US20160290365A1 - Fan and fan assembly - Google Patents
Fan and fan assembly Download PDFInfo
- Publication number
- US20160290365A1 US20160290365A1 US14/691,032 US201514691032A US2016290365A1 US 20160290365 A1 US20160290365 A1 US 20160290365A1 US 201514691032 A US201514691032 A US 201514691032A US 2016290365 A1 US2016290365 A1 US 2016290365A1
- Authority
- US
- United States
- Prior art keywords
- fan
- bottom plane
- protrusions
- protrusion
- guiding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/62—Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps
- F04D29/624—Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
- F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
- F04D29/4206—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
- F04D29/4226—Fan casings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/62—Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps
- F04D29/624—Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
- F04D29/626—Mounting or removal of fans
Definitions
- the subject matter herein generally relates to a fan and a fan assembly.
- microprocessors When electronic devices are in a working state, microprocessors can generate heat. If the heat is not dissipated in time, the electronic devices will be damaged.
- FIG. 1 is an isometric view of a first embodiment of a fan.
- FIG. 2 is an assembly view of the fan of FIG. 1 being installed on a circuit board.
- FIG. 3 is an isometric view of the fan of FIG. 1 being mounted to the circuit board.
- FIG. 4 is a top plan view of a second embodiment of a fan.
- FIG. 5 is a top plan view of a third embodiment of a fan.
- FIG. 6 is an isometric view of a forth embodiment of a fan.
- substantially is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact.
- substantially cylindrical means that the object resembles a cylinder, but can have one or more deviations from a true cylinder.
- comprising when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
- FIGS. 1-3 illustrate a first embodiment of a fan 10 .
- the fan 10 is used to dissipate heat from a component 24 .
- the fan 10 includes a bottom plane 11 , and four protrusions 12 .
- Four fixing holes 14 , an air inlet 16 , and an air outlet 18 are defined in the fan 10 .
- the four protrusions 12 extend up from the bottom plane 11 .
- the four fixing holes 14 and the air inlet 16 are defined on the bottom plane 11 .
- the four protrusions 12 are located on sides of the four fixing holes 14 .
- Each protrusion 12 includes a guiding surface 120 and a chamfer 122 .
- the chamfer 122 extends from the guiding surface 120 into an edge of the protrusion 12 .
- the guiding surface 120 extends into the fixing hole 14 .
- the bottom plane 11 can be substantially rectangular.
- the four protrusions 12 can be substantially located on four corners of the bottom plane 11 .
- the air inlet 16 is defined in the centre of the bottom plane 11 .
- the air outlet 18 is defined in a sidewall of the fan 10 .
- the sidewall can be substantially perpendicular to the bottom plane 11 .
- each protrusion 12 can be substantially a half ring.
- the guiding surface 120 can be arc-shaped. A diameter of the guiding surface 120 is greater than a diameter of the fixing hole 14 .
- the four guiding surfaces 120 curve toward a same direction.
- a circuit board 20 includes four fixing posts 22 .
- the component 24 is located on a central portion of the four fixing posts 22 .
- the fan 10 is moved to the circuit board 20 until the four fixing posts 22 engaged with the four guiding surfaces 120 .
- the four fixing posts 22 are slid into the four fixing holes 14 guided by the four guiding surfaces 120 .
- the fan 10 is fixed to the circuit board 20 .
- heat produced by the component 24 can be dissipated by the fan 10 via the air outlet 18 .
- FIG. 4 illustrates a second embodiment of a fan 10 .
- the four protrusions 12 can be substantially located on four corners of the bottom plane 11 .
- the air inlet 16 is located on a centre of the bottom plane 11 .
- the guiding surface 120 can be arc-shaped. At least two arcuate directions of the four guiding surfaces 120 are opposite.
- FIG. 5 illustrates a third embodiment of a fan 10 .
- the four protrusions 12 can be substantially located on four corners of the bottom plane 11 .
- the air inlet 16 is located on a centre of the bottom plane 11 .
- the guiding surface 120 can be arc-shaped. At least two guiding surfaces 120 face each other.
- FIG. 6 illustrates a forth embodiment of a fan 10 .
- Each protrusion 12 can be substantially a ring.
- the guiding surface 120 can be circular.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- This application claims priority to Chinese Patent Application No. 201510146970.7 filed on Mar. 31, 2015, the contents of which are incorporated by reference herein.
- The subject matter herein generally relates to a fan and a fan assembly.
- When electronic devices are in a working state, microprocessors can generate heat. If the heat is not dissipated in time, the electronic devices will be damaged.
- Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
-
FIG. 1 is an isometric view of a first embodiment of a fan. -
FIG. 2 is an assembly view of the fan ofFIG. 1 being installed on a circuit board. -
FIG. 3 is an isometric view of the fan ofFIG. 1 being mounted to the circuit board. -
FIG. 4 is a top plan view of a second embodiment of a fan. -
FIG. 5 is a top plan view of a third embodiment of a fan. -
FIG. 6 is an isometric view of a forth embodiment of a fan. - It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
- Several definitions that apply throughout this disclosure will now be presented.
- The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
- The present disclosure is described in relation to a fan
-
FIGS. 1-3 illustrate a first embodiment of afan 10. Thefan 10 is used to dissipate heat from acomponent 24. - The
fan 10 includes abottom plane 11, and fourprotrusions 12. Fourfixing holes 14, anair inlet 16, and anair outlet 18 are defined in thefan 10. The fourprotrusions 12 extend up from thebottom plane 11. The fourfixing holes 14 and theair inlet 16 are defined on thebottom plane 11. The fourprotrusions 12 are located on sides of the fourfixing holes 14. Eachprotrusion 12 includes a guidingsurface 120 and achamfer 122. Thechamfer 122 extends from the guidingsurface 120 into an edge of theprotrusion 12. The guidingsurface 120 extends into thefixing hole 14. In one embodiment, thebottom plane 11 can be substantially rectangular. The fourprotrusions 12 can be substantially located on four corners of thebottom plane 11. Theair inlet 16 is defined in the centre of thebottom plane 11. Theair outlet 18 is defined in a sidewall of thefan 10. The sidewall can be substantially perpendicular to thebottom plane 11. In one embodiment, eachprotrusion 12 can be substantially a half ring. The guidingsurface 120 can be arc-shaped. A diameter of the guidingsurface 120 is greater than a diameter of thefixing hole 14. The four guidingsurfaces 120 curve toward a same direction. - A
circuit board 20 includes fourfixing posts 22. Thecomponent 24 is located on a central portion of the fourfixing posts 22. - The
fan 10 is moved to thecircuit board 20 until the fourfixing posts 22 engaged with the four guidingsurfaces 120. The fourfixing posts 22 are slid into the fourfixing holes 14 guided by the four guidingsurfaces 120. Thefan 10 is fixed to thecircuit board 20. When thecomponent 24 is in a working state, heat produced by thecomponent 24 can be dissipated by thefan 10 via theair outlet 18. -
FIG. 4 illustrates a second embodiment of afan 10. The fourprotrusions 12 can be substantially located on four corners of thebottom plane 11. Theair inlet 16 is located on a centre of thebottom plane 11. The guidingsurface 120 can be arc-shaped. At least two arcuate directions of the four guidingsurfaces 120 are opposite. -
FIG. 5 illustrates a third embodiment of afan 10. The fourprotrusions 12 can be substantially located on four corners of thebottom plane 11. Theair inlet 16 is located on a centre of thebottom plane 11. The guidingsurface 120 can be arc-shaped. At least two guidingsurfaces 120 face each other. -
FIG. 6 illustrates a forth embodiment of afan 10. Eachprotrusion 12 can be substantially a ring. The guidingsurface 120 can be circular. - The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of a fan. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the details, especially in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510146970.7A CN106151072A (en) | 2015-03-31 | 2015-03-31 | Fan and fan component |
CN201510146970.7 | 2015-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20160290365A1 true US20160290365A1 (en) | 2016-10-06 |
Family
ID=57017407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/691,032 Abandoned US20160290365A1 (en) | 2015-03-31 | 2015-04-20 | Fan and fan assembly |
Country Status (3)
Country | Link |
---|---|
US (1) | US20160290365A1 (en) |
CN (1) | CN106151072A (en) |
TW (1) | TW201641825A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170146027A1 (en) * | 2015-11-25 | 2017-05-25 | Corsair Memory, Inc. | Blower fan cooling system |
DE102019006840A1 (en) | 2018-10-26 | 2020-04-30 | Sew-Eurodrive Gmbh & Co Kg | Handset, comprising electrical devices, first and second hoses and a first funding and a second funding |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5191230A (en) * | 1989-01-30 | 1993-03-02 | Heung Lap Yan | Circuit module fan assembly |
US5495392A (en) * | 1995-03-06 | 1996-02-27 | Shen; Tsan-Jung | CPU heat dissipating apparatus |
US5701045A (en) * | 1995-05-31 | 1997-12-23 | Sanyo Denki Co., Ltd. | Axial flow air fan having lateral suction and discharge ports for cooling electronic components |
US5810554A (en) * | 1995-05-31 | 1998-09-22 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
US6120368A (en) * | 1998-10-30 | 2000-09-19 | Ter-Minassian; Viguen | Force limited apparatus for tenderizing meat |
US6498724B1 (en) * | 2001-07-27 | 2002-12-24 | Sen Long Chien | Heat dissipation device for a computer |
US6712127B2 (en) * | 2001-03-03 | 2004-03-30 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
US7126824B2 (en) * | 2003-10-31 | 2006-10-24 | Fu Zhun Precision Industrial (Shenzhen) Co., Ltd. | Heat dissipation device assembly incorporating retention member |
US20070274040A1 (en) * | 2006-05-29 | 2007-11-29 | Asustek Computer Inc. | Electronic device and heat dissipation module thereof |
US20080056900A1 (en) * | 2006-09-05 | 2008-03-06 | Siegfried Seidler | Fan with integrated nonreturn flaps |
US20090290306A1 (en) * | 2008-05-26 | 2009-11-26 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating assembly and electronic device having same |
US20100002391A1 (en) * | 2008-07-01 | 2010-01-07 | Hong Fu Jin Precision Industry (Shenzhen) Co.,Ltd. | Electronic device with heat sink assembly |
US20100215520A1 (en) * | 2008-04-29 | 2010-08-26 | Ke-Wei Chin | Electric power free auxiliary cooling device |
US20120053436A1 (en) * | 2010-09-01 | 2012-03-01 | Roche Diagnostics Operations, Inc. | Limited-use blood glucose meters |
US20120188716A1 (en) * | 2011-01-26 | 2012-07-26 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation system |
US20140345844A1 (en) * | 2013-05-22 | 2014-11-27 | Tai-Sol Electronics Co., Ltd. | Heat sink |
US20150230013A1 (en) * | 2014-02-13 | 2015-08-13 | Wistron Corporation | Fixing structure and electronic device therewith |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100562235C (en) * | 2006-06-09 | 2009-11-18 | 富准精密工业(深圳)有限公司 | Heat abstractor |
CN101754651B (en) * | 2008-12-04 | 2012-05-23 | 鸿富锦精密工业(深圳)有限公司 | Fan fixing device |
CN201393359Y (en) * | 2009-02-26 | 2010-01-27 | 富准精密工业(深圳)有限公司 | Heat radiation device and base thereof |
CN103104510B (en) * | 2011-11-10 | 2016-02-03 | 台达电子工业股份有限公司 | Thin fan and manufacture method thereof |
-
2015
- 2015-03-31 CN CN201510146970.7A patent/CN106151072A/en not_active Withdrawn
- 2015-04-02 TW TW104110953A patent/TW201641825A/en unknown
- 2015-04-20 US US14/691,032 patent/US20160290365A1/en not_active Abandoned
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5191230A (en) * | 1989-01-30 | 1993-03-02 | Heung Lap Yan | Circuit module fan assembly |
US5495392A (en) * | 1995-03-06 | 1996-02-27 | Shen; Tsan-Jung | CPU heat dissipating apparatus |
US5701045A (en) * | 1995-05-31 | 1997-12-23 | Sanyo Denki Co., Ltd. | Axial flow air fan having lateral suction and discharge ports for cooling electronic components |
US5810554A (en) * | 1995-05-31 | 1998-09-22 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
US6120368A (en) * | 1998-10-30 | 2000-09-19 | Ter-Minassian; Viguen | Force limited apparatus for tenderizing meat |
US6712127B2 (en) * | 2001-03-03 | 2004-03-30 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
US6498724B1 (en) * | 2001-07-27 | 2002-12-24 | Sen Long Chien | Heat dissipation device for a computer |
US7126824B2 (en) * | 2003-10-31 | 2006-10-24 | Fu Zhun Precision Industrial (Shenzhen) Co., Ltd. | Heat dissipation device assembly incorporating retention member |
US20070274040A1 (en) * | 2006-05-29 | 2007-11-29 | Asustek Computer Inc. | Electronic device and heat dissipation module thereof |
US20080056900A1 (en) * | 2006-09-05 | 2008-03-06 | Siegfried Seidler | Fan with integrated nonreturn flaps |
US20100215520A1 (en) * | 2008-04-29 | 2010-08-26 | Ke-Wei Chin | Electric power free auxiliary cooling device |
US20090290306A1 (en) * | 2008-05-26 | 2009-11-26 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating assembly and electronic device having same |
US7729123B2 (en) * | 2008-05-26 | 2010-06-01 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating assembly and electronic device having same |
US20100002391A1 (en) * | 2008-07-01 | 2010-01-07 | Hong Fu Jin Precision Industry (Shenzhen) Co.,Ltd. | Electronic device with heat sink assembly |
US20120053436A1 (en) * | 2010-09-01 | 2012-03-01 | Roche Diagnostics Operations, Inc. | Limited-use blood glucose meters |
US20120188716A1 (en) * | 2011-01-26 | 2012-07-26 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation system |
US20140345844A1 (en) * | 2013-05-22 | 2014-11-27 | Tai-Sol Electronics Co., Ltd. | Heat sink |
US20150230013A1 (en) * | 2014-02-13 | 2015-08-13 | Wistron Corporation | Fixing structure and electronic device therewith |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170146027A1 (en) * | 2015-11-25 | 2017-05-25 | Corsair Memory, Inc. | Blower fan cooling system |
US9797408B2 (en) * | 2015-11-25 | 2017-10-24 | Corsair Memory, Inc. | Blower fan cooling system |
DE102019006840A1 (en) | 2018-10-26 | 2020-04-30 | Sew-Eurodrive Gmbh & Co Kg | Handset, comprising electrical devices, first and second hoses and a first funding and a second funding |
Also Published As
Publication number | Publication date |
---|---|
TW201641825A (en) | 2016-12-01 |
CN106151072A (en) | 2016-11-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHU, HAI-FENG;WANG, LI;WANG, YA-QIN;AND OTHERS;REEL/FRAME:035450/0034 Effective date: 20150415 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHU, HAI-FENG;WANG, LI;WANG, YA-QIN;AND OTHERS;REEL/FRAME:035450/0034 Effective date: 20150415 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |