WO2015022965A1 - Polymerizable composition containing reactive silicone compound - Google Patents
Polymerizable composition containing reactive silicone compound Download PDFInfo
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- WO2015022965A1 WO2015022965A1 PCT/JP2014/071320 JP2014071320W WO2015022965A1 WO 2015022965 A1 WO2015022965 A1 WO 2015022965A1 JP 2014071320 W JP2014071320 W JP 2014071320W WO 2015022965 A1 WO2015022965 A1 WO 2015022965A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
- C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/068—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
Definitions
- the present invention relates to a polymerizable composition containing a reactive silicone compound, a cured product obtained from the composition, and a method for producing a molded body using the composition.
- the glass transition temperature (hereinafter also referred to as Tg) needs to be at least 140 ° C. empirically.
- Tg the glass transition temperature of the cured product obtained from the composition of Patent Document 1 is as low as 50 to 96 ° C., and it is difficult to use it in a device exposed to high temperatures.
- An object of the present invention is to provide a liquid curable resin having no coloration (yellowing) even when exposed to a high temperature and having a Tg of a cured product of 140 ° C. or higher.
- the present inventors have found that a reactive silicone compound having a specific structure, an alicyclic group having 3 to 30 carbon atoms in the molecule and one radical as a polymerizable monomer.
- a compound having a polymerizable double bond and / or a maleimide derivative there is very little coloration (yellowing) due to heating, and a polymerization property capable of producing a cured product exhibiting a high Tg and a high refractive index.
- the present inventors have found that a composition can be obtained and completed the present invention.
- the present invention provides a first aspect as follows: (A) 100 parts by mass of a reactive silicone compound obtained by polycondensation of a diaryl silicate compound represented by the formula [1] and an alkoxysilicon compound represented by the formula [2] in the presence of an acid or a base; And (b) (b1) at least one polymerization selected from the group consisting of a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative
- the present invention relates to a polymerizable composition containing 20 to 100 parts by mass of a polymerizable monomer.
- Ar 1 and Ar 2 each independently represent a phenyl group which may be substituted with an alkyl group having 1 to 6 carbon atoms; Ar 3 represents at least one group having a polymerizable double bond
- the present invention relates to the polymerizable composition according to the first aspect, wherein (b1) is a (meth) acrylate compound.
- the present invention relates to the polymerizable composition according to the second aspect, wherein (b1) is a compound represented by the formula [3].
- R 3 represents a hydrogen atom or a methyl group
- L represents a single bond or an alkylene group having 1 to 6 carbon atoms
- R 4 represents an alicyclic group having 3 to 30 carbon atoms.
- the present invention relates to the polymerizable composition according to the third aspect, wherein L represents a single bond.
- the present invention relates to the polymerizable composition according to any one of the first aspect to the fourth aspect, in which the alicyclic group is an organic group having a crosslinked ring structure.
- the organic group is an organic group having at least one bridged ring structure selected from the group consisting of a norbornane ring, an adamantane ring, and a tricyclo [5.2.1.0 2,6 ] decane ring.
- the polymerizable composition according to the fifth aspect is an organic group having at least one bridged ring structure selected from the group consisting of a norbornane ring, an adamantane ring, and a tricyclo [5.2.1.0 2,6 ] decane ring.
- the present invention relates to the polymerizable composition according to any one of the first aspect to the sixth aspect, wherein (b2) is a compound represented by the formula [4].
- the (b) polymerizable monomer is (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative.
- the present invention relates to the polymerizable composition according to any one of the first to seventh aspects.
- the (a) reactive silicone compound is obtained by polycondensation of a compound represented by the formula [5] and a compound represented by the formula [6] in the presence of an acid or a base.
- the polymerizable composition according to any one of the first to eighth aspects which is a polymerizable silicone compound.
- R 1 represents the same meaning as described above.
- the present invention relates to a cured product obtained by photopolymerization or thermal polymerization of the polymerizable composition according to any one of the first to ninth aspects.
- As an 11th viewpoint it is related with the hardening relief pattern obtained from the polymeric composition in any one of a 1st viewpoint thru
- a 12th viewpoint it is related with the optical lens obtained from the polymeric composition in any one of a 1st viewpoint thru
- the present invention relates to a high refractive index resin lens material comprising the polymerizable composition according to any one of the first to ninth aspects.
- the present invention relates to the manufacturing method according to the fourteenth aspect, in which the molded body is a microlens array.
- a reactive silicone compound having a specific structure, a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule as a polymerizable monomer, and / or a maleimide derivative can be combined to obtain a polymerizable composition capable of producing a cured product having very little coloration (yellowing) due to heating and having a high Tg and a high refractive index.
- the polymerizable composition of the present invention having the above characteristics can easily mold a cured relief pattern typified by a lens array by various molding methods, and the obtained molded body is required to have a high heat resistance of 200 ° C. or higher. It can be used with high reliability even in a device.
- FIG. 1 is a diagram showing a 1 H NMR spectrum of the reactive silicone compound obtained in Production Example 1.
- FIG. 2 is an SEM image of the microlens array produced in Example 9.
- the present invention provides (a) reactivity obtained by polycondensation of a diaryl silicate compound represented by the above formula [1] and an alkoxy silicon compound represented by the above formula [2] in the presence of an acid or a base. Selected from the group consisting of 100 parts by mass of a silicone compound, (b) (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative And a polymerizable composition containing 20 to 100 parts by mass of at least one polymerizable monomer.
- the (a) reactive silicone compound used in the present invention is a compound obtained by polycondensation of a diaryl silicate compound having a specific structure and an alkoxy silicon compound having a specific structure in the presence of an acid or a base.
- diaryl silicate compound The diaryl silicate compound is a compound represented by the following formula [1].
- Ar 1 and Ar 2 each independently represent a phenyl group which may be substituted with an alkyl group having 1 to 6 carbon atoms.
- Ar 1 and Ar 2 include a phenyl group, o-tolyl group, m-tolyl group, p-tolyl group, 4-ethylphenyl group, 4-isopropylphenyl group, 4-tert-butylphenyl group, 3, Examples include 5-dimethylphenyl group, 3,5-diethylphenyl group, 3,5-diisopropylphenyl group, 2,4,6-trimethylphenyl group.
- Specific examples of the compound represented by the above formula [1] include diphenylsilanediol, di-p-tolylsilanediol, bis (4-ethylphenyl) silanediol, bis (4-isopropylphenyl) silanediol and the like. However, it is not limited to these.
- alkoxysilicon compounds The alkoxy silicon compound having the specific structure is a compound represented by the following formula [2].
- Ar 3 represents a phenyl group having at least one group having a polymerizable double bond, or a naphthyl group having at least one group having a polymerizable double bond
- R 1 is a methyl group
- R 2 represents a methyl group, an ethyl group or a vinylphenyl group
- a represents 2 or 3.
- Examples of the phenyl group having at least one group having a polymerizable double bond represented by Ar 3 include 2-vinylphenyl group, 3-vinylphenyl group, 4-vinylphenyl group, 4-vinyloxyphenyl group, 4 -Allylphenyl group, 4-allyloxyphenyl group, 4-isopropenylphenyl group and the like.
- Examples of the naphthyl group having at least one group having a polymerizable double bond represented by Ar 3 include a 4-vinylnaphthalen-1-yl group and a 6-vinylnaphthalen-2-yl group.
- Specific examples of the compound represented by the above formula [2] include, for example, trimethoxy (4-vinylphenyl) silane, triethoxy (4-vinylphenyl) silane, dimethoxy (methyl) (4-vinylphenyl) silane, dimethoxybis Examples include (4-vinylphenyl) silane, but are not limited thereto.
- the reactive silicone compound (a) is a reactive silicone obtained by polycondensation of a compound represented by the following formula [5] and a compound represented by the following formula [6] in the presence of an acid or a base. Compounds are preferred.
- R 1 represents the same meaning as described above.
- the polycondensation reaction between the diaryl silicate compound represented by the above formula [1] and the alkoxysilicon compound represented by the above formula [2] is preferably carried out in the presence of an acid or a basic catalyst.
- the type of the catalyst used for the polycondensation reaction is not particularly limited as long as it is dissolved or uniformly dispersed in the solvent described later, and can be appropriately selected and used as necessary.
- catalysts examples include B (OR) 3 , Al (OR) 3 , Ti (OR) 4 , and Zr (OR) 4 as acidic compounds; alkali metal hydroxides as basic compounds, Alkaline earth metal hydroxides, ammonium salts, amines, etc .;
- fluoride salts include NH 4 F, NR 4 F, and the like.
- R is selected from the group consisting of a hydrogen atom, a linear alkyl group having 1 to 12 carbon atoms, a branched alkyl group having 3 to 12 carbon atoms, and a cyclic alkyl group having 3 to 12 carbon atoms.
- the acidic compound examples include boric acid, trimethoxyboron, triethoxyboron, tri-n-propoxyboron, triisopropoxyboron, tri-n-butoxyboron, triisobutoxyboron, tri-sec-butoxyboron, Tri-tert-butoxyboron, trimethoxyaluminum, triethoxyaluminum, tri-n-propoxyaluminum, triisopropoxyaluminum, tri-n-butoxyaluminum, triisobutoxyaluminum, tri-sec-butoxyaluminum, tri-tert- Butoxyaluminum, tetramethoxytitanium, tetraethoxytitanium, tetra-n-propoxytitanium, tetraisopropoxytitanium (titanium tetraisopropoxide), tetra-n-butoxytitanium, te Lysobutoxy titanium, tetra-
- Examples of the basic compound include sodium hydroxide, potassium hydroxide, magnesium hydroxide, calcium hydroxide, strontium hydroxide, barium hydroxide, ammonium hydroxide, tetramethylammonium hydroxide, tetrabutylammonium hydroxide, triethylamine. Etc.
- fluoride salt examples include ammonium fluoride, tetramethylammonium fluoride, and tetrabutylammonium fluoride.
- one or more selected from the group consisting of tetraisopropoxy titanium (titanium tetraisopropoxide), magnesium hydroxide, calcium hydroxide, strontium hydroxide, and barium hydroxide is preferably used.
- the amount of the catalyst used is 0.01 to 10% by mass, preferably 0.1 to 5% by mass, based on the total mass of the diaryl silicate compound and the alkoxysilicon compound. The reaction proceeds more favorably when the amount of the catalyst used is 0.01% by mass or more. In consideration of economy, the use of 10% by mass or less is sufficient.
- the reactive silicone compound according to the present invention is characterized by the structure of the alkoxysilicon compound.
- the reactive group (polymerizable double bond) contained in the alkoxysilicon compound used in the present invention is easily polymerized radically or ionically (anion, cation), and has high heat resistance after polymerization (after curing). Show.
- an alkoxysilicon compound and a diarylsilicate compound are polycondensed to obtain a silicone compound having high heat resistance, it is necessary to stop the reaction at an appropriate degree of polymerization so that the product maintains a liquid state.
- the alkoxysilicon compound used in the present invention does not actively hydrolyze, the polycondensation reaction with the diaryl silicate compound is gentle, and the degree of polymerization is easily controlled.
- the polycondensation reaction of the alkoxy silicon compound and the diaryl silicate compound by dealcoholization can be carried out in the absence of a solvent, but it is also possible to use a solvent inert to the alkoxy silicon compound such as toluene as the reaction solvent. .
- a solvent inert to the alkoxy silicon compound such as toluene
- the reaction solvent When there is no solvent, there is an advantage that the alcohol as a reaction by-product can be easily distilled off.
- a reaction solvent there are advantages that the reaction system can be easily made uniform and a more stable polycondensation reaction can be performed.
- the reactive reaction of the reactive silicone compound may be performed without a solvent as described above, but there is no problem even if a solvent is used in order to make it more uniform.
- the solvent is not particularly limited as long as it does not react with the diaryl silicate compound and the alkoxysilicon compound and dissolves the condensate thereof.
- reaction solvent examples include ketones such as acetone and methyl ethyl ketone (MEK); aromatic hydrocarbons such as benzene, toluene and xylene; glycols such as ethylene glycol, propylene glycol and hexylene glycol; ethyl cellosolve Glycol ethers such as butyl cellosolve, ethyl carbitol, butyl carbitol, diethyl cellosolve and diethyl carbitol; amides such as N-methyl-2-pyrrolidone (NMP) and N, N-dimethylformamide (DMF) It is done.
- NMP N-methyl-2-pyrrolidone
- DMF N-dimethylformamide
- the reactive silicone compound used in the present invention comprises a dealcoholization condensation of a diaryl silicate compound represented by the formula [1] and an alkoxy silicon compound represented by the formula [2] in the presence of an acid or a basic catalyst. Is obtained.
- the reaction is preferably performed in an inert gas atmosphere such as nitrogen gas for the purpose of preventing moisture from entering.
- the reaction temperature is 20 to 150 ° C, more preferably 30 to 120 ° C.
- the reaction time is not particularly limited as long as it is longer than the time necessary for the molecular weight distribution of the polycondensate to increase and to stabilize the molecular weight distribution, and more specifically, several hours to several days.
- the reactive silicone compound obtained by any method such as filtration and solvent distillation it is preferable to collect the reactive silicone compound obtained by any method such as filtration and solvent distillation, and appropriately perform a purification treatment as necessary.
- the polycondensate obtained by such a reaction has a weight average molecular weight Mw measured in terms of polystyrene by gel permeation chromatography (GPC) of 500 to 10,000, and a dispersity Mw (weight average molecular weight) / Mn (Number average molecular weight) is 1.0 to 10.
- the (b) polymerizable monomer used in the present invention comprises (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative. And at least one polymerizable monomer selected from the group.
- the compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule used in the present invention is preferably an organic group in which the alicyclic group has a crosslinked ring structure, and a norbornane ring And an organic group having at least one kind of a bridged ring structure selected from the group consisting of an adamantane ring and a tricyclo [5.2.1.0 2,6 ] decane ring.
- Examples of the alicyclic group having 3 to 30 carbon atoms include cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, 3,3,5-trimethylcyclohexyl group, 4-tert-butylcyclohexyl group, menthyl group, Isobornyl, norbornyl, 1-adamantyl, 2-adamantyl, 2-methyladamantan-2-yl, 2-ethyladamantan-2-yl, tricyclo [5.2.1.0 2,6 ] decanyl Groups and the like.
- isobornyl group, norbornyl group, 1-adamantyl group, 2-adamantyl group, 2-methyladamantan-2-yl group, 2-ethyladamantan-2-yl group, tricyclo [5.2.1.0 2,6 A decanyl group is preferred.
- the compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule used in the present invention is preferably a (meth) acrylate compound, particularly a compound represented by the following formula [3] Is preferred.
- the (meth) acrylate compound refers to both an acrylate compound and a methacrylate compound.
- (meth) acrylic acid refers to acrylic acid and methacrylic acid.
- R 3 represents a hydrogen atom or a methyl group
- L represents a single bond or an alkylene group having 1 to 6 carbon atoms
- R 4 represents an alicyclic group having 3 to 30 carbon atoms. .
- L is, for example, a chain of methylene, ethylene, trimethylene, methylethylene, tetramethylene, 1-methyltrimethylene, pentamethylene, 2,2-dimethyltrimethylene, hexamethylene, etc. Or a branched alkylene group; cyclopropane-1,2-diyl group, cyclobutane-1,2-diyl group, cyclobutane-1,3-diyl group, cyclopentane-1,2-diyl group, cyclopentane-1, And cyclic alkylene groups such as a 3-diyl group, a cyclohexane-1,2-diyl group, a cyclohexane-1,3-diyl group, and a cyclohexane-1,4-diyl group.
- L is preferably a single bond, a methylene group or an ethylene group, and more preferably a single bond.
- Examples of the suitable compound (b1) having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule include cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, 3, 3,5-trimethylcyclohexyl (meth) acrylate, 4-tert-butylcyclohexyl (meth) acrylate, menthyl (meth) acrylate, isobornyl (meth) acrylate, norbornyl (meth) acrylate, 1-adamantyl (meth) acrylate, 2- Adamantyl (meth) acrylate, 2-methyladamantan-2-yl (meth) acrylate, 2-ethyladamantan-2-yl (meth) acrylate, tricyclo [5.2.1.0 2,6 ] decanyl (meth) acrylate Etc.
- the maleimide derivative used in the present invention is preferably a compound represented by the following formula [4].
- R 5 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an optionally substituted aromatic group having 6 to 12 carbon atoms, or a hydroxy group.
- alkyl group having 1 to 12 carbon atoms represented by R 5 examples include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl, isoamyl, neopentyl, tert-amyl, sec-isoamyl, cyclopentyl, n-hexyl, cyclohexyl, n-heptyl, n-octyl, benzyl, phenethyl, naphthylmethyl Group, naphthylethyl group and the like.
- Examples of the aromatic group having 6 to 12 carbon atoms represented by R 5 include a phenyl group and a naphthyl group.
- Examples of the substituent include an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group, a halogen atom, and a hydroxy group.
- Examples of the alkyl group having 1 to 6 carbon atoms as the substituent include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, and a tert-butyl group.
- N-pentyl group isoamyl group, neopentyl group, tert-amyl group, sec-isoamyl group, cyclopentyl group, n-hexyl group, cyclohexyl group and the like.
- alkoxy group having 1 to 6 carbon atoms as the substituent include methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, isobutoxy group, sec-butoxy group, tert-butoxy group.
- R 5 is preferably a cyclohexyl group or a phenyl group, and more preferably a cyclohexyl group.
- the (b) polymerizable monomer comprises both (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative. It is preferable.
- the content of the polymerizable monomer (b) is 20 to 100 parts by mass, more preferably 25 to 60 parts by mass with respect to 100 parts by mass of the (a) reactive silicone compound.
- the polymerizable composition of the present invention may contain (c) a polymerization initiator in addition to (a) the reactive silicone compound and (b) the polymerizable monomer.
- a polymerization initiator any of a photopolymerization initiator and a thermal polymerization initiator can be used.
- photopolymerization initiator examples include alkylphenones, benzophenones, acylphosphine oxides, Michler's benzoylbenzoates, oxime esters, tetramethylthiuram monosulfides, and thioxanthones.
- photocleavable photoradical polymerization initiators are preferred.
- examples of the photocleavable photoradical polymerization initiator include those described in the latest UV curing technology (p. 159, publisher: Kazuhiro Takahisa, publisher: Technical Information Association, published in 1991). .
- radical photopolymerization initiators examples include IRGACURE (registered trademark) 184, 369, 651, 500, 819, 907, 784, 2959, CGI 1700, CGI 1750, and CGI 1850.
- thermal polymerization initiator examples include azos and organic peroxides.
- thermal polymerization initiator examples include V-30, V-40, V-59, V-60, V-65, and V-70 [above, manufactured by Wako Pure Chemical Industries, Ltd.] Etc.
- organic peroxide thermal polymerization initiators examples include, for example, Parkadox (registered trademark) CH, BC-FF, 14, 16 and Trigonox (registered trademark) 22, 23, 121.
- the polymerization initiators When a polymerization initiator is added, the polymerization initiators may be used alone or in combination of two or more.
- the addition amount is 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass with respect to 100 parts by mass of the (a) reactive silicone compound.
- the method for preparing the polymerizable composition of the present embodiment is not particularly limited.
- a preparation method for example, the (a) component, the (b) component, and the (c) component as necessary are mixed at a predetermined ratio, and other additives are further added and mixed as desired. Or a method using a conventional solvent in addition to these components.
- the ratio of the solid content in the polymerizable composition is not particularly limited as long as each component is uniformly dissolved in the solvent, and is, for example, 1 to 50% by mass, or 1 to 30% by mass, or 1 to 25% by mass.
- the solid content is obtained by removing the solvent component from all components of the polymerizable composition.
- the solution of the polymerizable composition is preferably used after being filtered using a filter having a pore size of 0.05 to 5 ⁇ m.
- the present invention also relates to a cured product obtained by photo or thermal polymerization of the polymerizable composition.
- actinic rays used for photopolymerization include ultraviolet rays, electron beams, and X-rays.
- a light source used for ultraviolet irradiation sunlight, a chemical lamp, a low-pressure mercury lamp, a high-pressure mercury lamp, a metal halide lamp, a xenon lamp, a UV-LED, or the like can be used.
- post-baking is performed, and specifically, the polymerization can be completed by heating using a hot plate, an oven or the like.
- the post-baking conditions are not particularly limited, but are usually 50 to 260 ° C. for 1 to 120 minutes.
- the heating conditions in the thermal polymerization are not particularly limited, but are usually appropriately selected from the range of 50 to 300 ° C. and 1 to 120 minutes. Moreover, it does not specifically limit as a heating means, For example, a hotplate, oven, etc. are mentioned.
- the cured product of the present invention has a refractive index as high as 1.5 or more at a wavelength of 589 nm, and also has a dimensional stability by suppressing the occurrence of yellowing and cracks due to heating. It is useful as a material for a high refractive index resin lens such as an optical lens.
- cured material of this invention can be obtained as molded articles, such as a cured film and a laminated body, by coating the said polymeric composition on a base material and carrying out light or thermal polymerization (hardening).
- various molded bodies can be easily produced by using a conventional molding method such as compression molding, injection molding, blow molding, or vacuum molding.
- the substrate include plastics (polyesters such as polycarbonate, polymethacrylate, polystyrene, and PET (polyethylene terephthalate), polyolefins, epoxy resins, melamine resins, triacetyl cellulose, and ABS resins (acrylonitrile-butadiene-styrene copolymer).
- AS resin acrylonitrile-styrene copolymer
- norbornene resin etc.
- metal wood, paper, glass, slate and the like.
- the shape of these base materials may be a plate shape, a film shape, or a three-dimensional molded body.
- the coating method of the polymerizable composition of the present invention includes a cast coating method, a spin coating method, a blade coating method, a dip coating method, a roll coating method, a spray coating method, a bar coating method, a die coating method, an ink jet method, a printing method (letter plate). , Intaglio, lithographic, screen printing, etc.) can be selected as appropriate, and it is desirable to use a bar coating method because of the advantage that it can be applied in a short time and can be uniformly applied easily.
- the polymerizable composition used here can be suitably used in the form of a varnish.
- the thickness of the film formed by coating is usually 0.01 to 50 ⁇ m, preferably 0.05 to 30 ⁇ m, particularly preferably 0.1 to 30 ⁇ m after drying and curing.
- a method for producing a molded body for example, a step of filling the polymerizable composition in a space between the support and the mold, a step of exposing the filled composition to photopolymerization, and a step on the support
- a method for producing a molded article including a step of releasing the photopolymerized product from the mold and a step of heating the photopolymerized product together with the support.
- the molded body obtained by the above production method can be suitably used as a microlens array.
- UV exposure device Batch type UV irradiation device (high pressure mercury lamp 2kW x 1 lamp) manufactured by Eye Graphics Co., Ltd.
- Light transmittance apparatus UV-visible spectrophotometer UV-3100 manufactured by Shimadzu Corporation (6) Glass transition temperature (Tg)
- Apparatus Dynamic viscoelasticity measuring apparatus (DMA) Q800 manufactured by TA Instrument Deformation mode: Pulling frequency: 1 Hz Strain: 0.1% Measurement temperature: 25-250 ° C Temperature rising rate: 10 ° C./min (7)
- Refractive index Device Multi-wavelength Abbe refractometer DR-M4 manufactured by Atago Co., Ltd.
- ADCP Tricyclo [5.2.1.0 2,6 ] decane dimethanol diacrylate [NK Nakano Chemical Co., Ltd. NK ester A-DCP]
- ADM 1-adamantyl methacrylate [Adamantate (registered trademark) M-104, manufactured by Idemitsu Kosan Co., Ltd.]
- BZM benzyl methacrylate [manufactured by Aldrich]
- CHM N-cyclohexylmaleimide [Imirex (registered trademark) -C, manufactured by Nippon Shokubai Co., Ltd.]
- DCPM Tricyclo [5.2.1.0 2,6 ] decanyl methacrylate [manufactured by Hitachi Chemical Co., Ltd., FANCLIL (registered trademark) FA-513M]
- EPPA ethoxylated o-phenylphenol acrylate [manufactured by Shin-Nakamura Chemical Co., Ltd., NK Ester A-DCP
- Example 1 Preparation of polymerizable composition] 32 parts by mass of the reactive silicone compound produced in Production Example 1, 8 parts by mass of DCPM as a monofunctional monomer, 0.2 parts by mass of PEBHT as an antioxidant, and 2 parts by mass of I184 as a polymerization initiator are mixed and stirred at 2000 rpm for 30 minutes. A polymerizable composition was obtained by defoaming. [Production of cured product (thin film) and evaluation of transmittance reduction by heating] The polymerizable composition was applied on a glass substrate with an applicator having a gap of 25 ⁇ m.
- This coating film was subjected to UV exposure at 20 mW / cm 2 (365 nm detection) for 1 minute in a nitrogen atmosphere, and further heated on a hot plate at 150 ° C. for 10 minutes to produce a cured film.
- the obtained cured film was measured for light transmittance at a wavelength of 400 nm before and after a heating test (200 ° C., 3 hours), and evaluated for a decrease in transmittance due to heating. The results are shown in Table 1.
- the above-mentioned polymerizable composition was poured into a 200 ⁇ m-thick silicone mold obtained by cutting out a central portion placed on a glass substrate into a rectangle of 30 mm ⁇ 5 mm, and another glass substrate was covered from above.
- the polymerizable composition in the mold sandwiched between these two glass substrates was cured by UV exposure for 1 minute at 20 mW / cm 2 (365 nm detection). After curing, the cured product obtained by removing the glass substrate and the mold was further heated in an oven at 150 ° C. for 10 minutes to prepare a cured product.
- the obtained cured product was evaluated for the glass transition temperature (Tg) and the refractive index (n d ) of the D line (wavelength 589 nm).
- Tg glass transition temperature
- n d refractive index
- the storage elastic modulus E ′ and the loss elastic modulus E ′′ are measured by DMA, and the temperature at which the value of tan ⁇ (loss elastic modulus E ′′ / storage elastic modulus E ′) obtained from these is maximum is obtained.
- Tg The results are also shown in Table 1.
- Examples 2 to 8 Comparative Examples 1 to 6
- Operations and evaluations were performed in the same manner as in Example 1 except that each component was mixed with the composition shown in Table 1. The results are also shown in Table 1.
- the cured products (Examples 1 to 8) obtained from the polymerizable composition of the present invention all showed a high Tg of 140 ° C. or higher and a high refractive index of 1.56 or higher. Even after heating at 200 ° C. for 3 hours, the decrease in transmittance due to discoloration was 1.5% or less.
- Tg is 100 ° C. or less. Further, yellowing occurred by heating at 200 ° C. for 3 hours, and the transmittance decreased by 3 to 4%.
- Example 9 Production of microlens array and evaluation of dimensional stability by heating 0.01 g of the polymerizable composition prepared in Example 6 was placed on a glass substrate, and a microlens shape was formed from above using a nanoimprinter.
- a silicon mold (lens size: ⁇ 40 ⁇ m ⁇ depth 16.5 ⁇ m, manufactured by Kyodo International Co., Ltd.) was pressure bonded.
- This polymerizable composition was cured by UV exposure at 4 mW / cm 2 (365 nm detection) for 5 minutes from the glass surface. After curing, the mold was peeled off, and further heated on a hot plate at 150 ° C. for 10 minutes to produce a microlens array on the glass substrate.
- the cured product obtained from the polymerizable composition of the present invention has a very small shape change even after heating at 200 ° C. for 3 hours, and has very high dimensional stability by heating. Results were obtained.
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Abstract
[Problem] To provide a liquid curable resin which does not undergo (yellowish) discoloration even when exposed to a high temperature environment and can be cured into an article having a Tg of 140˚C or higher.
[Solution] A polymerizable composition comprising: (a) 100 parts by mass of a reactive silicone compound that is produced by the polycondensation of a diaryl silicic acid compound represented by formula [1] with an alkoxy silicon compound represented by formula [2] in the presence of an acid or a base; and (b) 20 to 100 parts by mass of at least one polymerizable monomer selected from the group consisting of (b1) a compound having a C3-30 alicyclic group and one radically polymerizable double bond in the molecule and (b2) a maleimide derivative.
(In the formula, Ar1 and Ar2 independently represent a phenyl group which may be substituted by a C1-6 alkyl group; Ar3 represents a phenyl group which has at least one group having a polymerizable double bond, or a naphthyl group which has at least one group having a polymerizable double bond; R1 represents a methyl group or an ethyl group; R2 represents a methyl group, an ethyl group or a vinylphenyl group; and a represents 2 or 3.)
Description
本発明は、反応性シリコーン化合物を含む重合性組成物、該組成物から得られる硬化物、及び該組成物を用いた成形体の製造方法に関する。
The present invention relates to a polymerizable composition containing a reactive silicone compound, a cured product obtained from the composition, and a method for producing a molded body using the composition.
近年、液晶パネルや有機ELパネルなどのディスプレイ分野では、大画面化や高品位画質が求められている。そのため、微細なレンズが基板上に規則的に多数配列されたマイクロレンズアレイにより光の進行方向を制御し、画面輝度や開効率の向上、視野角の拡大などの検討が進められている。
マイクロレンズアレイの製造方法としては、ガラス基板上へ樹脂レンズを成形する方法が一般的である。特に無溶剤液状の硬化樹脂を用いたモールド転写による成型法は、加工プロセスの再現性が高く、安価な設備でレンズアレイを製造できることから、非常に多く用いられている。このようなレンズ成型が可能な無溶剤液状の硬化樹脂としては、その硬化物が1.6程度の高屈折率を示す、フルオレン系アクリレートを含有する硬化性樹脂組成物が開示されている(特許文献1)。 In recent years, in the display field such as a liquid crystal panel and an organic EL panel, a large screen and high-quality image quality are required. For this reason, studies are being made on controlling the light traveling direction with a microlens array in which a large number of fine lenses are regularly arranged on a substrate, improving screen brightness and opening efficiency, and widening the viewing angle.
As a manufacturing method of the microlens array, a method of molding a resin lens on a glass substrate is common. In particular, a molding method using mold transfer using a solvent-free liquid cured resin is very frequently used because the process array has high reproducibility and a lens array can be manufactured with inexpensive equipment. As such a solvent-free liquid curable resin capable of lens molding, a curable resin composition containing a fluorene-based acrylate whose cured product exhibits a high refractive index of about 1.6 is disclosed (patent) Reference 1).
マイクロレンズアレイの製造方法としては、ガラス基板上へ樹脂レンズを成形する方法が一般的である。特に無溶剤液状の硬化樹脂を用いたモールド転写による成型法は、加工プロセスの再現性が高く、安価な設備でレンズアレイを製造できることから、非常に多く用いられている。このようなレンズ成型が可能な無溶剤液状の硬化樹脂としては、その硬化物が1.6程度の高屈折率を示す、フルオレン系アクリレートを含有する硬化性樹脂組成物が開示されている(特許文献1)。 In recent years, in the display field such as a liquid crystal panel and an organic EL panel, a large screen and high-quality image quality are required. For this reason, studies are being made on controlling the light traveling direction with a microlens array in which a large number of fine lenses are regularly arranged on a substrate, improving screen brightness and opening efficiency, and widening the viewing angle.
As a manufacturing method of the microlens array, a method of molding a resin lens on a glass substrate is common. In particular, a molding method using mold transfer using a solvent-free liquid cured resin is very frequently used because the process array has high reproducibility and a lens array can be manufactured with inexpensive equipment. As such a solvent-free liquid curable resin capable of lens molding, a curable resin composition containing a fluorene-based acrylate whose cured product exhibits a high refractive index of about 1.6 is disclosed (patent) Reference 1).
上記のようなデバイス作製工程では、カラーフィルター焼成やTFTアレイ作製など200℃程度の高温下に曝されることが多い。そのため、これらの用途に使用される硬化樹脂には高屈折率であると同時に、高温下に曝されても着色(黄変)や変形が無いことが必須条件である。特に、加熱による変形を抑制するためには、経験的にガラス転移温度(以下、Tgとも称す)が少なくとも140℃以上である必要がある。
例えば、上記特許文献1の組成物から得られる硬化物のTgは50~96℃と低く、高温に曝されるデバイスでの使用は難しい。このように、上記の物性をアクリル樹脂のような汎用的な硬化樹脂で満たすことは難しく、これらの物性を全て満たす材料が求められていた。
本発明の目的は、高温に曝されても着色(黄変)がなく、硬化物のTgが140℃以上の液状硬化樹脂を提供することである。 In the device manufacturing process as described above, exposure is often performed at a high temperature of about 200 ° C. such as color filter baking and TFT array manufacturing. Therefore, it is an essential condition that the cured resin used for these applications has a high refractive index and at the same time, is not colored (yellowing) or deformed even when exposed to high temperatures. In particular, in order to suppress deformation due to heating, the glass transition temperature (hereinafter also referred to as Tg) needs to be at least 140 ° C. empirically.
For example, the Tg of the cured product obtained from the composition ofPatent Document 1 is as low as 50 to 96 ° C., and it is difficult to use it in a device exposed to high temperatures. Thus, it is difficult to satisfy the above physical properties with a general-purpose cured resin such as an acrylic resin, and a material that satisfies all of these physical properties has been demanded.
An object of the present invention is to provide a liquid curable resin having no coloration (yellowing) even when exposed to a high temperature and having a Tg of a cured product of 140 ° C. or higher.
例えば、上記特許文献1の組成物から得られる硬化物のTgは50~96℃と低く、高温に曝されるデバイスでの使用は難しい。このように、上記の物性をアクリル樹脂のような汎用的な硬化樹脂で満たすことは難しく、これらの物性を全て満たす材料が求められていた。
本発明の目的は、高温に曝されても着色(黄変)がなく、硬化物のTgが140℃以上の液状硬化樹脂を提供することである。 In the device manufacturing process as described above, exposure is often performed at a high temperature of about 200 ° C. such as color filter baking and TFT array manufacturing. Therefore, it is an essential condition that the cured resin used for these applications has a high refractive index and at the same time, is not colored (yellowing) or deformed even when exposed to high temperatures. In particular, in order to suppress deformation due to heating, the glass transition temperature (hereinafter also referred to as Tg) needs to be at least 140 ° C. empirically.
For example, the Tg of the cured product obtained from the composition of
An object of the present invention is to provide a liquid curable resin having no coloration (yellowing) even when exposed to a high temperature and having a Tg of a cured product of 140 ° C. or higher.
本発明者らは、上記目的を達成するために鋭意検討を重ねた結果、特定構造の反応性シリコーン化合物と、重合性モノマーとして分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、及び/又はマレイミド誘導体とを組合せることにより、加熱による着色(黄変)が非常に少なく、かつ高Tg、高屈折率を示す硬化物を作製可能な重合性組成物を得ることができることを見出し、本発明を完成させた。
As a result of intensive studies in order to achieve the above object, the present inventors have found that a reactive silicone compound having a specific structure, an alicyclic group having 3 to 30 carbon atoms in the molecule and one radical as a polymerizable monomer. By combining a compound having a polymerizable double bond and / or a maleimide derivative, there is very little coloration (yellowing) due to heating, and a polymerization property capable of producing a cured product exhibiting a high Tg and a high refractive index. The present inventors have found that a composition can be obtained and completed the present invention.
すなわち、本発明は、第1観点として、
(a)式[1]で表されるジアリールケイ酸化合物と式[2]で表されるアルコキシケイ素化合物とを、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物100質量部、及び
(b)(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、並びに(b2)マレイミド誘導体からなる群から選ばれる少なくとも1種類の重合性モノマー20~100質量部
を含む重合性組成物に関する。
(式中、Ar1及びAr2はそれぞれ独立して、炭素原子数1乃至6のアルキル基で置換されていてもよいフェニル基を表し、Ar3は重合性二重結合を有する基を少なくとも1つ有するフェニル基、又は重合性二重結合を有する基を少なくとも1つ有するナフチル基を表し、R1はメチル基又はエチル基を表し、R2はメチル基、エチル基又はビニルフェニル基を表し、aは2又は3を表す。)
第2観点として、前記(b1)が(メタ)アクリレート化合物である、第1観点に記載の重合性組成物に関する。
第3観点として、前記(b1)が式[3]で表される化合物である、第2観点に記載の重合性組成物に関する。
(式中、R3は水素原子又はメチル基を表し、Lは単結合又は炭素原子数1乃至6のアルキレン基を表し、R4は炭素原子数3乃至30の脂環基を表す。)
第4観点として、前記Lが単結合を表す、第3観点に記載の重合性組成物に関する。
第5観点として、前記脂環基が架橋環構造を有する有機基である、第1観点乃至第4観点のうち何れか一つに記載の重合性組成物に関する。
第6観点として、前記有機基が、ノルボルナン環、アダマンタン環及びトリシクロ[5.2.1.02,6]デカン環からなる群から選ばれる少なくとも1種類の架橋環構造を有する有機基である、第5観点に記載の重合性組成物に関する。
第7観点として、前記(b2)が式[4]で表される化合物である、第1観点乃至第6観点のうち何れか一つに記載の重合性組成物に関する。
(式中、R5は水素原子、炭素原子数1乃至12のアルキル基、置換されていてもよい炭素原子数6乃至12の芳香族基、又はヒドロキシ基を表す。)
第8観点として、前記(b)重合性モノマーが、(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、並びに(b2)マレイミド誘導体の双方からなる、第1観点乃至第7観点のうち何れか一つに記載の重合性組成物に関する。
第9観点として、前記(a)反応性シリコーン化合物が、式[5]で表される化合物と式[6]で表される化合物とを、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物である、第1観点乃至第8観点のうち何れか一つに記載の重合性組成物に関する。
(式中、R1は前記と同じ意味を表す。)
第10観点として、第1観点乃至第9観点の何れかに記載の重合性組成物を光又は熱重合して得られる、硬化物に関する。
第11観点として、第1観点乃至第9観点の何れかに記載の重合性組成物から得られる、硬化レリーフパターンに関する。
第12観点として、第1観点乃至第9観点の何れかに記載の重合性組成物から得られる、光学レンズに関する。
第13観点として、第1観点乃至第9観点の何れかに記載の重合性組成物からなる高屈折率樹脂レンズ用材料に関する。
第14観点として、第1観点乃至第9観点の何れかに記載の重合性組成物を、支持体と鋳型との間の空間に充填する工程、当該充填された組成物を露光して光重合する工程、支持体上の光重合物を鋳型から離型する工程、光重合物を支持体ごと加熱する工程、を含む成形体の製造方法に関する。
第15観点として、前記成形体がマイクロレンズアレイである、第14観点に記載の製造方法に関する。 That is, the present invention provides a first aspect as follows:
(A) 100 parts by mass of a reactive silicone compound obtained by polycondensation of a diaryl silicate compound represented by the formula [1] and an alkoxysilicon compound represented by the formula [2] in the presence of an acid or a base; And (b) (b1) at least one polymerization selected from the group consisting of a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative The present invention relates to a polymerizable composition containing 20 to 100 parts by mass of a polymerizable monomer.
(In the formula, Ar 1 and Ar 2 each independently represent a phenyl group which may be substituted with an alkyl group having 1 to 6 carbon atoms; Ar 3 represents at least one group having a polymerizable double bond) One phenyl group, or a naphthyl group having at least one group having a polymerizable double bond, R 1 represents a methyl group or an ethyl group, R 2 represents a methyl group, an ethyl group, or a vinylphenyl group, a represents 2 or 3.)
As a second aspect, the present invention relates to the polymerizable composition according to the first aspect, wherein (b1) is a (meth) acrylate compound.
As a third aspect, the present invention relates to the polymerizable composition according to the second aspect, wherein (b1) is a compound represented by the formula [3].
(In the formula, R 3 represents a hydrogen atom or a methyl group, L represents a single bond or an alkylene group having 1 to 6 carbon atoms, and R 4 represents an alicyclic group having 3 to 30 carbon atoms.)
As a fourth aspect, the present invention relates to the polymerizable composition according to the third aspect, wherein L represents a single bond.
As a fifth aspect, the present invention relates to the polymerizable composition according to any one of the first aspect to the fourth aspect, in which the alicyclic group is an organic group having a crosslinked ring structure.
As a sixth aspect, the organic group is an organic group having at least one bridged ring structure selected from the group consisting of a norbornane ring, an adamantane ring, and a tricyclo [5.2.1.0 2,6 ] decane ring. And the polymerizable composition according to the fifth aspect.
As a seventh aspect, the present invention relates to the polymerizable composition according to any one of the first aspect to the sixth aspect, wherein (b2) is a compound represented by the formula [4].
(Wherein R 5 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an optionally substituted aromatic group having 6 to 12 carbon atoms, or a hydroxy group.)
As an eighth aspect, the (b) polymerizable monomer is (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative. The present invention relates to the polymerizable composition according to any one of the first to seventh aspects.
As a ninth aspect, the (a) reactive silicone compound is obtained by polycondensation of a compound represented by the formula [5] and a compound represented by the formula [6] in the presence of an acid or a base. The polymerizable composition according to any one of the first to eighth aspects, which is a polymerizable silicone compound.
(Wherein R 1 represents the same meaning as described above.)
As a tenth aspect, the present invention relates to a cured product obtained by photopolymerization or thermal polymerization of the polymerizable composition according to any one of the first to ninth aspects.
As an 11th viewpoint, it is related with the hardening relief pattern obtained from the polymeric composition in any one of a 1st viewpoint thru | or a 9th viewpoint.
As a 12th viewpoint, it is related with the optical lens obtained from the polymeric composition in any one of a 1st viewpoint thru | or a 9th viewpoint.
As a thirteenth aspect, the present invention relates to a high refractive index resin lens material comprising the polymerizable composition according to any one of the first to ninth aspects.
As a fourteenth aspect, a step of filling the polymerizable composition according to any one of the first to ninth aspects into a space between a support and a mold, exposing the filled composition to photopolymerization And a step of releasing the photopolymerized product on the support from the mold, and a step of heating the photopolymerized product together with the support.
As a fifteenth aspect, the present invention relates to the manufacturing method according to the fourteenth aspect, in which the molded body is a microlens array.
(a)式[1]で表されるジアリールケイ酸化合物と式[2]で表されるアルコキシケイ素化合物とを、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物100質量部、及び
(b)(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、並びに(b2)マレイミド誘導体からなる群から選ばれる少なくとも1種類の重合性モノマー20~100質量部
を含む重合性組成物に関する。
第2観点として、前記(b1)が(メタ)アクリレート化合物である、第1観点に記載の重合性組成物に関する。
第3観点として、前記(b1)が式[3]で表される化合物である、第2観点に記載の重合性組成物に関する。
第4観点として、前記Lが単結合を表す、第3観点に記載の重合性組成物に関する。
第5観点として、前記脂環基が架橋環構造を有する有機基である、第1観点乃至第4観点のうち何れか一つに記載の重合性組成物に関する。
第6観点として、前記有機基が、ノルボルナン環、アダマンタン環及びトリシクロ[5.2.1.02,6]デカン環からなる群から選ばれる少なくとも1種類の架橋環構造を有する有機基である、第5観点に記載の重合性組成物に関する。
第7観点として、前記(b2)が式[4]で表される化合物である、第1観点乃至第6観点のうち何れか一つに記載の重合性組成物に関する。
第8観点として、前記(b)重合性モノマーが、(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、並びに(b2)マレイミド誘導体の双方からなる、第1観点乃至第7観点のうち何れか一つに記載の重合性組成物に関する。
第9観点として、前記(a)反応性シリコーン化合物が、式[5]で表される化合物と式[6]で表される化合物とを、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物である、第1観点乃至第8観点のうち何れか一つに記載の重合性組成物に関する。
第10観点として、第1観点乃至第9観点の何れかに記載の重合性組成物を光又は熱重合して得られる、硬化物に関する。
第11観点として、第1観点乃至第9観点の何れかに記載の重合性組成物から得られる、硬化レリーフパターンに関する。
第12観点として、第1観点乃至第9観点の何れかに記載の重合性組成物から得られる、光学レンズに関する。
第13観点として、第1観点乃至第9観点の何れかに記載の重合性組成物からなる高屈折率樹脂レンズ用材料に関する。
第14観点として、第1観点乃至第9観点の何れかに記載の重合性組成物を、支持体と鋳型との間の空間に充填する工程、当該充填された組成物を露光して光重合する工程、支持体上の光重合物を鋳型から離型する工程、光重合物を支持体ごと加熱する工程、を含む成形体の製造方法に関する。
第15観点として、前記成形体がマイクロレンズアレイである、第14観点に記載の製造方法に関する。 That is, the present invention provides a first aspect as follows:
(A) 100 parts by mass of a reactive silicone compound obtained by polycondensation of a diaryl silicate compound represented by the formula [1] and an alkoxysilicon compound represented by the formula [2] in the presence of an acid or a base; And (b) (b1) at least one polymerization selected from the group consisting of a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative The present invention relates to a polymerizable composition containing 20 to 100 parts by mass of a polymerizable monomer.
As a second aspect, the present invention relates to the polymerizable composition according to the first aspect, wherein (b1) is a (meth) acrylate compound.
As a third aspect, the present invention relates to the polymerizable composition according to the second aspect, wherein (b1) is a compound represented by the formula [3].
As a fourth aspect, the present invention relates to the polymerizable composition according to the third aspect, wherein L represents a single bond.
As a fifth aspect, the present invention relates to the polymerizable composition according to any one of the first aspect to the fourth aspect, in which the alicyclic group is an organic group having a crosslinked ring structure.
As a sixth aspect, the organic group is an organic group having at least one bridged ring structure selected from the group consisting of a norbornane ring, an adamantane ring, and a tricyclo [5.2.1.0 2,6 ] decane ring. And the polymerizable composition according to the fifth aspect.
As a seventh aspect, the present invention relates to the polymerizable composition according to any one of the first aspect to the sixth aspect, wherein (b2) is a compound represented by the formula [4].
As an eighth aspect, the (b) polymerizable monomer is (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative. The present invention relates to the polymerizable composition according to any one of the first to seventh aspects.
As a ninth aspect, the (a) reactive silicone compound is obtained by polycondensation of a compound represented by the formula [5] and a compound represented by the formula [6] in the presence of an acid or a base. The polymerizable composition according to any one of the first to eighth aspects, which is a polymerizable silicone compound.
As a tenth aspect, the present invention relates to a cured product obtained by photopolymerization or thermal polymerization of the polymerizable composition according to any one of the first to ninth aspects.
As an 11th viewpoint, it is related with the hardening relief pattern obtained from the polymeric composition in any one of a 1st viewpoint thru | or a 9th viewpoint.
As a 12th viewpoint, it is related with the optical lens obtained from the polymeric composition in any one of a 1st viewpoint thru | or a 9th viewpoint.
As a thirteenth aspect, the present invention relates to a high refractive index resin lens material comprising the polymerizable composition according to any one of the first to ninth aspects.
As a fourteenth aspect, a step of filling the polymerizable composition according to any one of the first to ninth aspects into a space between a support and a mold, exposing the filled composition to photopolymerization And a step of releasing the photopolymerized product on the support from the mold, and a step of heating the photopolymerized product together with the support.
As a fifteenth aspect, the present invention relates to the manufacturing method according to the fourteenth aspect, in which the molded body is a microlens array.
本発明によれば、特定構造の反応性シリコーン化合物と、重合性モノマーとして分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、及び/又はマレイミド誘導体とを組合せることにより、加熱による着色(黄変)が非常に少なく、かつ高Tg、高屈折率を示す硬化物を作製可能な重合性組成物を得ることが出来る。
上記特徴を持つ本発明の重合性組成物は、各種成形方法によりレンズアレイに代表される硬化レリーフパターンを簡便に成形可能であり、得られた成形体は200℃以上の高い耐熱性を要求されるデバイス内においても信頼性高く使用することが可能となる。 According to the present invention, a reactive silicone compound having a specific structure, a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule as a polymerizable monomer, and / or a maleimide derivative Can be combined to obtain a polymerizable composition capable of producing a cured product having very little coloration (yellowing) due to heating and having a high Tg and a high refractive index.
The polymerizable composition of the present invention having the above characteristics can easily mold a cured relief pattern typified by a lens array by various molding methods, and the obtained molded body is required to have a high heat resistance of 200 ° C. or higher. It can be used with high reliability even in a device.
上記特徴を持つ本発明の重合性組成物は、各種成形方法によりレンズアレイに代表される硬化レリーフパターンを簡便に成形可能であり、得られた成形体は200℃以上の高い耐熱性を要求されるデバイス内においても信頼性高く使用することが可能となる。 According to the present invention, a reactive silicone compound having a specific structure, a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule as a polymerizable monomer, and / or a maleimide derivative Can be combined to obtain a polymerizable composition capable of producing a cured product having very little coloration (yellowing) due to heating and having a high Tg and a high refractive index.
The polymerizable composition of the present invention having the above characteristics can easily mold a cured relief pattern typified by a lens array by various molding methods, and the obtained molded body is required to have a high heat resistance of 200 ° C. or higher. It can be used with high reliability even in a device.
<<重合性組成物>>
本発明は、(a)上記式[1]で表されるジアリールケイ酸化合物と上記式[2]で表されるアルコキシケイ素化合物とを、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物100質量部、及び(b)(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、並びに(b2)マレイミド誘導体からなる群から選ばれる少なくとも1種類の重合性モノマー20~100質量部を含む重合性組成物に関する。 << Polymerizable composition >>
The present invention provides (a) reactivity obtained by polycondensation of a diaryl silicate compound represented by the above formula [1] and an alkoxy silicon compound represented by the above formula [2] in the presence of an acid or a base. Selected from the group consisting of 100 parts by mass of a silicone compound, (b) (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative And a polymerizable composition containing 20 to 100 parts by mass of at least one polymerizable monomer.
本発明は、(a)上記式[1]で表されるジアリールケイ酸化合物と上記式[2]で表されるアルコキシケイ素化合物とを、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物100質量部、及び(b)(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、並びに(b2)マレイミド誘導体からなる群から選ばれる少なくとも1種類の重合性モノマー20~100質量部を含む重合性組成物に関する。 << Polymerizable composition >>
The present invention provides (a) reactivity obtained by polycondensation of a diaryl silicate compound represented by the above formula [1] and an alkoxy silicon compound represented by the above formula [2] in the presence of an acid or a base. Selected from the group consisting of 100 parts by mass of a silicone compound, (b) (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative And a polymerizable composition containing 20 to 100 parts by mass of at least one polymerizable monomer.
<(a)反応性シリコーン化合物>
本発明に用いられる(a)反応性シリコーン化合物は、特定構造のジアリールケイ酸化合物と特定構造のアルコキシケイ素化合物とを、酸又は塩基の存在下重縮合して得られる化合物である。 <(A) Reactive silicone compound>
The (a) reactive silicone compound used in the present invention is a compound obtained by polycondensation of a diaryl silicate compound having a specific structure and an alkoxy silicon compound having a specific structure in the presence of an acid or a base.
本発明に用いられる(a)反応性シリコーン化合物は、特定構造のジアリールケイ酸化合物と特定構造のアルコキシケイ素化合物とを、酸又は塩基の存在下重縮合して得られる化合物である。 <(A) Reactive silicone compound>
The (a) reactive silicone compound used in the present invention is a compound obtained by polycondensation of a diaryl silicate compound having a specific structure and an alkoxy silicon compound having a specific structure in the presence of an acid or a base.
[ジアリールケイ酸化合物]
前記ジアリールケイ酸化合物は、下記式[1]で表される化合物である。
上記式[1]中、Ar1及びAr2はそれぞれ独立して、炭素原子数1乃至6のアルキル基で置換されていてもよいフェニル基を表す。
[Diaryl silicate compound]
The diaryl silicate compound is a compound represented by the following formula [1].
In the above formula [1], Ar 1 and Ar 2 each independently represent a phenyl group which may be substituted with an alkyl group having 1 to 6 carbon atoms.
前記ジアリールケイ酸化合物は、下記式[1]で表される化合物である。
The diaryl silicate compound is a compound represented by the following formula [1].
Ar1及びAr2としては、例えば、フェニル基、o-トリル基、m-トリル基、p-トリル基、4-エチルフェニル基、4-イソプロピルフェニル基、4-tert-ブチルフェニル基、3,5-ジメチルフェニル基、3,5-ジエチルフェニル基、3,5-ジイソプロピルフェニル基、2,4,6-トリメチルフェニル基等が挙げられる。
上記式[1]で表される化合物の具体例としては、ジフェニルシランジオール、ジ-p-トリルシランジオール、ビス(4-エチルフェニル)シランジオール、ビス(4-イソプロピルフェニル)シランジオール等が挙げられるが、これらに限定されるものではない。 Examples of Ar 1 and Ar 2 include a phenyl group, o-tolyl group, m-tolyl group, p-tolyl group, 4-ethylphenyl group, 4-isopropylphenyl group, 4-tert-butylphenyl group, 3, Examples include 5-dimethylphenyl group, 3,5-diethylphenyl group, 3,5-diisopropylphenyl group, 2,4,6-trimethylphenyl group.
Specific examples of the compound represented by the above formula [1] include diphenylsilanediol, di-p-tolylsilanediol, bis (4-ethylphenyl) silanediol, bis (4-isopropylphenyl) silanediol and the like. However, it is not limited to these.
上記式[1]で表される化合物の具体例としては、ジフェニルシランジオール、ジ-p-トリルシランジオール、ビス(4-エチルフェニル)シランジオール、ビス(4-イソプロピルフェニル)シランジオール等が挙げられるが、これらに限定されるものではない。 Examples of Ar 1 and Ar 2 include a phenyl group, o-tolyl group, m-tolyl group, p-tolyl group, 4-ethylphenyl group, 4-isopropylphenyl group, 4-tert-butylphenyl group, 3, Examples include 5-dimethylphenyl group, 3,5-diethylphenyl group, 3,5-diisopropylphenyl group, 2,4,6-trimethylphenyl group.
Specific examples of the compound represented by the above formula [1] include diphenylsilanediol, di-p-tolylsilanediol, bis (4-ethylphenyl) silanediol, bis (4-isopropylphenyl) silanediol and the like. However, it is not limited to these.
[アルコキシケイ素化合物]
上記特定構造のアルコキシケイ素化合物は、下記式[2]で表される化合物である。
上記式[2]中、Ar3は重合性二重結合を有する基を少なくとも1つ有するフェニル基、又は重合性二重結合を有する基を少なくとも1つ有するナフチル基を表し、R1はメチル基又はエチル基を表し、R2はメチル基、エチル基又はビニルフェニル基を表し、aは2又は3を表す。
[Alkoxysilicon compounds]
The alkoxy silicon compound having the specific structure is a compound represented by the following formula [2].
In the above formula [2], Ar 3 represents a phenyl group having at least one group having a polymerizable double bond, or a naphthyl group having at least one group having a polymerizable double bond, and R 1 is a methyl group Alternatively, it represents an ethyl group, R 2 represents a methyl group, an ethyl group or a vinylphenyl group, and a represents 2 or 3.
上記特定構造のアルコキシケイ素化合物は、下記式[2]で表される化合物である。
The alkoxy silicon compound having the specific structure is a compound represented by the following formula [2].
Ar3が表す重合性二重結合を有する基を少なくとも1つ有するフェニル基としては、例えば、2-ビニルフェニル基、3-ビニルフェニル基、4-ビニルフェニル基、4-ビニルオキシフェニル基、4-アリルフェニル基、4-アリルオキシフェニル基、4-イソプロペニルフェニル基等が挙げられる。
Ar3が表す重合性二重結合を有する基を少なくとも1つ有するナフチル基としては、例えば、4-ビニルナフタレン-1-イル基、6-ビニルナフタレン-2-イル基等が挙げられる。 Examples of the phenyl group having at least one group having a polymerizable double bond represented by Ar 3 include 2-vinylphenyl group, 3-vinylphenyl group, 4-vinylphenyl group, 4-vinyloxyphenyl group, 4 -Allylphenyl group, 4-allyloxyphenyl group, 4-isopropenylphenyl group and the like.
Examples of the naphthyl group having at least one group having a polymerizable double bond represented by Ar 3 include a 4-vinylnaphthalen-1-yl group and a 6-vinylnaphthalen-2-yl group.
Ar3が表す重合性二重結合を有する基を少なくとも1つ有するナフチル基としては、例えば、4-ビニルナフタレン-1-イル基、6-ビニルナフタレン-2-イル基等が挙げられる。 Examples of the phenyl group having at least one group having a polymerizable double bond represented by Ar 3 include 2-vinylphenyl group, 3-vinylphenyl group, 4-vinylphenyl group, 4-vinyloxyphenyl group, 4 -Allylphenyl group, 4-allyloxyphenyl group, 4-isopropenylphenyl group and the like.
Examples of the naphthyl group having at least one group having a polymerizable double bond represented by Ar 3 include a 4-vinylnaphthalen-1-yl group and a 6-vinylnaphthalen-2-yl group.
上記式[2]で表される化合物の具体例としては、例えば、トリメトキシ(4-ビニルフェニル)シラン、トリエトキシ(4-ビニルフェニル)シラン、ジメトキシ(メチル)(4-ビニルフェニル)シラン、ジメトキシビス(4-ビニルフェニル)シラン等が挙げられるが、これらに限定されるものではない。
Specific examples of the compound represented by the above formula [2] include, for example, trimethoxy (4-vinylphenyl) silane, triethoxy (4-vinylphenyl) silane, dimethoxy (methyl) (4-vinylphenyl) silane, dimethoxybis Examples include (4-vinylphenyl) silane, but are not limited thereto.
上記(a)反応性シリコーン化合物としては、下記式[5]で表される化合物と下記式[6]で表される化合物とを、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物が好ましい。
上記式[6]中、R1は前記と同じ意味を表す。
The reactive silicone compound (a) is a reactive silicone obtained by polycondensation of a compound represented by the following formula [5] and a compound represented by the following formula [6] in the presence of an acid or a base. Compounds are preferred.
In the above formula [6], R 1 represents the same meaning as described above.
[ジアリールケイ酸化合物とアルコキシケイ素化合物の配合割合]
上述の反応性シリコーン化合物に用いる式[1]で表されるジアリールケイ酸化合物と式[2]で表されるアルコキシケイ素化合物の重縮合反応にかかる配合モル比は特に限定されないが、ブロックコポリマー化を防ぐ目的から、通常、ジアリールケイ酸化合物:アルコキシケイ素化合物=2:1~1:2の範囲が好ましい。より好ましくは1.1:0.9~0.9:1.1の間で配合される範囲である。
上述のジアリールケイ酸化合物及びアルコキシケイ素化合物は、必要に応じて適宜化合物を選択して用いることができ、また、複数種を併用することもできる。この場合のモル比もジアリールケイ酸化合物のモル量の総計とアルコキシケイ素化合物のモル量の総計の比が上記の範囲となる。 [Blending ratio of diaryl silicate compound and alkoxy silicon compound]
Although the compounding molar ratio concerning the polycondensation reaction of the diaryl silicic acid compound represented by the formula [1] and the alkoxysilicon compound represented by the formula [2] used for the above-mentioned reactive silicone compound is not particularly limited, a block copolymer is formed. In general, the range of diaryl silicate compound: alkoxy silicon compound = 2: 1 to 1: 2 is preferable. More preferably, the blending ratio is between 1.1: 0.9 and 0.9: 1.1.
The above-mentioned diaryl silicate compound and alkoxy silicon compound can be appropriately selected and used as necessary, and a plurality of types can be used in combination. In this case, the molar ratio of the total molar amount of the diaryl silicate compound and the total molar amount of the alkoxysilicon compound is within the above range.
上述の反応性シリコーン化合物に用いる式[1]で表されるジアリールケイ酸化合物と式[2]で表されるアルコキシケイ素化合物の重縮合反応にかかる配合モル比は特に限定されないが、ブロックコポリマー化を防ぐ目的から、通常、ジアリールケイ酸化合物:アルコキシケイ素化合物=2:1~1:2の範囲が好ましい。より好ましくは1.1:0.9~0.9:1.1の間で配合される範囲である。
上述のジアリールケイ酸化合物及びアルコキシケイ素化合物は、必要に応じて適宜化合物を選択して用いることができ、また、複数種を併用することもできる。この場合のモル比もジアリールケイ酸化合物のモル量の総計とアルコキシケイ素化合物のモル量の総計の比が上記の範囲となる。 [Blending ratio of diaryl silicate compound and alkoxy silicon compound]
Although the compounding molar ratio concerning the polycondensation reaction of the diaryl silicic acid compound represented by the formula [1] and the alkoxysilicon compound represented by the formula [2] used for the above-mentioned reactive silicone compound is not particularly limited, a block copolymer is formed. In general, the range of diaryl silicate compound: alkoxy silicon compound = 2: 1 to 1: 2 is preferable. More preferably, the blending ratio is between 1.1: 0.9 and 0.9: 1.1.
The above-mentioned diaryl silicate compound and alkoxy silicon compound can be appropriately selected and used as necessary, and a plurality of types can be used in combination. In this case, the molar ratio of the total molar amount of the diaryl silicate compound and the total molar amount of the alkoxysilicon compound is within the above range.
[酸又は塩基性触媒]
上記式[1]で表されるジアリールケイ酸化合物と上記式[2]で表されるアルコキシケイ素化合物との重縮合反応は、酸又は塩基性触媒の存在下で好適に実施される。
重縮合反応に用いる触媒は、後述の溶媒に溶解する、又は均一分散する限りにおいては特にその種類は限定されず、必要に応じて適宜選択して用いることができる。
用いることのできる触媒としては、例えば、酸性化合物として、B(OR)3、Al(OR)3、Ti(OR)4、Zr(OR)4等;塩基性化合物として、アルカリ金属水酸化物、アルカリ土類金属水酸化物、アンモニウム塩、アミン類等;フッ化物塩として、NH4F、NR4F等が挙げられる。なお、ここでRは、水素原子、炭素原子数1乃至12の直鎖状アルキル基、炭素原子数3乃至12の分枝アルキル基、炭素原子数3乃至12の環状アルキル基からなる群から選ばれる一種以上の基である。
これら触媒は、一種単独で、又は複数種を併用することもできる。 [Acid or basic catalyst]
The polycondensation reaction between the diaryl silicate compound represented by the above formula [1] and the alkoxysilicon compound represented by the above formula [2] is preferably carried out in the presence of an acid or a basic catalyst.
The type of the catalyst used for the polycondensation reaction is not particularly limited as long as it is dissolved or uniformly dispersed in the solvent described later, and can be appropriately selected and used as necessary.
Examples of catalysts that can be used include B (OR) 3 , Al (OR) 3 , Ti (OR) 4 , and Zr (OR) 4 as acidic compounds; alkali metal hydroxides as basic compounds, Alkaline earth metal hydroxides, ammonium salts, amines, etc .; Examples of fluoride salts include NH 4 F, NR 4 F, and the like. Here, R is selected from the group consisting of a hydrogen atom, a linear alkyl group having 1 to 12 carbon atoms, a branched alkyl group having 3 to 12 carbon atoms, and a cyclic alkyl group having 3 to 12 carbon atoms. One or more groups.
These catalysts can be used alone or in combination of two or more.
上記式[1]で表されるジアリールケイ酸化合物と上記式[2]で表されるアルコキシケイ素化合物との重縮合反応は、酸又は塩基性触媒の存在下で好適に実施される。
重縮合反応に用いる触媒は、後述の溶媒に溶解する、又は均一分散する限りにおいては特にその種類は限定されず、必要に応じて適宜選択して用いることができる。
用いることのできる触媒としては、例えば、酸性化合物として、B(OR)3、Al(OR)3、Ti(OR)4、Zr(OR)4等;塩基性化合物として、アルカリ金属水酸化物、アルカリ土類金属水酸化物、アンモニウム塩、アミン類等;フッ化物塩として、NH4F、NR4F等が挙げられる。なお、ここでRは、水素原子、炭素原子数1乃至12の直鎖状アルキル基、炭素原子数3乃至12の分枝アルキル基、炭素原子数3乃至12の環状アルキル基からなる群から選ばれる一種以上の基である。
これら触媒は、一種単独で、又は複数種を併用することもできる。 [Acid or basic catalyst]
The polycondensation reaction between the diaryl silicate compound represented by the above formula [1] and the alkoxysilicon compound represented by the above formula [2] is preferably carried out in the presence of an acid or a basic catalyst.
The type of the catalyst used for the polycondensation reaction is not particularly limited as long as it is dissolved or uniformly dispersed in the solvent described later, and can be appropriately selected and used as necessary.
Examples of catalysts that can be used include B (OR) 3 , Al (OR) 3 , Ti (OR) 4 , and Zr (OR) 4 as acidic compounds; alkali metal hydroxides as basic compounds, Alkaline earth metal hydroxides, ammonium salts, amines, etc .; Examples of fluoride salts include NH 4 F, NR 4 F, and the like. Here, R is selected from the group consisting of a hydrogen atom, a linear alkyl group having 1 to 12 carbon atoms, a branched alkyl group having 3 to 12 carbon atoms, and a cyclic alkyl group having 3 to 12 carbon atoms. One or more groups.
These catalysts can be used alone or in combination of two or more.
上記酸性化合物としては、例えば、ホウ酸、トリメトキシボロン、トリエトキシボロン、トリ-n-プロポキシボロン、トリイソプロポキシボロン、トリ-n-ブトキシボロン、トリイソブトキシボロン、トリ-sec-ブトキシボロン、トリ-tert-ブトキシボロン、トリメトキシアルミニウム、トリエトキシアルミニウム、トリ-n-プロポキシアルミニウム、トリイソプロポキシアルミニウム、トリ-n-ブトキシアルミニウム、トリイソブトキシアルミニウム、トリ-sec-ブトキシアルミニウム、トリ-tert-ブトキシアルミニウム、テトラメトキシチタン、テトラエトキシチタン、テトラ-n-プロポキシチタン、テトライソプロポキシチタン(チタンテトライソプロポキシド)、テトラ-n-ブトキシチタン、テトライソブトキシチタン、テトラ-sec-ブトキシチタン、テトラ-tert-ブトキシチタン、テトラメトキシジルコニウム、テトラエトキシジルコニウム、テトラ-n-プロポキシジルコニウム、テトライソプロポキシジルコニウム、テトラ-n-ブトキシジルコニウム、テトライソブトキシジルコニウム、テトラ-sec-ブトキシジルコニウム、テトラ-tert-ブトキシジルコニウム等が挙げられる。
Examples of the acidic compound include boric acid, trimethoxyboron, triethoxyboron, tri-n-propoxyboron, triisopropoxyboron, tri-n-butoxyboron, triisobutoxyboron, tri-sec-butoxyboron, Tri-tert-butoxyboron, trimethoxyaluminum, triethoxyaluminum, tri-n-propoxyaluminum, triisopropoxyaluminum, tri-n-butoxyaluminum, triisobutoxyaluminum, tri-sec-butoxyaluminum, tri-tert- Butoxyaluminum, tetramethoxytitanium, tetraethoxytitanium, tetra-n-propoxytitanium, tetraisopropoxytitanium (titanium tetraisopropoxide), tetra-n-butoxytitanium, te Lysobutoxy titanium, tetra-sec-butoxy titanium, tetra-tert-butoxy titanium, tetramethoxy zirconium, tetraethoxy zirconium, tetra-n-propoxy zirconium, tetraisopropoxy zirconium, tetra-n-butoxy zirconium, tetraisobutoxy zirconium, Examples thereof include tetra-sec-butoxyzirconium, tetra-tert-butoxyzirconium and the like.
上記塩基性化合物としては、例えば、水酸化ナトリウム、水酸化カリウム、水酸化マグネシウム、水酸化カルシウム、水酸化ストロンチウム、水酸化バリウム、水酸化アンモニウム、水酸化テトラメチルアンモニウム、水酸化テトラブチルアンモニウム、トリエチルアミン等が挙げられる。
Examples of the basic compound include sodium hydroxide, potassium hydroxide, magnesium hydroxide, calcium hydroxide, strontium hydroxide, barium hydroxide, ammonium hydroxide, tetramethylammonium hydroxide, tetrabutylammonium hydroxide, triethylamine. Etc.
上記フッ化物塩としては、例えば、フッ化アンモニウム、フッ化テトラメチルアンモニウム、フッ化テトラブチルアンモニウム等を挙げることができる。
Examples of the fluoride salt include ammonium fluoride, tetramethylammonium fluoride, and tetrabutylammonium fluoride.
これら触媒のうち、好ましく用いられるのは、テトライソプロポキシチタン(チタンテトライソプロポキシド)、水酸化マグネシウム、水酸化カルシウム、水酸化ストロンチウム、及び水酸化バリウムからなる群から選ばれる一種以上である。
触媒の使用量は、上記ジアリールケイ酸化合物とアルコキシケイ素化合物との合計質量に対し、0.01~10質量%、好ましくは0.1~5質量%である。触媒の使用量を0.01質量%以上とすることで反応がより良好に進行する。また、経済性を考慮すれば、10質量%以下の使用で十分である。 Among these catalysts, one or more selected from the group consisting of tetraisopropoxy titanium (titanium tetraisopropoxide), magnesium hydroxide, calcium hydroxide, strontium hydroxide, and barium hydroxide is preferably used.
The amount of the catalyst used is 0.01 to 10% by mass, preferably 0.1 to 5% by mass, based on the total mass of the diaryl silicate compound and the alkoxysilicon compound. The reaction proceeds more favorably when the amount of the catalyst used is 0.01% by mass or more. In consideration of economy, the use of 10% by mass or less is sufficient.
触媒の使用量は、上記ジアリールケイ酸化合物とアルコキシケイ素化合物との合計質量に対し、0.01~10質量%、好ましくは0.1~5質量%である。触媒の使用量を0.01質量%以上とすることで反応がより良好に進行する。また、経済性を考慮すれば、10質量%以下の使用で十分である。 Among these catalysts, one or more selected from the group consisting of tetraisopropoxy titanium (titanium tetraisopropoxide), magnesium hydroxide, calcium hydroxide, strontium hydroxide, and barium hydroxide is preferably used.
The amount of the catalyst used is 0.01 to 10% by mass, preferably 0.1 to 5% by mass, based on the total mass of the diaryl silicate compound and the alkoxysilicon compound. The reaction proceeds more favorably when the amount of the catalyst used is 0.01% by mass or more. In consideration of economy, the use of 10% by mass or less is sufficient.
[重縮合反応]
本発明にかかる反応性シリコーン化合物は、アルコキシケイ素化合物の構造が一つの特徴となっている。本発明に用いられるアルコキシケイ素化合物に含まれる反応性基(重合性二重結合)は、ラジカル的又はイオン(アニオン、カチオン)的に容易に重合し、重合後(硬化後)は高い耐熱性を示す。
このようなアルコキシケイ素化合物とジアリールケイ酸化合物とを重縮合させ、耐熱性の高いシリコーン化合物とするとき、生成物が液体状態を保つよう、適度な重合度で反応を停止させる必要がある。なお本発明で用いるアルコキシケイ素化合物は積極的に加水分解しないことから、ジアリールケイ酸化合物との重縮合反応が穏やかであり、重合度を制御しやすい特徴がある。
アルコキシケイ素化合物とジアリールケイ酸化合物の脱アルコールによる重縮合反応は、無溶媒下で行うことも可能だが、トルエンなどのアルコキシケイ素化合物に対して不活性な溶媒を反応溶媒として用いることも可能である。無溶媒の場合は、反応副生成物であるアルコールの留去が容易になるという利点がある。一方、反応溶媒を用いる場合は、反応系を均一にしやすく、より安定した重縮合反応を行えるという利点がある。 [Polycondensation reaction]
The reactive silicone compound according to the present invention is characterized by the structure of the alkoxysilicon compound. The reactive group (polymerizable double bond) contained in the alkoxysilicon compound used in the present invention is easily polymerized radically or ionically (anion, cation), and has high heat resistance after polymerization (after curing). Show.
When such an alkoxysilicon compound and a diarylsilicate compound are polycondensed to obtain a silicone compound having high heat resistance, it is necessary to stop the reaction at an appropriate degree of polymerization so that the product maintains a liquid state. Since the alkoxysilicon compound used in the present invention does not actively hydrolyze, the polycondensation reaction with the diaryl silicate compound is gentle, and the degree of polymerization is easily controlled.
The polycondensation reaction of the alkoxy silicon compound and the diaryl silicate compound by dealcoholization can be carried out in the absence of a solvent, but it is also possible to use a solvent inert to the alkoxy silicon compound such as toluene as the reaction solvent. . When there is no solvent, there is an advantage that the alcohol as a reaction by-product can be easily distilled off. On the other hand, when a reaction solvent is used, there are advantages that the reaction system can be easily made uniform and a more stable polycondensation reaction can be performed.
本発明にかかる反応性シリコーン化合物は、アルコキシケイ素化合物の構造が一つの特徴となっている。本発明に用いられるアルコキシケイ素化合物に含まれる反応性基(重合性二重結合)は、ラジカル的又はイオン(アニオン、カチオン)的に容易に重合し、重合後(硬化後)は高い耐熱性を示す。
このようなアルコキシケイ素化合物とジアリールケイ酸化合物とを重縮合させ、耐熱性の高いシリコーン化合物とするとき、生成物が液体状態を保つよう、適度な重合度で反応を停止させる必要がある。なお本発明で用いるアルコキシケイ素化合物は積極的に加水分解しないことから、ジアリールケイ酸化合物との重縮合反応が穏やかであり、重合度を制御しやすい特徴がある。
アルコキシケイ素化合物とジアリールケイ酸化合物の脱アルコールによる重縮合反応は、無溶媒下で行うことも可能だが、トルエンなどのアルコキシケイ素化合物に対して不活性な溶媒を反応溶媒として用いることも可能である。無溶媒の場合は、反応副生成物であるアルコールの留去が容易になるという利点がある。一方、反応溶媒を用いる場合は、反応系を均一にしやすく、より安定した重縮合反応を行えるという利点がある。 [Polycondensation reaction]
The reactive silicone compound according to the present invention is characterized by the structure of the alkoxysilicon compound. The reactive group (polymerizable double bond) contained in the alkoxysilicon compound used in the present invention is easily polymerized radically or ionically (anion, cation), and has high heat resistance after polymerization (after curing). Show.
When such an alkoxysilicon compound and a diarylsilicate compound are polycondensed to obtain a silicone compound having high heat resistance, it is necessary to stop the reaction at an appropriate degree of polymerization so that the product maintains a liquid state. Since the alkoxysilicon compound used in the present invention does not actively hydrolyze, the polycondensation reaction with the diaryl silicate compound is gentle, and the degree of polymerization is easily controlled.
The polycondensation reaction of the alkoxy silicon compound and the diaryl silicate compound by dealcoholization can be carried out in the absence of a solvent, but it is also possible to use a solvent inert to the alkoxy silicon compound such as toluene as the reaction solvent. . When there is no solvent, there is an advantage that the alcohol as a reaction by-product can be easily distilled off. On the other hand, when a reaction solvent is used, there are advantages that the reaction system can be easily made uniform and a more stable polycondensation reaction can be performed.
反応性シリコーン化合物の合成反応は、前述のように無溶媒で行ってもよいが、より均一化させるために溶媒を使用しても問題ない。溶媒は、ジアリールケイ酸化合物及びアルコキシケイ素化合物と反応せず、その縮合物を溶解するものであれば特に限定されない。
このような反応溶媒としては、例えば、アセトン、メチルエチルケトン(MEK)等のケトン類;ベンゼン、トルエン、キシレン等の芳香族炭化水素類;エチレングリコール、プロピレングリコール、ヘキシレングリコール等のグリコール類;エチルセロソルブ、ブチルセロソルブ、エチルカルビトール、ブチルカルビトール、ジエチルセロソルブ、ジエチルカルビトール等のグリコールエーテル類;N-メチル-2-ピロリドン(NMP)、N,N-ジメチルホルムアミド(DMF)等のアミド類などが挙げられる。これら溶媒は、一種単独で、又は二種以上を混合して用いてもよい。 The reactive reaction of the reactive silicone compound may be performed without a solvent as described above, but there is no problem even if a solvent is used in order to make it more uniform. The solvent is not particularly limited as long as it does not react with the diaryl silicate compound and the alkoxysilicon compound and dissolves the condensate thereof.
Examples of such a reaction solvent include ketones such as acetone and methyl ethyl ketone (MEK); aromatic hydrocarbons such as benzene, toluene and xylene; glycols such as ethylene glycol, propylene glycol and hexylene glycol; ethyl cellosolve Glycol ethers such as butyl cellosolve, ethyl carbitol, butyl carbitol, diethyl cellosolve and diethyl carbitol; amides such as N-methyl-2-pyrrolidone (NMP) and N, N-dimethylformamide (DMF) It is done. These solvents may be used alone or in combination of two or more.
このような反応溶媒としては、例えば、アセトン、メチルエチルケトン(MEK)等のケトン類;ベンゼン、トルエン、キシレン等の芳香族炭化水素類;エチレングリコール、プロピレングリコール、ヘキシレングリコール等のグリコール類;エチルセロソルブ、ブチルセロソルブ、エチルカルビトール、ブチルカルビトール、ジエチルセロソルブ、ジエチルカルビトール等のグリコールエーテル類;N-メチル-2-ピロリドン(NMP)、N,N-ジメチルホルムアミド(DMF)等のアミド類などが挙げられる。これら溶媒は、一種単独で、又は二種以上を混合して用いてもよい。 The reactive reaction of the reactive silicone compound may be performed without a solvent as described above, but there is no problem even if a solvent is used in order to make it more uniform. The solvent is not particularly limited as long as it does not react with the diaryl silicate compound and the alkoxysilicon compound and dissolves the condensate thereof.
Examples of such a reaction solvent include ketones such as acetone and methyl ethyl ketone (MEK); aromatic hydrocarbons such as benzene, toluene and xylene; glycols such as ethylene glycol, propylene glycol and hexylene glycol; ethyl cellosolve Glycol ethers such as butyl cellosolve, ethyl carbitol, butyl carbitol, diethyl cellosolve and diethyl carbitol; amides such as N-methyl-2-pyrrolidone (NMP) and N, N-dimethylformamide (DMF) It is done. These solvents may be used alone or in combination of two or more.
本発明で用いる反応性シリコーン化合物は、式[1]で表されるジアリールケイ酸化合物と式[2]で表されるアルコキシケイ素化合物とを、酸又は塩基性触媒の存在下で、脱アルコール縮合を行うことにより得られる。反応は水分の混入を防ぐ目的から、窒素ガス等の不活性ガス雰囲気中で行うことが望ましい。反応温度は20~150℃、より好ましくは30~120℃である。
反応時間は、重縮合物の分子量増加が終了し、分子量分布が安定するのに必要な時間以上なら、特に制限は受けず、より具体的には数時間から数日間である。 The reactive silicone compound used in the present invention comprises a dealcoholization condensation of a diaryl silicate compound represented by the formula [1] and an alkoxy silicon compound represented by the formula [2] in the presence of an acid or a basic catalyst. Is obtained. The reaction is preferably performed in an inert gas atmosphere such as nitrogen gas for the purpose of preventing moisture from entering. The reaction temperature is 20 to 150 ° C, more preferably 30 to 120 ° C.
The reaction time is not particularly limited as long as it is longer than the time necessary for the molecular weight distribution of the polycondensate to increase and to stabilize the molecular weight distribution, and more specifically, several hours to several days.
反応時間は、重縮合物の分子量増加が終了し、分子量分布が安定するのに必要な時間以上なら、特に制限は受けず、より具体的には数時間から数日間である。 The reactive silicone compound used in the present invention comprises a dealcoholization condensation of a diaryl silicate compound represented by the formula [1] and an alkoxy silicon compound represented by the formula [2] in the presence of an acid or a basic catalyst. Is obtained. The reaction is preferably performed in an inert gas atmosphere such as nitrogen gas for the purpose of preventing moisture from entering. The reaction temperature is 20 to 150 ° C, more preferably 30 to 120 ° C.
The reaction time is not particularly limited as long as it is longer than the time necessary for the molecular weight distribution of the polycondensate to increase and to stabilize the molecular weight distribution, and more specifically, several hours to several days.
重縮合反応の終了後、得られた反応性シリコーン化合物をろ過、溶媒留去等の任意の方法で回収し、必要に応じて適宜精製処理を行うことが好ましい。
After completion of the polycondensation reaction, it is preferable to collect the reactive silicone compound obtained by any method such as filtration and solvent distillation, and appropriately perform a purification treatment as necessary.
このような反応によって得られた重縮合物は、ゲル浸透クロマトグラフィー(GPC)によるポリスチレン換算で測定される重量平均分子量Mwが500~10,000であり、分散度Mw(重量平均分子量)/Mn(数平均分子量)は1.0~10である。
The polycondensate obtained by such a reaction has a weight average molecular weight Mw measured in terms of polystyrene by gel permeation chromatography (GPC) of 500 to 10,000, and a dispersity Mw (weight average molecular weight) / Mn (Number average molecular weight) is 1.0 to 10.
<(b)重合性モノマー>
本発明に用いられる(b)重合性モノマーは、(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、並びに(b2)マレイミド誘導体からなる群から選ばれる少なくとも1種類の重合性モノマーである。 <(B) Polymerizable monomer>
The (b) polymerizable monomer used in the present invention comprises (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative. And at least one polymerizable monomer selected from the group.
本発明に用いられる(b)重合性モノマーは、(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、並びに(b2)マレイミド誘導体からなる群から選ばれる少なくとも1種類の重合性モノマーである。 <(B) Polymerizable monomer>
The (b) polymerizable monomer used in the present invention comprises (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative. And at least one polymerizable monomer selected from the group.
[(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物]
本発明で用いる分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物は、脂環基が架橋環構造を有する有機基であることが好ましく、ノルボルナン環、アダマンタン環及びトリシクロ[5.2.1.02,6]デカン環からなる群から選ばれる少なくとも1種類の架橋環構造を有する有機基であることがより好ましい。 [(B1) Compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule]
The compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule used in the present invention is preferably an organic group in which the alicyclic group has a crosslinked ring structure, and a norbornane ring And an organic group having at least one kind of a bridged ring structure selected from the group consisting of an adamantane ring and a tricyclo [5.2.1.0 2,6 ] decane ring.
本発明で用いる分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物は、脂環基が架橋環構造を有する有機基であることが好ましく、ノルボルナン環、アダマンタン環及びトリシクロ[5.2.1.02,6]デカン環からなる群から選ばれる少なくとも1種類の架橋環構造を有する有機基であることがより好ましい。 [(B1) Compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule]
The compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule used in the present invention is preferably an organic group in which the alicyclic group has a crosslinked ring structure, and a norbornane ring And an organic group having at least one kind of a bridged ring structure selected from the group consisting of an adamantane ring and a tricyclo [5.2.1.0 2,6 ] decane ring.
上記炭素原子数3乃至30の脂環基としては、例えば、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、3,3,5-トリメチルシクロヘキシル基、4-tert-ブチルシクロヘキシル基、メンチル基、イソボルニル基、ノルボルニル基、1-アダマンチル基、2-アダマンチル基、2-メチルアダマンタン-2-イル基、2-エチルアダマンタン-2-イル基、トリシクロ[5.2.1.02,6]デカニル基等が挙げられる。
中でも、イソボルニル基、ノルボルニル基、1-アダマンチル基、2-アダマンチル基、2-メチルアダマンタン-2-イル基、2-エチルアダマンタン-2-イル基、トリシクロ[5.2.1.02,6]デカニル基が好ましい。 Examples of the alicyclic group having 3 to 30 carbon atoms include cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, 3,3,5-trimethylcyclohexyl group, 4-tert-butylcyclohexyl group, menthyl group, Isobornyl, norbornyl, 1-adamantyl, 2-adamantyl, 2-methyladamantan-2-yl, 2-ethyladamantan-2-yl, tricyclo [5.2.1.0 2,6 ] decanyl Groups and the like.
Among them, isobornyl group, norbornyl group, 1-adamantyl group, 2-adamantyl group, 2-methyladamantan-2-yl group, 2-ethyladamantan-2-yl group, tricyclo [5.2.1.0 2,6 A decanyl group is preferred.
中でも、イソボルニル基、ノルボルニル基、1-アダマンチル基、2-アダマンチル基、2-メチルアダマンタン-2-イル基、2-エチルアダマンタン-2-イル基、トリシクロ[5.2.1.02,6]デカニル基が好ましい。 Examples of the alicyclic group having 3 to 30 carbon atoms include cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, 3,3,5-trimethylcyclohexyl group, 4-tert-butylcyclohexyl group, menthyl group, Isobornyl, norbornyl, 1-adamantyl, 2-adamantyl, 2-methyladamantan-2-yl, 2-ethyladamantan-2-yl, tricyclo [5.2.1.0 2,6 ] decanyl Groups and the like.
Among them, isobornyl group, norbornyl group, 1-adamantyl group, 2-adamantyl group, 2-methyladamantan-2-yl group, 2-ethyladamantan-2-yl group, tricyclo [5.2.1.0 2,6 A decanyl group is preferred.
本発明で用いる分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物は、(メタ)アクリレート化合物が好ましく、特に下記式[3]で表される化合物が好ましい。なお、本発明では(メタ)アクリレート化合物とは、アクリレート化合物とメタクリレート化合物の両方をいう。例えば(メタ)アクリル酸は、アクリル酸とメタクリル酸をいう。
上記式[3]中、R3は水素原子又はメチル基を表し、Lは単結合又は炭素原子数1乃至6のアルキレン基を表し、R4は炭素原子数3乃至30の脂環基を表す。
The compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule used in the present invention is preferably a (meth) acrylate compound, particularly a compound represented by the following formula [3] Is preferred. In the present invention, the (meth) acrylate compound refers to both an acrylate compound and a methacrylate compound. For example, (meth) acrylic acid refers to acrylic acid and methacrylic acid.
In the above formula [3], R 3 represents a hydrogen atom or a methyl group, L represents a single bond or an alkylene group having 1 to 6 carbon atoms, and R 4 represents an alicyclic group having 3 to 30 carbon atoms. .
Lとしては、例えば、メチレン基、エチレン基、トリメチレン基、メチルエチレン基、テトラメチレン基、1-メチルトリメチレン基、ペンタメチレン基、2,2-ジメチルトリメチレン基、ヘキサメチレン基等の鎖状又は分枝状アルキレン基;シクロプロパン-1,2-ジイル基、シクロブタン-1,2-ジイル基、シクロブタン-1,3-ジイル基、シクロペンタン-1,2-ジイル基、シクロペンタン-1,3-ジイル基、シクロヘキサン-1,2-ジイル基、シクロヘキサン-1,3-ジイル基、シクロヘキサン-1,4-ジイル基等の環状アルキレン基等が挙げられる。
中でもLは単結合、メチレン基又はエチレン基であることが好ましく、単結合であることがより好ましい。 L is, for example, a chain of methylene, ethylene, trimethylene, methylethylene, tetramethylene, 1-methyltrimethylene, pentamethylene, 2,2-dimethyltrimethylene, hexamethylene, etc. Or a branched alkylene group; cyclopropane-1,2-diyl group, cyclobutane-1,2-diyl group, cyclobutane-1,3-diyl group, cyclopentane-1,2-diyl group, cyclopentane-1, And cyclic alkylene groups such as a 3-diyl group, a cyclohexane-1,2-diyl group, a cyclohexane-1,3-diyl group, and a cyclohexane-1,4-diyl group.
Among these, L is preferably a single bond, a methylene group or an ethylene group, and more preferably a single bond.
中でもLは単結合、メチレン基又はエチレン基であることが好ましく、単結合であることがより好ましい。 L is, for example, a chain of methylene, ethylene, trimethylene, methylethylene, tetramethylene, 1-methyltrimethylene, pentamethylene, 2,2-dimethyltrimethylene, hexamethylene, etc. Or a branched alkylene group; cyclopropane-1,2-diyl group, cyclobutane-1,2-diyl group, cyclobutane-1,3-diyl group, cyclopentane-1,2-diyl group, cyclopentane-1, And cyclic alkylene groups such as a 3-diyl group, a cyclohexane-1,2-diyl group, a cyclohexane-1,3-diyl group, and a cyclohexane-1,4-diyl group.
Among these, L is preferably a single bond, a methylene group or an ethylene group, and more preferably a single bond.
上記(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する好適な化合物としては、例えば、シクロペンチル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、3,3,5-トリメチルシクロヘキシル(メタ)アクリレート、4-tert-ブチルシクロヘキシル(メタ)アクリレート、メンチル(メタ)アクリレート、イソボルニル(メタ)アクリレート、ノルボルニル(メタ)アクリレート、1-アダマンチル(メタ)アクリレート、2-アダマンチル(メタ)アクリレート、2-メチルアダマンタン-2-イル(メタ)アクリレート、2-エチルアダマンタン-2-イル(メタ)アクリレート、トリシクロ[5.2.1.02,6]デカニル(メタ)アクリレート等が挙げられる。
中でも、イソボルニル(メタ)アクリレート、ノルボルニル(メタ)アクリレート、1-アダマンチル(メタ)アクリレート、2-アダマンチル(メタ)アクリレート、2-メチルアダマンタン-2-イル(メタ)アクリレート、2-エチルアダマンタン-2-イル(メタ)アクリレート、トリシクロ[5.2.1.02,6]デカニル(メタ)アクリレートであることが特に好ましい。 Examples of the suitable compound (b1) having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule include cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, 3, 3,5-trimethylcyclohexyl (meth) acrylate, 4-tert-butylcyclohexyl (meth) acrylate, menthyl (meth) acrylate, isobornyl (meth) acrylate, norbornyl (meth) acrylate, 1-adamantyl (meth) acrylate, 2- Adamantyl (meth) acrylate, 2-methyladamantan-2-yl (meth) acrylate, 2-ethyladamantan-2-yl (meth) acrylate, tricyclo [5.2.1.0 2,6 ] decanyl (meth) acrylate Etc.
Among them, isobornyl (meth) acrylate, norbornyl (meth) acrylate, 1-adamantyl (meth) acrylate, 2-adamantyl (meth) acrylate, 2-methyladamantan-2-yl (meth) acrylate, 2-ethyladamantane-2- Particularly preferred are yl (meth) acrylate and tricyclo [5.2.1.0 2,6 ] decanyl (meth) acrylate.
中でも、イソボルニル(メタ)アクリレート、ノルボルニル(メタ)アクリレート、1-アダマンチル(メタ)アクリレート、2-アダマンチル(メタ)アクリレート、2-メチルアダマンタン-2-イル(メタ)アクリレート、2-エチルアダマンタン-2-イル(メタ)アクリレート、トリシクロ[5.2.1.02,6]デカニル(メタ)アクリレートであることが特に好ましい。 Examples of the suitable compound (b1) having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule include cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, 3, 3,5-trimethylcyclohexyl (meth) acrylate, 4-tert-butylcyclohexyl (meth) acrylate, menthyl (meth) acrylate, isobornyl (meth) acrylate, norbornyl (meth) acrylate, 1-adamantyl (meth) acrylate, 2- Adamantyl (meth) acrylate, 2-methyladamantan-2-yl (meth) acrylate, 2-ethyladamantan-2-yl (meth) acrylate, tricyclo [5.2.1.0 2,6 ] decanyl (meth) acrylate Etc.
Among them, isobornyl (meth) acrylate, norbornyl (meth) acrylate, 1-adamantyl (meth) acrylate, 2-adamantyl (meth) acrylate, 2-methyladamantan-2-yl (meth) acrylate, 2-ethyladamantane-2- Particularly preferred are yl (meth) acrylate and tricyclo [5.2.1.0 2,6 ] decanyl (meth) acrylate.
[(b2)マレイミド誘導体]
本発明で用いるマレイミド誘導体は、下記式[4]で表される化合物が好ましい。
上記式[4]式中、R5は水素原子、炭素原子数1乃至12のアルキル基、置換されていてもよい炭素原子数6乃至12の芳香族基、又はヒドロキシ基を表す。
[(B2) Maleimide derivative]
The maleimide derivative used in the present invention is preferably a compound represented by the following formula [4].
In the above formula [4], R 5 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an optionally substituted aromatic group having 6 to 12 carbon atoms, or a hydroxy group.
本発明で用いるマレイミド誘導体は、下記式[4]で表される化合物が好ましい。
The maleimide derivative used in the present invention is preferably a compound represented by the following formula [4].
R5が表す炭素原子数1乃至12のアルキル基としては、例えば、メチル基、エチル基、n-プロピル基、イソプロピル基、n-ブチル基、イソブチル基、sec-ブチル基、tert-ブチル基、n-ペンチル基、イソアミル基、ネオペンチル基、tert-アミル基、sec-イソアミル基、シクロペンチル基、n-ヘキシル基、シクロヘキシル基、n-ヘプチル基、n-オクチル基、ベンジル基、フェネチル基、ナフチルメチル基、ナフチルエチル基等が挙げられる。
R5が表す炭素原子数6乃至12の芳香族基としては、例えば、フェニル基、ナフチル基等が挙げられる。またその置換基としては、炭素原子数1乃至6のアルキル基、炭素原子数1乃至6のアルコキシ基、フェニル基、ハロゲン原子、ヒドロキシ基等が挙げられる。前記置換基としての炭素原子数1乃至6のアルキル基としては、例えば、メチル基、エチル基、n-プロピル基、イソプロピル基、n-ブチル基、イソブチル基、sec-ブチル基、tert-ブチル基、n-ペンチル基、イソアミル基、ネオペンチル基、tert-アミル基、sec-イソアミル基、シクロペンチル基、n-ヘキシル基、シクロヘキシル基等が挙げられる。前記置換基としての炭素原子数1乃至6のアルコキシ基としては、例えば、メトキシ基、エトキシ基、n-プロポキシ基、イソプロポキシ基、n-ブトキシ基、イソブトキシ基、sec-ブトキシ基、tert-ブトキシ基、n-ペンチルオキシ基、イソアミルオキシ基、ネオペンチルオキシ基、tert-アミルオキシ基、sec-イソアミルオキシ基、シクロペンチルオキシ基、n-ヘキシルオキシ基、シクロヘキシルオキシ基等が挙げられる。
中でもR5はシクロヘキシル基又はフェニル基であることが好ましく、シクロヘキシル基であることがより好ましい。 Examples of the alkyl group having 1 to 12 carbon atoms represented by R 5 include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl, isoamyl, neopentyl, tert-amyl, sec-isoamyl, cyclopentyl, n-hexyl, cyclohexyl, n-heptyl, n-octyl, benzyl, phenethyl, naphthylmethyl Group, naphthylethyl group and the like.
Examples of the aromatic group having 6 to 12 carbon atoms represented by R 5 include a phenyl group and a naphthyl group. Examples of the substituent include an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group, a halogen atom, and a hydroxy group. Examples of the alkyl group having 1 to 6 carbon atoms as the substituent include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, and a tert-butyl group. N-pentyl group, isoamyl group, neopentyl group, tert-amyl group, sec-isoamyl group, cyclopentyl group, n-hexyl group, cyclohexyl group and the like. Examples of the alkoxy group having 1 to 6 carbon atoms as the substituent include methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, isobutoxy group, sec-butoxy group, tert-butoxy group. Group, n-pentyloxy group, isoamyloxy group, neopentyloxy group, tert-amyloxy group, sec-isoamyloxy group, cyclopentyloxy group, n-hexyloxy group, cyclohexyloxy group and the like.
Among these, R 5 is preferably a cyclohexyl group or a phenyl group, and more preferably a cyclohexyl group.
R5が表す炭素原子数6乃至12の芳香族基としては、例えば、フェニル基、ナフチル基等が挙げられる。またその置換基としては、炭素原子数1乃至6のアルキル基、炭素原子数1乃至6のアルコキシ基、フェニル基、ハロゲン原子、ヒドロキシ基等が挙げられる。前記置換基としての炭素原子数1乃至6のアルキル基としては、例えば、メチル基、エチル基、n-プロピル基、イソプロピル基、n-ブチル基、イソブチル基、sec-ブチル基、tert-ブチル基、n-ペンチル基、イソアミル基、ネオペンチル基、tert-アミル基、sec-イソアミル基、シクロペンチル基、n-ヘキシル基、シクロヘキシル基等が挙げられる。前記置換基としての炭素原子数1乃至6のアルコキシ基としては、例えば、メトキシ基、エトキシ基、n-プロポキシ基、イソプロポキシ基、n-ブトキシ基、イソブトキシ基、sec-ブトキシ基、tert-ブトキシ基、n-ペンチルオキシ基、イソアミルオキシ基、ネオペンチルオキシ基、tert-アミルオキシ基、sec-イソアミルオキシ基、シクロペンチルオキシ基、n-ヘキシルオキシ基、シクロヘキシルオキシ基等が挙げられる。
中でもR5はシクロヘキシル基又はフェニル基であることが好ましく、シクロヘキシル基であることがより好ましい。 Examples of the alkyl group having 1 to 12 carbon atoms represented by R 5 include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl, isoamyl, neopentyl, tert-amyl, sec-isoamyl, cyclopentyl, n-hexyl, cyclohexyl, n-heptyl, n-octyl, benzyl, phenethyl, naphthylmethyl Group, naphthylethyl group and the like.
Examples of the aromatic group having 6 to 12 carbon atoms represented by R 5 include a phenyl group and a naphthyl group. Examples of the substituent include an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group, a halogen atom, and a hydroxy group. Examples of the alkyl group having 1 to 6 carbon atoms as the substituent include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, and a tert-butyl group. N-pentyl group, isoamyl group, neopentyl group, tert-amyl group, sec-isoamyl group, cyclopentyl group, n-hexyl group, cyclohexyl group and the like. Examples of the alkoxy group having 1 to 6 carbon atoms as the substituent include methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, isobutoxy group, sec-butoxy group, tert-butoxy group. Group, n-pentyloxy group, isoamyloxy group, neopentyloxy group, tert-amyloxy group, sec-isoamyloxy group, cyclopentyloxy group, n-hexyloxy group, cyclohexyloxy group and the like.
Among these, R 5 is preferably a cyclohexyl group or a phenyl group, and more preferably a cyclohexyl group.
上記(b)重合性モノマーとしては、上記(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、並びに(b2)マレイミド誘導体の双方からなることが好ましい。
The (b) polymerizable monomer comprises both (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative. It is preferable.
本発明において、上記(b)重合性モノマーの含有量としては、(a)反応性シリコーン化合物100質量部に対し20~100質量部、より好ましくは25~60質量部である。
In the present invention, the content of the polymerizable monomer (b) is 20 to 100 parts by mass, more preferably 25 to 60 parts by mass with respect to 100 parts by mass of the (a) reactive silicone compound.
<(c)重合開始剤>
本発明の重合性組成物には、上記(a)反応性シリコーン化合物、及び(b)重合性モノマーに加えて、(c)重合開始剤を含み得る。重合開始剤としては、光重合開始剤及び熱重合開始剤の何れも使用することができる。 <(C) Polymerization initiator>
The polymerizable composition of the present invention may contain (c) a polymerization initiator in addition to (a) the reactive silicone compound and (b) the polymerizable monomer. As the polymerization initiator, any of a photopolymerization initiator and a thermal polymerization initiator can be used.
本発明の重合性組成物には、上記(a)反応性シリコーン化合物、及び(b)重合性モノマーに加えて、(c)重合開始剤を含み得る。重合開始剤としては、光重合開始剤及び熱重合開始剤の何れも使用することができる。 <(C) Polymerization initiator>
The polymerizable composition of the present invention may contain (c) a polymerization initiator in addition to (a) the reactive silicone compound and (b) the polymerizable monomer. As the polymerization initiator, any of a photopolymerization initiator and a thermal polymerization initiator can be used.
光重合開始剤としては、例えば、アルキルフェノン類、ベンゾフェノン類、アシルホスフィンオキシド類、ミヒラーのベンゾイルベンゾエート類、オキシムエステル類、テトラメチルチウラムモノスルフィド類、チオキサントン類等が挙げられる。
特に、光開裂型の光ラジカル重合開始剤が好ましい。光開裂型の光ラジカル重合開始剤については、最新UV硬化技術(159頁、発行人:高薄一弘、発行所:(株)技術情報協会、1991年発行)に記載されているものが挙げられる。
市販されている光ラジカル重合開始剤としては、例えば、IRGACURE(登録商標)184、同369、同651、同500、同819、同907、同784、同2959、同CGI1700、同CGI1750、同CGI1850、同CG24-61、同TPO、Darocur(登録商標)1116、同1173[以上、BASFジャパン(株)製]、ESACURE KIP150、同KIP65LT、同KIP100F、同KT37、同KT55、同KTO46、同KIP75[以上、ランベルティ社製]等を挙げることができる。 Examples of the photopolymerization initiator include alkylphenones, benzophenones, acylphosphine oxides, Michler's benzoylbenzoates, oxime esters, tetramethylthiuram monosulfides, and thioxanthones.
In particular, photocleavable photoradical polymerization initiators are preferred. Examples of the photocleavable photoradical polymerization initiator include those described in the latest UV curing technology (p. 159, publisher: Kazuhiro Takahisa, publisher: Technical Information Association, published in 1991). .
Examples of commercially available radical photopolymerization initiators include IRGACURE (registered trademark) 184, 369, 651, 500, 819, 907, 784, 2959, CGI 1700, CGI 1750, and CGI 1850. CG24-61, TPO, Darocur (registered trademark) 1116, 1173 [above, manufactured by BASF Japan Ltd.], ESACURE KIP150, KIP65LT, KIP100F, KT37, KT55, KTO46, KIP75 [ As mentioned above, Lamberti Co.] can be mentioned.
特に、光開裂型の光ラジカル重合開始剤が好ましい。光開裂型の光ラジカル重合開始剤については、最新UV硬化技術(159頁、発行人:高薄一弘、発行所:(株)技術情報協会、1991年発行)に記載されているものが挙げられる。
市販されている光ラジカル重合開始剤としては、例えば、IRGACURE(登録商標)184、同369、同651、同500、同819、同907、同784、同2959、同CGI1700、同CGI1750、同CGI1850、同CG24-61、同TPO、Darocur(登録商標)1116、同1173[以上、BASFジャパン(株)製]、ESACURE KIP150、同KIP65LT、同KIP100F、同KT37、同KT55、同KTO46、同KIP75[以上、ランベルティ社製]等を挙げることができる。 Examples of the photopolymerization initiator include alkylphenones, benzophenones, acylphosphine oxides, Michler's benzoylbenzoates, oxime esters, tetramethylthiuram monosulfides, and thioxanthones.
In particular, photocleavable photoradical polymerization initiators are preferred. Examples of the photocleavable photoradical polymerization initiator include those described in the latest UV curing technology (p. 159, publisher: Kazuhiro Takahisa, publisher: Technical Information Association, published in 1991). .
Examples of commercially available radical photopolymerization initiators include IRGACURE (registered trademark) 184, 369, 651, 500, 819, 907, 784, 2959, CGI 1700, CGI 1750, and CGI 1850. CG24-61, TPO, Darocur (registered trademark) 1116, 1173 [above, manufactured by BASF Japan Ltd.], ESACURE KIP150, KIP65LT, KIP100F, KT37, KT55, KTO46, KIP75 [ As mentioned above, Lamberti Co.] can be mentioned.
熱重合開始剤としては、例えば、アゾ類、有機過酸化物類等が挙げられる。
市販されているアゾ系熱重合開始剤としては、例えば、V-30、V-40、V-59、V-60、V-65、V-70[以上、和光純薬工業(株)製]等を挙げることができる。
また市販されている有機過酸化物系熱重合開始剤としては、例えば、パーカドックス(登録商標)CH、同BC-FF、同14、同16、トリゴノックス(登録商標)22、同23、同121、カヤエステル(登録商標)P、同O、カヤブチル(登録商標)B[以上、化薬アクゾ(株)製]、パーヘキサ(登録商標)HC、パークミル(登録商標)H、パーオクタ(登録商標)O、パーヘキシル(登録商標)O、同Z、パーブチル(登録商標)O、同Z[以上、日油(株)製]等を挙げることができるが、これらに限定されるものではない。 Examples of the thermal polymerization initiator include azos and organic peroxides.
Examples of commercially available azo-based thermal polymerization initiators include V-30, V-40, V-59, V-60, V-65, and V-70 [above, manufactured by Wako Pure Chemical Industries, Ltd.] Etc.
Examples of commercially available organic peroxide thermal polymerization initiators include, for example, Parkadox (registered trademark) CH, BC-FF, 14, 16 and Trigonox (registered trademark) 22, 23, 121. , Kayaester (registered trademark) P, O, Kayabutyl (registered trademark) B [above, manufactured by Kayaku Akzo Co., Ltd.], Perhexa (registered trademark) HC, Parkmill (registered trademark) H, Perocta (registered trademark) O Perhexyl (registered trademark) O, Z, perbutyl (registered trademark) O, Z [above, manufactured by NOF Corporation] and the like, but is not limited thereto.
市販されているアゾ系熱重合開始剤としては、例えば、V-30、V-40、V-59、V-60、V-65、V-70[以上、和光純薬工業(株)製]等を挙げることができる。
また市販されている有機過酸化物系熱重合開始剤としては、例えば、パーカドックス(登録商標)CH、同BC-FF、同14、同16、トリゴノックス(登録商標)22、同23、同121、カヤエステル(登録商標)P、同O、カヤブチル(登録商標)B[以上、化薬アクゾ(株)製]、パーヘキサ(登録商標)HC、パークミル(登録商標)H、パーオクタ(登録商標)O、パーヘキシル(登録商標)O、同Z、パーブチル(登録商標)O、同Z[以上、日油(株)製]等を挙げることができるが、これらに限定されるものではない。 Examples of the thermal polymerization initiator include azos and organic peroxides.
Examples of commercially available azo-based thermal polymerization initiators include V-30, V-40, V-59, V-60, V-65, and V-70 [above, manufactured by Wako Pure Chemical Industries, Ltd.] Etc.
Examples of commercially available organic peroxide thermal polymerization initiators include, for example, Parkadox (registered trademark) CH, BC-FF, 14, 16 and Trigonox (registered trademark) 22, 23, 121. , Kayaester (registered trademark) P, O, Kayabutyl (registered trademark) B [above, manufactured by Kayaku Akzo Co., Ltd.], Perhexa (registered trademark) HC, Parkmill (registered trademark) H, Perocta (registered trademark) O Perhexyl (registered trademark) O, Z, perbutyl (registered trademark) O, Z [above, manufactured by NOF Corporation] and the like, but is not limited thereto.
重合開始剤を添加する場合、重合開始剤は一種単独で、又は二種以上を混合して用いてもよい。また、その添加量としては、(a)反応性シリコーン化合物100質量部に対して0.1~20質量部、さらに好ましくは0.3~10質量部である。
When a polymerization initiator is added, the polymerization initiators may be used alone or in combination of two or more. The addition amount is 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass with respect to 100 parts by mass of the (a) reactive silicone compound.
<その他添加剤>
さらに、本発明の重合性組成物には、本発明の効果を損なわない限りにおいて、必要に応じて、反応性希釈剤、連鎖移動剤、酸化防止剤、紫外線吸収剤、界面活性剤、レベリング剤、消泡剤、密着性向上剤等のその他の成分を適宜添加してもよい。 <Other additives>
Furthermore, in the polymerizable composition of the present invention, a reactive diluent, a chain transfer agent, an antioxidant, an ultraviolet absorber, a surfactant, and a leveling agent are added as necessary as long as the effects of the present invention are not impaired. Other components such as an antifoaming agent and an adhesion improver may be added as appropriate.
さらに、本発明の重合性組成物には、本発明の効果を損なわない限りにおいて、必要に応じて、反応性希釈剤、連鎖移動剤、酸化防止剤、紫外線吸収剤、界面活性剤、レベリング剤、消泡剤、密着性向上剤等のその他の成分を適宜添加してもよい。 <Other additives>
Furthermore, in the polymerizable composition of the present invention, a reactive diluent, a chain transfer agent, an antioxidant, an ultraviolet absorber, a surfactant, and a leveling agent are added as necessary as long as the effects of the present invention are not impaired. Other components such as an antifoaming agent and an adhesion improver may be added as appropriate.
<重合性組成物の調製方法>
本実施の形態の重合性組成物の調製方法は、特に限定されない。調製法としては、例えば、(a)成分、(b)成分及び必要に応じて(c)成分を所定の割合で混合し、所望によりその他添加剤をさらに添加して混合し、均一な溶液とする方法、又はこれらの成分に加え更に慣用の溶剤を使用する方法等が挙げられる。 <Method for Preparing Polymerizable Composition>
The method for preparing the polymerizable composition of the present embodiment is not particularly limited. As a preparation method, for example, the (a) component, the (b) component, and the (c) component as necessary are mixed at a predetermined ratio, and other additives are further added and mixed as desired. Or a method using a conventional solvent in addition to these components.
本実施の形態の重合性組成物の調製方法は、特に限定されない。調製法としては、例えば、(a)成分、(b)成分及び必要に応じて(c)成分を所定の割合で混合し、所望によりその他添加剤をさらに添加して混合し、均一な溶液とする方法、又はこれらの成分に加え更に慣用の溶剤を使用する方法等が挙げられる。 <Method for Preparing Polymerizable Composition>
The method for preparing the polymerizable composition of the present embodiment is not particularly limited. As a preparation method, for example, the (a) component, the (b) component, and the (c) component as necessary are mixed at a predetermined ratio, and other additives are further added and mixed as desired. Or a method using a conventional solvent in addition to these components.
重合性組成物における固形分の割合は、各成分が溶剤に均一に溶解している限りは特に限定はないが、例えば1~50質量%であり、又は、1~30質量%であり、又は1~25質量%である。ここで固形分とは、重合性組成物の全成分から溶剤成分を除いたものである。
The ratio of the solid content in the polymerizable composition is not particularly limited as long as each component is uniformly dissolved in the solvent, and is, for example, 1 to 50% by mass, or 1 to 30% by mass, or 1 to 25% by mass. Here, the solid content is obtained by removing the solvent component from all components of the polymerizable composition.
また、重合性組成物の溶液は、孔径が0.05~5μmのフィルタなどを用いてろ過した後、使用することが好ましい。
The solution of the polymerizable composition is preferably used after being filtered using a filter having a pore size of 0.05 to 5 μm.
<<硬化物>>
本発明は、また上記重合性組成物を光又は熱重合して得られる硬化物に関する。
光重合に用いる活性光線としては、例えば、紫外線、電子線、X線等が挙げられる。紫外線照射に用いる光源としては、太陽光線、ケミカルランプ、低圧水銀灯、高圧水銀灯、メタルハライドランプ、キセノンランプ、UV-LED等が使用できる。また、光重合後、必要に応じてポストベークを行うことにより、具体的にはホットプレート、オーブン等を用いて加熱することにより重合を完結させることができる。ポストベークの条件としては、特に限定されないが、通常、50~260℃、1~120分間の範囲で行われる。
熱重合における加熱条件としては、特に限定されないが、通常、50~300℃、1~120分間の範囲から適宜選択される。また、加熱手段としては、特に限定されないが、例えば、ホットプレート、オーブン等が挙げられる。 << cured product >>
The present invention also relates to a cured product obtained by photo or thermal polymerization of the polymerizable composition.
Examples of actinic rays used for photopolymerization include ultraviolet rays, electron beams, and X-rays. As a light source used for ultraviolet irradiation, sunlight, a chemical lamp, a low-pressure mercury lamp, a high-pressure mercury lamp, a metal halide lamp, a xenon lamp, a UV-LED, or the like can be used. In addition, after the photopolymerization, if necessary, post-baking is performed, and specifically, the polymerization can be completed by heating using a hot plate, an oven or the like. The post-baking conditions are not particularly limited, but are usually 50 to 260 ° C. for 1 to 120 minutes.
The heating conditions in the thermal polymerization are not particularly limited, but are usually appropriately selected from the range of 50 to 300 ° C. and 1 to 120 minutes. Moreover, it does not specifically limit as a heating means, For example, a hotplate, oven, etc. are mentioned.
本発明は、また上記重合性組成物を光又は熱重合して得られる硬化物に関する。
光重合に用いる活性光線としては、例えば、紫外線、電子線、X線等が挙げられる。紫外線照射に用いる光源としては、太陽光線、ケミカルランプ、低圧水銀灯、高圧水銀灯、メタルハライドランプ、キセノンランプ、UV-LED等が使用できる。また、光重合後、必要に応じてポストベークを行うことにより、具体的にはホットプレート、オーブン等を用いて加熱することにより重合を完結させることができる。ポストベークの条件としては、特に限定されないが、通常、50~260℃、1~120分間の範囲で行われる。
熱重合における加熱条件としては、特に限定されないが、通常、50~300℃、1~120分間の範囲から適宜選択される。また、加熱手段としては、特に限定されないが、例えば、ホットプレート、オーブン等が挙げられる。 << cured product >>
The present invention also relates to a cured product obtained by photo or thermal polymerization of the polymerizable composition.
Examples of actinic rays used for photopolymerization include ultraviolet rays, electron beams, and X-rays. As a light source used for ultraviolet irradiation, sunlight, a chemical lamp, a low-pressure mercury lamp, a high-pressure mercury lamp, a metal halide lamp, a xenon lamp, a UV-LED, or the like can be used. In addition, after the photopolymerization, if necessary, post-baking is performed, and specifically, the polymerization can be completed by heating using a hot plate, an oven or the like. The post-baking conditions are not particularly limited, but are usually 50 to 260 ° C. for 1 to 120 minutes.
The heating conditions in the thermal polymerization are not particularly limited, but are usually appropriately selected from the range of 50 to 300 ° C. and 1 to 120 minutes. Moreover, it does not specifically limit as a heating means, For example, a hotplate, oven, etc. are mentioned.
本発明の硬化物は、波長589nmにおける屈折率が1.5以上と高いものであり、また、加熱による黄変及びクラックの発生が抑制され、寸法安定性を有するものであるから、硬化レリーフパターン材料、特に光学レンズ等の高屈折率樹脂レンズ用材料として有用である。
The cured product of the present invention has a refractive index as high as 1.5 or more at a wavelength of 589 nm, and also has a dimensional stability by suppressing the occurrence of yellowing and cracks due to heating. It is useful as a material for a high refractive index resin lens such as an optical lens.
<<成形体>>
本発明の硬化物は、上記重合性組成物を基材上にコーティングして光又は熱重合(硬化)させることにより、硬化膜や積層体などの成形品として得ることができる。また、例えば、圧縮成形、射出成形、ブロー成形、真空成形等の慣用の成形法を使用することによって、各種成形体を容易に製造することができる。
前記基材としては、例えば、プラスチック(ポリカーボネート、ポリメタクリレート、ポリスチレン、PET(ポリエチレンテレフタレート)などのポリエステル、ポリオレフィン、エポキシ樹脂、メラミン樹脂、トリアセチルセルロース、ABS樹脂(アクリロニトリル-ブタジエン-スチレン共重合物)、AS樹脂(アクリロニトリル-スチレン共重合物)、ノルボルネン系樹脂等)、金属、木材、紙、ガラス、スレート等を挙げることができる。これら基材の形状は板状、フィルム状又は3次元成形体でもよい。 << Molded Article >>
The hardened | cured material of this invention can be obtained as molded articles, such as a cured film and a laminated body, by coating the said polymeric composition on a base material and carrying out light or thermal polymerization (hardening). Further, for example, various molded bodies can be easily produced by using a conventional molding method such as compression molding, injection molding, blow molding, or vacuum molding.
Examples of the substrate include plastics (polyesters such as polycarbonate, polymethacrylate, polystyrene, and PET (polyethylene terephthalate), polyolefins, epoxy resins, melamine resins, triacetyl cellulose, and ABS resins (acrylonitrile-butadiene-styrene copolymer). AS resin (acrylonitrile-styrene copolymer), norbornene resin, etc.), metal, wood, paper, glass, slate and the like. The shape of these base materials may be a plate shape, a film shape, or a three-dimensional molded body.
本発明の硬化物は、上記重合性組成物を基材上にコーティングして光又は熱重合(硬化)させることにより、硬化膜や積層体などの成形品として得ることができる。また、例えば、圧縮成形、射出成形、ブロー成形、真空成形等の慣用の成形法を使用することによって、各種成形体を容易に製造することができる。
前記基材としては、例えば、プラスチック(ポリカーボネート、ポリメタクリレート、ポリスチレン、PET(ポリエチレンテレフタレート)などのポリエステル、ポリオレフィン、エポキシ樹脂、メラミン樹脂、トリアセチルセルロース、ABS樹脂(アクリロニトリル-ブタジエン-スチレン共重合物)、AS樹脂(アクリロニトリル-スチレン共重合物)、ノルボルネン系樹脂等)、金属、木材、紙、ガラス、スレート等を挙げることができる。これら基材の形状は板状、フィルム状又は3次元成形体でもよい。 << Molded Article >>
The hardened | cured material of this invention can be obtained as molded articles, such as a cured film and a laminated body, by coating the said polymeric composition on a base material and carrying out light or thermal polymerization (hardening). Further, for example, various molded bodies can be easily produced by using a conventional molding method such as compression molding, injection molding, blow molding, or vacuum molding.
Examples of the substrate include plastics (polyesters such as polycarbonate, polymethacrylate, polystyrene, and PET (polyethylene terephthalate), polyolefins, epoxy resins, melamine resins, triacetyl cellulose, and ABS resins (acrylonitrile-butadiene-styrene copolymer). AS resin (acrylonitrile-styrene copolymer), norbornene resin, etc.), metal, wood, paper, glass, slate and the like. The shape of these base materials may be a plate shape, a film shape, or a three-dimensional molded body.
本発明の重合性組成物のコーティング方法は、キャストコート法、スピンコート法、ブレードコート法、ディップコート法、ロールコート法、スプレーコート法、バーコート法、ダイコート法、インクジェット法、印刷法(凸版、凹版、平版、スクリーン印刷等)等を適宜選択し得、中でも短時間で塗布でき、また、容易に均一な塗布を行うことができるという利点より、バーコート法を用いることが望ましい。ここで用いる重合性組成物は、ワニスの形態にあるものを好適に使用できる。
なお、コーティングによる膜の厚さは、乾燥、硬化後において、通常0.01~50μm、好ましくは0.05~30μm、特に好ましくは0.1~30μmである。 The coating method of the polymerizable composition of the present invention includes a cast coating method, a spin coating method, a blade coating method, a dip coating method, a roll coating method, a spray coating method, a bar coating method, a die coating method, an ink jet method, a printing method (letter plate). , Intaglio, lithographic, screen printing, etc.) can be selected as appropriate, and it is desirable to use a bar coating method because of the advantage that it can be applied in a short time and can be uniformly applied easily. The polymerizable composition used here can be suitably used in the form of a varnish.
The thickness of the film formed by coating is usually 0.01 to 50 μm, preferably 0.05 to 30 μm, particularly preferably 0.1 to 30 μm after drying and curing.
なお、コーティングによる膜の厚さは、乾燥、硬化後において、通常0.01~50μm、好ましくは0.05~30μm、特に好ましくは0.1~30μmである。 The coating method of the polymerizable composition of the present invention includes a cast coating method, a spin coating method, a blade coating method, a dip coating method, a roll coating method, a spray coating method, a bar coating method, a die coating method, an ink jet method, a printing method (letter plate). , Intaglio, lithographic, screen printing, etc.) can be selected as appropriate, and it is desirable to use a bar coating method because of the advantage that it can be applied in a short time and can be uniformly applied easily. The polymerizable composition used here can be suitably used in the form of a varnish.
The thickness of the film formed by coating is usually 0.01 to 50 μm, preferably 0.05 to 30 μm, particularly preferably 0.1 to 30 μm after drying and curing.
成形体を製造する方法としては、例えば、上記重合性組成物を、支持体と鋳型との間の空間に充填する工程、当該充填された組成物を露光して光重合する工程、支持体上の光重合物を鋳型から離型する工程、光重合物を支持体ごと加熱する工程、を含む成形体の製造方法等が挙げられる。
上記製造方法によって得られた成形体は、マイクロレンズアレイとして好適に使用することができる。 As a method for producing a molded body, for example, a step of filling the polymerizable composition in a space between the support and the mold, a step of exposing the filled composition to photopolymerization, and a step on the support And a method for producing a molded article, including a step of releasing the photopolymerized product from the mold and a step of heating the photopolymerized product together with the support.
The molded body obtained by the above production method can be suitably used as a microlens array.
上記製造方法によって得られた成形体は、マイクロレンズアレイとして好適に使用することができる。 As a method for producing a molded body, for example, a step of filling the polymerizable composition in a space between the support and the mold, a step of exposing the filled composition to photopolymerization, and a step on the support And a method for producing a molded article, including a step of releasing the photopolymerized product from the mold and a step of heating the photopolymerized product together with the support.
The molded body obtained by the above production method can be suitably used as a microlens array.
以下、実施例を挙げて、本発明をより具体的に説明するが、本発明は下記の実施例に限定されるものではない。
なお、実施例において、試料の調製及び物性の分析に用いた装置及び条件は、以下の通りである。 EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated more concretely, this invention is not limited to the following Example.
In the examples, the apparatus and conditions used for sample preparation and physical property analysis are as follows.
なお、実施例において、試料の調製及び物性の分析に用いた装置及び条件は、以下の通りである。 EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated more concretely, this invention is not limited to the following Example.
In the examples, the apparatus and conditions used for sample preparation and physical property analysis are as follows.
(1)1H NMRスペクトル
装置:日本電子(株)製 JNM-ECX300
測定溶媒:CDCl3
基準物質:テトラメチルシラン(0.00ppm)
(2)ゲル浸透クロマトグラフィー(GPC)
装置:東ソー(株)製 HLC-8320GPC
カラム:昭和電工(株)製 Shodex(登録商標)GPC KF-802.5、GPC KF-803
カラム温度:40℃
溶媒:テトラヒドロフラン
検出器:UV(254nm)
検量線:標準ポリスチレン
(3)撹拌脱泡機
装置:(株)シンキー製 自転・公転ミキサー あわとり錬太郎(登録商標)ARE-310
(4)UV露光
装置:アイグラフィックス(株)製 バッチ式UV照射装置(高圧水銀灯2kW×1灯)
(5)光線透過率
装置:(株)島津製作所製 紫外可視分光光度計UV-3100
(6)ガラス転移温度(Tg)
装置:TA Instrument社製 動的粘弾性測定装置(DMA)Q800
変形モード:引っ張り
周波数:1Hz
歪:0.1%
測定温度:25~250℃
昇温速度:10℃/分
(7)屈折率
装置:(株)アタゴ製 多波長アッベ屈折計DR-M4
中間液:モノブロモナフタレン
測定温度:23℃
(8)ナノインプリンター
装置:明昌機工(株) NM-0801B
ランプ:(株)東芝製 ショートアーク水銀灯
(9)SEM観察
装置:(株)日立ハイテクノロジーズ製 電界放出形走査電子顕微鏡S-4800 (1) 1 H NMR spectrum apparatus: JNM-ECX300 manufactured by JEOL Ltd.
Measuring solvent: CDCl 3
Reference substance: Tetramethylsilane (0.00ppm)
(2) Gel permeation chromatography (GPC)
Equipment: HLC-8320GPC manufactured by Tosoh Corporation
Column: Shodex (registered trademark) GPC KF-802.5, GPC KF-803 manufactured by Showa Denko K.K.
Column temperature: 40 ° C
Solvent: Tetrahydrofuran Detector: UV (254 nm)
Calibration curve: Standard polystyrene (3) Stirring and deaerator Machine: Rotating and revolving mixer manufactured by Shinkey Co., Ltd. Awatori Rentaro (registered trademark) ARE-310
(4) UV exposure device: Batch type UV irradiation device (high pressure mercury lamp 2kW x 1 lamp) manufactured by Eye Graphics Co., Ltd.
(5) Light transmittance apparatus: UV-visible spectrophotometer UV-3100 manufactured by Shimadzu Corporation
(6) Glass transition temperature (Tg)
Apparatus: Dynamic viscoelasticity measuring apparatus (DMA) Q800 manufactured by TA Instrument
Deformation mode: Pulling frequency: 1 Hz
Strain: 0.1%
Measurement temperature: 25-250 ° C
Temperature rising rate: 10 ° C./min (7) Refractive index Device: Multi-wavelength Abbe refractometer DR-M4 manufactured by Atago Co., Ltd.
Intermediate liquid: Monobromonaphthalene Measurement temperature: 23 ° C
(8) Nanoimprinter Device: Myeongchang Kiko NM-0801B
Lamp: Toshiba Corporation Short Arc Mercury Lamp (9) SEM Observation Equipment: Field Emission Scanning Electron Microscope S-4800, Hitachi High-Technologies Corporation
装置:日本電子(株)製 JNM-ECX300
測定溶媒:CDCl3
基準物質:テトラメチルシラン(0.00ppm)
(2)ゲル浸透クロマトグラフィー(GPC)
装置:東ソー(株)製 HLC-8320GPC
カラム:昭和電工(株)製 Shodex(登録商標)GPC KF-802.5、GPC KF-803
カラム温度:40℃
溶媒:テトラヒドロフラン
検出器:UV(254nm)
検量線:標準ポリスチレン
(3)撹拌脱泡機
装置:(株)シンキー製 自転・公転ミキサー あわとり錬太郎(登録商標)ARE-310
(4)UV露光
装置:アイグラフィックス(株)製 バッチ式UV照射装置(高圧水銀灯2kW×1灯)
(5)光線透過率
装置:(株)島津製作所製 紫外可視分光光度計UV-3100
(6)ガラス転移温度(Tg)
装置:TA Instrument社製 動的粘弾性測定装置(DMA)Q800
変形モード:引っ張り
周波数:1Hz
歪:0.1%
測定温度:25~250℃
昇温速度:10℃/分
(7)屈折率
装置:(株)アタゴ製 多波長アッベ屈折計DR-M4
中間液:モノブロモナフタレン
測定温度:23℃
(8)ナノインプリンター
装置:明昌機工(株) NM-0801B
ランプ:(株)東芝製 ショートアーク水銀灯
(9)SEM観察
装置:(株)日立ハイテクノロジーズ製 電界放出形走査電子顕微鏡S-4800 (1) 1 H NMR spectrum apparatus: JNM-ECX300 manufactured by JEOL Ltd.
Measuring solvent: CDCl 3
Reference substance: Tetramethylsilane (0.00ppm)
(2) Gel permeation chromatography (GPC)
Equipment: HLC-8320GPC manufactured by Tosoh Corporation
Column: Shodex (registered trademark) GPC KF-802.5, GPC KF-803 manufactured by Showa Denko K.K.
Column temperature: 40 ° C
Solvent: Tetrahydrofuran Detector: UV (254 nm)
Calibration curve: Standard polystyrene (3) Stirring and deaerator Machine: Rotating and revolving mixer manufactured by Shinkey Co., Ltd. Awatori Rentaro (registered trademark) ARE-310
(4) UV exposure device: Batch type UV irradiation device (high pressure mercury lamp 2kW x 1 lamp) manufactured by Eye Graphics Co., Ltd.
(5) Light transmittance apparatus: UV-visible spectrophotometer UV-3100 manufactured by Shimadzu Corporation
(6) Glass transition temperature (Tg)
Apparatus: Dynamic viscoelasticity measuring apparatus (DMA) Q800 manufactured by TA Instrument
Deformation mode: Pulling frequency: 1 Hz
Strain: 0.1%
Measurement temperature: 25-250 ° C
Temperature rising rate: 10 ° C./min (7) Refractive index Device: Multi-wavelength Abbe refractometer DR-M4 manufactured by Atago Co., Ltd.
Intermediate liquid: Monobromonaphthalene Measurement temperature: 23 ° C
(8) Nanoimprinter Device: Myeongchang Kiko NM-0801B
Lamp: Toshiba Corporation Short Arc Mercury Lamp (9) SEM Observation Equipment: Field Emission Scanning Electron Microscope S-4800, Hitachi High-Technologies Corporation
また、略記号は以下の意味を表す。
ADCP:トリシクロ[5.2.1.02,6]デカンジメタノールジアクリレート[新中村化学工業(株)製 NKエステルA-DCP]
ADM:1-アダマンチルメタクリレート[出光興産(株)製 アダマンテート(登録商標)M-104]
BZM:ベンジルメタクリレート[Aldrich社製]
CHM:N-シクロヘキシルマレイミド[(株)日本触媒製 イミレックス(登録商標)-C]
DCPM:トリシクロ[5.2.1.02,6]デカニルメタクリレート[日立化成(株)製 ファンクリル(登録商標)FA-513M]
EPPA:エトキシ化o-フェニルフェノールアクリレート[新中村化学工業(株)製 NKエステルA-LEN-10]
I184:1-ヒドロキシシクロヘキシル=フェニル=ケトン[BASFジャパン(株)製 IRGACURE(登録商標)184]
IBA:イソボルニルアクリレート[東京化成工業(株)製]
PEBHT:ペンタエリトリトールテトラキス(3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオナート)[東京化成工業(株)製]
TPO:ジフェニル(2,4,6-トリメチルベンゾイル)ホスフィンオキシド[BASFジャパン(株)製 IRGACURE(登録商標)TPO] Abbreviations represent the following meanings.
ADCP: Tricyclo [5.2.1.0 2,6 ] decane dimethanol diacrylate [NK Nakano Chemical Co., Ltd. NK ester A-DCP]
ADM: 1-adamantyl methacrylate [Adamantate (registered trademark) M-104, manufactured by Idemitsu Kosan Co., Ltd.]
BZM: benzyl methacrylate [manufactured by Aldrich]
CHM: N-cyclohexylmaleimide [Imirex (registered trademark) -C, manufactured by Nippon Shokubai Co., Ltd.]
DCPM: Tricyclo [5.2.1.0 2,6 ] decanyl methacrylate [manufactured by Hitachi Chemical Co., Ltd., FANCLIL (registered trademark) FA-513M]
EPPA: ethoxylated o-phenylphenol acrylate [manufactured by Shin-Nakamura Chemical Co., Ltd., NK Ester A-LEN-10]
I184: 1-hydroxycyclohexyl = phenyl ketone [IRGACURE (registered trademark) 184 manufactured by BASF Japan Ltd.]
IBA: Isobornyl acrylate [manufactured by Tokyo Chemical Industry Co., Ltd.]
PEBHT: Pentaerythritol tetrakis (3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate) [manufactured by Tokyo Chemical Industry Co., Ltd.]
TPO: Diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide [IRGACURE (registered trademark) TPO manufactured by BASF Japan Ltd.]
ADCP:トリシクロ[5.2.1.02,6]デカンジメタノールジアクリレート[新中村化学工業(株)製 NKエステルA-DCP]
ADM:1-アダマンチルメタクリレート[出光興産(株)製 アダマンテート(登録商標)M-104]
BZM:ベンジルメタクリレート[Aldrich社製]
CHM:N-シクロヘキシルマレイミド[(株)日本触媒製 イミレックス(登録商標)-C]
DCPM:トリシクロ[5.2.1.02,6]デカニルメタクリレート[日立化成(株)製 ファンクリル(登録商標)FA-513M]
EPPA:エトキシ化o-フェニルフェノールアクリレート[新中村化学工業(株)製 NKエステルA-LEN-10]
I184:1-ヒドロキシシクロヘキシル=フェニル=ケトン[BASFジャパン(株)製 IRGACURE(登録商標)184]
IBA:イソボルニルアクリレート[東京化成工業(株)製]
PEBHT:ペンタエリトリトールテトラキス(3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオナート)[東京化成工業(株)製]
TPO:ジフェニル(2,4,6-トリメチルベンゾイル)ホスフィンオキシド[BASFジャパン(株)製 IRGACURE(登録商標)TPO] Abbreviations represent the following meanings.
ADCP: Tricyclo [5.2.1.0 2,6 ] decane dimethanol diacrylate [NK Nakano Chemical Co., Ltd. NK ester A-DCP]
ADM: 1-adamantyl methacrylate [Adamantate (registered trademark) M-104, manufactured by Idemitsu Kosan Co., Ltd.]
BZM: benzyl methacrylate [manufactured by Aldrich]
CHM: N-cyclohexylmaleimide [Imirex (registered trademark) -C, manufactured by Nippon Shokubai Co., Ltd.]
DCPM: Tricyclo [5.2.1.0 2,6 ] decanyl methacrylate [manufactured by Hitachi Chemical Co., Ltd., FANCLIL (registered trademark) FA-513M]
EPPA: ethoxylated o-phenylphenol acrylate [manufactured by Shin-Nakamura Chemical Co., Ltd., NK Ester A-LEN-10]
I184: 1-hydroxycyclohexyl = phenyl ketone [IRGACURE (registered trademark) 184 manufactured by BASF Japan Ltd.]
IBA: Isobornyl acrylate [manufactured by Tokyo Chemical Industry Co., Ltd.]
PEBHT: Pentaerythritol tetrakis (3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate) [manufactured by Tokyo Chemical Industry Co., Ltd.]
TPO: Diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide [IRGACURE (registered trademark) TPO manufactured by BASF Japan Ltd.]
[製造例1]反応性シリコーン化合物の製造
冷却器を備えた1Lのナス型フラスコに、ジフェニルシランジオール[東京化成工業(株)製]177g(0.80mol)、トリメトキシ(4-ビニルフェニル)シラン[信越化学工業(株)製]179g(0.80mol)、及びトルエン141gを仕込み、窒素バルーンを用いてフラスコ中の空気を窒素で置換した。この反応混合物を50℃に加熱後、水酸化バリウム一水和物[Aldrich社製]0.303g(1.6mmol)を添加し、さらに50℃で2日間撹拌して脱アルコール縮合を行った。反応混合物を室温(およそ25℃)まで冷却し、孔径0.2μmのメンブレンフィルターを用いて不溶物を除去した。ロータリーエバポレーターを用いて、この反応混合物からトルエン及び副生成物のメタノールを50℃で減圧留去することで、無色透明油状物の反応性シリコーン化合物305gを得た。
得られた反応性シリコーン化合物の1H NMRスペクトルを図1に示す。また、GPCによるポリスチレン換算で測定される重量平均分子量Mwは1,600、分散度Mw(重量平均分子量)/Mn(数平均分子量)は1.3であった。 [Production Example 1] Production of reactive silicone compound In a 1 L eggplant-shaped flask equipped with a condenser, 177 g (0.80 mol) of diphenylsilanediol [manufactured by Tokyo Chemical Industry Co., Ltd.], trimethoxy (4-vinylphenyl) silane [Shin-Etsu Chemical Co., Ltd.] 179 g (0.80 mol) and 141 g of toluene were charged, and the air in the flask was replaced with nitrogen using a nitrogen balloon. After this reaction mixture was heated to 50 ° C., 0.303 g (1.6 mmol) of barium hydroxide monohydrate [manufactured by Aldrich] was added, and the mixture was further stirred at 50 ° C. for 2 days for dealcohol condensation. The reaction mixture was cooled to room temperature (approximately 25 ° C.), and insoluble matters were removed using a membrane filter having a pore size of 0.2 μm. Using a rotary evaporator, toluene and by-product methanol were distilled off from this reaction mixture under reduced pressure at 50 ° C. to obtain 305 g of a colorless transparent oily reactive silicone compound.
The 1 H NMR spectrum of the obtained reactive silicone compound is shown in FIG. Moreover, the weight average molecular weight Mw measured by polystyrene conversion by GPC was 1,600, and dispersion degree Mw (weight average molecular weight) / Mn (number average molecular weight) was 1.3.
冷却器を備えた1Lのナス型フラスコに、ジフェニルシランジオール[東京化成工業(株)製]177g(0.80mol)、トリメトキシ(4-ビニルフェニル)シラン[信越化学工業(株)製]179g(0.80mol)、及びトルエン141gを仕込み、窒素バルーンを用いてフラスコ中の空気を窒素で置換した。この反応混合物を50℃に加熱後、水酸化バリウム一水和物[Aldrich社製]0.303g(1.6mmol)を添加し、さらに50℃で2日間撹拌して脱アルコール縮合を行った。反応混合物を室温(およそ25℃)まで冷却し、孔径0.2μmのメンブレンフィルターを用いて不溶物を除去した。ロータリーエバポレーターを用いて、この反応混合物からトルエン及び副生成物のメタノールを50℃で減圧留去することで、無色透明油状物の反応性シリコーン化合物305gを得た。
得られた反応性シリコーン化合物の1H NMRスペクトルを図1に示す。また、GPCによるポリスチレン換算で測定される重量平均分子量Mwは1,600、分散度Mw(重量平均分子量)/Mn(数平均分子量)は1.3であった。 [Production Example 1] Production of reactive silicone compound In a 1 L eggplant-shaped flask equipped with a condenser, 177 g (0.80 mol) of diphenylsilanediol [manufactured by Tokyo Chemical Industry Co., Ltd.], trimethoxy (4-vinylphenyl) silane [Shin-Etsu Chemical Co., Ltd.] 179 g (0.80 mol) and 141 g of toluene were charged, and the air in the flask was replaced with nitrogen using a nitrogen balloon. After this reaction mixture was heated to 50 ° C., 0.303 g (1.6 mmol) of barium hydroxide monohydrate [manufactured by Aldrich] was added, and the mixture was further stirred at 50 ° C. for 2 days for dealcohol condensation. The reaction mixture was cooled to room temperature (approximately 25 ° C.), and insoluble matters were removed using a membrane filter having a pore size of 0.2 μm. Using a rotary evaporator, toluene and by-product methanol were distilled off from this reaction mixture under reduced pressure at 50 ° C. to obtain 305 g of a colorless transparent oily reactive silicone compound.
The 1 H NMR spectrum of the obtained reactive silicone compound is shown in FIG. Moreover, the weight average molecular weight Mw measured by polystyrene conversion by GPC was 1,600, and dispersion degree Mw (weight average molecular weight) / Mn (number average molecular weight) was 1.3.
[実施例1]
[重合性組成物の調製]
製造例1で製造した反応性シリコーン化合物32質量部、単官能モノマーとしてDCPM8質量部、酸化防止剤としてPEBHT0.2質量部、及び重合開始剤としてI184 2質量部を混合し、2000rpmで30分間撹拌脱泡することで重合性組成物を得た。
[硬化物(薄膜)の作製及び加熱による透過率低下の評価]
上記重合性組成物を、ガラス基板上にギャップ25μmのアプリケーターで塗布した。この塗膜を、窒素雰囲気下、20mW/cm2(365nm検出)で1分間UV露光し、さらに150℃のホットプレートで10分間加熱することで硬化膜を作製した。
得られた硬化膜の、加熱試験(200℃、3時間)前後の波長400nmの光線透過率を測定し、加熱による透過率の低下を評価した。結果を表1に示す。
[硬化物の作製及び物性の評価]
上記重合性組成物を、ガラス基板上に置いた中央部を30mm×5mmの矩形に切り抜いた200μm厚のシリコーン製型枠中に流し込み、別のガラス基板を上方から被せた。この二枚のガラス基板で挟み込んだ型枠中の重合性組成物を、20mW/cm2(365nm検出)で1分間UV露光し硬化させた。硬化後、ガラス基板及び型枠を外して取り出した硬化物を、さらに150℃のオーブンで10分間加熱することで硬化物を作製した。
得られた硬化物の、ガラス転移温度(Tg)及びD線(波長589nm)の屈折率(nd)を評価した。なお、Tgについては、DMAにより貯蔵弾性率E’及び損失弾性率E’’を測定し、これらから求められるtanδ(損失弾性率E’’/貯蔵弾性率E’)の値が極大を示す温度をTgとした。結果を表1に併せて示す。 [Example 1]
[Preparation of polymerizable composition]
32 parts by mass of the reactive silicone compound produced in Production Example 1, 8 parts by mass of DCPM as a monofunctional monomer, 0.2 parts by mass of PEBHT as an antioxidant, and 2 parts by mass of I184 as a polymerization initiator are mixed and stirred at 2000 rpm for 30 minutes. A polymerizable composition was obtained by defoaming.
[Production of cured product (thin film) and evaluation of transmittance reduction by heating]
The polymerizable composition was applied on a glass substrate with an applicator having a gap of 25 μm. This coating film was subjected to UV exposure at 20 mW / cm 2 (365 nm detection) for 1 minute in a nitrogen atmosphere, and further heated on a hot plate at 150 ° C. for 10 minutes to produce a cured film.
The obtained cured film was measured for light transmittance at a wavelength of 400 nm before and after a heating test (200 ° C., 3 hours), and evaluated for a decrease in transmittance due to heating. The results are shown in Table 1.
[Production of cured product and evaluation of physical properties]
The above-mentioned polymerizable composition was poured into a 200 μm-thick silicone mold obtained by cutting out a central portion placed on a glass substrate into a rectangle of 30 mm × 5 mm, and another glass substrate was covered from above. The polymerizable composition in the mold sandwiched between these two glass substrates was cured by UV exposure for 1 minute at 20 mW / cm 2 (365 nm detection). After curing, the cured product obtained by removing the glass substrate and the mold was further heated in an oven at 150 ° C. for 10 minutes to prepare a cured product.
The obtained cured product was evaluated for the glass transition temperature (Tg) and the refractive index (n d ) of the D line (wavelength 589 nm). For Tg, the storage elastic modulus E ′ and the loss elastic modulus E ″ are measured by DMA, and the temperature at which the value of tan δ (loss elastic modulus E ″ / storage elastic modulus E ′) obtained from these is maximum is obtained. Was Tg. The results are also shown in Table 1.
[重合性組成物の調製]
製造例1で製造した反応性シリコーン化合物32質量部、単官能モノマーとしてDCPM8質量部、酸化防止剤としてPEBHT0.2質量部、及び重合開始剤としてI184 2質量部を混合し、2000rpmで30分間撹拌脱泡することで重合性組成物を得た。
[硬化物(薄膜)の作製及び加熱による透過率低下の評価]
上記重合性組成物を、ガラス基板上にギャップ25μmのアプリケーターで塗布した。この塗膜を、窒素雰囲気下、20mW/cm2(365nm検出)で1分間UV露光し、さらに150℃のホットプレートで10分間加熱することで硬化膜を作製した。
得られた硬化膜の、加熱試験(200℃、3時間)前後の波長400nmの光線透過率を測定し、加熱による透過率の低下を評価した。結果を表1に示す。
[硬化物の作製及び物性の評価]
上記重合性組成物を、ガラス基板上に置いた中央部を30mm×5mmの矩形に切り抜いた200μm厚のシリコーン製型枠中に流し込み、別のガラス基板を上方から被せた。この二枚のガラス基板で挟み込んだ型枠中の重合性組成物を、20mW/cm2(365nm検出)で1分間UV露光し硬化させた。硬化後、ガラス基板及び型枠を外して取り出した硬化物を、さらに150℃のオーブンで10分間加熱することで硬化物を作製した。
得られた硬化物の、ガラス転移温度(Tg)及びD線(波長589nm)の屈折率(nd)を評価した。なお、Tgについては、DMAにより貯蔵弾性率E’及び損失弾性率E’’を測定し、これらから求められるtanδ(損失弾性率E’’/貯蔵弾性率E’)の値が極大を示す温度をTgとした。結果を表1に併せて示す。 [Example 1]
[Preparation of polymerizable composition]
32 parts by mass of the reactive silicone compound produced in Production Example 1, 8 parts by mass of DCPM as a monofunctional monomer, 0.2 parts by mass of PEBHT as an antioxidant, and 2 parts by mass of I184 as a polymerization initiator are mixed and stirred at 2000 rpm for 30 minutes. A polymerizable composition was obtained by defoaming.
[Production of cured product (thin film) and evaluation of transmittance reduction by heating]
The polymerizable composition was applied on a glass substrate with an applicator having a gap of 25 μm. This coating film was subjected to UV exposure at 20 mW / cm 2 (365 nm detection) for 1 minute in a nitrogen atmosphere, and further heated on a hot plate at 150 ° C. for 10 minutes to produce a cured film.
The obtained cured film was measured for light transmittance at a wavelength of 400 nm before and after a heating test (200 ° C., 3 hours), and evaluated for a decrease in transmittance due to heating. The results are shown in Table 1.
[Production of cured product and evaluation of physical properties]
The above-mentioned polymerizable composition was poured into a 200 μm-thick silicone mold obtained by cutting out a central portion placed on a glass substrate into a rectangle of 30 mm × 5 mm, and another glass substrate was covered from above. The polymerizable composition in the mold sandwiched between these two glass substrates was cured by UV exposure for 1 minute at 20 mW / cm 2 (365 nm detection). After curing, the cured product obtained by removing the glass substrate and the mold was further heated in an oven at 150 ° C. for 10 minutes to prepare a cured product.
The obtained cured product was evaluated for the glass transition temperature (Tg) and the refractive index (n d ) of the D line (wavelength 589 nm). For Tg, the storage elastic modulus E ′ and the loss elastic modulus E ″ are measured by DMA, and the temperature at which the value of tan δ (loss elastic modulus E ″ / storage elastic modulus E ′) obtained from these is maximum is obtained. Was Tg. The results are also shown in Table 1.
[実施例2乃至8、比較例1乃至6]
各成分を表1に記載の組成で混合した以外は実施例1と同様に操作、評価した。結果を表1に併せて示す。 [Examples 2 to 8, Comparative Examples 1 to 6]
Operations and evaluations were performed in the same manner as in Example 1 except that each component was mixed with the composition shown in Table 1. The results are also shown in Table 1.
各成分を表1に記載の組成で混合した以外は実施例1と同様に操作、評価した。結果を表1に併せて示す。 [Examples 2 to 8, Comparative Examples 1 to 6]
Operations and evaluations were performed in the same manner as in Example 1 except that each component was mixed with the composition shown in Table 1. The results are also shown in Table 1.
表1に示すように、本発明の重合性組成物から得られた硬化物(実施例1~8)は、何れも140℃以上の高いTg及び1.56以上の高い屈折率を示し、さらに200℃、3時間の加熱を経ても変色に因る透過率の低下が1.5%以下であった。
一方、特定の単官能モノマーが所定量未満の硬化物(比較例1)、及び特定の単官能モノマーに替えて二官能モノマーを添加した硬化物(比較例5)においては、Tgが100℃以下と低く、さらに200℃、3時間の加熱によって黄変し、透過率が3~4%低下した。また、特定の単官能モノマーに替えてその他の単官能モノマーを添加した硬化物(比較例3,4)においては、透過率の低下は小さかったものの、Tgが100℃以下と低かった。さらに、特定の単官能モノマーが所定量を超える硬化物(比較例2)では200℃、3時間の加熱時に、特定の単官能モノマーを添加しない硬化物(比較例6)では硬化物(薄膜)作製時に、それぞれクラックが入り硬化物が割れるという結果が得られた。 As shown in Table 1, the cured products (Examples 1 to 8) obtained from the polymerizable composition of the present invention all showed a high Tg of 140 ° C. or higher and a high refractive index of 1.56 or higher. Even after heating at 200 ° C. for 3 hours, the decrease in transmittance due to discoloration was 1.5% or less.
On the other hand, in the cured product in which the specific monofunctional monomer is less than the predetermined amount (Comparative Example 1) and the cured product in which the bifunctional monomer is added instead of the specific monofunctional monomer (Comparative Example 5), Tg is 100 ° C. or less. Further, yellowing occurred by heating at 200 ° C. for 3 hours, and the transmittance decreased by 3 to 4%. Moreover, in the hardened | cured material (Comparative Examples 3 and 4) which added the other monofunctional monomer instead of the specific monofunctional monomer, although the fall of the transmittance | permeability was small, Tg was as low as 100 degrees C or less. Furthermore, in the cured product (Comparative Example 2) in which the specific monofunctional monomer exceeds a predetermined amount (Comparative Example 2), the cured product (thin film) is not cured in the cured product (Comparative Example 6) to which the specific monofunctional monomer is added at 200 ° C. for 3 hours The result that a crack entered and the hardened | cured material cracked at the time of preparation was obtained.
一方、特定の単官能モノマーが所定量未満の硬化物(比較例1)、及び特定の単官能モノマーに替えて二官能モノマーを添加した硬化物(比較例5)においては、Tgが100℃以下と低く、さらに200℃、3時間の加熱によって黄変し、透過率が3~4%低下した。また、特定の単官能モノマーに替えてその他の単官能モノマーを添加した硬化物(比較例3,4)においては、透過率の低下は小さかったものの、Tgが100℃以下と低かった。さらに、特定の単官能モノマーが所定量を超える硬化物(比較例2)では200℃、3時間の加熱時に、特定の単官能モノマーを添加しない硬化物(比較例6)では硬化物(薄膜)作製時に、それぞれクラックが入り硬化物が割れるという結果が得られた。 As shown in Table 1, the cured products (Examples 1 to 8) obtained from the polymerizable composition of the present invention all showed a high Tg of 140 ° C. or higher and a high refractive index of 1.56 or higher. Even after heating at 200 ° C. for 3 hours, the decrease in transmittance due to discoloration was 1.5% or less.
On the other hand, in the cured product in which the specific monofunctional monomer is less than the predetermined amount (Comparative Example 1) and the cured product in which the bifunctional monomer is added instead of the specific monofunctional monomer (Comparative Example 5), Tg is 100 ° C. or less. Further, yellowing occurred by heating at 200 ° C. for 3 hours, and the transmittance decreased by 3 to 4%. Moreover, in the hardened | cured material (Comparative Examples 3 and 4) which added the other monofunctional monomer instead of the specific monofunctional monomer, although the fall of the transmittance | permeability was small, Tg was as low as 100 degrees C or less. Furthermore, in the cured product (Comparative Example 2) in which the specific monofunctional monomer exceeds a predetermined amount (Comparative Example 2), the cured product (thin film) is not cured in the cured product (Comparative Example 6) to which the specific monofunctional monomer is added at 200 ° C. for 3 hours The result that a crack entered and the hardened | cured material cracked at the time of preparation was obtained.
[実施例9]マイクロレンズアレイの作製及び加熱による寸法安定性の評価
実施例6で調製した重合性組成物0.01gをガラス基板上に乗せ、その上方からナノインプリンターを用いてマイクロレンズ形状シリコンモールド[(株)協同インターナショナル製 レンズサイズ:φ40μm×深さ16.5μm]を圧着させた。この重合性組成物を、4mW/cm2(365nm検出)で5分間ガラス面からUV露光し硬化させた。硬化後、モールドを剥離し、さらに150℃のホットプレートで10分間加熱することでガラス基板上にマイクロレンズアレイを作製した。
得られたマイクロレンズアレイをSEM観察したところ、きれいにレンズ形状が転写されていることが確認された。SEM画像を図2に示す。また、このマイクロレンズアレイの、加熱試験(200℃、3時間)前後のレンズ高さ(厚み)及びレンズ径(レンズ底部直径)を断面SEM観察により測定し、加熱による寸法安定性を評価した。結果を表2に示す。 [Example 9] Production of microlens array and evaluation of dimensional stability by heating 0.01 g of the polymerizable composition prepared in Example 6 was placed on a glass substrate, and a microlens shape was formed from above using a nanoimprinter. A silicon mold (lens size: φ40 μm × depth 16.5 μm, manufactured by Kyodo International Co., Ltd.) was pressure bonded. This polymerizable composition was cured by UV exposure at 4 mW / cm 2 (365 nm detection) for 5 minutes from the glass surface. After curing, the mold was peeled off, and further heated on a hot plate at 150 ° C. for 10 minutes to produce a microlens array on the glass substrate.
When the obtained microlens array was observed with an SEM, it was confirmed that the lens shape was clearly transferred. The SEM image is shown in FIG. Moreover, the lens height (thickness) and lens diameter (lens bottom diameter) before and after the heating test (200 ° C., 3 hours) of this microlens array were measured by cross-sectional SEM observation, and dimensional stability by heating was evaluated. The results are shown in Table 2.
実施例6で調製した重合性組成物0.01gをガラス基板上に乗せ、その上方からナノインプリンターを用いてマイクロレンズ形状シリコンモールド[(株)協同インターナショナル製 レンズサイズ:φ40μm×深さ16.5μm]を圧着させた。この重合性組成物を、4mW/cm2(365nm検出)で5分間ガラス面からUV露光し硬化させた。硬化後、モールドを剥離し、さらに150℃のホットプレートで10分間加熱することでガラス基板上にマイクロレンズアレイを作製した。
得られたマイクロレンズアレイをSEM観察したところ、きれいにレンズ形状が転写されていることが確認された。SEM画像を図2に示す。また、このマイクロレンズアレイの、加熱試験(200℃、3時間)前後のレンズ高さ(厚み)及びレンズ径(レンズ底部直径)を断面SEM観察により測定し、加熱による寸法安定性を評価した。結果を表2に示す。 [Example 9] Production of microlens array and evaluation of dimensional stability by heating 0.01 g of the polymerizable composition prepared in Example 6 was placed on a glass substrate, and a microlens shape was formed from above using a nanoimprinter. A silicon mold (lens size: φ40 μm × depth 16.5 μm, manufactured by Kyodo International Co., Ltd.) was pressure bonded. This polymerizable composition was cured by UV exposure at 4 mW / cm 2 (365 nm detection) for 5 minutes from the glass surface. After curing, the mold was peeled off, and further heated on a hot plate at 150 ° C. for 10 minutes to produce a microlens array on the glass substrate.
When the obtained microlens array was observed with an SEM, it was confirmed that the lens shape was clearly transferred. The SEM image is shown in FIG. Moreover, the lens height (thickness) and lens diameter (lens bottom diameter) before and after the heating test (200 ° C., 3 hours) of this microlens array were measured by cross-sectional SEM observation, and dimensional stability by heating was evaluated. The results are shown in Table 2.
表2に示すように、本発明の重合性組成物から得られた硬化物は、200℃、3時間の加熱を経てもその形状変化が極めて小さく、加熱による寸法安定性が非常に高いとする結果が得られた。
As shown in Table 2, the cured product obtained from the polymerizable composition of the present invention has a very small shape change even after heating at 200 ° C. for 3 hours, and has very high dimensional stability by heating. Results were obtained.
Claims (15)
- (a)式[1]で表されるジアリールケイ酸化合物と式[2]で表されるアルコキシケイ素化合物とを、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物100質量部、及び
(b)(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、並びに(b2)マレイミド誘導体からなる群から選ばれる少なくとも1種類の重合性モノマー20~100質量部
を含む重合性組成物。
- 前記(b1)が(メタ)アクリレート化合物である、請求項1に記載の重合性組成物。 The polymerizable composition according to claim 1, wherein (b1) is a (meth) acrylate compound.
- 前記(b1)が式[3]で表される化合物である、請求項2に記載の重合性組成物。
- 前記Lが単結合を表す、請求項3に記載の重合性組成物。 The polymerizable composition according to claim 3, wherein L represents a single bond.
- 前記脂環基が架橋環構造を有する有機基である、請求項1乃至請求項4のうち何れか一項に記載の重合性組成物。 The polymerizable composition according to any one of claims 1 to 4, wherein the alicyclic group is an organic group having a crosslinked ring structure.
- 前記有機基が、ノルボルナン環、アダマンタン環及びトリシクロ[5.2.1.02,6]デカン環からなる群から選ばれる少なくとも1種類の架橋環構造を有する有機基である、請求項5に記載の重合性組成物。 The organic group is an organic group having at least one bridged ring structure selected from the group consisting of a norbornane ring, an adamantane ring, and a tricyclo [5.2.1.0 2,6 ] decane ring. The polymerizable composition as described.
- 前記(b2)が式[4]で表される化合物である、請求項1乃至請求項6のうち何れか一項に記載の重合性組成物。
- 前記(b)重合性モノマーが、(b1)分子内に炭素原子数3乃至30の脂環基及び1つのラジカル重合性二重結合を有する化合物、並びに(b2)マレイミド誘導体の双方からなる、請求項1乃至請求項7のうち何れか一項に記載の重合性組成物。 The (b) polymerizable monomer comprises both (b1) a compound having an alicyclic group having 3 to 30 carbon atoms and one radical polymerizable double bond in the molecule, and (b2) a maleimide derivative. The polymerizable composition according to any one of Items 1 to 7.
- 前記(a)反応性シリコーン化合物が、式[5]で表される化合物と式[6]で表される化合物とを、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物である、請求項1乃至請求項8のうち何れか一項に記載の重合性組成物。
- 請求項1乃至請求項9の何れかに記載の重合性組成物を光又は熱重合して得られる、硬化物。 A cured product obtained by photo or thermal polymerization of the polymerizable composition according to any one of claims 1 to 9.
- 請求項1乃至請求項9の何れかに記載の重合性組成物から得られる、硬化レリーフパターン。 A cured relief pattern obtained from the polymerizable composition according to claim 1.
- 請求項1乃至請求項9の何れかに記載の重合性組成物から得られる、光学レンズ。 An optical lens obtained from the polymerizable composition according to claim 1.
- 請求項1乃至請求項9の何れかに記載の重合性組成物からなる高屈折率樹脂レンズ用材料。 A material for a high refractive index resin lens comprising the polymerizable composition according to any one of claims 1 to 9.
- 請求項1乃至請求項9の何れかに記載の重合性組成物を、支持体と鋳型との間の空間に充填する工程、当該充填された組成物を露光して光重合する工程、支持体上の光重合物を鋳型から離型する工程、光重合物を支持体ごと加熱する工程、を含む成形体の製造方法。 A step of filling the polymerizable composition according to any one of claims 1 to 9 in a space between a support and a mold, a step of photopolymerizing the filled composition by exposure, a support A method for producing a molded article, comprising the steps of releasing the photopolymerized product from the mold and heating the photopolymerized product together with the support.
- 前記成形体がマイクロレンズアレイである、請求項14に記載の製造方法。 The manufacturing method according to claim 14, wherein the molded body is a microlens array.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015159972A1 (en) * | 2014-04-18 | 2015-10-22 | 日産化学工業株式会社 | Polymerizable resin composition comprising reactive silicone compound |
WO2017038943A1 (en) * | 2015-09-02 | 2017-03-09 | 日産化学工業株式会社 | Polymerizable composition comprising silsesquioxane compound having acrylic group |
KR20170062395A (en) * | 2015-11-27 | 2017-06-07 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Silicon-containing condensate, composition for forming a silicon-containing resist under layer film, and patterning process |
US10253126B2 (en) * | 2015-10-21 | 2019-04-09 | Nissan Chemical Industries, Ltd. | Optical waveguide-forming composition |
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CN109154677B (en) * | 2016-05-30 | 2022-07-05 | 日产化学株式会社 | Low viscosity agent for high refractive index polymerizable compound and polymerizable composition containing same |
CN115322217B (en) * | 2022-08-11 | 2024-07-09 | 中国科学院化学研究所 | High-refractive-index polymerizable monomer for optical path adjusting coating of liquid crystal display and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009525354A (en) * | 2006-02-03 | 2009-07-09 | パナソニック電工株式会社 | Silicate condensation product and optical waveguide device using the same |
JP2010047746A (en) * | 2008-07-01 | 2010-03-04 | Asahi Kasei E-Materials Corp | Photosensitive resin composition |
WO2012097836A1 (en) * | 2011-01-21 | 2012-07-26 | Fraunhofer-Gesellschaft Zur Förderung Der... | Polymerizable compositions, cured products obtained therewith, and use of these materials |
-
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2014
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009525354A (en) * | 2006-02-03 | 2009-07-09 | パナソニック電工株式会社 | Silicate condensation product and optical waveguide device using the same |
JP2010047746A (en) * | 2008-07-01 | 2010-03-04 | Asahi Kasei E-Materials Corp | Photosensitive resin composition |
WO2012097836A1 (en) * | 2011-01-21 | 2012-07-26 | Fraunhofer-Gesellschaft Zur Förderung Der... | Polymerizable compositions, cured products obtained therewith, and use of these materials |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015159972A1 (en) * | 2014-04-18 | 2015-10-22 | 日産化学工業株式会社 | Polymerizable resin composition comprising reactive silicone compound |
WO2017038943A1 (en) * | 2015-09-02 | 2017-03-09 | 日産化学工業株式会社 | Polymerizable composition comprising silsesquioxane compound having acrylic group |
JPWO2017038943A1 (en) * | 2015-09-02 | 2018-06-14 | 日産化学工業株式会社 | Polymerizable composition containing silsesquioxane compound having acrylic group |
US10703863B2 (en) | 2015-09-02 | 2020-07-07 | Nissan Chemical Industries, Ltd. | Polymerizable composition comprising silsesquioxane compound having acrylic group |
US10253126B2 (en) * | 2015-10-21 | 2019-04-09 | Nissan Chemical Industries, Ltd. | Optical waveguide-forming composition |
KR20170062395A (en) * | 2015-11-27 | 2017-06-07 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Silicon-containing condensate, composition for forming a silicon-containing resist under layer film, and patterning process |
KR102112383B1 (en) * | 2015-11-27 | 2020-05-18 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Silicon-containing condensate, composition for forming a silicon-containing resist under layer film, and patterning process |
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