US2484204A - Selenium rectifier - Google Patents
Selenium rectifier Download PDFInfo
- Publication number
- US2484204A US2484204A US597191A US59719145A US2484204A US 2484204 A US2484204 A US 2484204A US 597191 A US597191 A US 597191A US 59719145 A US59719145 A US 59719145A US 2484204 A US2484204 A US 2484204A
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- United States
- Prior art keywords
- selenium
- rectifier
- layer
- oil
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 title description 28
- 229910052711 selenium Inorganic materials 0.000 title description 28
- 239000011669 selenium Substances 0.000 title description 28
- 238000000034 method Methods 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 125000003748 selenium group Chemical group *[Se]* 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
- H01L21/14—Treatment of the complete device, e.g. by electroforming to form a barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02625—Liquid deposition using melted materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
- H01L21/10—Preliminary treatment of the selenium or tellurium, its application to the foundation plate, or the subsequent treatment of the combination
- H01L21/105—Treatment of the surface of the selenium or tellurium layer after having been made conductive
Definitions
- One object of my invention is to provide a rectifier of the selenium type which shall exhibit rectifying properties of great uniformity as between diflerent specimens manufactured.
- Another object of my invention is to provide a selenium rectifier which shall have a rectifying contact layer exhibiting great uniformity in rectifying action throughout its expanse.
- Still another object of my invention is to produce selenium rectifiers by a wholesale manufacturing process yielding a product of great uniformity and reliability.
- a further object of my invention is to produce selenium rectifiers of high electrical efliciency.
- selenium rectifiers It is customary in manufacturing selenium rectifiers to coat a backing-plate of metal with a layer of molten selenium and to subject this layer to an annealing process at a temperature somewhat below its melting point. When this is done, it is found that a layer appears on the outer surface of the selenium which may be an oxide of selenium, but which at any rate has undesirable qualities in the rectifier. For example, such a layer is liable to be found of non-uniform character throughout the extent of the surface. and also to show considerable variations between rectifiers made at different times.
- the selenium unit to which the above-mentioned treatment is applied is preferably formed by taking a piece of sheet metal of the iron group such as cold-rolled steel, indicated at I in the drawings. One surface of this sheet is roughened to a matt surface by any convenient process,
- etching On this surface I place a coating of such as sand blasting or acid I amorphous selenium by heating it to a temperature between 220 C. and 250 C., the molten selenium being applied to a thickness of several mils and thereafter the plate is allowed to cool quickly. Thereafter the coated plate is heated to approximately C. and is pressed against a smooth flat surface with sumcient force to reduce the plastic selenium to a. smooth uniform layer preferably about 2 mils thick.
- the smooth flat surface may conveniently comprise a plate of the phenol condensation produce sold under the tradename of Micarta. The plate is then introduced into an oven at room temperature and heated 180 to 0., within a period of twohours, remaining at this temperature for several hours, preferably at least six. erably gradually cooled to room temperature before the plate is removed from the oven, the time taken for cooling hours.
- the plate is then prefgradually to approximately being preferably of about three
- the disk with the molten layer applied may be rotated about an axis passing through its center so that centrifugal force will tend to carry a portion of the molten selenium to the periphery; surface tension maintaining a desirabie uniform thickness in the .layer remaining on the major area of the plate.
- the selenium layer appears at 2 in the drawings.
- a contact layer 3 is formed on the selenium surface by any method well known in the art for this purpose.
- an alloy comprising approximately 75% tin and 25% cadmium may be Schoop-sprayed in. an approximately uniform layer over the selenium surface. as disclosed in E. D. Wilson Patent No. 2,193,610, for Selenium contact electrodes, assigned to the assignee of the present application and issued March 12, 1940.
- This process likewise tends to maintain a constant and uniform temperature on the rectifier element during the abovementioned voltage-forming period. While the greatest improvement from oil immersion is achieved if the voltage is impressed while the unit is still immersed in the oil, certain advantages, such as immunity from moisture absorption, are attained even when the unit is withdrawn from the oil before impression of the forming voltage.
- the method oi! treating rectifiers comprising a layer of selenium sandwiched between layers of metal, which comprises immersing said" rectifier in oil for a period of the order oi! minutes duration and impressing between said layers a direct-current voltage tending to cause current flow in the higher resistance direction through said rectifier while still immersed in said oil.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
Description
0d. 11, 1949. w. E. BLACKBURN 2,484,204
SELENIUM RECTIFIER Original Filed July 25, 1942 1 /Jn--Ca Je/efi/um 3 Sfee/ WITNESSES: INVENTOR W AQMQ, Way/7e [TB/40450177.
Patented on. 11, 1949 OFFICE SELENIUM RECTIFIER Wayne E. Blackburn, Wllkinsburg,
to Pittsburgh, Pa.,
Original application J 452.263. Divided an My invention relates to selenium rectiflers and, in particular. to methods of insuring consistent rectifying performance throughout the area of a relatively large selenium surface.-
This application is a division of my application Serial No. 452,263, filed July 25, 1942, now Patent No. 2,390,771, issued December 11, 1945, and assigned to the Westinghouse Electric Corporation, East Pittsburgh, Pennsylvania.
One object of my invention is to provide a rectifier of the selenium type which shall exhibit rectifying properties of great uniformity as between diflerent specimens manufactured.
Another object of my invention is to provide a selenium rectifier which shall have a rectifying contact layer exhibiting great uniformity in rectifying action throughout its expanse.
Still another object of my invention is to produce selenium rectifiers by a wholesale manufacturing process yielding a product of great uniformity and reliability.
A further object of my invention is to produce selenium rectifiers of high electrical efliciency.
Other objects of my invention will become apparent upon reading the following description, taken in connection with the drawing in which the single figure illustrates a rectifier produced Pa., assignor Westinghouse Electric Corporation, East a corporation of Pennsylvania ulyl25, 1942, Serial No.
d this application June 2, 1945. Serial No. 597,191
5 Claims. (Cl. 175-386) in accordance with the principles of my invention.
It is customary in manufacturing selenium rectifiers to coat a backing-plate of metal with a layer of molten selenium and to subject this layer to an annealing process at a temperature somewhat below its melting point. When this is done, it is found that a layer appears on the outer surface of the selenium which may be an oxide of selenium, but which at any rate has undesirable qualities in the rectifier. For example, such a layer is liable to be found of non-uniform character throughout the extent of the surface. and also to show considerable variations between rectifiers made at different times.
In order to avoid the difficulties resulting from i this lack of uniformity and to produce rectifiers of reliable rectifying characteristics, I have found that a superior product is produced if the selenium surface; after annealing, is submerged in boiling water for thirty seconds. Thereupon. the selenium element is removed from the water and permitted to dry by evaporation of the remaining'moisture due to the heat stored in the element. The element is'then dipped for thirty seconds into a boiling solution of sodium hydroxide of approximately 1.3 grams per liter of solution. Thereafter it is removed and permitted to dry by its own'heat. The selenium unit to which the above-mentioned treatment is applied is preferably formed by taking a piece of sheet metal of the iron group such as cold-rolled steel, indicated at I in the drawings. One surface of this sheet is roughened to a matt surface by any convenient process,
etching. On this surface I place a coating of such as sand blasting or acid I amorphous selenium by heating it to a temperature between 220 C. and 250 C., the molten selenium being applied to a thickness of several mils and thereafter the plate is allowed to cool quickly. Thereafter the coated plate is heated to approximately C. and is pressed against a smooth flat surface with sumcient force to reduce the plastic selenium to a. smooth uniform layer preferably about 2 mils thick. The smooth flat surface may conveniently comprise a plate of the phenol condensation produce sold under the tradename of Micarta. The plate is then introduced into an oven at room temperature and heated 180 to 0., within a period of twohours, remaining at this temperature for several hours, preferably at least six. erably gradually cooled to room temperature before the plate is removed from the oven, the time taken for cooling hours.
The plate is then prefgradually to approximately being preferably of about three As an alternative to insure a smooth and uni form coating of selenium, the disk with the molten layer applied may be rotated about an axis passing through its center so that centrifugal force will tend to carry a portion of the molten selenium to the periphery; surface tension maintaining a desirabie uniform thickness in the .layer remaining on the major area of the plate.
The selenium layer appears at 2 in the drawings.
After the treatment with sodium hydroxide mentioned above, a contact layer 3 is formed on the selenium surface by any method well known in the art for this purpose. For example, an alloy comprising approximately 75% tin and 25% cadmium may be Schoop-sprayed in. an approximately uniform layer over the selenium surface. as disclosed in E. D. Wilson Patent No. 2,193,610, for Selenium contact electrodes, assigned to the assignee of the present application and issued March 12, 1940. The remaining steps in the process of manufacture described in the aforesaid Wilson patent may likewise be applied to the unit chemically treated as above snag-204 In order to insure a high resistance of the rectifier in thenon-conductive direction, I impress a voltage tending to cause current fiow in the high resistance direction; that is to say, high voltage tending to cause current flow in the opposite direction from that which the rectifier will allow to freely pass when alternating voltage is impressed upon it. Before impressing this voltage, however, I immerse the rectifier disc, held between appropriate electrodes, in thin transformer oil for a period preferably of minutes duration. After such a treatment, the rectifier may be exposed to moisture without atfecting the leakage'current flowing in the high resistance direction and may even be stored for considerable times in a humid atmosphere. This process likewise tends to maintain a constant and uniform temperature on the rectifier element during the abovementioned voltage-forming period. While the greatest improvement from oil immersion is achieved if the voltage is impressed while the unit is still immersed in the oil, certain advantages, such as immunity from moisture absorption, are attained even when the unit is withdrawn from the oil before impression of the forming voltage.
While I have described the particular alkali solution employed as sodium hydroxide, it will be recognized by those skilled in the art that 2. The method oi! treating rectifiers comprising a layer of selenium sandwiched between lay-.
ers of metal, which comprises immersing said rectifier in oil. and impressing between said layers a direct-current high voltage tending to cause current. fiow in-the higher resistance direction through said rectifier.
3. The method oi! treating rectifiers comprising a layer of selenium sandwiched between layers of metal, which comprises immersing said" rectifier in oil for a period of the order oi! minutes duration and impressing between said layers a direct-current voltage tending to cause current flow in the higher resistance direction through said rectifier while still immersed in said oil.
4. The method of treating an electric circuit element comprising selenium sandwiched between opposing metal layers, which comprises covering said element with oil and impressing between said layers a voltage tending to cause current flow between said layers in a higher resistance direction through said rectifier.
5. The method of treating an electric circuit element comprising selenium sandwiched between opposing metal layers, which comprises covering said element with oil for the period of the order of minutes duration and impressing between said layers a voltage tending to cause current flow between said layers in a higher resistance direction through said rectifier.
WAYNE E. BLACKBURN.
REFERENCES CITED The following references are of record in the file of this patent:
UNITED STATES PATENTS Number Name Date 2,229,807 Hoppe Jan. 28, 1941 2,237,802 Wittke Apr. 8, 1941 2,279,187 Tompson et al Apr. 7, 1942 2,288,341 Addink June 30, 1942 2,352,640 Kotterman July 14, 1944
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US597191A US2484204A (en) | 1942-07-25 | 1945-06-02 | Selenium rectifier |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US452263A US2390771A (en) | 1942-07-25 | 1942-07-25 | Selenium rectifier |
US597191A US2484204A (en) | 1942-07-25 | 1945-06-02 | Selenium rectifier |
Publications (1)
Publication Number | Publication Date |
---|---|
US2484204A true US2484204A (en) | 1949-10-11 |
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ID=27036724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US597191A Expired - Lifetime US2484204A (en) | 1942-07-25 | 1945-06-02 | Selenium rectifier |
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US (1) | US2484204A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2896305A (en) * | 1954-12-16 | 1959-07-28 | Sarkes Tarzian | Rectifier electroforming process |
DE1205194B (en) * | 1963-01-18 | 1965-11-18 | Licentia Gmbh | Method for preventing corrosion in selenium rectifiers |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2229807A (en) * | 1938-05-07 | 1941-01-28 | Hermes Patentverwertungs Gmbh | Method of manufacturing selenium rectifiers |
US2237802A (en) * | 1938-06-14 | 1941-04-08 | Gen Electric | Method of treating dry plate elements |
US2279187A (en) * | 1939-01-11 | 1942-04-07 | Union Switch & Signal Co | Alternating electric current rectifier of the selenium type |
US2288341A (en) * | 1939-06-02 | 1942-06-30 | Hartford Nat Bank & Trust Co | Blocking layer electrode system |
US2352640A (en) * | 1942-11-03 | 1944-07-04 | Fed Telephone & Radio Corp | Plate rectifier |
-
1945
- 1945-06-02 US US597191A patent/US2484204A/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2229807A (en) * | 1938-05-07 | 1941-01-28 | Hermes Patentverwertungs Gmbh | Method of manufacturing selenium rectifiers |
US2237802A (en) * | 1938-06-14 | 1941-04-08 | Gen Electric | Method of treating dry plate elements |
US2279187A (en) * | 1939-01-11 | 1942-04-07 | Union Switch & Signal Co | Alternating electric current rectifier of the selenium type |
US2288341A (en) * | 1939-06-02 | 1942-06-30 | Hartford Nat Bank & Trust Co | Blocking layer electrode system |
US2352640A (en) * | 1942-11-03 | 1944-07-04 | Fed Telephone & Radio Corp | Plate rectifier |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2896305A (en) * | 1954-12-16 | 1959-07-28 | Sarkes Tarzian | Rectifier electroforming process |
DE1205194B (en) * | 1963-01-18 | 1965-11-18 | Licentia Gmbh | Method for preventing corrosion in selenium rectifiers |
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