WO2014157031A1 - High-frequency transmission line and electronic device - Google Patents

High-frequency transmission line and electronic device Download PDF

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Publication number
WO2014157031A1
WO2014157031A1 PCT/JP2014/057979 JP2014057979W WO2014157031A1 WO 2014157031 A1 WO2014157031 A1 WO 2014157031A1 JP 2014057979 W JP2014057979 W JP 2014057979W WO 2014157031 A1 WO2014157031 A1 WO 2014157031A1
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WO
WIPO (PCT)
Prior art keywords
conductor
transmission line
signal conductor
frequency transmission
central region
Prior art date
Application number
PCT/JP2014/057979
Other languages
French (fr)
Japanese (ja)
Inventor
用水邦明
小澤真大
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2014/054409 external-priority patent/WO2014156422A1/en
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201490000277.8U priority Critical patent/CN204994053U/en
Publication of WO2014157031A1 publication Critical patent/WO2014157031A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths

Definitions

  • the present invention relates to a high-frequency transmission line that transmits a high-frequency signal and an electronic device including the high-frequency transmission line.
  • Patent Document 1 Conventionally, as a thin high-frequency transmission line for transmitting a high-frequency signal, a structure as shown in Patent Document 1 has been devised.
  • the high-frequency transmission cable described in Patent Document 1 has a so-called triplate-type stripline structure. Specifically, a first ground conductor, a signal conductor, and a second ground conductor are sequentially arranged at intervals along the thickness direction of the flat dielectric body. The first ground conductor and the second ground conductor are connected by a via conductor.
  • the signal conductor is a long linear conductor extending along the longitudinal direction of the dielectric body.
  • the first ground conductor is formed on substantially the entire plane orthogonal to the thickness direction of the dielectric body.
  • the second ground conductor includes two long conductors extending along the longitudinal direction of the dielectric body.
  • the two long conductors are formed near both ends in the short direction perpendicular to the longitudinal direction of the dielectric body.
  • the two long conductors are connected by a bridge conductor at intervals along the longitudinal direction.
  • the second ground conductor is provided with a plurality of openings along the longitudinal direction (extension direction). By providing the opening in this way, the high-frequency transmission line is easily bent.
  • the characteristic impedance of the high-frequency transmission line having such a structure is determined by the shape and positional relationship between the signal conductor and the first and second ground conductors and the dielectric constant of the dielectric element body. It is determined by the shape and positional relationship with the ground conductor and the dielectric constant of the dielectric body.
  • a connector is connected to both ends (both ends in the longitudinal direction) of the high-frequency transmission line, and a high-frequency signal is transmitted through the connector.
  • the characteristic impedance of the entire high-frequency transmission line at the frequency of the high-frequency signal is set to about 50 ⁇ . In this way, even in the impedance matching state, heat is generated in the central region along the transmission direction of the high-frequency transmission line connecting the two connector connection points.
  • an object of the present invention is to provide a high-frequency transmission line that can suppress heat loss due to transmission of a high-frequency signal and has low transmission loss.
  • the high-frequency transmission line of the present invention is characterized by having the following configuration.
  • a high-frequency transmission line includes a dielectric body having a first main surface and a second main surface facing each other, a signal conductor provided in the dielectric body and extending in a signal transmission direction, and a dielectric body And a ground conductor formed in a different layer from the signal conductor.
  • the width of the central region in the extending direction of the signal conductor is larger than the width of both end regions in the extending direction.
  • the dielectric element body includes a main line portion and a plurality of external connection portions provided at both ends of the main line portion, and the width of the signal conductor in the central region of the main line portion is plural.
  • variety of the signal conductor of the external connection part vicinity may be sufficient.
  • the width of the signal conductor continuously changes along the extending direction.
  • the opposing area between the signal conductor and the ground conductor is larger in the center area than the both end areas, or the distance between the signal conductor and the ground conductor is greater in the center area than the both end areas. Is preferably long.
  • the ground conductor includes a first ground conductor formed in a shape along the signal conductor on the first main surface side of the signal conductor.
  • the first ground conductor has a smaller facing area in the central region of the signal conductor than a facing area in both end regions of the signal conductor.
  • This configuration shows a specific mode in which a first ground conductor facing the signal conductor in the thickness direction is provided as a ground conductor, and the capacitive coupling between the signal conductor and the first ground conductor in the central region is reduced. .
  • the first ground conductor may be provided with an opening in a range facing the central region of the signal conductor.
  • the specific aspect which makes small the opposing area of a signal conductor and a 1st ground conductor is shown.
  • the ratio of the area of the opening in the unit area of the first ground conductor is changed in response to the change in the width of the signal conductor.
  • the interval between the first ground conductor and the signal conductor in the central region of the signal conductor may be wider than the interval between the first ground conductor and the signal conductor in both end regions of the signal conductor.
  • the capacitance between the signal conductor and the first ground conductor can be reduced, and the change in characteristic impedance can be suppressed.
  • the central region of the signal conductor is disposed on the second main surface side with respect to both end regions of the signal conductor, and the central region and both end regions of the signal conductor are formed of the dielectric body. It may be connected by an interlayer connection conductor extending in the thickness direction.
  • This configuration shows a specific mode in which the distance between the central region of the signal conductor and the first ground conductor is wider than the distance between the two end regions of the signal conductor and the first ground conductor. And an embodiment in which both end regions are formed in different layers.
  • the central region of the first ground conductor is disposed closer to the first main surface side than both end regions of the first ground conductor, and the central region and both end regions of the first ground conductor May be connected by an interlayer connection conductor extending in the thickness direction of the dielectric body.
  • This configuration shows a specific mode in which the interval between the central region of the signal conductor and the first ground conductor is wider than the interval between the both end regions of the signal conductor and the first ground conductor.
  • region of a signal conductor in a different layer is shown.
  • the high-frequency transmission line of the present invention may have the following configuration.
  • the ground conductor of the high-frequency transmission line is formed on the second main surface side of the signal conductor in a shape that follows the signal conductor and does not overlap with the signal conductor in the thickness direction, and the signal conductor extends in the width direction of the dielectric body.
  • a second ground conductor having two long conductors disposed so as to be sandwiched therebetween is provided.
  • the width of the portion corresponding to the central region of the long conductor is narrower than the width of the portion corresponding to both end regions.
  • This configuration shows an aspect in which only the second ground conductor that is hardly opposed to the signal conductor in the thickness direction is provided, or an aspect in which the signal conductor is sandwiched between the first ground conductor and the second ground conductor. Then, the characteristic impedance due to the wide width of the signal conductor by making the width of the portion of the second ground conductor facing the central region of the signal conductor narrower than the width of the portion of the signal conductor facing both the end regions. Can be suppressed.
  • the high frequency transmission line of the present invention may have the following configuration.
  • the second ground conductor of the high-frequency transmission line includes a plurality of bridge conductors that connect two long conductors at intervals along the signal transmission direction.
  • the width of the bridge conductor in the portion corresponding to the central region of the signal conductor is narrower than the width of the bridge conductor in the portion corresponding to the both end regions.
  • This configuration shows a mode in which a bridge conductor connecting two long conductors is provided in the second ground conductor.
  • the bridge conductor is structurally opposed to the signal conductor, but the width of the signal conductor is wide because the width of the bridge conductor in the portion corresponding to the central region is narrower than the width of the bridge conductor in the portion corresponding to both end regions. It is possible to suppress a change in characteristic impedance due to the occurrence of the failure.
  • the interval between the plurality of bridge conductors in the portion corresponding to the central region is wider than the interval between the plurality of bridge conductors in the portion corresponding to the both end regions.
  • the number of opposing portions of the signal conductor and the bridge conductor in the central region of the signal conductor is smaller than the number of opposing portions of the signal conductor and the bridge conductor in both end regions of the signal conductor. Therefore, it is possible to suppress a change in characteristic impedance due to the wide width of the signal conductor.
  • the dielectric constant of the central region sandwiched between the signal conductor and the first ground conductor in the dielectric body is lower than the dielectric constant of the central region sandwiched between the signal conductor and the first ground conductor. May be.
  • An electronic apparatus includes any one of the high-frequency transmission lines described above, and a first circuit unit and a second circuit unit that are connected by the high-frequency transmission line and transmit and receive signals through the high-frequency transmission line. It is characterized by.
  • heat loss due to transmission of a high-frequency signal can be suppressed.
  • a high frequency signal can be transmitted with low loss.
  • FIG. 1 is an external perspective view of a high-frequency transmission line according to an embodiment of the present invention. It is a disassembled perspective view of the high frequency transmission line concerning a 1st embodiment of the present invention. It is a top view which shows the conductor pattern of each layer which comprises the high frequency transmission line which concerns on the 1st Embodiment of this invention.
  • FIG. 4 is a cross-sectional view taken along line AA, BB, and CC in FIG. 3. It is side surface sectional drawing and plane sectional drawing which show the components structure of the portable electronic device which concerns on the 1st Embodiment of this invention. It is a side view which shows the structure of the communication apparatus module which concerns on the 1st Embodiment of this invention.
  • FIG. 1 is an external perspective view of a high-frequency transmission line according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the high-frequency transmission line according to the first embodiment of the present invention.
  • FIG. 3 is a plan view showing a conductor pattern of each layer constituting the high-frequency transmission line according to the first embodiment of the present invention.
  • FIG. 3A is a diagram showing the overlapping state of each conductor pattern,
  • FIG. 3B shows the second ground conductor,
  • FIG. 3C shows the signal conductor, and
  • FIG. 4 is a cross-sectional view taken along line AA, BB, and CC in FIG. 1 and 2, the first main surface side is shown as an upper side, and in FIGS. 3 and 4, the second main surface side is shown as an upper side. Show.
  • the high-frequency transmission line 10 includes a dielectric element body 200, resist films 31 and 32, and connectors 41 and 42.
  • the dielectric element body 200 is composed of a long flat plate extending in one direction.
  • the extending direction is referred to as the long direction
  • the direction perpendicular to the long direction and the thickness direction is referred to as the short direction.
  • the surfaces (distance surfaces in the thickness direction) parallel to the longitudinal direction and perpendicular to the thickness direction in the dielectric body 200 are referred to as a first main surface and a second main surface, respectively.
  • the resist film 31 is disposed on the entire first main surface of the dielectric element body 200, and the resist film 32 is disposed on the entire second main surface of the dielectric element body 200.
  • the resist films 31 and 32 are made of an insulating material.
  • the connector 41 is disposed at one end of the dielectric element body 200 in the longitudinal direction.
  • the connector 42 is disposed at the other end of the dielectric element body 200 in the longitudinal direction.
  • the connectors 41 and 42 are disposed on the first main surface of the dielectric element body 200.
  • the dielectric body 200 is formed by laminating dielectric layers 201, 202, and 203 in the thickness direction.
  • the dielectric layers 201, 202, and 203 are made of an insulating resin having flexibility, and are made of, for example, a liquid crystal polymer.
  • Each dielectric layer 201, 202, 203 has a thickness of about 10 ⁇ m to 100 ⁇ m.
  • dielectric body 200 is fabricated by bonding the interfaces between the dielectric layers by thermocompression after lamination.
  • the dielectric layer 201 side is the first main surface side of the dielectric body 200
  • the dielectric layer 203 side is the second main surface side of the dielectric body 200.
  • the dielectric element body 200 is functionally composed of a main line portion and an external connection portion, and external connection portions are provided at both ends in the longitudinal direction of the main line portion.
  • the width of the external connection portion (length in the short direction) is wider than the width of the main line portion (length in the short direction).
  • a first ground conductor 210 is disposed on the surface of the dielectric layer 201 on the first main surface side (side on which the resist film 31 is disposed).
  • the first ground conductor 210 is made of a highly conductive material, for example, a metal foil such as copper (Cu).
  • the first ground conductor 210 is formed on substantially the entire surface of the dielectric layer 201 on the first main surface side.
  • the first ground conductor 210 is provided with a plurality of openings 211L and 211S.
  • the opening 211L and the opening 211S have different opening areas.
  • the opening 211L is provided in the central region ReC in the longitudinal direction of the first ground conductor 210.
  • the central region ReC is, for example, a middle region obtained by dividing the entire length in the longitudinal direction into three.
  • the plurality of openings 211S are provided on both sides in the longitudinal direction with respect to the arrangement range of the openings 211L (a range on the central region ReC side of both end portions ReE).
  • a signal conductor 220 is disposed on the surface of the dielectric layer 202 on the second main surface side (the side opposite to the dielectric layer 201).
  • the signal conductor 220 is also made of a highly conductive material, for example, a metal foil such as copper (Cu).
  • the signal conductor 220 has a long shape extending along the long direction of the dielectric layer 202.
  • the signal conductor 220 is disposed substantially at the center in the width direction of the dielectric layer 202 (dielectric body 200).
  • Signal conductor 220 a shape which widens towards the width W A of the central region ReC than the width W C of the both end portions in the longitudinal direction.
  • the signal conductor 220 is provided so that the width gradually increases from both ends in the longitudinal direction toward the central region ReC.
  • the width W A of the central region ReC wider than the width W C of the both end portions, the width W B of the vicinity of the boundary of the central area ReC both end regions ReE the central region ReC it is a width between the width W C of the width W a and both end portions.
  • the width of the signal conductor 220 is continuously increased from both ends in the longitudinal direction toward the central region ReC as shown in FIG.
  • the width W A in the central region ReC signal conductors 220 is substantially constant.
  • the pure resistance (DC resistance) of the central region ReC of the signal conductor 220 is smaller than the pure resistance (DC resistance) of both end regions ReE, and the signal conductor 220 has a pure resistance toward the center in the longitudinal direction. (DC resistance) decreases.
  • the signal conductor 220 has a smaller heat loss in the central region ReC in the longitudinal direction than in the both end regions ReE, and the heat loss becomes smaller toward the center in the longitudinal direction.
  • the transmission loss by the heat loss of the signal conductor 220 as shown in the problem in the conventional configuration can be suppressed.
  • a second ground conductor 230 is disposed on the surface of the dielectric layer 203 on the second main surface side (side on which the resist film 32 is disposed).
  • the second ground conductor 230 has a ladder shape and includes long conductors 231 and 232 and a bridge conductor 233.
  • the long conductors 231 and 232 and the bridge conductor 233 are made of the same material as other conductors (for example, a metal foil such as copper).
  • the long conductors 231 and 232 are formed in a shape extending along the long direction of the dielectric layer 203.
  • the long conductors 231 and 232 are formed near both ends in the width direction (short direction) of the dielectric layer 203.
  • the long conductors 231 and 232 are disposed so as not to overlap the signal conductor 220 when viewed in a direction orthogonal to the first main surface and the second main surface of the dielectric body 200.
  • the long conductors 231 and 232 have a constant width.
  • a plurality of bridge conductors 233 are arranged at intervals along the longitudinal direction of the dielectric layer 203.
  • the plurality of bridge conductors 233 are rectangular and connect the long conductors 231 and 232.
  • the long conductors 231 and 232 are connected by the bridge conductor 233 at a plurality of positions at intervals along the long direction.
  • an opening region 234 is formed between portions connected by the bridge conductor 233.
  • the second ground conductor 230 is provided with a plurality of opening regions 234 along the longitudinal direction.
  • the first ground conductor 210 and the second ground conductor 230 are connected by an interlayer connection conductor 290 formed so as to penetrate the dielectric layers 201, 202, and 203. More specifically, a portion where the long conductors 231 and 232 constituting the second ground conductor 230 are connected to the bridge conductor 233 and the first ground conductor 210 are connected by the interlayer connection conductor 290.
  • the interlayer connection conductor 290 is, for example, a via-hole conductor, and applies, for example, a conductive paste containing one or more metals selected from Ag, Ni, Cu, and Sn to the holes provided in the dielectric layers 201, 202, and 203. Then, it is formed by metallization (sintering) with heat.
  • the conductive paste applied to the holes is metallized by heat in the step of thermocompression bonding the dielectric layers 201, 202, and 203.
  • the first ground conductor 210 and the second ground conductor 230 can be set to substantially the same potential, that is, these conductors can be set to the ground potential.
  • the triplate type high frequency transmission line 10 which makes the signal conductor 220 the main line is formed thinly.
  • the first ground conductor 210 serves as the main ground and the second ground conductor 230 serves as the sub-ground.
  • the second ground conductor 230 suppresses electromagnetic waves leaking from the signal conductor 220 to the outside, and the opening region 234 is provided, so that flexibility can be increased.
  • the characteristic impedance of the high-frequency transmission line 10 is basically determined by the shape and positional relationship between the signal conductor 220 and the first ground conductor 210 and the material characteristics of the dielectric element body 200. That is, the basic characteristic impedance is determined by the width of the signal conductor 220 and the distance D 01 between the signal conductor 220 and the ground conductor 211. Furthermore, the desired characteristic impedance (for example, 50 ⁇ ) is finally taken into account by taking into account the positional relationship between the signal conductor 220 and the second ground conductor 230, the coupling between the signal conductor 220 and the second ground conductor 230 based on the distance D02 and the like. ).
  • the signal conductor 220 and the first ground conductor are formed by making the total thickness D 01 of the dielectric layers 201 and 202 larger than the thickness D 02 of the dielectric layer 203.
  • the distance from 210 is set to more than half of the thickness of the dielectric body 200. That is, the signal conductor 220 is disposed in the thickness direction of the dielectric element body 200 so as to be offset from the center in the thickness direction to the side opposite to the first ground conductor 210 side.
  • the width of the signal conductor 220 varies depending on the longitudinal direction. Specifically, as shown in FIG. 4, the width W A of the central region ReC is wider than the widths W B and W C of both end regions ReE, and the width W B on the central region ReC side is also within both end regions ReE. , wider than the width W C of the end side. Furthermore, as shown in FIG. 3, it is preferable that the width of the signal conductor 220 is continuously increased from both ends in the longitudinal direction toward the central region ReC.
  • the capacitance between the signal conductor 220 and the first ground conductor 210 is greater in the central region ReC than in the two end regions ReE.
  • Sexual bond increases.
  • the characteristic impedance of the central region is lower than that of both end regions.
  • the plurality of openings 211L at least partially overlapping the signal conductor 220 are provided in the central region ReC of the first ground conductor 210, so that the signal conductor 220 and the first conductor The area facing the ground conductor 210 can be reduced.
  • the increase in capacitance due to the wide width of the signal conductor 220 can be offset by the decrease in capacitance due to the provision of the plurality of openings 211L. Thereby, it can suppress that the characteristic impedance of the center area
  • a plurality of openings 211S at least partially overlapping with the signal conductor 220 are also provided in the range of the both end regions ReE on the central region ReC side.
  • the width of the signal conductor 220 is narrower in the range of the both end regions ReE on the central region ReC side than the central region ReC, but the signal conductor 220 is wider than both ends. Therefore, by providing the plurality of openings 211S, it is possible to suppress the characteristic impedance from changing as in the central region ReC.
  • the high-frequency transmission line 10 can be set to a desired characteristic impedance as a whole, and transmission loss due to mismatch of characteristic impedances can be suppressed.
  • the openings 211L and 211S are arranged so that at least a part thereof overlaps the signal conductor 220 when the dielectric element body 200 is viewed in plan view. It is also possible to arrange them so as not to overlap. However, it is preferable to arrange the openings 211L and 211S so that at least a part thereof overlaps the signal conductor 220, so that the characteristic impedance can be adjusted more effectively.
  • the openings 211L and 211S may change not only the opening area but also the arrangement interval.
  • the opening areas 211L and 211S may have the same opening area, and only the arrangement interval may be changed.
  • the setting example of the central region of the present embodiment is an example, and the middle two regions divided into four in the longitudinal direction may be set as the central region, and the middle three regions in which the total length in the longitudinal direction is divided into five.
  • the region may be a central region. These may be set based on the heat distribution of the high-frequency transmission line 10 in a state where the signal conductor is not widened.
  • the first ground conductor 210 is provided with an external connection opening 212.
  • an external connection conductor pattern 213 is disposed in the center of the opening 212.
  • the external connection conductor pattern 213 is connected to the end of the signal conductor 220 by the interlayer connection conductor 290.
  • the first ground conductor 210 and the second ground conductor 230 are connected by a plurality of interlayer connection conductors 290.
  • the resist film 31 is provided with an opening region 310, and a part of the first ground conductor 210 and the external connection conductor pattern 213 are exposed to the outside on the first main surface side through the opening region 310. .
  • Connectors 41 and 42 are mounted on the exposed first ground conductor 210 and external connection conductor pattern 213.
  • the high-frequency transmission line configured as described above is manufactured as follows, for example.
  • first, second, and third dielectric sheets which are liquid crystal polymer sheets with single-sided copper, are prepared.
  • the first ground conductor 211 and the external connection conductor pattern 213 are formed on the first main surface side of the first dielectric film by a patterning process using a photolithography technique or the like.
  • a signal conductor 220 is formed on the second main surface side of the second dielectric film by patterning.
  • Second ground conductors 231 and 232 are formed on the second main surface side of the third dielectric film by patterning.
  • the first, second, and third dielectric films each have a plurality of pairs formed with each conductor.
  • through holes are provided at positions where the interlayer connection conductors 290 are to be formed, and the conductive paste is filled therein.
  • the first, second, and third dielectric sheets are laminated and thermocompression bonded.
  • the conductive paste is sintered and the interlayer connection conductor 290 is formed.
  • a laminated dielectric sheet in which a plurality of dielectric element bodies 200 are arranged is formed.
  • Resist films 31 and 32 are applied to dielectric body 200 and cured, and connectors 41 and 42 are mounted using a conductive material such as solder. Thereby, the composite_body
  • FIG. 5A is a side cross-sectional view illustrating a component configuration of the portable electronic device according to the first embodiment of the present invention
  • FIG. 5B is a plan cross-sectional view illustrating the component configuration of the portable electronic device. is there.
  • the portable electronic device 70 includes a thin device casing 71.
  • mounting circuit boards 72A and 72B and a battery pack 700 are disposed in the device casing 71.
  • a plurality of IC chips 74 and mounting components 75 are mounted on the surfaces of the mounting circuit boards 72A and 72B.
  • the mounting circuit boards 72A and 72B and the battery pack 700 are installed in the equipment casing 71 so that the battery casing 700 is disposed between the mounting circuit boards 72A and 72B in a plan view of the equipment casing 71.
  • the device housing 71 is formed as thin as possible, the distance between the battery pack 700 and the device housing 71 is extremely narrow in the thickness direction of the device housing 71. Therefore, a coaxial cable cannot be disposed between them.
  • the high-frequency transmission line 10 shown in the present embodiment so that the thickness direction of the high-frequency transmission line 10 matches the thickness direction of the device casing 71, the battery pack 700 and the device casing are arranged.
  • the high-frequency transmission line 10 can be passed between 71 and 71.
  • the connector 41 is attached to the mounting circuit board 72A
  • the connector 42 is attached to the mounting circuit board 72B.
  • the mounted circuit boards 72A and 72B that are spaced apart from each other with the battery pack 700 disposed therebetween can be connected by the high-frequency transmission line 10.
  • the high-frequency transmission line 10 has flexibility, even if the battery pack 700 is arranged in the middle, it can be arranged along the surface of the battery pack 700, and the mounting circuit boards 72A and 72B are securely connected. can do.
  • the high-frequency transmission line 10 can transmit high-frequency signals with low loss, so that high-frequency signals can be transmitted and received between the mounted circuit boards 72A and 72B with low loss.
  • FIG. 6 is a side view showing the configuration of the communication device module according to the first embodiment of the present invention.
  • the communication device module 70A includes a front end board 711, an antenna board 712, and a high-frequency transmission line 10 '.
  • Various circuit components that realize a high-frequency front-end circuit are mounted on the mounting surface of the front-end substrate 711.
  • An antenna conductor 720 is formed on the antenna substrate 712.
  • the antenna substrate 712 is disposed on the mounting surface side of the front end substrate 711 so as to be separated from the front end substrate 711.
  • the high-frequency transmission line 10 ′ has one end connector 41 attached to the first main surface side and the other end connector 42 attached to the second main surface side. Other structures are the same as those of the high-frequency transmission line 10 described above.
  • the connector 41 of the high-frequency transmission line 10 ′ is connected to the surface on the front end substrate 711 side of the antenna substrate 712.
  • the connector 42 of the high-frequency transmission line 10 ′ is connected to the surface (mounting surface) on the antenna substrate 712 side of the front end substrate 711. Since the high-frequency transmission line 10 ′ has flexibility, a bent portion can be formed in the middle of the extending direction. As described above, by forming the bent portion, the high-frequency transmission line 10 ′ can connect the front end substrate 711 and the antenna substrate 712 in a state where the high-frequency transmission line 10 ′ is formed in a shape that does not contact the circuit components.
  • the high-frequency transmission line 10 ′ can transmit a high-frequency signal with low loss, a high-frequency signal can be transmitted and received with low loss between the front-end substrate 711 and the antenna substrate 712. it can.
  • FIG. 7 is a plan view showing a conductor pattern of each layer constituting the high-frequency transmission line according to the second embodiment of the present invention.
  • FIG. 7A is a diagram showing the overlapping state of each conductor pattern
  • FIG. 7B shows the second ground conductor
  • FIG. 7C shows the signal conductor
  • FIG. 7D shows the first conductor conductor. Indicates a ground conductor.
  • the high-frequency transmission line 10 ⁇ / b> A according to the present embodiment is different from the high-frequency transmission line 10 according to the first embodiment in that an opening is not provided in the first ground conductor 210 and the second ground
  • the shape of the conductor 230A is different. Therefore, only a different part from the high frequency transmission line 10 which concerns on 1st Embodiment is demonstrated concretely.
  • the first ground conductor 210 is a conductor pattern formed on the entire surface of the dielectric layer having no opening.
  • the second ground conductor 230A includes long conductors 231A and 232A.
  • the long conductors 231A and 232A have a long shape extending along the long direction of the dielectric body, and the width varies depending on the position in the long direction. Specifically, the width WD 1 at both ends in the longitudinal direction of the long conductors 231A and 232A is wider than the width WD 4 at the center in the longitudinal direction of the long conductors 231A and 232A. Further, the width WD 3 in the vicinity of the boundary between the center region ReC and both end regions ReE of the long conductors 231A and 232A is narrower than the width WD 1 at both ends and wider than the center width WD 4 in the length direction.
  • the widths of the long conductors 231A and 232A are narrowed toward the center in the long direction. At this time, there may be a region where the width does not partially change along the longitudinal direction. In the example of this embodiment, the width is near the both ends in the longitudinal direction and at the central portion of the central region ReC. Does not change.
  • interval (distance along a short direction) of long conductors 231A and 232A becomes large, so that it approaches a long direction.
  • the elongated conductors 231A, spacing G 4 at the center in the longitudinal direction of the 232A is elongated conductor 231A, the gap G at both ends in the longitudinal direction of 232A It is wider than 1 .
  • the elongated conductors 231A, spacing G 3 in the vicinity of the boundary between the central region ReC both ends regions ReE of 232A is wider than the spacing G 1 at both ends, than the spacing G 4 at the center in the longitudinal direction narrow.
  • the width of the signal conductor 220 increases, the distance between the long conductors 231A and 232A decreases. Therefore, an increase in capacitive coupling between the signal conductor 220 and the long conductors 231A and 232A due to the wide width of the signal conductor 220 can be suppressed. Thereby, a change in characteristic impedance due to the wide width of the signal conductor 220 can be suppressed.
  • the width of the bridge conductor also changes depending on the position in the longitudinal direction.
  • the width W 4 of the bridge conductor 2333 disposed in the central region ReC in the longitudinal direction is disposed near both ends in the longitudinal direction. narrower than the width W 1 of the bridge conductors 2331 that is.
  • the width W 3 of the bridge conductor 2332 disposed near the boundary between the central region ReC and both end regions ReE in the longitudinal direction is narrower than the width W 1 at both ends and wider than the width W 4 of the central region. . That is, the width of the bridge conductor becomes narrower as it approaches the center in the longitudinal direction.
  • FIG. 8 is an exploded perspective view of the high-frequency transmission line according to the third embodiment of the present invention.
  • the high-frequency transmission line 10B of the present embodiment has no opening in the first ground conductor 210 with respect to the high-frequency transmission line 10 according to the first embodiment, and the signal conductor 220B.
  • the signal conductor 220B Are different in shape. Therefore, only a different part from the high frequency transmission line 10 which concerns on 1st Embodiment is demonstrated concretely.
  • the dielectric body 200B is formed by laminating dielectric layers 201, 2021, 2022, and 203.
  • the first ground conductor 210 is disposed on the entire surface of the dielectric layer 201. That is, the first ground conductor 210 is not provided with an opening as shown in the first embodiment.
  • the signal conductor 220B has a structure made up of signal conductors 220B1 and 220B2 arranged in two different layers in the dielectric body 200B.
  • the signal conductor 220B1 is disposed on the dielectric layer 2021.
  • the signal conductor 220B1 is disposed in a region corresponding to both end regions ReE of the dielectric layer 2021.
  • the signal conductor 220B1 is wider toward the center in the longitudinal direction.
  • the signal conductor 220B2 is disposed on the dielectric layer 2022.
  • the signal conductor 220B2 is disposed in a region corresponding to the central region ReC of the dielectric layer 2022.
  • the signal conductor 220B2 has substantially the same width over the entire length along the longitudinal direction, but it is preferable that the signal conductor 220B2 become wider as it approaches the center in the longitudinal direction.
  • the signal conductor 220B2 is formed in a region between the two signal conductors 220B1 along the longitudinal direction of the dielectric body 200B in plan view. Both ends of the signal conductor 220B2 overlap with each of the two signal conductors 220B1 in a plan view of the dielectric body 200B. The overlapping portions of the signal conductors 220B1 and 220B2 are connected by an interlayer connection conductor 290.
  • the signal conductor 220B including the signal conductors 220B1 and 220B2 and the interlayer connection conductor 290 has the same shape as the signal conductor 220 shown in the first embodiment in plan view of the dielectric body 200B. .
  • the signal conductor 220B2 in the central region ReC is separated from the first ground conductor 210 by the thickness of the dielectric layer 2022 (thickness after thermocompression bonding) than the signal conductor 220B1 in the both end regions ReE. Separate. Thereby, the magnitude of the capacitive coupling between the signal conductor 220B2 and the first ground conductor 210 in the central region ReC is larger than the magnitude of the capacitive coupling between the signal conductor 220B1 and the first ground conductor 210 in the both end regions ReE. Get smaller.
  • interlayer connection conductor 290 connecting the signal conductors 220B1 and 220B2 is shown, but a plurality of interlayer connection conductors 290 may be provided.
  • FIG. 9 is an exploded perspective view of the high-frequency transmission line according to the fourth embodiment of the present invention.
  • the high-frequency transmission line 10 ⁇ / b> C according to the present embodiment is not provided with an opening in the first ground conductor 210 ⁇ / b> C with respect to the high-frequency transmission line 10 according to the first embodiment.
  • the shape of the ground conductor 210C is different. Therefore, only a different part from the high frequency transmission line 10 which concerns on 1st Embodiment is demonstrated concretely.
  • the dielectric body 200C is formed by laminating dielectric layers 2012, 2011, 2022, and 203.
  • the first ground conductor 210C has a structure composed of first ground conductors 210C1 and 210C2 arranged in two different layers in the dielectric body 200C.
  • the first ground conductor 210C1 is disposed on the first main surface side (the side opposite to the dielectric layer 202) of the dielectric layer 2011.
  • the first ground conductor 210C1 is disposed over substantially the entire surface of both end regions ReE of the dielectric layer 2011.
  • the first ground conductor 210C2 is disposed on the surface of the dielectric layer 2012 on the first main surface side (the side opposite to the dielectric layer 2011).
  • the first ground conductor 210C2 is disposed on substantially the entire surface of the central region ReC of the dielectric layer 2012.
  • the first ground conductor 210C2 is formed in a region between the two first ground conductors 210C1 along the longitudinal direction of the dielectric element body 200C in plan view. . Both ends of the first ground conductor 210C2 overlap with each of the two first ground conductors 210C1 in plan view of the dielectric body 200C. The overlapping portions of the first ground conductors 210C1 and 210C2 are connected by a plurality of interlayer connection conductors 290.
  • the first ground conductor 210C including the first ground conductors 210C1 and 210C2 and the plurality of interlayer connection conductors 290 has the first embodiment shown in the first embodiment in plan view of the dielectric body 200C.
  • the shape is the same as that of the ground conductor 210.
  • the signal conductor first ground conductor 210C2 in the central region ReC is equal to the thickness of the dielectric layer 2012 (thickness after thermocompression bonding) than the first ground conductor 210C1 in both end regions ReE. Separated from the signal conductor 220. Thereby, the magnitude of the capacitive coupling between the signal conductor 220 and the first ground conductor 210C2 in the central region ReC is larger than the magnitude of the capacitive coupling between the signal conductor 220 and the first ground conductor 210C1 in both end regions ReE. Get smaller.
  • FIG. 10 is a diagram illustrating an opening shape of a high-frequency transmission line according to the fifth embodiment of the present invention.
  • FIG. 10A and FIG. 10B show different modes.
  • the high-frequency transmission line according to this embodiment is different from the high-frequency transmission line 10 according to the first embodiment in the shape of the opening, and the other configurations are the same. Therefore, only the shape of the opening will be specifically described.
  • an opening 211D is provided in the first ground conductor 210.
  • the opening 210D has a shape in which the length (opening width) in the short direction changes along the long direction of the dielectric body.
  • the opening width of the opening 210D is wide in the central region in the longitudinal direction and narrow in both end regions.
  • the opening 210 ⁇ / b> D is provided in an ellipse or an oval shape in which the longitudinal direction is the major axis direction in plan view.
  • the wider the width of the signal conductor 220 the wider the opening width of the opening 210D.
  • each opening 211E has a rectangular opening shape, and the length of one side of the rectangle becomes longer as it approaches the center in the longitudinal direction.
  • the length L C2 of the one side is longer than the length L C3 of one side of the opening 211E arranged closer to the end in the longitudinal direction than the opening 211E of the length L C2 of the one side. long. That is, L C1 > L C2 > L C3 . Thereby, the opening area of the opening 211E increases as it approaches the center in the longitudinal direction.
  • the ratio AR C1 of the central area in the longitudinal direction with respect to the first ground conductor 210 in the first ground conductor 210 is the ratio of the opening area of the central area in the longitudinal direction with respect to the first ground conductor 210. greater than the AR C2.
  • the opposing area of the signal conductor and the ground conductor is larger in the central region than the both end regions, or the distance between the signal conductor and the ground conductor is longer in the central region than the both end regions. Any one of the first ground conductor and the second ground conductor is not necessarily provided as long as the ground electrodes having the relationship are included.
  • the high-frequency transmission line has a microstrip line structure.
  • the dielectric constant of the dielectric layer is changed. Also good.
  • the dielectric constant of the central region of the dielectric layer may be made lower than the dielectric constant of both end regions.
  • a through hole or a groove may be provided in the dielectric layer, or a material having a low dielectric constant may be used.

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Abstract

A high-frequency transmission line (10) is provided with a dielectric element (200) obtained by stacking dielectric layers (201, 202, 203). Resist films (31, 32) are respectively located on the two principal surfaces of the dielectric element (200). A first ground conductor (210) is located on substantially the entire resist film (31)-side surface of the dielectric layer (201). A signal conductor (220) having an elongated shape is located on the dielectric layer (203)-side surface of the dielectric layer (202). A ladder-shaped second ground conductor (230) is located on the resist film (32)-side surface of the dielectric layer (203). The signal conductor (220) is shaped so that the width increases towards the center along the direction of elongation. The first ground conductor (210) has a plurality of openings (211L) provided in the center region along the direction of elongation, and has a plurality of openings (211S) having a small opening area provided so as to flank the region in which the openings (211L) are located.

Description

高周波伝送線路、および電子機器High frequency transmission line and electronic equipment
　本発明は、高周波信号を伝送する高周波伝送線路および当該高周波伝送線路を備える電子機器に関する。 The present invention relates to a high-frequency transmission line that transmits a high-frequency signal and an electronic device including the high-frequency transmission line.
　従来、高周波信号を伝送する薄型の高周波伝送線路として、特許文献１に示すような構造のものが考案されている。特許文献１に記載の高周波伝送ケーブルは、所謂トリプレート型のストリップライン構造である。具体的には、平板状の誘電体素体の厚み方向に沿って、第１グランド導体、信号導体、第２グランド導体が順に間隔をおいて配設されている。第１グランド導体と第２グランド導体は、ビア導体によって接続されている。 Conventionally, as a thin high-frequency transmission line for transmitting a high-frequency signal, a structure as shown in Patent Document 1 has been devised. The high-frequency transmission cable described in Patent Document 1 has a so-called triplate-type stripline structure. Specifically, a first ground conductor, a signal conductor, and a second ground conductor are sequentially arranged at intervals along the thickness direction of the flat dielectric body. The first ground conductor and the second ground conductor are connected by a via conductor.
　信号導体は、誘電体素体の長手方向に沿って伸長する長尺状の線状導体である。第１グランド導体は、誘電体素体の厚み方向に直交する平面の略全面に形成されている。 The signal conductor is a long linear conductor extending along the longitudinal direction of the dielectric body. The first ground conductor is formed on substantially the entire plane orthogonal to the thickness direction of the dielectric body.
　第２グランド導体は、誘電体素体の長手方向に沿って伸長する二本の長尺導体を備える。二本の長尺導体は、誘電体素体の長手方向に直交する短手方向の両端付近に形成されている。二本の長尺導体は、長手方向に沿って間隔をおいてブリッジ導体によって接続されている。これにより、第２グランド導体には、長手方向（伸長方向）に沿って、複数の開口部が設けられている。このように開口部を設けることで、高周波伝送線路を湾曲しやすくしている。 The second ground conductor includes two long conductors extending along the longitudinal direction of the dielectric body. The two long conductors are formed near both ends in the short direction perpendicular to the longitudinal direction of the dielectric body. The two long conductors are connected by a bridge conductor at intervals along the longitudinal direction. Thereby, the second ground conductor is provided with a plurality of openings along the longitudinal direction (extension direction). By providing the opening in this way, the high-frequency transmission line is easily bent.
　このような構造の高周波伝送線路の特性インピーダンスは、信号導体と第１、第２グランド導体との形状および位置関係と、誘電体素体の誘電率によって決まるが、主としては、信号導体と第１グランド導体との形状および位置関係と、誘電体素体の誘電率によって決まる。 The characteristic impedance of the high-frequency transmission line having such a structure is determined by the shape and positional relationship between the signal conductor and the first and second ground conductors and the dielectric constant of the dielectric element body. It is determined by the shape and positional relationship with the ground conductor and the dielectric constant of the dielectric body.
国際公開第２０１２／０７３５９１号パンフレットInternational Publication No. 2012/073591 Pamphlet
　しかしながら、上述のようなトリプレート型のストリップライン構造からなる高周波伝送線路を、高周波信号の伝送中に熱分析した結果、高周波伝送線路の中央領域で発熱量が多くなることが、発明者らによって発見された。 However, as a result of thermal analysis of the high-frequency transmission line having the above-described triplate-type stripline structure during transmission of high-frequency signals, the inventors have found that the amount of heat generated in the central region of the high-frequency transmission line increases. It's been found.
　具体的には、高周波伝送線路の両端（長尺方向の両端）にコネクタを接続し、当該コネクタを介して高周波信号を伝送させる。この際、高周波信号の周波数での高周波伝送線路全体としての特性インピーダンスは、略５０Ωに設定されている。このように、インピーダンスマッチングされている状態であっても、２つのコネクタ接続点を結ぶ高周波伝送線路の伝送方向に沿った中央領域では、熱が発生してしまう。 Specifically, a connector is connected to both ends (both ends in the longitudinal direction) of the high-frequency transmission line, and a high-frequency signal is transmitted through the connector. At this time, the characteristic impedance of the entire high-frequency transmission line at the frequency of the high-frequency signal is set to about 50Ω. In this way, even in the impedance matching state, heat is generated in the central region along the transmission direction of the high-frequency transmission line connecting the two connector connection points.
　そして、このように中央領域で熱が発生することで、当該中央領域での電力損失が大きくなり、高周波伝送線路としての伝送損失が大きくなってしまうことが分かった。 And it has been found that the heat generated in the central region increases the power loss in the central region and increases the transmission loss as a high-frequency transmission line.
　したがって、本発明の目的は、高周波信号の伝送による熱損失を抑制でき、伝送損失が低い高周波伝送線路を提供することにある。 Therefore, an object of the present invention is to provide a high-frequency transmission line that can suppress heat loss due to transmission of a high-frequency signal and has low transmission loss.
　この発明の高周波伝送線路は、次の構成を有することを特徴としている。高周波伝送線路は、互いに対向する第１主面と第２主面とを有する誘電体素体と、誘電体素体に設けられた信号伝送方向に伸長する形状の信号導体と、誘電体素体における信号導体と異なる層に形成されたグランド導体と、を備える。信号導体の伸長方向の中央領域の幅は、伸長方向の両端領域の幅よりも大きい。 The high-frequency transmission line of the present invention is characterized by having the following configuration. A high-frequency transmission line includes a dielectric body having a first main surface and a second main surface facing each other, a signal conductor provided in the dielectric body and extending in a signal transmission direction, and a dielectric body And a ground conductor formed in a different layer from the signal conductor. The width of the central region in the extending direction of the signal conductor is larger than the width of both end regions in the extending direction.
　また、この発明の高周波伝送線路では、誘電体素体は、主線路部と主線路部の両端に設けられる複数の外部接続部とを備え、主線路部の中央領域における信号導体の幅は複数の外部接続部近傍の信号導体の幅よりも大きい態様であってもよい。 In the high-frequency transmission line of the present invention, the dielectric element body includes a main line portion and a plurality of external connection portions provided at both ends of the main line portion, and the width of the signal conductor in the central region of the main line portion is plural. The aspect larger than the width | variety of the signal conductor of the external connection part vicinity may be sufficient.
　これらの構成では、高周波伝送線路の中央領域で、信号導体の幅が広いので、信号導体の純抵抗（直流抵抗）が低くなる。これにより、高周波伝送線路の中央領域での発熱を抑制でき、伝送損失の増加を抑制できる。 In these configurations, since the width of the signal conductor is wide in the central region of the high-frequency transmission line, the pure resistance (DC resistance) of the signal conductor is low. Thereby, the heat_generation | fever in the center area | region of a high frequency transmission line can be suppressed, and the increase in transmission loss can be suppressed.
　また、この発明の高周波伝送線路では、信号導体の幅は伸長方向に沿って連続的に変化していることが好ましい。 Further, in the high-frequency transmission line of the present invention, it is preferable that the width of the signal conductor continuously changes along the extending direction.
　この構成では、信号伝送方向に沿った高周波伝送線路のインピーダンス変化が不連続にならないので、不連続点による伝送損失を防止する。これにより、高周波信号をより低損失に伝送できる。 In this configuration, since the impedance change of the high-frequency transmission line along the signal transmission direction does not become discontinuous, transmission loss due to discontinuous points is prevented. Thereby, a high frequency signal can be transmitted with lower loss.
　また、この発明の高周波伝送線路では、信号導体とグランド導体との対向面積は両端領域よりも中央領域の方が広い、もしくは、信号導体とグランド導体との距離は両端領域よりも中央領域の方が長いことが好ましい。 In the high-frequency transmission line according to the present invention, the opposing area between the signal conductor and the ground conductor is larger in the center area than the both end areas, or the distance between the signal conductor and the ground conductor is greater in the center area than the both end areas. Is preferably long.
　この構成では、信号導体の幅が広くなっても、信号導体とグランド導体との対向面積が小さくか、信号導体とグランド導体との距離が長くなる。したがって、信号導体とグランド導体との間で生じる静電容量は小さくなる。このため、信号導体の幅が広くなったことによる高周波伝送線路の特性インピーダンスの低下を抑制でき、信号導体の幅が広くなる前と同じ状態にすることができる。これにより、伝送損失の増加を抑制できる。 In this configuration, even if the width of the signal conductor is increased, the facing area between the signal conductor and the ground conductor is small, or the distance between the signal conductor and the ground conductor is increased. Therefore, the capacitance generated between the signal conductor and the ground conductor is reduced. For this reason, it is possible to suppress a decrease in the characteristic impedance of the high-frequency transmission line due to the increase in the width of the signal conductor, and the same state as before the width of the signal conductor is increased can be obtained. Thereby, an increase in transmission loss can be suppressed.
　また、この発明の高周波伝送線路は、次の構成であってもよい。グランド導体は、信号導体よりも第１主面側に、信号導体に沿う形状で形成された第１グランド導体を備える。第１グランド導体は、信号導体の中央領域における対向面積が信号導体の両端領域における対向面積よりも小さい。 Further, the high frequency transmission line of the present invention may have the following configuration. The ground conductor includes a first ground conductor formed in a shape along the signal conductor on the first main surface side of the signal conductor. The first ground conductor has a smaller facing area in the central region of the signal conductor than a facing area in both end regions of the signal conductor.
　この構成では、グランド導体として信号導体と厚み方向に対向する第１グランド導体を備え、中央領域での信号導体と第１グランド導体との静電容量結合を低下させる具体的な態様を示している。 This configuration shows a specific mode in which a first ground conductor facing the signal conductor in the thickness direction is provided as a ground conductor, and the capacitive coupling between the signal conductor and the first ground conductor in the central region is reduced. .
　また、この発明の高周波伝送線路では、第１グランド導体は、信号導体の中央領域と対向する範囲に開口部が設けられていてもよい。この構成では、信号導体と第１グランド導体の対向面積を小さくする具体的な態様を示している。 In the high-frequency transmission line of the present invention, the first ground conductor may be provided with an opening in a range facing the central region of the signal conductor. In this structure, the specific aspect which makes small the opposing area of a signal conductor and a 1st ground conductor is shown.
　また、この発明の高周波伝送線路では、信号導体の幅の変化に対応して、第１グランド導体の単位面積における開口部の面積の割合が変化させることが好ましい。 In the high-frequency transmission line of the present invention, it is preferable that the ratio of the area of the opening in the unit area of the first ground conductor is changed in response to the change in the width of the signal conductor.
　この構成では、信号導体の幅の変化に応じて、信号導体と第１グランド導体の対向面積が変化するので、信号導体の幅の変化による高周波伝送線路の特性インピーダンスの変化を、より精確に抑制できる。 In this configuration, since the opposing area of the signal conductor and the first ground conductor changes according to the change in the width of the signal conductor, the change in the characteristic impedance of the high-frequency transmission line due to the change in the width of the signal conductor is more accurately suppressed. it can.
　また、この発明の高周波伝送線路では、信号導体の中央領域における第１グランド導体と信号導体の間隔が信号導体の両端領域における第１グランド導体と信号導体の間隔よりも広くてもよい。 In the high-frequency transmission line of the present invention, the interval between the first ground conductor and the signal conductor in the central region of the signal conductor may be wider than the interval between the first ground conductor and the signal conductor in both end regions of the signal conductor.
　この構成でも、信号導体と第１グランド導体との間の静電容量を低くでき、特性インピーダンスの変化を抑制できる。 Even in this configuration, the capacitance between the signal conductor and the first ground conductor can be reduced, and the change in characteristic impedance can be suppressed.
　また、この発明の高周波伝送線路では、信号導体の中央領域は、信号導体の両端領域よりも第２主面側に配設されており、信号導体の中央領域と両端領域は、誘電体素体の厚み方向に伸長する層間接続導体によって接続されていてもよい。 In the high-frequency transmission line of the present invention, the central region of the signal conductor is disposed on the second main surface side with respect to both end regions of the signal conductor, and the central region and both end regions of the signal conductor are formed of the dielectric body. It may be connected by an interlayer connection conductor extending in the thickness direction.
　この構成では、信号導体の中央領域と第１グランド導体との間隔を、信号導体の両端領域と第１グランド導体との間隔よりも広くする具体的な態様を示しており、信号導体の中央領域と両端領域を異なる層に形成する態様を示している。 This configuration shows a specific mode in which the distance between the central region of the signal conductor and the first ground conductor is wider than the distance between the two end regions of the signal conductor and the first ground conductor. And an embodiment in which both end regions are formed in different layers.
　また、この発明の高周波伝送線路では、第１グランド導体の中央領域は、第１グランド導体の両端領域よりも第１主面側に配設されており、第１グランド導体の中央領域と両端領域は、誘電体素体の厚み方向に伸長する層間接続導体によって接続されていてもよい。 In the high-frequency transmission line of the present invention, the central region of the first ground conductor is disposed closer to the first main surface side than both end regions of the first ground conductor, and the central region and both end regions of the first ground conductor May be connected by an interlayer connection conductor extending in the thickness direction of the dielectric body.
　この構成では、信号導体の中央領域と第１グランド導体との間隔を、信号導体の両端領域と第１グランド導体との間隔よりも広くする具体的な態様を示しており、第１グランド導体における信号導体の中央領域に対向する部分と信号導体の両端領域に対向する部分を異なる層に形成する態様を示している。 This configuration shows a specific mode in which the interval between the central region of the signal conductor and the first ground conductor is wider than the interval between the both end regions of the signal conductor and the first ground conductor. The mode which forms the part which opposes the center area | region of a signal conductor and the part which opposes the both ends area | region of a signal conductor in a different layer is shown.
　また、この発明の高周波伝送線路では、次の構成を備えていてもよい。高周波伝送線路のグランド導体は、信号導体よりも第２主面側に、信号導体に沿う形状であり厚み方向において信号導体と重ならない形状で形成され、信号導体を誘電体素体の幅方向に沿って挟むように配設された二本の長尺導体を有する第２グランド導体を備える。長尺導体の中央領域に対応する部分の幅は、両端領域に対応する部分の幅よりも狭い。 The high-frequency transmission line of the present invention may have the following configuration. The ground conductor of the high-frequency transmission line is formed on the second main surface side of the signal conductor in a shape that follows the signal conductor and does not overlap with the signal conductor in the thickness direction, and the signal conductor extends in the width direction of the dielectric body. A second ground conductor having two long conductors disposed so as to be sandwiched therebetween is provided. The width of the portion corresponding to the central region of the long conductor is narrower than the width of the portion corresponding to both end regions.
　この構成では、信号導体と厚み方向に殆ど対向しない第２グランド導体のみを備えている態様、もしくは、第１グランド導体と第２グランド導体とで信号導体を挟み込む態様を示している。そして、第２グランド導体における信号導体の中央領域に対向する部分の幅を、信号導体の両端領域に対向する部分の幅よりも狭くすることで、信号導体の幅が広くなったことによる特性インピーダンスの変化を抑制できる。 This configuration shows an aspect in which only the second ground conductor that is hardly opposed to the signal conductor in the thickness direction is provided, or an aspect in which the signal conductor is sandwiched between the first ground conductor and the second ground conductor. Then, the characteristic impedance due to the wide width of the signal conductor by making the width of the portion of the second ground conductor facing the central region of the signal conductor narrower than the width of the portion of the signal conductor facing both the end regions. Can be suppressed.
　また、この発明の高周波伝送線路では、次の構成であってもよい。高周波伝送線路の第２グランド導体は、二本の長尺導体を信号伝送方向に沿って間隔をおいて接続する複数のブリッジ導体を備える。信号導体の中央領域に対応する部分のブリッジ導体の幅は、両端領域に対応する部分のブリッジ導体の幅よりも狭い。 Further, the high frequency transmission line of the present invention may have the following configuration. The second ground conductor of the high-frequency transmission line includes a plurality of bridge conductors that connect two long conductors at intervals along the signal transmission direction. The width of the bridge conductor in the portion corresponding to the central region of the signal conductor is narrower than the width of the bridge conductor in the portion corresponding to the both end regions.
　この構成では、二本の長尺導体を接続するブリッジ導体を第２グランド導体に備える態様を示している。ブリッジ導体は、構造上、信号導体と対向するが、中央領域に対応する部分のブリッジ導体の幅が、両端領域に対応する部分のブリッジ導体の幅よりも狭いことで、信号導体の幅が広くなったことによる特性インピーダンスの変化を抑制できる。 This configuration shows a mode in which a bridge conductor connecting two long conductors is provided in the second ground conductor. The bridge conductor is structurally opposed to the signal conductor, but the width of the signal conductor is wide because the width of the bridge conductor in the portion corresponding to the central region is narrower than the width of the bridge conductor in the portion corresponding to both end regions. It is possible to suppress a change in characteristic impedance due to the occurrence of the failure.
　また、この発明の高周波伝送線路では、中央領域に対応する部分での複数のブリッジ導体の間隔は、両端領域に対応する部分での複数のブリッジ導体の間隔よりも広いことが好ましい。 In the high-frequency transmission line of the present invention, it is preferable that the interval between the plurality of bridge conductors in the portion corresponding to the central region is wider than the interval between the plurality of bridge conductors in the portion corresponding to the both end regions.
　この構成では、信号導体の中央領域における信号導体とブリッジ導体との対向箇所の個数が、信号導体の両端領域における信号導体とブリッジ導体との対向箇所の個数よりも少なくなる。したがって、信号導体の幅が広くなったことによる特性インピーダンスの変化を抑制できる。 In this configuration, the number of opposing portions of the signal conductor and the bridge conductor in the central region of the signal conductor is smaller than the number of opposing portions of the signal conductor and the bridge conductor in both end regions of the signal conductor. Therefore, it is possible to suppress a change in characteristic impedance due to the wide width of the signal conductor.
　また、この発明の高周波伝送線路では、誘電体素体における信号導体と第１グランド導体に挟まれる中央領域の誘電率は、信号導体と第１グランド導体に挟まれる中央領域の誘電率よりも低くてもよい。 In the high-frequency transmission line of the present invention, the dielectric constant of the central region sandwiched between the signal conductor and the first ground conductor in the dielectric body is lower than the dielectric constant of the central region sandwiched between the signal conductor and the first ground conductor. May be.
　この構成であっても、信号導体の幅が広くなったことによる特性インピーダンスの変化を抑制できる。 Even with this configuration, it is possible to suppress a change in characteristic impedance due to an increase in the width of the signal conductor.
　また、この発明の電子機器は、上述のいずれかに記載の高周波伝送線路と、高周波伝送線路によって接続され高周波伝送線路によって信号を送受信する第１回路部および第２回路部と、を備えたことを特徴としている。 An electronic apparatus according to the present invention includes any one of the high-frequency transmission lines described above, and a first circuit unit and a second circuit unit that are connected by the high-frequency transmission line and transmit and receive signals through the high-frequency transmission line. It is characterized by.
　この構成では、上述の高周波伝送線路を用いることで、電子機器内で低損失に高周波信号を送受信することができ、電子機器の性能を向上させることができる。 In this configuration, by using the above-described high-frequency transmission line, a high-frequency signal can be transmitted and received with low loss in the electronic device, and the performance of the electronic device can be improved.
　この発明によれば、高周波信号の伝送による熱損失を抑制することができる。これにより、高周波信号を低損失に伝送することができる。 According to the present invention, heat loss due to transmission of a high-frequency signal can be suppressed. Thereby, a high frequency signal can be transmitted with low loss.
本発明の実施形態に係る高周波伝送線路の外観斜視図である。1 is an external perspective view of a high-frequency transmission line according to an embodiment of the present invention. 本発明の第１の実施形態に係る高周波伝送線路の分解斜視図である。It is a disassembled perspective view of the high frequency transmission line concerning a 1st embodiment of the present invention. 本発明の第１の実施形態に係る高周波伝送線路を構成する各層の導体パターンを示す平面図である。It is a top view which shows the conductor pattern of each layer which comprises the high frequency transmission line which concerns on the 1st Embodiment of this invention. 図３のＡ－Ａ断面図、Ｂ－Ｂ断面図、およびＣ－Ｃ断面図である。FIG. 4 is a cross-sectional view taken along line AA, BB, and CC in FIG. 3. 本発明の第１の実施形態に係る携帯電子機器の部品構成を示す側面断面図および平面断面図である。It is side surface sectional drawing and plane sectional drawing which show the components structure of the portable electronic device which concerns on the 1st Embodiment of this invention. 本発明の第１の実施形態に係る通信機器モジュールの構成を示す側面図である。It is a side view which shows the structure of the communication apparatus module which concerns on the 1st Embodiment of this invention. 本発明の第２の実施形態に係る高周波伝送線路を構成する各層の導体パターンを示す平面図である。It is a top view which shows the conductor pattern of each layer which comprises the high frequency transmission line which concerns on the 2nd Embodiment of this invention. 本発明の第３の実施形態に係る高周波伝送線路の分解斜視図である。It is a disassembled perspective view of the high frequency transmission line which concerns on the 3rd Embodiment of this invention. 本発明の第４の実施形態に係る高周波伝送線路の分解斜視図である。It is a disassembled perspective view of the high frequency transmission line which concerns on the 4th Embodiment of this invention. 本発明の第５の実施形態に係る高周波伝送線路の開口部形状を示す図である。It is a figure which shows the opening part shape of the high frequency transmission line which concerns on the 5th Embodiment of this invention.
　本発明の第１の実施形態に係る高周波伝送線路について、図を参照して説明する。図１は、本発明の実施形態に係る高周波伝送線路の外観斜視図である。図２は、本発明の第１の実施形態に係る高周波伝送線路の分解斜視図である。図３は、本発明の第１の実施形態に係る高周波伝送線路を構成する各層の導体パターンを示す平面図である。図３（Ａ）は各導体パターンの重なり状態を示す図であり、図３（Ｂ）は第２グランド導体を示し、図３（Ｃ）は信号導体を示し、図３（Ｄ）は第１グランド導体を示す。 The high-frequency transmission line according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of a high-frequency transmission line according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the high-frequency transmission line according to the first embodiment of the present invention. FIG. 3 is a plan view showing a conductor pattern of each layer constituting the high-frequency transmission line according to the first embodiment of the present invention. FIG. 3A is a diagram showing the overlapping state of each conductor pattern, FIG. 3B shows the second ground conductor, FIG. 3C shows the signal conductor, and FIG. Indicates a ground conductor.
図４は、図３のＡ－Ａ断面図、Ｂ－Ｂ断面図、およびＣ－Ｃ断面図である。なお、図の見やすさを優先して、図１、図２では第１主面側が上側となるように図示しており、図３、図４では、第２主面側が上側となるように図示している。 4 is a cross-sectional view taken along line AA, BB, and CC in FIG. 1 and 2, the first main surface side is shown as an upper side, and in FIGS. 3 and 4, the second main surface side is shown as an upper side. Show.
　高周波伝送線路１０は、誘電体素体２００、レジスト膜３１，３２、およびコネクタ４１，４２を備える。誘電体素体２００は、一方向に伸長する長尺状の平板からなる。以下では、伸長する方向を長尺方向と称し、当該長尺方向と厚み方向に直交する方向を短尺方向と称する。そして、誘電体素体２００における長尺方向に平行で厚み方向に直交する面（厚み方向の両端面）を、それぞれ第１主面および第２主面と称する。 The high-frequency transmission line 10 includes a dielectric element body 200, resist films 31 and 32, and connectors 41 and 42. The dielectric element body 200 is composed of a long flat plate extending in one direction. Hereinafter, the extending direction is referred to as the long direction, and the direction perpendicular to the long direction and the thickness direction is referred to as the short direction. The surfaces (distance surfaces in the thickness direction) parallel to the longitudinal direction and perpendicular to the thickness direction in the dielectric body 200 are referred to as a first main surface and a second main surface, respectively.
　レジスト膜３１は、誘電体素体２００の第１主面の全面に配設されており、レジスト膜３２は、誘電体素体２００の第２主面の全面に配設されている。レジスト膜３１，３２は、絶縁性を有する材料からなる。 The resist film 31 is disposed on the entire first main surface of the dielectric element body 200, and the resist film 32 is disposed on the entire second main surface of the dielectric element body 200. The resist films 31 and 32 are made of an insulating material.
　コネクタ４１は、誘電体素体２００における長尺方向の一方端に配設されている。コネクタ４２は、誘電体素体２００における長尺方向の他方端に配設されている。コネクタ４１，４２は、誘電体素体２００の第１主面に配設されている。 The connector 41 is disposed at one end of the dielectric element body 200 in the longitudinal direction. The connector 42 is disposed at the other end of the dielectric element body 200 in the longitudinal direction. The connectors 41 and 42 are disposed on the first main surface of the dielectric element body 200.
　図２に示すように、誘電体素体２００は、誘電体層２０１，２０２，２０３を厚み方向に積層してなる。誘電体層２０１，２０２，２０３は、可撓性を有する絶縁性樹脂からなり、例えば液晶ポリマを材料としている。各誘電体層２０１，２０２，２０３の厚みは１０μｍ～１００μｍ程度である。液晶ポリマからなる誘電体層２０１，２０２，２０３を用いる場合、積層後、熱圧着することで各誘電体層間の界面を接合することにより、誘電体素体２００が作製される。誘電体層２０１側が誘電体素体２００の第１主面側であり、誘電体層２０３側が誘電体素体２００の第２主面側である。 As shown in FIG. 2, the dielectric body 200 is formed by laminating dielectric layers 201, 202, and 203 in the thickness direction. The dielectric layers 201, 202, and 203 are made of an insulating resin having flexibility, and are made of, for example, a liquid crystal polymer. Each dielectric layer 201, 202, 203 has a thickness of about 10 μm to 100 μm. When dielectric layers 201, 202, and 203 made of a liquid crystal polymer are used, dielectric body 200 is fabricated by bonding the interfaces between the dielectric layers by thermocompression after lamination. The dielectric layer 201 side is the first main surface side of the dielectric body 200, and the dielectric layer 203 side is the second main surface side of the dielectric body 200.
　誘電体素体２００は、機能的には主線路部と外部接続部とからなり、主線路部の長尺方向の両端にそれぞれ外部接続部が備えられている。外部接続部の幅（短尺方向の長さ）は、主線路部の幅（短尺方向の長さ）よりも広い。 The dielectric element body 200 is functionally composed of a main line portion and an external connection portion, and external connection portions are provided at both ends in the longitudinal direction of the main line portion. The width of the external connection portion (length in the short direction) is wider than the width of the main line portion (length in the short direction).
　（主線路部の構造）
　誘電体層２０１の第１主面側（レジスト膜３１が配設される側）の面には、第１グランド導体２１０が配設されている。第１グランド導体２１０は、導電性の高い材料からなり、例えば銅（Ｃｕ）等の金属箔からなる。 (Main track structure)
A first ground conductor 210 is disposed on the surface of the dielectric layer 201 on the first main surface side (side on which the resist film 31 is disposed). The first ground conductor 210 is made of a highly conductive material, for example, a metal foil such as copper (Cu).
　第１グランド導体２１０は、誘電体層２０１の第１主面側の略全面に形成されている。第１グランド導体２１０には、複数の開口部２１１Ｌ，２１１Ｓが設けられている。開口部２１１Ｌと開口部２１１Ｓは開口面積が異なる。開口部２１１Ｌは、第１グランド導体２１０における長尺方向の中央領域ＲｅＣに設けられている。ここで、中央領域ＲｅＣとは、例えば、長尺方向の全長を三分割した真ん中の領域である。複数の開口部２１１Ｓは、開口部２１１Ｌの配設範囲を挟んで長尺方向の両側（両端部ＲｅＥの中央領域ＲｅＣ側の範囲）に設けられている。 The first ground conductor 210 is formed on substantially the entire surface of the dielectric layer 201 on the first main surface side. The first ground conductor 210 is provided with a plurality of openings 211L and 211S. The opening 211L and the opening 211S have different opening areas. The opening 211L is provided in the central region ReC in the longitudinal direction of the first ground conductor 210. Here, the central region ReC is, for example, a middle region obtained by dividing the entire length in the longitudinal direction into three. The plurality of openings 211S are provided on both sides in the longitudinal direction with respect to the arrangement range of the openings 211L (a range on the central region ReC side of both end portions ReE).
　誘電体層２０２の第２主面側（誘電体層２０１と反対側）の面には、信号導体２２０が配設されている。信号導体２２０も、導電性の高い材料からなり、例えば銅（Ｃｕ）等の金属箔からなる。 A signal conductor 220 is disposed on the surface of the dielectric layer 202 on the second main surface side (the side opposite to the dielectric layer 201). The signal conductor 220 is also made of a highly conductive material, for example, a metal foil such as copper (Cu).
　信号導体２２０は、誘電体層２０２の長尺方向に沿って伸長する長尺状からなる。信号導体２２０は、誘電体層２０２（誘電体素体２００）の幅方向の略中央に配設されている。信号導体２２０は、長尺方向の両端部の幅ＷＣよりも中央領域ＲｅＣの幅ＷＡの方が広くなる形状からなる。 The signal conductor 220 has a long shape extending along the long direction of the dielectric layer 202. The signal conductor 220 is disposed substantially at the center in the width direction of the dielectric layer 202 (dielectric body 200). Signal conductor 220, a shape which widens towards the width W A of the central region ReC than the width W C of the both end portions in the longitudinal direction.
　また、信号導体２２０は、図３に示すように、長尺方向の両端部から中央領域ＲｅＣに向かって、幅が徐々に広くなるように、設けられている。具体的には、図４に示すように、中央領域ＲｅＣの幅ＷＡは両端部の幅ＷＣよりも広く、中央領域ＲｅＣと両端領域ＲｅＥの境界付近の幅ＷＢは、中央領域ＲｅＣの幅ＷＡと両端部の幅ＷＣとの間の幅である。この際、信号導体２２０の幅は、図３に示すように、長尺方向の両端部から中央領域ＲｅＣに向かって連続的に広くなるようにすることが好ましい。なお、本実施形態の高周波伝送線路１０では、信号導体２２０の中央領域ＲｅＣにおいて幅ＷＡは略一定である。 Further, as shown in FIG. 3, the signal conductor 220 is provided so that the width gradually increases from both ends in the longitudinal direction toward the central region ReC. Specifically, as shown in FIG. 4, the width W A of the central region ReC wider than the width W C of the both end portions, the width W B of the vicinity of the boundary of the central area ReC both end regions ReE the central region ReC it is a width between the width W C of the width W a and both end portions. At this time, it is preferable that the width of the signal conductor 220 is continuously increased from both ends in the longitudinal direction toward the central region ReC as shown in FIG. In the high-frequency transmission line 10 of the present embodiment, the width W A in the central region ReC signal conductors 220 is substantially constant.
　このような構成により、信号導体２２０の中央領域ＲｅＣの純抵抗（直流抵抗）は両端領域ＲｅＥの純抵抗（直流抵抗）よりも小さくなり、信号導体２２０は長尺方向の中央に向かうほど純抵抗（直流抵抗）が小さくなる。これにより、信号導体２２０は、長尺方向の中央領域ＲｅＣの方が両端領域ＲｅＥよりも熱損失が小さくなり、長尺方向の中央に向かうほど熱損失が小さくなる。これにより、従来の構成における課題に示したような、信号導体２２０の熱損失による伝送損失を抑制することができる。 With such a configuration, the pure resistance (DC resistance) of the central region ReC of the signal conductor 220 is smaller than the pure resistance (DC resistance) of both end regions ReE, and the signal conductor 220 has a pure resistance toward the center in the longitudinal direction. (DC resistance) decreases. Thereby, the signal conductor 220 has a smaller heat loss in the central region ReC in the longitudinal direction than in the both end regions ReE, and the heat loss becomes smaller toward the center in the longitudinal direction. Thereby, the transmission loss by the heat loss of the signal conductor 220 as shown in the problem in the conventional configuration can be suppressed.
　誘電体層２０３の第２主面側（レジスト膜３２が配設される側）の面には、第２グランド導体２３０が配設されている。第２グランド導体２３０は、梯子形状からなり、長尺導体２３１，２３２、およびブリッジ導体２３３を備える。長尺導体２３１，２３２およびブリッジ導体２３３は、他の導体と同様の材料（例えば、銅等の金属箔）からなる。 A second ground conductor 230 is disposed on the surface of the dielectric layer 203 on the second main surface side (side on which the resist film 32 is disposed). The second ground conductor 230 has a ladder shape and includes long conductors 231 and 232 and a bridge conductor 233. The long conductors 231 and 232 and the bridge conductor 233 are made of the same material as other conductors (for example, a metal foil such as copper).
　長尺導体２３１，２３２は、誘電体層２０３の長尺方向に沿って伸長する形状で形成されている。長尺導体２３１，２３２は、誘電体層２０３の幅方向（短尺方向）の両端付近に形成されている。この際、長尺導体２３１，２３２は、誘電体素体２００の第１主面および第２主面に直交する方向に見て、信号導体２２０と重ならないように配設されている。長尺導体２３１，２３２は一定の幅からなる。 The long conductors 231 and 232 are formed in a shape extending along the long direction of the dielectric layer 203. The long conductors 231 and 232 are formed near both ends in the width direction (short direction) of the dielectric layer 203. At this time, the long conductors 231 and 232 are disposed so as not to overlap the signal conductor 220 when viewed in a direction orthogonal to the first main surface and the second main surface of the dielectric body 200. The long conductors 231 and 232 have a constant width.
　ブリッジ導体２３３は、誘電体層２０３の長尺方向に沿って間隔を空けて、複数配設されている。複数のブリッジ導体２３３は、矩形であり、長尺導体２３１，２３２を接続している。言い換えれば、長尺導体２３１，２３２は、長尺方向に沿って間隔を空けて複数箇所で、ブリッジ導体２３３によって接続されている。そして、この構成により、ブリッジ導体２３３で接続される部分の間は、開口領域２３４となる。言い換えれば、第２グランド導体２３０には、長尺方向に沿って複数の開口領域２３４が配設されている。 A plurality of bridge conductors 233 are arranged at intervals along the longitudinal direction of the dielectric layer 203. The plurality of bridge conductors 233 are rectangular and connect the long conductors 231 and 232. In other words, the long conductors 231 and 232 are connected by the bridge conductor 233 at a plurality of positions at intervals along the long direction. With this configuration, an opening region 234 is formed between portions connected by the bridge conductor 233. In other words, the second ground conductor 230 is provided with a plurality of opening regions 234 along the longitudinal direction.
　第１グランド導体２１０と第２グランド導体２３０は、誘電体層２０１，２０２，２０３を貫通するように形成された層間接続導体２９０によって接続されている。より具体的には、第２グランド導体２３０を構成する長尺導体２３１，２３２がブリッジ導体２３３に接続する部分と第１グランド導体２１０とが、層間接続導体２９０によって接続されている。 The first ground conductor 210 and the second ground conductor 230 are connected by an interlayer connection conductor 290 formed so as to penetrate the dielectric layers 201, 202, and 203. More specifically, a portion where the long conductors 231 and 232 constituting the second ground conductor 230 are connected to the bridge conductor 233 and the first ground conductor 210 are connected by the interlayer connection conductor 290.
　層間接続導体２９０は、例えばビアホール導体であり、例えばＡｇ，Ｎｉ，Ｃｕ，Ｓｎから選ばれる１つもしくは複数の金属を含む導電性ペーストを、誘電体層２０１，２０２，２０３に設けた孔に付与し、熱により金属化（焼結）させることにより形成される。液晶ポリマからなる誘電体層２０１，２０２，２０３を用いる場合、誘電体層２０１，２０２，２０３を熱圧着する工程における熱により、孔に付与された導電性ペーストを金属化させる。 The interlayer connection conductor 290 is, for example, a via-hole conductor, and applies, for example, a conductive paste containing one or more metals selected from Ag, Ni, Cu, and Sn to the holes provided in the dielectric layers 201, 202, and 203. Then, it is formed by metallization (sintering) with heat. When using the dielectric layers 201, 202, and 203 made of a liquid crystal polymer, the conductive paste applied to the holes is metallized by heat in the step of thermocompression bonding the dielectric layers 201, 202, and 203.
　この構成により、第１グランド導体２１０と第２グランド導体２３０を略同電位、すなわち、これらの導体をグランド電位にすることができる。 With this configuration, the first ground conductor 210 and the second ground conductor 230 can be set to substantially the same potential, that is, these conductors can be set to the ground potential.
　そして、このような構成とすることで、信号導体２２０を主線路とするトリプレート型の高周波伝送線路１０が薄型で形成される。この際、高周波伝送線路１０では、信号導体２２０と第１グランド導体２１０との結合が強いので、第１グランド導体２１０がメイングランドとなり、第２グランド導体２３０がサブグランドとなる。また、第２グランド導体２３０によって、信号導体２２０から外部へ漏洩する電磁波を抑圧するとともに、開口領域２３４が設けられていることで可撓性を高くすることができる。 And by setting it as such a structure, the triplate type high frequency transmission line 10 which makes the signal conductor 220 the main line is formed thinly. At this time, in the high-frequency transmission line 10, since the signal conductor 220 and the first ground conductor 210 are strongly coupled, the first ground conductor 210 serves as the main ground and the second ground conductor 230 serves as the sub-ground. Further, the second ground conductor 230 suppresses electromagnetic waves leaking from the signal conductor 220 to the outside, and the opening region 234 is provided, so that flexibility can be increased.
　なお、当該高周波伝送線路１０の特性インピーダンスは、信号導体２２０と第１グランド導体２１０の形状や位置関係、および誘電体素体２００の材質特性によって基本的に決定される。すなわち、信号導体２２０の幅、および信号導体２２０とグランド導体２１１との距離Ｄ０１によって、基本的な特性インピーダンスは決定される。さらに、信号導体２２０と第２グランド導体２３０との位置関係や距離Ｄ０２等に基づく信号導体２２０と第２グランド導体２３０との結合を加味して、最終的に所望とする特性インピーダンス（例えば５０Ω）に設定される。 The characteristic impedance of the high-frequency transmission line 10 is basically determined by the shape and positional relationship between the signal conductor 220 and the first ground conductor 210 and the material characteristics of the dielectric element body 200. That is, the basic characteristic impedance is determined by the width of the signal conductor 220 and the distance D 01 between the signal conductor 220 and the ground conductor 211. Furthermore, the desired characteristic impedance (for example, 50Ω) is finally taken into account by taking into account the positional relationship between the signal conductor 220 and the second ground conductor 230, the coupling between the signal conductor 220 and the second ground conductor 230 based on the distance D02 and the like. ).
　例えば、具体的には、図４に示すように、誘電体層２０１，２０２の合計の厚みＤ０１を誘電体層２０３の厚みＤ０２よりも厚くすることで、信号導体２２０と第１グランド導体２１０との距離を誘電体素体２００の厚みの半分以上にする。すなわち、信号導体２２０は、誘電体素体２００の厚み方向において、厚み方向の中心よりも第１グランド導体２１０側と反対側にオフセットして配設されている。このような構成により、信号導体２２０と第１グランド導体２１０との容量性結合を低減して、特性インピーダンスを所望値に近づくように設定している。 For example, specifically, as shown in FIG. 4, the signal conductor 220 and the first ground conductor are formed by making the total thickness D 01 of the dielectric layers 201 and 202 larger than the thickness D 02 of the dielectric layer 203. The distance from 210 is set to more than half of the thickness of the dielectric body 200. That is, the signal conductor 220 is disposed in the thickness direction of the dielectric element body 200 so as to be offset from the center in the thickness direction to the side opposite to the first ground conductor 210 side. With such a configuration, capacitive coupling between the signal conductor 220 and the first ground conductor 210 is reduced, and the characteristic impedance is set to approach a desired value.
　さらに、本実施形態の構成では、上述のように、信号導体２２０の幅が長尺方向によって変化する。具体的には、図４に示すように、中央領域ＲｅＣの幅ＷＡは両端領域ＲｅＥの幅ＷＢ，ＷＣよりも広く、両端領域ＲｅＥ内においても、中央領域ＲｅＣ側の幅ＷＢは、端部側の幅ＷＣよりも広い。さらに、図３に示すように、信号導体２２０の幅は、長尺方向の両端部から中央領域ＲｅＣに向かって連続的に広くなるようにすることが好ましい。 Furthermore, in the configuration of the present embodiment, as described above, the width of the signal conductor 220 varies depending on the longitudinal direction. Specifically, as shown in FIG. 4, the width W A of the central region ReC is wider than the widths W B and W C of both end regions ReE, and the width W B on the central region ReC side is also within both end regions ReE. , wider than the width W C of the end side. Furthermore, as shown in FIG. 3, it is preferable that the width of the signal conductor 220 is continuously increased from both ends in the longitudinal direction toward the central region ReC.
　したがって、第１グランド導体２１０の形状が中央領域ＲｅＣと両端領域ＲｅＥとで同じであれば、中央領域ＲｅＣの方が両端領域ＲｅＥよりも、信号導体２２０と第１グランド導体２１０との間の容量性結合が高くなる。これにより、中央領域は両端領域よりも、特性インピーダンスが低くなってしまう。 Therefore, if the shape of the first ground conductor 210 is the same in the central region ReC and the two end regions ReE, the capacitance between the signal conductor 220 and the first ground conductor 210 is greater in the central region ReC than in the two end regions ReE. Sexual bond increases. As a result, the characteristic impedance of the central region is lower than that of both end regions.
　しかしながら、本実施形態の高周波伝送線路１０では、第１グランド導体２１０の中央領域ＲｅＣに信号導体２２０と少なくとも一部が重なる複数の開口部２１１Ｌが設けられていることで、信号導体２２０と第１グランド導体２１０との対向面積を小さくすることができる。信号導体２２０の幅が広くなることによる静電容量の増加を、複数の開口部２１１Ｌを設けることによる静電容量の低下で相殺できる。これにより、信号導体の２２０の幅が広くなることによって高周波伝送線路１０の中央領域ＲｅＣの特性インピーダンスが変化することを抑制できる。 However, in the high-frequency transmission line 10 of the present embodiment, the plurality of openings 211L at least partially overlapping the signal conductor 220 are provided in the central region ReC of the first ground conductor 210, so that the signal conductor 220 and the first conductor The area facing the ground conductor 210 can be reduced. The increase in capacitance due to the wide width of the signal conductor 220 can be offset by the decrease in capacitance due to the provision of the plurality of openings 211L. Thereby, it can suppress that the characteristic impedance of the center area | region ReC of the high frequency transmission line 10 changes because the width | variety of the signal conductor 220 becomes wide.
　さらに、本実施形態では、両端領域ＲｅＥの中央領域ＲｅＣ側の範囲にも、信号導体２２０と少なくとも一部が重なる複数の開口部２１１Ｓを設けている。この両端領域ＲｅＥの中央領域ＲｅＣ側の範囲は、中央領域ＲｅＣよりも信号導体２２０の幅は狭いが、両端と比較すると信号導体２２０の幅は広い。したがって、複数の開口部２１１Ｓを設けることで、中央領域ＲｅＣと同様に、特性インピーダンスが変化することを抑制できる。 Furthermore, in the present embodiment, a plurality of openings 211S at least partially overlapping with the signal conductor 220 are also provided in the range of the both end regions ReE on the central region ReC side. The width of the signal conductor 220 is narrower in the range of the both end regions ReE on the central region ReC side than the central region ReC, but the signal conductor 220 is wider than both ends. Therefore, by providing the plurality of openings 211S, it is possible to suppress the characteristic impedance from changing as in the central region ReC.
　この際、中央領域ＲｅＣでの信号導体２２０の幅ＷＡと比較して、両端領域ＲｅＥの中央領域ＲｅＣ側の範囲での信号導体２２０の幅ＷＢが狭いのに応じて、複数の開口部２１１Ｓによる開口面積は、複数の開口部２１１Ｌによる開口面積よりも小さい。これにより、長尺方向の位置に応じて開口面積が調整されるので、長尺方向のいずれの位置であっても、高周波伝送線路１０の特性インピーダンスを殆ど変化させない。 At this time, as compared to the width W A of the signal conductors 220 in the central region REC, according to the narrow width W B of the signal conductors 220 in the range of the central region REC side across regions Ree, a plurality of openings The opening area by 211S is smaller than the opening area by the some opening part 211L. Thereby, since the opening area is adjusted according to the position in the longitudinal direction, the characteristic impedance of the high-frequency transmission line 10 is hardly changed at any position in the longitudinal direction.
　これにより、高周波伝送線路１０は、全体として所望の特性インピーダンスに設定することができ、特性インピーダンスの不一致による伝送損失を抑制することができる。 Thereby, the high-frequency transmission line 10 can be set to a desired characteristic impedance as a whole, and transmission loss due to mismatch of characteristic impedances can be suppressed.
　以上のように、本実施形態の構成を用いれば、熱損失を含む伝送損失を抑制した低損失な高周波伝送線路を実現することができる。 As described above, by using the configuration of this embodiment, a low-loss high-frequency transmission line that suppresses transmission loss including heat loss can be realized.
　なお、本実施形態では、図３に示すように、開口部２１１Ｌ，２１１Ｓは、誘電体素体２００を平面視して、少なくとも一部が信号導体２２０に重なるように配設しているが、重ならないように配設することも可能である。しかしながら、少なくとも一部が信号導体２２０に重なるように開口部２１１Ｌ，２１１Ｓを配設することで、より効果的に特性インピーダンスを調整することができ、好適である。 In this embodiment, as shown in FIG. 3, the openings 211L and 211S are arranged so that at least a part thereof overlaps the signal conductor 220 when the dielectric element body 200 is viewed in plan view. It is also possible to arrange them so as not to overlap. However, it is preferable to arrange the openings 211L and 211S so that at least a part thereof overlaps the signal conductor 220, so that the characteristic impedance can be adjusted more effectively.
　また、開口部２１１Ｌ，２１１Ｓは、開口面積を変えるだけでなく、配設間隔を変えてもよい。また、開口部２１１Ｌ，２１１Ｓの開口面積を同じにして、配設間隔だけを変えてもよい。 Moreover, the openings 211L and 211S may change not only the opening area but also the arrangement interval. Alternatively, the opening areas 211L and 211S may have the same opening area, and only the arrangement interval may be changed.
　また、本実施形態の中央領域の設定例は一例であり、長尺方向の全長を四分割した真ん中の二つの領域を中央領域としてもよく、長尺方向の全長を五分割した真ん中の三つの領域を中央領域としてもよい。これらは、信号導体を幅広にしない状態での高周波伝送線路１０の熱分布に基づいて設定すればよい。 In addition, the setting example of the central region of the present embodiment is an example, and the middle two regions divided into four in the longitudinal direction may be set as the central region, and the middle three regions in which the total length in the longitudinal direction is divided into five. The region may be a central region. These may be set based on the heat distribution of the high-frequency transmission line 10 in a state where the signal conductor is not widened.
　さらに、本実施形態では、二種類の開口部２１１Ｌ，２１１Ｓを設ける例を示したが、中央領域ＲｅＣ等の区切りをつけることなく、信号導体２２０の幅が広くなるのにしたがって、開口部の開口面積を広げるようにしてもよい。 Furthermore, in the present embodiment, an example in which two types of openings 211L and 211S are provided has been described. However, as the width of the signal conductor 220 is increased without dividing the central region ReC or the like, the openings of the openings are opened. The area may be increased.
　（外部接続部の構造）
　図２に示すように、外部接続部では、第１グランド導体２１０には、外部接続用開口部２１２が設けられている。開口部２１２の中央には、外部接続用導体パターン２１３が配設されている。外部接続用導体パターン２１３は、層間接続導体２９０によって、信号導体２２０の端部に接続されている。 (External connection structure)
As shown in FIG. 2, in the external connection portion, the first ground conductor 210 is provided with an external connection opening 212. In the center of the opening 212, an external connection conductor pattern 213 is disposed. The external connection conductor pattern 213 is connected to the end of the signal conductor 220 by the interlayer connection conductor 290.
　また、外部接続部でも、第１グランド導体２１０と第２グランド導体２３０は、複数の層間接続導体２９０によって接続されている。 In the external connection portion, the first ground conductor 210 and the second ground conductor 230 are connected by a plurality of interlayer connection conductors 290.
　レジスト膜３１には、開口領域３１０が設けられており、第１グランド導体２１０の一部と外部接続用導体パターン２１３は、開口領域３１０を介して第１主面側で外部に露出している。この露出された第１グランド導体２１０と外部接続用導体パターン２１３に対してコネクタ４１，４２が実装されている。 The resist film 31 is provided with an opening region 310, and a part of the first ground conductor 210 and the external connection conductor pattern 213 are exposed to the outside on the first main surface side through the opening region 310. . Connectors 41 and 42 are mounted on the exposed first ground conductor 210 and external connection conductor pattern 213.
　以上のような構成からなる高周波伝送線路は、例えば次に示すように製造される。 The high-frequency transmission line configured as described above is manufactured as follows, for example.
　まず、片面銅貼りの液晶ポリマシートである第１、第２、第３の誘電体シートを用意する。第１の誘電体フィルムの第１主面側に、フォトリソグラフィー技術などを用いたパターニング処理により、第１グランド導体２１１、外部接続用導体パターン２１３を形成する。第２の誘電体フィルムの第２主面側に、パターニング処理により、信号導体２２０を形成する。第３の誘電体フィルムの第２主面側に、パターニング処理により、第２グランド導体２３１，２３２を形成する。なお、第１、第２、第３の誘電体フィルムには、各導体との組が、それぞれ複数個、配列形成されている。 First, first, second, and third dielectric sheets, which are liquid crystal polymer sheets with single-sided copper, are prepared. The first ground conductor 211 and the external connection conductor pattern 213 are formed on the first main surface side of the first dielectric film by a patterning process using a photolithography technique or the like. A signal conductor 220 is formed on the second main surface side of the second dielectric film by patterning. Second ground conductors 231 and 232 are formed on the second main surface side of the third dielectric film by patterning. The first, second, and third dielectric films each have a plurality of pairs formed with each conductor.
　第１、第２、第３の誘電体シートにおける層間接続導体２９０を形成すべき位置に、貫通孔を設けて導電性ペーストを充填する。 In the first, second, and third dielectric sheets, through holes are provided at positions where the interlayer connection conductors 290 are to be formed, and the conductive paste is filled therein.
　第１、第２、第３の誘電体シートを積層し、熱圧着する。この熱圧着により、導電性ペーストが焼結し、層間接続導体２９０が形成される。これにより、誘電体素体２００が複数配列形成された積層誘電体シートが形成される。 The first, second, and third dielectric sheets are laminated and thermocompression bonded. By this thermocompression bonding, the conductive paste is sintered and the interlayer connection conductor 290 is formed. Thereby, a laminated dielectric sheet in which a plurality of dielectric element bodies 200 are arranged is formed.
　誘電体素体２００にレジスト膜３１，３２を塗布し硬化させ、また、はんだ等の導電性材料を用いてコネクタ４１，４２を実装する。これにより、複数の高周波伝送線路１０が配列形成された複合体が形成される。この複合体から、それぞれ個別の高周波伝送線路１０を切り出す。 Resist films 31 and 32 are applied to dielectric body 200 and cured, and connectors 41 and 42 are mounted using a conductive material such as solder. Thereby, the composite_body | complex in which the some high frequency transmission line 10 was arranged and formed is formed. Individual high-frequency transmission lines 10 are cut out from the composite.
　上述の構造からなる高周波伝送線路１０は、次に示す携帯電子機器に用いることができる。図５（Ａ）は本発明の第１の実施形態に係る携帯電子機器の部品構成を示す側面断面図であり、図５（Ｂ）は当該携帯電子機器の部品構成を説明する平面断面図である。 The high-frequency transmission line 10 having the above-described structure can be used for the following portable electronic devices. FIG. 5A is a side cross-sectional view illustrating a component configuration of the portable electronic device according to the first embodiment of the present invention, and FIG. 5B is a plan cross-sectional view illustrating the component configuration of the portable electronic device. is there.
　携帯電子機器７０は、薄型の機器筐体７１を備える。機器筐体７１内には、実装回路基板７２Ａ，７２Ｂと、バッテリーパック７００が配設されている。実装回路基板７２Ａ，７２Ｂの表面には、複数のＩＣチップ７４および実装部品７５が実装されている。実装回路基板７２Ａ，７２Ｂおよびバッテリーパック７００は、機器筐体７１を平面視して、実装回路基板７２Ａ，７２Ｂ間にバッテリーパック７００が配設されるように、機器筐体７１に設置されている。ここで、機器筐体７１はできる限り薄型に形成されているので、機器筐体７１の厚み方向においては、バッテリーパック７００と機器筐体７１との間隔が極狭い。したがって、この間に同軸ケーブルを配設することができない。 The portable electronic device 70 includes a thin device casing 71. In the device casing 71, mounting circuit boards 72A and 72B and a battery pack 700 are disposed. A plurality of IC chips 74 and mounting components 75 are mounted on the surfaces of the mounting circuit boards 72A and 72B. The mounting circuit boards 72A and 72B and the battery pack 700 are installed in the equipment casing 71 so that the battery casing 700 is disposed between the mounting circuit boards 72A and 72B in a plan view of the equipment casing 71. . Here, since the device housing 71 is formed as thin as possible, the distance between the battery pack 700 and the device housing 71 is extremely narrow in the thickness direction of the device housing 71. Therefore, a coaxial cable cannot be disposed between them.
　しかしながら、本実施形態に示した高周波伝送線路１０を、当該高周波伝送線路１０の厚み方向と、機器筐体７１の厚み方向とが一致するように配設することで、バッテリーパック７００と機器筐体７１との間に、高周波伝送線路１０を通すことができる。そして、実装回路基板７２Ａにコネクタ４１を装着し、実装回路基板７２Ｂにコネクタ４２を装着する。これにより、バッテリーパック７００を中間に配して離間された実装回路基板７２Ａ，７２Ｂを、高周波伝送線路１０によって接続することができる。この際、高周波伝送線路１０は可撓性を有するので、バッテリーパック７００が中間に配置されていても、当該バッテリーパック７００の表面を沿うように配置でき、実装回路基板７２Ａ，７２Ｂを確実に接続することができる。 However, by arranging the high-frequency transmission line 10 shown in the present embodiment so that the thickness direction of the high-frequency transmission line 10 matches the thickness direction of the device casing 71, the battery pack 700 and the device casing are arranged. The high-frequency transmission line 10 can be passed between 71 and 71. Then, the connector 41 is attached to the mounting circuit board 72A, and the connector 42 is attached to the mounting circuit board 72B. As a result, the mounted circuit boards 72A and 72B that are spaced apart from each other with the battery pack 700 disposed therebetween can be connected by the high-frequency transmission line 10. At this time, since the high-frequency transmission line 10 has flexibility, even if the battery pack 700 is arranged in the middle, it can be arranged along the surface of the battery pack 700, and the mounting circuit boards 72A and 72B are securely connected. can do.
　さらに、本実施形態に示したように、高周波伝送線路１０は、低損失に高周波信号伝送できるので、実装回路基板７２Ａ，７２Ｂ間で、高周波信号を低損失に送受信することができる。 Furthermore, as shown in the present embodiment, the high-frequency transmission line 10 can transmit high-frequency signals with low loss, so that high-frequency signals can be transmitted and received between the mounted circuit boards 72A and 72B with low loss.
　また、上述の構造からなる高周波伝送線路１０は、次に示す通信機器モジュールにも用いることができる。図６は本発明の第１の実施形態に係る通信機器モジュールの構成を示す側面図である。 The high-frequency transmission line 10 having the above-described structure can also be used for the following communication device module. FIG. 6 is a side view showing the configuration of the communication device module according to the first embodiment of the present invention.
　通信機器モジュール７０Ａは、フロントエンド基板７１１、アンテナ基板７１２、および高周波伝送線路１０’によって構成される。フロントエンド基板７１１の実装面には、高周波フロントエンド回路を実現する各種の回路部品が実装されている。アンテナ基板７１２には、アンテナ導体７２０が形成されている。アンテナ基板７１２は、フロントエンド基板７１１の実装面側に、当該フロントエンド基板７１１から離間して配置されている。 The communication device module 70A includes a front end board 711, an antenna board 712, and a high-frequency transmission line 10 '. Various circuit components that realize a high-frequency front-end circuit are mounted on the mounting surface of the front-end substrate 711. An antenna conductor 720 is formed on the antenna substrate 712. The antenna substrate 712 is disposed on the mounting surface side of the front end substrate 711 so as to be separated from the front end substrate 711.
　高周波伝送線路１０’は、一方端のコネクタ４１が第１主面側に装着され、他方端のコネクタ４２が第２主面側に装着されている。その他の構造は、上述の高周波伝送線路１０と同じである。高周波伝送線路１０’のコネクタ４１は、アンテナ基板７１２におけるフロントエンド基板７１１側の面に接続されている。高周波伝送線路１０’のコネクタ４２は、フロントエンド基板７１１におけるアンテナ基板７１２側の面（実装面）に接続されている。高周波伝送線路１０’は、可撓性を有するので、伸長方向の途中に屈曲部を形成することができる。このように、屈曲部を形成することで、高周波伝送線路１０’は、回路部品に接触しないような形状に成形された状態で、フロントエンド基板７１１とアンテナ基板７１２とを接続することができる。 The high-frequency transmission line 10 ′ has one end connector 41 attached to the first main surface side and the other end connector 42 attached to the second main surface side. Other structures are the same as those of the high-frequency transmission line 10 described above. The connector 41 of the high-frequency transmission line 10 ′ is connected to the surface on the front end substrate 711 side of the antenna substrate 712. The connector 42 of the high-frequency transmission line 10 ′ is connected to the surface (mounting surface) on the antenna substrate 712 side of the front end substrate 711. Since the high-frequency transmission line 10 ′ has flexibility, a bent portion can be formed in the middle of the extending direction. As described above, by forming the bent portion, the high-frequency transmission line 10 ′ can connect the front end substrate 711 and the antenna substrate 712 in a state where the high-frequency transmission line 10 ′ is formed in a shape that does not contact the circuit components.
　そして、本実施形態に示したように、高周波伝送線路１０’は、低損失に高周波信号伝送できるので、フロントエンド基板７１１とアンテナ基板７１２との間で、高周波信号を低損失に送受信することができる。 As shown in the present embodiment, since the high-frequency transmission line 10 ′ can transmit a high-frequency signal with low loss, a high-frequency signal can be transmitted and received with low loss between the front-end substrate 711 and the antenna substrate 712. it can.
　次に、本発明の第２の実施形態に係る高周波伝送線路について、図を参照して説明する。図７は、本発明の第２の実施形態に係る高周波伝送線路を構成する各層の導体パターンを示す平面図である。図７（Ａ）は各導体パターンの重なり状態を示す図であり、図７（Ｂ）は第２グランド導体を示し、図７（Ｃ）は信号導体を示し、図７（Ｄ）は第１グランド導体を示す。 Next, a high-frequency transmission line according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a plan view showing a conductor pattern of each layer constituting the high-frequency transmission line according to the second embodiment of the present invention. FIG. 7A is a diagram showing the overlapping state of each conductor pattern, FIG. 7B shows the second ground conductor, FIG. 7C shows the signal conductor, and FIG. 7D shows the first conductor conductor. Indicates a ground conductor.
　図７に示すように、本実施形態の高周波伝送線路１０Ａは、第１の実施形態に係る高周波伝送線路１０に対して、第１グランド導体２１０に開口部が設けられておらず、第２グランド導体２３０Ａの形状が異なるものである。したがって、第１の実施形態に係る高周波伝送線路１０と異なる箇所のみを具体的に説明する。 As shown in FIG. 7, the high-frequency transmission line 10 </ b> A according to the present embodiment is different from the high-frequency transmission line 10 according to the first embodiment in that an opening is not provided in the first ground conductor 210 and the second ground The shape of the conductor 230A is different. Therefore, only a different part from the high frequency transmission line 10 which concerns on 1st Embodiment is demonstrated concretely.
　第１グランド導体２１０は、開口部を有さない誘電体層の全面に形成された導体パターンである。 The first ground conductor 210 is a conductor pattern formed on the entire surface of the dielectric layer having no opening.
　第２グランド導体２３０Ａは、長尺導体２３１Ａ，２３２Ａからなる。長尺導体２３１Ａ，２３２Ａは、誘電体素体の長尺方向に沿って伸長する長尺状であり、長尺方向の位置によって幅が異なる。具体的には、長尺導体２３１Ａ，２３２Ａの長尺方向の両端部の幅ＷＤ１は、長尺導体２３１Ａ，２３２Ａの長尺方向の中央の幅ＷＤ４よりも広い。また、長尺導体２３１Ａ，２３２Ａの中央領域ＲｅＣと両端領域ＲｅＥとの境界付近の幅ＷＤ３は、両端部の幅ＷＤ１よりも狭く、長尺方向の中央の幅ＷＤ４よりも広い。 The second ground conductor 230A includes long conductors 231A and 232A. The long conductors 231A and 232A have a long shape extending along the long direction of the dielectric body, and the width varies depending on the position in the long direction. Specifically, the width WD 1 at both ends in the longitudinal direction of the long conductors 231A and 232A is wider than the width WD 4 at the center in the longitudinal direction of the long conductors 231A and 232A. Further, the width WD 3 in the vicinity of the boundary between the center region ReC and both end regions ReE of the long conductors 231A and 232A is narrower than the width WD 1 at both ends and wider than the center width WD 4 in the length direction.
　また、長尺導体２３１Ａ，２３２Ａの幅は、長尺方向の中央に近づくにしたがって狭くなっている。この際、部分的に長尺方向に沿って幅が変化しない領域が存在してもよく、本実施形態の例であれば、長尺方向の両端部近傍と中央領域ＲｅＣのさらに中央部分では幅が変化しない。 Also, the widths of the long conductors 231A and 232A are narrowed toward the center in the long direction. At this time, there may be a region where the width does not partially change along the longitudinal direction. In the example of this embodiment, the width is near the both ends in the longitudinal direction and at the central portion of the central region ReC. Does not change.
　長尺導体２３１Ａ，２３２Ａにおける誘電体素体の短尺方向の両端側の辺は、長尺方向に沿って一直線になっている。 Sides on both ends in the short direction of the dielectric body in the long conductors 231A and 232A are in a straight line along the long direction.
　このような構成とすることで、長尺導体２３１Ａ，２３２Ａの間隔（短尺方向に沿った距離）は、長尺方向に近づくほど広くなる。例えば、具体的には、図７に示すように、長尺導体２３１Ａ，２３２Ａの長尺方向の中央での間隔Ｇ４は、長尺導体２３１Ａ，２３２Ａの長尺方向の両端部での間隔Ｇ１よりも広い。また、長尺導体２３１Ａ，２３２Ａの中央領域ＲｅＣと両端領域ＲｅＥとの境界付近での間隔Ｇ３は、両端部での間隔Ｇ１よりも広く、長尺方向の中央での間隔Ｇ４よりも狭い。 By setting it as such a structure, the space | interval (distance along a short direction) of long conductors 231A and 232A becomes large, so that it approaches a long direction. For example, specifically, as shown in FIG. 7, the elongated conductors 231A, spacing G 4 at the center in the longitudinal direction of the 232A is elongated conductor 231A, the gap G at both ends in the longitudinal direction of 232A It is wider than 1 . Further, the elongated conductors 231A, spacing G 3 in the vicinity of the boundary between the central region ReC both ends regions ReE of 232A is wider than the spacing G 1 at both ends, than the spacing G 4 at the center in the longitudinal direction narrow.
　このように、本実施形態の構成では、信号導体２２０の幅が広くなるほど、長尺導体２３１Ａ，２３２Ａの間隔が狭くなる。したがって、信号導体２２０の幅が広くなることによる信号導体２２０と長尺導体２３１Ａ，２３２Ａとの静電容量結合の増加を抑制できる。これにより、信号導体２２０の幅が広くなることによる特性インピーダンスの変化を抑制できる。 Thus, in the configuration of the present embodiment, as the width of the signal conductor 220 increases, the distance between the long conductors 231A and 232A decreases. Therefore, an increase in capacitive coupling between the signal conductor 220 and the long conductors 231A and 232A due to the wide width of the signal conductor 220 can be suppressed. Thereby, a change in characteristic impedance due to the wide width of the signal conductor 220 can be suppressed.
　さらに、本実施形態の高周波伝送線路１０Ａでは、ブリッジ導体の幅も長尺方向の位置によって変化する。例えば、具体的には、図７に示すように、具体的には、長尺方向の中央領域ＲｅＣに配設されたブリッジ導体２３３３の幅Ｗ４は、長尺方向の両端部付近に配設されたブリッジ導体２３３１の幅Ｗ１よりも狭い。また、長尺方向の中央領域ＲｅＣと両端領域ＲｅＥとの境界付近に配設されたブリッジ導体２３３２の幅Ｗ３は、両端部の幅Ｗ１よりも狭く、中央領域の幅Ｗ４よりも広い。すなわち、ブリッジ導体の幅は、長尺方向の中央に近づくにしたがって狭くなっている。 Furthermore, in the high-frequency transmission line 10A of the present embodiment, the width of the bridge conductor also changes depending on the position in the longitudinal direction. For example, as shown in FIG. 7, specifically, the width W 4 of the bridge conductor 2333 disposed in the central region ReC in the longitudinal direction is disposed near both ends in the longitudinal direction. narrower than the width W 1 of the bridge conductors 2331 that is. In addition, the width W 3 of the bridge conductor 2332 disposed near the boundary between the central region ReC and both end regions ReE in the longitudinal direction is narrower than the width W 1 at both ends and wider than the width W 4 of the central region. . That is, the width of the bridge conductor becomes narrower as it approaches the center in the longitudinal direction.
　このような構成により、長尺方向の中央に近づくほど、信号導体とブリッジ導体との対向面積を小さくでき、信号導体とブリッジ導体との静電容量結合を小さくできる。これにより、信号導体２２０の幅が広くなることによる特性インピーダンスの変化をさらに抑制できる。 With such a configuration, the closer to the center in the longitudinal direction, the smaller the facing area between the signal conductor and the bridge conductor, and the smaller the capacitive coupling between the signal conductor and the bridge conductor. Thereby, the change in characteristic impedance due to the width of the signal conductor 220 can be further suppressed.
　次に、本発明の第３の実施形態に係る高周波伝送線路について、図を参照して説明する。図８は、本発明の第３の実施形態に係る高周波伝送線路の分解斜視図である。 Next, a high-frequency transmission line according to the third embodiment of the present invention will be described with reference to the drawings. FIG. 8 is an exploded perspective view of the high-frequency transmission line according to the third embodiment of the present invention.
　図８に示すように、本実施形態の高周波伝送線路１０Ｂは、第１の実施形態に係る高周波伝送線路１０に対して、第１グランド導体２１０に開口部が設けられておらず、信号導体２２０Ｂの形状が異なるものである。したがって、第１の実施形態に係る高周波伝送線路１０と異なる箇所のみを具体的に説明する。 As shown in FIG. 8, the high-frequency transmission line 10B of the present embodiment has no opening in the first ground conductor 210 with respect to the high-frequency transmission line 10 according to the first embodiment, and the signal conductor 220B. Are different in shape. Therefore, only a different part from the high frequency transmission line 10 which concerns on 1st Embodiment is demonstrated concretely.
　誘電体素体２００Ｂは、誘電体層２０１，２０２１，２０２２，２０３を積層してなる。第１グランド導体２１０は、誘電体層２０１の全面に配設されている。すなわち、第１グランド導体２１０には、第１の実施形態に示したような開口部が設けられていない。 The dielectric body 200B is formed by laminating dielectric layers 201, 2021, 2022, and 203. The first ground conductor 210 is disposed on the entire surface of the dielectric layer 201. That is, the first ground conductor 210 is not provided with an opening as shown in the first embodiment.
　信号導体２２０Ｂは、誘電体素体２００Ｂ内の異なる二層に分けて配設された信号導体２２０Ｂ１，２２０Ｂ２からなる構造を有する。 The signal conductor 220B has a structure made up of signal conductors 220B1 and 220B2 arranged in two different layers in the dielectric body 200B.
　信号導体２２０Ｂ１は、誘電体層２０２１に配設されている。信号導体２２０Ｂ１は、誘電体層２０２１の両端領域ＲｅＥに対応する領域に配設されている。信号導体２２０Ｂ１は、長尺方向の中央に近づくほど幅広である。 The signal conductor 220B1 is disposed on the dielectric layer 2021. The signal conductor 220B1 is disposed in a region corresponding to both end regions ReE of the dielectric layer 2021. The signal conductor 220B1 is wider toward the center in the longitudinal direction.
　信号導体２２０Ｂ２は、誘電体層２０２２に配設されている。信号導体２２０Ｂ２は、誘電体層２０２２の中央領域ＲｅＣに対応する領域に配設されている。信号導体２２０Ｂ２は、長尺方向に沿って全長に亘り略同じ幅からなるが、長尺方向の中央に近づくほど幅広となっていることが好ましい。 The signal conductor 220B2 is disposed on the dielectric layer 2022. The signal conductor 220B2 is disposed in a region corresponding to the central region ReC of the dielectric layer 2022. The signal conductor 220B2 has substantially the same width over the entire length along the longitudinal direction, but it is preferable that the signal conductor 220B2 become wider as it approaches the center in the longitudinal direction.
　そして、本実施形態の構成では、誘電体素体２００Ｂを平面視して、長尺方向に沿って、信号導体２２０Ｂ２は、二本の信号導体２２０Ｂ１の間の領域に形成されている。信号導体２２０Ｂ２の両端は、誘電体素体２００Ｂを平面視して、二本の信号導体２２０Ｂ１のそれぞれと重なっている。この信号導体２２０Ｂ１，２２０Ｂ２が重なっている部分は、層間接続導体２９０によって接続されている。 In the configuration of the present embodiment, the signal conductor 220B2 is formed in a region between the two signal conductors 220B1 along the longitudinal direction of the dielectric body 200B in plan view. Both ends of the signal conductor 220B2 overlap with each of the two signal conductors 220B1 in a plan view of the dielectric body 200B. The overlapping portions of the signal conductors 220B1 and 220B2 are connected by an interlayer connection conductor 290.
　このような構成により、信号導体２２０Ｂ１，２２０Ｂ２および層間接続導体２９０からなる信号導体２２０Ｂは、誘電体素体２００Ｂを平面視して、第１の実施形態に示した信号導体２２０と同じ形状となる。 With such a configuration, the signal conductor 220B including the signal conductors 220B1 and 220B2 and the interlayer connection conductor 290 has the same shape as the signal conductor 220 shown in the first embodiment in plan view of the dielectric body 200B. .
　さらに、本実施形態の構成では、中央領域ＲｅＣの信号導体２２０Ｂ２は、両端領域ＲｅＥの信号導体２２０Ｂ１よりも、誘電体層２０２２の厚み（熱圧着後の厚み）分だけ、第１グランド導体２１０から離間する。これにより、中央領域ＲｅＣの信号導体２２０Ｂ２と第１グランド導体２１０とによる静電容量結合の大きさは、両端領域ＲｅＥの信号導体２２０Ｂ１と第１グランド導体２１０とによる静電容量結合の大きさよりも小さくなる。 Further, in the configuration of the present embodiment, the signal conductor 220B2 in the central region ReC is separated from the first ground conductor 210 by the thickness of the dielectric layer 2022 (thickness after thermocompression bonding) than the signal conductor 220B1 in the both end regions ReE. Separate. Thereby, the magnitude of the capacitive coupling between the signal conductor 220B2 and the first ground conductor 210 in the central region ReC is larger than the magnitude of the capacitive coupling between the signal conductor 220B1 and the first ground conductor 210 in the both end regions ReE. Get smaller.
　したがって、中央領域ＲｅＣの信号導体２２０Ｂ２の幅が両端領域ＲｅＥの信号導体２２０Ｂ１の幅よりも広いことによる静電容量の変化を相殺することできる。これにより、信号導体２２０Ｂ２を信号導体２２０Ｂ１よりも幅広にすることによる特性インピーダンスの変化を抑制でき、低損失な高周波伝送線路１０Ｂを実現することができる。 Therefore, it is possible to cancel the change in capacitance due to the fact that the width of the signal conductor 220B2 in the central region ReC is wider than the width of the signal conductor 220B1 in both end regions ReE. Thereby, the change of the characteristic impedance by making the signal conductor 220B2 wider than the signal conductor 220B1 can be suppressed, and the low-loss high-frequency transmission line 10B can be realized.
　なお、図８では、信号導体２２０Ｂ１，２２０Ｂ２を接続する層間接続導体２９０は、それぞれ一つずつしか図示していないが、複数個であってもよい。 In FIG. 8, only one interlayer connection conductor 290 connecting the signal conductors 220B1 and 220B2 is shown, but a plurality of interlayer connection conductors 290 may be provided.
　次に、本発明の第４の実施形態に係る高周波伝送線路について、図を参照して説明する。図９は、本発明の第４の実施形態に係る高周波伝送線路の分解斜視図である。 Next, a high-frequency transmission line according to the fourth embodiment of the present invention will be described with reference to the drawings. FIG. 9 is an exploded perspective view of the high-frequency transmission line according to the fourth embodiment of the present invention.
　図９に示すように、本実施形態の高周波伝送線路１０Ｃは、第１の実施形態に係る高周波伝送線路１０に対して、第１グランド導体２１０Ｃに開口部が設けられておらず、さらに第１グランド導体２１０Ｃの形状が異なるものである。したがって、第１の実施形態に係る高周波伝送線路１０と異なる箇所のみを具体的に説明する。 As shown in FIG. 9, the high-frequency transmission line 10 </ b> C according to the present embodiment is not provided with an opening in the first ground conductor 210 </ b> C with respect to the high-frequency transmission line 10 according to the first embodiment. The shape of the ground conductor 210C is different. Therefore, only a different part from the high frequency transmission line 10 which concerns on 1st Embodiment is demonstrated concretely.
　誘電体素体２００Ｃは、誘電体層２０１２，２０１１，２０２２，２０３を積層してなる。第１グランド導体２１０Ｃは、誘電体素体２００Ｃ内の異なる二層に分けて配設された第１グランド導体２１０Ｃ１，２１０Ｃ２からなる構造を有する。 The dielectric body 200C is formed by laminating dielectric layers 2012, 2011, 2022, and 203. The first ground conductor 210C has a structure composed of first ground conductors 210C1 and 210C2 arranged in two different layers in the dielectric body 200C.
　第１グランド導体２１０Ｃ１は、誘電体層２０１１の第１主面側（誘電体層２０２と反対側）の面に配設されている。第１グランド導体２１０Ｃ１は、誘電体層２０１１の両端領域ＲｅＥの略全面に亘って配設されている。 The first ground conductor 210C1 is disposed on the first main surface side (the side opposite to the dielectric layer 202) of the dielectric layer 2011. The first ground conductor 210C1 is disposed over substantially the entire surface of both end regions ReE of the dielectric layer 2011.
　第１グランド導体２１０Ｃ２は、誘電体層２０１２の第１主面側（誘電体層２０１１と反対側）の面に配設されている。第１グランド導体２１０Ｃ２は、誘電体層２０１２の中央領域ＲｅＣの略全面に配設されている。 The first ground conductor 210C2 is disposed on the surface of the dielectric layer 2012 on the first main surface side (the side opposite to the dielectric layer 2011). The first ground conductor 210C2 is disposed on substantially the entire surface of the central region ReC of the dielectric layer 2012.
　そして、本実施形態の構成では、誘電体素体２００Ｃを平面視して、長尺方向に沿って、第１グランド導体２１０Ｃ２は、二つの第１グランド導体２１０Ｃ１の間の領域に形成されている。第１グランド導体２１０Ｃ２の両端は、誘電体素体２００Ｃを平面視して、二つの第１グランド導体２１０Ｃ１のそれぞれと重なっている。この第１グランド導体２１０Ｃ１，２１０Ｃ２が重なっている部分は、複数の層間接続導体２９０によって接続されている。 In the configuration of the present embodiment, the first ground conductor 210C2 is formed in a region between the two first ground conductors 210C1 along the longitudinal direction of the dielectric element body 200C in plan view. . Both ends of the first ground conductor 210C2 overlap with each of the two first ground conductors 210C1 in plan view of the dielectric body 200C. The overlapping portions of the first ground conductors 210C1 and 210C2 are connected by a plurality of interlayer connection conductors 290.
　このような構成により、第１グランド導体２１０Ｃ１，２１０Ｃ２および複数の層間接続導体２９０からなる第１グランド導体２１０Ｃは、誘電体素体２００Ｃを平面視して、第１の実施形態に示した第１グランド導体２１０と同じ形状となる。 With such a configuration, the first ground conductor 210C including the first ground conductors 210C1 and 210C2 and the plurality of interlayer connection conductors 290 has the first embodiment shown in the first embodiment in plan view of the dielectric body 200C. The shape is the same as that of the ground conductor 210.
　さらに、本実施形態の構成では、中央領域ＲｅＣの信号導体第１グランド導体２１０Ｃ２は、両端領域ＲｅＥの第１グランド導体２１０Ｃ１よりも、誘電体層２０１２の厚み（熱圧着後の厚み）分だけ、信号導体２２０から離間する。これにより、中央領域ＲｅＣの信号導体２２０と第１グランド導体２１０Ｃ２とによる静電容量結合の大きさは、両端領域ＲｅＥの信号導体２２０と第１グランド導体２１０Ｃ１とによる静電容量結合の大きさよりも小さくなる。 Furthermore, in the configuration of the present embodiment, the signal conductor first ground conductor 210C2 in the central region ReC is equal to the thickness of the dielectric layer 2012 (thickness after thermocompression bonding) than the first ground conductor 210C1 in both end regions ReE. Separated from the signal conductor 220. Thereby, the magnitude of the capacitive coupling between the signal conductor 220 and the first ground conductor 210C2 in the central region ReC is larger than the magnitude of the capacitive coupling between the signal conductor 220 and the first ground conductor 210C1 in both end regions ReE. Get smaller.
　したがって、信号導体２２０の中央領域ＲｅＣの幅が両端領域ＲｅＥの幅よりも広いことによる静電容量の変化を相殺することできる。これにより、信号導体２２０の中央領域ＲｅＣの部分を両端領域ＲｅＥの部分よりも幅広にすることによる特性インピーダンスの変化を抑制でき、低損失な高周波伝送線路１０Ｃを実現することができる。 Therefore, it is possible to cancel the change in capacitance due to the width of the central region ReC of the signal conductor 220 being wider than the width of the both end regions ReE. Thereby, the change of the characteristic impedance by making the part of the center region ReC of the signal conductor 220 wider than the part of the both end regions ReE can be suppressed, and the low-loss high-frequency transmission line 10C can be realized.
　次に、本発明の第５の実施形態に係る高周波伝送線路について、図を参照して説明する。図１０は、本発明の第５の実施形態に係る高周波伝送線路の開口部形状を示す図である。図１０（Ａ）と図１０（Ｂ）は異なる態様を示している。 Next, a high frequency transmission line according to a fifth embodiment of the invention will be described with reference to the drawings. FIG. 10 is a diagram illustrating an opening shape of a high-frequency transmission line according to the fifth embodiment of the present invention. FIG. 10A and FIG. 10B show different modes.
　本実施形態に係る高周波伝送線路は、開口部の形状が第１の実施形態に係る高周波伝送線路１０と異なるものであり、他の構成は同じである。したがって、開口部の形状のみを具体的に説明する。 The high-frequency transmission line according to this embodiment is different from the high-frequency transmission line 10 according to the first embodiment in the shape of the opening, and the other configurations are the same. Therefore, only the shape of the opening will be specifically described.
　図１０（Ａ）に示すように、高周波伝送線路１０Ｄでは、第１グランド導体２１０に開口部２１１Ｄが設けられている。開口部２１０Ｄは、誘電体素体の長尺方向に沿って短尺方向の長さ（開口幅）が変化する形状からなる。開口部２１０Ｄの開口幅は、長尺方向の中央領域で広く、両端領域で狭い。例えば、図１０（Ａ）に示すように、開口部２１０Ｄは、平面視して、長尺方向が長軸方向となる楕円もしくは長円形状に設けられている。 As shown in FIG. 10A, in the high-frequency transmission line 10D, an opening 211D is provided in the first ground conductor 210. The opening 210D has a shape in which the length (opening width) in the short direction changes along the long direction of the dielectric body. The opening width of the opening 210D is wide in the central region in the longitudinal direction and narrow in both end regions. For example, as illustrated in FIG. 10A, the opening 210 </ b> D is provided in an ellipse or an oval shape in which the longitudinal direction is the major axis direction in plan view.
　このような構成では、信号導体２２０の幅が広くなるほど、開口部２１０Ｄの開口幅も広くなる。これにより、第１の実施形態と同様に、特性インピーダンスの変化を抑制し、高周波信号を低損失に伝送することができる。 In such a configuration, the wider the width of the signal conductor 220, the wider the opening width of the opening 210D. Thereby, similarly to the first embodiment, it is possible to suppress a change in characteristic impedance and transmit a high-frequency signal with low loss.
　図１０（Ｂ）に示すように、高周波伝送線路１０Ｅでは、第１グランド導体２１０に複数の開口部２１１Ｅが配列して設けられている。各開口部２１１Ｅは開口形状が矩形であり、当該矩形の一辺の長さは、長尺方向の中央に近づくほど長い。具体的に、図１０（Ｂ）の場合であれば、中央付近の開口部２１１Ｅの一辺の長さＬＣ１は、当該一辺の長さＬＣ１の開口部２１１Ｅよりも、長尺方向の端部に近い側に配置された開口部２１１Ｅの一辺の長さＬＣ２よりも長い。さらに、この一辺の長さＬＣ２は、当該一辺の長さＬＣ２の開口部２１１Ｅよりも、長尺方向の端部に近い側に配置された開口部２１１Ｅの一辺の長さＬＣ３よりも長い。すなわち、ＬＣ１＞ＬＣ２＞ＬＣ３の関係にある。これにより、開口部２１１Ｅは、長尺方向の中央に近づくほど開口面積が大きくなる。 As shown in FIG. 10B, in the high-frequency transmission line 10E, a plurality of openings 211E are arranged in the first ground conductor 210. Each opening 211E has a rectangular opening shape, and the length of one side of the rectangle becomes longer as it approaches the center in the longitudinal direction. Specifically, in the case of FIG. 10 (B), the opening 211E of the side length L C1 near the center, rather than the opening 211E of the length L C1 of the one side, the longitudinal direction of the end portion It is longer than the length L C2 of one side of the opening 211E arranged on the side close to. Further, the length L C2 of the one side is longer than the length L C3 of one side of the opening 211E arranged closer to the end in the longitudinal direction than the opening 211E of the length L C2 of the one side. long. That is, L C1 > L C2 > L C3 . Thereby, the opening area of the opening 211E increases as it approaches the center in the longitudinal direction.
　また、図１０（Ｂ）に示すように、中央付近の開口部２１１Ｅの長尺方向に沿った配置間隔ＰＣ１は、長尺方向の端部に近い側に配置された開口部２１１Ｅの長尺方向に沿った配置間隔ＰＣ２よりも狭い。 Further, as shown in FIG. 10 (B), the arrangement interval P C1 along the longitudinal direction of the opening 211E near the center, the elongated openings 211E which are disposed closer to the end portion in the longitudinal direction It is narrower than the arrangement interval PC2 along the direction.
　このような構成による、第１グランド導体２１０における第１グランド導体２１０に対する長尺方向の中央領域の開口面積の割合ＡＲＣ１は、第１グランド導体２１０に対する長尺方向の中央領域の開口面積の割合ＡＲＣ２よりも大きい。これにより、第１の実施形態と同様に、特性インピーダンスの変化を抑制し、高周波信号を低損失に伝送することができる。 With this configuration, the ratio AR C1 of the central area in the longitudinal direction with respect to the first ground conductor 210 in the first ground conductor 210 is the ratio of the opening area of the central area in the longitudinal direction with respect to the first ground conductor 210. greater than the AR C2. Thereby, similarly to the first embodiment, it is possible to suppress a change in characteristic impedance and transmit a high-frequency signal with low loss.
　なお、本発明において、信号導体とグランド導体との対向面積は両端領域よりも中央領域の方が広い、もしくは、信号導体とグランド導体との距離は両端領域よりも中央領域の方が長い、という関係を有するグランド電極を有する限り、第１グランド導体または第２グランド導体のいずれか一方は必ずしも設けなくてもよい。この場合、高周波伝送線路はマイクロストリップライン構造となる。 In the present invention, the opposing area of the signal conductor and the ground conductor is larger in the central region than the both end regions, or the distance between the signal conductor and the ground conductor is longer in the central region than the both end regions. Any one of the first ground conductor and the second ground conductor is not necessarily provided as long as the ground electrodes having the relationship are included. In this case, the high-frequency transmission line has a microstrip line structure.
　また、上述の各実施形態の構成は、必要に応じて組み合わせて用いることができる。例えば、（１）第１グランド導体に開口部を形成する構成、（２）第１グランド導体と信号導体との中央領域ＲｅＣでの間隔を両端領域ＲｅＥでの間隔よりも広くする構成、を組み合わせてもよい。 In addition, the configurations of the above-described embodiments can be used in combination as necessary. For example, (1) a configuration in which an opening is formed in the first ground conductor, and (2) a configuration in which the distance between the first ground conductor and the signal conductor in the central region ReC is wider than the distance between both end regions ReE. May be.
　また、上述の各実施形態の構成では、信号導体とグランド導体との対向面積または距離の少なくとも一方を中央領域と両端領域で変化させる例を示したが、誘電体層の誘電率を変化させてもよい。例えば、誘電体層の中央領域の誘電率を、両端領域の誘電率よりも低くすればよい。誘電率を低くする態様としては、誘電体層に貫通穴や溝を設けたり、誘電率の低い材質を用いればよい。 In the configuration of each of the embodiments described above, the example in which at least one of the opposing area or distance between the signal conductor and the ground conductor is changed in the central region and the both end regions has been described, but the dielectric constant of the dielectric layer is changed. Also good. For example, the dielectric constant of the central region of the dielectric layer may be made lower than the dielectric constant of both end regions. As a mode for reducing the dielectric constant, a through hole or a groove may be provided in the dielectric layer, or a material having a low dielectric constant may be used.
１０，１０’，１０Ａ，１０Ｂ，１０Ｃ，１０Ｄ，１０Ｅ：高周波伝送線路
２００，２００Ａ，２００Ｂ，２００Ｃ：誘電体素体
２０１，２０２，２０３，２０１１，２０１２，２０２１，２０２２：誘電体層
２１０，２１０Ｃ，２１０Ｃ１，２１０Ｃ２：第１グランド導体
２１１Ｌ，２１１Ｓ，２１１Ｄ，２１１Ｅ：開口部
２１２：外部接続用開口部
２１３：外部接続用導体パターン
２２０，２２０Ｂ，２２０Ｂ１，２２０Ｂ２：信号導体
２３０，２３０Ａ：第２グランド導体
２３１，２３２，２３１Ａ，２３２Ａ：長尺導体
２３３，２３３１，２３３２，２３３３：ブリッジ導体
２３４，２３４１，２３４２，２３４３：開口部
２９０：層間接続導体
３１，３２：レジスト膜
３１０：開口領域
４１，４２：コネクタ
７０：携帯電子機器
７０Ａ：通信機器モジュール
７１：機器筐体
７２Ａ，７２Ｂ：実装回路基板
７４：ＩＣチップ
７５：実装部品
７１１：フロントエンド基板
７１２：アンテナ基板
７２０：アンテナ導体 10, 10 ', 10A, 10B, 10C, 10D, 10E: high- frequency transmission lines 200, 200A, 200B, 200C: dielectric bodies 201, 202, 203, 2011, 2012, 2021, 2022: dielectric layers 210, 210C 210C1, 210C2: first ground conductors 211L, 211S, 211D, 211E: opening 212: external connection opening 213: external connection conductor patterns 220, 220B, 220B1, 220B2: signal conductor 230, 230A: second ground Conductors 231, 232, 231A, 232A: Long conductors 233, 2331, 2332, 2333: Bridge conductors 234, 2341, 2342, 2343: Opening 290: Interlayer connection conductor 31, 32: Resist film 310: Opening regions 41, 42 : Connector 70: Portable electronic device 70 A: Communication device module 71: Device housing 72A, 72B: Mounting circuit board 74: IC chip 75: Mounting component 711: Front end board 712: Antenna board 720: Antenna conductor

Claims (15)

  1. 　互いに対向する第１主面と第２主面とを有する誘電体素体と、
    　前記誘電体素体に設けられた信号伝送方向に伸長する形状の信号導体と、
    　前記誘電体素体における前記信号導体と異なる層に形成されたグランド導体と、
    　を備え、
    　前記信号導体の前記伸長方向の中央領域の幅は、前記伸長方向の両端領域の幅よりも大きい、
    　高周波伝送線路。     A dielectric body having a first main surface and a second main surface facing each other;
    A signal conductor having a shape extending in a signal transmission direction provided in the dielectric body;
    A ground conductor formed in a different layer from the signal conductor in the dielectric body;
    With
    The width of the central region in the extension direction of the signal conductor is larger than the width of both end regions in the extension direction.
    High frequency transmission line.
  2. 　前記誘電体素体は、主線路部と、主線路部の両端に設けられる複数の外部接続部とを備え、
    　前記主線路部の中央領域における前記信号導体の幅は、複数の外部接続部近傍の前記信号導体の幅よりも大きい、請求項１に記載の高周波伝送線路。     The dielectric element body includes a main line portion and a plurality of external connection portions provided at both ends of the main line portion,
    2. The high-frequency transmission line according to claim 1, wherein a width of the signal conductor in a central region of the main line portion is larger than a width of the signal conductor in the vicinity of a plurality of external connection portions.
  3. 　前記信号導体の幅は、前記伸長方向に沿って連続的に変化している、
    　請求項１または請求項２に記載の高周波伝送線路。     The width of the signal conductor is continuously changing along the extending direction.
    The high-frequency transmission line according to claim 1 or 2.
  4. 　前記信号導体と前記グランド導体との対向面積は前記両端領域よりも中央領域の方が広い、もしくは、前記信号導体と前記グランド導体との距離は前記両端領域よりも前記中央領域の方が長い、
    　請求項１乃至請求項３のいずれかに記載の高周波伝送線路。     The opposing area of the signal conductor and the ground conductor is wider in the central region than the both end regions, or the distance between the signal conductor and the ground conductor is longer in the central region than the both end regions,
    The high-frequency transmission line according to any one of claims 1 to 3.
  5. 　前記グランド導体は、前記信号導体よりも前記第１主面側に、前記信号導体に沿う形状で形成された第１グランド導体を備え、
    　該第１グランド導体は、前記信号導体の前記中央領域における対向面積が前記信号導体の前記両端領域における対向面積よりも小さい、
    　請求項１乃至請求項４のいずれかに記載の高周波伝送線路。     The ground conductor includes a first ground conductor formed in a shape along the signal conductor on the first main surface side of the signal conductor,
    The first ground conductor has a smaller opposing area in the central region of the signal conductor than an opposing area in the both end regions of the signal conductor,
    The high-frequency transmission line according to any one of claims 1 to 4.
  6. 　前記第１グランド導体は、前記信号導体の前記中央領域と対向する範囲に開口部が設けられている、
    　請求項５に記載の高周波伝送線路。     The first ground conductor is provided with an opening in a range facing the central region of the signal conductor.
    The high frequency transmission line according to claim 5.
  7. 　前記信号導体の幅の変化に対応して、前記第１グランド導体の単位面積における前記開口部の面積の割合が変化する、
    　請求項６に記載の高周波伝送線路。     Corresponding to the change in the width of the signal conductor, the ratio of the area of the opening in the unit area of the first ground conductor changes.
    The high frequency transmission line according to claim 6.
  8. 　前記信号導体の前記中央領域における前記第１グランド導体と前記信号導体の間隔が前記信号導体の前記両端領域における前記第１グランド導体と前記信号導体の間隔よりも広い、
    　請求項５乃至請求項７のいずれかに記載の高周波伝送線路。     An interval between the first ground conductor and the signal conductor in the central region of the signal conductor is wider than an interval between the first ground conductor and the signal conductor in the both end regions of the signal conductor;
    The high-frequency transmission line according to claim 5.
  9. 　前記信号導体の前記中央領域は、前記信号導体の前記両端領域よりも前記第２主面側に配設されており、
    　前記信号導体の前記中央領域と前記両端領域は、前記誘電体素体の厚み方向に伸長する層間接続導体によって接続されている、
    　請求項８に記載の高周波伝送線路。     The central region of the signal conductor is disposed closer to the second main surface than the both end regions of the signal conductor,
    The central region and the both end regions of the signal conductor are connected by an interlayer connection conductor extending in the thickness direction of the dielectric body.
    The high-frequency transmission line according to claim 8.
  10. 　前記第１グランド導体の前記中央領域は、前記第１グランド導体の前記両端領域よりも前記第１主面側に配設されており、
    　前記第１グランド導体の前記中央領域と前記両端領域は、前記誘電体素体の厚み方向に伸長する層間接続導体によって接続されている、
    　請求項８または請求項９に記載の高周波伝送線路。     The central region of the first ground conductor is disposed closer to the first main surface than the both end regions of the first ground conductor;
    The central region and the both end regions of the first ground conductor are connected by an interlayer connection conductor extending in the thickness direction of the dielectric body.
    The high-frequency transmission line according to claim 8 or 9.
  11. 　前記グランド導体は、前記信号導体よりも前記第２主面側に、前記信号導体に沿う形状であり前記厚み方向において前記信号導体と重ならない形状で形成され、前記信号導体を前記誘電体素体の幅方向に沿って挟むように配設された二本の長尺導体を有する第２グランド導体を備え、
    　前記長尺導体の前記中央領域に対応する部分の幅は、前記両端領域に対応する部分の幅よりも狭い、
    　請求項１乃至請求項１０のいずれかに記載の高周波伝送線路。     The ground conductor is formed on the second main surface side of the signal conductor in a shape along the signal conductor so as not to overlap the signal conductor in the thickness direction, and the signal conductor is the dielectric body. A second ground conductor having two long conductors arranged so as to be sandwiched along the width direction of
    The width of the portion corresponding to the central region of the long conductor is narrower than the width of the portion corresponding to the both end regions,
    The high-frequency transmission line according to any one of claims 1 to 10.
  12. 　前記第２グランド導体は、前記信号伝送方向に沿って間隔をおいて前記二本の長尺導体を接続する複数のブリッジ導体を備え、
    　前記中央領域に対応する部分の前記ブリッジ導体の幅は、前記両端領域に対応する部分の前記ブリッジ導体の幅よりも狭い、
    　請求項１１に記載の高周波伝送線路。     The second ground conductor includes a plurality of bridge conductors connecting the two long conductors with an interval along the signal transmission direction,
    The width of the bridge conductor in the portion corresponding to the central region is narrower than the width of the bridge conductor in the portion corresponding to the both end regions,
    The high-frequency transmission line according to claim 11.
  13. 　前記中央領域に対応する部分での前記複数のブリッジ導体の間隔は、前記両端領域に対応する部分での前記複数のブリッジ導体の間隔よりも広い、
    　請求項１２に記載の高周波伝送線路。     The interval between the plurality of bridge conductors in the portion corresponding to the central region is wider than the interval between the plurality of bridge conductors in the portion corresponding to the both end regions,
    The high-frequency transmission line according to claim 12.
  14. 　前記誘電体素体における前記信号導体と前記第１グランド導体に挟まれる前記中央領域の誘電率は、前記信号導体と前記第１グランド導体に挟まれる前記中央領域の誘電率よりも低い、
    　請求項１乃至請求項１３のいずれかに記載の高周波伝送線路。     The dielectric constant of the central region sandwiched between the signal conductor and the first ground conductor in the dielectric body is lower than the dielectric constant of the central region sandwiched between the signal conductor and the first ground conductor.
    The high-frequency transmission line according to any one of claims 1 to 13.
  15. 　請求項１乃至請求項１４のいずれかに記載の高周波伝送線路と、
    　前記高周波伝送線路によって接続され、前記高周波伝送線路によって信号を送受信する第１回路部および第２回路部と、
    　を備えた、電子機器。     The high-frequency transmission line according to any one of claims 1 to 14,
    A first circuit unit and a second circuit unit, which are connected by the high-frequency transmission line and transmit / receive a signal by the high-frequency transmission line;
    With electronic equipment.
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