US3681929A - Thermoelectric device - Google Patents

Thermoelectric device Download PDF

Info

Publication number
US3681929A
US3681929A US95728A US3681929DA US3681929A US 3681929 A US3681929 A US 3681929A US 95728 A US95728 A US 95728A US 3681929D A US3681929D A US 3681929DA US 3681929 A US3681929 A US 3681929A
Authority
US
United States
Prior art keywords
thermoelectric device
warm
peltier block
cold sides
crystalline particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US95728A
Inventor
Hans Schering
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of US3681929A publication Critical patent/US3681929A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof

Definitions

  • Thermoelectric device includes at least one Peltier block formed of a plurality of n and p-conductive semiconductor legs and metallic bridge members interconnecting the legs at opposite warm and cold sides of the Peltier block, heat exchanger means located respectively at the warm and the cold sides of the Peltier block and having a surface disposed adjacent a surface of the bridge members located at the warm and the cold sides respectively of the Peltier block, and an intermediate layer of solid insulating material and deformable medium for improving heat transfer sandwiched between the surfaces at the warm and the cold sides respectively of the Peltier block, the insulating material being in the form
  • thermoelectric device having at least one Peltier block formed of a plurality of n and p-conductive semiconductor legs and metallic bridge members interconnecting the legs at opposite warm and cold sides respectively of the Peltier block, and having a surface disposed adjacent a surface of the bridge members located at the warm and cold sides respectively of the Peltier block, and an intermediate layer of solid insulating material and deformable medium for improving heat transfer, sandwiched between the surfaces at the warm and the cold sides respectively of the Peltier block.
  • Peltier blocks are constructed so that the n and p-conductive semiconductor legs are traversed in a meandering manner by electrical current.
  • the metallic bridge members between the semiconductor legs of the Peltier block are provided with respective opposite surfaces, on of which is located at the cold and the other at the warm side of the Peltier block.
  • Both sides of the Peltier block are usually provided with heat exchanger devices in order to dissipate heat produced at the warm side thereof to the surroundings or to a cooling medium and in order to absorb heat from the surroundings at the cold side of the Peltier block or to cool a warm medium thereat.
  • the metallic bridge members at one side of the Peltier block have different potentials from one another, electrical insulation is required to be located between them and the heat exchanger element adjacent thereto, so as to prevent a short circuit through the metallic heat exchanger element.
  • electrical insulation causes temperature drop between the respective sides of the Peltier block and the respective surface of the heat exchanger elements located adjacent thereto. This is undesirable from the standpoint of optimum utility of the temperature difference that is available between the Peltier block and the respective heat exchanger elements.
  • heat exchanger element foils such as mica foil or foils of plastic material, for example, between the Peltier blocks and the respective heat exchanger elements, the foils being of solid insulating material which electrically insulates the metallic bridge members from the respective surfaces of the heat exchanger element.
  • auxiliary pasty or soft masses can be applied between the Peltier block on the one hand and the heat exchanger element on the other hand for filling in unevenesses and roughness depths of the surfaces.
  • thermoelectric device Even when great care is taken, it is possible to damage the electrically insulating foil, i.e. to rupture or tear the mica or plastic material foil, during the manufacture of the thennoelectric device, rendering the thermoelectric device unserviceable.
  • the aforedescribed heretofore known type of assembly has the advantage that the connecting bridge members, on the one hand, and the heat exchanger elements, on the other hand, can be selected without being concerned with the different coefficients or expansions of the material thereof, but only with the electrical and thermal conductivity thereof. It is especially desired that the surfaces be movable relative to one another so that the metallic bridge members and the'semiconductor legs rigidly connected thereto, are not additionally stressed mechanically.
  • thermoelectric device which avoids the disadvantages of the greater number of heretofore known types of thermoelectric devices and which is an improvement over the last mentioned advantageous type of thermoelectric device.
  • thermoelectric device comprising at least one Peltier block formed of a plurality of n and p-conductive semiconductorlegs and metallic bridge members interconnecting the legs at opposite warm and cold sides of the Peltier block, heat exchanger means located respectively at the warm and the cold sides of the Peltier block and having a surface disposed adjacent a surface of the bridge members located at the warm and the cold sides respectively of the Peltier block, and an intermediate layer of solid insulating material and deformable medium for improving heat transfer sandwiched between the surfaces at the warm and the cold sides respectively of the Peltier block, the insulating material being in the form of crystalline particles having a grain diameter exceeding the sum of the roughness depths of the surfaces between which the respective intermediate layer is sandwiched.
  • the crystalline particles Due to the stated dimensions of the crystalline particles, a minimum spacing between the surfaces to be electrically insulated is established.
  • the advantages of good heat transfer and high mechanical stability are provided by the crystalline structure of the insulating material.
  • metallic oxides such as berryllium oxide, alurninum oxide and quartz, having desirable coefficients of therrnoconductivity have sufficiently high electrically insulating characteristics are suitably employed as the crystalline particles.
  • the properties of thermal conductivity between the surfaces of the device of the invention is increased to the 10th power when the crystalline particles are formed of silicon carbide.
  • Silicon carbide in itself is an electrical conductor; however, by suitable pre-treatment or when stored for a very long time, an oxide skin or layer is formed on the silicon carbide crystals and has the necessary electrical insulation properties.
  • the crystalline particles consist of a multiplicity of substantially spherically shaped grains.
  • the particulate material is mixed with a carrier medium which is liquid at least when it is applied to the surfaces.
  • the carrier medium has an effective viscosity of greater than 100 centistoke when applied to the surfaces, and may be formed at least partly of silicone oil.
  • the carrier medium for the particulate material is formed of at least one hardenable plastic material which is elastically yieldable and affords equalization of the varying expansion between the heat exchanger and the Peltier block.
  • the hardenable plastic material is, for example, artificial resins based on castor oil or ricinus oil-isocyanate(known in the an by the trademark Desmodur).
  • thermoelectric device thermoelectric device
  • FIG. 1 is an elevational view of there thermoelectric device of my invention, showing schematically a Peltier block located between two heat exchanger elements;
  • FIG. 2 is a much enlarged fragmentary sectional view of FIG. 1 enclosed within the circle Z thereof.
  • thermoelectric device in accordance with my invention, which is formed with a Peltier block 1 having a cold side 2 and a warm side 3, both sides being connected to heart exchanger elements 4.
  • the connections between the heat exchanger elements 4 and the Peltier block 1 are effected by non-illustrated clamping members which press the engagement surfaces 5 of the respective heat exchanger elements 4 against the warm and cold sides 2 and 3 of the Peltier block 1.
  • the heat exchanger elements 4 are provided with fins or ribs 6 through which an air current is passed for suitable warming or cooling the ribs or fins, as the case may be.
  • the Peltier block 1 is formed of a multiplicity of n and p-conductive semiconductor legs and metallic bridge members coordinated therewith, (only part of the one of the legs 1' and part of one bridge member 1" being shown in FIG. 2).
  • the Peltier block is not shown in detail in the drawing, since such devices are wellknown in the art.
  • the semiconductor legs are connected electrically in series so that an electric current traverses the semiconductor legs and the connecting metallic bridge members in a meandering or tortuous path.
  • the metallic bridge members are formed, for example, of copper, while the metallic heat exchanger elements 4 are formed of aluminum, for example.
  • Insulation 7 formed of crystalline particulate material is disposed or sandwiched between the surfaces 5 of heat exchanger elements 4 of the adjacent surfaces of the respective bridge members at the warm or cold side of the Peltier block 1.
  • the grain size or diameter a of the particles of the insulating material 7 exceeds the sum of the roughness depths b and b of the surfaces 3 and 5 respectively.
  • the particulate material 7 is at least partly pressed into the surfaces 3 and 5 that are being connected together.
  • the particulate material is mixed with a carrier medium 8 having good heat conductive properties.
  • the particulate material 7 which is formed, for example, of beryllium oxide, aluminum oxide, quartz or silicon carbide, is provided with as spherical a shape as possible in order to improve the flow properties of the intermediate layer sandwiched between the respective heat exchanger elements 4 of the Peltier block 1.
  • River sand for example, has this spherical shape.
  • the spherical shape can be produced, however, by polishing or grinding in a ball mill, for example.
  • the carrier medium 8 is advantageously in liquid state at least when applied to the surfaces 3 and 5 that are to be connected together.
  • the liquid carrier medium 8 advantageously has a viscosity of greater than centistoke.
  • the carrier medium is advantageous for the carrier medium to be formed of an elastic, yieldable and expandable plastic material which hardens after being applied to the surfaces 3 and 5, such as, for example, an artificial resin having a base of castor oil or ricinus oil isocyanate.
  • an artificial resin having a base of castor oil or ricinus oil isocyanate.
  • additional relatively smaller electrically insulating particles whose quantity and size is determined so that they fill the voids located between the particles of crystalline insulating material 7.
  • Thermoelectric device comprising at least one Peltier block formed of a plurality of n and p-conductive semiconductor legs and metallic bridge members interconnecting said legs at opposite warm and cold sides of said Peltier block, heat exchanger means located respectively at said warm and said cold sides of said Peltier block and having a surface disposed adjacent a surface of the bridge members located at said warm and said cold sides respectively of said Peltier block, and an intermediate layer of solid insulating material and deformable medium for improving heat transfer sandwiched between said surfaces at said warm and said cold sides respectively of said Peltier block, said insulating material being in the form of crystalline particles having a grain diameter exceeding the sum of the roughness depths of the surfaces between which the respective intermediate layer is sandwiched, and a carrier medium mixed with said crystalline particles, said carrier medium being in liquid state at least when initially applied to said surfaces of said bridge members and both of said heat exchanger means.
  • said crystalline particles comprise a multiplici- 5 wherein said carrier medium consists at least partly of silicone oil.
  • said carrier medium is formed at least partly of a hardening plastic material.
  • plastic material is a synthetic resin having a base of ricinus oil.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lubricants (AREA)

Abstract

Thermoelectric device includes at least one Peltier block formed of a plurality of n and p-conductive semiconductor legs and metallic bridge members interconnecting the legs at opposite warm and cold sides of the Peltier block, heat exchanger means located respectively at the warm and the cold sides of the Peltier block and having a surface disposed adjacent a surface of the bridge members located at the warm and the cold sides respectively of the Peltier block, and an intermediate layer of solid insulating material and deformable medium for improving heat transfer sandwiched between the surfaces at the warm and the cold sides respectively of the Peltier block, the insulating material being in the form of crystalline particles having a grain diameter exceeding the sum of the roughness depths of the surfaces between which the respective intermediate layer is sandwiched.

Description

Umted States Patent 1 3,681,929
Schering [4 Aug. 8, 1972 [54] THERMOELECTRIC DEVICE Primary Examiner-William J. Wye
[72] Inventor: Hans Schering Riensber t AttorneyCurt M. Avery Arthur E. wilfond, Herbert 1000 Berlin 20 Germany gs L. Lerner and Daniel J. TlCk [22] Filed: Dec. 7, 1970 [57] ABSTRACT 21 Appl. No.: 95,728
[30] Foreign Application Priority Data [1.8. Cl. ..62/3, 136/203, 136/204 Int. Cl ..F 25b 27/00 Field of Search ..136/203, 204; 62/3 [56] References Cited UNITED STATES PATENTS 7/ 1958 Lindenblad ..62/ 3 H1963 Elfving ..62/3 7/1965 Elfving ..62/ 3 Thermoelectric device includes at least one Peltier block formed of a plurality of n and p-conductive semiconductor legs and metallic bridge members interconnecting the legs at opposite warm and cold sides of the Peltier block, heat exchanger means located respectively at the warm and the cold sides of the Peltier block and having a surface disposed adjacent a surface of the bridge members located at the warm and the cold sides respectively of the Peltier block, and an intermediate layer of solid insulating material and deformable medium for improving heat transfer sandwiched between the surfaces at the warm and the cold sides respectively of the Peltier block, the insulating material being in the form of crystalline particles having a grain diameter exceeding the sum of the roughness depths of the surfaces between which the respective intermediate layer is sandwiched.
9 Claims, 2 Drawing Figures PATENTEflAus 8 I972 Fly. 1
Jill T777100 THERMOELECTRIC DEVICE My invention relates to thermoelectric device having at least one Peltier block formed of a plurality of n and p-conductive semiconductor legs and metallic bridge members interconnecting the legs at opposite warm and cold sides respectively of the Peltier block, and having a surface disposed adjacent a surface of the bridge members located at the warm and cold sides respectively of the Peltier block, and an intermediate layer of solid insulating material and deformable medium for improving heat transfer, sandwiched between the surfaces at the warm and the cold sides respectively of the Peltier block.
As a general rule, Peltier blocks are constructed so that the n and p-conductive semiconductor legs are traversed in a meandering manner by electrical current. The metallic bridge members between the semiconductor legs of the Peltier block are provided with respective opposite surfaces, on of which is located at the cold and the other at the warm side of the Peltier block. Both sides of the Peltier block are usually provided with heat exchanger devices in order to dissipate heat produced at the warm side thereof to the surroundings or to a cooling medium and in order to absorb heat from the surroundings at the cold side of the Peltier block or to cool a warm medium thereat.
Since the metallic bridge members at one side of the Peltier block have different potentials from one another, electrical insulation is required to be located between them and the heat exchanger element adjacent thereto, so as to prevent a short circuit through the metallic heat exchanger element. However, such electrical insulation causes temperature drop between the respective sides of the Peltier block and the respective surface of the heat exchanger elements located adjacent thereto. This is undesirable from the standpoint of optimum utility of the temperature difference that is available between the Peltier block and the respective heat exchanger elements.
It has been known to dispose heat exchanger element foils such as mica foil or foils of plastic material, for example, between the Peltier blocks and the respective heat exchanger elements, the foils being of solid insulating material which electrically insulates the metallic bridge members from the respective surfaces of the heat exchanger element. To improve heat transfer, auxiliary pasty or soft masses can be applied between the Peltier block on the one hand and the heat exchanger element on the other hand for filling in unevenesses and roughness depths of the surfaces.
Even when great care is taken, it is possible to damage the electrically insulating foil, i.e. to rupture or tear the mica or plastic material foil, during the manufacture of the thennoelectric device, rendering the thermoelectric device unserviceable.
With respect to other known embodiments of the thermoelectric device wherein a mechanically stable or reliable connection between the Peltier blocks and the heat exchanger elements is provided, the aforedescribed heretofore known type of assembly has the advantage that the connecting bridge members, on the one hand, and the heat exchanger elements, on the other hand, can be selected without being concerned with the different coefficients or expansions of the material thereof, but only with the electrical and thermal conductivity thereof. It is especially desired that the surfaces be movable relative to one another so that the metallic bridge members and the'semiconductor legs rigidly connected thereto, are not additionally stressed mechanically.
It is accordingly an object of the invention, to provide thermoelectric device which avoids the disadvantages of the greater number of heretofore known types of thermoelectric devices and which is an improvement over the last mentioned advantageous type of thermoelectric device.
VVrth the foregoing and other objects in view, 1 provide in accordance with my invention, thermoelectric device comprising at least one Peltier block formed of a plurality of n and p-conductive semiconductorlegs and metallic bridge members interconnecting the legs at opposite warm and cold sides of the Peltier block, heat exchanger means located respectively at the warm and the cold sides of the Peltier block and having a surface disposed adjacent a surface of the bridge members located at the warm and the cold sides respectively of the Peltier block, and an intermediate layer of solid insulating material and deformable medium for improving heat transfer sandwiched between the surfaces at the warm and the cold sides respectively of the Peltier block, the insulating material being in the form of crystalline particles having a grain diameter exceeding the sum of the roughness depths of the surfaces between which the respective intermediate layer is sandwiched.
Due to the stated dimensions of the crystalline particles, a minimum spacing between the surfaces to be electrically insulated is established. The advantages of good heat transfer and high mechanical stability are provided by the crystalline structure of the insulating material. In accordance with a further feature of the invention, metallic oxides, such as berryllium oxide, alurninum oxide and quartz, having desirable coefficients of therrnoconductivity have sufficiently high electrically insulating characteristics are suitably employed as the crystalline particles.
The properties of thermal conductivity between the surfaces of the device of the invention, is increased to the 10th power when the crystalline particles are formed of silicon carbide. Silicon carbide in itself is an electrical conductor; however, by suitable pre-treatment or when stored for a very long time, an oxide skin or layer is formed on the silicon carbide crystals and has the necessary electrical insulation properties.
In accordance with another feature of the invention, the crystalline particles consist of a multiplicity of substantially spherically shaped grains. The advantage thereof is that the desired flow characteristic between the surfaces which are to be thermally conductively connected, is increased.
In accordance with yet another feature of the invention, in order to increase the coefficient of heat transfer from the Peltier block to the heat exchanger, at least part of the crystalline particles is impressed into the surfaces that are being thermally connected.
In accordance with still another feature of the invention and in order to provide a simplified handling of the particulate material when applied to the surfaces that are to be thermally conductively connected, the particulate material is mixed with a carrier medium which is liquid at least when it is applied to the surfaces. Other added features of the invention are that the carrier medium has an effective viscosity of greater than 100 centistoke when applied to the surfaces, and may be formed at least partly of silicone oil.
In accordance with an additional feature of the invention, the carrier medium for the particulate material is formed of at least one hardenable plastic material which is elastically yieldable and affords equalization of the varying expansion between the heat exchanger and the Peltier block. In accordance with another, more specific feature of the invention, the hardenable plastic material is, for example, artificial resins based on castor oil or ricinus oil-isocyanate(known in the an by the trademark Desmodur).
Other features which are considered as characteristic for the invention are set forth in the appended claims.
Although the invention is illustrated and described herein as embodied in thermoelectric device, it is nevertheless not intended to be limited to the details shown, since various modifications and structural changes may be made therein without departing from the spirit of the invention and within the scope and range of equivalents of the claims.
The construction and method of operation of the invention, however, together with additional objects and advantages thereof, will be best understood from the following description of specific embodiments when read in connection with the accompanying drawing, in which:
FIG. 1 is an elevational view of there thermoelectric device of my invention, showing schematically a Peltier block located between two heat exchanger elements; and
FIG. 2 is a much enlarged fragmentary sectional view of FIG. 1 enclosed within the circle Z thereof.
Referring now to the drawing and more particularly to FIG. 1 thereof, there is shown therein a thermoelectric device in accordance with my invention, which is formed with a Peltier block 1 having a cold side 2 and a warm side 3, both sides being connected to heart exchanger elements 4. Ordinarily, the connections between the heat exchanger elements 4 and the Peltier block 1 are effected by non-illustrated clamping members which press the engagement surfaces 5 of the respective heat exchanger elements 4 against the warm and cold sides 2 and 3 of the Peltier block 1. The heat exchanger elements 4 are provided with fins or ribs 6 through which an air current is passed for suitable warming or cooling the ribs or fins, as the case may be.
The Peltier block 1 is formed of a multiplicity of n and p-conductive semiconductor legs and metallic bridge members coordinated therewith, (only part of the one of the legs 1' and part of one bridge member 1" being shown in FIG. 2). The Peltier block is not shown in detail in the drawing, since such devices are wellknown in the art. The semiconductor legs are connected electrically in series so that an electric current traverses the semiconductor legs and the connecting metallic bridge members in a meandering or tortuous path. The metallic bridge members are formed, for example, of copper, while the metallic heat exchanger elements 4 are formed of aluminum, for example. Insulation 7 formed of crystalline particulate material is disposed or sandwiched between the surfaces 5 of heat exchanger elements 4 of the adjacent surfaces of the respective bridge members at the warm or cold side of the Peltier block 1. The grain size or diameter a of the particles of the insulating material 7 exceeds the sum of the roughness depths b and b of the surfaces 3 and 5 respectively. In the embodiment of FIG. 2, the particulate material 7 is at least partly pressed into the surfaces 3 and 5 that are being connected together. To facilitate handling, the particulate material is mixed with a carrier medium 8 having good heat conductive properties. The particulate material 7 which is formed, for example, of beryllium oxide, aluminum oxide, quartz or silicon carbide, is provided with as spherical a shape as possible in order to improve the flow properties of the intermediate layer sandwiched between the respective heat exchanger elements 4 of the Peltier block 1. River sand, for example, has this spherical shape. The spherical shape can be produced, however, by polishing or grinding in a ball mill, for example.
The carrier medium 8 is advantageously in liquid state at least when applied to the surfaces 3 and 5 that are to be connected together. The liquid carrier medium 8 advantageously has a viscosity of greater than centistoke. Naturally, it is possible to produce a grain medium at least partly of silicone oil.
In certain cases, it is advantageous for the carrier medium to be formed of an elastic, yieldable and expandable plastic material which hardens after being applied to the surfaces 3 and 5, such as, for example, an artificial resin having a base of castor oil or ricinus oil isocyanate. In order to improve further the thermal conductivity between the Peltier block and the heat exchanger elements, it may be advantageous to employ additional relatively smaller electrically insulating particles whose quantity and size is determined so that they fill the voids located between the particles of crystalline insulating material 7.
I claim:
1. Thermoelectric device comprising at least one Peltier block formed of a plurality of n and p-conductive semiconductor legs and metallic bridge members interconnecting said legs at opposite warm and cold sides of said Peltier block, heat exchanger means located respectively at said warm and said cold sides of said Peltier block and having a surface disposed adjacent a surface of the bridge members located at said warm and said cold sides respectively of said Peltier block, and an intermediate layer of solid insulating material and deformable medium for improving heat transfer sandwiched between said surfaces at said warm and said cold sides respectively of said Peltier block, said insulating material being in the form of crystalline particles having a grain diameter exceeding the sum of the roughness depths of the surfaces between which the respective intermediate layer is sandwiched, and a carrier medium mixed with said crystalline particles, said carrier medium being in liquid state at least when initially applied to said surfaces of said bridge members and both of said heat exchanger means.
2. Thermoelectric device according to claim 1, wherein said crystalline particles are formed of at least one metal oxide.
3. Thermoelectric device according to claim 2, wherein said metal oxide is selected from the group consisting of berryllium oxide, aluminum oxide and quartz.
4. Thermoelectric device according to claim 1, wherein said crystalline particles are formed of silicon carbide.
S. Thermoelectric device according to claim 1,
wherein said crystalline particles comprise a multiplici- 5 wherein said carrier medium consists at least partly of silicone oil.
8. Thermoelectric device according to claim 1,
wherein said carrier medium is formed at least partly of a hardening plastic material.
9. Thermoelectric device according to claim 8, wherein said plastic material is a synthetic resin having a base of ricinus oil.

Claims (9)

1. Thermoelectric device comprising at least one Peltier block formed of a plurality of n and p-conductive semiconductor legs and metallic bridge members interconnecting said legs at opposite warm and cold sides of said Peltier block, heat exchanger means located respectively at said warm and said cold sides of said Peltier block and having a surface disposed adjacent a surface of the bridge members located at said warm and said cold sides respectively of said Peltier block, and an intermediate layer of solid insulating material and deformable medium for improving heat transfer sandwiched between said surfaces at said warm and said cold sides respectively of said Peltier block, said insulating material being in the form of crystalline particles having a grain diameter exceeding the sum of the roughness depths of the surfaces between which the respective intermediate layer is sandwiched, and a carrier medium mixed with said crystalline particles, said carrier medium being in liquid state at least when initially applied to said surfaces of said bridge members and both of said heat exchanger means.
2. Thermoelectric device according to claim 1, wherein said crystalline particles are formed of at least one metal oxide.
3. Thermoelectric device according to claim 2, wherein said metal oxide is selected from the group consisting of berryllium oxide, aluminum oxide and quartz.
4. Thermoelectric device according to claim 1, wherein said crystalline particles are formed of silicon carbide.
5. Thermoelectric device according to claim 1, wherein said crystalline particles comprise a multiplicity of substantially spherically shaped granules.
6. Thermoelectric device according to claim 1, wherein said carrier medium in said liquid state thereof has a viscosity of greater than 100 centistoke.
7. Thermoelectric device according to claim 1, wherein said carrier medium consists at least partly of silicone oil.
8. Thermoelectric device according to claim 1, wherein said carrier medium is formed at least partly of a hardening plastic material.
9. Thermoelectric device according to claim 8, wherein said plastic material is a synthetic resin having a base of ricinus oil.
US95728A 1969-12-10 1970-12-07 Thermoelectric device Expired - Lifetime US3681929A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691963023 DE1963023A1 (en) 1969-12-10 1969-12-10 Thermoelectric device

Publications (1)

Publication Number Publication Date
US3681929A true US3681929A (en) 1972-08-08

Family

ID=5754028

Family Applications (1)

Application Number Title Priority Date Filing Date
US95728A Expired - Lifetime US3681929A (en) 1969-12-10 1970-12-07 Thermoelectric device

Country Status (7)

Country Link
US (1) US3681929A (en)
JP (1) JPS4825839B1 (en)
AT (1) AT299348B (en)
CH (1) CH526867A (en)
DE (1) DE1963023A1 (en)
FR (1) FR2072993A5 (en)
NL (1) NL7018076A (en)

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4472945A (en) * 1980-07-14 1984-09-25 Pavel Cech Device for the exchange of cold and heat, procedure for its manufacture and range of application for the same
US4586342A (en) * 1985-02-20 1986-05-06 Nissin Electric Co., Ltd. Dehumidifying and cooling apparatus
US5409547A (en) * 1992-10-05 1995-04-25 Thermovonics Co., Ltd. Thermoelectric cooling device for thermoelectric refrigerator, process for the fabrication of semiconductor suitable for use in the thermoelectric cooling device, and thermoelectric refrigerator using the thermoelectric cooling device
US5715684A (en) * 1995-03-02 1998-02-10 Thermovonics Co., Ltd. Thermoelectric converter
WO2002065030A1 (en) * 2001-02-09 2002-08-22 Bsst, Llc Improved efficiency thermoelectrics utilizing thermal isolation
US20030005706A1 (en) * 2001-02-09 2003-01-09 Bell Lon E Compact, high-efficiency thermoelectric systems
US20030029173A1 (en) * 2001-08-07 2003-02-13 Bell Lon E. Thermoelectric personal environment appliance
US6598405B2 (en) 2001-02-09 2003-07-29 Bsst Llc Thermoelectric power generation utilizing convective heat flow
US6625990B2 (en) 2001-02-09 2003-09-30 Bsst Llc Thermoelectric power generation systems
US6637210B2 (en) 2001-02-09 2003-10-28 Bsst Llc Thermoelectric transient cooling and heating systems
US6672076B2 (en) 2001-02-09 2004-01-06 Bsst Llc Efficiency thermoelectrics utilizing convective heat flow
US20040031514A1 (en) * 2001-02-09 2004-02-19 Bell Lon E. Thermoelectric power generation systems
US6700052B2 (en) 2001-11-05 2004-03-02 Amerigon Incorporated Flexible thermoelectric circuit
US20040076214A1 (en) * 2001-02-09 2004-04-22 Bell Lon K High power density thermoelectric systems
US6812395B2 (en) 2001-10-24 2004-11-02 Bsst Llc Thermoelectric heterostructure assemblies element
US20060272697A1 (en) * 2005-06-06 2006-12-07 Board Of Trustees Of Michigan State University Thermoelectric compositions and process
US20070214799A1 (en) * 2006-03-16 2007-09-20 Goenka Lakhi N Thermoelectric device efficiency enhancement using dynamic feedback
US20090235969A1 (en) * 2008-01-25 2009-09-24 The Ohio State University Research Foundation Ternary thermoelectric materials and methods of fabrication
US7870892B2 (en) 2004-05-10 2011-01-18 Bsst Llc Climate control method for hybrid vehicles using thermoelectric devices
US20110079023A1 (en) * 2005-07-19 2011-04-07 Goenka Lakhi N Energy management system for a hybrid-electric vehicle
US7942010B2 (en) 2001-02-09 2011-05-17 Bsst, Llc Thermoelectric power generating systems utilizing segmented thermoelectric elements
US7946120B2 (en) 2001-02-09 2011-05-24 Bsst, Llc High capacity thermoelectric temperature control system
US7952015B2 (en) 2006-03-30 2011-05-31 Board Of Trustees Of Michigan State University Pb-Te-compounds doped with tin-antimony-tellurides for thermoelectric generators or peltier arrangements
US20110236731A1 (en) * 2009-05-18 2011-09-29 Bsst Llc Battery Thermal Management System
US8408012B2 (en) 2005-04-08 2013-04-02 Bsst Llc Thermoelectric-based heating and cooling system
US8490412B2 (en) 2001-08-07 2013-07-23 Bsst, Llc Thermoelectric personal environment appliance
US8613200B2 (en) 2008-10-23 2013-12-24 Bsst Llc Heater-cooler with bithermal thermoelectric device
US8631659B2 (en) 2006-08-02 2014-01-21 Bsst Llc Hybrid vehicle temperature control systems and methods
US8640466B2 (en) 2008-06-03 2014-02-04 Bsst Llc Thermoelectric heat pump
US8722222B2 (en) 2011-07-11 2014-05-13 Gentherm Incorporated Thermoelectric-based thermal management of electrical devices
US9006556B2 (en) 2005-06-28 2015-04-14 Genthem Incorporated Thermoelectric power generator for variable thermal power source
US9006557B2 (en) 2011-06-06 2015-04-14 Gentherm Incorporated Systems and methods for reducing current and increasing voltage in thermoelectric systems
US9038400B2 (en) 2009-05-18 2015-05-26 Gentherm Incorporated Temperature control system with thermoelectric device
US9103573B2 (en) 2006-08-02 2015-08-11 Gentherm Incorporated HVAC system for a vehicle
US9293680B2 (en) 2011-06-06 2016-03-22 Gentherm Incorporated Cartridge-based thermoelectric systems
US9306143B2 (en) 2012-08-01 2016-04-05 Gentherm Incorporated High efficiency thermoelectric generation
US9310112B2 (en) 2007-05-25 2016-04-12 Gentherm Incorporated System and method for distributed thermoelectric heating and cooling
US9447994B2 (en) 2008-10-23 2016-09-20 Gentherm Incorporated Temperature control systems with thermoelectric devices
US9555686B2 (en) 2008-10-23 2017-01-31 Gentherm Incorporated Temperature control systems with thermoelectric devices
US10270141B2 (en) 2013-01-30 2019-04-23 Gentherm Incorporated Thermoelectric-based thermal management system
US10991869B2 (en) 2018-07-30 2021-04-27 Gentherm Incorporated Thermoelectric device having a plurality of sealing materials
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
US11993132B2 (en) 2018-11-30 2024-05-28 Gentherm Incorporated Thermoelectric conditioning system and methods

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55528U (en) * 1978-06-16 1980-01-05
DE9102118U1 (en) * 1991-02-22 1992-06-25 Laumen, Michael, 4150 Krefeld Device for heat transfer in the thermoelectric heat transport system
DE102014002247A1 (en) * 2014-02-21 2015-08-27 Stiebel Eltron Gmbh & Co. Kg Construction of a Peltier module for hot water storage

Cited By (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4472945A (en) * 1980-07-14 1984-09-25 Pavel Cech Device for the exchange of cold and heat, procedure for its manufacture and range of application for the same
US4586342A (en) * 1985-02-20 1986-05-06 Nissin Electric Co., Ltd. Dehumidifying and cooling apparatus
US5409547A (en) * 1992-10-05 1995-04-25 Thermovonics Co., Ltd. Thermoelectric cooling device for thermoelectric refrigerator, process for the fabrication of semiconductor suitable for use in the thermoelectric cooling device, and thermoelectric refrigerator using the thermoelectric cooling device
US5715684A (en) * 1995-03-02 1998-02-10 Thermovonics Co., Ltd. Thermoelectric converter
US8079223B2 (en) 2001-02-09 2011-12-20 Bsst Llc High power density thermoelectric systems
US20050072165A1 (en) * 2001-02-09 2005-04-07 Bell Lon E. Thermoelectrics utilizing thermal isolation
US8495884B2 (en) 2001-02-09 2013-07-30 Bsst, Llc Thermoelectric power generating systems utilizing segmented thermoelectric elements
US6539725B2 (en) * 2001-02-09 2003-04-01 Bsst Llc Efficiency thermoelectrics utilizing thermal isolation
US6598405B2 (en) 2001-02-09 2003-07-29 Bsst Llc Thermoelectric power generation utilizing convective heat flow
US6625990B2 (en) 2001-02-09 2003-09-30 Bsst Llc Thermoelectric power generation systems
US6637210B2 (en) 2001-02-09 2003-10-28 Bsst Llc Thermoelectric transient cooling and heating systems
US6672076B2 (en) 2001-02-09 2004-01-06 Bsst Llc Efficiency thermoelectrics utilizing convective heat flow
US20040020217A1 (en) * 2001-02-09 2004-02-05 Bell Lon E. Efficiency thermoelectrics utilizing convective heat flow
US20040031514A1 (en) * 2001-02-09 2004-02-19 Bell Lon E. Thermoelectric power generation systems
US8375728B2 (en) 2001-02-09 2013-02-19 Bsst, Llc Thermoelectrics utilizing convective heat flow
US20040076214A1 (en) * 2001-02-09 2004-04-22 Bell Lon K High power density thermoelectric systems
US7926293B2 (en) 2001-02-09 2011-04-19 Bsst, Llc Thermoelectrics utilizing convective heat flow
US20030005706A1 (en) * 2001-02-09 2003-01-09 Bell Lon E Compact, high-efficiency thermoelectric systems
US6948321B2 (en) 2001-02-09 2005-09-27 Bsst Llc Efficiency thermoelectrics utilizing convective heat flow
US20050210883A1 (en) * 2001-02-09 2005-09-29 Bell Lon E Efficiency thermoelectrics utilizing convective heat flow
US6959555B2 (en) 2001-02-09 2005-11-01 Bsst Llc High power density thermoelectric systems
US20050263177A1 (en) * 2001-02-09 2005-12-01 Bell Lon E High power density thermoelectric systems
US7111465B2 (en) 2001-02-09 2006-09-26 Bsst Llc Thermoelectrics utilizing thermal isolation
WO2002065030A1 (en) * 2001-02-09 2002-08-22 Bsst, Llc Improved efficiency thermoelectrics utilizing thermal isolation
US7231772B2 (en) 2001-02-09 2007-06-19 Bsst Llc. Compact, high-efficiency thermoelectric systems
US20110162389A1 (en) * 2001-02-09 2011-07-07 Bsst, Llc Thermoelectrics utilizing convective heat flow
US7273981B2 (en) 2001-02-09 2007-09-25 Bsst, Llc. Thermoelectric power generation systems
US7421845B2 (en) 2001-02-09 2008-09-09 Bsst Llc Thermoelectrics utilizing convective heat flow
US7946120B2 (en) 2001-02-09 2011-05-24 Bsst, Llc High capacity thermoelectric temperature control system
CN100427849C (en) * 2001-02-09 2008-10-22 Bsst公司 Improved efficiency thermoelectrics utilizing thermal isolation
US7587902B2 (en) 2001-02-09 2009-09-15 Bsst, Llc High power density thermoelectric systems
US7942010B2 (en) 2001-02-09 2011-05-17 Bsst, Llc Thermoelectric power generating systems utilizing segmented thermoelectric elements
US8069674B2 (en) 2001-08-07 2011-12-06 Bsst Llc Thermoelectric personal environment appliance
US20030029173A1 (en) * 2001-08-07 2003-02-13 Bell Lon E. Thermoelectric personal environment appliance
US8490412B2 (en) 2001-08-07 2013-07-23 Bsst, Llc Thermoelectric personal environment appliance
US7426835B2 (en) 2001-08-07 2008-09-23 Bsst, Llc Thermoelectric personal environment appliance
US6812395B2 (en) 2001-10-24 2004-11-02 Bsst Llc Thermoelectric heterostructure assemblies element
US7932460B2 (en) 2001-10-24 2011-04-26 Zt Plus Thermoelectric heterostructure assemblies element
US6700052B2 (en) 2001-11-05 2004-03-02 Amerigon Incorporated Flexible thermoelectric circuit
US9365090B2 (en) 2004-05-10 2016-06-14 Gentherm Incorporated Climate control system for vehicles using thermoelectric devices
US7870892B2 (en) 2004-05-10 2011-01-18 Bsst Llc Climate control method for hybrid vehicles using thermoelectric devices
US9863672B2 (en) 2005-04-08 2018-01-09 Gentherm Incorporated Thermoelectric-based air conditioning system
US8915091B2 (en) 2005-04-08 2014-12-23 Gentherm Incorporated Thermoelectric-based thermal management system
US8408012B2 (en) 2005-04-08 2013-04-02 Bsst Llc Thermoelectric-based heating and cooling system
US7847179B2 (en) 2005-06-06 2010-12-07 Board Of Trustees Of Michigan State University Thermoelectric compositions and process
US20060272697A1 (en) * 2005-06-06 2006-12-07 Board Of Trustees Of Michigan State University Thermoelectric compositions and process
US9006556B2 (en) 2005-06-28 2015-04-14 Genthem Incorporated Thermoelectric power generator for variable thermal power source
US8261868B2 (en) 2005-07-19 2012-09-11 Bsst Llc Energy management system for a hybrid-electric vehicle
US8783397B2 (en) 2005-07-19 2014-07-22 Bsst Llc Energy management system for a hybrid-electric vehicle
US20110079023A1 (en) * 2005-07-19 2011-04-07 Goenka Lakhi N Energy management system for a hybrid-electric vehicle
US7870745B2 (en) 2006-03-16 2011-01-18 Bsst Llc Thermoelectric device efficiency enhancement using dynamic feedback
US8424315B2 (en) 2006-03-16 2013-04-23 Bsst Llc Thermoelectric device efficiency enhancement using dynamic feedback
US20070214799A1 (en) * 2006-03-16 2007-09-20 Goenka Lakhi N Thermoelectric device efficiency enhancement using dynamic feedback
US7952015B2 (en) 2006-03-30 2011-05-31 Board Of Trustees Of Michigan State University Pb-Te-compounds doped with tin-antimony-tellurides for thermoelectric generators or peltier arrangements
US9103573B2 (en) 2006-08-02 2015-08-11 Gentherm Incorporated HVAC system for a vehicle
US8631659B2 (en) 2006-08-02 2014-01-21 Bsst Llc Hybrid vehicle temperature control systems and methods
US10464391B2 (en) 2007-05-25 2019-11-05 Gentherm Incorporated System and method for distributed thermoelectric heating and cooling
US9366461B2 (en) 2007-05-25 2016-06-14 Gentherm Incorporated System and method for climate control within a passenger compartment of a vehicle
US9310112B2 (en) 2007-05-25 2016-04-12 Gentherm Incorporated System and method for distributed thermoelectric heating and cooling
US20090235969A1 (en) * 2008-01-25 2009-09-24 The Ohio State University Research Foundation Ternary thermoelectric materials and methods of fabrication
US9719701B2 (en) 2008-06-03 2017-08-01 Gentherm Incorporated Thermoelectric heat pump
US8701422B2 (en) 2008-06-03 2014-04-22 Bsst Llc Thermoelectric heat pump
US10473365B2 (en) 2008-06-03 2019-11-12 Gentherm Incorporated Thermoelectric heat pump
US8640466B2 (en) 2008-06-03 2014-02-04 Bsst Llc Thermoelectric heat pump
US8613200B2 (en) 2008-10-23 2013-12-24 Bsst Llc Heater-cooler with bithermal thermoelectric device
US9447994B2 (en) 2008-10-23 2016-09-20 Gentherm Incorporated Temperature control systems with thermoelectric devices
US9555686B2 (en) 2008-10-23 2017-01-31 Gentherm Incorporated Temperature control systems with thermoelectric devices
US10106011B2 (en) 2009-05-18 2018-10-23 Gentherm Incorporated Temperature control system with thermoelectric device
US9666914B2 (en) 2009-05-18 2017-05-30 Gentherm Incorporated Thermoelectric-based battery thermal management system
US9038400B2 (en) 2009-05-18 2015-05-26 Gentherm Incorporated Temperature control system with thermoelectric device
US11203249B2 (en) 2009-05-18 2021-12-21 Gentherm Incorporated Temperature control system with thermoelectric device
US8974942B2 (en) 2009-05-18 2015-03-10 Gentherm Incorporated Battery thermal management system including thermoelectric assemblies in thermal communication with a battery
US20110236731A1 (en) * 2009-05-18 2011-09-29 Bsst Llc Battery Thermal Management System
US11264655B2 (en) 2009-05-18 2022-03-01 Gentherm Incorporated Thermal management system including flapper valve to control fluid flow for thermoelectric device
US9293680B2 (en) 2011-06-06 2016-03-22 Gentherm Incorporated Cartridge-based thermoelectric systems
US9006557B2 (en) 2011-06-06 2015-04-14 Gentherm Incorporated Systems and methods for reducing current and increasing voltage in thermoelectric systems
US8722222B2 (en) 2011-07-11 2014-05-13 Gentherm Incorporated Thermoelectric-based thermal management of electrical devices
US9671142B2 (en) 2011-07-11 2017-06-06 Gentherm Incorporated Thermoelectric-based thermal management of electrical devices
US10337770B2 (en) 2011-07-11 2019-07-02 Gentherm Incorporated Thermoelectric-based thermal management of electrical devices
US9306143B2 (en) 2012-08-01 2016-04-05 Gentherm Incorporated High efficiency thermoelectric generation
US10270141B2 (en) 2013-01-30 2019-04-23 Gentherm Incorporated Thermoelectric-based thermal management system
US10784546B2 (en) 2013-01-30 2020-09-22 Gentherm Incorporated Thermoelectric-based thermal management system
US11075331B2 (en) 2018-07-30 2021-07-27 Gentherm Incorporated Thermoelectric device having circuitry with structural rigidity
US10991869B2 (en) 2018-07-30 2021-04-27 Gentherm Incorporated Thermoelectric device having a plurality of sealing materials
US11223004B2 (en) 2018-07-30 2022-01-11 Gentherm Incorporated Thermoelectric device having a polymeric coating
US11993132B2 (en) 2018-11-30 2024-05-28 Gentherm Incorporated Thermoelectric conditioning system and methods
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board

Also Published As

Publication number Publication date
CH526867A (en) 1972-08-15
JPS4825839B1 (en) 1973-08-01
DE1963023A1 (en) 1971-06-16
FR2072993A5 (en) 1971-09-24
AT299348B (en) 1972-06-12
NL7018076A (en) 1971-06-14

Similar Documents

Publication Publication Date Title
US3681929A (en) Thermoelectric device
US4908695A (en) Cooling apparatus and semiconductor device employing the same
EP1264343B1 (en) Apparatus and method for passive phase change thermal management
US6046498A (en) Device having a heat sink for cooling an integrated circuit
JPH0566025B2 (en)
US3076051A (en) Thermoelectric devices and methods of making same
CN104810466A (en) Thermoelectric module and heat conversion device including the same
KR910013467A (en) Semiconductor device mounting and cooling system and regulated power supply system
US10292307B1 (en) Thermal heatsink
US3248681A (en) Contacts for semiconductor devices
US3183121A (en) Thermoelectric generator with heat transfer and thermal expansion adaptor
JP2019021864A (en) Power module
CN101764109A (en) Thermoelectric cooler for semiconductor devices with tsv
JP4927822B2 (en) Formable Peltier heat transfer element and method for manufacturing the same
US3261721A (en) Thermoelectric materials
US3316474A (en) Thermoelectric transformer
JPH0677347A (en) Substrate
US3181304A (en) Peltier device employing semi-conductor bodies which are connected to one another bymeans of interposed members of satisfactory electrical and thermal conductivity
JPH11159907A (en) Electronic heating cooling device
US3462654A (en) Electrically insulating-heat conductive mass for semiconductor wafers
US2862159A (en) Conduction cooled rectifiers
CA1162978A (en) Heat sink thermal transfer system for zinc oxide varistors
JPH0997988A (en) Thermally conductive compound
JP7328664B2 (en) thermoelectric converter
US3287176A (en) Thermoelectric apparatus