は、示差走査熱量測定に従ったガラス転移温度(Tg)が90℃以上であることが好ましく、110℃以上であることがより好ましく、120℃以上であることがさらに好ましく、130℃以上であることが一層好ましく、140℃以上であることがより一層好ましく、145℃以上であることがさらに一層好ましく、148℃以上であることが特に一層好ましい。通常のポリアミド樹脂は、融点を持つ結晶性樹脂であるため、ガラス転移温度が低くても高温環境で成形品の形状が維持できる。しかしながら、非晶性ポリアミド樹脂の場合、明確な融点を持たない為、ガラス転移温度が低くなると高温環境で成形品の形状が保持できなくなってしまう。さらに、ポリアミド樹脂は吸水によってガラス転移温度が下がるため、吸水性が高い非晶性ポリアミド樹脂は高温環境で成形品の形状が保持できなくなってしまう。本実施形態のポリアミド樹脂はガラス転移温度が高く、吸水性が低いため、非晶性ポリアミド樹脂であっても、成形品の保持、特に、吸水後の成形品の形状変化を効果的に抑制できる。前記ガラス転移温度は、また、200℃以下であることが好ましく、180℃以下であることがより好ましく、170℃以下であることがさらに好ましく、160℃以下であることが一層好ましく、155℃以下であってもよい。前記上限値以下とすることにより、溶融時の流動性が高くなり、成形性がより向上する傾向にある。
ガラス転移温度は、後述する実施例に記載の方法に従って測定される。
吸水率は、後述する実施例に記載の方法に従って測定される。
尚、本実施形態のポリアミド樹脂は、通常、非晶性ポリアミド樹脂である。非晶性ポリアミド樹脂とは、明確な融点を持たないポリアミド樹脂であり、具体的には、結晶融解エンタルピーΔHmが5J/g未満であることをいい、3J/g以下が好ましく、1J/g以下がさらに好ましい。結晶融解エンタルピーΔHmは、後述する実施例に記載の方法に従う。
本実施形態のポリアミド樹脂は、好ましくは、触媒としてリン原子含有化合物を用いて溶融重縮合(溶融重合)法、もしくは加圧塩法により製造され、加圧塩法により製造されることがさらに好ましい。溶融重縮合法としては、溶融させた原料ジカルボン酸に原料ジアミンを滴下しつつ加圧下で昇温し、縮合水を除きながら重合させる方法が好ましい。加圧塩法としては、原料ジアミンと原料ジカルボン酸から構成される塩を水の存在下で、加圧下で昇温し、加えた水および縮合水を除きながら溶融状態で重合させる方法が好ましい。
リン原子含有化合物としては、具体的には、ジメチルホスフィン酸、フェニルメチルホスフィン酸等のホスフィン酸化合物;次亜リン酸、次亜リン酸ナトリウム、次亜リン酸カリウム、次亜リン酸リチウム、次亜リン酸マグネシウム、次亜リン酸カルシウム、次亜リン酸エチル等の次亜リン酸化合物;ホスホン酸、ホスホン酸ナトリウム、ホスホン酸リチウム、ホスホン酸カリウム、ホスホン酸マグネシウム、ホスホン酸カルシウム、フェニルホスホン酸、エチルホスホン酸、フェニルホスホン酸ナトリウム、フェニルホスホン酸カリウム、フェニルホスホン酸リチウム、フェニルホスホン酸ジエチル、エチルホスホン酸ナトリウム、エチルホスホン酸カリウム等のホスホン酸化合物;亜ホスホン酸、亜ホスホン酸ナトリウム、亜ホスホン酸リチウム、亜ホスホン酸カリウム、亜ホスホン酸マグネシウム、亜ホスホン酸カルシウム、フェニル亜ホスホン酸、フェニル亜ホスホン酸ナトリウム、フェニル亜ホスホン酸カリウム、フェニル亜ホスホン酸リチウム、フェニル亜ホスホン酸エチル等の亜ホスホン酸化合物;亜リン酸、亜リン酸水素ナトリウム、亜リン酸ナトリウム、亜リン酸リチウム、亜リン酸カリウム、亜リン酸マグネシウム、亜リン酸カルシウム、亜リン酸トリエチル、亜リン酸トリフェニル、ピロ亜リン酸等の亜リン酸化合物等が挙げられ、ジ亜リン酸ナトリウムとジ亜リン酸カルシウムが好ましく、次亜リン酸カルシウムがさらに好ましい。次亜リン酸カルシウムを用いると得られるポリアミド樹脂の耐熱性がより向上する傾向にある、
これらのリン原子含有化合物は、1種または2種以上を組み合わせて用いることができる。
リン原子含有化合物の添加量は、ポリアミド樹脂中のリン原子濃度が0.001~0.1質量%となる量であることが好ましい。このような範囲にすることでポリアミド樹脂の耐熱性が向上する傾向にある。
アルカリ金属原子としては、ナトリウム、カリウムおよびリチウムが例示され、ナトリウムが好ましい。アルカリ土類金属原子としては、カルシウムおよびマグネシウムが例示される。
重合速度調整剤の具体例としては、水酸化リチウム、水酸化ナトリウム、水酸化カリウム、水酸化ルビジウム、水酸化セシウム、水酸化マグネシウム、水酸化カルシウム、水酸化ストロンチウム、水酸化バリウム、酢酸リチウム、酢酸ナトリウム、酢酸カリウム、酢酸ルビジウム、酢酸セシウム、酢酸マグネシウム、酢酸カルシウム、酢酸ストロンチウム、酢酸バリウムが挙げられる。これらの中でも、水酸化ナトリウム、水酸化カリウム、水酸化マグネシウム、水酸化カルシウム、酢酸ナトリウム、酢酸カリウムおよび酢酸カルシウムから選ばれる少なくとも1種が好ましく、酢酸ナトリウム、酢酸カリウムおよび酢酸カルシウムから選ばれる少なくとも1種がより好ましく、酢酸ナトリウムがさらに好ましい。
これらの重合速度調整剤は、1種のみ、または、2種以上を組み合わせて用いることができる。
重合速度調整剤の添加量は、原料ジアミンとジカルボン酸の合計量の0.001~0.5質量%であることが好ましい。
本実施形態のポリアミド樹脂は、本実施形態のポリアミド樹脂を含む組成物(以下、「本実施形態の樹脂組成物」ということがある)、さらには、前記組成物を成形してなる成形品として用いることができる。前記組成物は、本実施形態のポリアミド樹脂を1種または2種以上のみ含んでいてもよいし、他の成分を含んでいてもよい。
他の成分としては、本実施形態のポリアミド樹脂以外の他のポリアミド樹脂、ポリアミド樹脂以外の熱可塑性樹脂、充填剤、艶消剤、耐熱安定剤、耐候安定剤、紫外線吸収剤、可塑剤、難燃剤、帯電防止剤、着色防止剤、ゲル化防止剤等の添加剤を必要に応じて添加することができる。これらの添加剤は、それぞれ、1種であってもよいし、2種以上であってもよい。
他の成分としては、本実施形態のポリアミド樹脂以外の他のポリアミド樹脂、ポリアミド樹脂以外の熱可塑性樹脂、強化材(充填剤)、耐熱安定剤および耐候安定剤等の酸化防止剤(特に耐熱安定剤)、難燃剤、難燃助剤、離型剤、滴下防止剤、艶消剤、紫外線吸収剤、可塑剤、帯電防止剤、着色防止剤、ゲル化防止剤等の添加剤を必要に応じて添加することができる。これらの添加剤は、それぞれ、1種であってもよいし、2種以上であってもよい。
本実施形態の樹脂組成物が含みうる他のポリアミド樹脂は、脂肪族ポリアミド樹脂であっても、半芳香族ポリアミド樹脂であってもよい。
脂肪族ポリアミド樹脂としては、ポリアミド6、ポリアミド66、ポリアミド46、ポリアミド6/66(ポリアミド6成分およびポリアミド66成分からなる共重合体)、ポリアミド610、ポリアミド612、ポリアミド410、ポリアミド1010、ポリアミド11、ポリアミド12、ポリアミド9C(1,9-ノナンジアミンと2-メチル-1,8-オクタンジアミンからなる混合ジアミンと1,4-シクロヘキサンジカルボン酸からなるポリアミド)が例示される。
半芳香族ポリアミド樹脂としては、ポリアミド4T、ポリアミド6T、ポリアミド6I、ポリアミド6T/6I、ポリアミド9T、ポリアミド10T、ポリアミド9N(1,9-ノナンジアミンと2-メチル-1,8-オクタンジアミンからなる混合ジアミンと2,6-ナフタレンジカルボン酸からなるポリアミド)などが例示される。
また、半芳香族ポリアミド樹脂としては、ジアミン由来の構成単位とジカルボン酸由来の構成単位から構成され、ジアミン由来の構成単位の70モル%以上がメタキシリレンジアミンおよびパラキシリレンジアミンの少なくとも一方に由来し、ジカルボン酸由来の構成単位の70モル%以上が、炭素数4~20のα,ω-直鎖脂肪族ジカルボン酸に由来するキシリレンジアミン系ポリアミド樹脂が例示される。具体的には、メタキシリレンジアミンとアジピン酸の重縮合物であるMXD6、メタキシリレンジアミンとアジピン酸とイソフタル酸の重縮合物であるMXD6I、メタキシリレンジアミンとパラキシリレンジアミンとアジピン酸の重縮合物であるMP6、メタキシリレンジアミンとセバシン酸の重縮合物であるMXD10、メタキシリレンジアミンとパラキシリレンジアミンとセバシン酸の重縮合物であるMP10、パラキシリレンジアミンとセバシン酸の重縮合物であるPXD10などが例示される。
さらに、半芳香族ポリアミド樹脂としては、1,9-ノナンジアミン、2-メチル-1,8-オクタンジアミン、および、1,10-デカンジアミンのうち少なくとも1種とテレフタル酸および/またはナフタレンジカルボン酸の重縮合物であるポリアミド樹脂も例示される。特に、1,9-ノナンジアミンと2-メチル-1,8-オクタンジアミンとナフタレンジカルボン酸の重縮合物であるポリアミド樹脂が好ましい。
ポリアミド樹脂以外の熱可塑性樹脂としては、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート、ポリブチレンナフタレート等のポリエステル樹脂を例示できる。これらのポリアミド樹脂以外の熱可塑性樹脂は、それぞれ、1種であってもよいし、2種以上であってもよい。
本実施形態の樹脂組成物はさらに、酸化防止剤を含んでいてもよい。酸化防止剤を含むことにより、耐熱性に優れた成形品が得られる。
酸化防止剤としては、有機酸化防止剤を含む態様が例示され、より具体的には一次酸化防止剤と二次酸化防止剤を含む態様が例示される。また、酸化防止剤としては、無機酸化防止剤を含む態様が例示される。さらに、有機酸化防止剤と無機酸化防止剤の両方を含んでいてもよい。
二次酸化防止剤は、いわゆる過酸化物分解剤として働くものであり、例えば、発生したヒドロペルオキシドを分解し、安定なアルコール化合物へと変化させる役割を果たす。二次酸化防止剤としては、リン系酸化防止剤、硫黄系酸化防止剤が例示される。
上記一次酸化防止剤と二次酸化防止剤を併用することにより、酸化防止機能が連鎖して作用することになり、より効果的に酸化防止効果を発現させることができる。特に、フェノール系酸化防止剤(好ましくはヒンダードフェノール系酸化防止剤)とリン系酸化防止剤を併用することが好ましい。一次酸化防止剤と二次酸化防止剤を併用するとき、その比率は、1:0.1~1:10(質量比)の混合物であることが好ましく、1:0.5~1:2の混合物であることがさらに好ましい。
また、本実施形態では、アミド結合を有するヒンダードフェノール系酸化防止剤が好ましく、アミド結合を有するヒンダード型ヒンダードフェノール系酸化防止剤がより好ましく、2~6つのアミド結合と、2~6つのヒンダード型ヒンダードフェノール構造を有するヒンダードフェノール系酸化防止剤がより好ましく、2~6つのジ-tert-ブチル-4ヒドロキシフェニルアルキルカルボニルアミド基を有するヒンダードフェノール系酸化防止剤(アルキル鎖部分の炭素数は1~5が好ましく、2~4がより好ましい)がさらに好ましく、N、N’-ヘキサン-1,6ジイルビス[3-(3,5-ジ-tert-ブチル-4ヒドロキシフェニルプロピオンアミド]であることが特に好ましい。
ヒンダード型のヒンダードフェノール系酸化防止剤の市販品としては、BASFから、Irganoxシリーズとして販売されている酸化防止剤やADEKAからアデカスタブシリーズ(例えば、AO-20、AO-50、AO-50F、AO-60、AO-60G、AO-330)として販売されている酸化防止剤が好ましく、Irganox1098が好ましい。
本実施形態では特に、芳香環を含むアミン系酸化防止剤が好ましく、ベンゼン環を2つ以上(好ましくは2~5つ)含むアミン系酸化防止剤がより好ましい。
下記式(A)で表されるアミン系酸化防止剤および式(B)で表されるアミン系酸化防止剤が好ましい。
式(A)
RA1およびRA2は、アルキル基またはアリール基であることが好ましく、RA1およびRA2の少なくとも一方がアリール基であることがより好ましい。アルキル基およびアリール基は、置換基を有していてもよい。アリール基はフェニル基およびナフチル基が例示される。
式(B)
RB1およびRB2は、芳香環を2つ以上含む炭化水素基であることが好ましく、芳香環を2つ含む炭化水素基であることがより好ましく、ベンゼン環を2つ含む炭化水素基であることがさらに好ましく、2つのベンゼン環が炭素数1~4のアルキレン基で連結した炭化水素基であることが一層好ましい。
式(A)で表されるアミン系酸化防止剤および式(B)で表されるアミン系酸化防止剤は、分子量が200~1200であることが好ましく、300~600であることがより好ましい。
式(A)で表される酸化防止剤は、活性部位であるアミンが2ヶ所あり、本実施形態の効果が効果的に発揮されると考えられる。さらに、本実施形態の趣旨を逸脱しない範囲で、他の化合物が共重合されていてもよい。
リン系酸化防止剤は、具体的には、例えばリン酸一ナトリウム、リン酸二ナトリウム、リン酸三ナトリウム、亜リン酸ナトリウム、亜リン酸カルシウム、亜リン酸マグネシウム、亜リン酸マンガン、ペンタエリスリトール型ホスファイト化合物、トリオクチルホスファイト、トリラウリルホスファイト、オクチルジフェニルホスファイト、トリスイソデシルホスファイト、フェニルジイソデシルホスファイト、フェニルジ(トリデシル)ホスファイト、ジフェニルイソオクチルホスファイト、ジフェニルイソデシルホスファイト、ジフェニル(トリデシル)ホスファイト、トリフェニルホスファイト、トリオクタデシルホスファイト、トリデシルホスファイト、トリ(ノニルフェニル)ホスファイト、トリス(2,4-ジ-tert-ブチルフェニル)ホスファイト、トリス(2,4-ジ-tert-ブチル-5-メチルフェニル)ホスファイト、トリス(ブトキシエチル)ホスファイト、4,4’-ブチリデン-ビス(3-メチル-6-tert-ブチルフェニル-テトラトリデシル)ジホスファイト、テトラ(C12~C15混合アルキル)-4,4’-イソプロピリデンジフェニルジホスファイト、4,4’-イソプロピリデンビス(2-tert-ブチルフェニル)・ジ(ノニルフェニル)ホスファイト、トリス(ビフェニル)ホスファイト、テトラ(トリデシル)-1,1,3-トリス(2-メチル-5-tert-ブチル-4-ヒドロキシフェニル)ブタンジホスファイト、テトラ(トリデシル)-4,4’-ブチリデンビス(3-メチル-6-tert-ブチルフェニル)ジホスファイト、テトラ(C1~C15混合アルキル)-4,4’-イソプロピリデンジフェニルジホスファイト、トリス(モノ、ジ混合ノニルフェニル)ホスファイト、4,4’-イソプロピリデンビス(2-tert-ブチルフェニル)・ジ(ノニルフェニル)ホスファイト、9,10-ジヒドロ-9-オキサ-10-ホスファフェナンスレン-10-オキサイド、トリス(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)ホスファイト、水素化-4,4’-イソプロピリデンジフェニルポリホスファイト、ビス(オクチルフェニル)・ビス(4,4’-ブチリデンビス(3-メチル-6-tert-ブチルフェニル))・1,6-ヘキサノールジホスファイト、ヘキサトリデシル-1,1,3-トリス(2-メチル-4-ヒドロキシ-5-tert-ブチルフェニル)ジホスファイト、トリス(4,4’-イソプロピリデンビス(2-tert-ブチルフェニル))ホスファイト、トリス(1,3-ステアロイルオキシイソプロピル)ホスファイト、2,2-メチレンビス(4,6-ジ-tert-ブチルフェニル)オクチルホスファイト、2,2-メチレンビス(3-メチル-4,6-ジ-tert-ブチルフェニル)-2-エチルヘキシルホスファイト、テトラキス(2,4-ジ-tert-ブチル-5-メチルフェニル)-4,4’-ビフェニレンジホスファイト、テトラキス(2,4-ジ-tert-ブチルフェニル)-4,4’-ビフェニレンジホスファイト、6-[3-(3-tert-ブチル-4-ヒドロキシ-5-メチルフェニル)プロポキシ]-2,4,8,10-テトラ-tert-ブチルジベンゾ[d,f][1,3,2]-ジオキサホスフェピンなどが挙げられる。
式(P)
RP1およびRP2は、アリール基であることが好ましく、フェニル基であることがより好ましい。アリール基は、置換基を有していてもよい。置換基としては、炭化水素基が例示され、アルキル基が好ましい。前記置換基はさらに、炭化水素基等の置換基を有していてもよい。
式(P)で表される化合物は、分子量が400~1200であることが好ましく、500~800であることがより好ましい。
本実施形態で用いられる銅化合物としては、ハロゲン化銅(例えば、ヨウ化銅、臭化銅、塩化銅)および酢酸銅が例示され、ヨウ化第一銅、ヨウ化第二銅、臭化第一銅、臭化第二銅、酢酸第一銅および酢酸第二銅、塩化第一銅、塩化第二銅の中から好ましく選択され、ヨウ化銅、酢酸銅および塩化第一銅から選択されることがより好ましい。
銅化合物と、ハロゲン化アルカリを組み合わせる場合については、特表2013-513681号公報の段落0046~0048の記載も参酌でき、これらの内容は本願明細書に組み込まれる。
本実施形態の樹脂組成物は、酸化防止剤を1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。
本実施形態の樹脂組成物は、難燃剤を含んでいてもよい。難燃剤を含むことにより、難燃性を向上させることができる。
難燃剤としては、リン系難燃剤、ハロゲン系難燃剤、有機金属塩系難燃剤が例示され、リン系難燃剤およびハロゲン系難燃剤が好ましく、リン系難燃剤がより好ましい。
式(FP1)
また、市販の縮合リン酸エステルとしては、例えば、大八化学工業(株)より「CR733S」(レゾルシノールビス(ジフェニルホスフェート))、「CR741」(ビスフェノールAビス(ジフェニルホスフェート))、「PX-200」(レゾルシノールビス(ジキシレニルホスフェート))、旭電化工業(株)より「アデカスタブFP-700」(2,2-ビス(p-ヒドロキシフェニル)プロパン・トリクロロホスフィンオキシド重縮合物(重合度1~3)のフェノール縮合物)といった商品名で販売されており、容易に入手可能である。
Rf9は、-N=P(ORf7)3基、-N=P(ORf8)3基、-N=P(O)ORf7基、-N=P(O)ORf8基から選ばれる少なくとも1種を表し、Rf10は、-P(ORf7)4基、-P(ORf8)4基、-P(O)(ORf7)2基、-P(O)(ORf8)2基から選ばれる少なくとも1種を示す。
また、架橋フェノキシホスファゼン化合物中のフェニレン基の含有量は、式(FP2)で表される環状ホスファゼン化合物および/または式(FP3)で表される鎖状フェノキシホスファゼン化合物中の全フェニル基およびフェニレン基数を基準として、通常50~99.9%、好ましくは70~90%である。また、前記架橋フェノキシホスファゼン化合物は、その分子内にフリーの水酸基を有しない化合物であることが特に好ましい。
ホスファゼン化合物の市販品としては、FP-110、伏見製薬社製が例示される。
臭素系難燃剤としては、ヘキサブロモシクロドデカン、デカブロモジフェニルオキサイド、オクタブロモジフェニルオキサイド、テトラブロモビスフェノールA、ビス(トリブロモフェノキシ)エタン、ビス(ペンタブロモフェノキシ)エタン、テトラブロモビスフェノールAエポキシ樹脂、テトラブロモビスフェノールAカーボネート、エチレン(ビステトラブロモフタル)イミド、エチレンビスペンタブロモジフェニル、トリス(トリブロモフェノキシ)トリアジン、ビス(ジブロモプロピル)テトラブロモビスフェノールA、ビス(ジブロモプロピル)テトラブロモビスフェノールS、臭素化ポリフェニレンエーテル(ポリ(ジ)ブロモフェニレンエーテルなどを含む)、臭素化ポリスチレン(ポリジブロモスチレン、ポリトリブロモスチレン、架橋臭素化ポリスチレン、臭素化ポリカーボネート等が例示される。
本実施形態の樹脂組成物は、難燃剤を1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。
本実施形態の樹脂組成物は、また、難燃助剤を配合してもよい。
難燃助剤としては、アンチモン系化合物、錫酸亜鉛、酸化銅、酸化マグネシウム、酸化亜鉛、酸化モリブデン、酸化ジルコニウム、酸化錫、酸化鉄、酸化チタン、酸化アルミニウム、硼酸亜鉛等が挙げられ、アンチモン系化合物、錫酸亜鉛が好ましい。特に、リン系難燃剤を用いる場合は錫酸亜鉛が、ハロゲン系難燃剤を用いる場合はアンチモン系化合物が好ましい。
アンチモン系化合物は、アンチモンを含む化合物であって、難燃性に寄与する化合物である。具体的には、三酸化アンチモン(Sb2O3)、四酸化アンチモン、五酸化アンチモン(Sb2O5)等の酸化アンチモン、アンチモン酸ナトリウム、燐酸アンチモンなどが挙げられる。中でも酸化アンチモンが耐湿熱性に優れるため好ましい。さらに好ましくは三酸化アンチモンが用いられる。
本実施形態の樹脂組成物は、難燃助剤を1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。
本実施形態の樹脂組成物は、強化材を含んでいてもよく、強化材を樹脂組成物中、5.0~60.0質量%の割合で含むことが好ましい。
本実施形態で用いることができる強化材は、その種類等、特に定めるものではなく、繊維、フィラー、フレーク、ビーズ等のいずれであってもよいが、繊維が好ましい。
強化材が短繊維やフィラー、ビーズ等の場合、本実施形態の樹脂組成物は、ペレット、前記ペレットを粉末化したもの、および前記ペレットから成形されるフィルム等が例示される。
強化材が長繊維の場合、強化材は、いわゆる、UD材(Uni-Directional)用の長繊維、織物および編み物等のシート状の長繊維などが例示される。これらの長繊維を用いる場合、本実施形態の樹脂組成物の強化材以外の成分を、前記シート状の長繊維である強化材に含浸させて、シート状の樹脂組成物(例えば、プリプレグ)とすることができる。
ガラス繊維は、Aガラス、Cガラス、Eガラス、Rガラス、Dガラス、Mガラス、Sガラスなどのガラス組成から選択され、特に、Eガラス(無アルカリガラス)が好ましい。
ガラス繊維は、長さ方向に直角に切断した断面形状が真円状または多角形状の繊維状の材料をいう。ガラス繊維は、単繊維の数平均繊維径が通常1~25μm、好ましくは5~17μmである。数平均繊維径を1μm以上とすることにより、樹脂組成物の成形加工性がより向上する傾向にある。数平均繊維径を25μm以下とすることにより、得られる成形体の外観が向上し、補強効果も向上する傾向にある。ガラス繊維は、単繊維または単繊維を複数本撚り合わせたものであってもよい。
ガラス繊維の形態は、単繊維や複数本撚り合わせたものを連続的に巻き取ったガラスロービング、長さ1~10mmに切りそろえたチョップドストランド(すなわち、数平均繊維長1~10mmのガラス繊維)、長さ10~500μm程度に粉砕したミルドファイバー(すなわち、数平均繊維長10~500μmのガラス繊維)などのいずれであってもよいが、長さ1~10mmに切りそろえたチョップドストランドが好ましい。ガラス繊維は、形態が異なるものを併用することもできる。
また、ガラス繊維としては、異形断面形状を有するものも好ましい。この異形断面形状とは、繊維の長さ方向に直角な断面の長径/短径比で示される扁平率が、例えば、1.5~10であり、中でも2.5~10、さらには2.5~8、特に2.5~5であることが好ましい。
金属としては、銅、ニッケル、銀、ステンレスからなるものが例示され、金属フィラーやステンレス繊維、磁性フィラーが好ましい。金属酸化物としては、アルミナ、酸化亜鉛が例示され、アルミナ繊維、酸化亜鉛ナノチューブが好ましい。導電性炭素化合物としては、カーボンブラック、ケッチェンカーボン、グラフェン、黒鉛、フラーレン、カーボンナノコイル、カーボンナノチューブ、カーボンファイバーが好ましく、カーボンナノチューブがより好ましい。
また、金属や金属酸化物、導電性炭素化合物で被覆された繊維なども好ましい。例えば、カーボンでコートされたチタン酸カリウムウィスカー、金属被覆繊維などが例示される。
その他、強化材としては、特開2021-031633号公報の段落0033~0041の記載を参酌でき、この内容は本明細書に組み込まれる。
本実施形態の樹脂組成物は強化材(好ましくはガラス繊維)を1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。
本実施形態の樹脂組成物は、核剤を含んでいてもよい。核剤を含むことにより、結晶化速度を速くすることができる。
無機核剤としては、グラファイト、二硫化モリブデン、硫酸バリウム、タルク、炭酸カルシウム、燐酸ソーダ、マイカおよびカオリンが例示され、タルクおよび炭酸カルシウムから選択される少なくとも1種であることがより好ましく、タルクがさらに好ましい。
有機核剤としては、特に限定されるものではなく、公知の核剤を使用できるが、例えば核剤はジベンジリデンソルビトール系核剤、ノニトール系核剤、リン酸エステル塩系核剤、ロジン系核剤、安息香酸金属塩系核剤等から選択される少なくとも1種であることが好ましい。
核剤の数平均粒子径は、下限値が、0.1μm以上であることが好ましい。核剤の数平均粒子径は、上限値が、40μm以下であることが好ましく、30μm以下であることがより好ましく、28μm以下であることが一層好ましく、15μm以下であることがより一層好ましく、10μm以下であることがさらに一層好ましい。数平均粒子径を40μm以下とすることにより、核剤の配合量に比して、核となる核剤の数が多くなるため、結晶構造がより安定化する傾向にある。
本実施形態の樹脂組成物が核剤を含む場合、核剤を1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。
本実施形態の樹脂組成物は、離型剤を含んでいてもよい。
離型剤としては、例えば、脂肪族カルボン酸、脂肪族カルボン酸の塩、脂肪族カルボン酸とアルコールとのエステル、数平均分子量200~15,000の脂肪族炭化水素化合物、ポリシロキサン系シリコーンオイル、ケトンワックス、ライトアマイドなどが挙げられ、脂肪族カルボン酸、脂肪族カルボン酸の塩、脂肪族カルボン酸とアルコールとのエステルが好ましく、脂肪族カルボン酸の塩がより好ましい。
離型剤の詳細は、特開2018-095706号公報の段落0055~0061の記載を参酌でき、これらの内容は本明細書に組み込まれる。
本実施形態の樹脂組成物が離型剤を含む場合、その含有量は、樹脂組成物中、0.05~3質量%であることが好ましく、0.1~0.8質量%であることがより好ましく、0.2~0.6質量%であることがさらに好ましい。
本実施形態の樹脂組成物は、離型剤を、1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。
本実施形態の樹脂組成物の製造方法は、特に定めるものではなく、公知の熱可塑性樹脂組成物の製造方法を広く採用できる。具体的には、各成分を、タンブラーやヘンシェルミキサーなどの各種混合機を用い予め混合した後、バンバリーミキサー、ロール、ブラベンダー、単軸押出機、二軸押出機、ニーダーなどで溶融混練することによって樹脂組成物を製造することができる。
本実施形態のポリアミド樹脂または本実施形態の樹脂組成物から、成形品が形成される。
成形品を成形する方法としては、特に制限されず、従来公知の成形法を採用でき、例えば、射出成形法、射出圧縮成形法、押出成形法、異形押出法、トランスファー成形法、中空成形法、ガスアシスト中空成形法、ブロー成形法、押出ブロー成形、IMC(インモールドコーティング成形)成形法、回転成形法、多層成形法、2色成形法、インサート成形法、サンドイッチ成形法、発泡成形法、加圧成形法、延伸、真空成形等が挙げられる。
本実施形態の組成物から形成される成形品としては、射出成形品、薄肉成形品、中空成形品、フィルム(板状、シートを含む)、円筒状(ホース、チューブ等)、環状、円形状、楕円形状、歯車状、多角形形状、異形品、中空品、枠状、箱状、パネル状押出成形品、繊維等が例示される。
本実施形態のポリアミド樹脂またはポリアミド樹脂組成物を上述の強化材(特に強化繊維、好ましくは炭素繊維またはガラス繊維)に含浸させたプリプレグ;繊維成分として、本実施形態のポリアミド樹脂またはポリアミド樹脂組成物を含む連続熱可塑性樹脂繊維と連続強化繊維を含む混繊糸、組み紐または撚り紐;本実施形態のポリアミド樹脂またはポリアミド樹脂組成物を含む連続熱可塑性樹脂繊維と連続強化繊維を用いた織物または編み物;ならびに、本実施形態のポリアミド樹脂またはポリアミド樹脂組成物を含む熱可塑性樹脂繊維と強化繊維から構成される不織布などが例示される。
実施例で用いた測定機器等が廃番等により入手困難な場合、他の同等の性能を有する機器を用いて測定することができる。
p-BDEA:p-ベンゼンジエタンアミン、下記合成例に従って合成した。
<<p-BDEAの合成例>>
p-キシリレンジシアニド(製造元:東京化成工業)を水素雰囲気下で還元し、得られた生成物を蒸留精製することで、p-ベンゼンジエタンアミンを得た。ガスクロマトグラフィーを用いて分析した結果、純度は99.7%であった。
セバシン酸:製造元:東京化成工業
ドデカン二酸:製造元:東京化成工業
次亜リン酸カルシウム:製造元:富士フイルム和光純薬
酢酸ナトリウム:製造元:富士フイルム和光純薬
<<ポリアミド樹脂の合成>>
平底試験管にp-BDEA 0.00204mol(0.3351g)、p-BDEA-4Me 0.00136mol(0.2997g)、イソフタル酸0.00340mol(0.5648g)、次亜リン酸カルシウム0.3mg(ポリアミド樹脂中のリン濃度として0.01質量%)、酢酸ナトリウム0.2mgを加え、純水7.0gを加え、その試験管を温度計、圧力計および圧力調整弁を備えた容積20mLの反応缶に仕込んだ。続いて十分に窒素置換し、反応缶内を常圧に戻したのち、圧力調整弁を閉じた。反応缶をアルミブロックヒーターで加熱し、反応缶の内圧を1.9MPa、210℃で20分間保持し、続いて2.8MPa、230℃で40分間保持した。続いて、260℃まで昇温しながら、圧力調整弁を微開し、30分かけて圧力を常圧まで下げながら圧力調整弁から水を抜いた。その後、圧力調整弁から適宜水分を抜きながら、反応缶を300℃まで昇温し、10分間保持した。反応缶を室温まで冷却したのち、試験管を取り出し、ポリアミド樹脂を得た。
以下の方法に従って測定したポリアミド樹脂の結晶融解エンタルピーΔHmは、1J/g以下であった。
ガラス転移温度は、示差走査熱量計(DSC)を用いて、窒素気流中、室温から250℃まで昇温速度10℃/分で加熱したのち、ただちに室温以下まで冷却し、再び室温から250℃まで昇温速度10℃/分で加熱した際のガラス転移温度(単位:℃)を測定した。
本実施例では、示差走査熱量計として、(株)島津製作所社製のDSC-60を用いた。
また、ポリアミド樹脂の結晶融解エンタルピーΔHmは、JIS K7121およびK7122に準じて、昇温過程における値を測定した。
吸水率は、上記で得られたポリアミド樹脂0.2gを85℃、相対湿度85%の環境で20日間保存したのち、水分率を測定することで求めた。
本実施例では、水分率(単位:質量%)は、JIS K 0068に従って、235℃で20分間の測定を行って求めた。
測定に際し、日東精工アナリテック(株)製のCA-310/VA-236Sを用いた。
吸水後の変形は、上記で得られたポリアミド樹脂0.5gを平底試験管に加えて、窒素雰囲気下で、300℃で10分間加熱して、室温まで冷却したのちに取り出すことで板状に成形し、得られた成形品を85℃、相対湿度85%の環境で20日間保存したのち、形状を目視で確認した。目視で変形を認められたものは変形あり、変形を認められなかったものは変形なしとした。なお、変形したものは、保存前と比較して、丸みを帯びた形状に変形した。
実施例1において、ジアミンおよびジカルボン酸の種類および/または量を表1に示すように変更し、他は同様に行った。
Claims (10)
- 前記芳香族ジカルボン酸由来の構成単位の30モル%超が、イソフタル酸、テレフタル酸、および、フェニレン二酢酸から選択される芳香族ジカルボン酸由来の構成単位である、請求項1に記載のポリアミド樹脂。
- 前記芳香族ジカルボン酸由来の構成単位の30モル%超が、イソフタル酸由来の構成単位である、請求項1に記載のポリアミド樹脂。
- 前記ジカルボン酸由来の構成単位の55モル%以上が芳香族ジカルボン酸由来の構成単位である、請求項1~3のいずれか1項に記載のポリアミド樹脂。
- 前記ジカルボン酸由来の構成単位の90モル%以上が芳香族ジカルボン酸由来の構成単位である、請求項1~3のいずれか1項に記載のポリアミド樹脂。
- 前記ジアミン由来の構成単位の30モル%超100モル%以下が、前記の式で表されるジアミンに由来し、70モル%~0モル%がp-ベンゼンジエタンアミンに由来する、請求項1~5のいずれか1項に記載のポリアミド樹脂。
- 前記の式中、R1~R8は、それぞれ独立に、水素原子またはメチル基を表す、請求項1~6のいずれか1項に記載のポリアミド樹脂。
- 前記の式中、R1、R2、R7およびR8は、水素原子であり、R3、R4、R5およびR6は、メチル基である、請求項1~6のいずれか1項に記載のポリアミド樹脂。
- 前記ポリアミド樹脂の示差走査熱量測定に従ったガラス転移温度が90℃以上である、請求項1~8のいずれか1項に記載のポリアミド樹脂。
- 前記ポリアミド樹脂は非晶性ポリアミド樹脂である、請求項1~9のいずれか1項に記載のポリアミド樹脂。
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