US7386197B2 - Method and apparatus for wafer level testing of integrated optical waveguide circuits - Google Patents

Method and apparatus for wafer level testing of integrated optical waveguide circuits Download PDF

Info

Publication number
US7386197B2
US7386197B2 US10/994,021 US99402104A US7386197B2 US 7386197 B2 US7386197 B2 US 7386197B2 US 99402104 A US99402104 A US 99402104A US 7386197 B2 US7386197 B2 US 7386197B2
Authority
US
United States
Prior art keywords
plc
optical
planar lightwave
optical probe
lightwave circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US10/994,021
Other versions
US20050100266A1 (en
Inventor
Dmitri E. Nikonov
Mark T. McCormack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Priority to US10/994,021 priority Critical patent/US7386197B2/en
Publication of US20050100266A1 publication Critical patent/US20050100266A1/en
Application granted granted Critical
Publication of US7386197B2 publication Critical patent/US7386197B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/30—Testing of optical devices, constituted by fibre optics or optical waveguides
    • G01M11/37—Testing of optical devices, constituted by fibre optics or optical waveguides in which light is projected perpendicularly to the axis of the fibre or waveguide for monitoring a section thereof

Definitions

  • the described invention relates to the field of optical circuits.
  • the invention relates to an optical probe for testing an optical circuit.
  • Optical circuits include, but are not limited to, light sources, detectors and/or waveguides that provide such functions as splitting, coupling, combining, multiplexing, demultiplexing, and switching.
  • Planar lightwave circuits are optical circuits that are manufactured and operate in the plane of a wafer. PLC technology is advantageous because it can be used to form many different types of optical devices, such as array waveguide grating (AWG) filters, optical add/drop (de)multiplexers, optical switches, monolithic, as well as hybrid opto-electronic integrated devices. Such devices formed with optical fibers would typically be much larger or would not be feasible at all. Further, PLC structures may be mass produced on a silicon wafer.
  • FIG. 1 is a schematic diagram that shows an example of the current way that planar waveguides 20 , 22 are tested.
  • a PLC wafer is diced and optical fibers, 10 , 12 are mounted to the edge of a PLC die.
  • Light is sent in to the PLC structure 5 through one optical fiber 10 , and a second optical fiber 12 is used to detect the light.
  • a photodetector coupled to the second optical probe 12 will detect the power of light transmitted to it.
  • FIG. 1 is a schematic diagram that shows an example of the current way that planar waveguides are tested.
  • FIG. 2 is a cross-sectional schematic diagram of an optical probe used to test a planar lightwave circuit (PLC).
  • PLC planar lightwave circuit
  • FIG. 3 is a 3-dimensional view illustrating one embodiment for testing a PLC wafer using two optical probes.
  • a method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit.
  • a second optical probe is used in combination with the first optical probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.
  • FIG. 2 is a cross-sectional schematic diagram of an optical probe 130 used to test a planar lightwave circuit (PLC) 105 .
  • the PLC 105 comprises a waveguide having a core layer 110 , an upper cladding 120 , and a lower cladding 122 .
  • the upper cladding 120 is only partially applied at the time that the optical probe 130 is used to test the PLC 105 , and one or more additional layers of upper cladding are subsequently applied to the PLC 105 after removing the optical probe.
  • an upper cladding layer of approximately 1-2 microns provides good optical coupling.
  • the optical probe 130 is an optical fiber comprising a core 132 and an outer cladding 134 .
  • the optical fiber 130 has been side-polished so that the core 132 is exposed.
  • the side-polished optical fiber 130 is coupled to the waveguide core 110 .
  • an index-matching fluid 140 is used to improve the optical coupling between the optical probe 130 and the waveguide core 110 .
  • FIG. 3 is a 3-dimensional view illustrating one embodiment for testing a PLC wafer 205 using two optical probes 210 , 220 .
  • PLC wafer 205 may include several PLC dice. In one embodiment, the testing is done before dicing the wafer or fiber interfacing the dice.
  • a first optical probe 210 is coupled to a first portion of a waveguide of the PLC 205 .
  • the first optical probe 210 is coupled, e.g., with an optical fiber, to a light source 212 such as a laser.
  • the light source 212 provides a light beam to the first optical probe 210 , which is evanescently coupled to a first portion of the PLC 205 .
  • a second optical probe 220 is coupled to a second portion of the PLC 205 , and the second optical probe 220 is also coupled to a photodetector 222 . Light transmission between the first portion of the PLC and the second portion of the PLC can now be tested.
  • the first optical probe 210 couples a light beam into the PLC 205
  • the light beam is detected through the second optical probe by the photodetector 222 , if the PLC 205 is working properly.
  • An alignment stage 230 is used to position the first optical probe 210
  • an alignment stage 232 is used to position the second optical probe 220 .
  • each alignment stage 230 , 232 provides six degrees of freedom.
  • the optical probes are able to be aligned with the PLC 205 by modifying, for example, the X, Y, and Z coordinates, as well as pitch, yaw, and roll.
  • an additional layer of upper cladding may then be added to the top surface of the PLC 205 .
  • this technology can be used for fault isolation or intermediate device debugging capabilities. It can be applied to a whole wafer as well as previously diced and possibly fiber interfaced PLCs if they are found non-optimal in performance.
  • One or more probes with detection and/or transmission capability may be coupled at intermediate positions within the PLC (which would be inaccessible by conventional methods) to measure characteristics of PLC subunits and hence determine the local cause of observed effects for debug, fault isolation, and performance enhancement purposes.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Optical Integrated Circuits (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)

Abstract

A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second probe is used in combination with the first probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.

Description

This application is continuation of Ser. No. 10/041,038 filed Dec. 28, 2001, is now U.S. Pat. No. 6,859,587.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The described invention relates to the field of optical circuits. In particular, the invention relates to an optical probe for testing an optical circuit.
2. Description of Related Art
Optical circuits include, but are not limited to, light sources, detectors and/or waveguides that provide such functions as splitting, coupling, combining, multiplexing, demultiplexing, and switching. Planar lightwave circuits (PLCs) are optical circuits that are manufactured and operate in the plane of a wafer. PLC technology is advantageous because it can be used to form many different types of optical devices, such as array waveguide grating (AWG) filters, optical add/drop (de)multiplexers, optical switches, monolithic, as well as hybrid opto-electronic integrated devices. Such devices formed with optical fibers would typically be much larger or would not be feasible at all. Further, PLC structures may be mass produced on a silicon wafer.
FIG. 1 is a schematic diagram that shows an example of the current way that planar waveguides 20, 22 are tested. Typically, a PLC wafer is diced and optical fibers, 10, 12 are mounted to the edge of a PLC die. Light is sent in to the PLC structure 5 through one optical fiber 10, and a second optical fiber 12 is used to detect the light. A photodetector coupled to the second optical probe 12 will detect the power of light transmitted to it.
If the PLC works properly, then fibers are permanently attached to the PLC, and the PLC is put into a package. However, if the PLC does not work properly, the unit is discarded, and the time and effort to dice, fiber mount and to comprehensively test the device are wasted. Thus, a method of testing a planar lightwave circuit at the wafer level or before fiber attach is important.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic diagram that shows an example of the current way that planar waveguides are tested.
FIG. 2 is a cross-sectional schematic diagram of an optical probe used to test a planar lightwave circuit (PLC).
FIG. 3 is a 3-dimensional view illustrating one embodiment for testing a PLC wafer using two optical probes.
 DETAILED DESCRIPTION
A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second optical probe is used in combination with the first optical probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.
FIG. 2 is a cross-sectional schematic diagram of an optical probe 130 used to test a planar lightwave circuit (PLC) 105. The PLC 105 comprises a waveguide having a core layer 110, an upper cladding 120, and a lower cladding 122. In one embodiment, the upper cladding 120 is only partially applied at the time that the optical probe 130 is used to test the PLC 105, and one or more additional layers of upper cladding are subsequently applied to the PLC 105 after removing the optical probe. In one embodiment, an upper cladding layer of approximately 1-2 microns provides good optical coupling.
The optical probe 130 is an optical fiber comprising a core 132 and an outer cladding 134. The optical fiber 130 has been side-polished so that the core 132 is exposed. The side-polished optical fiber 130 is coupled to the waveguide core 110. In one embodiment, an index-matching fluid 140 is used to improve the optical coupling between the optical probe 130 and the waveguide core 110.
FIG. 3 is a 3-dimensional view illustrating one embodiment for testing a PLC wafer 205 using two optical probes 210, 220. PLC wafer 205 may include several PLC dice. In one embodiment, the testing is done before dicing the wafer or fiber interfacing the dice. A first optical probe 210 is coupled to a first portion of a waveguide of the PLC 205. The first optical probe 210 is coupled, e.g., with an optical fiber, to a light source 212 such as a laser. The light source 212 provides a light beam to the first optical probe 210, which is evanescently coupled to a first portion of the PLC 205.
A second optical probe 220 is coupled to a second portion of the PLC 205, and the second optical probe 220 is also coupled to a photodetector 222. Light transmission between the first portion of the PLC and the second portion of the PLC can now be tested. When the first optical probe 210 couples a light beam into the PLC 205, the light beam is detected through the second optical probe by the photodetector 222, if the PLC 205 is working properly.
An alignment stage 230 is used to position the first optical probe 210, and an alignment stage 232 is used to position the second optical probe 220. In one embodiment, each alignment stage 230, 232 provides six degrees of freedom. Thus, the optical probes are able to be aligned with the PLC 205 by modifying, for example, the X, Y, and Z coordinates, as well as pitch, yaw, and roll.
As previously mentioned, after functionality of the PLC 205 has been established, an additional layer of upper cladding may then be added to the top surface of the PLC 205.
In addition to the testing methods previously mentioned, this technology can be used for fault isolation or intermediate device debugging capabilities. It can be applied to a whole wafer as well as previously diced and possibly fiber interfaced PLCs if they are found non-optimal in performance. One or more probes with detection and/or transmission capability may be coupled at intermediate positions within the PLC (which would be inaccessible by conventional methods) to measure characteristics of PLC subunits and hence determine the local cause of observed effects for debug, fault isolation, and performance enhancement purposes.
Thus, a method and apparatus for testing a planar lightwave circuit is disclosed. However, the specific embodiments and methods described herein are merely illustrative. Numerous modifications in form and detail may be made without departing from the scope of the invention as claimed below. The invention is limited only by the scope of the appended claims.

Claims (1)

1. A method of testing a planar lightwave circuit comprising:
coupling a first optical probe having a side-polished optical fiber to the planar lightwave circuit;
testing an optical pathway within the planar lightwave circuit by transmitting or receiving light through the first optical probe; and
adding an additional layer of upper cladding to the planar lightwave circuit after removing the first optical probe.
US10/994,021 2001-12-28 2004-11-19 Method and apparatus for wafer level testing of integrated optical waveguide circuits Expired - Fee Related US7386197B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/994,021 US7386197B2 (en) 2001-12-28 2004-11-19 Method and apparatus for wafer level testing of integrated optical waveguide circuits

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/041,038 US6859587B2 (en) 2001-12-28 2001-12-28 Method and apparatus for wafer level testing of integrated optical waveguide circuits
US10/994,021 US7386197B2 (en) 2001-12-28 2004-11-19 Method and apparatus for wafer level testing of integrated optical waveguide circuits

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10/041,038 Continuation US6859587B2 (en) 2001-12-28 2001-12-28 Method and apparatus for wafer level testing of integrated optical waveguide circuits

Publications (2)

Publication Number Publication Date
US20050100266A1 US20050100266A1 (en) 2005-05-12
US7386197B2 true US7386197B2 (en) 2008-06-10

Family

ID=21914382

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/041,038 Expired - Fee Related US6859587B2 (en) 2001-12-28 2001-12-28 Method and apparatus for wafer level testing of integrated optical waveguide circuits
US10/994,021 Expired - Fee Related US7386197B2 (en) 2001-12-28 2004-11-19 Method and apparatus for wafer level testing of integrated optical waveguide circuits

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US10/041,038 Expired - Fee Related US6859587B2 (en) 2001-12-28 2001-12-28 Method and apparatus for wafer level testing of integrated optical waveguide circuits

Country Status (4)

Country Link
US (2) US6859587B2 (en)
AU (1) AU2002351294A1 (en)
TW (1) TWI250322B (en)
WO (1) WO2003058190A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140203830A1 (en) * 2013-01-24 2014-07-24 Samsung Electronics Co., Ltd. Test system and method for wafer including optical component

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7116851B2 (en) * 2001-10-09 2006-10-03 Infinera Corporation Optical signal receiver, an associated photonic integrated circuit (RxPIC), and method improving performance
US6859587B2 (en) * 2001-12-28 2005-02-22 Intel Corporation Method and apparatus for wafer level testing of integrated optical waveguide circuits
US7440179B2 (en) * 2002-05-29 2008-10-21 Alphion Corporation SOA-MZI device fault isolation
US6909830B2 (en) * 2002-07-16 2005-06-21 Enablence Holdings Llc Method and apparatus for on-wafer testing of an individual optical chip
US6925238B2 (en) * 2002-07-16 2005-08-02 Enablence Holdings Llc Method and apparatus for on-wafer testing of an individual optical chip
US7378861B1 (en) * 2003-04-07 2008-05-27 Luxtera, Inc. Optical alignment loops for the wafer-level testing of optical and optoelectronic chips
US7184626B1 (en) * 2003-04-07 2007-02-27 Luxtera, Inc Wafer-level testing of optical and optoelectronic chips
WO2005020297A2 (en) * 2003-08-25 2005-03-03 Tau-Metrix, Inc. Technique for evaluating a fabrication of a semiconductor component and wafer
US7109739B2 (en) * 2004-03-08 2006-09-19 Sioptical, Inc. Wafer-level opto-electronic testing apparatus and method
US7142748B1 (en) * 2004-03-11 2006-11-28 New Span Opto-Technology, Inc. Optical waveguide evanescent ribbon coupler
EP2009416A1 (en) * 2007-06-29 2008-12-31 Interuniversitair Microelektronica Centrum Vzw Optical probe
US9234854B2 (en) 2013-03-15 2016-01-12 International Business Machines Corporation Single fiber noncritical-alignment wafer-scale optical testing
US9563018B2 (en) 2014-10-09 2017-02-07 International Business Machines Corporation Tapered photonic waveguide to optical fiber proximity coupler
US9759634B2 (en) 2015-09-14 2017-09-12 Seagate Technology Llc Coupling loss evaluation
US10429582B1 (en) 2018-05-02 2019-10-01 Globalfoundries Inc. Waveguide-to-waveguide couplers with multiple tapers
JP2019207305A (en) * 2018-05-29 2019-12-05 日本電信電話株式会社 Optical inspection circuit
US10436982B1 (en) 2018-07-18 2019-10-08 Globalfoundries Inc. Waveguide bends with field confinement
JP7259431B2 (en) * 2019-03-15 2023-04-18 富士通オプティカルコンポーネンツ株式会社 Optical device, optical module using same, and test method for optical device
JP2021182113A (en) * 2020-05-20 2021-11-25 株式会社日本マイクロニクス Optical probe, optical probe array, optical probe card, and method for manufacturing optical probe

Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864016A (en) 1972-04-10 1975-02-04 Gte Laboratories Inc Holographic fiber to waveguide coupler
US3912363A (en) 1974-01-29 1975-10-14 Rca Corp Optical fiber to planar waveguide coupler
US3938895A (en) * 1974-08-19 1976-02-17 Gte Laboratories Incorporated Method for positioning an optical fiber
US4097118A (en) * 1975-10-30 1978-06-27 Rca Corporation Optical waveguide coupler employing deformed shape fiber-optic core coupling portion
US4243297A (en) * 1979-06-27 1981-01-06 International Communications And Energy, Inc. Optical wavelength division multiplexer mixer-splitter
US4302267A (en) * 1980-02-20 1981-11-24 General Dynamics, Pomona Division Optical fiber mating apparatus and method
US4762386A (en) * 1986-09-02 1988-08-09 Amp Incorporated Optical fiber assembly including means utilizing a column load to compensate for thermal effects
US4773063A (en) 1984-11-13 1988-09-20 University Of Delaware Optical wavelength division multiplexing/demultiplexing system
US5185760A (en) * 1988-06-29 1993-02-09 Fraunhofer-Gessellschaft zur Forderung der angewandten Forschung e.V. Aerodynamic window for a gas laser
US5187760A (en) * 1992-01-23 1993-02-16 General Instrument Corporation Wavelength selective coupler for high power optical communications
US5222170A (en) * 1987-04-03 1993-06-22 Bt&D Technologies Ltd. Optical fiber device fabrication
US5321714A (en) 1992-12-14 1994-06-14 Xerox Corporation Reflection suppression in semiconductor diode optical switching arrays
US5355429A (en) * 1992-12-30 1994-10-11 Minnesota Mining And Manufacturing Company Optical fiber strain relief apparatus
US5585634A (en) * 1994-09-29 1996-12-17 Foster-Miller, Inc. Attenuated total reflectance sensing
US5631571A (en) * 1996-04-03 1997-05-20 The United States Of America As Represented By The Secretary Of The Air Force Infrared receiver wafer level probe testing
US5703980A (en) * 1996-09-20 1997-12-30 Northern Telecom Method for low-loss insertion of an optical signal from an optical fibre to a waveguide integrated on to a semiconductor wafer
US5892870A (en) * 1995-11-16 1999-04-06 Fiber Connections Inc. Fibre optic cable connector
US6028435A (en) * 1996-03-22 2000-02-22 Nec Corporation Semiconductor device evaluation system using optical fiber
US6243517B1 (en) 1999-11-04 2001-06-05 Sparkolor Corporation Channel-switched cross-connect
US6257771B1 (en) * 1996-10-17 2001-07-10 Advantest Corporation Opitcal/electrical hybrid wiring board and its manufacturing method
US6330388B1 (en) 1999-01-27 2001-12-11 Northstar Photonics, Inc. Method and apparatus for waveguide optics and devices
US6342166B1 (en) * 1998-12-10 2002-01-29 Nikon Corporation Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing
US20020063568A1 (en) * 2000-11-30 2002-05-30 Hung Henry H. Multi-device automated test station (MATS)
US20020164129A1 (en) * 2001-04-05 2002-11-07 Jackson Michael K. Optical fiber passive alignment fixture
US6489399B1 (en) 2000-07-31 2002-12-03 Molecular Optoelectronics Corp. Dye-appended polymers for broadband fiber optic devices
US20030020903A1 (en) * 2001-05-11 2003-01-30 Alfred Healy Method of aligning optical fibers to an IOC
US6542672B2 (en) 1999-06-01 2003-04-01 Picolight, Incorporated Opto-mechanical assembly
WO2003058190A1 (en) 2001-12-28 2003-07-17 Intel Corporation Method and apparatus for wafer level testing of integrated optical waveguide circuits
US6628860B1 (en) * 2000-06-05 2003-09-30 Infineon Technologies North America Corp. Fiber optic connector systems
US6684015B2 (en) 2001-12-28 2004-01-27 Intel Corporation Method of self-aligning optical waveguides
US6760500B2 (en) * 1999-06-25 2004-07-06 Kabushiki Kaisha Toshiba Optical wiring device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5228937A (en) * 1991-04-03 1993-07-20 National Brick Panel Systems, Inc. Method of making a brick panel

Patent Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864016A (en) 1972-04-10 1975-02-04 Gte Laboratories Inc Holographic fiber to waveguide coupler
US3912363A (en) 1974-01-29 1975-10-14 Rca Corp Optical fiber to planar waveguide coupler
US3938895A (en) * 1974-08-19 1976-02-17 Gte Laboratories Incorporated Method for positioning an optical fiber
US4097118A (en) * 1975-10-30 1978-06-27 Rca Corporation Optical waveguide coupler employing deformed shape fiber-optic core coupling portion
US4243297A (en) * 1979-06-27 1981-01-06 International Communications And Energy, Inc. Optical wavelength division multiplexer mixer-splitter
US4302267A (en) * 1980-02-20 1981-11-24 General Dynamics, Pomona Division Optical fiber mating apparatus and method
US4773063A (en) 1984-11-13 1988-09-20 University Of Delaware Optical wavelength division multiplexing/demultiplexing system
US4762386A (en) * 1986-09-02 1988-08-09 Amp Incorporated Optical fiber assembly including means utilizing a column load to compensate for thermal effects
US5222170A (en) * 1987-04-03 1993-06-22 Bt&D Technologies Ltd. Optical fiber device fabrication
US5185760A (en) * 1988-06-29 1993-02-09 Fraunhofer-Gessellschaft zur Forderung der angewandten Forschung e.V. Aerodynamic window for a gas laser
US5187760A (en) * 1992-01-23 1993-02-16 General Instrument Corporation Wavelength selective coupler for high power optical communications
US5321714A (en) 1992-12-14 1994-06-14 Xerox Corporation Reflection suppression in semiconductor diode optical switching arrays
US5355429A (en) * 1992-12-30 1994-10-11 Minnesota Mining And Manufacturing Company Optical fiber strain relief apparatus
US5585634A (en) * 1994-09-29 1996-12-17 Foster-Miller, Inc. Attenuated total reflectance sensing
US5892870A (en) * 1995-11-16 1999-04-06 Fiber Connections Inc. Fibre optic cable connector
US6028435A (en) * 1996-03-22 2000-02-22 Nec Corporation Semiconductor device evaluation system using optical fiber
US5631571A (en) * 1996-04-03 1997-05-20 The United States Of America As Represented By The Secretary Of The Air Force Infrared receiver wafer level probe testing
US5703980A (en) * 1996-09-20 1997-12-30 Northern Telecom Method for low-loss insertion of an optical signal from an optical fibre to a waveguide integrated on to a semiconductor wafer
US6257771B1 (en) * 1996-10-17 2001-07-10 Advantest Corporation Opitcal/electrical hybrid wiring board and its manufacturing method
US6342166B1 (en) * 1998-12-10 2002-01-29 Nikon Corporation Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing
US6330388B1 (en) 1999-01-27 2001-12-11 Northstar Photonics, Inc. Method and apparatus for waveguide optics and devices
US6542672B2 (en) 1999-06-01 2003-04-01 Picolight, Incorporated Opto-mechanical assembly
US6760500B2 (en) * 1999-06-25 2004-07-06 Kabushiki Kaisha Toshiba Optical wiring device
US6243517B1 (en) 1999-11-04 2001-06-05 Sparkolor Corporation Channel-switched cross-connect
US6628860B1 (en) * 2000-06-05 2003-09-30 Infineon Technologies North America Corp. Fiber optic connector systems
US6489399B1 (en) 2000-07-31 2002-12-03 Molecular Optoelectronics Corp. Dye-appended polymers for broadband fiber optic devices
US20020063568A1 (en) * 2000-11-30 2002-05-30 Hung Henry H. Multi-device automated test station (MATS)
US20020164129A1 (en) * 2001-04-05 2002-11-07 Jackson Michael K. Optical fiber passive alignment fixture
US20030020903A1 (en) * 2001-05-11 2003-01-30 Alfred Healy Method of aligning optical fibers to an IOC
WO2003058190A1 (en) 2001-12-28 2003-07-17 Intel Corporation Method and apparatus for wafer level testing of integrated optical waveguide circuits
US6684015B2 (en) 2001-12-28 2004-01-27 Intel Corporation Method of self-aligning optical waveguides
US6859587B2 (en) * 2001-12-28 2005-02-22 Intel Corporation Method and apparatus for wafer level testing of integrated optical waveguide circuits

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140203830A1 (en) * 2013-01-24 2014-07-24 Samsung Electronics Co., Ltd. Test system and method for wafer including optical component
US9297849B2 (en) * 2013-01-24 2016-03-29 Samsung Electronics Co., Ltd. Test system and method for wafer including optical component

Also Published As

Publication number Publication date
US6859587B2 (en) 2005-02-22
TW200304000A (en) 2003-09-16
US20030123804A1 (en) 2003-07-03
WO2003058190A1 (en) 2003-07-17
AU2002351294A1 (en) 2003-07-24
US20050100266A1 (en) 2005-05-12
TWI250322B (en) 2006-03-01

Similar Documents

Publication Publication Date Title
US7386197B2 (en) Method and apparatus for wafer level testing of integrated optical waveguide circuits
US7020363B2 (en) Optical probe for wafer testing
US10042131B1 (en) Architecture for silicon photonics enabling wafer probe and test
CN107430245B (en) Multi-port optical probe for photonic IC characterization and packaging
CA2558483C (en) Wafer-level opto-electronic testing apparatus and method
JP7177496B2 (en) Integrated Optical Probe Card and System for Batch Testing of Optical MEMS Structures with In-Plane Optical Axis Using Micro-Optical Bench Components
CN100570386C (en) Wafer-level opto-electronic testing apparatus and method
JP2021060569A (en) Test device and heterogeneously integrated structure
US20230384520A1 (en) Managing characterization of optical couplers in an integrated circuit
CN115980090A (en) Chip and testing method thereof
TWI773248B (en) Semiconductor structures and methods of forming the same
Huang et al. Robust edge coupling probe applied in wafer-level optical testing
CN110161634A (en) The method of photoelectric chip and the photonic circuit for testing this chip
US20230314274A1 (en) Optical receiver photodiode testing using test optical terminal at different location than operational optical terminal
WO2023042320A1 (en) Testing optical circuit and method for manufacturing optical circuit chip
JPS58196434A (en) Inspector for end faces of optical fiber

Legal Events

Date Code Title Description
FPAY Fee payment

Year of fee payment: 4

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20160610