US4754430A - Memory cell with dual collector, active load transistors - Google Patents
Memory cell with dual collector, active load transistors Download PDFInfo
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- US4754430A US4754430A US06/943,986 US94398686A US4754430A US 4754430 A US4754430 A US 4754430A US 94398686 A US94398686 A US 94398686A US 4754430 A US4754430 A US 4754430A
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/411—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using bipolar transistors only
- G11C11/4116—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using bipolar transistors only with at least one cell access via separately connected emittors of said transistors or via multiple emittors, e.g. T2L, ECL
Definitions
- This invention relates to solid state memory cells wherein cross coupled bipolar switching transistors utilize dual collector bipolar transistors as active loads.
- FIG. 1 shows an active load bipolar RAM memory cell 10 referred to as a complementary transistor switch (CTS) cell.
- CTS complementary transistor switch
- bipolar switching transistors 12 and 14 each have their bases connected to the collector of the other switching transistor.
- Transistors 12 and 14 employ bipolar transistors 16 and 18, respectively, as active loads.
- Two read/write Schottky diodes 20 and 22, and anti-saturation clamp Schottky diodes 24 and 26 complete cell 10.
- cell 10 is either in standby, read or write mode.
- load transistor 16 or 18 is conducting and diodes 20 and 22 are non-conducting.
- Excess switching transistor base current is directed through anti-saturation diode 24 or 26. This prevents a build-up of carriers in the bases of the switching transistors, thus preparing the cell for fast switching. It also improves the speed of the CTS cell as compared to a standard silicon controlled rectifier (SCR) cell where diodes 24 and 26 are not used.
- SCR silicon controlled rectifier
- the load transistors are off. Current is supplied to the switching transistors only through the bit lines. For a write, the selected bit line voltage is raised sufficiently to flip the direction of current flow in the switching transistors.
- a merged transistor layout is employed where the same doped region is used for two different transistors where possible (e.g., the base of transistor 12 is the collector of transistor 16). This, along with the absence of resistors in the cell, results in a very compact structure.
- Schottky diodes 20 and 22 must remain on (i.e. be forward biased) in the standby mode. This reduces the voltage differential of the cell thereby reducing noise margins. Further, the dependence on reliable Schottky diodes increases processing difficulties.
- a memory cell which retains the advantages of the CTS cell yet affords improved noise margins and does not employ Schottky diodes is highly desirable.
- a solid state memory cell includes two cross coupled npn switching transistors, and two pnp active load transistors. Each active load transistor has two collectors. In each load transistor, one of the collectors is directly connected to the base. The additional collector in the load transistors acts as an additional current source for the collector of one of the switching transistors. The result is less heavily saturated switching transistors and a faster operating cell than a cell where the load transistors have only one collector.
- FIG. 1 is a schematic of a related art, CTS memory cell.
- FIG. 2 is a schematic of the memory cell of the present invention.
- FIG. 3 is a schematic of a master-slave flip-flop which utilizes the present invention.
- FIG. 4 is a sectional view of a monolithic IC implementation of half of the memory cell of the present invention.
- Memory cell 28 incorporates the present invention, and includes first and second pnp bipolar active load transistors T 1 and T 2 , and first and second npn bipolar switching transistors T 3 and T 4 .
- Cell 28 is configured in FIG. 2 as a RAM cell for illustrative purposes.
- Transistor T 1 has two collectors (i.e., 38 and 40), as does transistor T 2 (i.e. 42 and 44).
- Collector 40 of T 1 is directly connected to the base 46 of T 1
- collector 44 of T 2 is directly connected to the base 48 of T 2 .
- merged transistor configurations are employed to form T 1 and T 3 , and to form T 2 and T 4 .
- the collector 50 of T 3 is also the base 46 of T 1 and the base 52 of T 3 is also collector 38 of T 1 .
- the collector 54 of T 4 is also the base 48 off T 2 and the base 56 of T 4 is also collector 42 of T 2 .
- the first emitter 60 of T 3 is directly connected to the first emitter 62 of T 4 at node 64. Node 64 in turn is connected to standby line 66.
- Cell 28 is completed by the cross coupling of base 52 of T 3 to collector 54 of T 4 (i.e., by conductive line 80), and of base 56 of T 4 to collector 50 of T 3 (i.e., by conductive line 82).
- T 1 , T 2 , T 3 and T 4 provide a bistable, regenerative circuit.
- cell 28 connects to left and right bit lines 68 and 70, by way of second emitters 72 and 74 of T 3 and T 4 , respectively.
- cell 28 connects to left and right bit lines 68 and 70 by way of diodes (preferrably Schottky diodes) 76 and 78.
- diodes preferrably Schottky diodes
- cell 28 operates in one of three modes--standby, read or write. In each mode only "one-half" of cell 28 will be conducting, the other half will be nonconducting. T 1 and T 3 form one half of cell 28, T 2 and T 4 the other half.
- the wordline voltage is low and the voltage on both bit lines is high.
- Current is drawn by standby line 66 from wordline 36 through, for example, T 2 and T 4 (i.e., T 2 and T 4 are each on, and T 1 and T 3 are each off).
- the current flows primarily through emitter 62 of T 4 with little, if any, current through emitter 74 to bit line 70.
- the collector current of T 4 is provided by both the base 48 of T 2 and the second collector 44 of T 2 .
- the base current of T 4 is provided solely from the first collector 42 of T 2 . If the second collector 44 of T 2 were not present, the collector current of T 4 would equal the base current of T 2 , and the base current of T 4 would equal the collector current of T 2 . In that case, both T 2 and T 4 would be heavily saturated, resulting in relatively slow transistor switching and slow cell operation.
- the base current of T 2 is less than the collector current of T 4 .
- the less heavily saturated transistor T 4 can switch faster and cell 28 can operate faster than a cell without the second collector.
- the same speed advantage will hold true for T 3 if the left half of cell 28 were conducting instead of the right half.
- the wordline voltage is raised.
- the voltage on the bit line connected to the conducting side of cell 28 will be high, and the voltage on the other bit line will be low.
- Substantial current will now be drawn through both emitters 62 and 74 of T 4 .
- the wordline voltage will be raised from the standby voltage and (for the case where initially T 2 and T 4 are conducting) the voltage on the left bit line 68 lowered to below its read voltage.
- T 2 and T 4 will switch off, T 1 and T 3 will switch on, and current will flow from wordline 36 to bit line 68 through emitter 72 of T 3 .
- Emitter 60 of T 3 will then conduct.
- Cell 28 as implemented in FIG. 4 includes parasitic vertical pnp transistors T6 and T8 in each of the two halves of the cell.
- emitter 90 of T6 is the base 56 of T4 and collector 42 of T2.
- Base 92 of T6 is the collector 54 of T4 and base 48 of T2.
- Collector 94 of T6 is the substrate, 88.
- emitter 96 is the emitter 32 of T2
- base 98 is collector 54 of T4 and base 48 of T2
- collector 100 is the substrate, 88.
- These transistors (T6 and T8) are also present in similar implementations of a CTS cell or standard SCR cell.
- transistors T6 and T8 are conducting in the half of the cell which is conducting.
- the collector current for T6 and T8 goes into the substrate, resulting in wasted power and slower cell operation. It is desirable to minimize this current into the substrate to reduce power dissipation and increase write speed for the cell.
- both the load transistor and the switching transistor which are conducting are heavily saturated. This results in large base-emitter voltages on T6 and T8.
- the load and switching devices are less heavily saturated, so the base-emitter voltages on T6 and T8 are lower and less current is wasted into the substrate.
- the present invention can also be employed as a memory cell of a register.
- An example of a master-slave flip-flop register using two cells 84 and 86 of the present invention is shown in FIG. 3. Corresponding transistors between FIGS. 2 and 3 are like-labelled. Note that the flip-flop includes resistors R 1 , R 2 and R 3 . It functions with input signals IN and INB (where INB is the complement of IN), clock signals CP and CPN (where CPN is the complement of CP), voltage reference VR, voltage supply VCC and outputs OUT and OUTB (where OUTB is the complement of OUT).
- the cell voltage differential is increased because there is no Schottky diode clamping the base-collector voltage of the npn switching transistors T3 and T4. In turn, noise margin is increased making the cell more resistant to soft errors such as errors due to particle radiation.
- FIG. 4 shows a sectional view of one half of cell 28, with corresponding structure between FIGS. 2 and 4 like-numbered.
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- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Static Random-Access Memory (AREA)
Abstract
A memory cell includes two active load, pnp transistors, and two npn switching transistors. The collector and base regions of the switching transistors are cross coupled. Each of the load transistors have two collectors, with the base of each load transistor directly connected to only one of its two collectors. The additional collector prevents the switching transistors from heavily saturating and thus increases the speed of operation of the cell.
Description
1. Field of the Invention
This invention relates to solid state memory cells wherein cross coupled bipolar switching transistors utilize dual collector bipolar transistors as active loads.
2. Related Art
FIG. 1 shows an active load bipolar RAM memory cell 10 referred to as a complementary transistor switch (CTS) cell. Therein bipolar switching transistors 12 and 14 each have their bases connected to the collector of the other switching transistor. Transistors 12 and 14 employ bipolar transistors 16 and 18, respectively, as active loads. Two read/write Schottky diodes 20 and 22, and anti-saturation clamp Schottky diodes 24 and 26 complete cell 10.
In operation, cell 10 is either in standby, read or write mode. In standby, load transistor 16 or 18 is conducting and diodes 20 and 22 are non-conducting. Excess switching transistor base current is directed through anti-saturation diode 24 or 26. This prevents a build-up of carriers in the bases of the switching transistors, thus preparing the cell for fast switching. It also improves the speed of the CTS cell as compared to a standard silicon controlled rectifier (SCR) cell where diodes 24 and 26 are not used.
During a read or write operation, the load transistors are off. Current is supplied to the switching transistors only through the bit lines. For a write, the selected bit line voltage is raised sufficiently to flip the direction of current flow in the switching transistors.
The use of an active load affords a nonlinear voltage response to current injected into the load transistors. Thus, less current is needed to operate the cell than cells employing linear resistors as the load.
A merged transistor layout is employed where the same doped region is used for two different transistors where possible (e.g., the base of transistor 12 is the collector of transistor 16). This, along with the absence of resistors in the cell, results in a very compact structure.
Despite the many advantages of the CTS cell, disadvantages remain. Schottky diodes 20 and 22 must remain on (i.e. be forward biased) in the standby mode. This reduces the voltage differential of the cell thereby reducing noise margins. Further, the dependence on reliable Schottky diodes increases processing difficulties.
A memory cell which retains the advantages of the CTS cell yet affords improved noise margins and does not employ Schottky diodes is highly desirable.
A solid state memory cell includes two cross coupled npn switching transistors, and two pnp active load transistors. Each active load transistor has two collectors. In each load transistor, one of the collectors is directly connected to the base. The additional collector in the load transistors acts as an additional current source for the collector of one of the switching transistors. The result is less heavily saturated switching transistors and a faster operating cell than a cell where the load transistors have only one collector.
FIG. 1 is a schematic of a related art, CTS memory cell.
FIG. 2 is a schematic of the memory cell of the present invention.
FIG. 3 is a schematic of a master-slave flip-flop which utilizes the present invention.
FIG. 4 is a sectional view of a monolithic IC implementation of half of the memory cell of the present invention.
Memory cell 28 (FIG. 2) incorporates the present invention, and includes first and second pnp bipolar active load transistors T1 and T2, and first and second npn bipolar switching transistors T3 and T4. Cell 28 is configured in FIG. 2 as a RAM cell for illustrative purposes.
The emitters 30 and 32 of T1 and T2 are connected at node 34 which leads to wordline 36. Transistor T1 has two collectors (i.e., 38 and 40), as does transistor T2 (i.e. 42 and 44). Collector 40 of T1 is directly connected to the base 46 of T1, and collector 44 of T2 is directly connected to the base 48 of T2.
Preferably, merged transistor configurations are employed to form T1 and T3, and to form T2 and T4. Thus, the collector 50 of T3 is also the base 46 of T1 and the base 52 of T3 is also collector 38 of T1. Likewise, the collector 54 of T4 is also the base 48 off T2 and the base 56 of T4 is also collector 42 of T2. The first emitter 60 of T3 is directly connected to the first emitter 62 of T4 at node 64. Node 64 in turn is connected to standby line 66.
The above described connections of T1, T2, T3 and T4 provide a bistable, regenerative circuit.
In one RAM cell configuration; cell 28 connects to left and right bit lines 68 and 70, by way of second emitters 72 and 74 of T3 and T4, respectively. In an alternative RAM cell configuration, cell 28 connects to left and right bit lines 68 and 70 by way of diodes (preferrably Schottky diodes) 76 and 78. The operation of cell 28 as RAM cell will be described below with regard only to the first configuration.
In the example of a RAM cell, cell 28 operates in one of three modes--standby, read or write. In each mode only "one-half" of cell 28 will be conducting, the other half will be nonconducting. T1 and T3 form one half of cell 28, T2 and T4 the other half.
In the standby mode, the wordline voltage is low and the voltage on both bit lines is high. Current is drawn by standby line 66 from wordline 36 through, for example, T2 and T4 (i.e., T2 and T4 are each on, and T1 and T3 are each off). The current flows primarily through emitter 62 of T4 with little, if any, current through emitter 74 to bit line 70. The collector current of T4 is provided by both the base 48 of T2 and the second collector 44 of T2. The base current of T4 is provided solely from the first collector 42 of T2. If the second collector 44 of T2 were not present, the collector current of T4 would equal the base current of T2, and the base current of T4 would equal the collector current of T2. In that case, both T2 and T4 would be heavily saturated, resulting in relatively slow transistor switching and slow cell operation.
However, with the second collector 44, the base current of T2 is less than the collector current of T4. This increases the collector to base current ratio (i.e., βF) of T4, which means that T4 is not as heavily saturated. The less heavily saturated transistor T4 can switch faster and cell 28 can operate faster than a cell without the second collector. Of course, the same speed advantage will hold true for T3 if the left half of cell 28 were conducting instead of the right half.
To read cell 28, the wordline voltage is raised. The voltage on the bit line connected to the conducting side of cell 28 will be high, and the voltage on the other bit line will be low. Substantial current will now be drawn through both emitters 62 and 74 of T4.
To write in cell 28, the wordline voltage will be raised from the standby voltage and (for the case where initially T2 and T4 are conducting) the voltage on the left bit line 68 lowered to below its read voltage. T2 and T4 will switch off, T1 and T3 will switch on, and current will flow from wordline 36 to bit line 68 through emitter 72 of T3. Emitter 60 of T3 will then conduct.
For cell 28, the CTS cell and a standard SCR cell, transistors T6 and T8 are conducting in the half of the cell which is conducting. The collector current for T6 and T8 goes into the substrate, resulting in wasted power and slower cell operation. It is desirable to minimize this current into the substrate to reduce power dissipation and increase write speed for the cell.
In a standard SCR cell, both the load transistor and the switching transistor which are conducting are heavily saturated. This results in large base-emitter voltages on T6 and T8. For both cell 28 and the CTS cell, the load and switching devices are less heavily saturated, so the base-emitter voltages on T6 and T8 are lower and less current is wasted into the substrate.
The present invention can also be employed as a memory cell of a register. An example of a master-slave flip-flop register using two cells 84 and 86 of the present invention is shown in FIG. 3. Corresponding transistors between FIGS. 2 and 3 are like-labelled. Note that the flip-flop includes resistors R1, R2 and R3. It functions with input signals IN and INB (where INB is the complement of IN), clock signals CP and CPN (where CPN is the complement of CP), voltage reference VR, voltage supply VCC and outputs OUT and OUTB (where OUTB is the complement of OUT).
Note in cell 28 that the desirable features of the CTS cell (i.e., active load, use of merged transistors, lower substrate current and faster operation than the standard SCR cell) have been retained, yet the cell voltage differential is increased and Schottky diodes are not relied upon.
The cell voltage differential is increased because there is no Schottky diode clamping the base-collector voltage of the npn switching transistors T3 and T4. In turn, noise margin is increased making the cell more resistant to soft errors such as errors due to particle radiation.
Further, cell manufacturing is simplified without the need to form Schottky diodes, thus yield is increased.
FIG. 4 shows a sectional view of one half of cell 28, with corresponding structure between FIGS. 2 and 4 like-numbered.
The uses of the memory cell of the present invention have been given merely by way of example, the scope of the invention being defined solely by the claims.
Claims (7)
1. A solid state memory cell comprising first and second active load, pnp transistors, each of said load transistors having a base, an emitter and first and second collectors, wherein the first collector of said first load transistor is directly connected to the base of said first load transistor, and the first collector of said second load transistor is directly connected to the base of said second load transistor, and wherein the emitters of said load transistors are connected to a first node; and
first and second switching, npn transistors, each of said switching transistors having a base, a first emitter and a collector, wherein the second collector of said first load transistor is connected to the base of said first switching transistor and to the collector of said second switching transistor, and the second collector of said second load transistor is connected to the base of said second switching transistor and to the collector of said first switching transistor, wherein the base of said first load transistor is connected to the collector of said first switching transistor, and the base of said second load transistor is connected to the collector of said second switching transistor, and wherein the first emitters of said switching transistors are connected at a second node.
2. The cell of claim 1 further including a first Schottky diode having an anode and a cathode, with the cathode of said first Schottky diode connected to the collector of said first switching transistor, and a second Schottky diode having an anode and a cathode, with the cathode of said second Schottky diode connected to the collector of said second switching transistor.
3. The cell of claim 1 wherein the base of said first load transistor is also the collector of said first switching transistor, the base of said first switching transistor is also the second collector of the first load transistor, the base of said second load transistor is also the collector of said second switching transistor, and the base of said second switching transistor is also the second collector of the second load transistor.
4. The cell of claim 1 wherein said cell is part of a random access memory.
5. The cell of claim 1 wherein said cell is part of a flip-flop.
6. The cell of claim 1 further including a second emitter for each of said switching transistors.
7. The cell of claim 6 further including a conductive wordline, conductive standby line, and first and second conductive bit lines, wherein said wordline is connected to said first node, said standby line is connected to said second node, said first bitline is connected to the second emitter of said first switching transistor and the second bitline is connected to the second emitter of said second switching transistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/943,986 US4754430A (en) | 1986-12-18 | 1986-12-18 | Memory cell with dual collector, active load transistors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/943,986 US4754430A (en) | 1986-12-18 | 1986-12-18 | Memory cell with dual collector, active load transistors |
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| US4754430A true US4754430A (en) | 1988-06-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| US06/943,986 Expired - Lifetime US4754430A (en) | 1986-12-18 | 1986-12-18 | Memory cell with dual collector, active load transistors |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4858181A (en) * | 1987-07-07 | 1989-08-15 | Texas Instruments Incorporated | Fast recovery PNP loaded bipolar static RAM memory cell with an independent current path |
| US4922411A (en) * | 1988-12-27 | 1990-05-01 | Atmel Corporation | Memory cell circuit with supplemental current |
| US5016214A (en) * | 1987-01-14 | 1991-05-14 | Fairchild Semiconductor Corporation | Memory cell with separate read and write paths and clamping transistors |
| US5020027A (en) * | 1990-04-06 | 1991-05-28 | International Business Machines Corporation | Memory cell with active write load |
| US5040145A (en) * | 1990-04-06 | 1991-08-13 | International Business Machines Corporation | Memory cell with active write load |
| US5091881A (en) * | 1989-06-13 | 1992-02-25 | Atmel Corporation | Multiple port memory including merged bipolar transistors |
| WO2016049581A1 (en) * | 2014-09-25 | 2016-03-31 | Kilopass Technology, Inc. | Cross-coupled thyristor sram circuits and methods of operation |
| WO2016049594A1 (en) * | 2014-09-25 | 2016-03-31 | Kilopass Technology, Inc. | Two-transistor sram semiconductor structure and methods of fabrication |
| WO2016049599A1 (en) * | 2014-09-25 | 2016-03-31 | Kilopass Technology, Inc. | Write assist sram circuits and methods of operation |
| US9564199B2 (en) | 2014-09-25 | 2017-02-07 | Kilopass Technology, Inc. | Methods of reading and writing data in a thyristor random access memory |
| US9564441B2 (en) | 2014-09-25 | 2017-02-07 | Kilopass Technology, Inc. | Two-transistor SRAM semiconductor structure and methods of fabrication |
| US9741413B2 (en) | 2014-09-25 | 2017-08-22 | Kilopass Technology, Inc. | Methods of reading six-transistor cross-coupled thyristor-based SRAM memory cells |
| US9837418B2 (en) | 2014-09-25 | 2017-12-05 | Kilopass Technology, Inc. | Thyristor volatile random access memory and methods of manufacture |
| US10090037B2 (en) | 2014-09-25 | 2018-10-02 | Tc Lab, Inc. | Methods of retaining and refreshing data in a thyristor random access memory |
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| US4538244A (en) * | 1983-12-29 | 1985-08-27 | Fujitsu Limited | Semiconductor memory device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4538244A (en) * | 1983-12-29 | 1985-08-27 | Fujitsu Limited | Semiconductor memory device |
Cited By (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5016214A (en) * | 1987-01-14 | 1991-05-14 | Fairchild Semiconductor Corporation | Memory cell with separate read and write paths and clamping transistors |
| US4858181A (en) * | 1987-07-07 | 1989-08-15 | Texas Instruments Incorporated | Fast recovery PNP loaded bipolar static RAM memory cell with an independent current path |
| US4922411A (en) * | 1988-12-27 | 1990-05-01 | Atmel Corporation | Memory cell circuit with supplemental current |
| US5091881A (en) * | 1989-06-13 | 1992-02-25 | Atmel Corporation | Multiple port memory including merged bipolar transistors |
| US5020027A (en) * | 1990-04-06 | 1991-05-28 | International Business Machines Corporation | Memory cell with active write load |
| US5040145A (en) * | 1990-04-06 | 1991-08-13 | International Business Machines Corporation | Memory cell with active write load |
| US9613968B2 (en) | 2014-09-25 | 2017-04-04 | Kilopass Technology, Inc. | Cross-coupled thyristor SRAM semiconductor structures and methods of fabrication |
| CN106537507B (en) * | 2014-09-25 | 2018-06-19 | 克劳帕斯科技有限公司 | Cross-linked thyristor SRAM circuit and operating method |
| WO2016049599A1 (en) * | 2014-09-25 | 2016-03-31 | Kilopass Technology, Inc. | Write assist sram circuits and methods of operation |
| US9449669B2 (en) | 2014-09-25 | 2016-09-20 | Kilopass Technology, Inc. | Cross-coupled thyristor SRAM circuits and methods of operation |
| US9564199B2 (en) | 2014-09-25 | 2017-02-07 | Kilopass Technology, Inc. | Methods of reading and writing data in a thyristor random access memory |
| US9564198B2 (en) | 2014-09-25 | 2017-02-07 | Kilopass Technology, Inc. | Six-transistor SRAM semiconductor structures and methods of fabrication |
| US9564441B2 (en) | 2014-09-25 | 2017-02-07 | Kilopass Technology, Inc. | Two-transistor SRAM semiconductor structure and methods of fabrication |
| CN106537507A (en) * | 2014-09-25 | 2017-03-22 | 克劳帕斯科技有限公司 | Cross-coupled thyristor SRAM circuits and methods of operation |
| WO2016049581A1 (en) * | 2014-09-25 | 2016-03-31 | Kilopass Technology, Inc. | Cross-coupled thyristor sram circuits and methods of operation |
| US9741413B2 (en) | 2014-09-25 | 2017-08-22 | Kilopass Technology, Inc. | Methods of reading six-transistor cross-coupled thyristor-based SRAM memory cells |
| US9748223B2 (en) | 2014-09-25 | 2017-08-29 | Kilopass Technology, Inc. | Six-transistor SRAM semiconductor structures and methods of fabrication |
| US9837418B2 (en) | 2014-09-25 | 2017-12-05 | Kilopass Technology, Inc. | Thyristor volatile random access memory and methods of manufacture |
| US9899389B2 (en) | 2014-09-25 | 2018-02-20 | Kilopass Technology, Inc. | Two-transistor SRAM semiconductor structure and methods of fabrication |
| WO2016049594A1 (en) * | 2014-09-25 | 2016-03-31 | Kilopass Technology, Inc. | Two-transistor sram semiconductor structure and methods of fabrication |
| US10020043B2 (en) | 2014-09-25 | 2018-07-10 | Tc Lab, Inc. | Methods of reading and writing data in a thyristor random access memory |
| US10056389B2 (en) | 2014-09-25 | 2018-08-21 | Kilopass Technology, Inc. | Cross-coupled thyristor SRAM semiconductor structures and methods of fabrication |
| US10090037B2 (en) | 2014-09-25 | 2018-10-02 | Tc Lab, Inc. | Methods of retaining and refreshing data in a thyristor random access memory |
| US10283185B2 (en) | 2014-09-25 | 2019-05-07 | Tc Lab, Inc. | Write assist thyristor-based SRAM circuits and methods of operation |
| US10332886B2 (en) | 2014-09-25 | 2019-06-25 | Tc Lab, Inc. | Thyristor volatile random access memory and methods of manufacture |
| US10381063B2 (en) | 2014-09-25 | 2019-08-13 | Tc Lab, Inc. | Methods of reading and writing data in a thyristor random access memory |
| US10438952B2 (en) | 2014-09-25 | 2019-10-08 | Tc Lab, Inc. | Method of writing into and refreshing a thyristor volatile random access memory |
| US10460789B2 (en) | 2014-09-25 | 2019-10-29 | Tc Lab, Inc. | Methods of reading and writing data in a thyristor random access memory |
| US10529718B2 (en) | 2014-09-25 | 2020-01-07 | Tc Lab, Inc. | Thyristor volatile random access memory and methods of manufacture |
| US10553588B2 (en) | 2014-09-25 | 2020-02-04 | Tc Lab, Inc. | Thyristor volatile random access memory and methods of manufacture |
| US11114438B2 (en) | 2014-09-25 | 2021-09-07 | Tc Lab, Inc. | Thyristor volatile random access memory and methods of manufacture |
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