WO2020016010A1

WO2020016010A1 - Device for producing soldered connections on glass planes, and method therefor

Info

Publication number: WO2020016010A1
Application number: PCT/EP2019/067817
Authority: WO
Inventors: Hadi RASTEGAR; Katja Werner; Bernhard Reul; Mitja Rateiczak
Original assignee: Saint-Gobain Glass France
Priority date: 2018-07-20
Filing date: 2019-07-03
Publication date: 2020-01-23
Also published as: CN110945966A

Abstract

The invention relates to a device (1) for producing soldered connections on glass panes (GS), • wherein the glass pane (GS) has an electrically conductive layer (AG) on the surface at points to be soldered, wherein a contact (K) to be attached at the point to be soldered has at least two partial regions (KB1, KB2) to be soldered which are spaced apart but electrically connected to one another, wherein soldering material (L) is introduced at the points to be soldered between the conductive layer on the surface and the two contact regions (KB1, KB2), • wherein the device has a first contact electrode (KE1) for contacting the first partial region (KB1), and • wherein the device has a second contact electrode (KE2) for contacting the second partial region (KB2), • wherein, for soldering by means of the first contact electrode (KE1) and the second contact electrode (KE2) via the electrical connection of the first partial region (KB1) and the second partial region (KB2), the contact is provided by applying a voltage for resistance soldering so that the soldering material (L) under the two contact regions (KB1, KB2) is indirectly provided for melting, • wherein a nozzle (D) is mounted in the space between the first contact electrode (KE1) and the second contact electrode (KE2) and is provided for the valve-controlled output of a cooling medium so that the surface of the contact (K) to be mounted can be cooled directly and the soldering material (L) between the partial regions (KB1, KB2) and the conductive layer (AG) can be cooled indirectly, • wherein the nozzle (D) has its outlet opening at a distance (d) relative to the plane of the ends of the two contact regions (KB1, KB2). The invention also relates to a corresponding method.

Description

Device for producing soldered connections on glass panes and

Procedure for this

The invention relates to a device for producing soldered connections on glass panes and a method therefor.

It is known to arrange electrically conductive layers on panes or, in the case of multilayer panes, between two panes. These layers come e.g. the function of heaters or antennas or electrodes for displays and / or sensors.

These electrically conductive layers generally have to be connected to a control and / or power supply by means of cables.

For this purpose, contacts are applied at a suitable point.

It turns out, however, that the production of contacts cannot be sensibly carried out using classic soldering techniques based on lead / tin soldering.

One problem is the comparatively high temperature, which e.g. with laminated glass panes could damage a laminated film. Other problems arise from the materials used.

One solution that has proven to be practical is soldering using indium-based solder materials, since these have a comparatively low melting point.

From the Chinese patent CN 103 990 882 B a device for soldering cables of a bundle of cables to individual connections by means of individual soldering pins is known. Furthermore, the document shows a safety device with a cooling device. The However, the device is disadvantageous because it has a high energy consumption because the soldering tips have to be kept at a high temperature for a quick soldering process. In addition, the device there requires fuse elements adapted to individual connections. The cooling device itself is only able to cool partial areas of a single soldering. However, this does not guarantee a secure connection.

Another device is known from the applicant's WO 2017/198 703 A1. However, this device does not provide active cooling at the soldering point itself.

From US 2009/0233 1 19 A1 an electrical connector for car glass panes is known. In order to avoid stresses caused by different heating, slow cooling over a long period of time is stimulated there. However, this is not compatible with the targeted clock rates. In addition, with slow cooling, a further - albeit lower - heat supply over a certain period of time is necessary. This leads to further energy consumption.

However, it turns out that with conventional soldering processes the cycle times for the secure establishment of an adhesive connection are comparatively long and e.g. 8 seconds. If the time is chosen shorter, it can slip / detach. This has a detrimental effect on production, since such panes must be rejected as defective.

Against this background, it is an object of the invention to provide a device for producing soldered connections on glass panes and methods for this, by means of which it is possible to reduce the cycle times.

The object is achieved by a device for producing soldered connections on glass panes. The glass pane has an electrically conductive layer on the surface at the points to be soldered, a contact to be attached to the point to be soldered having at least two partial regions to be soldered, which are spaced apart but electrically connected to one another, at the points to be soldered between the conductive part Layer is introduced on the surface and the two contact areas of solder material. The device has a first contact electrode for contacting the first partial area and a second contact electrode for contacting the second partial area, wherein for soldering by means of the first contact electrode and the second contact electrode via the electrical connection of the first partial area and the second partial area, the contact is provided by applying a voltage for resistance soldering, so that the solder material is located under the two contact areas is indirectly provided for melting, a nozzle being provided in the space between the first contact electrode and the second contact electrode, which nozzle is provided for the valve-controlled delivery of a cooling medium, so that the surface of the contact to be attached is directly cooled and the solder material between the partial regions and the conductive layer is cooled indirectly wherein the nozzle is at a distance relative to the plane of the ends of the two contact areas of its outflow opening.

With the device it is possible to reduce the cycle times. As a result, the production speed can be increased and the costs reduced.

In one embodiment of the invention, the cooling medium is gaseous.

Gaseous cooling media are particularly easy to control and are often available at low cost.

In one embodiment of the invention, the cooling medium is air.

Compressed air systems are available in many companies and are sometimes also used in previous manufacturing devices e.g. used to position contacts using pneumatically operated units.

In a further embodiment of the invention, a method for producing soldered connections on glass panes is provided by means of one of the above-mentioned devices. The method comprises a step of obtaining a glass sheet with an electrically conductive layer and the step of obtaining electrical contact for electrical connection to the conductive layer. A contact to be attached at the point to be soldered has at least two partial areas to be soldered, which are spaced apart but electrically connected to one another, at the points to be soldered between the conductive layer on the surface and the two contact areas, solder material (L) is introduced. In a further step, the electrical contact is arranged relative to the glass pane at the points to be soldered and then at least the point to be soldered of the arranged contact is applied by applying a voltage heated between a first contact electrode for contacting the first partial area and a second contact electrode for contacting the second partial area, so that the melting point of a solder material is reached at the point to be soldered under the two contact areas at least on the surface. The points to be soldered are then actively cooled in a further step, a nozzle being arranged in the space between the first contact electrode and the second contact electrode, the nozzle having its outflow opening at a distance relative to the plane of the ends of the two contact regions, so that the surface of the contact to be attached can be cooled directly and the solder material between the partial areas and the conductive layer can be cooled indirectly.

With the method it is possible to reduce the cycle times. As a result, the production speed can be increased and the costs reduced.

In one embodiment of the invention, the active cooling takes place by means of a gas stream.

In one embodiment of the invention, the melting point of the solder material is less than 200 ° C.

Low-melting solder materials can be heated with less energy. This makes it possible to reduce cycle times and energy consumption. As a result, the production speed can be increased and the costs reduced.

In one embodiment of the invention, the active cooling step lasts 4 seconds or less. This means that the cycle times can be greatly reduced compared to the prior art.

In one embodiment of the invention, the step of active cooling takes place by means of an air stream.

In one embodiment of the invention, the solder material has indium.

Indium is a comparatively low-melting metal, so that energy consumption can be reduced.

In one embodiment of the invention, the temperature at the solder joint is measured by measuring the resistance of the electrical contact between the two sub-areas.

As a result, active control of the soldering process can be made available, as a result of which the cycle times can be reduced further and / or the quality of the soldering can be improved.

The object is also achieved by a glass pane obtained by a method according to the invention or the use of such a glass pane in a vehicle.

Embodiments of the present invention will be described by way of example with reference to the accompanying drawings, in which:

1 is a schematic representation of elements of the invention in a sectional view,

Fig. 2 is a schematic representation of a contact for use with the invention, and Fig. 3 is a schematic flow chart according to embodiments of the invention.

Detailed illustration of the invention with reference to the drawings

The invention will be illustrated in more detail below with reference to the figures. It should be noted that different aspects are described, which can be used individually or in combination. That Any aspect can be used with different embodiments of the invention unless explicitly shown as a pure alternative.

Furthermore, for the sake of simplicity, generally only one entity will be referred to below. Unless explicitly noted, the invention can also have several of the entities concerned. In this respect, the use of the words "a", "a" and "one" is only to be understood as an indication that in a simple embodiment at least one entity is used.

Insofar as methods are described below, the individual steps of a method can be arranged and / or combined in any order, unless the context does not explicitly state otherwise. Unless expressly stated otherwise, the processes can also be combined with one another.

Data with numerical values are generally not to be understood as exact values, but also include a tolerance of +/- 1% up to +/- 10%.

Reference to standards or specifications or norms are to be understood as references to standards or specifications or norms that apply / apply at the time of registration and / or - if priority is claimed - at the time of priority registration. However, this is not to be understood as a general exclusion of the applicability to subsequent or replacing standards or specifications or norms.

In FIG. 1, elements of the invention are shown schematically in connection with a glass pane GS. The glass pane GS has an electrically conductive layer AG on the surface at points to be soldered.

The surface can also be a recess. The electrically conductive layer AG can have a wide variety of materials, e.g. Copper and / or silver.

The electrically conductive layer AG can be arranged on a base layer and / or a black print DS or the like, so that any number of (functional) intermediate layers can be arranged between the electrically conductive layer AG and the glass pane GS underneath.

The contact K to be attached has at least two partial areas KB1, KB2 to be soldered, which are shown in FIG. 2. 2 thus represents a (two-legged) contact K from FIG. 1.

These two partial areas KB1, KB2 to be soldered are spaced apart. Since the first section KB1 and the second section KB2 e.g. can be integrally formed from a suitable material, they are also electrically connected. That A resistance can be measured between the two partial areas KB1, KB2. This resistance is usually temperature-dependent.

At the points to be soldered, a solder material L is introduced (in sections) between the conductive layer AG on the surface and the two contact areas KB1, KB2.

The solder material can also extend over a larger area, for example occupy the entire area under the contact K. The solder material L preferably also provides an electrical connection of the corresponding subregions. The device 1 for producing soldered connections on glass panes GS now has a first contact electrode KE1 for contacting the first partial area KB1 and a second contact electrode KE2 for contacting the second partial area KB2.

For soldering by means of the first contact electrode KE1 and the second contact electrode KE2, a voltage for resistance soldering can be applied via the electrical connection of the first partial area KB1 and the second partial area KB2, so that the solder material L under the two contact areas KB1, KB2 is caused indirectly by the self-heating due to of the current flow through the solder material L and / or through external heating due to the current flow through the partial areas KB1, KB2 of the contact K is provided for melting. Since only a small area, namely in particular under the two contact areas KB1, KB2 and the immediate vicinity, is heated, there is also the heat reservoir, which follows the solidification of the solder material (and thus for the permanent establishment of the electrical and mechanical connection of contact K and electrically conductive Layer AG) stands in the way.

In the space between the first contact electrode KE1 and the second contact electrode KE2, a nozzle D is attached, which is provided for the valve-controlled delivery of a cooling medium, so that the surface of the contact K to be attached is directly and the solder material L between the partial areas KB1, KB2 and the conductive layer AG can be cooled indirectly. The outflow opening of the nozzle D is arranged at a distance d relative to the plane of the ends of the two contact areas KB1, KB2. That the cooling medium can flow past the surface of the contact K. Since the solder joint (s) lies between the contact K and the electrically conductive layer, no negative influence is to be expected, since no liquefied solder can be entrained by the flow of the cooling medium. That the flow of the cooling medium specifically cools the contact K and the immediate vicinity. That essentially only the heated areas are cooled.

In one embodiment of the invention, the cooling medium is gaseous. Gaseous cooling media are particularly easy to control and are often available at low cost.

In one embodiment of the invention, the cooling medium is air.

Compressed air systems are available in many companies and are sometimes also used in previous manufacturing devices e.g. used to position contacts using pneumatically operated units. That existing infrastructure can be used inexpensively.

The device can be used in a method according to the invention. The method will be explained in more detail with reference to FIG. 3.

The method has a step 100 in which a glass pane GS with an electrically conductive layer is obtained. In a step 200 downstream / upstream / simultaneous step 200, an electrical contact K for electrical connection to the conductive layer AG is obtained. A contact K to be attached at the point to be soldered has at least two partial areas KB1, KB2 to be soldered, which are spaced but electrically connected to one another, at the points to be soldered between the conductive layer on the surface and the two contact areas KB1, KB2 solder material L. is introduced.

The electrical contact K thus obtained and the glass pane GS thus obtained (with its further layers) are arranged with respect to one another in a step 300, so that the partial areas KB1, KB2 of the contact K are arranged at the points to be soldered.

The point of the arranged electrical contact K to be soldered is then heated in a step 400 by applying a voltage between a first contact electrode KE1 for contacting the first partial area KB1 and a second contact electrode KE2 for contacting the second partial area KB2, so that the melting point of a solder material L. the spot (s) to be soldered is reached at least on the surface under the two contact areas KB1, KB2. For this purpose, the device 1 is in contact as described above brought with the sub-areas KB1, KB2 of the contact K and voltage applied to the contact (and, if applicable, to the solder material L).

In a further step, the point (s) to be soldered is then actively cooled in step 500, a nozzle D being arranged in the space between the first contact electrode KE1 and the second contact electrode KE2, the nozzle D being at a distance d relative to The plane of the ends of the two contact areas KB1, KB2 has its outflow opening so that the surface of the contact K to be attached can be cooled directly and the solder material L can be cooled indirectly between the partial areas KB1, KB2 and the conductive layer AG.

Steps 400, 500 can run in a time-controlled manner. Alternatively or additionally, it is possible to alternatively control the steps by measurement or to create an execution criterion.

In one embodiment of the invention, the solder material L has indium.

In one embodiment of the invention, the temperature at the solder joint is measured by measuring the resistance of the electrical contact K between the two sub-areas.

For example, in a step 50 the resistance of the contact K between the two partial areas KB1, KB2 can be measured before / after / during the arrangement of the contact K on the glass pane GS. Depending on the shape of the solder joint, the resistance of the solder material L under the contact K (with "continuous" connection of the solder material) is also determined. This can e.g. the resistance can be determined at a known “ambient temperature”.

Alternatively or additionally, the resistance during heating or cooling can also be determined in steps 450 and 550. In appropriate steps 475 and 575, the temperature measured at the soldering point can be determined using the resistance now measured (under certain circumstances taking into account the measured resistance with a known “ambient temperature”). It can then be compared whether a specific target temperature for melting / solidifying the solder material L has been reached. If so, so can proceed according to the arrows "Yes". If this is not the case, heating 400 or cooling 500 can be continued.

The object is also achieved by a glass pane obtained by a method according to the invention or the use of such a glass pane in a vehicle, in particular a land vehicle, such as, for example, cars, buses, trucks, work machines, trains, trams, sea vehicles, such as ships, ferries, Submersible boats, aircraft, such as planes, helicopters, space shuttles.

Bezeichnunqsliste

1 device for producing soldered connections on glass panes

GS glass pane

AG electrically conductive layer

K contact

KB1, KB2 partial areas to be soldered

L solder material

KE1, KE2 contact electrode

D nozzle

DS top layer

steps

100 Obtained a sheet of glass

200 Get an electrical contact

300 Arrange the electrical contact

400 heating

500 Indirectly active cooling of the areas to be soldered

50 Determining the resistance of the electrical contact before soldering

450 Determine the resistance of the electrical contact when heated

475 Comparison of whether target temperature for soldering has been reached

550 Determine the resistance of the electrical contact during cooling

575 Comparison of whether target temperature reached to finish cooling

Claims

Expectations

1. Device (1) for producing soldered connections on glass panes (GS),

• The glass pane (GS) has an electrically conductive layer (AG) on the surface at points to be soldered, a contact (K) to be soldered to the point to be soldered having at least two partial areas (KB1, KB2) which are spaced apart are electrically connected to one another, solder material (L) being introduced at the points to be soldered between the conductive layer on the surface and the two contact regions (KB1, KB2),

• The device has a first contact electrode (KE1) for contacting the first partial area (KB1), and

Wherein the device has a second contact electrode (KE2) for contacting the second partial area (KB2),

• wherein for soldering by means of the first contact electrode (KE1) and the second contact electrode (KE2) via the electrical connection of the first partial area (KB1) and the second partial area (KB2) the contact is provided by applying a voltage for resistance soldering, so that the solder material ( L) is indirectly provided for melting under the two contact areas (KB1, KB2),

• wherein in the space between the first contact electrode (KE1) and the second contact electrode (KE2) a nozzle (D) is provided, which is provided for the valve-controlled delivery of a cooling medium, so that the surface of the contact (K) to be attached directly and the solder material (L ) can be cooled indirectly between the sub-areas (KB1, KB2) and the conductive layer (AG),

• wherein the nozzle (D) has its outflow opening at a distance (d) relative to the plane of the ends of the two contact regions (KB1, KB2).

2. Device according to claim 1, characterized in that the cooling medium is gaseous.

3. Device according to claim 1 or 2, characterized in that the cooling medium is air.

4. A method for producing soldered connections on glass panes (GS) by means of a device (1) according to one of the preceding claims, comprising

Obtaining (100) a glass pane (GS) with an electrically conductive layer (AG),

• Receiving (200) an electrical contact (K) for the electrical connection to the conductive layer, a contact (K) to be attached at the point to be soldered having at least two partial areas (KB1, KB2) which are spaced apart but electrically connected to one another , where solder material (L) is introduced at the points to be soldered between the conductive layer on the surface and the two contact areas (KB1, KB2),

Arranging (300) the electrical contact (K) relative to the glass pane (GS) at the points to be soldered,

• heating (400) at least the point of the arranged electrical contact (K) to be soldered relatively by applying a voltage between a first contact electrode (KE1) for contacting the first partial area (KB1) and a second contact electrode (KE2) for contacting the second partial area ( KB2) so that the melting point of a solder material (L) at the point to be soldered is reached at least on the surface under the two contact areas (KB1, KB2),

• Active cooling (500) of the points to be soldered, a nozzle (D) being fitted in the space between the first contact electrode (KE1) and the second contact electrode (KE2), the nozzle (D) being at a distance (d) relative to The plane of the ends of the two contact areas (KB1, KB2) has its outflow opening so that the surface of the contact (K) to be attached is directly cooled and the solder material (L) between the partial areas (KB1, KB2) and the conductive layer (AG) is cooled indirectly can be.

5. The method according to claim 4, characterized in that the active cooling takes place by means of a gas stream.

6. The method according to claim 4 or 5, characterized in that the melting point of the solder material (L) is less than 200 ° C.

7. The method according to any one of the preceding claims 4 to 6, characterized in that the step of active cooling (500) lasts 4 seconds or less.

8. The method according to any one of the preceding claims 4 to 7, characterized in that the step of active cooling (500) takes place by means of an air stream.

9. The method according to any one of the preceding claims 4 to 8, characterized in that the solder material has indium.

10. The method according to any one of the preceding claims 4 to 9, characterized in that the temperature at the solder joint is measured by measuring the resistance of the electrical conductor between two sub-areas.

1 1. Glass sheet obtained by a method according to any one of the preceding claims 4 to 10.

12. Use of a glass pane according to claim 1 1 in a vehicle.