WO2004101835A1 - Gold alloy and method for manufacturing a dental restoration - Google Patents
Gold alloy and method for manufacturing a dental restoration Download PDFInfo
- Publication number
- WO2004101835A1 WO2004101835A1 PCT/NL2004/000344 NL2004000344W WO2004101835A1 WO 2004101835 A1 WO2004101835 A1 WO 2004101835A1 NL 2004000344 W NL2004000344 W NL 2004000344W WO 2004101835 A1 WO2004101835 A1 WO 2004101835A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- alloy
- gold
- porcelain
- temperature
- metal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K6/00—Preparations for dentistry
- A61K6/80—Preparations for artificial teeth, for filling teeth or for capping teeth
- A61K6/802—Preparations for artificial teeth, for filling teeth or for capping teeth comprising ceramics
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K6/00—Preparations for dentistry
- A61K6/80—Preparations for artificial teeth, for filling teeth or for capping teeth
- A61K6/84—Preparations for artificial teeth, for filling teeth or for capping teeth comprising metals or alloys
- A61K6/844—Noble metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Definitions
- the invention relates to a gold alloy and more in particular to a gold alloy having a high gold content.
- the invention further relates to a method for manufacturing a metal-ceramic dental restoration.
- gold alloys with a high gold content have been used in dental restorations, particularly because of their biological and chemical inertia and their attractive deep yellow color.
- This pressing procedure comprises the following steps: a supporting structure from a metal alloy is, either provided with a thin coating layer or not, pressed over with a press ceramic by use of the "lost wax method". During the burning out or drying out of the wax, while heating for a long time at a relatively high temperature, with many alloys, a thick oxide layer is formed on the alloy. In many cases, this oxide layer results in a dark edge or contour.
- steps need to be taken to form as little oxide as possible on the surface of the structure from the metal alloy.
- an alloy with a high gold content a so-called “high gold alloy” has now been found which remains yellow upon oxidation, which alloy is suitable for use in a metal -ceramic system, in which a gold alloy with an aesthetic yellow color is fired on or pressed on with a dental ceramic or porcelain tailored thereto.
- the alloy according to the invention has a high degree of biocompatibility.
- This alloy according to the invention comprises 0.01-0.05 wt.% zinc; 0.01-0.05 wt.% indium; 0.01-0.05 wt.% silver and 0.01-0.05 wt.% manganese in a gold base.
- the gold base substantially consists of gold, but may contain small amounts of pollutants, as long as they produce no adverse color effects and do not affect the biocompatibility.
- the alloy according to the invention comprises at least 99 wt.% gold.
- a very suitable alloy substantially consists of 99.80 wt.% gold; 0.05 wt.% zinc; 0.05 wt.% indium; 0.05 wt.% silver and 0.05 wt.% manganese.
- the alloy according to the invention provides a stable, very thin, possibly monomolecular oxidation layer which is so light in color than no adverse color effects occur.
- the oxidation layer is sufficiently strongly bound to the underlying alloy and appears to be capable of a very good metal-press glass or metal-porcelain binding.
- manganese provides a good bond.
- Tin and indium ensure a reinforcement of the oxide.
- the gold alloy according to the invention does not have a very great strength, but this has not been found necessary for the applications for which this alloy is intended.
- the alloys according to the invention have a solidus temperature of between 1030 and 1100°C; for the preferred alloys, the solidus temperature is between 1045 and 1065°C.
- the coefficient of thermal expansion (measured from 25 to 500°C) is between 14.5 and 15.5 ⁇ m/m.°C; and for the preferred alloys between 14.8 and 15.3 ⁇ m/m.°C.
- DE-OS 44 19 408 describes a dental alloy with 95-98 wt.% gold; 1-4 wt.% titanium; and 0.05-1.5 wt.% of one or more elements from the group of Re, Rh, Ru, Ir and Ta.
- US-A-5,922,276 relates to a dental alloy with an excellent oxide color, which alloy contains at least 99.5 wt.% gold, 0.1-0.25 wt.% zinc, 0.1-0.25 wt.% indium and up to 0.3 wt.% Rt, Pd, Rh, Ir, Re or combinations thereof. It is explicitly stated that elements like copper, manganese and iron should be avoided because they produce dark or colored oxides.
- the invention relates to a method for manufacturing a metal-ceramic dental restoration, comprising pressing, with heating, a tooth-colored press glass onto a wholly or partly supporting structure from the alloy according to the invention, with the press glass having a coefficient of thermal expansion (CTE) of between 12.5 and 14.5, and preferably between 13.0 and 14.5 km/m.K, measured in the range from 25°C to 500°C or to the glass transformation temperature, depending on which of the two is the lowest, and with the press glass having a pressing temperature which is at least 50°C lower than the solidus temperature of the alloy.
- CTE coefficient of thermal expansion
- the press glass is pressed with heating in a mold manufactured by use of the "lost wax" method.
- Such a method is much more effective and economical than the conventional method in which porcelain was applied layer by layer.
- fewer bubbles and cracks are formed during pressing compared to applying the porcelain layer by layer.
- the alloy according to the invention can also be coated with this conventional method.
- a wax model of one or more teeth and/or molars is made, which model is embedded in a fire-resistant material, for instance Carrara ® Universal Dustless Investment (ex Elephant Dental B.V., Hoorn, The Netherlands). Then, after curing of the die from fire-resistant material, the wax is burnt out. After this, a closed pellet of press glass is brought, on the connecting channels, to the mold, by pressing the glass therein with a fire-resistant cylinder with thermal plasticization.
- the structure from the high gold alloy according to the invention is present, as stated. This structure may, for instance, be formed by CAD/CAM methodologies.
- the press glass is available in a tooth color.
- the coloring of porcelain is known to a skilled person. A suitable method is described in DE-OS- 1999 04 522, which document is understood to be inserted in this specification for the description of the coloring method.
- a so-called liner may be applied onto the alloy.
- This liner will, as a rule, have a melting point which is less than 50°C lower than the pressing temperature of the press glass.
- a suitable liner consists of 58.5 wt.% Si ⁇ , 12.6 wt.% AI2O3, 11.0 wt.% K 2 O, 7.1 wt.% Na 2 O, 10.4 wt.% CeO 2 , 0.4 wt.% LiO 2 .
- This liner can be applied as a single coating in a thickness of 20-40 ⁇ m and be burnt up at about 900°C.
- a suitable press glass may have the following (preferred) composition: 7-15 wt.% AI2O3; 13-23 wt.% (K 2 O + Na 2 O), 1-3 wt.% (BaO + CaO), 1-3 wt.% (Sb2 ⁇ 3 + LA2O) and 0.2-1.2 wt.% fluorine, rest Si ⁇ 2 including coloring compositions.
- the powder formed from these glass compositions preferably has a particle size smaller than 106 ⁇ .
- This powder is granulated with a binder and uniaxially dry -pressed at room temperature and sintered at a temperature of, for instance, 800-1000°C, preferably 900-960°C, for 1 minute to 1 hour, preferably 1-30 minutes.
- the invention relates to a method for manufacturing a metal-ceramic dental restoration, comprising firing a dental porcelain onto a supporting structure from the alloy according to any one of claims 1-3, with the porcelain having a coefficient of thermal expansion of between 12.5 and 14.5 ⁇ m/m.K, measured in the range from 25°C to 500°C or to the glass transformation temperature, depending on which of the two is the lowest, and with the porcelain having a firing temperature which is at least 50 °C lower than the solidus temperature of the alloy.
- a suitable firing ceramic has the following (preferred) composition: 64.1-67.0% Si ⁇ 2, 11.0-12.5% AI2O3, 10.1-11.6% K 2 O, 6.6-8.6% Na 2 O, 0.7-1.1% CaO, 0.4-1.3% BaO, 0-2.1% Sb2 ⁇ 3, 0-0.2% L12O, and 0-0.6% fluorine with pigments.
- a more preferred firing ceramic has the following composition: 64.1% Si ⁇ 2, 14.2% AI2O3, 11.1% K 2 O, 6.6% Na O, 1.1% CaO, 0.4% BaO, 1.4% Sb 2 O 3 , 0.2% Li 2 O and 0.6% F2 with pigments.
- Every CTE described in this specification or the claims is measured in the range from 25°C to 500°C or to the glass transformation temperature, depending on which of the two is the lowest. Also, every percentage is a weight percentage related to the weight of the total composition, unless indicated otherwise.
- the pressing or firing temperature needs to be at least 50°C lower than the solidus temperature of the alloy in order to avoid deformation of the metal structure during pressing.
- the CTE of the press glass or porcelain needs to be such that the CTE of the alloy is 0.5-2.0 ⁇ m/m.K higher than that of the press glass or porcelain.
- the alloys were then cast in an electric casting device at 1200 °C into a graphite -containing, phosphate-bound embedding mass die, which had been preheated to 750°C. After oxidation, the alloy has a grey-yellow color.
- the binding with porcelain is given in Table 3.
- Example 2 In the same manner as in Example 1, an alloy was produced with the following composition: 98.2 wt.% gold, 1.2 wt.% platinum, 0.1 wt.% zinc,
- Example 2 In the same manner as in Example 1, an alloy was produced with the following composition: 99.8 wt.% gold, 0.05% zinc, 0.05% indium, 0.05% silver, 0.05% manganese. After oxidation, the alloy has an intensely yellow color.
- Example 3 In the same manner as in Example 1, an alloy was produced with the following composition: 99.7 wt.% gold, 0.1% zinc, 0.2% indium (see US-A-5,922,276). After oxidation, the alloy has an intensely yellow color, but did not have the good bond of Example 3.
- a round disk of the alloys was cast with a diameter of 25 mm and a thickness of 1.0 mm. After casting, the casting pieces were ground with coarse and fine aluminum oxide. The metal-ceramic disk was then deformed from the top, with the porcelain downwards, by a stamp with a spherical end. The disk was bent 0.4 mm in the centre to achieve a consistent deformation of the disk and removal of the ceramic with minimal cracks in the metal. After the breaking off of the porcelain, loose particles of porcelain were removed from the surface of fracture with a nylon brush, after which the surface of fracture was placed in an ultrasonic bath for 10 minutes.
Landscapes
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Engineering & Computer Science (AREA)
- Veterinary Medicine (AREA)
- Materials Engineering (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epidemiology (AREA)
- Plastic & Reconstructive Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Dental Prosthetics (AREA)
- Dental Preparations (AREA)
- Ceramic Products (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BRPI0408748-8A BRPI0408748A (en) | 2003-05-19 | 2004-05-18 | alloy and method for fabricating a metal-ceramic dental restoration |
EP04748587A EP1627088A1 (en) | 2003-05-19 | 2004-05-18 | Gold alloy and method for manufacturing a dental restoration |
CA002520131A CA2520131A1 (en) | 2003-05-19 | 2004-05-18 | Gold alloy and method for manufacturing a dental restoration |
JP2007518402A JP2007527955A (en) | 2003-05-19 | 2004-05-18 | Gold alloy and method for producing dental restoration |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1023458 | 2003-05-19 | ||
NL1023458A NL1023458C2 (en) | 2003-05-19 | 2003-05-19 | Gold alloy as well as a method for manufacturing a dental restoration. |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004101835A1 true WO2004101835A1 (en) | 2004-11-25 |
Family
ID=33448527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/NL2004/000344 WO2004101835A1 (en) | 2003-05-19 | 2004-05-18 | Gold alloy and method for manufacturing a dental restoration |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1627088A1 (en) |
JP (1) | JP2007527955A (en) |
KR (1) | KR20050118301A (en) |
CN (1) | CN1777688A (en) |
BR (1) | BRPI0408748A (en) |
CA (1) | CA2520131A1 (en) |
NL (1) | NL1023458C2 (en) |
WO (1) | WO2004101835A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1595523A1 (en) * | 2004-05-14 | 2005-11-16 | The Argen Corporation | Dental prosthesis method and alloys |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104367383A (en) * | 2013-08-16 | 2015-02-25 | 刘俐旻 | Porcelain tooth structure containing nanogold |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03130332A (en) * | 1989-10-16 | 1991-06-04 | Tokuriki Honten Co Ltd | White gold alloy for ornament |
NL9200564A (en) * | 1992-03-26 | 1993-10-18 | Elephant Edelmetaal Bv | Dental alloy and dental porcelain for dental purposes. |
DE19525361A1 (en) * | 1995-02-16 | 1996-08-22 | Herbst Bremer Goldschlaegerei | Platinum- and/or palladium-contg. gold@ dental alloy |
US5922276A (en) * | 1998-02-17 | 1999-07-13 | The Argen Corporation | Gold alloy for porcelain/metal dental restorations |
EP1193320A1 (en) * | 2000-09-29 | 2002-04-03 | Cendres Et Metaux S.A. | Fireable dental alloy with a high gold content |
-
2003
- 2003-05-19 NL NL1023458A patent/NL1023458C2/en not_active IP Right Cessation
-
2004
- 2004-05-18 KR KR1020057018694A patent/KR20050118301A/en not_active Application Discontinuation
- 2004-05-18 BR BRPI0408748-8A patent/BRPI0408748A/en not_active Application Discontinuation
- 2004-05-18 CN CNA2004800104151A patent/CN1777688A/en active Pending
- 2004-05-18 WO PCT/NL2004/000344 patent/WO2004101835A1/en not_active Application Discontinuation
- 2004-05-18 CA CA002520131A patent/CA2520131A1/en not_active Abandoned
- 2004-05-18 JP JP2007518402A patent/JP2007527955A/en active Pending
- 2004-05-18 EP EP04748587A patent/EP1627088A1/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03130332A (en) * | 1989-10-16 | 1991-06-04 | Tokuriki Honten Co Ltd | White gold alloy for ornament |
NL9200564A (en) * | 1992-03-26 | 1993-10-18 | Elephant Edelmetaal Bv | Dental alloy and dental porcelain for dental purposes. |
DE19525361A1 (en) * | 1995-02-16 | 1996-08-22 | Herbst Bremer Goldschlaegerei | Platinum- and/or palladium-contg. gold@ dental alloy |
US5922276A (en) * | 1998-02-17 | 1999-07-13 | The Argen Corporation | Gold alloy for porcelain/metal dental restorations |
EP1193320A1 (en) * | 2000-09-29 | 2002-04-03 | Cendres Et Metaux S.A. | Fireable dental alloy with a high gold content |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 015, no. 337 (C - 0862) 27 August 1991 (1991-08-27) * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1595523A1 (en) * | 2004-05-14 | 2005-11-16 | The Argen Corporation | Dental prosthesis method and alloys |
US7279054B2 (en) | 2004-05-14 | 2007-10-09 | The Argen Corporation | Dental prosthesis method and alloys |
US7892480B2 (en) | 2004-05-14 | 2011-02-22 | The Argen Corporation | Dental prosthesis method and alloys |
Also Published As
Publication number | Publication date |
---|---|
BRPI0408748A (en) | 2006-03-28 |
JP2007527955A (en) | 2007-10-04 |
KR20050118301A (en) | 2005-12-16 |
CA2520131A1 (en) | 2004-11-25 |
EP1627088A1 (en) | 2006-02-22 |
NL1023458C2 (en) | 2004-11-22 |
CN1777688A (en) | 2006-05-24 |
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