WO2021117324A1

WO2021117324A1 - Processing unit and substrate processing device

Info

Publication number: WO2021117324A1
Application number: PCT/JP2020/038243
Authority: WO
Inventors: 吉田　篤史; 誠柏木; 遊石井
Original assignee: 株式会社荏原製作所
Priority date: 2019-12-10
Filing date: 2020-10-09
Publication date: 2021-06-17
Also published as: JP2021091039A; TW202124098A

Abstract

The present invention suppresses an increase in the footprint of a substrate processing device and improves the processing efficiency of a processing unit of the substrate processing device.　A dressing unit used for the substrate processing device includes: a dresser shaft (51) disposed so as to oppose a polishing pad (352) for polishing a substrate; a plurality of dressers (50-1, 50-2) for holding a plurality of dressing members (50-1a, 50-2a) which are arranged concentrically via arms (410) about the axis of the dresser shaft (51); an air cylinder for driving the plurality of dressers (50-1, 50-2) in a direction approaching or going away from the polishing pad (352); and a folding mechanism (450) configured to be capable of adjusting the angle of the arms (410) such that the plurality of dressers (50-1, 50-2) approach each other.

Description

Processing unit and substrate processing equipment

This application relates to a processing unit and a substrate processing apparatus. The present application claims priority based on Japanese Patent Application No. 2019-222928 filed on December 10, 2019. All disclosures, including the specification, claims, drawings and abstracts of Japanese Patent Application No. 2019-222928, are incorporated herein by reference in their entirety.

Chemical mechanical polishing (CMP) equipment is used to flatten the surface of substrates in the manufacture of semiconductor devices. Substrates used in the manufacture of semiconductor devices are often disk-shaped. In addition to semiconductor devices, there is an increasing demand for flatness when flattening the surface of square substrates such as CCL substrates (Copper Clad Laminate substrates), PCBs (Printed Circuit Board) substrates, photomask substrates, and display panels. ing. Further, there is an increasing demand for flattening the surface of a package substrate on which an electronic device such as a PCB substrate is arranged.

Substrate processing equipment such as chemical mechanical polishing equipment includes various processing units, and one of them includes a dresser for dressing (sharpening) the surface of a polishing pad for polishing a substrate. The dresser includes a holder to which a dressing member electrodeposited with diamond particles or the like is attached, a rotating shaft that holds the holder, a motor that rotates the rotating shaft, and an elevating mechanism that moves the holder up and down. The dresser is configured to dress the surface of the polishing pad by pressing the dressing member against the polishing pad by an elevating mechanism and rotating the rotating shaft.

Japanese Unexamined Patent Publication No. 2008-110471

While the size of the polishing pad is increasing along with the increase in size of the substrate in recent years, there is a concern that the dressing will be insufficient if the polishing pad is dressed using a dresser of a conventional size. On the other hand, it is conceivable to increase the dressing time in order to prevent the dressing shortage, but this is not preferable from the viewpoint of processing efficiency.

In this respect, dressing can be performed efficiently and sufficiently by increasing the diameter of the dresser, but it is not preferable because increasing the diameter of the dresser may increase the footprint of the substrate processing apparatus.

Such a problem is not only a dresser, but also a processing unit including a cleaning tool for cleaning the surface of the substrate arranged face-up, or a processing unit for polishing the substrate face-down with respect to the polishing pad. Can occur in the same way.

Therefore, one of the purposes of the present application is to suppress an increase in the footprint of the substrate processing apparatus and to improve the processing efficiency of the processing unit of the substrate processing apparatus.

According to one embodiment, a processing unit used in a substrate processing apparatus, a rotating shaft arranged to face a substrate or a polishing pad for polishing the substrate, and an arm around the axis of the rotating shaft. A plurality of holders for holding a plurality of processing tools or a plurality of processing objects arranged concentrically with each other, and a drive for driving the plurality of holders closer to or further from the substrate or the polishing pad. A processing unit including a unit and a folding mechanism configured to adjust the angle of the arm so that the plurality of holders come close to each other is disclosed.

It is a top view which shows the whole structure of the substrate processing apparatus by one Embodiment. It is a perspective view which shows typically the structure of the polishing unit by one Embodiment. It is a vertical sectional view which shows the structure of the dressing unit according to one Embodiment schematicly. It is a top view which shows roughly the structure of the dresser and the folding mechanism by one Embodiment. It is a vertical cross-sectional view which shows roughly the structure of the dresser and the folding mechanism by one Embodiment, and shows the state which the dresser is opened. It is a vertical cross-sectional view which shows roughly the structure of the dresser and the folding mechanism by one Embodiment, and shows the state which the dresser is folded. It is a top view which shows the state which dressing is performed using the dressing unit by one Embodiment. It is a top view which shows roughly the structure of the dresser and the folding mechanism by one Embodiment. It is a vertical cross-sectional view which shows roughly the structure of the dresser and the folding mechanism by one Embodiment, and shows the state which the dresser is opened. It is a vertical cross-sectional view which shows roughly the structure of the dresser and the folding mechanism by one Embodiment, and shows the state which the dresser is folded. It is a perspective view which shows typically the structure of the cleaning tool and the folding mechanism by one Embodiment. It is a top view which shows roughly the structure of the cleaning tool and the folding mechanism by one Embodiment.

Hereinafter, an embodiment of a substrate processing apparatus including a dressing unit as an example of the processing unit according to the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, the same or similar elements are designated by the same or similar reference numerals, and duplicate description of the same or similar elements may be omitted in the description of each embodiment. In addition, the features shown in each embodiment can be applied to other embodiments as long as they do not contradict each other.

FIG. 1 is a plan view showing the overall configuration of the substrate processing apparatus 1000 according to one embodiment. The substrate processing apparatus 1000 shown in FIG. 1 includes a load unit 100, a transfer unit 200, a polishing unit 300, a drying unit 500, and an unload unit 600. In the illustrated embodiment, the transport unit 200 has two

transport units

200A, 200B, and the polishing unit 300 has two

polishing units

300A, 300B. In one embodiment, each of these units can be formed independently. By forming these units independently, it is possible to easily form the substrate processing apparatus 1000 having different configurations by arbitrarily combining the number of each unit. Further, the substrate processing device 1000 includes a control device 900, and each component of the substrate processing device 1000 is controlled by the control device 900. In one embodiment, the control device 900 can consist of a general computer including an input / output device, an arithmetic unit, a storage device, and the like.

<Load unit>
The load unit 100 is a unit for introducing the substrate WF before the processing such as polishing and cleaning into the substrate processing apparatus 1000. In one embodiment, the load unit 100 is configured to comply with the SMEMA (Surface Mount Equipment Manufacturers Association) mechanical device interface standard (IPC-SMEMA-9851).

In the illustrated embodiment, the transport mechanism of the load unit 100 has a plurality of transport rollers 202 and a plurality of roller shafts 204 to which the transport rollers 202 are attached. In the embodiment shown in FIG. 1, three transfer rollers 202 are attached to each roller shaft 204. The substrate WF is arranged on the transfer roller 202, and the substrate WF is conveyed by rotating the transfer roller 202. The mounting position of the transport roller 202 on the roller shaft 204 can be arbitrary as long as the substrate WF can be stably transported. However, since the transfer roller 202 comes into contact with the substrate WF, it should be arranged so that the transfer roller 202 comes into contact with a region where there is no problem even if it comes into contact with the substrate WF to be processed. In one embodiment, the transport roller 202 of the load unit 100 can be made of a conductive polymer. In one embodiment, the transport roller 202 is electrically grounded via a roller shaft 204 or the like. This is to prevent the substrate WF from being charged and damaging the electronic devices and the like on the substrate WF. Further, in one embodiment, the load unit 100 may be provided with an ionizer (not shown) in order to prevent the substrate WF from being charged.

<Transport unit>
The substrate processing apparatus 1000 shown in FIG. 1 includes two

transfer units

200A and 200B. Since the two

transport units

200A and 200B can have the same configuration, they will be collectively referred to as the transport unit 200 below.

The illustrated transport unit 200 includes a plurality of transport rollers 202 for transporting the substrate WF. By rotating the transport roller 202, the substrate WF on the transport roller 202 can be transported in a predetermined direction. The transport roller 202 of the transport unit 200 may be formed of a conductive polymer or a non-conductive polymer. The transport roller 202 is driven by a motor (not shown). The substrate WF is conveyed to the substrate delivery position by the transfer roller 202.

In one embodiment, the transport unit 200 has a cleaning nozzle 284. The cleaning nozzle 284 is connected to a source of cleaning liquid (not shown). The cleaning nozzle 284 is configured to supply the cleaning liquid to the substrate WF conveyed by the transfer roller 202.

<Polishing unit>
FIG. 2 is a perspective view schematically showing the configuration of the polishing unit 300 according to the embodiment. The substrate processing apparatus 1000 shown in FIG. 1 includes two polishing

units

300A and 300B. Since the two polishing

units

300A and 300B can have the same configuration, they will be collectively referred to as the polishing unit 300 below.

As shown in FIG. 2, the polishing unit 300 includes a polishing table 350 and a top ring 302 constituting a polishing head that holds a substrate to be polished and presses it against a polishing surface on the polishing table 350. .. The polishing table 350 is connected to a polishing table rotation motor (not shown) arranged below the table shaft 351 via a table shaft 351 so that the polishing table 350 can rotate around the table shaft 351. A polishing pad 352 is attached to the upper surface of the polishing table 350, and the surface 352a of the polishing pad 352 constitutes a polishing surface for polishing the substrate. In one embodiment, the polishing pad 352 may be attached via a layer to facilitate peeling from the polishing table 350. Such a layer includes, for example, a silicone layer or a fluorine-based resin layer, and for example, those described in JP-A-2014-176950 may be used.

A polishing liquid supply nozzle 354 is installed above the polishing table 350, and the polishing liquid is supplied onto the polishing pad 352 on the polishing table 350 by the polishing liquid supply nozzle 354. Further, as shown in FIG. 2, the polishing table 350 and the table shaft 351 are provided with a passage 353 for supplying the polishing liquid. The passage 353 communicates with the opening 355 on the surface of the polishing table 350. A through hole 357 is formed in the polishing pad 352 at a position corresponding to the opening 355 of the polishing table 350, and the polishing liquid passing through the passage 353 is polished from the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352. It is supplied to the surface of the pad 352. The opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 may be one or a plurality. Further, the positions of the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 are arbitrary, but in one embodiment, they are arranged near the center of the polishing table 350.

Although not shown in FIG. 2, in one embodiment, the polishing unit 300 includes an atomizer 358 for injecting a liquid or a mixed fluid of a liquid and a gas toward the polishing pad 352 (FIG. 1). reference). The liquid injected from the atomizer 358 is, for example, pure water, and the gas is, for example, nitrogen gas.

The top ring 302 is connected to the top ring shaft 18, and the top ring shaft 18 moves up and down with respect to the swing arm 360 by the vertical movement mechanism 319. By the vertical movement of the top ring shaft 18, the entire top ring 302 is vertically moved and positioned with respect to the swing arm 360. The top ring shaft 18 is rotated by driving a top ring rotation motor (not shown). Due to the rotation of the top ring shaft 18, the top ring 302 rotates about the top ring shaft 18. A rotary joint 323 is attached to the upper end of the top ring shaft 18.

There are various types of polishing pads available on the market. For example, SUBA800 (“SUBA” is a registered trademark), IC-1000, IC-1000 / SUBA400 (double layer cloth) manufactured by Nitta Hearth Co., Ltd., There are Surfin xxx-5, Surfin 000, etc. (“Surfin” is a registered trademark) manufactured by Fujimi Incorporated. SUBA800, Surfinxxx-5, and Surfin 000 are non-woven fabrics in which fibers are hardened with urethane resin, and IC-1000 is a hard polyurethane foam (single layer). Polyurethane foam is porous and has numerous fine dents or pores on its surface.

The top ring 302 can hold a quadrangular substrate on its lower surface. The swing arm 360 is configured to be rotatable around a support shaft 362. The top ring 302 can be moved between the substrate delivery position of the above-mentioned transfer unit 200 and the upper part of the polishing table 350 by turning the swing arm 360. By lowering the top ring shaft 18, the top ring 302 can be lowered to press the substrate against the surface (polished surface) 352a of the polishing pad 352. At this time, the top ring 302 and the polishing table 350 are rotated, respectively, from the polishing liquid supply nozzle 354 provided above the polishing table 350 and / or from the opening 355 provided in the polishing table 350 onto the polishing pad 352. Supply the polishing liquid to. In this way, the surface of the substrate can be polished by pressing the substrate WF against the polishing surface 352a of the polishing pad 352. During polishing of the substrate WF, the arm 360 may be fixed or rocked so that the top ring 302 passes through the center of the polishing pad 352 (covering the through hole 357 of the polishing pad 352).

The vertical movement mechanism 319 that moves the top ring shaft 18 and the top ring 302 up and down includes a bridge 28 that rotatably supports the top ring shaft 18 via a bearing 321 and a ball screw 32 attached to the bridge 28, and a support column 130. A support base 29 supported by the support base 29 and an AC servomotor 38 provided on the support base 29 are provided. The support base 29 that supports the servomotor 38 is fixed to the swing arm 360 via the support column 130.

The ball screw 32 includes a screw shaft 32a connected to the servomotor 38 and a nut 32b into which the screw shaft 32a is screwed. The top ring shaft 18 is adapted to move up and down integrally with the bridge 28. Therefore, when the servomotor 38 is driven, the bridge 28 moves up and down via the ball screw 32, which causes the top ring shaft 18 and the top ring 302 to move up and down. The polishing unit 300 includes a distance measuring sensor 70 as a position detecting unit for detecting the distance to the lower surface of the bridge 28, that is, the position of the bridge 28. By detecting the position of the bridge 28 by the distance measuring sensor 70, the position of the top ring 302 can be detected. The distance measuring sensor 70 constitutes a vertical movement mechanism 319 together with the ball screw 32 and the servomotor 38. The distance measuring sensor 70 may be a laser sensor, an ultrasonic sensor, an overcurrent sensor, or a linear scale sensor. Further, each device in the polishing unit such as the distance measuring sensor 70 and the servomotor 38 is configured to be controlled by the control device 900.

The polishing unit 300 according to the embodiment includes a dressing unit 356 that dresses the polishing surface 352a of the polishing pad 352. The dressing unit 356 will be outlined with reference to FIG. 2, and then detailed with reference to FIGS. 3 to 10. As shown in FIG. 2, the dressing unit 356 moves up and down the dresser (dressing member holder) 50 which is slidably contacted with the polishing surface 352a, the dresser shaft 51 to which the dresser 50 is connected, and the dresser shaft 51. It includes a cylinder 53 and a swing arm 55 that rotatably supports the dresser shaft 51. In FIG. 2, one dresser 50 is illustrated for simplification of the description, but in the present embodiment, a plurality of dressers are included as described later. A dressing member 50a is held in the lower part of the dresser 50, and needle-shaped diamond particles are electrodeposited on the lower surface of the dressing member 50a. The air cylinder 53 is arranged on a support base 57 supported by the columns 56, and these columns 56 are fixed to the swing arm 55.

The swing arm 55 is driven by a motor (not shown) and is configured to rotate around a support shaft 58. The dresser shaft 51 is arranged to face the polishing pad 352 and rotates by driving a motor (not shown in FIG. 2), and the rotation of the dresser shaft 51 causes the dresser 50 to rotate around the dresser shaft 51. .. The air cylinder 53 moves the dresser 50 up and down via the dresser shaft 51, and presses the dresser 50 against the polishing surface 352a of the polishing pad 352 with a predetermined pressing force.

Dressing of the polished surface 352a of the polishing pad 352 is performed as follows. The dresser 50 is pressed against the polished surface 352a by the air cylinder 53, and at the same time, pure water is supplied to the polished surface 352a from a pure water supply nozzle (not shown). In this state, the dresser 50 rotates around the dresser shaft 51, and the lower surface (diamond particles) of the dressing member 50a is brought into sliding contact with the polished surface 352a. In this way, the polishing pad 352 is scraped off by the dresser 50, and the polishing surface 352a is dressed.

In the polishing apparatus of this embodiment, the amount of wear of the polishing pad 352 is measured by using the dresser 50. That is, the dressing unit 356 includes a displacement sensor 60 that measures the displacement of the dresser 50. The displacement sensor 60 constitutes a wear amount detecting means for detecting the wear amount of the polishing pad 352, and is provided on the upper surface of the swing arm 55. A target plate 61 is fixed to the dresser shaft 51, and the target plate 61 moves up and down as the dresser 50 moves up and down. The displacement sensor 60 is arranged so as to insert the target plate 61, and measures the displacement of the dresser 50 by measuring the displacement of the target plate 61. As the displacement sensor 60, any type of sensor such as a linear scale sensor, a laser sensor, an ultrasonic sensor, or an eddy current sensor is used.

In this embodiment, the amount of wear of the polishing pad 352 is measured as follows. First, the air cylinder 53 is driven to bring the dresser 50 into contact with the polishing surface 352a of the initially sharpened polishing pad 352. In this state, the displacement sensor 60 detects the initial position (initial height value) of the dresser 50 and stores the initial position (initial height value) in the control device 900. Then, after the polishing process of one or a plurality of substrates is completed, the dresser 50 is brought into contact with the polishing surface 352a again, and the position of the dresser 50 is measured in this state. Since the position of the dresser 50 is displaced downward according to the amount of wear of the polishing pad 352, the control device 900 obtains the difference between the initial position and the position of the dresser 50 after polishing to obtain the amount of wear of the polishing pad 352. Can be sought. In this way, the amount of wear of the polishing pad 352 is determined based on the position of the dresser 50.

<Drying unit>
The drying unit 500 is a device for drying the substrate WF. In the substrate processing apparatus 1000 shown in FIG. 1, the drying unit 500 dries the substrate WF cleaned by the cleaning unit of the transport unit 200 after being polished by the polishing unit 300. As shown in FIG. 1, the drying unit 500 is arranged downstream of the transport unit 200.

The drying unit 500 has a nozzle 530 for injecting gas toward the substrate WF transported on the transport roller 202. The gas can be, for example, compressed air or nitrogen. The substrate WF can be dried by blowing off the water droplets on the conveyed substrate WF with the drying unit 500.

<Unload unit>
The unload unit 600 is a unit for carrying out the substrate WF after processing such as polishing and cleaning to the outside of the substrate processing apparatus 1000. In the substrate processing apparatus 1000 shown in FIG. 1, the unload unit 600 receives the substrate after being dried by the drying unit 500. As shown in FIG. 1, the unload unit 600 is arranged downstream of the drying unit 500.

In one embodiment, the unload unit 600 is configured to comply with the SMEMA (Surface Mount Equipment Manufacturers Association) mechanical device interface standard (IPC-SMEMA-9851).

<Dressing unit>
Next, the details of the dressing unit 356, which is an example of the processing unit used in the substrate processing apparatus, will be described. FIG. 3 is a vertical cross-sectional view schematically showing the configuration of the dressing unit 356 according to the embodiment. As shown in FIG. 3, the above-mentioned dresser shaft 51 is held by the swing arm 55 via the ball spline 72. The dresser shaft 51 is connected to the motor 86 and the speed reducer 88 via the dresser side gear 82 and the motor side gear 84, and is configured to rotate by driving the motor 86. A pulley and a belt may be provided in place of the dresser side gear 82 and the motor side gear 84. Further, the dresser shaft 51 is held by the housing 76 via a bearing 74, and a rotary joint 78 is provided on the housing 76. A slip ring may be provided instead of the rotary joint 78. The above-mentioned air cylinder 53 is connected to the target plate 61 via a load cell 54, and is configured to move the dresser shaft 51 up and down via the target plate 61. The air cylinder 53 is an example of a drive unit that drives a plurality of dressers, which will be described later, in a direction of moving closer to or further from the polishing pad 352. Further, a fluid machine other than the air cylinder 53 can be used as the drive unit. Further, an electric motor such as a motor can be used instead of the fluid machine. In this case, as the elevating mechanism of the dresser shaft 51, the same configuration as the vertical movement mechanism 319 in which the ball screw 32 for elevating and lowering the top ring shaft 18 and the top ring 302 and the servomotor 38 and the like is combined can be adopted. ..

A dresser 50 and a folding mechanism 450 are provided at the lower end of the dresser shaft 51. The dresser 50 and the folding mechanism 450 are omitted in FIG. 3, and details will be described below. FIG. 4 is a plan view schematically showing the configuration of the dresser and the folding mechanism according to the embodiment. FIG. 5 is a vertical cross-sectional view schematically showing the configuration of the dresser and the folding mechanism according to the embodiment, and shows a state in which the dresser is opened. FIG. 6 is a vertical cross-sectional view schematically showing the configuration of the dresser and the folding mechanism according to the embodiment, and shows a state in which the dresser is folded. FIG. 7 is a plan view schematically showing a state in which dressing is performed using the dressing unit according to the embodiment.

As shown in FIGS. 4 to 6, the dressing unit 356 includes an arm 410 extending radially around the axis of the dresser shaft 51. Further, the dressing unit 356 holds a dressing member (dressing member holder) 50 that holds the dressing members 50-1a, 50-2a, 50-3a arranged concentrically with respect to the axial center of the dresser shaft 51 via the arm 410. Includes -1, 50-2, 50-3. In the present embodiment, an example in which the dressing unit 356 includes three dressers 50-1, 50-2, and 50-3 is shown, but the number of dressers may be any number of two or more.

The dressing unit 356 includes a folding mechanism 450 configured so that the angle of the arm 410 can be adjusted so that the dressers 50-1, 50-2, and 50-3 approach each other. The folding mechanism 450 includes a worm wheel 430 attached to the arm 410, a worm shaft 420 that meshes with the worm wheel 430, and a rotary actuator 440 for rotationally driving the worm shaft 420.

Specifically, the housing 442 is connected to the lower end of the dresser shaft 51, and the rotary actuator 440 is arranged in the housing 442. Gas for rotationally driving the worm shaft 420 is supplied to the rotary actuator 440 via the rotary joint 78. When the rotary actuator 440 is electric, an electric signal for rotationally driving the worm shaft 420 is supplied via a slip ring. The worm shaft 420 extends downward from the rotary actuator 440 and is held in the housing 442 via a bearing 422. A screw gear is formed on the worm shaft 420 so that the worm shaft 420 and the worm wheel 430 mesh with each other. Instead of the worm shaft 420 and the worm wheel 430, a rack gear and a 1/4 yen pinion can be provided. In this case, the rotary actuator 440 can be a linear actuator (air cylinder or linear electric actuator).

The arm 410 includes a first arm 410a extending downward from the housing 442 and a second arm 410b extending radially around the axis of the dresser shaft 51 via a rotary joint 414 with respect to the first arm 410a. Including. The angle of the second arm 410b can be changed by the rotary joint 414. The worm wheel 430 is connected to the second arm 410b. Dressers 50-1, 50-2, and 50-3 are attached to the tips of the second arm 410b via spherical joints 416, respectively. By providing the spherical joint 416, the dressing surface of the dressing members 50-1a, 50-2a, 50-3a can be made parallel to the polishing pad 352.

The first arm 410a is provided with a flange 418 protruding in the radial direction from the first arm 410a, and a stopper bolt (stopper) 412 is attached to the flange 418 so as to penetrate the flange 418. The stopper bolt 412 has a portion that protrudes through the flange 418 and comes into contact with the arm 410 (second arm 410b), so that the dressers 50-1, 50-2, 50-3 are separated from each other by the arm 410 (the arm 410 (2nd arm 410b). The movement of the second arm 410b) is restricted. The rotary actuator 440 may be a servomotor. When using a servomotor with a brake, the stopper bolt 412 can be omitted.

When the worm shaft 420 is rotated in a predetermined direction (for example, clockwise) by the rotary actuator 440, the worm wheel 430 that meshes with the worm shaft 420 rotates, and the angle of the second arm 410b changes so as to open outward. When the second arm 410b comes into contact with the stopper bolt 412, the dressers 50-1, 50-2, and 50-3 are opened as shown in FIG. The state in which the dressers 50-1, 50-2, and 50-3 are open means that the dressing surfaces of the dressing members 50-1a, 50-2a, and 50-3a are substantially parallel to the polishing pad 352. By lowering the dressers 50-1, 50-2, 50-3 using the air cylinder 53 with the dressers 50-1, 50-2, 50-3 open, the dressing members 50-1a, 50-2a , 50-3a are pressed against the polishing pad 352. In this state, as shown in FIG. 7, the dressers 50-1, 50-2, and 50-3 are rotated by the motor 86 while rotating the polishing table 350 (polishing pad 352) to polish the dressing liquid (pure water). By supplying to the surface 352a, the polishing pad 352 can be dressed (sharpened). By swinging the swing arm 55 around the support shaft 58 during dressing, the entire surface of the polishing pad 352 can be dressed.

On the other hand, when the dressing is completed, the dressers 50-1, 50-2, and 50-3 are raised by the air cylinder 53 as shown in FIG. In this state, when the worm shaft 420 is rotated in the opposite direction (for example, counterclockwise) by the rotary actuator 440, the worm wheel 430 rotates in the opposite direction, and the second arm 410b closes inward accordingly. The angle changes like this. As a result, the dressers 50-1, 50-2, and 50-3 are in a folded state as shown in FIG. The state in which the dressers 50-1, 50-2, 50-3 are folded means that the dressers 50-1, 50-2, 50-3 are in the open state of the dressers 50-1, 50-2, 50-3. A circle formed by connecting the outermost circumferences of dressers 50-1, 50-2, 50-3 by closing the second arm 410b inward, rather than the diameter α of the circle formed by connecting the outermost circumferences. This is a state in which the diameter β has become smaller.

According to the present embodiment, the dressers 50-1, 50-2, and 50-3 are opened as shown in FIGS. 5 and 7, so that the dressing 50 having a substantially large diameter is used for dressing. It can be carried out. As a result, even if the polishing pad 352 becomes larger due to the increase in size of the substrate WF, dressing can be performed in a short time, so that the processing efficiency of the processing unit (dressing unit 356) of the substrate processing apparatus 1000 can be improved. Can be done.

Further, according to the present embodiment, when dressing is not performed, the dressers 50-1, 50-2, and 50-3 are folded as shown in FIG. 6, thereby saving the substrate processing apparatus 1000. Space can be achieved. That is, when dressing is not performed, the dressing unit 356 is arranged so as to retract to the outside of the polishing table 350 as shown in FIG. In this state, if the dressing unit 356 has a dresser having a large diameter, it is necessary to widen the side wall of the polishing unit 300 to the outside in order to provide a predetermined clearance between the dresser and the side wall of the polishing unit 300. This leads to an increase in the footprint of the substrate processing device. On the other hand, according to the present embodiment, as shown in FIG. 6, the dressers 50-1, 50-2, and 50-3 are folded and arranged outside the polishing table 350, whereby the polishing unit 300 As a result, it is possible to suppress an increase in the footprint of the substrate processing apparatus 1000 because it is not necessary to widen the side wall of the substrate processing apparatus 1000 to the outside. Further, according to the present embodiment, it is possible to suppress an increase in the cost of the dressing unit 356 and the substrate processing apparatus 1000. That is, when a dresser having a large diameter is used as the polishing pad 352 becomes larger, the cost of the dressing unit 356 and the substrate processing device 1000 may increase due to the high price of the dresser having a large diameter. On the other hand, according to the present embodiment, since the dresser having a small diameter conventionally used can be used as it is, the dressing unit 356 and the substrate processing apparatus 1000 are compared with the case where a dresser having a large diameter is used. The increase in cost can be suppressed.

Next, a modified example of the folding mechanism 450 will be described. FIG. 8 is a plan view schematically showing the configuration of the dresser and the folding mechanism according to the embodiment. FIG. 9 is a vertical cross-sectional view schematically showing the configuration of the dresser and the folding mechanism according to the embodiment, and shows a state in which the dresser is opened. FIG. 10 is a vertical cross-sectional view schematically showing the configuration of the dresser and the folding mechanism according to the embodiment, and shows a state in which the dresser is folded.

As shown in FIGS. 8 to 10, the dressing unit 356 includes an arm 490 extending radially around the axis of the dresser shaft 51. Further, the dressing unit 356 holds the dressing members 50-1a, 50-2a, 50-3a concentrically arranged with respect to the axial center of the dresser shaft 51 via the arm 490, and the dressing unit 50 Includes -1, 50-2, 50-3.

The dressing unit 356 includes a folding mechanism 450 configured so that the angle of the arm 490 can be adjusted so that the dressers 50-1, 50-2, and 50-3 approach each other. The folding mechanism 450 is provided at the first rotary joint 462 provided at the end of the arm 490 where the dressers 50-1, 50-2, 50-3 are not provided, and at the center of the arm 490. Includes a second rotary joint 464 and. The folding mechanism 450 also includes a link 466 connected to a second rotary joint 464 and a third rotary joint 468 provided at the end of the link 466. Further, the folding mechanism 450 includes a linear shaft 470 to which a third rotary joint 468 is attached and a linear actuator 480 that reciprocates the linear shaft 470.

Specifically, the housing 482 is connected to the lower end of the dresser shaft 51, and the linear actuator 480 is arranged in the housing 482. Gas for reciprocating the linear shaft 470 is supplied to the linear actuator 480 via the rotary joint 78. When the linear actuator 480 is electric, an electric signal for reciprocating the linear shaft 470 is supplied via the slip ring. The linear shaft 470 extends downward from the linear actuator 480. A flange 484 protruding in the radial direction from the linear shaft 470 is provided in the lower portion of the housing 482, and a stopper bolt (stopper) 492 is attached to the flange 484 so as to penetrate the flange 484. The stopper bolt 492 regulates the movement of the arm 490 in the direction in which the dressers 50-1, 50-2, and 50-3 are separated from each other when the portion protruding from the flange 484 comes into contact with the arm 490. ing.

The first rotary joint 462 is attached to the central portion of the lower surface of the flange 484. The arm 490 extends radially from the first rotary joint 462 around the axis of the linear shaft 470. The angle of the arm 490 can be changed by the first rotary joint 462. Dressers 50-1, 50-2, and 50-3 are attached to the tips of the arms 490 via spherical joints 494, respectively. By providing the spherical joint 494, the dressing surface of the dressing members 50-1a, 50-2a, 50-3a can be made parallel to the polishing pad 352. The second rotary joint 464 is provided between the end to which the first rotary joint 462 of the arm 490 is attached and the end to which the dressers 50-1, 50-2, 50-3 are attached (central portion). .. The third rotary joint 468 is attached to the lower end of the linear shaft 470. The link 466 is provided so as to connect the second rotary joint 464 and the third rotary joint 468.

When the linear shaft 470 is driven upward by the linear actuator 480, the position of the third rotary joint 468 attached to the lower end of the linear shaft 470 rises, whereby the arm 490 opens outward via the link 466. The angle changes like this. When the arm 490 comes into contact with the stopper bolt 492, the dressers 50-1, 50-2, and 50-3 are opened as shown in FIG. The state in which the dressers 50-1, 50-2, and 50-3 are open means that the dressing surfaces of the dressing members 50-1a, 50-2a, and 50-3a are substantially parallel to the polishing pad 352. By lowering the dressers 50-1, 50-2, 50-3 using the air cylinder 53 with the dressers 50-1, 50-2, 50-3 open, the dressing members 50-1a, 50-2a , 50-3a are pressed against the polishing pad 352. In this state, the dressers 50-1, 50-2, and 50-3 are rotated by the motor 86 while rotating the polishing table 350 (polishing pad 352) in the same manner as in the above-described embodiment (FIG. 7 and its related description). Therefore, the polishing pad 352 can be dressed (sharpened).

On the other hand, when the dressing is completed, the dressers 50-1, 50-2, and 50-3 are raised by the air cylinder 53 as shown in FIG. In this state, when the linear shaft 470 is driven downward by the linear actuator 480, the position of the third rotary joint 468 is lowered, and the angle of the arm 490 is changed so as to close inward via the link 466. As a result, the dressers 50-1, 50-2, and 50-3 are in a folded state as shown in FIG. The state in which the dressers 50-1, 50-2, 50-3 are folded means that the dressers 50-1, 50-2, 50-3 are in the open state of the dressers 50-1, 50-2, 50-3. The diameter β of the circle formed by connecting the outermost circumferences of the dressers 50-1, 50-2, 50-3 by closing the arm 490 inward is larger than the diameter α of the circle formed by connecting the outermost circumferences. It is in a smaller state. At the stroke end of the linear actuator 480, the dressers 50-1, 50-2, 50-3 are folded as shown in FIG. 10, so that the dressers 50-1, 50-2, 50-3 are folded. It is possible to prevent them from coming into contact with each other.

According to the present embodiment, the dressers 50-1, 50-2, and 50-3 are opened as shown in FIGS. 9 and 10, so that the dressing 50 having a substantially large diameter is used for dressing. It can be carried out. As a result, even if the polishing pad 352 becomes larger due to the increase in size of the substrate WF, dressing can be performed in a short time, so that the processing efficiency of the processing unit (dressing unit 356) of the substrate processing apparatus 1000 can be improved. Can be done.

Further, according to the present embodiment, when the dressing is not performed, the dressers 50-1, 50-2, and 50-3 are folded as shown in FIG. 10, thereby saving the substrate processing apparatus 1000. Space can be achieved. That is, when dressing is not performed, the dressing unit 356 is arranged so as to retract to the outside of the polishing table 350 as shown in FIG. In this state, if the dressing unit 356 has a dresser having a large diameter, it is necessary to widen the side wall of the polishing unit 300 to the outside in order to provide a predetermined clearance between the dresser and the side wall of the polishing unit 300. This leads to an increase in the footprint of the substrate processing device. On the other hand, according to the present embodiment, as shown in FIG. 10, the dressers 50-1, 50-2, and 50-3 are folded and arranged outside the polishing table 350, whereby the polishing unit 300 As a result, it is possible to suppress an increase in the footprint of the substrate processing apparatus 1000 because it is not necessary to widen the side wall of the substrate processing apparatus 1000 to the outside.

In the above, the dressing members 50-1a, 50-2a, 50-3a have been described as an example of a plurality of processing tools concentrically arranged around the axis of the rotating shaft via an arm, but the present invention is not limited thereto. .. The plurality of processing tools may be cleaning tools arranged to face the substrate WF in order to clean the substrate WF. FIG. 11 is a perspective view schematically showing the configuration of a substrate processing apparatus having a cleaning tool and a folding mechanism according to an embodiment. FIG. 12 is a plan view schematically showing the configuration of a substrate processing apparatus having a cleaning tool and a folding mechanism according to an embodiment.

As shown in FIG. 11, the cleaning unit used in the substrate processing apparatus includes a table 10 that holds and rotates the substrate WF conveyed by the transfer unit, and a cleaning tool holder 27 on which a cleaning tool (disk-shaped sponge) 21 is mounted. Including. The table 10 includes a plurality of arms 12 (four in the figure) on which chucks 11 for holding the substrate WF in a horizontal posture are mounted, and the arms 12 are integrally attached to the base 13. The base 13 is connected to the rotating shaft 14, and the substrate WF can be rotated in the direction of arrow A by the rotation of the rotating shaft 14.

Further, the cleaning tool mounting mechanism 20 has a swing arm 23, and a rotation shaft 22 is provided at the tip of the swing arm 23. A folding mechanism 450 and an arm 490 similar to those in FIGS. 9 and 10 are provided at the lower end of the rotating shaft 22. A cleaning tool holder 27 is provided at the tip of the arm 490 instead of the dressers 50-1, 50-2, 50-3 in FIGS. 9 and 10, and the cleaning tool holder 27 is provided with a cleaning tool (disc-shaped sponge) 21. Is attached. The rotating shaft 22 is rotated in the direction of arrow B by a rotating mechanism (not shown), and the cleaning tool 21 is rotated in the same direction. A swing shaft 24 is provided at the rear end of the swing arm 23 so that the swing arm 23 swings in the direction of arrow C. Further, the swing shaft 24 is also designed to raise and lower the swing arm 23 as shown by an arrow D.

In the substrate processing apparatus having the above configuration, the rocking shaft 24 is lowered to bring the cleaning tool 21 into contact with the substrate WF held by the chuck 11, and the nozzle 25 to pure water or the like is applied to the upper surface of the substrate WF rotating in the direction of arrow A. At the same time as injecting the cleaning liquid, the cleaning tool 21 is rotated in the direction of arrow B and the swing arm 23 is swung in the direction of arrow C to clean the upper surface of the substrate WF. When the cleaning is completed, the swing arm 23 is swiveled to retract the cleaning tool holder 27 to the outside of the substrate WF.

By opening the cleaning tool holder 27 as shown in FIG. 11, the substrate WF can be cleaned using the cleaning tool holder 27 having a substantially large diameter. As a result, even if the size of the substrate WF is increased, cleaning can be performed in a short time, so that the processing efficiency of the processing unit (cleaning unit) of the substrate processing apparatus can be improved.

Further, according to the present embodiment, when cleaning is not performed, the cleaning tool holder 27 can be folded as shown in FIG. 12 to save space in the substrate processing apparatus. That is, as shown in FIG. 12, when cleaning is not performed, the cleaning unit is arranged so as to retract to the outside of the substrate WF. In this state, if the cleaning unit has a cleaning tool holder 27 having a large diameter, it is necessary to widen the side wall WL of the substrate processing device to the outside in order to accommodate the cleaning tool holder 27 in the substrate processing device. Invites an increase in the footprint of. On the other hand, according to the present embodiment, it is necessary to expand the side wall WL of the substrate processing apparatus to the outside by arranging the cleaning tool holder 27 in a folded state and arranging it outside the substrate WF as shown in FIG. As a result, it is possible to suppress an increase in the footprint of the substrate processing apparatus.

In the above, the dresser and the cleaning tool have been described as an example of a plurality of processing tools, but the present invention is not limited to these, and may be used as a polishing unit for polishing a plurality of substrates concentrically arranged around the axis of a rotating shaft via an arm. In contrast, the present invention can also be applied. That is, in a substrate processing device for polishing a substrate face-down with respect to a polishing pad, a substrate holder is provided in place of the dresser 50 or the cleaning tool holder 27 described above, and the substrate WF is attached to the substrate holder to make the substrate WF more efficient. It can be polished well and the increase in the footprint of the substrate processing apparatus can be suppressed.

Although some embodiments of the present invention have been described above, the above-described embodiments of the present invention are for facilitating the understanding of the present invention and do not limit the present invention. The present invention can be modified and improved without departing from the spirit thereof, and it goes without saying that the present invention includes an equivalent thereof. In addition, any combination or omission of the claims and the components described in the specification is possible within the range in which at least a part of the above-mentioned problems can be solved, or in the range in which at least a part of the effect is exhibited. Is.

The present application is, as an embodiment, a processing unit used in a substrate processing apparatus, wherein a rotating shaft is arranged so as to face a substrate or a polishing pad for polishing the substrate, and an arm around the axis of the rotating shaft. A plurality of holders for holding a plurality of processing tools or a plurality of objects to be processed concentrically arranged via the above, and the plurality of holders are driven in a direction to be brought closer to or separated from the substrate or the polishing pad. A processing unit including a drive unit and a folding mechanism configured so that the angle of the arm can be adjusted so that the plurality of holders come close to each other is disclosed.

Further, in one embodiment, the folding mechanism includes a worm wheel attached to the arm, a worm shaft that meshes with the worm wheel, and a rotary actuator for rotationally driving the worm shaft. Disclose the unit.

Further, in the present application, as one embodiment, the folding mechanism includes a first rotary joint provided at the end of the arm, a second rotary joint provided at the center of the arm, and the second rotary joint. A link connected to a rotary joint, a third rotary joint provided at the end of the link, a linear shaft to which the third rotary joint is attached, and a linear actuator for reciprocating the linear shaft. Disclose processing units, including.

Further, the present application discloses, as an embodiment, a processing unit further including a stopper that restricts the movement of the arm in a direction in which the plurality of holders are separated from each other by contact with the arm.

Further, in one embodiment, the plurality of processing tools face a dressing member arranged to face the polishing pad to sharpen the polishing pad, or face the substrate to clean the substrate. Disclose a processing unit, which is one of the cleaning tools arranged in the manner in which the plurality of processing objects are substrates arranged so as to face the polishing pad.

Further, in the present application, as one embodiment, a transport unit for transporting a substrate, a table holding a substrate or a polishing pad for polishing the substrate, and any of the above-mentioned ones provided facing the substrate or the polishing pad. A substrate processing apparatus including the processing unit is disclosed.

13 Table 21 Cleaning tool (disc-shaped sponge)
22 Rotating shaft 27 Cleaning tool holder 50-1, 50-2, 50-3 Dresser (dressing member holder)
50-1a, 50-2a, 50-3a Dressing member 51 Dresser shaft 53 Air cylinder (drive unit)
200 Conveying unit 300 Polishing unit 352 Polishing pad 356 Dressing unit 410 Arm 412 Stopper bolt (stopper)
414 Rotating Joint 420 Warm Shaft 430 Warm Wheel 440 Rotary Actuator 450 Folding Mechanism 462 First Rotating Joint 464 Second Rotating Joint 466 Link 468 Third Rotating Joint 470 Linear Shaft 480 Linear Actuator 490 Arm 492 Stopper Bolt (Stopper)
500 Drying unit 1000 Substrate processing device WF Substrate

Claims

A processing unit used in a substrate processing device.
A rotating shaft that is placed opposite the substrate or the polishing pad for polishing the substrate,
A plurality of processing tools or a plurality of holders for holding a plurality of processing objects concentrically arranged around the axis of the rotating shaft via an arm, and a plurality of holders.
A drive unit that drives the plurality of holders in a direction to move them closer to or further from the substrate or the polishing pad.
A folding mechanism configured so that the angle of the arm can be adjusted so that the plurality of holders approach each other.
Including the processing unit.
The folding mechanism includes a worm wheel attached to the arm, a worm shaft that meshes with the worm wheel, and a rotary actuator for rotationally driving the worm shaft.
The processing unit according to claim 1.
The folding mechanism includes a first rotary joint provided at the end of the arm, a second rotary joint provided at the center of the arm, and a link connected to the second rotary joint. A third rotary joint provided at the end of the link, a linear shaft to which the third rotary joint is attached, and a linear actuator for reciprocating the linear shaft are included.
The processing unit according to claim 1.
Further including a stopper that restricts the movement of the arm in the direction in which the plurality of holders are separated from each other by contacting the arm.
The processing unit according to claim 2 or 3.
The plurality of processing tools are a dressing member arranged to face the polishing pad to sharpen the polishing pad, or a cleaning tool arranged to face the substrate to clean the substrate. Is either
The plurality of processing objects are substrates arranged so as to face the polishing pad.
The processing unit according to any one of claims 1 to 4.
A transport unit for transporting the board and
A table holding a substrate or a polishing pad for polishing the substrate,
The processing unit according to any one of claims 1 to 5, which is provided so as to face the substrate or the polishing pad.
Including substrate processing equipment.