US20110189819A1 - Resistive Memory Structure with Buffer Layer - Google Patents

Resistive Memory Structure with Buffer Layer Download PDF

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US20110189819A1
US20110189819A1 US13/083,450 US201113083450A US2011189819A1 US 20110189819 A1 US20110189819 A1 US 20110189819A1 US 201113083450 A US201113083450 A US 201113083450A US 2011189819 A1 US2011189819 A1 US 2011189819A1
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buffer layer
memory element
electrode
oxide
memory
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Wei-Chih Chien
Kuo-Pin Chang
Erh-Kun Lai
Kuang Yeu Hsieh
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Macronix International Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/021—Formation of switching materials, e.g. deposition of layers
    • H10N70/026—Formation of switching materials, e.g. deposition of layers by physical vapor deposition, e.g. sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/021—Formation of switching materials, e.g. deposition of layers
    • H10N70/028—Formation of switching materials, e.g. deposition of layers by conversion of electrode material, e.g. oxidation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
    • H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828—Tellurides, e.g. GeSbTe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/883—Oxides or nitrides
    • H10N70/8833—Binary metal oxides, e.g. TaOx
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/883—Oxides or nitrides
    • H10N70/8836—Complex metal oxides, e.g. perovskites, spinels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/884—Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/90—Bulk effect device making

Definitions

  • the present invention relates to memory devices and methods for manufacturing high density memory devices, and more particularly to memory devices having a data storage material based on tungsten-oxygen compounds.
  • Nonvolatile memory devices include magnetic random access memory MRAM, ferroelectric random access memory FRAM and phase-change random access memory PCRAM and other resistive random access memory RRAM.
  • RRAM has attracted much attention because of its simple structure and small cell size.
  • Metal-oxide based RRAM can be caused to change resistance between two or more stable ranges by application of electrical pulses at levels suitable for implementation in integrated circuits, and the resistance can be read and written with random access to indicate stored data.
  • NiO, TiO 2 , HfO 2 , and ZrO 2 based RRAM have been investigated for use as a memory material in memory cells. See, Baek, et al., “Highly Scalable Non-Volatile Resistive Memory using Simple Binary Oxide Driven by Asymmetric Unipolar Voltage Pulses”, IEDM Technical Digest pp. 23.6.1-23.6.4, IEEE International Electron Devices Meeting 2004.
  • These memory cells are formed by a non-self-aligned process in a M-I-M structure, where M is a noble metal acting as an electrode and I is one of NiO, TiO 2 , HfO 2 , and ZrO 2 .
  • This MIM structure requires several additional masks and patterning to form the noble metal electrodes and the memory material, and results in a relatively large memory cell size.
  • Cu x O based RRAM has also been investigated for use as a memory material in memory cells. See, Chen et al., “Non-Volatile Resistive Switching for Advanced Memory Applications”, IEDM Technical Digest pp. 746-749, IEEE International Electron Devices Meeting 2005.
  • the Cu x O material is formed by thermal oxidation of a copper via which acts as the bottom electrode for the memory cell, while the top electrode consists of a bi-layer Ti/TiN film that is deposited and etched. This structure requires several additional masks to form the top and bottom electrodes, and results in a relatively large memory cell size. Chen et al. disclose that having a copper bottom electrode complicates erasing of the memory cell since the applied field during erasing may push copper ions into the Cu x O. Additionally, Cu x O has a relatively small resistance window of 10 ⁇ .
  • Cu—WO 3 based RRAM has also been investigated for use as a memory material in memory cells. See, Kozicki et al., “A Low-Power Nonvolatile Switching Element Based on Copper-Tungsten Oxide Solid Electrolyte”, IEEE Transactions on Nanotechnology pp. 535-544, Vol. 5, No. 5, September 2006. Switching elements fabricated using tungsten metal, a solid electrolyte based on tungsten-oxide and photodiffused copper, and a copper top electrode are disclosed.
  • the switching element is formed by tungsten-oxide grown or deposited on tungsten material, a layer of Cu formed on the tungsten-oxide and the Cu photodiffused into the tungsten-oxide to form the solid electrolyte, and a Cu layer is formed and patterned over the solid electrolyte to act as a top electrode.
  • the switching element changes resistance by applying a bias voltage to cause electrodeposition of Cu ions from the top electrode into the solid electrolyte, and states that “a lack of Cu in the top electrode results in no measurable switching activity” (see page 539, column 1).
  • This structure thus needs a Cu top electrode, involves several process steps to form the solid electrolyte, and necessitates bias voltages of opposite polarities to cause the injection of Cu ions to program and erase the solid electrolyte.
  • An example of a memory device comprises first and second electrodes with a memory element and a buffer layer located between and electrically coupled to the first and second electrodes.
  • the memory element comprises one or more metal oxygen compounds.
  • the buffer layer comprises at least one of an oxide and a nitride. In some example is the buffer layer has a thickness of less than 50 ⁇ . In some example is the memory element comprises one or more tungsten oxygen compounds. In some examples the buffer layer comprises at least one of the following: SiO 2 , WO, TiO, NiO, AlO, CuO, ZrO, Si 3 N 4 , and TiN.
  • memory element comprises one or more of the following: WOx, NiO, Nb 2 O 5 , CuO 2 , Ta 2 O 5 , Al 2 O 3 , CoO, Fe 2 O 3 , HfO 2 , TiO 2 , SrTiO 3 , SrZrO 3 , (BaSr)TiO 3 , GeTi, SnMnTe, SbTe, Pr1-xCaxMnO 3 , (Te—Cu/GdOX, GeSb with Ag + or Cu + ).
  • a second example of a memory device comprises a first electrode and a second electrode with a memory element and a buffer layer located between and electrically coupled to the first and the second electrodes.
  • the memory comprises one or more metal oxygen compounds.
  • the buffer layer has a thickness of less than 50 ⁇ .
  • An example of a method of fabricating a memory device is carried out as follows.
  • a first electrode and a second electrode are formed.
  • a memory located between and electrically coupled to the first and the second electrodes, is formed; the memory comprises one or more metal oxygen compounds and the buffer layer comprises at least one of an oxide and a nitride.
  • the buffer layer is located between and electrically coupled to the memory element and the first electrode.
  • the buffer layer has a thickness of less than 50 ⁇ .
  • the buffer layer has a resistivity of about 10 13 ⁇ 10 16 ohm-cm.
  • a second buffer layer is formed between and electrically coupled to the memory element and the second electrode, the second buffer layer comprising at least one of an oxide and a nitride.
  • the present invention improves the performance, including data retention and cycle endurance, of a resistive memory structure.
  • FIG. 1 is a simplified cross-sectional view of an example of a resistive memory structure in accordance with the present invention with a barrier layer between the bottom electrode and the memory cell.
  • FIG. 2 is a simplified cross-sectional view of another example of a resistive memory structure similar to that of FIG. 1 but where the buffer layer is between the memory cell and the top electrode.
  • FIG. 3 is a simplified cross-sectional view of a further example of a resistive memory structure similar to that of FIG. 1 including a buffer layer between the bottom electrode and the memory cell as in FIG. 1 and a buffer layer between the top electrode and the memory cell as in FIG. 2 .
  • FIG. 4 is a graph of resistivity versus retention time for a resistive memory structure of the type not including a buffer layer.
  • FIG. 5 is a graph of resistivity versus retention time for a resistive memory structure made according to the invention showing the improved data retention over the data retention illustrated in FIG. 4 .
  • FIG. 6 is a graph of resistivity versus cycle time for a memory structure of the type not including a buffer layer.
  • FIG. 7 is a graph of resistivity versus cycle time for a resistive memory structure made according to the invention showing the improved cycle endurance over the cycle endurance illustrated in FIG. 6 .
  • FIG. 8 is a graph of resistivity versus read disturb for a resistive memory structure made according to the invention showing that it exhibits very good read disturb characteristics in both the on state and the off state.
  • FIG. 9 is a simplified block diagram of an integrated circuit including resistive memory structures.
  • FIGS. 1-9 A description of structural embodiments and methods of the present invention is provided with reference to FIGS. 1-9 . It is to be understood that there is no intention to limit the invention to the specifically disclosed embodiments but that the invention may be practiced using other features, elements, methods and embodiments. Like elements in various embodiments are commonly referred to with like reference numerals.
  • FIG. 1 is a simplified cross-sectional view of a first example of a resistive memory structure 10 .
  • Structure 10 includes a substrate 11 upon which an AlCu stack 12 is formed.
  • a dielectric layer 14 typically silicon dioxide, is formed over stack 12 .
  • a bottom electrode 16 extends from stack 12 completely through dielectric layer 14 .
  • Bottom electrode 16 is an electrically conductive element.
  • bottom electrode 16 may be a drain terminal of an access transistor or a terminal of a diode.
  • a buffer layer 18 is formed by, for example, down-stream plasma, plasma sputtering or reactive sputtering onto dielectric layer 14 and bottom electrode 16 .
  • Buffer layer 18 has a thickness of less than 50 ⁇ ; the advantages accruing from the use of buffer layer 18 will be discussed below.
  • Buffer layer 18 comprises at least one of an oxide and a nitride.
  • buffer layer 18 may comprise at least one of the following: SiO 2 , WO, TiO, NiO, AlO, CuO, ZrO, Si 3 N 4 , and TiN.
  • Buffer layer 18 preferably exhibits a resistivity of about 10 13 ⁇ 10 16 ohm-cm and preferably has a thickness of less than 5 nm (50 ⁇ ).
  • Buffer layer 18 may be formed by, for example, physical vapor deposition or chemical vapor deposition methods.
  • a memory element layer 20 having a thickness of 50-1000 ⁇ , is deposited on buffer layer 18 .
  • Memory element layer 20 comprises one or more metal-oxygen compounds, especially tungsten-oxygen compounds W x O y , for example one or more of WO 3 , W 2 O 5 , WO 2 .
  • the result can be a number of different tungsten-oxygen compounds.
  • memory element layer 20 comprises WO 3 /W 2 O 5 /WO 2 and has a thickness of about 140 ⁇ .
  • a top electrode 22 is formed on memory element layer 20 . Electrodes 16 , 22 are typically a metal such as tungsten or AlCu.
  • Memory element 26 may comprise one or more of the following: WO x , NiO, Nb 2 O 5 , CuO 2 , Ta 2 O 5 , Al 2 O 3 , CoO, Fe 2 O 3 , HfO 2 , TiO 2 , SrTiO 3 , SrZrO 3 , (BaSr)TiO 3 , GeTi, SnMnTe, SbTe, Pr 1-x Ca x MnO 3 , (Te—Cu/GdOX, GeSb with Ag + or Cu + ).
  • memory element 26 can store two or more bits of data.
  • FIG. 2 is a simplified cross-sectional view of another example of a resistive memory structure 10 similar to that of FIG. 1 but without buffer layer 18 but including a buffer layer 19 between memory element 26 and at top electrode 22 .
  • FIG. 3 is a simplified cross-sectional view of a further example of a resistive memory structure 10 including a buffer layer 18 between bottom electrode 16 and memory element 26 as in FIG. 1 and a buffer layer 19 between top electrode 22 and the memory element 26 as in FIG. 2 .
  • Resistive memory structure 10 can be manufactured using conventional back-end-of-line W-plug processing techniques. A single mask can be used to form both buffer layer 19 and top electrode 22 .
  • buffer layers 18 , 19 helps to improve the performance of resistive memory structure 10 . This improvement in performance will be demonstrated with reference to FIGS. 4-8 .
  • the structure of FIG. 1 was used to develop the results seen at FIGS. 5 , 7 and 8 .
  • the test structure had the following characteristics: bottom electrode 16 was made of W and had an average diameter of about 200 nm; top electrode 22 was made of Al and had an average width of about 500 nm; memory element layer 20 was made of WO x and a thickness of about 140 ⁇ ; buffer layer 18 was made of SiO 2 and had a thickness of about 2 nm.
  • the results shown at FIGS. 4 and 6 are for a resistive memory structure substantially identical to the test structure but without any buffer layers, referred to below as the conventional resistive memory structure.
  • FIG. 4 is a graph of resistivity versus retention time for the conventional resistive memory structure in both the on state and the off state. It can be seen that the resistivity, especially in the on state, increases relatively quickly over time, time being plotted on a logarithmic scale. In contrast, the plot of resistivity versus retention time for resistive memory structure 10 is seen in FIG. 5 to be essentially flat, a substantial improvement over the conventional resistive memory structure used to create the graph of FIG. 4 .
  • FIG. 6 is a graph of resistivity versus cycle time for the conventional resistive memory structure. Graphs for both the on state and the off state show significant increases in the resistivity over cycle time. In contrast, the graph of FIG. 7 of resistivity versus cycle time for resistive memory structure 10 shows a relatively flat resistivity versus cycle time plots for both the on state and the off state. This indicates substantially improved cycle endurance for resistive memory structure 10 over the cycle endurance of the conventional resistive memory structure used to create the graph in FIG. 6 .
  • FIG. 8 is a graph of resistivity versus read disturb for resistive memory structure 10 showing that the resistivity of structure 10 exhibits very good read disturb characteristics in both the on state and the off state.
  • Read disturb refers to the gain or loss of resistance of memory element 26 resulting from reading the state of the memory element 26 .
  • FIG. 9 is a simplified block diagram of an integrated circuit 110 including a memory array 112 implemented using resistive memory structures 10 .
  • a word line decoder 114 having read, set and reset modes is coupled to and in electrical communication with a plurality of word lines 116 arranged along rows in the memory array 112 .
  • a bit line (column) decoder 118 is in electrical communication with a plurality of bit lines 120 arranged along columns in the array 112 for reading, setting, and resetting memory element 26 in array 112 . Addresses are supplied on bus 122 to word line decoder and drivers 114 and bit line decoder 118 .
  • Sense amplifiers and data-in structures in block 124 are coupled to bit line decoder 118 via data bus 126 .
  • Data is supplied via a data-in line 128 from input/output ports on integrated circuit 110 , or from other data sources internal or external to integrated circuit 110 , to data-in structures in block 124 .
  • Other circuitry 130 may be included on integrated circuit 110 , such as a general purpose processor or special purpose application circuitry, or a combination of modules providing system-on-a-chip functionality supported by array 112 .
  • Data is supplied via a data-out line 132 from the sense amplifiers in block 124 to input/output ports on integrated circuit 110 , or to other data destinations internal or external to integrated circuit 110 .
  • Controller 134 may be implemented using special-purpose logic circuitry as known in the art.
  • controller 134 comprises a general-purpose processor, which may be implemented on the same integrated circuit to execute a computer program to control the operations of the device.
  • a combination of special-purpose logic circuitry and a general-purpose processor may be utilized for implementation of controller 134 .
  • An exemplary formation method for W x O y uses a PVD sputtering or magnetron-sputtering method with reactive gases of Ar, N 2 , O 2 , and/or He, etc. at a pressure of 1 mTorr ⁇ 100 mTorr, using a target of W x O y .
  • the deposition is usually performed at room temperature.
  • a collimater with an aspect ratio of 1 ⁇ 5 can be used to improve the fill-in performance.
  • the DC bias of several tens of volts to several hundreds of volts is also used. If desired, DC bias and the collimater can be used simultaneously.
  • a post-deposition annealing treatment in vacuum or in an N 2 ambient or O 2 /N 2 mixed ambient is optionally performed to improve the oxygen distribution of metal oxide.
  • the annealing temperature ranges from 400° C. to 600° C. with an annealing time of less than 2 hours.
  • Yet another formation method uses oxidation by a high temperature oxidation system, such as a furnace or a rapid thermal pulse (“RTP”) system.
  • the temperature ranges from 200° C. to 700° C. with pure O 2 or N 2 /O 2 mixed gas at a pressure of several mTorr to 1 atm. The time can range several minutes to hours.
  • Another oxidation method is plasma oxidation.
  • An RF or a DC source plasma with pure O 2 or Ar/O 2 mixed gas or Ar/N 2 /O 2 mixed gas at a pressure of 1 mTorr to 100 mTorr is used to oxidize the surface of W.
  • the oxidation time ranges several seconds to several minutes.
  • the oxidation temperature ranges from room temperature to 300° C., depending on the degree of plasma oxidation.

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Abstract

A memory device comprises first and second electrodes with a memory element and a buffer layer located between and electrically coupled to them. The memory element comprises one or more metal oxygen compounds. The buffer layer comprises at least one of an oxide and a nitride. Another memory device comprises first and second electrodes with a memory element and a buffer layer, having a thickness of less than 50 Å, located between and electrically coupled to them. The memory comprises one or more metal oxygen compounds. An example of a method of fabricating a memory device includes forming first and second electrodes. A memory, located between and electrically coupled to the first and the second electrodes, is formed; the memory comprises one or more metal oxygen compounds and the buffer layer comprises at least one of an oxide and a nitride.

Description

    CROSS-REFERENCE TO OTHER APPLICATIONS
  • The present application is a continuation of U.S. patent application Ser. No. 12/836,304, filed on 14 Jul. 2010, Attorney Docket MXIC 1845-2; which application is a continuation of U.S. patent application Ser. No. 12/176,183, filed on 18 Jul. 2008, now U.S. Pat. No. 7,777,215, Attorney Docket MXIC 1845-1; which application claims the benefit of U.S. Provisional Patent Application No. 60/950,874, filed on 20 Jul. 2007, Attorney Docket MXIC 1845-0.
  • The present application is related to the following U.S. patent applications: Resistance Random Access Memory Structure for Enhanced Retention, U.S. patent application Ser. No. 11/560,723, filed on 16 Nov. 2006, published on 22 May 2008 as publication number US-2008-0116440-A1, Attorney Docket MXIC 1741-1; and Resistance Memory with Tungsten Compound and Manufacturing, U.S. patent application Ser. No. 11/955,137, filed on 12 Dec. 2007, published on 11 Dec. 2008 as publication number US-2008-0304312-A1, Attorney Docket MXIC 1742-2.
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to memory devices and methods for manufacturing high density memory devices, and more particularly to memory devices having a data storage material based on tungsten-oxygen compounds.
  • 2. Description of Related Art
  • Nonvolatile memory devices include magnetic random access memory MRAM, ferroelectric random access memory FRAM and phase-change random access memory PCRAM and other resistive random access memory RRAM. RRAM has attracted much attention because of its simple structure and small cell size.
  • Metal-oxide based RRAM can be caused to change resistance between two or more stable ranges by application of electrical pulses at levels suitable for implementation in integrated circuits, and the resistance can be read and written with random access to indicate stored data.
  • NiO, TiO2, HfO2, and ZrO2 based RRAM have been investigated for use as a memory material in memory cells. See, Baek, et al., “Highly Scalable Non-Volatile Resistive Memory using Simple Binary Oxide Driven by Asymmetric Unipolar Voltage Pulses”, IEDM Technical Digest pp. 23.6.1-23.6.4, IEEE International Electron Devices Meeting 2004. These memory cells are formed by a non-self-aligned process in a M-I-M structure, where M is a noble metal acting as an electrode and I is one of NiO, TiO2, HfO2, and ZrO2. This MIM structure requires several additional masks and patterning to form the noble metal electrodes and the memory material, and results in a relatively large memory cell size.
  • CuxO based RRAM has also been investigated for use as a memory material in memory cells. See, Chen et al., “Non-Volatile Resistive Switching for Advanced Memory Applications”, IEDM Technical Digest pp. 746-749, IEEE International Electron Devices Meeting 2005. The CuxO material is formed by thermal oxidation of a copper via which acts as the bottom electrode for the memory cell, while the top electrode consists of a bi-layer Ti/TiN film that is deposited and etched. This structure requires several additional masks to form the top and bottom electrodes, and results in a relatively large memory cell size. Chen et al. disclose that having a copper bottom electrode complicates erasing of the memory cell since the applied field during erasing may push copper ions into the CuxO. Additionally, CuxO has a relatively small resistance window of 10×.
  • Cu—WO3 based RRAM has also been investigated for use as a memory material in memory cells. See, Kozicki et al., “A Low-Power Nonvolatile Switching Element Based on Copper-Tungsten Oxide Solid Electrolyte”, IEEE Transactions on Nanotechnology pp. 535-544, Vol. 5, No. 5, September 2006. Switching elements fabricated using tungsten metal, a solid electrolyte based on tungsten-oxide and photodiffused copper, and a copper top electrode are disclosed. The switching element is formed by tungsten-oxide grown or deposited on tungsten material, a layer of Cu formed on the tungsten-oxide and the Cu photodiffused into the tungsten-oxide to form the solid electrolyte, and a Cu layer is formed and patterned over the solid electrolyte to act as a top electrode. The switching element changes resistance by applying a bias voltage to cause electrodeposition of Cu ions from the top electrode into the solid electrolyte, and states that “a lack of Cu in the top electrode results in no measurable switching activity” (see page 539, column 1). This structure thus needs a Cu top electrode, involves several process steps to form the solid electrolyte, and necessitates bias voltages of opposite polarities to cause the injection of Cu ions to program and erase the solid electrolyte.
    • SUMMARY OF THE INVENTION
  • An example of a memory device comprises first and second electrodes with a memory element and a buffer layer located between and electrically coupled to the first and second electrodes. The memory element comprises one or more metal oxygen compounds. The buffer layer comprises at least one of an oxide and a nitride. In some example is the buffer layer has a thickness of less than 50 Å. In some example is the memory element comprises one or more tungsten oxygen compounds. In some examples the buffer layer comprises at least one of the following: SiO2, WO, TiO, NiO, AlO, CuO, ZrO, Si3N4, and TiN. In some examples memory element comprises one or more of the following: WOx, NiO, Nb2O5, CuO2, Ta2O5, Al2O3, CoO, Fe2O3, HfO2, TiO2, SrTiO3, SrZrO3, (BaSr)TiO3, GeTi, SnMnTe, SbTe, Pr1-xCaxMnO3, (Te—Cu/GdOX, GeSb with Ag+ or Cu+).
  • A second example of a memory device comprises a first electrode and a second electrode with a memory element and a buffer layer located between and electrically coupled to the first and the second electrodes. The memory comprises one or more metal oxygen compounds. The buffer layer has a thickness of less than 50 Å.
  • An example of a method of fabricating a memory device is carried out as follows. A first electrode and a second electrode are formed. A memory, located between and electrically coupled to the first and the second electrodes, is formed; the memory comprises one or more metal oxygen compounds and the buffer layer comprises at least one of an oxide and a nitride. In some examples the buffer layer is located between and electrically coupled to the memory element and the first electrode. In some examples the buffer layer has a thickness of less than 50 Å. In some examples the buffer layer has a resistivity of about 1013˜1016 ohm-cm. In some examples a second buffer layer is formed between and electrically coupled to the memory element and the second electrode, the second buffer layer comprising at least one of an oxide and a nitride.
  • Advantageously, the present invention improves the performance, including data retention and cycle endurance, of a resistive memory structure.
  • The structures and methods of the present invention are disclosed in the detailed description below. This summary does not purport to define the invention. The invention is defined by the claims. These and other embodiments, features, aspects, and advantages of the technology can be understood with regard to the following description, appended claims and accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The invention will be described with respect to specific embodiments thereof, and reference will be made to the drawings, in which:
  • FIG. 1 is a simplified cross-sectional view of an example of a resistive memory structure in accordance with the present invention with a barrier layer between the bottom electrode and the memory cell.
  • FIG. 2 is a simplified cross-sectional view of another example of a resistive memory structure similar to that of FIG. 1 but where the buffer layer is between the memory cell and the top electrode.
  • FIG. 3 is a simplified cross-sectional view of a further example of a resistive memory structure similar to that of FIG. 1 including a buffer layer between the bottom electrode and the memory cell as in FIG. 1 and a buffer layer between the top electrode and the memory cell as in FIG. 2.
  • FIG. 4 is a graph of resistivity versus retention time for a resistive memory structure of the type not including a buffer layer.
  • FIG. 5 is a graph of resistivity versus retention time for a resistive memory structure made according to the invention showing the improved data retention over the data retention illustrated in FIG. 4.
  • FIG. 6 is a graph of resistivity versus cycle time for a memory structure of the type not including a buffer layer.
  • FIG. 7 is a graph of resistivity versus cycle time for a resistive memory structure made according to the invention showing the improved cycle endurance over the cycle endurance illustrated in FIG. 6.
  • FIG. 8 is a graph of resistivity versus read disturb for a resistive memory structure made according to the invention showing that it exhibits very good read disturb characteristics in both the on state and the off state.
  • FIG. 9 is a simplified block diagram of an integrated circuit including resistive memory structures.
    •  DETAILED DESCRIPTION
  • A description of structural embodiments and methods of the present invention is provided with reference to FIGS. 1-9. It is to be understood that there is no intention to limit the invention to the specifically disclosed embodiments but that the invention may be practiced using other features, elements, methods and embodiments. Like elements in various embodiments are commonly referred to with like reference numerals.
  • FIG. 1 is a simplified cross-sectional view of a first example of a resistive memory structure 10. Structure 10 includes a substrate 11 upon which an AlCu stack 12 is formed. A dielectric layer 14, typically silicon dioxide, is formed over stack 12. A bottom electrode 16 extends from stack 12 completely through dielectric layer 14. Bottom electrode 16 is an electrically conductive element. For example, bottom electrode 16 may be a drain terminal of an access transistor or a terminal of a diode. A buffer layer 18 is formed by, for example, down-stream plasma, plasma sputtering or reactive sputtering onto dielectric layer 14 and bottom electrode 16. Buffer layer 18 has a thickness of less than 50 Å; the advantages accruing from the use of buffer layer 18 will be discussed below. Buffer layer 18 comprises at least one of an oxide and a nitride. For example, buffer layer 18 may comprise at least one of the following: SiO2, WO, TiO, NiO, AlO, CuO, ZrO, Si3N4, and TiN. Buffer layer 18 preferably exhibits a resistivity of about 1013˜1016 ohm-cm and preferably has a thickness of less than 5 nm (50 Å). Buffer layer 18 may be formed by, for example, physical vapor deposition or chemical vapor deposition methods.
  • A memory element layer 20, having a thickness of 50-1000 Å, is deposited on buffer layer 18. Memory element layer 20 comprises one or more metal-oxygen compounds, especially tungsten-oxygen compounds WxOy, for example one or more of WO3, W2O5, WO2. In some cases, such as when plasma oxidation or thermal oxidation is used to form memory element layer 20, the result can be a number of different tungsten-oxygen compounds. In one example memory element layer 20 comprises WO3/W2O5/WO2 and has a thickness of about 140 Å. A top electrode 22 is formed on memory element layer 20. Electrodes 16, 22 are typically a metal such as tungsten or AlCu. The portions of the bottom and top electrodes 16, 22 that are aligned define a memory cell region 24 therebetween. The portion of memory element layer 20 situated within memory cell region 24 constitutes a memory element 26 electrically coupled to bottom and top electrodes 16, 22. Memory element 26 may comprise one or more of the following: WOx, NiO, Nb2O5, CuO2, Ta2O5, Al2O3, CoO, Fe2O3, HfO2, TiO2, SrTiO3, SrZrO3, (BaSr)TiO3, GeTi, SnMnTe, SbTe, Pr1-xCaxMnO3, (Te—Cu/GdOX, GeSb with Ag+ or Cu+).
  • In operation, voltages applied to the top and bottom electrodes 22, 16 will cause current to flow between the top and bottom electrodes via memory element 26 and can induce a programmable change in electrical resistance of the memory element 26, the electrical resistance indicating a data value stored in the memory element 26. In some embodiments memory element 26 can store two or more bits of data.
  • FIG. 2 is a simplified cross-sectional view of another example of a resistive memory structure 10 similar to that of FIG. 1 but without buffer layer 18 but including a buffer layer 19 between memory element 26 and at top electrode 22. FIG. 3 is a simplified cross-sectional view of a further example of a resistive memory structure 10 including a buffer layer 18 between bottom electrode 16 and memory element 26 as in FIG. 1 and a buffer layer 19 between top electrode 22 and the memory element 26 as in FIG. 2.
  • Resistive memory structure 10 can be manufactured using conventional back-end-of-line W-plug processing techniques. A single mask can be used to form both buffer layer 19 and top electrode 22.
  • The use of one or both of buffer layers 18, 19 helps to improve the performance of resistive memory structure 10. This improvement in performance will be demonstrated with reference to FIGS. 4-8. The structure of FIG. 1 was used to develop the results seen at FIGS. 5, 7 and 8. The test structure had the following characteristics: bottom electrode 16 was made of W and had an average diameter of about 200 nm; top electrode 22 was made of Al and had an average width of about 500 nm; memory element layer 20 was made of WOx and a thickness of about 140 Å; buffer layer 18 was made of SiO2 and had a thickness of about 2 nm. The results shown at FIGS. 4 and 6 are for a resistive memory structure substantially identical to the test structure but without any buffer layers, referred to below as the conventional resistive memory structure.
  • FIG. 4 is a graph of resistivity versus retention time for the conventional resistive memory structure in both the on state and the off state. It can be seen that the resistivity, especially in the on state, increases relatively quickly over time, time being plotted on a logarithmic scale. In contrast, the plot of resistivity versus retention time for resistive memory structure 10 is seen in FIG. 5 to be essentially flat, a substantial improvement over the conventional resistive memory structure used to create the graph of FIG. 4.
  • FIG. 6 is a graph of resistivity versus cycle time for the conventional resistive memory structure. Graphs for both the on state and the off state show significant increases in the resistivity over cycle time. In contrast, the graph of FIG. 7 of resistivity versus cycle time for resistive memory structure 10 shows a relatively flat resistivity versus cycle time plots for both the on state and the off state. This indicates substantially improved cycle endurance for resistive memory structure 10 over the cycle endurance of the conventional resistive memory structure used to create the graph in FIG. 6.
  • FIG. 8 is a graph of resistivity versus read disturb for resistive memory structure 10 showing that the resistivity of structure 10 exhibits very good read disturb characteristics in both the on state and the off state. Read disturb refers to the gain or loss of resistance of memory element 26 resulting from reading the state of the memory element 26.
  • FIG. 9 is a simplified block diagram of an integrated circuit 110 including a memory array 112 implemented using resistive memory structures 10. A word line decoder 114 having read, set and reset modes is coupled to and in electrical communication with a plurality of word lines 116 arranged along rows in the memory array 112. A bit line (column) decoder 118 is in electrical communication with a plurality of bit lines 120 arranged along columns in the array 112 for reading, setting, and resetting memory element 26 in array 112. Addresses are supplied on bus 122 to word line decoder and drivers 114 and bit line decoder 118. Sense amplifiers and data-in structures in block 124, including voltage and/or current sources for the read, set, and reset modes are coupled to bit line decoder 118 via data bus 126. Data is supplied via a data-in line 128 from input/output ports on integrated circuit 110, or from other data sources internal or external to integrated circuit 110, to data-in structures in block 124. Other circuitry 130 may be included on integrated circuit 110, such as a general purpose processor or special purpose application circuitry, or a combination of modules providing system-on-a-chip functionality supported by array 112. Data is supplied via a data-out line 132 from the sense amplifiers in block 124 to input/output ports on integrated circuit 110, or to other data destinations internal or external to integrated circuit 110.
  • A controller 134 implemented in this example, using a bias arrangement state machine, controls the application of bias arrangement supply voltages and current sources 136, such as read, program, erase, erase verify and program verify voltages and/or currents. Controller 134 may be implemented using special-purpose logic circuitry as known in the art. In alternative embodiments, controller 134 comprises a general-purpose processor, which may be implemented on the same integrated circuit to execute a computer program to control the operations of the device. In yet other embodiments, a combination of special-purpose logic circuitry and a general-purpose processor may be utilized for implementation of controller 134.
  • An exemplary formation method for WxOy uses a PVD sputtering or magnetron-sputtering method with reactive gases of Ar, N2, O2, and/or He, etc. at a pressure of 1 mTorr˜100 mTorr, using a target of WxOy. The deposition is usually performed at room temperature. A collimater with an aspect ratio of 1˜5 can be used to improve the fill-in performance. To improve the fill-in performance, the DC bias of several tens of volts to several hundreds of volts is also used. If desired, DC bias and the collimater can be used simultaneously.
  • A post-deposition annealing treatment in vacuum or in an N2 ambient or O2/N2 mixed ambient is optionally performed to improve the oxygen distribution of metal oxide. The annealing temperature ranges from 400° C. to 600° C. with an annealing time of less than 2 hours.
  • Yet another formation method uses oxidation by a high temperature oxidation system, such as a furnace or a rapid thermal pulse (“RTP”) system. The temperature ranges from 200° C. to 700° C. with pure O2 or N2/O2 mixed gas at a pressure of several mTorr to 1 atm. The time can range several minutes to hours. Another oxidation method is plasma oxidation. An RF or a DC source plasma with pure O2 or Ar/O2 mixed gas or Ar/N2/O2 mixed gas at a pressure of 1 mTorr to 100 mTorr is used to oxidize the surface of W. The oxidation time ranges several seconds to several minutes. The oxidation temperature ranges from room temperature to 300° C., depending on the degree of plasma oxidation.
  • The invention has been described with reference to specific exemplary embodiments. Various modifications, adaptations, and changes may be made without departing from the spirit and scope of the invention. Accordingly, the specification and drawings are to be regarded as illustrative of the principles of this invention rather than restrictive, the invention is defined by the following appended claims. For example, a transition or protective layer of material could be used between the buffer layer and one or both of the memory element and an electrode.
  • Any and all patents, patent applications and printed publications referred to above are incorporated by reference.

Claims (24)

1. A method of fabricating a memory device, comprising:
forming a first electrode and a second electrode; and
forming a memory element and a buffer layer located between and electrically coupled to the first and the second electrodes, the memory element comprising one or more metal oxygen compounds, the buffer layer comprising at least one of an oxide and a nitride.
2. The method according to claim 1, wherein the buffer layer is formed by down-stream plasma, plasma sputtering or reactive sputtering.
3. The method according to claim 1, wherein the memory element is formed by plasma oxidation or thermal oxidation.
4. The method according to claim 1, wherein the buffer layer is located between and electrically coupled to the memory element and the first electrode.
5. The method according to claim 1, wherein the buffer layer has a thickness of less than 50 Å.
6. The method according to claim 1, wherein the buffer layer has a resistivity of about 1013˜1016 ohm-cm.
7. The method according to claim 4, further comprising forming a second buffer layer located between and electrically coupled to the memory element and the second electrode, the second buffer layer comprising at least one of an oxide and a nitride.
8. The method according to claim 7, wherein the second buffer layer has a thickness of less than 50 Å
9. The method according to claim 1, wherein the memory element has a thickness, measured between the first and second electrodes, of 50-1000 Å.
10. The method according to claim 1, wherein the memory element comprises at least one of the following: WOx, NiO, Nb2O5, CuO2, Ta2O5, Al2O3, CoO, Fe2O3, HfO2, TiO2, SrTiO3, SrZrO3, (BaSr)TiO3, GeTi, SnMnTe, SbTe, Pr1-xCaxMnO3, (Te—Cu/GdOX, GeSb with Ag+ or Cu+).
11. The method according to claim 1, wherein the buffer layer comprises at least one of the following: a tungsten oxide, a titanium oxide, an aluminum oxide, a zirconium oxide and a silicon nitride.
12. The method according to claim 1, wherein the buffer layer comprises SiO2.
13. A method for fabricating a memory device comprising:
forming a first electrode and a second electrode;
forming a memory element and a buffer layer located between and electrically coupled to the first and the second electrodes;
selecting the memory element to comprise at least one of the following: WOx, NiO, Nb2O5, CuO2, Ta2O5, Al2O3, CoO, Fe2O3, HfO2, TiO2, GeTi, SnMnTe, SbTe, Pr1-xCaxMnO3, (Te—Cu/GdOX, GeSb with Ag+ or Cu)+; and
selecting the buffer layer to comprise at least one of the following: a tungsten oxide, a titanium oxide, an aluminum oxide, a zirconium oxide and a silicon nitride.
14. The method according to claim 13, wherein the buffer layer is located between and electrically coupled to the memory element and the first electrode.
15. The method according to claim 14, further comprising a second buffer layer located between and electrically coupled to the memory element and the second electrode, the second buffer layer comprising at least one of an oxide and a nitride.
16. The memory device according to claim 13, wherein the memory element is a programmable resistance memory element.
17. A method of fabricating a memory device comprising:
forming a first electrode;
forming a metal oxide resistive random access memory element located over and electrically coupled to the first electrode;
the memory element comprising at least one of the following: WOx, NiO, Nb2O5, CuO2, Ta2O5, Al2O3, CoO, Fe2O3, HfO2, TiO2, Pr1-xCaxMnO3, (Te—Cu/GdOX, GeSb with Ag+ or Cu+);
forming a buffer layer located over and electrically coupled to the memory element; and
forming a second electrode located over and contacting the buffer layer.
18. The method according to claim 17, wherein the buffer layer has a resistivity of about 1013˜1016 ohm-cm.
19. The method according to claim 17, further comprising forming a second buffer layer located between and electrically coupled to the memory element and the first electrode, the second buffer layer comprising at least one of an oxide and a nitride.
20. The method according to claim 19, wherein the second buffer layer has a thickness of less than 50 Å.
21. The method according to claim 17, wherein the memory element has a thickness, measured between the first and second electrodes, of 50-1000 Å.
22. The method according to claim 17, further comprising selecting the buffer layer to comprise at least one of the following: a tungsten oxide, a titanium oxide, an aluminum oxide, a zirconium oxide, a silicon nitride and a titanium nitride.
23. The method according to claim 17, further comprising selecting the buffer layer to comprise SiO2.
24. The method according to claim 17, wherein the memory element is a programmable resistance random access memory element.
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