WO2013168195A1

WO2013168195A1 - Pattern forming method

Info

Publication number: WO2013168195A1
Application number: PCT/JP2012/003033
Authority: WO
Inventors: 隆史藤立; 剛本田; 一哉小谷
Original assignee: 株式会社ニッシン
Priority date: 2012-05-09
Filing date: 2012-05-09
Publication date: 2013-11-14

Abstract

A chamber (1) is configured to be narrower than the width (W₁) of a transfer sheet (S) in a direction (F) orthogonal to the direction of feeding a base material (transfer sheet) (S). In the chamber (1), the transfer sheet (S) is fed in stages for each prescribed distance while an annular O-ring (4) with a round cross-section is interposed between the coated surface of the transfer sheet (S) and the surface of the chamber (1) facing the transfer sheet (S). The transfer sheet (S) is subjected to plasma processing while the inside of the chamber (1) is being depressurized. As a result, since the transfer sheet (S) is inevitably interposed where the O-ring is interposed,, at all the locations where the O-ring is interposed, not only the O-ring (4) but also the transfer sheet (S) itself shuts off the atmosphere. Thereby, a device for pattern forming (chamber 1) may be miniaturized while preventing thermal deformation and heat-induced damage and a fine metal particle sintered pattern can be efficiently formed onto an object to be processed (work).

Description

Pattern formation method

The present invention relates to a pattern forming method for forming a pattern obtained by sintering metal fine particles on an object to be processed.

Conventionally, metal pastes made of fine metal particles such as nano-sized silver and copper have been developed for the purpose of producing printed wiring boards. Specifically, metal fine particles are dissolved in a solvent, and a metal paste in which the fine particles are dispersed by a dispersant is applied to an object to be processed such as a substrate by a printing technique (inkjet or screen printing). Thereafter, the fine particles are sintered by dispersing the dispersant and the solvent by heat treatment.

In the heat treatment, when a glass substrate is used as an object to be processed using silver fine particles, sintering is performed at 220 ° C. for 60 minutes. When a substrate thinner than the glass substrate is used as the object to be processed, the sintering is performed at a low temperature of 120 ° C. to 150 ° C. for 60 minutes in order to prevent thermal deformation and damage due to heat.

However, when PET (polyethylene terephthalate) is used as the object to be treated, the heat resistance temperature of PET is 150 ° C., and the sintering temperature of copper is as high as 250 ° C. Therefore, the object to be coated with the copper ink can be applied only to a polyimide film or the like at present. In the case of silver, since the sintering temperature is low, it can be applied to PET, but there is another problem that it tends to cause migration and is expensive.

Therefore, there is a technique in which a transfer sheet is used as a base material and a pattern sintered on the transfer sheet is transferred to a ceramic substrate (for example, see Patent Document 1). If transferred to an object to be processed having a low heat-resistant temperature such as PET instead of this ceramic substrate, a pattern in which metal fine particles are sintered can be formed on the object to be processed having a low heat-resistant temperature.

On the other hand, conventionally, in order to sinter a workpiece (workpiece) by plasma treatment, the workpiece is usually housed in a vacuum chamber and processed, but the workpiece is fed while being fed in a roll-to-roll manner. In the case of winding the workpiece after processing, there is a technique of storing the rollers together with the rollers such as the feeding means (feeding roller) and the winding means (winding roller) in the vacuum chamber.

Japanese Patent No. 4128885

However, in the case described above, the larger the roller, the larger the vacuum chamber and the more expensive the apparatus. In addition, when the vacuum chamber becomes large, the time until the vacuum is reached becomes very long and becomes inefficient. Furthermore, when a workpiece such as PET having a low heat-resistant temperature is transferred to a long workpiece, if the workpiece is transferred inside the vacuum chamber, the workpiece may be thermally deformed or damaged by heat. There is a problem that the configuration of the apparatus becomes complicated if it is transferred externally.

The present invention has been made in view of such circumstances, and a pattern in which metal fine particles are sintered while miniaturizing an apparatus for pattern formation while preventing thermal deformation and damage due to heat. It is an object of the present invention to provide a pattern forming method that can be efficiently formed on an object to be processed.

As a result of earnest research to solve the above problems, the inventors have obtained the following knowledge.

That is, the above-described vacuum processing includes the case where plasma processing is performed by supplying a gas. Therefore, the target is not a complete high vacuum, but a relatively high processing at a low vacuum of about 100 Pascals. It only has to be achieved. Therefore, the roller can be disposed outside the chamber as long as the atmosphere is blocked by a member that can be sealed to some extent between the outside of the chamber under atmospheric pressure and the inside of the chamber under low vacuum. Then, the substrate (transfer sheet) is processed while being fed into the chamber with a roller outside the chamber, and the transferred air is transferred to the workpiece while being transferred to the outside of the chamber, and the air is cut off by the roller. can do.

As a result of arranging each roller including the transfer roller outside the chamber, the chamber (processing chamber) can be downsized and the time to reach a low vacuum can be shortened, and metal ink is efficiently applied to the transfer sheet. And as a result, the pattern can be efficiently formed on the workpiece. As a member to be sealed, an O-ring having a circular cross section (O shape) and an annular shape is optimal.

However, as shown in the plan view of FIG. 7, when the chamber 101 is configured such that the transfer sheet S is completely accommodated in the chamber 101 in the direction orthogonal to the direction F in which the transfer sheet S is fed, the O-ring 104 is Even in the intervening state, the atmosphere cannot be completely shut off (in FIG. 7, the chamber 101 is shown by a two-dot chain line). This is considered to be caused by the following matters.

That is, in a place where the transfer sheet S is present, the chamber 101, the O-ring 104, the transfer sheet S, and the base (not shown in FIG. 7) are arranged in this order, and the O-ring 104 and the transfer sheet S are interposed between the chamber 101 and the base. As a result, not only the O-ring 104 but also the transfer sheet S itself blocks the atmosphere. However, it is considered that the air flows from the gap where there is no transfer sheet S as a result of only the O-ring 104 being interposed in the place where there is no transfer sheet S.

On the other hand, normally, the workpiece is not processed on the entire processing surface and has some margin. Therefore, in the direction orthogonal to the direction of feeding the transfer sheet, if the transfer sheet corresponding to the processing part is accommodated in the transfer sheet by changing the idea of completely accommodating the transfer sheet as the transfer base in the chamber, The inventors have found that the end of the transfer sheet is accommodated so as to protrude outside the chamber. In other words, if the chamber is configured to be narrower than the width of the transfer sheet in the direction perpendicular to the direction in which the transfer sheet is fed, the transfer sheet is always present at the location where the O-ring is interposed, so that the atmosphere is easily blocked. It came.

The present invention based on such knowledge has the following configuration.
That is, the pattern forming method according to the present invention is a pattern forming method for forming a pattern in which fine metal particles are sintered on an object to be processed, and a substrate feeding process for feeding a substrate in stages at predetermined distances. A fine particle coating process for applying the fine particles to the base material fed in stages, and a plasma treatment for the base material to which the fine particles are fed in stages and coated with the fine particles. In a direction perpendicular to the feeding direction, in a processing chamber configured to be narrower than the width of the base material, the cross section is circular and annular between the base material application surface and the base material side surface of the processing chamber. A plasma processing process in which the base material is fed stepwise for each predetermined distance with an O-ring interposed, and the base material is subjected to plasma processing in a state where the inside of the processing chamber is decompressed, and sintering is performed by the plasma processing. And the fine And a pattern transfer step of transferring the substrate coated with the child stepwise from the processing chamber and transferring the sintered fine particle pattern from the substrate to the object to be processed. .

According to the pattern forming method of the present invention, the base material feeding process feeds the base material step by step for each predetermined distance, and the fine particle coating step coats the base material fed stepwise. The plasma treatment process is performed as follows when plasma treatment is performed on a substrate that is fed in stages and coated with fine particles. In a direction perpendicular to the direction in which the base material is fed, the cross section is circular between the coating surface of the base material and the base material side surface of the processing chamber in the processing chamber configured to be narrower than the width of the base material. With the annular O-ring interposed, the base material is fed stepwise for each predetermined distance, and the base material is subjected to plasma processing while the inside of the processing chamber is decompressed. As a result, since the base material is always present at locations where the O-ring is interposed, not only the O-ring but also the base material itself blocks the atmosphere at all locations where the O-ring is interposed. Plasma treatment under reduced pressure can be achieved with a low vacuum of about 100 Pascals.

Then, a substrate obtained by sintering the coated fine particles by plasma treatment is sent out step by step from the processing chamber, and the pattern transfer process transfers the pattern of the sintered fine particles from the substrate to the object to be processed. A pattern in which the fine particles are sintered is formed on the workpiece. Therefore, a feeding means for feeding the substrate, a transfer means for transferring the pattern to the object to be processed, and a winding means for winding the object to be processed or the substrate can be arranged outside the processing chamber. The device to be performed) can be reduced in size. By disposing the transfer unit outside the processing chamber and performing the transfer outside the processing chamber, it is possible to prevent thermal deformation and damage to the object to be processed due to heat. In addition, as a result of downsizing the processing chamber, the time required to reach a low vacuum can be shortened, and the fine particles can be efficiently applied to the substrate and sintered. As a result, the fine metal particles are sintered. The tied pattern can be efficiently formed on the workpiece.

In the present invention described above, the substrate having the substrate after the transfer is sent back to the feeding side step by step at a predetermined distance, and the substrate having been cleaned is provided with a cleaning step of cleaning the returned substrate. In the substrate feeding process, the substrate is preferably fed again, and the fine particle coating process, the plasma processing process, the pattern transfer process, the substrate feeding back process, the cleaning process, and the substrate feeding process are repeated. In this way, the substrate cleaned after the transfer can be reused and reused.

In these present inventions described above, the first drying process is performed between the fine particle coating process and the plasma processing process. The first drying process is performed stepwise to dry the substrate coated with the fine particles. In the process, it is preferable to perform a plasma treatment on a substrate which is fed stepwise and the fine particles are dried and applied.

In the present invention described above, an adhesive coating process is performed between the plasma processing process and the pattern transfer process, in which an adhesive is applied to a substrate on which fine particles are applied by sintering by plasma processing, and the pattern transfer process. May transfer a pattern of fine particles coated with an adhesive and sintered from the base material to the object to be processed by the adhesive. In addition, an adhesive application process is applied between the plasma treatment process and the pattern transfer process to apply an adhesive to the object to be processed. In the pattern transfer process, the sintered fine particle pattern is applied from the substrate to the adhesive. You may transfer to the to-be-processed object with the said adhesive agent. In any case, the adhesiveness between the object to be processed and the pattern can be improved by the adhesive.

In the present invention described above, it is preferable to include a second drying process for performing a drying process on the object to be processed after the transfer. In particular, when the adhesive is interposed between the object to be processed and the pattern and the object to be processed is wound, the pattern is transferred to the adjacent object to be processed by winding by the adhesive drying process. Can be prevented.

In the present invention described above, a heat treatment process for performing heat treatment on the substrate on which the fine particles are applied may be provided, and the plasma treatment may be performed after the heat treatment process. In this way, by combining a heat treatment different from the plasma treatment with the plasma treatment, the substrate can be uniformly heated, the uniformity of the treatment is improved, and the heating time and the plasma irradiation time are shortened. The temperature difference between the front and back surfaces is reduced. As a result, it is possible to efficiently sinter the fine particles at a low temperature while reducing the heating time to a low temperature and preventing thermal deformation and damage due to heat. Further, by performing the heating in advance of the plasma treatment, the temperature fluctuation range is reduced, and the reproducibility of the treatment can be improved.

According to the pattern forming method of the present invention, in the direction perpendicular to the direction in which the substrate is fed, the treatment chamber configured to be narrower than the width of the substrate, the substrate coating surface and the substrate side of the treatment chamber The substrate is stepwise fed at predetermined distances with a circular cross-section between the surface and an annular O-ring interposed, and the substrate is subjected to plasma treatment in a state where the inside of the processing chamber is decompressed. Do. As a result, since the base material is always present at locations where the O-ring is interposed, not only the O-ring but also the base material itself blocks the atmosphere at all locations where the O-ring is interposed. Therefore, it is possible to reduce the size of an apparatus for forming a pattern while preventing thermal deformation and damage due to heat, and efficiently form a pattern in which metal fine particles are sintered on an object to be processed.

It is the schematic of the plasma processing apparatus which concerns on an Example. 1 is a schematic view of a pattern forming apparatus including a plasma processing apparatus and peripheral devices according to an embodiment. It is a flowchart which shows a series of flows of the pattern formation method for every pattern which concerns on an Example. (A) And (b) is a schematic sectional drawing of the plasma processing apparatus of the embodiment different from FIG. It is the schematic of the pattern formation apparatus provided with the plasma processing apparatus and its peripheral device which concern on a modification. It is a schematic sectional drawing of the plasma processing apparatus which concerns on a modification. It is a schematic plan view of the plasma processing apparatus when the chamber is configured such that the lateral width direction of the transfer sheet that has reached the knowledge of the present invention is completely accommodated in the chamber.

Embodiments of the present invention will be described below with reference to the drawings. 1A is a schematic perspective view of a plasma processing apparatus according to an embodiment, FIG. 1B is a schematic plan view, FIG. 1C is a schematic cross-sectional view, and FIG. FIG. 3 is a schematic diagram of a plasma processing apparatus according to an embodiment and a pattern forming apparatus including peripheral devices thereof, and FIG. 3 is a flowchart showing a series of flow of a pattern forming method for each pattern according to the embodiment, 4A and 4B are schematic cross-sectional views of a plasma processing apparatus according to an embodiment different from that shown in FIG. In FIG. 1B, in order to clearly illustrate the arrangement of the O-ring, the chamber is illustrated by a two-dot chain line, and the base is not illustrated. In the present embodiment, the description will be made with the coated surface coated with metal fine particles as the upper surface and the surface opposite to the coated surface as the lower surface.

In this embodiment, the plasma processing apparatus includes a chamber 1 and a base 2 as shown in FIGS. 1 (a) and 1 (c). As shown in FIG. 1C, a vacuum pump 3 is provided to reduce the pressure inside the chamber 1 to make it vacuum. In a state where the inside of the chamber 1 is decompressed by the vacuum pump 3, a long (belt-shaped in this embodiment) base material (transfer sheet) S is placed in a direction F shown in FIGS. 1 (a) to 1 (c). Process while feeding in steps (stepwise) every predetermined distance by roll-to-roll. The base 2 faces the surface opposite to the application surface of the transfer sheet S (to which metal fine particles are applied), and supports the transfer sheet S. The chamber 1 corresponds to the processing chamber in the present invention, and the transfer sheet S corresponds to the base material in the present invention.

For example, the chamber 1 in FIG. 1C repeats sealing and opening while raising and lowering up and down, the transfer sheet S is fed when the chamber 1 is raised, the chamber is lowered after the transfer sheet S is stopped, Sealed and evacuated (depressurized), and treated with plasma or the like. Further, by feeding the transfer sheet S in the direction F shown in FIGS. 1A to 1C, the pattern P _{1 in} FIG. 1B is processed, the pattern P ₂ is being processed, and the pattern P ₁ is processed. ₃ is unprocessed. Further, the predetermined distance to be fed is appropriately determined according to the processing area.

The transfer sheet S is a thin film having a thickness of about 50 μm to 300 μm or a metal foil having a thickness of about 200 μm for feeding by roll-to-roll. Although it will not specifically limit if it has the heat-resistant temperature higher than sintering temperature, For example, it is a polyimide film etc. as a thin film, For example, it is SUS (stainless steel) as a metal foil. As will be described later, in this embodiment, the transfer sheet S that has been washed after transfer is reused and repeatedly used, so that the transfer sheet S has a belt shape. Therefore, when SUS (stainless steel) is used as the transfer sheet S, the transfer sheet S is a SUS belt, and when the polyimide film is used as the transfer sheet S, the transfer sheet S is a polyimide film belt. If the step feeding process is not continuous processing, the transfer sheet S can be sandwiched between the chamber 1 and the base 2 as shown in FIG. The vacuum is not limited to about 100 Pascal but may be a high vacuum of less than 100 Pascal.

In addition, as shown in FIGS. 1B and 1C, the plasma processing apparatus includes a circular O-ring 4 having a circular cross section (O shape). The material of the O-ring 4 is not particularly limited, and is, for example, rubber, metal, fluorine resin, or the like. When the material is metal, a metal hollow O-ring having a hollow O-shaped cross section is used. The O-ring 4 corresponds to the O-ring in the present invention.

Further, as shown in FIGS. 1 (a) and 1 (b), in the direction orthogonal to the direction F in which the transfer sheet S is fed (see FIGS. 1 (a) to 1 (c)), as shown in FIGS. the width is _{w 1,} when the width of the chamber 1 and _{w _2,} the w 1> _{w 2.} That is, the chamber 1 is configured to be narrower than the width w ₁ of the transfer sheet S in a direction orthogonal to the direction F in which the transfer sheet S is fed (see FIGS. 1A to 1C). The width _{w 1} of the transfer sheet S, is not particularly limited, for example, width of about 500 mm. The width w ₂ of the chamber 1 is not particularly limited as long as w ₁ > w ₂ is satisfied, but can be designed to be as narrow as about 100 mm.

The length of the transfer sheet S in the feeding direction F is not particularly limited. Further, the length of the chamber 1 is not particularly limited, and is appropriately determined according to the processing area. Further, the width and length of the base 2 are not particularly limited, but in order to sandwich and transfer the transfer sheet S between the chamber 1 and the base 2, the same width or length as the chamber 1 or What is necessary is just to design with the above width and length. Therefore, the width of the base 2, if the chamber 1 and as wide or more, may be narrower than the width w ₁ of the transfer sheet S, even wider than the width w ₁ of the transfer sheet S It may be the same as the width w ₁ of the transfer sheet S.

As shown in FIG. 1C, an annular groove 1a is provided on the bottom surface of the wall of the chamber 1, and an O-ring 4 is fitted along the groove 1a. Therefore, the O-ring 4 can be interposed between the application surface of the transfer sheet S coated with metal (for example, copper) fine particles and the surface of the chamber 1 on the transfer sheet S side. Thus, the space inside than the inner wall of the chamber 1, the process where possible (see pattern P ₂ in FIG. 1 (b)) becomes, if accommodated in the chamber 1 even transfer area corresponding to the processing locations, transfer The transfer sheet S is accommodated so that the end of the transfer sheet S protrudes out of the chamber 1 in a direction orthogonal to the direction F in which the sheet S is fed (see FIGS. 1A to 1C).

Also, there is a possibility that air enters the surface opposite to the coated surface of the transfer sheet S. Therefore, as shown in FIG. 1C, it is preferable to provide a vacuum pump 5 as a decompression means on the opposite surface. By providing the vacuum pump 5, the decompression process can be performed more reliably.

In order to perform plasma processing in the chamber 1, a supply channel 11 for supplying a gas for plasma (indicated as “Gas” in FIG. 1C), and a power for plasma (in FIG. 1C) And an electrode 12 to which “Power” is applied). Although FIG. 1 (c) shows a single supply channel 11, two or more supply channels 11 may be provided. The gas for plasma is hydrogen, oxygen, or nitrogen, but any gas that is normally used in plasma as exemplified by rare gases such as argon (Ar) and helium (He) can be used. Is not particularly limited. The gas pressure is, for example, about 20 Pascals, but is not limited thereto, and may be changed as appropriate according to the application. Also, the power for plasma (plasma source) is not particularly limited.

Furthermore, an electric heater 13 is provided in the base 2 for performing heat treatment. In FIG. 1, the electric heater 13 is provided in the base 2, but the electric heater 13 is not necessarily provided in the base 2. As shown in FIG. When the upper surface of the sheet supports the transfer sheet S, an electric heater 13 may be provided in the vicinity of the transfer sheet S. Further, the electric heater 13 is not necessarily required, and may be a heating means usually used for heat treatment as exemplified by a silicon carbide microwave heater made of silicon carbide (SiC) or a lamp heater. For example, the heating means provided in the chamber 1 is not particularly limited. Moreover, about the temperature of heat processing, it is about 100 degreeC, for example, However, It is not limited to this, You may change suitably according to a use.

Also, it is not always necessary to perform the heat treatment at high vacuum or low vacuum. The heat treatment is performed under atmospheric pressure, and the pressure is reduced only during the plasma treatment and may be performed in a high vacuum or a low vacuum. Heating under atmospheric pressure also has the effect of distributing heat uniformly under atmospheric pressure. Of course, evacuation (reduced pressure) and heat treatment may be performed in parallel. Thus, in this embodiment, the heat treatment and the plasma treatment are performed in the same chamber 1.

In addition to the plasma processing apparatus, the pattern forming apparatus includes a sheet feeding roller 21, a printing inkjet 22, a first drying processing unit 23, and an adhesive inkjet 24 in the periphery of the plasma processing apparatus as shown in FIG. A return roller 25, a cleaner 26, a work feed roller 27, a transfer roller 28, a second drying processing unit 29, and a take-up roller 30. 2, illustration of the vacuum pump 5 (refer FIG.1 (c)) is abbreviate | omitted for convenience of drawing.

The sheet feeding roller 21 feeds the transfer sheet S step by step in a roll-to-roll manner every predetermined distance. The printing ink jet 22 applies fine particles of metal (for example, copper) to the transfer sheet S fed in stages. Specifically, a metal paste in which metal fine particles are dissolved in a solvent and fine particles are dispersed by a dispersant is jetted onto the transfer sheet S by the ink jet 22 for printing toward the application surface of the transfer sheet S. Apply. In addition, it does not necessarily need to be an inkjet, and the application means is not particularly limited as long as it is a printing technique normally used, as exemplified by screen printing.

The first drying processing unit 23 is provided between the printing inkjet 22 and the plasma processing apparatus (chamber 1), and performs a drying process on the transfer sheet S that is fed stepwise and coated with fine particles. . The 1st drying process part 23 is comprised, for example by the heater or the warm air machine which sends in warm air. Of course, the structure of the first drying processing unit 23 is not particularly limited as long as it is a commonly used drying means.

The adhesive ink-jet 24 is provided between the plasma processing apparatus (chamber 1) and the return roller 25 and the transfer roller 28. The transfer sheet S is sintered by the plasma processing in the chamber 1 and coated with fine particles. Apply adhesive to Specifically, the adhesive inkjet 24 applies the adhesive to the transfer sheet S by spraying the adhesive onto the pattern composed of fine particles after the transfer sheet S is sintered. The application of the adhesive is not limited to inkjet. Further, the specific adhesive is not particularly limited.

The return roller 25 returns the transfer sheet S after the transfer by the transfer roller 28 to the sheet feed roller 21 every predetermined distance. The cleaner 26 is provided between the sheet feeding roller 21 and the feeding roller 25 and cleans the transferred transfer sheet S. The cleaner 26 is composed of a wire brush, for example, and mechanically scrubs the transfer surface (pattern stain) of the transfer sheet S. Of course, the structure of the cleaner 26 is not particularly limited as long as it is a commonly used cleaning means, as exemplified by wet cleaning with a cleaning liquid, ashing, dry cleaning with plasma, and the like. Further, scrub cleaning, wet cleaning, and dry cleaning may be appropriately combined.

The work feeding roller 27 feeds a long workpiece (work) W to the transfer roller 28 in a roll-to-roll manner. The transfer roller 28 is in contact with the return roller 25, and the transfer roller 28 transfers the sintered fine particle pattern from the transfer sheet S to the workpiece W by rotating the rollers 25, 28 in the direction of the arrow in the figure. Transcript. The workpiece W corresponds to an object to be processed in the present invention.

The workpiece W is a thin film with a thickness of about 50 μm to 300 μm or a metal foil with a thickness of about 200 μm, like the transfer sheet S, in order to feed the work W by roll. Although the heat resistance temperature of the workpiece W is not particularly limited, in view of the purpose of forming a pattern on the workpiece W while preventing thermal deformation and damage due to heat by transferring to the workpiece W, the heat resistance temperature is lower than the sintering temperature. This is particularly useful in the case of a workpiece W having a temperature. For example, when a pattern obtained by sintering copper fine particles is formed on a thin film, the thin film is, for example, PET (polyethylene terephthalate). As described above, the sintering temperature of copper is as high as 250 ° C., and the heat resistant temperature of PET is as low as 150 ° C. Even if the heat resistant temperature is low as in PET, the heat is transferred to the workpiece W made of PET. The pattern can be formed on the workpiece W while preventing damage due to deformation and heat.

The second drying processing unit 29 is provided between the transfer roller 28 and the take-up roller 30 and performs a drying process on the workpiece W after being transferred by the transfer roller 28. Similar to the first drying processing unit 23, the second drying processing unit 29 is configured by, for example, a heater or a warm air blower for sending warm air. Of course, the structure of the second drying processing unit 29 is not particularly limited as long as it is a drying means that is normally used. The winding roller 30 winds up the work W after the drying process in the second drying processing unit 29 in a roll-to-roll manner.

Next, the pattern forming method according to the present embodiment will be described with reference to FIG. In FIG. 3, it is assumed that the patterns P ₁ , P ₂ , P ₃ , P ₄ ,. In FIG. 3, the processing time of each step is the same except for feeding, transferring, and winding, and the number of times of feeding is one. In the chamber, heat treatment / plasma is performed every two patterns. It demonstrates as what performs a process simultaneously. Steps S1xx (except x = 01, 02, 03, ...) in FIG. 3, the process relates to pattern _{P 1,} step S2xx (although xx = 01, 02, 03, ...), the process relates to the pattern _{P 2,} step S3xx (except x = 01, 02, 03, ...), the process relates to a pattern _{P 3,} step S4xx (except x = 01, 02, 03, ...), the process relates to the pattern _{P 4,} ... step Snxx (except x = (01, 02, 03,...) Are processes related to the pattern P _n .

(Step S101) Transfer Sheet Feed The sheet feed roller 21 feeds the transfer sheet S once at a predetermined distance. By this feeding, the pattern P ₁ is positioned up to the printing inkjet 22. This step S101 corresponds to the substrate feeding process in the present invention.

(Step S102) pattern _{P 1} of microparticles coated fed the transfer sheet S, the printing jet 22 for applying fine particles of metal. This step S102 corresponds to the fine particle coating process in the present invention.

(Step S103) Transfer sheet feeding / (Step S201) Transfer sheet feeding When step S102 is completed, the sheet feeding roller 21 feeds the transfer sheet S once at a predetermined distance. This feed pattern _{P 1} is located to the first drying unit 23 (step S103), the pattern _{P 2} is located to the printing jet 22 (step S201). Steps S103 and S201 correspond to the substrate feeding process in the present invention.

(Step S104) with respect to the pattern _{P 1} of the first drying process, (step S202) fine particle coating the fed to the transfer sheet S which fine particles are coated, the first drying unit 23 for drying process (step S104). Concurrently with step S104, the pattern _{P 2} of the transfer sheet S fed, printing ink jet 22 for applying fine particles of a metal (step S202). This step S104 corresponds to the first drying process in the present invention, and this step S202 corresponds to the fine particle coating process in the present invention.

(Step S105) Transfer sheet feeding / (Step S203) Transfer sheet feeding / (Step S301) Transfer sheet feeding When these steps S104 and S202 are completed, the sheet feeding roller 21 feeds the transfer sheet S once at a predetermined distance. By this feeding, the pattern P ₁ is positioned up to the plasma processing apparatus (chamber 1) (step S105), the pattern P ₂ is positioned up to the first drying processing unit 23 (step S203), and the pattern P ₃ is And the ink jet 22 for printing (step S301). Steps S105, S203, and S301 correspond to the substrate feeding process in the present invention.

(Step S106) Standby / (Step S204) First drying process / (Step S302) Particulate application As described above, in the chamber 1, the heating process and the plasma process are performed simultaneously for each of the two patterns. chamber 1 with respect to the pattern P ₁ of dried coated transfer sheet S waits without heat treatment, plasma treatment (step S106). On the other hand, the fed and the pattern P ₂ of the transfer sheet S particles has been applied, the first drying unit 23 for drying process (step S204). Concurrently with step S204, the pattern _{P 3} of the transfer sheet S fed, printing ink jet 22 for applying fine particles of a metal (step S302). This step S204 corresponds to the first drying process in the present invention, and this step S302 corresponds to the fine particle coating process in the present invention.

(Step S107) Transfer sheet feeding / (Step S205) Transfer sheet feeding / (Step S303) Transfer sheet feeding / (Step S401) Transfer sheet feeding When these steps S106, S204, and S302 are completed, the sheet feeding roller 21 is transferred. The sheet S is fed once at a predetermined distance. By this feeding, the pattern P ₁ is positioned up to the back side of the chamber 1 (step S107), the pattern P ₂ is positioned up to the chamber 1 (step S205), and the pattern P ₃ is the first drying processing unit 23. located to the (step S303), the pattern _{P 4} is located to the printing jet 22 (step S401). That accommodates the pattern _P 1, _{P 2} into the chamber 1, respectively carried out at the same time heat treatment, plasma treatment for the pattern _P 1, _{P 2} in the next step. Steps S107, S205, S303, and S401 correspond to the substrate feeding process in the present invention.

(Step S108) Heat treatment / Plasma treatment / (Step S206) Heat treatment / Plasma treatment / (Step S304) First drying process / (Step S402) Particulate application The chamber 1 performs heat treatment and plasma treatment on the patterns P ₁ and P ₂ (steps S108 and S206). By electric heater 13 heats the pattern _P 1, _{P 2} of the transfer sheet S, the heat treatment is performed for the pattern _{_P} 1, _P _2. Next, gas is supplied into the chamber 1 through the supply channel 11 until a predetermined pressure (for example, about 20 Pascals) is reached. Then, a power of about 2 KW is applied to the electrode 12 to generate plasma in the chamber 1 by plasma discharge. Then, plasma processing is performed on the patterns P ₁ and P ₂ . In this way, the plasma treatment is performed on the patterns P ₁ and P ₂ after the heat treatment.

On the other hand, the fed and the pattern P ₃ of the transfer sheet S particles has been applied, the first drying unit 23 for drying process (step S304). Concurrently with step S304, the pattern _{P 4} of the transfer sheet S fed, printing ink jet 22 for applying fine particles of a metal (step S402). The steps S108 and S206 correspond to the heat treatment process and the plasma treatment process in the present invention, the step S304 corresponds to the first drying process in the present invention, and the step S402 corresponds to the fine particle coating process in the present invention. Equivalent to.

In the following step, the pattern P ₅ and later are not explained further, and describes only the patterns P _{1 ~} P _4.

(Step S109) Transfer sheet feeding, (Step S207) Transfer sheet feeding, (Step S305) Transfer sheet feeding, (Step S403) Transfer sheet feeding When these steps S108, S206, S304, and S402 are completed, the sheet feeding roller 21 is Then, the transfer sheet S is fed once at a predetermined distance. This feed pattern _{P 1} is located to the outside of the chamber 1 (step S109), the pattern _{P 2} is located to the rear side of the chamber 1 (step S207), the pattern _{P 3} until the chamber 1 Situated (step S305), the pattern _{P 4} is located to the first drying unit 23 (step S403). Steps S109, S207, S305, and S403 correspond to the substrate feeding process in the present invention.

(Step S110) waits · (step S208) waits · (step S306) waits · (step S404) outside the first drying treatment plasma treatment by sintering to the transfer sheet S of the pattern _{P 1} in which fine particles are coated from the chamber 1 the delivery, waits without performing any processing for the pattern _{P 1} (step S110). On the other hand, feeding and sintered by a plasma treatment transfer sheet S pattern P ₂ which fine particles are coated to the back side of the chamber 1, similarly waits without performing any processing on the pattern P ₁ in (step S208).

Further, the chamber 1 with respect to the pattern P ₃ of the fed to the transfer sheet S which fine particles are coated and dried waits without heat treatment, plasma treatment (step S306). On the other hand, the fed and the pattern P ₄ of the transfer sheet S particles has been applied, the first drying unit 23 for drying process (step S404). This step S404 corresponds to the first drying process in the present invention.

(Step S111) Transfer sheet feeding, (Step S209) Transfer sheet feeding, (Step S307) Transfer sheet feeding, (Step S405) Transfer sheet feeding When these steps S110, S208, S306, and S404 are completed, the sheet feeding roller 21 is Then, the transfer sheet S is fed once at a predetermined distance. By this feeding, the pattern P ₁ is positioned up to the adhesive inkjet 24 (step S111), the pattern P ₂ is positioned up to the outside of the chamber 1 (step S209), and the pattern P ₃ is positioned at the back of the chamber 1. located to the side (step S307), the pattern _{P 4} is located to the chamber 1 (step S405). That accommodates a pattern _P 3, _{P 4} into the chamber 1, respectively carried out at the same time heat treatment, plasma treatment for the pattern _P 3, _{P 4} in the next step. Steps S111, S209, S307, and S405 correspond to the substrate feeding process in the present invention.

(Step S112) adhesive coating and (step S210) waits · (step S308) heat treatment, a plasma treatment, (step S406) heat treatment and plasma treatment Plasma treatment by sintering to transfer particles of the pattern _{P 1} coated The adhesive inkjet 24 applies an adhesive to the sheet S (step S112). On the other hand, the transfer sheet S of the pattern P ₂ , which is sintered by the plasma treatment and coated with the fine particles, is sent out from the chamber 1 and waits without performing any processing on the pattern P ₂ (step S 210). Incidentally, in the pattern P _1, waiting for the adhesive without coating in the previous step S110, the an adhesive is applied in step S112 in the immediately preceding step S114, adhesive dry pattern transfer of step S114 This is because the transfer is performed before the end. Of course, if the adhesive does not dry or it takes time to apply the adhesive, the adhesive may be applied in the step S110.

On the other hand, the chamber 1 performs a heat treatment and a plasma treatment on the patterns P ₃ and P _{4 of} the transfer sheet S that are fed and dried by applying fine particles (steps S308 and S406). By electric heater 13 heats the pattern _P 3, _{P 4} of the transfer sheet S, the heat treatment is performed for the pattern _{_P} 3, _P _4. Next, gas is supplied into the chamber 1 through the supply channel 11 until a predetermined pressure (for example, about 20 Pascals) is reached. Then, a power of about 2 KW is applied to the electrode 12 to generate plasma in the chamber 1 by plasma discharge. Then, plasma processing is performed on the patterns P ₃ and P ₄ . In this way, the plasma treatment is performed on the patterns P ₃ and P ₄ after the heat treatment. This step S112 corresponds to the adhesive coating process in the present invention, and the steps S308 and S406 correspond to the heat treatment process and the plasma processing process in the present invention.

(Step S113) Transfer sheet feeding (Step S211) Transfer sheet feeding (Step S309) Transfer sheet feeding (Step S407) Transfer sheet feeding When these steps S112, S210, S308, and S406 are completed, the sheet feeding roller 21 is Then, the transfer sheet S is fed once at a predetermined distance. This feed pattern _{P 1} is located to the send back roller 25 and transfer roller 28 (step S113), the pattern _{P 2} is located to the adhesive for an ink jet 24 (step S211), the pattern _{P 3} is a chamber located to the outside of one (step S309), the pattern _{P 4} is located to the rear side of the chamber 1 (step S407). In the pattern P ₁ , in order to transfer the sintered fine particle pattern from the transfer sheet S to the workpiece W at the stage of feeding to the return roller 25 and the transfer roller 28 in step S 113, the workpiece feeding roller 27 transfers the workpiece W to the workpiece W. Send it in. Steps S113, S211, S309, and S407 correspond to the substrate feeding process in the present invention.

(Step S114) Pattern transfer / (Step S212) Adhesive application / (Step S310) Standby / (Step S408) Standby By rotating the rollers 25 and 28 in the directions of the arrows in FIG. the pattern _{P 1} of the sintered particles from the transfer sheet S is transferred to the workpiece W (step S114). On the other hand, sintered by a plasma treatment on the transfer sheet S pattern P ₂ which fine particles are coated, adhesive jet 24 for applying an adhesive (step S212). Although mentioned in the pattern _{P 1,} the pattern _{P 2,} waiting to adhesive without applying in the previous step S210, was coated with adhesive in step S212 immediately before the step S214, the pattern of step 214 This is because the transfer is performed before the adhesive is dried. Of course, if the adhesive does not dry or it takes time to apply the adhesive, the adhesive may be applied in the step S210.

Also, sintered by a plasma treatment feeds the transfer sheet S pattern P ₃ which fine particles are coated from the chamber 1 to the outside, and waits without performing any processing for the pattern P ₃ (step S310). On the other hand, feed the transfer sheet S pattern P ₄ which fine particles are coated with sintered by a plasma treatment to the back side of the chamber 1, similarly waits without performing any processing on the pattern P ₃ in (step S408). This step S114 corresponds to the pattern transfer process in the present invention, and this step S212 corresponds to the adhesive application process in the present invention.

(Step S115) Transfer sheet feeding, (Step S213) Transfer sheet feeding, (Step S311) Transfer sheet feeding, (Step S409) Transfer sheet feeding When these steps S114, S212, S310, and S408 are completed, the sheet feeding roller 21 is Then, the transfer sheet S is fed once at a predetermined distance. The transfer sheet S on which the pattern P ₁ is transferred to the workpiece W by this feeding is sent back to the feeding side and positioned before the cleaner 26, and at the same time, the pattern P ₁ transferred to the workpiece W (pattern P ₁ workpiece W) after the transfer of, and position to the second drying unit 29 (step S115), the pattern _{P 2} is located to the send back roller 25 and transfer roller 28 (step S213), the pattern _{P 3} is located to the adhesive for an ink jet 24 (step S311), the pattern _{P 4} is located to the outside of the chamber 1 (step S409). Steps S115, S213, S311, and S409 correspond to the substrate feeding process in the present invention.

Against (step S116) second drying process, (step S214) pattern transfer, (step S312) adhesive coating and (step S410) the work W after the transfer of the stand-pattern _{P 1,} the second drying unit 29 Drying Processing is performed (step S116). On the other hand, by rotating the rollers 25 and 28 in the direction of the arrow in FIG. 2, the transfer roller 28 transfers the workpiece W to the pattern P ₂ of the sintered particles from the transfer sheet S (step S214).

Also, sintered by a plasma treatment on the transfer sheet S pattern P ₃ which fine particles are coated, adhesive jet 24 for applying an adhesive (step 312). On the other hand, sintered by a plasma treatment feeds the transfer sheet S pattern P ₄ which fine particles are coated from the chamber 1 to the outside, and waits without performing any processing for the pattern P ₄ (step S410). This step S116 corresponds to the second drying process in the present invention, this step S214 corresponds to the pattern transfer process in the present invention, and this step S312 corresponds to the adhesive application process in the present invention.

In the following steps, since the same process as the pattern P _1, it will not be described pattern P ₂ or later. The pattern _{P 1} only, illustrating the steps S117 ~ S118.

(Step S117) Transfer Sheet Feed When these steps S116, S214, S312 and S410 are completed, the sheet feed roller 21 feeds the transfer sheet S once at a predetermined distance. This infeed, the transfer sheet S pattern P ₁ is transferred to the workpiece W, at the same time as the position to the cleaner 26 is sent back to further infeed side, the workpiece W after the drying process of the pattern P ₁ is wound Located on the take-off roller 30. This step S117 corresponds to the substrate feeding process in the present invention.

(Step S118) Cleaner 26 transfer sheet S cleaning and winding back pattern P ₁ is at the same time as the cleaning, the take-up roller 30, winds the workpiece W on which the pattern P ₁ is formed, the pattern P _A series of processing for ₁ is finished. This step S118 corresponds to the cleaning process in the present invention.

In the flowchart of FIG. 3, it has been described that the processing time of each step is the same except for feeding, transferring, and winding, but the processing time is not limited to this when the processing time is different. For example, in synchronization with the start of processing, the short processing time step may be ended first, and the long processing time step may be ended later. Conversely, the long processing time step is started first, and then Alternatively, a step with a short processing time may be started so that the end of each step coincides. In particular, as described above, in order to perform the transfer before the adhesive is dried by pattern transfer, it is only necessary to apply the adhesive immediately before the pattern transfer, and it is not always necessary to synchronize with the processing in other steps.

In the flowchart of FIG. 3, the number of times of feeding is one time, but it may be a plurality of times and is not particularly limited. In the flowchart of FIG. 3, the heat treatment and the plasma treatment are performed simultaneously for each of the two patterns in the chamber. However, the heat treatment and the plasma treatment may be performed for each pattern, or three or more patterns may be performed. Heat treatment and plasma treatment may be performed simultaneously for each time.

According to the pattern forming method according to the present embodiment, the base material (transfer sheet) S is fed stepwise for each predetermined distance, and the fine particles are applied to the transfer sheet S fed stepwise. When the plasma processing is performed on the transfer sheet S which is fed stepwise and coated with fine particles, the following processing is performed. In a direction perpendicular to the direction F of feeding the transfer sheet S, on the transfer sheet narrowly constructed chamber 1 than the width w ₁ of the S, between the coating surface and the transfer sheet S side surface of the chamber 1 of the transfer sheet S The transfer sheet S is fed stepwise at a predetermined distance with a circular O-ring 4 having a circular cross section between them, and the transfer sheet S is subjected to plasma treatment in a state where the inside of the chamber 1 is decompressed. Do. As a result, since the transfer sheet S is always present at the location where the O-ring 4 is interposed, not only the O-ring 4 but also the transfer sheet S itself blocks the atmosphere at all locations where the O-ring 4 is interposed. Plasma treatment under reduced pressure can be achieved with a low vacuum of about 100 Pascals.

Then, the transfer sheet S obtained by sintering the applied fine particles by plasma treatment is sent out step by step from the chamber 1, and the pattern of the sintered fine particles is transferred from the transfer sheet S to the workpiece (workpiece) W. A pattern in which the fine particles are sintered is formed on the workpiece W. Accordingly, rollers such as a feeding means (sheet feeding roller 21) for feeding the transfer sheet S, a transferring means (transfer roller 28) for transferring the pattern to the workpiece W, and a winding means (winding roller) for winding the transfer sheet S are provided. It can be disposed outside the chamber 1 and the chamber 1 (apparatus for pattern formation) can be downsized. By disposing the transfer means (transfer roller 28) outside the chamber 1 and performing the transfer outside the chamber 1, it is possible to prevent the workpiece W from being thermally deformed or damaged by heat. In addition, as a result of downsizing the chamber 1, the time to reach a low vacuum can be shortened, and the fine particles can be efficiently applied to the transfer sheet S and sintered. The sintered pattern can be efficiently formed on the workpiece W.

In this embodiment, the transferred transfer sheet S is sent back to the feeding side step by step at predetermined distances, the transferred transfer sheet S is washed, and the transferred transfer sheet S is again used by using the washed transfer sheet S. It is preferable to perform the feeding and each step repeatedly. In this way, the transfer sheet S washed after transfer can be reused by being reused.

In the present embodiment, a first drying process step is performed between the fine particle application step and the plasma treatment step. The first drying process step is performed to dry the transfer sheet S that is fed stepwise and coated with the fine particles. In the processing step, it is preferable to perform plasma processing on the transfer sheet S which is fed stepwise and the fine particles are dried and applied.

In this embodiment, an adhesive is applied between the plasma processing step and the pattern transfer step to the transfer sheet S that is sintered by the plasma processing and coated with the fine particles. The fine particle pattern applied and sintered is transferred from the transfer sheet S to the workpiece W by the adhesive. In this case, the adhesiveness between the workpiece W and the pattern can be improved by the adhesive.

In this embodiment, it is preferable to perform a (second) drying process on the workpiece W after transfer. In particular, when the adhesive is interposed between the workpiece W and the pattern and the workpiece W is wound up, the pattern is transferred to the adjacent workpiece W by winding up by preventing the adhesive from being dried. Can do.

In this embodiment, the transfer sheet S coated with fine particles is subjected to heat treatment, and plasma treatment is performed after the heat treatment step. In this way, by combining a heat treatment different from the plasma treatment with the plasma treatment, uniform heating can be achieved, the uniformity of the treatment can be improved, and the heating time and the plasma irradiation time can be shortened. There is little damage, and the temperature difference between the front and back surfaces is reduced. As a result, it is possible to efficiently sinter the fine particles at a low temperature while reducing the heating time to a low temperature and preventing thermal deformation and damage due to heat. Further, by performing the heating in advance of the plasma treatment, the temperature fluctuation range is reduced, and the reproducibility of the treatment can be improved.

1 and 2, the support means for supporting the transfer sheet S is the base 2, but as shown in FIG. 4A, the upper surface of the wall of the chamber 1 on the lower side supports the transfer sheet S. It may be configured. That is, an annular groove 1b is provided on the upper surface of the wall of the chamber 1 on the lower side, and an O-ring 4 is further fitted along the groove 1b. Therefore, an O-ring 4 is interposed between the transfer sheet S application surface and the transfer sheet S side surface of the chamber 1, so that the surface opposite to the transfer sheet S application surface and the transfer sheet S side of the chamber 1. Further, an O-ring 4 can be interposed between them.

In addition, instead of the lower chamber 1 shown in FIG. 4A, an O-ring 4 can be further interposed in the base 2 shown in FIGS. 1A and 1C. That is, an annular groove (not shown) is provided on the upper surface of the base 2, and the O-ring 4 is fitted along the groove, so that the transfer surface of the transfer sheet S and the surface of the chamber 1 on the transfer sheet S side are formed. An O-ring 4 may be interposed therebetween, and an O-ring 4 may be further interposed between the surface opposite to the coating surface of the transfer sheet S and the surface of the base 2 on the transfer sheet S side. it can.

As described above, the O-ring 4 is further interposed between the surface opposite to the coating surface of the transfer sheet S and the surface on the transfer sheet S side of the support means (the lower chamber 1 or the base 2). It is preferable to install. By interposing the O-ring 4 also on the surface opposite to the application surface, the atmosphere can be further blocked.

Further, when a support means such as a base supports the surface opposite to the application surface of the transfer sheet S, there is a slight gap between the opposite surface and the support means. May get in. Therefore, as shown in FIG. 4B, in addition to the vacuum pump 5, a decompression chamber 6 may be provided on the opposite surface as a decompression processing chamber that decompresses to the same pressure as the chamber 1. A through hole 6 a is provided in the decompression chamber 6, air or the like in the gap is drawn from the through hole 6 a, and the inside of the decompression chamber 6 is decompressed by the vacuum pump 5. By providing the vacuum pump 5 and the decompression chamber 6 in this manner, the decompression process can be performed more reliably.

Also, FIG. 4 (a) and FIG. 4 (b) may be combined with each other. That is, an annular groove (not shown) is provided on the upper surface of the wall of the decompression chamber 6 shown in FIG. 4 (b), and the O-ring 4 is fitted along the groove as shown in FIG. 4 (a). Thus, an O-ring 4 is interposed between the transfer sheet S application surface and the surface of the chamber 1 on the transfer sheet S side, so that the surface opposite to the transfer sheet S application surface and the transfer sheet S of the decompression chamber 6 are present. An O-ring 4 may be further interposed between the side surfaces. In the case of FIG. 4A, the transfer sheet S can be simultaneously coated on both sides.

The present invention is not limited to the above embodiment, and can be modified as follows.

(1) In the embodiment described above, the application surface is the upper surface and the surface opposite to the application surface is the lower surface, but it may be upside down. That is, the application surface may be the lower surface, and the surface opposite to the application surface may be the upper surface.

(2) In the embodiment described above, the application surface is the upper surface, the surface opposite to the application surface is the lower surface, and the application surface is only one surface, but both surfaces may be the application surface.

(3) In the above-described embodiment, the heat treatment and the plasma treatment are performed in the same chamber 1, but a chamber (treatment chamber) (not shown) for performing the heat treatment is provided separately from the chamber 1 for performing the plasma treatment, Heat treatment and plasma treatment may be individually performed for each chamber. Further, heat treatment may be performed outside the chamber 1 where plasma treatment is performed.

(4) In the above-described embodiments, the shape of the chamber is square, and the O-ring is arranged in accordance with the shape. However, the shape of the chamber and the O-ring is not particularly limited. For example, in the case of a cylindrical chamber, an O-ring may be arranged accordingly.

(5) In the above-described embodiment, there is only one O-ring, but double or triple O-rings may be provided.

(6) In the above-described embodiment, similarly to the base material (transfer sheet), the transfer target object (work) is also long because it is fed roll-to-roll, but the work is not necessarily long. It does not have to be a scale. Transfer may be performed on the substrate-like workpiece, or transfer may be performed by combining the substrate-like workpiece and the long workpiece.

(7) In the above-described embodiments, the transfer sheet washed after transfer is reused and repeatedly used. However, it is not always necessary to reuse. You may perform the printing by an inkjet, or the sintering by a plasma process with respect to a disposable base material (transfer sheet).

(8) In the above-described embodiment, the first drying process step is performed between the fine particle application step and the plasma treatment step. The plasma treatment step was performed on the transfer sheet that was sent stepwise and the fine particles were dried and applied, but if the fine particles were already dried before the plasma treatment, It is not always necessary to perform a drying process.

(9) In the above-described embodiment, the adhesive is applied to the transfer sheet on which the fine particles are applied by sintering by the plasma processing between the plasma processing step and the pattern transfer step. Although the fine particle pattern applied with the adhesive and sintered is transferred from the transfer sheet S to the workpiece W by the adhesive, the present invention is not limited to this. For example, as shown in FIG. 5, between the plasma processing step and the pattern transfer step, an adhesive inkjet 24 for applying an adhesive to the workpiece (workpiece) W is provided downstream of the workpiece feed roller 27. The adhesive inkjet 24 may transfer the sintered fine particle pattern from the base material (transfer sheet) S to the workpiece W to which the adhesive is applied by the adhesive. In any case, the adhesiveness between the workpiece W and the pattern can be improved by the adhesive.

(10) Although the adhesive is applied in the above-described embodiment and modification (9), the improvement in the adhesion between the object to be processed (work) and the pattern is not taken into consideration, or the workpiece is applied without applying the adhesive. When the pattern adheres, it is not always necessary to apply an adhesive.

(11) In the above-described embodiment, the (second) drying process is performed on the workpiece after transfer, but the adhesive is already dried before being wound, and the pattern is transferred to the adjacent workpiece by winding. In the case where there is no fear of being dried, it is not always necessary to perform a drying process.

(12) In the above-described embodiment, the transfer sheet coated with the fine particles is subjected to the heat treatment, and the plasma treatment is performed after the heat treatment step. However, only the plasma treatment is performed without performing the heat treatment. Also good. For example, as shown in FIG. 6, only the plasma processing may be performed without providing the chamber 1 with heating means represented by the electric heater 13 (see FIG. 1C, FIG. 2, etc.).

1 ... chamber 4 ... O-ring F ... width S of the width w ₂ ... chambers direction w ₁ ... workpiece feeding the workpiece ... transfer sheet (substrate)
W ... Workpiece (processed object)

Claims

A pattern forming method for forming a pattern in which metal fine particles are sintered on a workpiece,
A substrate feeding process for feeding the substrate in stages at predetermined distances;
A fine particle application process for applying the fine particles to the substrate fed stepwise;
A processing chamber configured to be narrower than the width of the base material in a direction orthogonal to the direction in which the base material is fed when performing plasma processing on the base material that is fed stepwise and coated with the fine particles. In addition, in a state where the cross-section is circular and an annular O-ring is interposed between the application surface of the base material and the surface on the base material side of the processing chamber, the base material is fed stepwise for each predetermined distance, A plasma treatment process for performing plasma treatment on the substrate in a state where the inside of the treatment chamber is decompressed,
And a pattern transfer step of transferring the sintered fine particle pattern from the base material to the object to be processed by stepwise sending out the base material coated with the fine particles sintered by the plasma treatment from the processing chamber. A pattern forming method characterized by comprising:
In the pattern formation method of Claim 1,
Substrate feeding back process of feeding back the substrate after transfer to the feeding side step by step for each predetermined distance;
A cleaning process for cleaning the returned substrate,
In the substrate feeding process using the washed substrate, the substrate is fed again, the fine particle coating process, the plasma processing process, the pattern transfer process, the substrate feeding back process, the cleaning process, and the substrate. A pattern forming method, wherein the feeding process is repeated.
In the pattern formation method of Claim 1 or Claim 2,
A first drying process for performing a drying process on the substrate on which the fine particles have been applied by being sent stepwise between the fine particle application process and the plasma treatment process;
In the plasma processing process, the plasma processing is performed on the substrate which is fed stepwise and the fine particles are dried and applied.
In the pattern formation method in any one of Claims 1-3,
Between the plasma treatment process and the pattern transfer process, comprising an adhesive application process for applying an adhesive to a substrate on which the fine particles have been applied by sintering by the plasma treatment,
In the pattern transfer process, the pattern of fine particles, which is coated with the adhesive and sintered, is transferred from a base material to the object to be processed by the adhesive.
In the pattern formation method in any one of Claims 1-3,
An adhesive application process for applying an adhesive to the object to be processed is provided between the plasma processing process and the pattern transfer process,
The pattern transfer method is characterized in that, in the pattern transfer process, the sintered fine particle pattern is transferred from a base material to the workpiece to which the adhesive is applied by the adhesive.
In the pattern formation method in any one of Claims 1-5,
A pattern forming method comprising: a second drying process for performing a drying process on the object to be processed after the transfer.
In the pattern formation method in any one of Claims 1-6,
Comprising a heat treatment process for performing heat treatment on the base material coated with the fine particles,
A pattern forming method, wherein the plasma treatment is performed after the heat treatment process.