WO2015146544A1 - Method for manufacturing mask for use in vapor deposition, and method for manufacturing display device - Google Patents

Abstract

A method for manufacturing a mask for use in vapor deposition comprises: forming a first mask which has multiple first openings that serve as through-holes for a vapor deposition material; and stretching the first mask across a frame. In the formation of the first mask, when the positions of the first openings are designed, such a correction that the amount of opening position shift is additionally made upon the stretching of the first mask across the frame.

Description

Method for manufacturing deposition mask and method for manufacturing display device

The present disclosure relates to a method for manufacturing a vapor deposition mask and a method for manufacturing a display device used at the time of vapor deposition of a material.

For example, in an organic EL (Electro-Luminescence) display device, light from a white light emitting layer formed over all pixels is separated into red (R), green (G), and blue (B) color light using a color filter. There are two types: a type in which R, G, and B color light-emitting layers are formed (painted separately) for each pixel. When the R, G, and B light-emitting layers are formed for each pixel, each light-emitting layer is formed by a vapor deposition method (vacuum vapor deposition method) using a metal mask.

Metal masks are formed with a plurality of openings serving as through holes for the vapor deposition material, and are produced by an electroforming (plating) method, or those obtained by etching a thin metal base material by etching. This metal mask is rarely used alone in the vapor deposition process, and is used in a state where it is assembled by welding or the like to a highly rigid frame, for example. This is because the thickness of the metal mask is thin and the position of the opening cannot be accurately maintained by itself. Therefore, for example, it is pulled with a predetermined elongation rate in the biaxial direction and welded to the frame.

The opening position accuracy is required for the metal mask as described above. For example, when a metal mask is pulled and pasted on a frame, there is a method of adjusting the amount of tension while observing all of the opening positions with a measuring machine while pulling. However, with this method, it takes a considerable amount of time to measure and adjust the tensile amount. Therefore, there is a method in which the position of the opening arranged on the outer peripheral portion of the metal mask is measured while being thinned, and the tensile amount is adjusted while viewing the data. Further, there is a method of adjusting the opening position of the outer periphery of the mask after the metal mask is welded to the frame (for example, Patent Document 1).

JP 2004-6257 A

However, although the technique disclosed in Patent Document 1 and the like can design an ideal opening position at the outer periphery of the mask, there is room for improvement in the opening position accuracy at the center of the mask. Therefore, realization of a highly accurate vapor deposition mask is desired.

Therefore, it is desirable to provide a deposition mask manufacturing method and a display device manufacturing method capable of realizing a highly accurate deposition mask.

According to one embodiment of the present disclosure, a method for manufacturing a deposition mask includes a step of forming a first mask having a plurality of first openings as passage holes for a deposition material, and the first mask is stretched on a frame. In the step of forming the first mask including the steps, correction is performed in consideration of the opening position shift amount when the first opening is stretched when the position of the first opening is designed.

A method for manufacturing a display device according to an embodiment of the present disclosure includes a step of forming a vapor deposition mask and a step of patterning a material layer using the vapor deposition mask. In the step of forming a vapor deposition mask, a first mask having a plurality of first openings is formed as a passage hole for the vapor deposition material, the first mask is stretched over the frame, and the first mask is When designing the position of one opening, correction is performed in consideration of the amount of opening position shift when the frame is stretched.

In the method for manufacturing a vapor deposition mask and the method for manufacturing a display device according to an embodiment of the present disclosure, a first mask having a plurality of first openings is formed as a through hole for a vapor deposition material, and then the first mask is used. Tension on the frame. In the step of forming the first mask, when the position of the first opening is designed, correction is performed in consideration of the opening position shift amount when the first opening is stretched. Thus, when the first mask is stretched on the frame, the first opening is arranged at a desired position, and an ideal opening position design is possible.

In the method for manufacturing a vapor deposition mask and the method for manufacturing a display device according to an embodiment of the present disclosure, a first mask having a plurality of first openings is formed as a through hole for a vapor deposition material, and then the first mask is used. Tension on the frame. In the step of forming the first mask, correction is performed in consideration of the opening position shift amount when the first opening is stretched, when designing the position of the first opening. This makes it possible to design an ideal opening position by stretching the first mask on the frame. Therefore, a highly accurate vapor deposition mask can be realized.

The above content is an example of the present disclosure. The effects of the present disclosure are not limited to those described above, and may be other different effects or may include other effects.

It is a mimetic diagram showing composition of a mask for vapor deposition concerning a 1st embodiment of this indication. It is a flowchart showing the manufacturing process of the mask for vapor deposition shown in FIG. It is a flowchart showing the process regarding the electroforming condition setting at the time of metal mask production shown in FIG. FIG. 2 is an XY plan view illustrating a configuration of a correction value setting metal mask illustrated in FIG. 1. FIG. 5 is a schematic diagram showing an opening position and thickness distribution of the metal mask shown in FIG. 4 before frame welding. It is a schematic diagram for demonstrating opening position and thickness distribution at the time of welding the metal mask shown to FIG. 5A to a flame | frame. It is a schematic diagram showing the thickness measurement point at the time of opening position shift amount calculation. It is a characteristic view showing the thickness distribution in the measurement point shown in FIG. It is a characteristic view showing the opening position shift amount computed from the thickness distribution shown in FIG. It is a schematic diagram showing the measurement point at the time of measuring thickness distribution in multiple series. FIG. 10 is a characteristic diagram illustrating thickness distributions in a plurality of series illustrated in FIG. 9. It is a characteristic view showing the opening position shift amount computed from the thickness distribution shown in FIG. It is the figure which represented typically the structure of opening vicinity. It is a characteristic view for demonstrating the correction value set based on the opening position shift amount shown in FIG. It is a characteristic view for demonstrating the correction value set based on the opening position shift amount shown in FIG. It is a schematic diagram showing the opening position and thickness of the metal mask designed in consideration of the opening position shift amount. It is a schematic diagram showing the opening position and thickness after flame | frame welding of the metal mask shown in FIG. It is a flowchart showing the manufacturing process of the mask for vapor deposition which concerns on a comparative example. It is a flowchart for demonstrating the merit of the manufacturing method of the mask for vapor deposition shown in FIG. It is a flowchart showing the manufacturing process of the mask for vapor deposition which concerns on 2nd Embodiment of this indication. It is a XY plane schematic diagram for demonstrating the measurement point and area division of the vapor deposition mask which concern on 2nd Embodiment of this indication. It is a characteristic view showing the opening position shift amount based on the thickness distribution at the measurement point shown in FIG. 19A. It is a characteristic view showing the opening position shift amount computed based on the thickness distribution of the sample of a metal mask. It is a characteristic view showing the opening position shift amount computed based on the thickness distribution of the sample of a metal mask. It is a characteristic view showing the opening position shift amount computed based on the thickness distribution of the sample of a metal mask. It is a characteristic view showing the opening position shift amount computed based on the thickness distribution of the sample of a metal mask. It is a characteristic view showing the opening position shift amount computed based on the thickness distribution of the sample of a metal mask. FIG. 25 is a characteristic diagram showing an average value for each area of the samples shown in FIGS. 20 to 24; It is a characteristic view showing an opening position shift amount (A) before correction and an opening position shift amount (B) after correction of a sample of a metal mask according to Modification 1. It is a characteristic view showing an opening position shift amount (A) before correction and an opening position shift amount (B) after correction of a sample of a metal mask according to Modification 1. It is a characteristic view showing an opening position shift amount (A) before correction and an opening position shift amount (B) after correction of a sample of a metal mask according to Modification 1. It is a characteristic view showing an opening position shift amount (A) before correction and an opening position shift amount (B) after correction of a sample of a metal mask according to Modification 1. It is a characteristic view showing an opening position shift amount (A) before correction and an opening position shift amount (B) after correction of a sample of a metal mask according to Modification 1. It is the figure which represented typically the structure of opening vicinity. 10 is a schematic diagram for explaining a calculation model of a metal mask according to Modification 2. FIG. 10 is a schematic diagram for explaining a calculation model of a metal mask according to Modification 2. FIG. 10 is a schematic diagram for explaining a calculation model of a metal mask according to Modification 2. FIG. It is a characteristic view showing the measured value of opening position shift amount, and the calculated value using the model shown to FIG. 32A. It is a characteristic view showing the actual value of opening position shift amount, and the calculated value using the model shown to FIG. 32B. It is a characteristic view showing the actual value of opening position shift amount, and the calculated value using the model shown in Drawing 32C. It is a flowchart showing the manufacturing process of the display apparatus which concerns on an application example. It is a schematic diagram for demonstrating the organic layer vapor deposition process shown in FIG.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be given in the following order.
1. First embodiment (an example of a mask manufacturing process in which correction is performed based on an opening position shift amount at the time of stretching when designing an opening position)
2. Second embodiment (example in which correction based on opening position shift amount is performed for each area)
3. Modification 1 (example in which area-specific correction values are obtained from the average value of a plurality of masks)
4). Modification 2 (example in which parameters other than thickness are taken into account when calculating the opening position shift amount)
5. Application example (Example of manufacturing method of organic EL display device)

<First Embodiment>
[Constitution]
FIG. 1 illustrates an XY plane configuration of an evaporation mask (evaporation mask 1) according to the first embodiment of the present disclosure. FIG. 1 also shows a cross-sectional configuration of a metal mask (metal mask M1). The vapor deposition mask 1 is used when an organic layer is vapor-deposited in a manufacturing process of a display device (an organic EL display device described later) using an organic EL element, for example. The vapor deposition mask 1 includes, for example, a metal mask M1 serving as a mask body and a frame 110 on which the metal mask M1 is stretched.

The metal mask M1 is a metal foil made of a material containing at least one of nickel (Ni), invar (Fe / Ni alloy), copper (Cu), and the like, and has a thickness of about 10 to 50 μm, for example. . In the metal mask M1, a plurality of openings H1 are formed in a pattern as passage holes for allowing the vapor deposition material to pass therethrough. The plurality of openings H1 are two-dimensionally arranged in a matrix, for example, as a whole. One opening H1 corresponds to an element region for forming one pixel region of the display device. The shape (planar shape) of the opening H1 is, for example, a rectangular shape, a square shape, a circular shape, or the like. For example, a low molecular organic material is deposited through the opening H1. The “metal mask M1” of the present embodiment corresponds to a specific example of “first mask” of the present disclosure, and the opening H1 corresponds to a specific example of “first opening” of the present disclosure. .

The metal mask M1 is fixed (stretched) to the frame 110 in a state where a predetermined tension is applied, for example. Specifically, the outer edge portion of the metal mask M1 is bonded to the frame 110 by, for example, spot welding (for example, by electric resistance or laser).

Examples of the formation method of the metal mask M1 include a method using electroforming (electroplating) or etching. In the case of electroforming, for example, a thin film layer made of the above-described metal is grown (electrodeposited) on a patterned base material (matrix, base layer). Alternatively, in the case of etching, the metal foil is patterned by etching using, for example, a photolithography method. In any case, after the thin metal mask M1 is formed, the thin film metal mask M1 is assembled to the frame 110 made of a highly rigid metal by welding or the like. Although details will be described later, the thickness of the metal mask M1 is not uniform in the plane but has a distribution. In particular, when the metal mask M1 is formed by electroforming among the above methods, such a thickness distribution occurs in the mask surface.

The frame 110 is a frame-like member for holding the metal mask M1, and is made of a highly rigid metal or the like. The outer shape of the frame 110 is, for example, a rectangular shape, and a metal mask M1 is stretched on four sides along the biaxial direction.

[Method for Manufacturing Evaporation Mask 1]
Hereinafter, the manufacturing method of the mask 1 for vapor deposition is demonstrated. FIG. 2 shows a flow of manufacturing the deposition mask 1. In the present embodiment, the evaporation mask 1 is used. For example, it is manufactured as follows. That is, first, an electroforming mask Mf0 is produced (step S11). Next, optimum electroforming conditions are set (or adjusted) using the produced electroforming mask Mf0 (step S12). Next, a metal mask (metal mask M0) is produced using the set electroforming conditions (step S13). Next, the opening position shift amount is calculated using the metal mask M0 (step S14).

Thereafter, a correction value is set based on the calculated opening position shift amount (step S15). Next, an electroforming mask Mf1 for forming the metal mask M1 is produced by the opening position design reflecting the correction value (step S16). Next, a metal mask M1 is produced by electroforming using the electroforming mask Mf1 (step S17). The metal mask 1 thus manufactured is welded to the frame 110 (step S18), and finally the opening position accuracy is confirmed (step S19). In this way, the vapor deposition mask 1 is completed. Details of each step (steps S11 to S19) will be described below.

(Production of metal mask M0: S11 to S13)
The electroforming mask Mf0 is a mask for patterning a base material for plating the metal mask M0. The metal mask M0 is a mask sample for calculating an opening position shift amount, which will be described later, and setting a correction value. The metal mask M0 is not left on the completed vapor deposition mask 1 (not shipped) and is finally discarded. The For this reason, as the electroforming mask Mf0, for example, a mask having the same accuracy as the electroforming mask Mf1 (described later) may be used. However, the electroforming mask Mf0 is finally (after the aperture correction). Is not required, and the electroforming mask Mf1 is used instead. For this reason, in order to reduce the cost, an inexpensive photomask such as blue plate glass or film emulsion may be used as the electrocasting mask Mf0 for determining the conditions. Although the design accuracy of blue plates and films is inferior to that of quartz or the like, it can be said that the accuracy is sufficient for the purpose of setting conditions and setting correction values only. The “metal mask M0” of the present embodiment corresponds to a specific example of “second mask” of the present disclosure, and the opening H0 corresponds to a specific example of “second opening” of the present disclosure. .

When producing the metal mask M0, it is desirable to set optimal electroforming conditions (perform so-called electroforming conditions). FIG. 3 shows an example of determining the electroforming conditions. When setting the conditions, electroforming conditions (for example, processing time, partition layout in the plating bath, etc.) until the design error becomes a predetermined threshold value or less with respect to the base material formed using the electroforming mask Mf0. The metal mask M0 _n (where n is an integer greater than or equal to 1) is formed.

Specifically, first, predetermined electroforming conditions are set (step S21), and a metal mask (metal mask M0 ₁ ) is formed by plating using the set conditions (step S22). Then, by measuring the fabricated metal mask M0 ₁ thickness (plate thickness) (step S23), and calculates the design errors based on the measured thickness (step S24). The calculation method of the position error using this thickness is the same as the calculation method of the opening position shift amount described later. Then, it is determined whether or not the calculated design error is equal to or less than a predetermined threshold (whether or not a desired accuracy is obtained) (step S25). The case design error in the metal mask M0 ₁ is equal to or less than a predetermined threshold value (Y in step S25), and the metal mask M0 _1, a metal mask M0 above. On the other hand, if the design error in the metal mask M0 ₁ is greater than a predetermined threshold value (N in step S25), and returns to step S21, adjusting the electroforming condition (set to different electroforming condition), the metal mask ( A metal mask M0 ₂ ) is formed by plating, and thickness measurement, design error calculation, and threshold determination are performed in the same manner as described above. In this way, the metal mask (metal mask M0 _n ) is repeatedly formed until the desired accuracy is obtained, and the optimum electroforming conditions are selected. The metal mask M0 _n formed under electroforming conditions that can finally achieve the desired accuracy is referred to as a metal mask M0. In this way, a metal mask M0 is produced.

(Calculation of opening position shift amount: S14)
FIG. 4 shows the XY plane configuration of the metal mask M0 before frame welding. Thus, in the metal mask M0 before frame welding, the plurality of openings H0 are arranged at equal intervals along the biaxial direction. Here, images when the metal mass M0 is attached to the frame are shown in FIGS. 5A and 5B. 5A and 5B also show a cross-sectional configuration for explaining the thickness of the mask. In this way, when the metal mask M0 is stretched, the metal mask M0 is welded to the frame 110 while being pulled in all directions (biaxial direction) at a predetermined elongation rate, and then the tensile force T is released. By stretching the metal mask M0, the opening H0 is shifted (shifted) from the ideal position (design position) as shown in FIG. 5B after welding to the frame 110. Further, the position shift amount of the opening H0 is not uniform. For this reason, the arrangement of the openings H0 after frame welding is disturbed, and the arrangement is not evenly spaced (the spacing is uneven).

This is due to the fact that the metal mask M0 has a thickness distribution as shown in the lower part of FIG. 5A. In particular, in the metal mask M0 formed by electroforming, the thickness distribution tends to occur due to variations in the plating growth rate. Here, the design error of the opening position of the metal mask M0 before frame welding is such that there is no practical problem (for example, about submicron). However, when tension is applied during welding, the metal mask M0 expands and contracts due to the tensile force. At this time, if the metal mask M0 has a thickness distribution, the elongation varies depending on the region. For example, the elongation rate is small (difficult to stretch) in a relatively thick region, and the elongation rate is large (easy to stretch) in a relatively thin region. As a result, as shown in the lower part of FIG. 5B, the position shift amount of the opening H0 becomes non-uniform, and a desired position design accuracy cannot be obtained.

Therefore, in the present embodiment, in order to perform correction in consideration of the opening position shift at the time of stretching as described above, the opening position shift amount is calculated using the metal mask M0 as a sample. At this time, the thickness (thickness distribution) of the metal mask M0 is measured, and the opening position shift amount is obtained by calculation using the thickness and the pulling rate at the time of stretching as parameters. Note that the thickness of the metal mask M0 can be easily measured using a measuring instrument such as a micrometer or a step gauge even when the thickness is not held by the frame 110.

The thickness distribution of the metal mask M0 and the opening position shift amount will be described with reference to FIGS. FIG. 6 is a schematic diagram showing thickness measurement points. FIG. 7 is a characteristic diagram showing the thickness distribution at the measurement point shown in FIG. FIG. 8 is a characteristic diagram showing the opening position shift amount (opening position distribution) calculated from the thickness distribution shown in FIG. FIG. 9 is a schematic diagram illustrating measurement points when thickness distribution is measured in a plurality of series. FIG. 10 is a characteristic diagram showing thickness distributions in a plurality of series shown in FIG. FIG. 11 is a characteristic diagram showing the opening position shift amount calculated from the thickness distribution shown in FIG.

When the metal mask M0 has, for example, 3840 openings H0 in the X direction and 2160 openings in the Y direction, measuring the thickness at points corresponding to all the openings H0 results in over 8 million measurement points. The time is enormous. For this reason, in actuality, measurement is performed at an appropriate distance (thinning out at selected locations). For example, the example shown in FIG. 6 assumes 15 measurement points in the X direction and 7 measurement points in the Y direction (that is, a total of 15 × 7 locations). FIG. 7 shows a distribution of thicknesses at positions along the X direction (total of 15 positions) in the fourth series of measurement points in FIG. In this measurement result, the thickness is the largest at the 14th position in the X direction and the smallest at the 4th or 7th position in the X direction. In FIG. 8, when the opening positions of the same measurement points as in FIG. 7 are the same as the design position, the position shift amount is 0 (zero). When shifting to the plus side in the X direction, the shift amount is plus and minus. When shifting to the side, the amount of shift is indicated by minus. For example, it indicates that the opening H0 at the second position in the X direction is shifted to the plus side in the X direction from the design position. Further, in this example, the opening position shift amount at both ends in the X direction (No. 1 and No. 15) is set to 0 by the condition setting at the time of calculation.

In addition, FIG. 9 shows a total of seven measurement points in the Y direction 1-7. FIG. 10 shows the thickness distribution for each of the seven series shown in FIG. Also in the example of FIG. 11, the opening position shift amount at both ends in the X direction (No. 1 and No. 15) is set to 0 by the condition setting at the time of calculation.

Here, when calculating the opening position shift amount, the metal mask M0 can be handled as a one-dimensional model (one-dimensional tensile model) along one axial direction. For example, the opening position shift amount is calculated using a one-dimensional model along the X direction (rectangular longitudinal direction) of the two X and Y axes. Assuming that the metal mask M0 is stretched on the frame 110, the metal mask M0 is pulled in, for example, the biaxial directions of the X direction and the Y direction. Therefore, strictly speaking, the opening position shift amount is determined by the interaction between the tensile amount in the X direction and the tensile amount in the Y direction. However, in this embodiment, the effect of the tensile force in the Y direction is ignored, and the X direction The calculation is performed considering only the action of. It has been confirmed by comparison with the actual measurement that the action in the Y direction is sufficiently negligible.

FIG. 12A shows an image of the opening H0 of the metal mask M0. In practice, about 4000 openings H0 are arranged in the X direction and about 200 openings H0 in the Y direction, but here, 3 × 2 = 6 openings H0 (H0a, H0b) are shown for explanation. .

As described above, the portion (X1) extending along the X direction between the openings H0 can be used as a thickness measurement target, and the opening position shift amount can be calculated. As shown in FIG. 12B, the thickness (t2) in the vicinity of the central opening H0b is larger than the thickness (t1) in the vicinity of the opening H0a on both sides (t2> t1). In addition, in the vicinity of the opening H0b, as the thickness t2 increases, the width d2 along the Y direction of the elongated portion (beam 121b) between the openings H0b becomes wider than the width d1 of the beam 121a between the openings H0a. Further, the length s2 of the beam 121b along the X direction is shorter than the length s1 of the beam 121a. This is due to the nature of electroforming. The relatively thick portion acts so that the width and length of the beam 121b are less likely to extend. On the other hand, the portion having a relatively small thickness becomes the opposite, and is easily stretched. As parameters for calculating the opening position shift amount, the widths d1 and d2 and the lengths s1 and s2 can be used in addition to the thicknesses t1 and t2, but only the thickness is used in the present embodiment. . A case where the thickness and width are taken into account and a case where the thickness, width and length are taken into account will be described later (modified example).

(Correction value setting: S15)
As described above, the opening position shift amount at the time of stretching to the frame 110 can be calculated from the thickness distribution of the metal mask M0. However, as long as the metal mask M0 has the thickness distribution, the opening position shift from the ideal position may occur. In order to improve the accuracy under such circumstances, the opening position may be shifted in the reverse direction in advance at the design stage in consideration of the opening position shift. In other words, a correction value is set based on the calculated opening position shift amount, and this correction value is fed back to the design stage.

For example, as shown in FIG. 13A, the correction value is set based on the opening position shift amount (the example shown in FIG. 8 is taken as an example). Specifically, as shown in FIG. 13B, the correction value is set so that the position shift amount in the X direction becomes 0 at each of the positions in the X direction (numbers 1 to 15). For example, since position 3 is shifted 7 (for example, 7 μm) in the plus direction in the X direction, “−7” is set as the correction value. Further, at position 9, since the shift is 6 to the minus side in the X direction, “+6” is set as the correction value. The correction value for each position is fed back to the opening position design process of the metal mask M1.

(Production of metal mask M1: S16, S17)
When producing the metal mask M1, the opening position is designed using the correction value based on the opening position shift amount set as described above. Specifically, a new electroforming mask Mf1 reflecting such a correction value is created, and a metal mask M1 is formed using the electroforming mask Mf1. It is desirable to use a highly accurate photomask as the electroforming mask Mf1. For example, a glass photomask in which chrome plating is applied to glass having low thermal expansion or quartz glass may be used.

FIG. 14 shows an XY plane configuration and a cross-sectional configuration of the metal mask M1. As described above, in the metal mask M1 in which the opening position is designed to reflect the correction value, the positions of the openings H1 are not evenly spaced. By welding such a metal mask M1 to the frame 110 at a predetermined elongation rate in the next step (step S18), the position of the opening H1 is shifted depending on the thickness distribution. As a result, as shown in FIG. 15, in the state of being stretched on the frame 110, the opening position is close to the ideal position (the openings H1 are arranged at equal intervals). Before welding, the opening positions of unequal intervals are evenly spaced after welding. Here, the correction of the opening position shift amount may be performed with respect to the opening position in one axis (X direction), but correction may be performed for two axes in the X direction and the Y direction. When correcting for two axes, after obtaining the position shift amount in the X direction as described above, the position shift amount in the Y direction is similarly calculated based on the thickness distribution in the Y direction (or Actually measure). Accordingly, correction values at measurement points in the X direction and the Y direction (for example, a total of 105 locations including 15 locations in the X direction and 7 locations in the Y direction) can be obtained. The opening position correction based on the correction value can be performed independently in the X direction and the Y direction.

Finally, the opening position accuracy is confirmed in the metal mask M1 stretched on the frame 110. Thus, the vapor deposition mask 1 shown in FIG. 1 is completed.

[effect]
In the manufacturing method of the evaporation mask 1 of the present embodiment, as described above, after forming the metal mask M1 having a plurality of openings H1 as the passage holes for the evaporation material, the metal mask M1 is stretched on the frame 110. (Adhering by welding or the like while applying tension). In designing the opening position of the metal mask M1, correction is performed in consideration of the opening position shift amount when the metal mask M1 is stretched on the frame 110. For example, the opening position shift amount is obtained by calculation from the thickness distribution of the metal mask M0, and the correction value is set based on the calculated opening position shift amount. The set correction value is reflected in the opening position design of the metal mask M1. Thereby, when the metal mask M1 is stretched on the frame 110, the opening H1 is arranged at a desired position, and an ideal opening position design is possible. Therefore, a highly accurate evaporation mask can be realized.

In addition, as described above, the opening position shifts when the mask is stretched. Until now, it has been clarified whether the opening position shift is caused by variations in tensile force or due to elastic deformation. Was not. Under such circumstances, the applicant can assume the metal mask M0 as a one-dimensional model and calculate the opening position shift amount from the thickness distribution by calculating the opening position shift amount in advance. I found out that As a result, it can be seen that the variation in the thickness of the metal mask M0 is the main factor of the opening position shift when the frame 110 is stretched to the frame 110, and each process of measuring the thickness distribution and calculating the opening position shift amount is one-dimensional. It can be integrated into the model.

On the other hand, it is actually difficult to eliminate the thickness distribution of the metal mask M0. In particular, in electroforming, unevenness in the thickness occurs due to the fact that the flow of the plating solution is uneven and the current density varies depending on the region on the base material depending on the positional relationship with the electrode. . In general, since the electrode is disposed at the end portion on the base material, the plating growth rate in the central portion on the base material is slow. For this reason, there exists a tendency for the thickness in the center part in a mask surface to become relatively thin. That is, the mask thickness distribution has a unique tendency due to the process conditions. Accordingly, by calculating the opening position shift amount from such a thickness distribution and feeding it back to the design stage as a correction value, it is possible to design an opening position that assumes an opening position shift caused by such process conditions in advance.

In the present embodiment, for example, in the metal mask M0 manufacturing process (S11 to S13 in FIG. 2) and the opening position shift amount calculating step (S14), the design error or the opening position shift amount is obtained by calculation. Accordingly, it is possible to set conditions or set correction values without welding the metal mask M0 to the frame 110.

(Comparative example)
FIG. 16 shows a mask manufacturing flow in the case where the electroforming conditions are determined by actual measurement as a comparative example of the present embodiment. In this case, after performing a series of steps from electroforming mask production (step S101), electroforming condition setting (step S102), metal mask production (step S103) and frame welding (step S104), the opening position is measured. (Step S105). As described above, when the opening position accuracy is actually measured, the measurement is performed while being welded to the frame. This is because in a state where the metal mask is not welded, the metal mask does not become flat and measurement is difficult.

Specifically, when the metal mask is welded to the frame (S104), the metal mask is pulled while measuring the opening position using a dedicated measuring machine, and the tensile amount of the four sides is finely adjusted. Weld to. As a measuring instrument, a metal mask is placed on a measurement surface plate, and measured with, for example, a camera with a microscope moving along two axes in the X direction and the Y direction, a laser interferometer and a scale, and captured by the camera with a microscope. A two-dimensional length measuring device or a three-dimensional length measuring device of a type that determines an opening position by image processing can be used. Thereafter, the opening position accuracy is measured with a dedicated measuring machine similar to the above (S105).

Thus, in the actual measurement, a welding process (stretching process) to the frame of the metal mask and a subsequent opening position accuracy process are required. For this reason, when the desired accuracy is not obtained in the opening accuracy determination (S106), the metal mask is peeled off from the frame, and the welded surface of the frame is polished and cleaned. These processes are time-consuming and can be performed once a day. In this way, every time the electroforming conditions are reset, a process of peeling, polishing, and cleaning the metal mask from the frame is required.

On the other hand, in the present embodiment, it does not take much time to measure the thickness of the metal mask M0. Since the thickness of the metal mask M0 can be easily measured using a measuring instrument such as a micrometer or a step meter, the process time can be shortened. For this reason, it is not difficult to produce about 4 metal masks M0 _n (n = 1 to 4) per day and to measure the thickness in order to determine the electroforming conditions (FIG. 3). In this way, by calculating the design error from the thickness distribution, it is possible to repeat the electroforming condition setting process 10 times or more, and in some cases, several tens of times before the metal mask M0 is attached to the frame 110. It becomes. Only the metal mask M0 determined to have a desired accuracy by calculation may be finally welded to the frame for confirmation to measure the accuracy. Therefore, the time required for electroforming conditions can be greatly shortened. Depending on the required specifications for how much accuracy should be pursued, the period of one month or more can be shortened in some cases.

In addition, there is an advantage that the yield of shipped products is improved by performing accuracy judgment before welding the metal mask M1 to the frame 110. FIG. 17 shows a manufacturing flow in the case of welding to the frame 110 after determining the accuracy of the metal mask M1. If the design conditions (electroforming conditions and opening position design) for producing the metal mask M1 are determined by the above-described steps, a plurality of metal masks M1 can be produced based on the design conditions. However, even if the metal mask M1 is manufactured under the same design conditions, desired accuracy may not be obtained due to variations in conditions in the electroforming process. Assuming such a case, after manufacturing the metal mask M1 (step S31) and before welding to the frame 110 (step S35), the thickness distribution of the metal mask M1 is measured (step S32), and the design error is calculated. Obtained (step S33). Then, accuracy determination based on the design error is performed (step S34), and when a desired accuracy is obtained (Y in step S34), the process proceeds to the frame welding process. On the other hand, if the desired accuracy is not obtained in the accuracy determination (N in step S34), the process returns to the step of manufacturing the metal mask M1 again (the metal mask M1 is manufactured again).

As described above, after the metal mask M1 is manufactured, only those having desired accuracy can be welded to the frame 110. Thereafter, the opening position is measured (step S36), and the accuracy is confirmed (step S37). By producing the deposition mask 1 in such a flow, it is possible to determine whether or not the deposition mask 1 should be sent to the frame 110, and the number of masks that become defective after the frame is welded with insufficient accuracy. Can be reduced. That is, the yield of the final shipment product can be improved.

Hereinafter, vapor deposition masks according to other embodiments and modifications of the present disclosure will be described. In addition, the same code | symbol is attached | subjected about the component similar to the said 1st Embodiment, and description is abbreviate | omitted suitably.

<Second Embodiment>
FIG. 18 illustrates a flow of manufacturing an evaporation mask according to the second embodiment of the present disclosure. Also in the present embodiment, the vapor deposition mask is produced as follows, for example, in the same manner as in the method of manufacturing the vapor deposition mask 1 of the first embodiment. That is, first, an electroforming mask Mf0 is produced (step S41). Next, optimal electroforming conditions are set (or adjusted) using the produced electroforming mask Mf0 (step S42). Next, a metal mask (metal mask M0) is produced using the set electroforming conditions (step S43). Next, the opening position shift amount is calculated using the metal mask M0 (step S44). Thereafter, a correction value (representative correction value) is set based on the calculated opening position shift amount (step S45). Next, the electroforming mask Mf1 reflecting the correction value is produced (step S46). Next, a metal mask M1 is produced by electroforming using the electroforming mask Mf1 (step S47). The metal mask 1 thus manufactured is welded to the frame 110 (step S48), and finally the opening position accuracy is confirmed (step S49). In this way, a vapor deposition mask is completed.

However, this embodiment is different from the first embodiment in the following points. In the present embodiment, in the opening position shift amount calculation step (S44), the metal mask M0 is divided into a plurality of areas based on the tendency of the opening position shift amount. In the correction value setting step (S45), a representative correction value in each area is set based on the opening position shift amount for each area.

FIG. 19A shows measurement points (X direction 0 to 32, Y direction 1 to 13) and areas (A1 to A5) of the present embodiment. FIG. 19B is a characteristic diagram of the opening position shift amount in the X direction (longitudinal direction) calculated based on the thickness distribution of the metal mask M0. Also in the present embodiment, the thickness distribution and the opening position shift amount are measured and calculated as a one-dimensional model along the X direction. In the example of FIGS. 19A and 19B, measurement and calculation were performed at 33 locations (0 to 32) along the X direction for each series of 1 to 13 in the Y direction.

In the example shown in FIG. 19B, the series 6, 7, and 8 are similar curves. In other words, it can be understood that the position shift of the portion including these series 6, 7, and 8 has the same tendency. Similarly, series 12 and 13 have similar position shifts. This indicates that the mask surface can be divided into a plurality of areas (areas A1 to A5) extending along the pulling direction (X direction) according to the tendency of the opening position shift. This is because the thickness distribution of the metal mask M0 is similar for each area. For example, as described above, the electroforming plating growth tends to be slow at the central portion on the base material. For this reason, it has line symmetry with the center in the X direction (the same applies to the Y direction) as the axis of symmetry in the mask plane. For this reason, when an axis of symmetry is placed at the center of the mask in the X direction, the amount of shift in a portion that is line symmetric with respect to the axis becomes similar. Due to the similarity of the position shift tendency, the in-plane of the metal mask M0 can be regarded as a plurality of areas A1 to A5, and correction can be performed for each area.

Here, since a one-dimensional model along the tensile direction (X direction) is assumed, area division (areas A1 to A5) is performed for each group of series having similar trends in the opening position shift amount. Specifically, area A1 is series 1, 2, area A2 is series 3-5, area A3 is series 6-8, area A4 is series 9-11, area A5 is series 12, 13, Respectively.

Thus, after extracting the areas A1 to A5 having similar opening position shift tendencies, representative correction values are set in each of the areas A1 to A5. For example, an average of the opening position shift amounts between sequences in each area can be taken, and this average value can be used as a representative correction value. For example, in area 1, the average value of the opening position shift amount of series 1 and the opening position shift amount of series 2 can be used as the representative correction value of area 1. Thus, opening position shift amount calculation (S44) and correction value setting (S45) are performed. Further, the electroforming mask Mf1 is manufactured by opening position design that reflects the set representative correction value for each area (S46). The other steps (S41 to S43, S47 to S49) of the present embodiment are the same as the steps (S11 to S13, S17 to S19) of the first embodiment.

Also in the present embodiment, the effect equivalent to that of the first embodiment can be obtained by performing correction in consideration of the opening position shift amount in the opening position design in the manufacturing process of the metal mask M1. .

In the present embodiment, as described above, when calculating the opening position and setting the correction value, the area is divided and a representative correction value for each area is set. This eliminates the need to enter a correction value for each individual opening when designing the opening position, and it is sufficient to enter a representative correction value for each area. For example, a vapor deposition mask for a display having 8 million pixels or more has a numerical aperture of 8 million or more. However, as in this embodiment, correction by area is possible, and the amount of correction value Can be greatly reduced. Further, in practice, there is a certain degree of variation for each electroforming lot, and therefore, practicality is higher when performing each area than when performing correction for each individual opening.

In addition, with respect to the opening position shift in the Y direction, area division and representative correction value setting can be performed by the same method as described above. The X direction and the Y direction can be handled independently of each other, and correction values can be set separately. However, since the accumulated amount of opening position shift in the longitudinal direction (X direction) of the display is large, the maximum shift amount is almost always generated in the longitudinal direction. Therefore, it is possible to obtain a sufficient effect only by correcting the shift amount only in the longitudinal direction.

<Modification 1>
In the method of manufacturing a deposition mask according to the second embodiment, the method for setting the correction value for each area has been described. However, even in the case of a metal mask manufactured under the same electroforming conditions, the thickness distribution is actually reduced. Varies from rod to rod. In particular, in the electroforming process, the thickness distribution tends to vary from lot to lot.

Therefore, in the present modification, after the areas are divided in the same manner as in the second embodiment, the corresponding areas (the same area) are opened between the plurality of metal masks manufactured under the same electroforming conditions. Take the average of the position shift amount. In other words, the average aperture position shift amount of the area is taken for all the metal masks. Hereinafter, an example will be described.

20 to 24 show opening position shift amounts calculated based on the thickness distribution of a total of five metal masks M0 (samples A to E) manufactured under the same electroforming conditions. In this manner, it can be seen that Samples A to E have a somewhat similar tendency for each series or area, but have some variation.

FIG. 25 shows an average of these five samples A to E for each area. It should be noted that here, series 1 and 2 (corresponding to area A1 in FIG. 19A), series 3 to 5, 9 to 11 (corresponding to areas A2 and A4), and series 6 to 8 (corresponding to area A3). Equivalent), and a total of four areas of a set of series 12 and 13 (corresponding to area A5), respectively. Specifically, for example, the average value of the set of series 1 and 2 includes the opening position shift amount of series 1 and 2 of sample A, the opening position shift amount of series 1 and 2 of sample B, and the series 1 and 2 of sample C. 2 is the average value of the opening position shift amount of the sample D, the opening position shift amount of the series 1 and 2 of the sample D, and the opening position shift amount of the series 1 and 2 of the sample E.

The average value for each area in the plurality of metal masks M0 obtained in this way is fed back to the design process of the metal mask M1 as a representative correction value, as in the second embodiment. As a result, the same effects as those of the second embodiment can be obtained, and correction in consideration of variation for each rod can be performed. Higher accuracy can be realized. Further, when the aperture position design correction is actually performed, since there is only one electroforming mask Mf1, the method of taking an average for each area from a plurality of metal masks as in this modification is most practical. .

(Correction effect)
26 to 30 show the opening position shift amount (A in each figure) of the samples A to E of this modification and the position shift amount after actually performing the opening position design correction ((B in each figure). )). The corrected distribution in (B) is a calculated value obtained by subtracting one representative correction value set by the above-described method for each area in the characteristic diagram in (A). Each figure also shows the maximum value (max), minimum value (min), and maximum width (maximum value of shift amount in the X direction: Range) of the position shift amount. In all the samples A to E, in the characteristic diagram after correction, all of the maximum value, the minimum value, and the maximum width are halved (or reduced) than before correction. These results show that the opening position accuracy is improved by the correction at the time of designing the opening position described above.

<Modification 2>
In the above embodiment and the like, the opening position shift amount is calculated based on the thickness (thickness distribution) of the metal mask M0. However, in addition to the thickness, other parameters are used for calculating the opening position shift amount. Also good. FIG. 31A shows an image of the opening H0 of the metal mask M0. In practice, about 4000 openings H0 are arranged in the X direction and about 200 openings H0 in the Y direction, but here, 3 × 2 = 6 openings H0 (H0a, H0b) are shown for explanation. .

As in the first embodiment, as a one-dimensional model, a portion (X1) extending along the X direction between the openings H0 can be measured. As shown in FIG. 31B, the thickness (t2) near the central opening H0b is larger than the thickness (t1) near the opening H0a on both sides (t2> t1). In addition, in the vicinity of the opening H0b, as the thickness t2 increases, the width d2 along the Y direction of the elongated portion (beam 121b) between the openings H0b becomes wider than the width d1 of the beam 121a between the openings H0a. Further, as shown in FIG. 31C, the length s2 of the beam 121b along the X direction is shorter than the length s1 of the beam 121a. This is due to the nature of electroforming. The relatively thick portion acts so that the width and length of the beam 121b are less likely to extend. On the other hand, the portion having a relatively small thickness becomes the opposite, and is easily stretched.

In the present modification, when only the thicknesses t1 and t2 are considered in the one-dimensional model portion X1 (corresponding to the first embodiment: model 1), the thicknesses t1 and t2 and the widths d1 and d2 are considered. The case where the thicknesses t1, t2, the widths d1, d2, and the lengths s1, s2 are taken into account (model 3) will be described. In the model X1, only the thickness is considered in the part X1, that is, the extension of the opening part and the extension of the non-opening part are not distinguished in the X direction (FIG. 32A). The model 2 considers the thickness and width in the portion X1, that is, does not distinguish between the extension of the opening portion and the extension of the non-opening portion in the X direction (FIG. 32B). In the model 3, the thickness, width and length are considered in the portion X1, that is, only the beams 121a and 121b are assumed to extend in the X direction (FIG. 32C).

Measured values were compared with calculated values in each of the above three types of models 1 to 3. FIG. 33 shows measured values (FIG. 33A) and model 1 calculated values (FIG. 33B). FIG. 34 shows measured values ((A) of FIG. 34) and calculated values of model 2 ((B) of FIG. 34). FIG. 35 shows measured values (FIG. 35A) and model 3 calculated values (FIG. 35B). Note that the actual measurement values are actual measurements of the opening position with the metal mask stretched on the frame. Further, in each calculated value of the models 1 to 3, the position shift amount at the end (1, 15) in the X direction was set to zero. This assumes a state where the opening position of the outer peripheral portion of the mask is attached to the frame 110 as an ideal position (design position). In addition, there were a total of 7 Y-direction series, and 15 measurement points in each series were set in the X direction. Accordingly, there are a total of seven curves in each figure.

As a result, it can be seen that the calculated value of any model has the same tendency as the actually measured value, and it can be seen that the correction effect can be obtained with any model. In particular, it was also found that the calculated value of model 2 in FIG. 34 is closest to the actually measured value. That is, it was found that more accuracy can be obtained when the thickness and width are taken into consideration. Further, it was found that there is no problem even if the tension in the direction (Y direction) perpendicular to the tension direction (X direction) is ignored.

<Application example>
An application example of the vapor deposition mask described in the above embodiment and modifications will be described. The vapor deposition mask or the vapor deposition mask manufacturing method of the above embodiment can be suitably used, for example, in the manufacturing process of an organic EL display device.

FIG. 36 shows the flow of manufacturing the organic EL display device. As described above, the organic EL display device includes the first electrode formation process (step S51), the organic layer deposition process (step S52), the second electrode formation process (step S53), and the sealing process (step S54). Among these, in the organic layer vapor deposition step (S52), for example, when the organic electroluminescent layer is formed by vapor deposition, the vapor deposition mask of the above-described embodiment or the like can be used.

FIG. 37 shows an image of the organic layer deposition process. In this way, during vapor deposition, for example, in the vapor deposition apparatus, the vapor deposition mask 1 (frame 110, metal mask M1) moves at a constant speed above the vapor deposition source 13 while being in close contact with the substrate 11. The organic material (organic EL material 12) is diffused as vapor 12a from the vapor deposition source 13 and adheres to the substrate 11 through the vapor deposition mask 1.

As described above, in the manufacturing process of the organic EL display device, by using the vapor deposition mask according to the above-described embodiment or the like, it is possible to design a pixel with high accuracy and to realize high definition of the pixel. In addition, longer life and higher brightness can be expected.

As mentioned above, although embodiment, the modification, and the application example were demonstrated, this indication content is not limited to these embodiment etc., A various deformation | transformation is possible. For example, in the above-described embodiment and the like, the case where the opening position shift amount is obtained by calculation based on the distribution such as the thickness of the metal mask has been described as an example, but the present disclosure is not limited thereto. For example, the opening position may be measured in a state where the metal mask is actually welded to the frame after being manufactured. In this case, a correction value may be set based on the measured opening position shift amount. However, as described in the above embodiments and the like, it is preferable to obtain the opening position shift amount by calculation because the number of steps and processing time can be greatly reduced.

In the above-described embodiment and the like, the case where the metal mask is manufactured by electroforming has been described as an example. However, the present disclosure can be applied to the case where the metal mask is manufactured by etching.

Furthermore, in the above-described embodiment and the like, the example in which the vapor deposition mask is used in the manufacturing process of the organic EL display device has been described. However, the vapor deposition mask of the present disclosure is not limited to an organic material, and may be applied to a vapor deposition process of a metal material, a dielectric material, or the like, for example. Alternatively, the mask may be used not only for vapor deposition but also for exposure or printing, and can be widely applied to masks that require high accuracy.

Further, the effects described in the above embodiments and the like are examples, and other effects may be included or further effects may be included.

The present disclosure can be configured as follows.
(1)
Forming a first mask having a plurality of first openings as passage holes for the vapor deposition material;
Stretching the first mask on the frame;
A method for manufacturing a vapor deposition mask, wherein, when forming the first mask, correction is performed in consideration of an opening position shift amount when the first opening is stretched to the frame when designing the position of the first opening.
(2)
When forming the first mask,
Preparing a second mask having a plurality of second openings;
Calculating the opening position shift amount using the second mask;
Set the correction value based on the calculated opening position shift amount,
The vapor deposition mask manufacturing method according to (1), wherein correction using the correction value is performed when designing the position of the first opening.
(3)
The method for manufacturing a vapor deposition mask according to (2), wherein the opening position shift amount is calculated based on a thickness distribution of the second mask.
(4)
The method for manufacturing an evaporation mask according to (3), wherein the opening position shift amount is calculated using a one-dimensional model considering only a first direction of the mask pulling direction when the frame is stretched.
(5)
The surface shape of the first and second masks is rectangular,
The said 1st direction is a manufacturing method of the mask for vapor deposition as described in said (4) which is the said rectangular-shaped longitudinal direction.
(6)
The method for manufacturing an evaporation mask according to (4) or (5), wherein the opening position shift amount at both ends of the second mask in the first direction is set to 0 (zero).
(7)
When forming the first mask,
The second mask is formed a plurality of times while adjusting process conditions until the design error becomes a predetermined threshold value or less,
The process for producing a vapor deposition mask according to (2) above, wherein a process condition in which the design error is equal to or less than the threshold is set as a process condition of the first mask.
(8)
Further measuring the width along the second direction of the beam portion between the second openings in a second direction orthogonal to the first direction;
The method of manufacturing a deposition mask according to (3), wherein the opening position shift amount is calculated based on the measured thickness and width.
(9)
Further measuring the length of the beam portion along the first direction;
The method for manufacturing a deposition mask according to (8), wherein the opening position shift amount is calculated based on the measured thickness, width, and length.
(10)
When designing the position of the first opening, correction is performed in consideration of the opening position shift amount in each of the first and second directions orthogonal to each other in the mask pulling direction. The manufacturing method of the mask for vapor deposition in any one of.
(11)
In designing the position of the first opening, correction is performed in consideration of the opening position shift amount in any one of the first and second directions orthogonal to each other in the mask pulling direction. ) To (9). A method for producing an evaporation mask according to any one of the above.
(12)
In the setting of the correction value, the position shift amount of the second opening which is selective among all the openings of the second mask is used. The vapor deposition according to any one of the above (2) to (11) Mask manufacturing method.
(13)
Dividing the second mask into a plurality of areas each having a similar tendency of the opening position shift amount;
The vapor deposition mask manufacturing method according to any one of (2) to (12), wherein correction is performed using a representative correction value set for each area when the position of the first opening is designed.
(14)
Each of the plurality of areas extends along a first direction of the mask pulling directions and is divided along a second direction orthogonal to the first direction. (13) Of manufacturing a mask for vapor deposition.
(15)
The said representative correction value is set using the average of the said opening position shift amount in each of these areas, The manufacturing method of the mask for vapor deposition as described in said (14).
(16)
Forming a plurality of the second masks;
The said representative correction value is set using the average of the opening position shift amount of the area corresponding between several said 2nd masks, The manufacturing method of the mask for vapor deposition as described in said (14).
(17)
The method for manufacturing an evaporation mask according to any one of (2) to (16), wherein the first and second masks are formed by electroforming.
(18)
The mask used when forming the second mask is made of a material less expensive than the mask used when forming the first mask. Any of the above (2) to (16) A method for producing a vapor deposition mask according to claim 1.
(19)
When forming the first mask, a glass mask is used,
A film mask is used when forming the second mask. The method for manufacturing a vapor deposition mask according to (18).
(20)
The method for manufacturing an evaporation mask according to any one of (2) to (19), wherein the first and second masks are formed by etching.
(21)
When forming the first mask,
Preparing a second mask having a plurality of second openings;
In a state where the second mask is stretched on the frame, the opening position shift amount is measured,
Set the correction value based on the measured opening position shift amount,
The vapor deposition mask manufacturing method according to (1), wherein correction using the correction value is performed when designing the position of the first opening.
(22)
Forming a deposition mask,
Patterning the material layer using the vapor deposition mask;
When forming the evaporation mask,
Forming a first mask having a plurality of first openings as passage holes for the vapor deposition material;
The first mask is stretched on the frame, and the first mask is corrected in consideration of the opening position shift amount when stretched to the frame when designing the position of the first opening. Manufacturing method of display device.
(23)
The method for manufacturing a display device according to (22), wherein the material layer is an organic electroluminescent layer.

This application claims priority on the basis of Japanese Patent Application No. 2014-69045 filed on March 28, 2014 at the Japan Patent Office. The entire contents of this application are incorporated herein by reference. This is incorporated into the application.

Those skilled in the art will envision various modifications, combinations, subcombinations, and changes, depending on design requirements and other factors, which are within the scope of the appended claims and their equivalents. It is understood that

Claims (23)

1. Forming a first mask having a plurality of first openings as through holes for the vapor deposition material;
   Stretching the first mask on the frame;
   A method for manufacturing a vapor deposition mask, wherein, when forming the first mask, correction is performed in consideration of an opening position shift amount when the first opening is stretched to the frame when designing the position of the first opening.
2. When forming the first mask,
   Preparing a second mask having a plurality of second openings;
   Calculating the opening position shift amount using the second mask;
   Set the correction value based on the calculated opening position shift amount,
   The method for manufacturing an evaporation mask according to claim 1, wherein correction using the correction value is performed when designing the position of the first opening.
3. The method for manufacturing an evaporation mask according to claim 2, wherein the opening position shift amount is calculated based on a thickness distribution of the second mask.
4. The evaporation mask manufacturing method according to claim 3, wherein the opening position shift amount is calculated using a one-dimensional model considering only the first direction of the mask pulling direction when the frame is stretched.
5. The surface shape of the first and second masks is rectangular,
   The method for manufacturing a vapor deposition mask according to claim 4, wherein the first direction is a longitudinal direction of the rectangular shape.
6. The method for manufacturing an evaporation mask according to claim 4, wherein the opening position shift amount at both end portions in the first direction of the second mask is set to 0 (zero).
7. When forming the first mask,
   The second mask is formed a plurality of times while adjusting process conditions until the design error becomes a predetermined threshold value or less,
   The method for manufacturing an evaporation mask according to claim 2, wherein a process condition in which the design error is equal to or less than the threshold is set as a process condition of the first mask.
8. Further measuring the width along the second direction of the beam portion between the second openings in a second direction orthogonal to the first direction;
   The method for manufacturing an evaporation mask according to claim 3, wherein the opening position shift amount is calculated based on the measured thickness and width.
9. Further measuring the length of the beam portion along the first direction;
   The method for manufacturing an evaporation mask according to claim 8, wherein the opening position shift amount is calculated based on the measured thickness, width, and length.
10. 2. The vapor deposition according to claim 1, wherein in designing the position of the first opening, correction is performed in consideration of the opening position shift amount in each of the first and second directions orthogonal to each other in the mask pulling direction. Manufacturing method for a mask.
11. 2. The position of the first opening is corrected in consideration of the opening position shift amount in any one of the first and second directions orthogonal to each other in the mask pulling direction. The manufacturing method of the mask for vapor deposition as described in any one of.
12. The method for manufacturing an evaporation mask according to claim 2, wherein when the correction value is set, a selective positional shift amount of the second opening among all the openings of the second mask is used.
13. Dividing the second mask into a plurality of areas each having a similar tendency of the opening position shift amount;
    The method for manufacturing an evaporation mask according to claim 2, wherein correction is performed using a representative correction value set for each area when designing the position of the first opening.
14. The plurality of areas each extend along a first direction in a mask pulling direction and are divided along a second direction orthogonal to the first direction. A method for manufacturing a mask for vapor deposition.
15. The method for manufacturing an evaporation mask according to claim 14, wherein the representative correction value is set using an average of the opening position shift amounts in each of the plurality of areas.
16. Forming a plurality of the second masks;
    The method for manufacturing an evaporation mask according to claim 14, wherein the representative correction value is set using an average of opening position shift amounts of corresponding areas between the plurality of second masks.
17. The method for manufacturing a vapor deposition mask according to claim 2, wherein the first and second masks are formed by electroforming.
18. The evaporation mask according to claim 2, wherein the mask used when forming the second mask is made of a material that is less expensive than the mask used when forming the first mask. Production method.
19. When forming the first mask, a glass mask is used,
    The method for manufacturing a vapor deposition mask according to claim 18, wherein a film mask is used when forming the second mask.
20. The method for manufacturing a deposition mask according to claim 2, wherein the first and second masks are formed by etching.
21. When forming the first mask,
    Preparing a second mask having a plurality of second openings;
    In a state where the second mask is stretched on the frame, the opening position shift amount is measured,
    Set the correction value based on the measured opening position shift amount,
    The method for manufacturing an evaporation mask according to claim 1, wherein correction using the correction value is performed when designing the position of the first opening.
22. Forming a deposition mask,
    Patterning the material layer using the vapor deposition mask;
    When forming the evaporation mask,
    Forming a first mask having a plurality of first openings as passage holes for the vapor deposition material;
    The first mask is stretched on the frame, and the first mask is corrected in consideration of the opening position shift amount when stretched to the frame when designing the position of the first opening. Manufacturing method of display device.
23. The method for manufacturing a display device according to claim 22, wherein the material layer is an organic electroluminescent layer.

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