WO2014204256A3 - 봉지재 필름의 신뢰 수명을 평가하는 방법 및 상기 필름의 신뢰도 평가 장치 - Google Patents

봉지재 필름의 신뢰 수명을 평가하는 방법 및 상기 필름의 신뢰도 평가 장치 Download PDF

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WO2014204256A3
WO2014204256A3 PCT/KR2014/005450 KR2014005450W WO2014204256A3 WO 2014204256 A3 WO2014204256 A3 WO 2014204256A3 KR 2014005450 W KR2014005450 W KR 2014005450W WO 2014204256 A3 WO2014204256 A3 WO 2014204256A3
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evaluating
film
bag material
reliability
material film
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PCT/KR2014/005450
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English (en)
French (fr)
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WO2014204256A2 (ko
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유현지
이승민
조윤경
배경열
심정섭
장석기
김현석
문정옥
최반석
양세우
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주식회사 엘지화학
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Priority to JP2016521210A priority Critical patent/JP6226347B2/ja
Priority to CN201480035548.8A priority patent/CN105358963B/zh
Priority to EP14813837.3A priority patent/EP3012617B1/en
Priority to US14/897,208 priority patent/US9548473B2/en
Publication of WO2014204256A2 publication Critical patent/WO2014204256A2/ko
Publication of WO2014204256A3 publication Critical patent/WO2014204256A3/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/183—Sealing members
    • H01M50/184—Sealing members characterised by their shape or structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/183—Sealing members
    • H01M50/19—Sealing members characterised by the material
    • H01M50/193—Organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/151—Copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Photovoltaic Devices (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Drying Of Gases (AREA)
  • Sealing Material Composition (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

본 출원은 봉지재 필름의 신뢰 수명을 평가하는 방법 및 상기 필름의 신뢰도 평가 장치에 관한 것이며, 본 출원에서는 봉지재 필름의 신뢰성을 봉지재 필름의 사용 직전 헤이즈 측정 만으로도 간단하고 손쉽게 평가하여 제품의 불량 여부를 확인하고, 신뢰성을 예측할 수 있는 평가방법에 제공될 수 있는 필름을 제공할 수 있다.
PCT/KR2014/005450 2013-06-19 2014-06-19 봉지재 필름의 신뢰 수명을 평가하는 방법 및 상기 필름의 신뢰도 평가 장치 WO2014204256A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016521210A JP6226347B2 (ja) 2013-06-19 2014-06-19 封止材フィルムの信頼寿命を評価する方法及び上記フィルムの信頼度評価装置
CN201480035548.8A CN105358963B (zh) 2013-06-19 2014-06-19 评价包封膜的可靠寿命的方法以及用于评价所述膜的可靠性的装置
EP14813837.3A EP3012617B1 (en) 2013-06-19 2014-06-19 Method of evaluating reliable life span of bag material film and device for evaluating reliability of said film
US14/897,208 US9548473B2 (en) 2013-06-19 2014-06-19 Method of evaluating reliable life span of encapsulant film and device for evaluating reliability of said film

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20130070637 2013-06-19
KR10-2013-0070637 2013-06-19
KR1020140075206A KR101622023B1 (ko) 2013-06-19 2014-06-19 봉지재 필름의 신뢰 수명을 평가하는 방법 및 상기 필름의 신뢰도 평가 장치
KR10-2014-0075206 2014-06-19

Publications (2)

Publication Number Publication Date
WO2014204256A2 WO2014204256A2 (ko) 2014-12-24
WO2014204256A3 true WO2014204256A3 (ko) 2015-04-23

Family

ID=52676417

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PCT/KR2014/005451 WO2014204257A2 (ko) 2013-06-19 2014-06-19 봉지재 필름
PCT/KR2014/005450 WO2014204256A2 (ko) 2013-06-19 2014-06-19 봉지재 필름의 신뢰 수명을 평가하는 방법 및 상기 필름의 신뢰도 평가 장치

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Application Number Title Priority Date Filing Date
PCT/KR2014/005451 WO2014204257A2 (ko) 2013-06-19 2014-06-19 봉지재 필름

Country Status (7)

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US (2) US9923169B2 (ko)
EP (2) EP3012617B1 (ko)
JP (2) JP6226347B2 (ko)
KR (2) KR101642568B1 (ko)
CN (2) CN105358963B (ko)
TW (2) TWI583938B (ko)
WO (2) WO2014204257A2 (ko)

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