WO2021000261A1 - 天线基板以及天线基板的制造方法 - Google Patents

天线基板以及天线基板的制造方法 Download PDF

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Publication number
WO2021000261A1
WO2021000261A1 PCT/CN2019/094410 CN2019094410W WO2021000261A1 WO 2021000261 A1 WO2021000261 A1 WO 2021000261A1 CN 2019094410 W CN2019094410 W CN 2019094410W WO 2021000261 A1 WO2021000261 A1 WO 2021000261A1
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WO
WIPO (PCT)
Prior art keywords
board
plate
dielectric
calibration
circuit board
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PCT/CN2019/094410
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English (en)
French (fr)
Inventor
韩洪娟
岳月华
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瑞声声学科技(深圳)有限公司
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Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/094410 priority Critical patent/WO2021000261A1/zh
Priority to CN201910605963.7A priority patent/CN110350320B/zh
Priority to US16/990,984 priority patent/US20210005962A1/en
Publication of WO2021000261A1 publication Critical patent/WO2021000261A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/267—Phased-array testing or checking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole

Definitions

  • the present invention relates to the field of antennas, in particular to a base station antenna.
  • the feeder board and calibration board of the existing large-scale antenna scheme are mostly directly made into a whole PCB board by multi-layer lamination, including the power division network layer 501 and the first medium stacked in sequence.
  • the power division network, the calibration network layer 505 and the first ground layer 503 form a calibration network in the form of a stripline, and the power division network and the power division network share the first ground layer 503.
  • a through hole 508 is punched in the entire PCB board.
  • the through hole 508 penetrates the power division network layer 501, the first dielectric layer 502, the first ground layer 503, the adhesive layer 504, the calibration network layer 505, and the second medium.
  • Layer 506 and the second ground layer 507 the purpose of making the through holes 508 is to form a dense ground structure on the periphery of the strip line.
  • the power division network layer 501 and the through holes 508 of the first dielectric layer 502 are separated by a back drilling process.
  • the purpose of back drilling is to eliminate the conduction of the power division network layer 501 and the first ground layer 503 due to the through holes 508, which affects the performance of the power division network.
  • One of the objectives of the present invention is to provide an antenna substrate, which can effectively reduce the manufacturing cost.
  • the second object of the present invention is to provide a method for manufacturing an antenna substrate.
  • An antenna substrate includes:
  • the feeder board including the feeder network used to feed the antenna element;
  • the calibration board includes a calibration network for calibrating the amplitude and phase of the signal transmitted to the feeding network, the calibration network is electrically connected to the feeding network, and the calibration board is The power feeding boards are separately manufactured and fixed by assembly.
  • the antenna substrate further includes a reinforcing plate provided between the feed plate and the calibration plate, and the feed plate, the reinforcing plate and the calibration plate are fixed by riveting .
  • the calibration board includes a first circuit board, a second circuit board arranged on a side of the first circuit board away from the reinforcing plate, and a second circuit board arranged on the first circuit board and the first circuit board.
  • An adhesive layer between two circuit boards, the first circuit board and the second circuit board are adhesively fixed by the adhesive layer.
  • the first circuit board includes a first dielectric board, a first ground layer and a signal line layer provided on two opposite surfaces of the first dielectric board
  • the second circuit board includes a second dielectric board And a second ground layer provided on the second dielectric board away from the surface of the first circuit board; the first ground layer, the first dielectric board, the signal line layer, the adhesive layer, the The second dielectric plate and the second ground layer are sequentially stacked from the side of the reinforcing plate away from the power feeding plate to a direction away from the reinforcing plate.
  • the calibration plate is provided with metallized vias penetrating the first dielectric plate, the adhesive layer and the second dielectric plate, and the first ground layer and the second The ground layer is connected through the metallized via.
  • the antenna substrate further includes a conductive pillar
  • the second ground layer is provided with a clearance area
  • a signal transfer board is provided in the clearance area
  • the first circuit board, the adhesive layer, and the second circuit board are penetrated with avoiding holes
  • the conductive posts are penetrated through the avoiding holes to electrically connect the feeding network and the signal
  • the switch board, the signal line layer and the signal switch board are electrically connected by metal probes.
  • the feeder plate includes a third dielectric plate, and the feeder network and a third grounding layer provided on two opposite surfaces of the third dielectric plate.
  • a manufacturing method of an antenna substrate includes the following steps:
  • a calibration board includes a pressed first circuit board, an adhesive layer, and a second circuit board, wherein the first circuit board includes a first dielectric board, and is disposed on two opposite sides of the first dielectric board.
  • the first ground layer and the signal line layer on the surface, the second circuit board includes a second dielectric board and a second ground layer disposed on the second dielectric board away from the surface of the first circuit board; the first ground layer, The first dielectric board, the signal line layer, the adhesive layer, the second dielectric board, and the second ground layer are stacked in sequence, and the calibration board is provided with the first ground layer And the metalized through hole of the second ground layer;
  • the second ground layer is provided with a clearance area, and the clearance area is provided with a signal transfer board electrically connected to the signal line layer.
  • the feeder plate, the reinforcing plate and the calibration plate are provided with through avoidance holes, and conductive posts are penetrated in the avoidance holes to electrically connect the feeder network and the signal transfer board.
  • the embodiment of the present invention is manufactured separately by setting the feeder plate and the calibration plate.
  • the antenna substrate is manufactured There is no need to use the back drilling process in the process, the processing is simple, the cost is low, and because the feeder board and the calibration board are manufactured separately, in this way, the calibration board and the feeder board can be made into different sizes.
  • the calibration board can be The size is reduced, the material cost is saved, and the occupied space is reduced.
  • FIG. 1 is a schematic structural diagram of an array antenna provided by an embodiment of the present invention
  • FIG. 2 is a schematic diagram of a cross-sectional structure of an antenna substrate provided by an embodiment of the present invention
  • FIG. 3 is a schematic block diagram of a method for manufacturing an antenna substrate provided by an embodiment of the present invention.
  • Fig. 4 is a schematic diagram of the structure of the feed plate and the calibration plate of the existing antenna.
  • an element when an element is referred to as being “fixed on” or “disposed on” another element, the element may be directly on the other element or there may be a centering element at the same time.
  • an element When an element is referred to as being “connected” to another element, it can be directly connected to the other element or an intermediate element may also exist.
  • a base station antenna 300 provided by an embodiment of the present invention includes an antenna substrate 100 and a plurality of antenna elements 200 arranged on the antenna substrate 100 in an array distribution.
  • the antenna substrate 100 includes a feeder plate 10, a reinforcement plate 20 and a calibration plate 30.
  • the feeder plate 10 and the calibration plate 30 are manufactured separately, and the feeder plate 10, the reinforcement plate 20 and the calibration plate 30 are stacked
  • the antenna substrate 100 is formed by riveting and fixing.
  • the feeder board 10 includes a feeder network 11 for feeding the antenna element 200, and the calibration board 30 includes a calibration network 31 for calibrating the amplitude and phase of the signal transmitted to the feeder network.
  • the signal transmitted to the antenna element 200 is calibrated by the calibration network 31 and then enters the feed network 11 and is passed to the antenna element 200.
  • the detection accuracy of the calibration network 31 can directly affect the beamforming and the signal arrival direction. Angle calculation accuracy.
  • the feed network 11 has a microstrip line structure
  • the calibration network 31 is a stripline structure
  • the calibration network 31 is composed of a directional coupler and a combiner.
  • the feed board 10 and the calibration board 30 are separately manufactured separately. Compared with the existing method of making the feed board and the calibration board into a whole PCB board, the antenna substrate 100 does not need to be used in the manufacturing process The back-drilling process is simple and has low cost. Moreover, since the power feeding board 10 and the calibration board 30 are manufactured separately, the calibration board 30 and the power feeding board 10 can be made into different sizes. Specifically, the calibration board 30 can be made into different sizes. The size is reduced, the material cost is saved, and the occupied space is reduced.
  • the reinforcing plate 20 is used to increase the strength of the antenna substrate 100, and is preferably a metal plate, and more preferably an aluminum plate. Understandably, in some embodiments, the antenna substrate 100 may not be provided with the reinforcing plate 20, that is, the antenna substrate 100 may be assembled and fixed by the feed plate 10 and the calibration plate 30. Further, the feeder plate 10, the reinforcement plate 20 and the calibration plate 30 are not limited to be connected by riveting. For example, the feeder plate 10, the reinforcement plate 20 and the calibration plate 30 can also be connected by bolts. Fasten the connection.
  • the calibration board 30 includes a first circuit board 32, a second circuit board 33 arranged on the side of the first circuit board 32 away from the reinforcing plate 20, and arranged on the first circuit board 32 and the second circuit board.
  • the bonding layer 34 between the two circuit boards 33, the first circuit board 32 and the second circuit board 33 are bonded and fixed by the bonding layer 34.
  • the first circuit board 32 includes a first dielectric board 321, a first ground layer 322 and a signal line layer 323 disposed on opposite surfaces of the first dielectric board 321, and the second circuit board 33 includes a second dielectric board 331 and a device.
  • the second ground layer 332 on the second dielectric board 331 away from the surface of the first circuit board 32; the first ground layer 322, the first dielectric board 321, the signal line layer 323, the adhesive layer 34, the second dielectric board 331, and the second
  • the ground layer 332 is sequentially stacked from the side of the reinforcing plate 20 away from the power feeding plate 10 to the direction away from the reinforcing plate 20.
  • the signal line layer 323 is electrically connected to the second ground layer 332, and the first ground layer 322, the signal line layer 323 and the second ground layer 332 form the calibration network 31.
  • the calibration plate 30 is provided with a metalized via 35 penetrating the first dielectric plate 321, the adhesive layer 34 and the second dielectric plate 331, the first ground layer 322 and the second ground layer 332 is connected through the metalized via 35.
  • the antenna substrate 100 further includes a conductive column 40, the second ground layer 332 is provided with a clearance area 333, the clearance area 333 is provided with a signal transfer plate 334, a feed plate 10, and a reinforcing plate 20.
  • the first circuit board 32, the adhesive layer 33, and the second circuit board 33 are penetrated with an escape hole 335, and the conductive post 40 penetrates the escape hole 335 to electrically connect the feed network 11 and the signal transfer board 334, and the signal line
  • the layer 323 is electrically connected to the signal transfer board 323.
  • the signal line layer 323 and the signal transfer board 323 may be electrically connected through a metal probe. Therefore, the feeding network 11 is electrically connected to the calibration network 31 through the signal switch board 323.
  • the feeder plate 10 further includes a third dielectric plate 12 and a third ground layer 13.
  • the feeder network 11 is arranged on the side of the third dielectric plate 12 away from the reinforcing plate 20, and the third The ground layer 13 is arranged between the third dielectric plate 12 and the reinforcing plate 20.
  • an antenna substrate manufacturing method S10 provided by an embodiment of the present invention includes the following steps:
  • the power feeding board 10 includes a third dielectric board 12 and the feeding network 11 and a third ground layer 13 provided on two opposite surfaces of the third dielectric board 12;
  • a calibration board 30 is provided.
  • the calibration board 30 includes a first circuit board 32, an adhesive layer 34, and a second circuit board 33 that are pressed together.
  • the first circuit board 32 includes a first dielectric board 321, The first ground layer 322 and the signal line layer 323 on two opposite surfaces of the first dielectric board 321.
  • the second circuit board 33 includes a second dielectric board 331 and is disposed on the second dielectric board 331 away from the first circuit board 32.
  • the power feeding plate 10, the reinforcing plate 20 and the calibration plate 30 are stacked and fixed by riveting.
  • the second ground layer 332 is provided with a clearance area 333, and the clearance area 333 is provided with a signal transfer board 334 electrically connected to the signal line layer 323.
  • the manufacturing method S10 of the antenna substrate further includes:
  • a through hole 335 is provided on the feeding plate 10, the reinforcing plate 20, and the calibration plate 30, and a conductive post 40 is inserted into the avoiding hole 335 to electrically connect the feeding network 11 and the signal Adapter plate 334.
  • the method for manufacturing the antenna element provided by this embodiment is to process the feeder plate 10 and the calibration plate 30 separately.
  • the antenna substrate The manufacturing process of 100 does not need to use back drilling technology, the processing is simple, the cost is low, and since the feeder board 10 and the calibration board 30 are manufactured separately, the calibration board 30 and the feeder board 10 can be made into different sizes. Therefore, the size of the calibration plate 30 can be reduced, which saves material cost and reduces the occupied space.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguide Aerials (AREA)
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Abstract

天线基板以及天线基板的制造方法。其中，天线基板包括馈电板（10）和校准板（30），馈电板（10）包括用于为天线振子馈电的馈电网络（11）；校准板（30）包括校准网络（31），校准网络（31）用于对发射到所述馈电网络（11）的信号的幅度和相位进行校准，校准网络（31）与馈电网络（11）电性连接，校准板（30）和馈电板（10）分别独立制造并通过组装固定。

Description

天线基板以及天线基板的制造方法 技术领域
本发明涉及天线领域，尤其涉及一种基站天线。
 背景技术
如图4所示，现有的大规模天线方案的馈电板和校准板多通过多层压合的方式直接做成一整块PCB板，包括依次层叠的功分网络层501、第一介质层502、第一接地层503、粘接层504、校准网络层505、第二介质层506和第二接地层507，其中，功分网络层501和第一接地层503形成微带线形式的功分网络，校准网络层505和第一接地层503形成带状线形式的校准网络，功分网络和功分网络共用第一接地层503。制造时，首先，在整块PCB板上打通孔508，通孔508贯穿功分网络层501、第一介质层502、第一接地层503、粘接层504、校准网络层505、第二介质层506和第二接地层507，制作通孔508的目的是为了在带状线周缘形成致密的接地结构，然后，通过背钻工艺将功分网络层501和第一介质层502的通孔508去除，背钻的目的是为了消除功分网络层501和第一接地层503因为打通孔508而产生的导通，影响功分网络的性能。
现有的馈电板和校准板的制造需要采用背钻工艺，背钻工艺加工复杂，成本高。
 技术问题
本发明的目的之一在于提供一种天线基板，其可以有效降低制造成本。本发明的目的之二在于提供一种天线基板的制造方法。
 技术解决方案
本发明的目的之一采用如下技术方案实现：
一种天线基板，包括：
馈电板，包括用于为天线振子馈电的馈电网络；
校准板，包括校准网络，所述校准网络用于对发射到所述馈电网络的信号的幅度和相位进行校准，所述校准网络与所述馈电网络电性连接，所述校准板和所述馈电板分别独立制造并通过组装固定。
作为一种改进方式，所述天线基板还包括设于所述馈电板与所述校准板之间的补强板，所述馈电板、所述补强板以及所述校准板通过铆接固定。
作为一种改进方式，所述校准板包括第一电路板、设于所述第一电路板远离所述补强板一侧的第二电路板以及设于所述第一电路板与所述第二电路板之间的粘接层，所述第一电路板和所述第二电路板通过所述粘接层粘接固定。
作为一种改进方式，所述第一电路板包括第一介质板、设于所述第一介质板两相对表面的第一接地层以及信号线层，所述第二电路板包括第二介质板和设于所述第二介质板远离所述第一电路板表面的第二接地层；所述第一接地层、所述第一介质板、所述信号线层、所述粘接层、所述第二介质板以及所述第二接地层从所述补强板远离所述馈电板的一侧往远离所述补强板的方向依次层叠设置。
作为一种改进方式，所述校准板上设置有贯穿所述第一介质板、所述粘接层以及所述第二介质板的金属化过孔，所述第一接地层和所述第二接地层通过所述金属化过孔形成连通。
作为一种改进方式，所述天线基板还包括导电柱，所述第二接地层开设有净空区，所述净空区内设有信号转接盘，所述馈电板、所述补强板、所述第一电路板、所述粘接层、所述第二电路板贯穿开设有避让孔，所述导电柱穿设于所述避让孔中以电性连接所述馈电网络和所述信号转接盘，所述信号线层与所述信号转接盘通过金属探针电性连接。
作为一种改进方式，所述馈电板包括第三介质板和设于所述第三介质板两相对表面的所述馈电网络和第三接地层。
本发明的目的之二采用如下技术方案实现：
一种天线基板的制造方法，包括如下步骤：
提供馈电板，所述馈电板包括第三介质板和设于所述第三介质板两相对表面的所述馈电网络和第三接地层；
提供补强板；
提供校准板，所述校准板包括压合的第一电路板、粘接层、第二电路板，其中，所述第一电路板包括第一介质板、设于所述第一介质板两相对表面的第一接地层以及信号线层，所述第二电路板包括第二介质板和设于所述第二介质板远离第一电路板表面的第二接地层；所述第一接地层、所述第一介质板、所述信号线层、所述粘接层、所述第二介质板以及所述第二接地层依次层叠设置，所述校准板上设有连通所述第一接地层和所述第二接地层的金属化通孔；
S2：将所述馈电板、所述补强板以及所述校准板层叠设置并通过铆接固定。
作为一种改进方式，所述第二接地层开设有净空区，所述净空区设有与所述信号线层电连接的信号转接盘。
作为一种改进方式，还包括：
在所述馈电板、补强板和校准板上设置贯通的避让孔，并在所述避让孔中穿设导电柱以电连接所述馈电网络和所述信号转接盘。
 有益效果
本发明实施方式相对于现有技术而言，通过设置馈电板和校准板分别独立制造，相对于现有的将馈电板和校准板做成一整块PCB板的方式，天线基板的制造过程中不需要使用背钻工艺，加工简单，成本低，而且由于馈电板和校准板分别独立制造，这样，校准板和馈电板可以做成不同的尺寸，具体地，可以将校准板的尺寸缩小，节约材料成本，减小占用空间。
 附图说明
图1为本发明实施例提供的阵列天线的结构示意图；
图2为本发明实施例提供的天线基板的剖面结构示意图；
图3为本发明实施例提供的天线基板的制造方法的方框示意图；
图4为现有的天线的馈电板和校准板的结构示意图。
 本发明的实施方式
下面结合附图和实施方式对本发明作进一步说明。
需要说明的是，本发明实施例中所有方向性指示（诸如上、下、左、右、前、后、内、外、顶部、底部……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
还需要说明的是，当元件被称为“固定于”或“设置于”另一个元件上时，该元件可以直接在另一个元件上或者可能同时存在居中元件。当一个元件被称为“连接”另一个元件，它可以是直接连接另一个元件或者可能同时存在居中元件。
请参阅图1，本发明实施例提供的一种基站天线300，包括天线基板100和设置于天线基板100上呈阵列分布的若干个天线振子200。
请参阅图2，天线基板100包括馈电板10、补强板20和校准板30，馈电板10和校准板30分别独立制造，馈电板10、补强板20和校准板30层叠设置并通过铆合固定形成天线基板100。馈电板10包括用于为天线振子200馈电的馈电网络11，校准板30包括校准网络31，校准网络31用于对发射到馈电网络的信号的幅度和相位进行校准。
阵列天线300使用时，发射给天线振子200的信号先经过校准网络31的校准后再进入馈电网络11传递给天线振子200，校准网络31的检测精度可以直接影响到波束赋形和信号到达方位角的计算精度。具体地，馈电网络11微带线结构，校准网络31为带状线结构，校准网络31由定向耦合器和合路器组成。
本实施方式，通过设置馈电板10和校准板30分别独立制造，相对于现有的将馈电板和校准板做成一整块PCB板的方式，天线基板100的制造过程中不需要使用背钻工艺，加工简单，成本低，而且由于馈电板10和校准板30分别独立制造，这样，校准板30和馈电板10可以做成不同的尺寸，具体地，可以将校准板30的尺寸缩小，节约材料成本，减小占用空间。
补强板20用于增强天线基板100的强度，优选为金属板，进一步优选为铝板。可以理解地，在一些实施例中，天线基板100可以不增设该补强板20，也即，天线基板100由馈电板10和校准板30组装固定也是可以的。进一步地，馈电板10、补强板20和校准板30不局限于采用铆合的方式进行固定连接，例如馈电板10、补强板20和校准板30也可以采用螺栓连接的方式进行紧固连接。
作为本实施例的一种改进方式，校准板30包括第一电路板32、设于第一电路板32远离补强板20一侧的第二电路板33以及设于第一电路板32与第二电路板33之间的粘接层34，第一电路板32和第二电路板33通过粘接层34粘接固定。
具体地，第一电路板32包括第一介质板321、设于第一介质板321两相对表面的第一接地层322以及信号线层323，第二电路板33包括第二介质板331和设于第二介质板331远离第一电路板32表面的第二接地层332；第一接地层322、第一介质板321、信号线层323、粘接层34、第二介质板331以及第二接地层332从补强板20远离馈电板10的一侧往远离补强板20的方向依次层叠设置。信号线层323与第二接地层332电性连接，第一接地层322、信号线层323以及第二接地层332形成所述校准网络31。
作为本实施例的一种改进方式，校准板30上设置有贯穿第一介质板321、粘接层34以及第二介质板331的金属化过孔35，第一接地层322和第二接地层332通过金属化过孔35形成连通。
作为本实施例的一种改进方式，天线基板100还包括导电柱40，第二接地层332开设有净空区333，净空区333设有信号转接盘334，馈电板10、补强板20、第一电路板32、粘接层33以及第二电路板33贯穿开设有避让孔335，导电柱40穿设于避让孔335以电性连接馈电网络11和信号转接盘334，信号线层323与信号转接盘电323电性连接，具体地，信号线层323与信号转接盘电323可以通过金属探针进行电性连接。从而馈电网络11通过信号转接盘323与校准网络31电性连接。
作为本实施例的一种改进方式，馈电板10还包括第三介质板12和第三接地层13，馈电网络11设置于第三介质板12远离补强板20的一侧，第三接地层13设置于第三介质板12与补强板20之间。
请参阅图1-3，本发明实施例提供的一种天线基板的制造方法S10，包括如下步骤：
S1：
提供馈电板10，所述馈电板10包括第三介质板12和设于所述第三介质板12两相对表面的所述馈电网络11和第三接地层13；
提供补强板20；
提供校准板30，所述校准板30包括压合的第一电路板32、粘接层34、第二电路板33，其中，所述第一电路板32包括第一介质板321、设于所述第一介质板321两相对表面的第一接地层322以及信号线层323，所述第二电路板33包括第二介质板331和设于所述第二介质板331远离第一电路板32表面的第二接地层332；所述第一接地层322、所述第一介质板321、所述信号线层323、所述粘接层34、所述第二介质板331以及所述第二接地层332依次层叠设置，所述校准板30上设有连通所述第一接地层322和所述第二接地层332的金属化通孔35;
S2:
将所述馈电板10、所述补强板20以及所述校准板30层叠设置并通过铆接固定。
作为本实施例的一种改进方式，所述第二接地层332开设有净空区333，所述净空区333设有与所述信号线层323电连接的信号转接盘334。
作为本实施例的一种改进方式，所述天线基板的制造方法S10还包括：
在所述馈电板10、补强板20和校准板30上设置贯通的避让孔335，并在所述避让孔335中穿设导电柱40以电连接所述馈电网络11和所述信号转接盘334。
本实施例提供的天线振子的制造方法通过将馈电板10和校准板30分别加工成型，相对于现有的将馈电板10和校准板30做成一整块PCB板的方式，天线基板100的制造过程中不需要使用背钻工艺，加工简单，成本低，而且由于馈电板10和校准板30分别独立制造，这样，校准板30和馈电板10可以做成不同的尺寸，具体地，可以将校准板30的尺寸缩小，节约材料成本，减小占用空间。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (10)

  1. 一种天线基板，其特征在于，包括：
    馈电板，包括用于为天线振子馈电的馈电网络；
    校准板，包括校准网络，所述校准网络用于对发射到所述馈电网络的信号的幅度和相位进行校准，所述校准网络与所述馈电网络电性连接，所述校准板和所述馈电板分别独立制造并通过组装固定。
  2. 根据权利要求1所述的天线基板，其特征在于，所述天线基板还包括设于所述馈电板与所述校准板之间的补强板，所述馈电板、所述补强板以及所述校准板通过铆接固定。
  3. 根据权利要求2所述的天线基板，其特征在于，所述校准板包括第一电路板、设于所述第一电路板远离所述补强板一侧的第二电路板以及设于所述第一电路板与所述第二电路板之间的粘接层，所述第一电路板和所述第二电路板通过所述粘接层粘接固定。
  4. 根据权利要求3所述的天线基板，其特征在于，所述第一电路板包括第一介质板、设于所述第一介质板两相对表面的第一接地层以及信号线层，所述第二电路板包括第二介质板和设于所述第二介质板远离所述第一电路板表面的第二接地层；所述第一接地层、所述第一介质板、所述信号线层、所述粘接层、所述第二介质板以及所述第二接地层从所述补强板远离所述馈电板的一侧往远离所述补强板的方向依次层叠设置。
  5. 根据权利要求4所述的天线基板，其特征在于，所述校准板上设置有贯穿所述第一介质板、所述粘接层以及所述第二介质板的金属化过孔，所述第一接地层和所述第二接地层通过所述金属化过孔形成连通。
  6. 根据权利要求4所述的天线基板，其特征在于，所述天线基板还包括导电柱，所述第二接地层开设有净空区，所述净空区内设有信号转接盘，所述馈电板、所述补强板、所述第一电路板、所述粘接层、所述第二电路板贯穿开设有避让孔，所述导电柱穿设于所述避让孔中以电性连接所述馈电网络和所述信号转接盘，所述信号线层与所述信号转接盘通过金属探针电性连接。
  7. 根据权利要求1所述的天线基板，其特征在于，所述馈电板包括第三介质板和设于所述第三介质板两相对表面的所述馈电网络和第三接地层。
  8. 一种天线基板的制造方法，其特征在于，包括如下步骤：
    S1：
    提供馈电板，所述馈电板包括第三介质板和设于所述第三介质板两相对表面的所述馈电网络和第三接地层；
    提供补强板；
    提供校准板，所述校准板包括压合的第一电路板、粘接层、第二电路板，其中，所述第一电路板包括第一介质板、设于所述第一介质板两相对表面的第一接地层以及信号线层，所述第二电路板包括第二介质板和设于所述第二介质板远离第一电路板表面的第二接地层；所述第一接地层、所述第一介质板、所述信号线层、所述粘接层、所述第二介质板以及所述第二接地层依次层叠设置，所述校准板上设有连通所述第一接地层和所述第二接地层的金属化通孔；
    S2：将所述馈电板、所述补强板以及所述校准板层叠设置并通过铆接固定。
  9. 如权利要求8所述的制造方法，其特征在于，所述第二接地层开设有净空区，所述净空区设有与所述信号线层电连接的信号转接盘。
  10. 如权利要求9所述的制造方法，其特征在于，还包括：
    在所述馈电板、补强板和校准板上设置贯通的避让孔，并在所述避让孔中穿设导电柱以电连接所述馈电网络和所述信号转接盘。
PCT/CN2019/094410 2019-07-02 2019-07-02 天线基板以及天线基板的制造方法 WO2021000261A1 (zh)

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