WO2006080359A1

WO2006080359A1 - Image pickup device

Info

Publication number: WO2006080359A1
Application number: PCT/JP2006/301155
Authority: WO
Inventors: Kazunari Ueda; Jun Asakura
Original assignee: Matsushita Electric Industrial Co., Ltd.
Priority date: 2005-01-26
Filing date: 2006-01-25
Publication date: 2006-08-03

Abstract

An image pickup device by which mass production and cost reduction can be easily achieved while maintaining size reduction, thickness reduction and high performance. The image pickup device is provided with a solid-state image pickup element (101), a printed board (103), and a signal processing IC chip (104). The signal processing IC chip (104) processes a signal outputted from the solid-state image pickup element (101). The printed board (103) is composed of a rigid flexible substrate whereupon a through hole (107) into which a protruding section (102) of the signal processing IC chip (104) can be inserted is formed. The solid-state image pickup element (101) is directly mounted on one surface of the rigid section of the printed board (103). The signal processing IC chip (104) is mounted on an IC chip mounting substrate (105) arranged on the other surface of the rigid section of the printed board (103).

Description

Specification

Imaging device

Technical field

TECHNICAL FIELD [0001] The present invention relates to an imaging device, and more particularly, to an imaging device useful as an imaging means for a mobile terminal device such as a mobile phone, a portable information terminal, a DVC (Digital Video Camera) equipped with an image sensor and a signal processing IC. .

Background art

In recent years, this type of mobile terminal device has been improved in performance and functionality, and mobile terminal devices having various functions have been put on the market. Among them, mobile phones with cameras are overwhelmingly supported by users, and it has become commonplace for V and Maya mobile phones to be equipped with cameras.

[0003] However, while recent mobile terminal devices have been improved in performance and functionality, the size of the device main body has been steadily increasing, and the user is required to have a smaller and lighter device main body. ing.

[0004] In addition, in an imaging device mounted on this type of mobile terminal device, a solid-state imaging device in which an image processing unit and an imaging unit are integrated has been used, but recently, the high resolution has been used. Image processing capabilities are essential to meet the needs for higher performance and higher functionality.

Therefore, it is necessary to convert the image processing unit into a dedicated IC.

[0005] For this reason, as an imaging device to be mounted on a portable terminal device that does not have a sufficient mounting space, a mounting form that can be mounted without taking up a space for a solid-state imaging device and an image processing IC. Is required.

[0006] As an imaging apparatus that meets such a demand, for example, an imaging apparatus as shown in FIG. 1 is known (see, for example, Patent Document 1).

As shown in FIG. 1, a conventional imaging device 10 includes a transparent substrate 11, a solid-state imaging device 31, and peripheral I.

It consists of C chip 41, printed wiring board 51, lead part 54, chip part 57, lens holder 81, lens 91, and the like.

In FIG. 1, the solid-state image sensor 31 has a bump contact with the light receiving surface facing the transparent substrate 11. The alloy is joined afterwards. On the solid-state image sensor 31, an image photographed by the imaging device 10 is formed through the lens 91 and the transparent substrate 11. Further, the solid-state imaging device 31 is sealed with a thermosetting resin 32.

[0009] The peripheral IC chip 41 also has power such as a digital signal processing IC that processes the signal output from the solid-state image sensor 31, and is bonded to the back side of the light-receiving surface of the solid-state image sensor 31 with a thermosetting resin 32. Are stacked.

[0010] The transparent substrate 11 and the printed wiring board 51 are bump-connected by wire bumps with the solid-state imaging device 31 and the peripheral IC chip 41 inserted into a through-hole having a saddle portion provided on the printed wiring board 51. And

[0011] The lead electrode provided in the saddle portion of the printed wiring board 51 and the peripheral IC chip 41 are wire-bonded and connected by the wire 61! Speak.

The wire 61, the solid-state image sensor 31 and the peripheral IC chip 41 are sealed with a coat resin 71.

The lens holder 81 is attached with an adhesive 82 to the back surface of the surface of the transparent substrate 11 to which the solid-state imaging element 31 is bonded and the printed wiring board 51 with the side surface of the transparent substrate 11 as a reference. Chip components 57 such as resistors and capacitors are mounted on the surface of the printed wiring board 51.

As described above, the imaging apparatus 10 has a structure in which the peripheral IC chip 41 is connected by the printed wiring board 51 and the wire 61, and the lens 91, the solid-state imaging device 31 and the digital signal processing IC are vertically arranged. Since it is mounted in the direction, space saving, downsizing and thinning can be achieved.

Patent Document 1: Japanese Patent Laid-Open No. 2002-231916

Disclosure of the invention

Problems to be solved by the invention

However, the image pickup apparatus described in Patent Document 1 has a complicated construction method such as wire bonding connection between a peripheral IC chip such as a digital signal processing IC and a printed wiring board, and for high performance. Cleanliness is high and needs to be installed in a location.

[0016] For this reason, such a conventional imaging apparatus is newly used for mass production in a factory. There were problems such as low cost and difficulty in mass production, such as requiring large capital investment.

An object of the present invention is to provide an imaging apparatus that can easily be mass-produced and reduced in cost while maintaining downsizing, thinning, and high performance.

Means for solving the problem

The image pickup apparatus of the present invention includes a solid-state image sensor, a signal processing IC chip that processes a signal output from the solid-state image sensor, and a printed board on which the solid-state image sensor is mounted. The processing IC chip is mounted on a dedicated IC chip mounting substrate, and the IC chip mounting substrate is disposed on the surface of the printed board opposite to the mounting surface of the solid-state imaging device.

The invention's effect

[0019] According to the present invention, it is possible to easily achieve mass production and low cost while maintaining downsizing, thinning, and high performance.

Brief Description of Drawings

FIG. 1 is a cross-sectional view showing a schematic configuration of a conventional imaging device

FIG. 2 is a cross-sectional view showing a schematic configuration of an imaging apparatus according to an embodiment of the present invention.

FIG. 3 is a block diagram when the imaging device according to one embodiment of the present invention is connected to a mobile terminal device.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, components having the same configuration or function and corresponding parts are denoted by the same reference numerals, and the description thereof is not repeated.

FIG. 2 is a cross-sectional view showing a schematic configuration of the imaging apparatus according to the embodiment of the present invention.

As shown in FIG. 2, the imaging apparatus 100 according to the present embodiment includes a solid-state imaging device 101, a printed board 103, a signal processing IC chip 104, an IC chip mounting board 105, peripheral components 106, and the like.

FIG. 3 shows a case where the imaging device according to one embodiment of the present invention is connected to a mobile terminal device. FIG. As shown in FIG. 3, the solid-state imaging device 101 of the imaging device 100 is electrically connected to the signal processing IC chip 104. The signal processing IC chip 104 of the imaging device 100 is electrically connected to the control unit 201 of the mobile terminal device 200, processes a signal output from the solid-state imaging device 101, and sends the processed signal to the control unit 201.

As shown in FIG. 2, the solid-state image sensor 101 has a protrusion 102. Therefore, the solid-state image sensor 101 cannot be mounted on the printed circuit board 103 as it is.

In order to mount such a solid-state image sensor 101, for example, there is a method in which a ball is provided on a land portion of the solid-state image sensor 101 and the protrusion 102 is raised so as not to interfere with the printed circuit board 103.

[0026] However, this method has a problem that the cost increases due to an increase in parts (balls) and man-hours, and the apparatus becomes thicker due to raising the bottom.

Therefore, in imaging device 100 according to the present embodiment, protruding portion is formed on printed circuit board 103.

A through-hole 107 large enough to accommodate 102 is provided. And the projecting part in this through hole 107

102 is inserted, and a solid-state imaging device 101 is mounted on a printed circuit board 103 by an LGA (Land Grid Array).

That is, in this example, the solid-state imaging device 10 with the protruding portion 102 inserted into the through hole 107.

The joint 108 between the land portion 1 and the printed circuit board 103 is soldered by reflow to mount the solid-state imaging device 101 on the printed circuit board 103.

Incidentally, the signal processing IC chip 104 of the imaging device 100 needs to be electrically connected to the control unit 201 of the mobile terminal device 200 as shown in FIG.

However, if the printed circuit board 103 is provided with a connector for drawing out connection wiring, an ACF (Anisotropic Conductive Film) connection portion, or the like, the board area of the printed circuit board 103 is increased.

Therefore, in the imaging apparatus 100 according to the present embodiment, as the printed circuit board 103, a rigid part having a rigid printed circuit board force capable of mounting components, and a flexible part having a flexible printed circuit board force capable of being bent. A rigid-flex board is used.

[0032] An imaging apparatus 100 using such a printed circuit board 103 as a rigid flexible circuit board is a printed circuit board. The structure can be reduced in size by reducing the area used for 103 connection wiring leads. In addition, since this imaging apparatus 100 does not require a connector, a cable, or the like, it is possible to reduce the total cost including the component cost and the inspection cost associated therewith. Furthermore, in this imaging apparatus 100, it is possible to reduce noise due to the antenna action at the conventional cable portion and reflection at the connection portion.

On the other hand, in image pickup apparatus 100 according to the present embodiment, a bear chip IC is used as signal processing IC chip 104.

[0034] However, the board on which this fine-pitch bare chip IC can be mounted is expensive, and it is difficult to ensure the reliability of mounting the fine-pitch bare chip IC on the printed circuit board 103, which is a rigid-flex board. Become.

[0035] Therefore, in imaging device 100 according to the present embodiment, an IC chip mounting substrate 105 dedicated for bare chip IC is a general method for ensuring low cost and high reliability. The signal processing IC chip 104 is mounted by ACF connection using a conductive film.

Further, as shown in FIG. 2, the above-mentioned IC chip mounting board 105 is soldered to the surface of the printed board 103 opposite to the mounting surface of the solid-state image sensor 101 by reflow soldering. LGA mounting structure. The other joint 110 between the printed circuit board 103 and the IC chip mounting board 105 is a land Z solder joint for drawing out to the control unit 201 of the mobile terminal device 200.

Furthermore, in imaging device 100 according to the present embodiment, peripheral components 106 such as chip capacitors and chip resistors necessary for signal processing IC chip 104 are also mounted on IC chip mounting substrate 105. This can prevent performance degradation such as an increase in noise. Therefore, it is desirable that the size of the IC chip mounting substrate 105 in the imaging apparatus 100 of the present example is larger than the size of the solid-state imaging element 101.

In the imaging apparatus 100 of this example, the solid-state imaging device 101 and the IC chip mounting board 105 are mounted on the front and back of the printed board 103 and are electrically connected.

Therefore, in the imaging apparatus 100 of the present example, the pitch and position of the land for the solid-state imaging device 101 and the land for the IC chip mounting board 105 provided on the printed board 103 are determined on the front and back sides of the printed board 103. It is desirable to keep them consistent. [0040] In this way, by making the pitch and position of the lands on the front and back sides of the printed circuit board 103 coincide with each other, linear wiring from the land for the solid-state imaging device 101 to the land for the IC chip mounting substrate 105 is achieved. Therefore, it is possible to prevent unnecessary wiring and the like, and the printed circuit board 103 can be downsized.

[0041] An imaging device according to a first aspect of the present invention includes a solid-state imaging device, a signal processing IC chip that processes a signal output from the solid-state imaging device, and a print substrate on which the solid-state imaging device is mounted. The signal processing IC chip is mounted on a dedicated IC chip mounting board, and the IC chip mounting board is disposed on the surface of the printed board opposite to the mounting surface of the solid-state imaging device. Take the configuration.

[0042] According to this configuration, since the signal processing IC chip is mounted on the dedicated IC chip mounting substrate, a general purpose for ensuring low cost and high reliability without using an expensive substrate is used. A signal processing IC chip can be implemented by ACF connection using an anisotropic conductive film, which is a simple construction method. Therefore, according to this configuration, it is possible to easily achieve mass production and low cost while maintaining downsizing, thinning, and high performance.

[0043] An imaging device according to a second aspect of the present invention employs a configuration in which, in the first aspect, a peripheral component for signal processing of the signal processing IC chip is mounted on the IC chip mounting substrate.

[0044] According to this configuration, peripheral components such as chip capacitors and chip resistors necessary for the signal processing IC chip are also mounted on the IC chip mounting substrate, so that performance deterioration such as noise increase can be prevented. it can.

[0045] An imaging device according to a third aspect of the present invention employs a configuration in which the size of the IC chip mounting substrate is larger than the size of the solid-state imaging device in the second aspect.

[0046] According to this configuration, since the size of the IC chip mounting substrate is larger than the size of the solid-state imaging device, peripherals such as chip capacitors and chip resistors necessary for the signal processing IC chip can be obtained without increasing the printed circuit board. Components can be easily mounted on an IC chip mounting board.

[0047] In the imaging device according to the fourth aspect of the present invention, in the first aspect, lands provided on the front and back of the printed circuit board on which the solid-state imaging device is mounted are arranged at the same position at the same pitch. Adopt the configuration. [0048] According to this configuration, since the pitches and positions of the lands on the front and back sides of the printed circuit board coincide with each other, linear wiring from the land for the solid-state imaging device to the land for the IC chip mounting board becomes possible. This can prevent unnecessary wiring and reduce the size of the printed circuit board.

[0049] Contents of this book of Ito Itada Based on Japanese Patent Application 2005-018112, filed on January 26, 2005. All this content is included here.

Industrial applicability

[0050] The image pickup apparatus according to the present invention can be easily mass-produced and reduced in cost while maintaining downsizing, thinning, and high performance. Therefore, the image pickup device and the signal processing IC are mounted. It is useful as an imaging means for mobile terminal devices such as mobile phones, personal digital assistants, and DVCs.

Claims

The scope of the claims

[1] a solid-state image sensor;

A signal processing IC chip for processing a signal output from the solid-state imaging device; and a printed circuit board on which the solid-state imaging device is mounted.

The signal processing IC chip is mounted on a dedicated IC chip mounting substrate,

An imaging apparatus, wherein the IC chip mounting substrate is disposed on a surface of the printed board opposite to a mounting surface of the solid-state imaging device.

[2] The imaging device according to [1], wherein peripheral components for signal processing of the signal processing IC chip are mounted on the IC chip mounting substrate.

[3] The imaging device according to [2], wherein the size of the IC chip mounting substrate is larger than the size of the solid-state imaging device.

4. The imaging apparatus according to claim 1, wherein lands provided on the front and back sides of the printed circuit board on which the solid-state imaging device is mounted are 1 arranged at the same position and at the same pitch.

[5] A portable terminal device equipped with an imaging means,

A portable terminal device using the imaging device according to claim 1 as the imaging means.