TWM637537U

TWM637537U - Heat dissipation device

Info

Publication number: TWM637537U
Application number: TW111210505U
Authority: TW
Inventors: 陳惇達; 陳宏明; 何清
Original assignee: 華碩電腦股份有限公司
Priority date: 2022-09-27
Filing date: 2022-09-27
Publication date: 2023-02-11

Abstract

A heat dissipation device includes a heat dissipation base and a vapor chamber. The vapor chamber is disposed on the heat dissipation base, and the vapor chamber is fixed to the heat dissipation base by laser welding so as to be integrated with the heat dissipation base.

Description

heat sink

本案是有關於一種具有較佳散熱效能的散熱裝置。This case is about a heat dissipation device with better heat dissipation performance.

現下的均溫板或是熱管等散熱件是透過膠層固定於散熱基座上，散熱件的熱傳遞至散熱基座時會被膠層影響熱能的傳遞效率，進而影響散熱效能。The current heat dissipation parts such as vapor chambers or heat pipes are fixed on the heat dissipation base through an adhesive layer. When the heat of the heat dissipation element is transferred to the heat dissipation base, the heat transfer efficiency will be affected by the adhesive layer, thereby affecting the heat dissipation performance.

本案提供一種散熱裝置，其包括一散熱基座以及一均溫板，均溫板設置在散熱基座上，均溫板以雷射焊接接合於散熱基座，而與散熱基座成為一體。This case provides a heat dissipation device, which includes a heat dissipation base and a temperature equalization plate, the temperature equalization plate is arranged on the heat dissipation base, the temperature equalization plate is bonded to the heat dissipation base by laser welding, and integrated with the heat dissipation base.

基於上述，本案的散熱裝置的均溫板以雷射焊接接合於散熱基座，而與散熱基座成為一體。因此，均溫板與散熱基座之間的熱能的傳遞效率高，進而具有較佳的散熱效能。Based on the above, the vapor chamber of the heat dissipation device of the present application is joined to the heat dissipation base by laser welding, and integrated with the heat dissipation base. Therefore, the heat transfer efficiency between the vapor chamber and the heat dissipation base is high, thereby having better heat dissipation performance.

請參閱圖1至圖3，散熱裝置100包括一散熱基座110及一均溫板120。散熱基座110包括相對的一第一面112與第二面118，第一面112包括一周圍區114及凹陷於周圍區114的一凹腔116。Referring to FIGS. 1 to 3 , the heat dissipation device 100 includes a heat dissipation base 110 and a temperature chamber 120 . The heat dissipation base 110 includes a first surface 112 and a second surface 118 opposite to each other. The first surface 112 includes a surrounding area 114 and a cavity 116 recessed in the surrounding area 114 .

均溫板120適於跟熱源(未繪示)接觸，以將熱源的熱能帶走。均溫板120位於散熱基座110的第一面112的凹腔116內，且與周圍區114共平面，以使散熱基座110與均溫板120能夠穩定地放置，也就是說，均溫板120可以等高於周圍區114。當然，在其他實施例中，均溫板120也可以與周圍區114非共平面，例如均溫板120可以高於周圍區114。The vapor chamber 120 is adapted to be in contact with a heat source (not shown), so as to take away heat energy of the heat source. The temperature chamber 120 is located in the concave cavity 116 of the first surface 112 of the heat dissipation base 110, and is coplanar with the surrounding area 114, so that the heat dissipation base 110 and the temperature chamber 120 can be placed stably, that is, the temperature uniformity The plate 120 may be level with the surrounding area 114 . Certainly, in other embodiments, the temperature chamber 120 may also be non-coplanar with the surrounding area 114 , for example, the temperature chamber 120 may be higher than the surrounding area 114 .

在本實施例中，均溫板120以雷射焊接接合於散熱基座110，而與散熱基座110成為一體。因此，均溫板120與散熱基座110之間的熱能的傳遞效率高，進而具有較佳的散熱效能。In this embodiment, the temperature chamber 120 is joined to the heat dissipation base 110 by laser welding, and is integrated with the heat dissipation base 110 . Therefore, the heat transfer efficiency between the vapor chamber 120 and the heat dissipation base 110 is high, thereby having better heat dissipation performance.

如圖4所示，均溫板120包括一內腔122及位於上表面的一接合區124，均溫板120透過接合區124雷射焊接接合至散熱基座110。搭配圖2與圖4可見，接合區124對散熱基座110的投影位於內腔122對散熱基座110的投影之外。如圖2所示，在本實施例中，接合區124例如是環型區。接合區124環繞內腔122對散熱基座110的投影。這樣的設計避免均溫板120與散熱基座110進行雷射接合時，熱熔的區域影響到內腔122。As shown in FIG. 4 , the temperature chamber 120 includes an inner cavity 122 and a bonding area 124 on the upper surface, and the temperature chamber 120 is bonded to the heat dissipation base 110 through the bonding area 124 by laser welding. It can be seen from FIG. 2 and FIG. 4 that the projection of the bonding area 124 on the heat dissipation base 110 is outside the projection of the inner cavity 122 on the heat dissipation base 110 . As shown in FIG. 2 , in this embodiment, the junction area 124 is, for example, an annular area. The bonding area 124 surrounds the projection of the inner cavity 122 to the heat dissipation base 110 . Such a design prevents the inner cavity 122 from being affected by the thermally fused area when the vapor chamber 120 is laser bonded to the heat dissipation base 110 .

在一實施例中，均溫板120在內腔122的正上方的外表面與散熱基座110之間可選擇地填入散熱膠。然而，即便均溫板120在內腔122的正上方的外表面與散熱基座110之間填入散熱膠，由於均溫板120的接合區124與散熱基座110之間仍使採用雷射焊接接合，相較於習知整個均溫板與散熱基座之間均使用膠合的方式固定，本實施例的散熱裝置100在均溫板120的接合區124與散熱基座110之間仍為一體而直接導熱，因此具有較佳的散熱效果。In one embodiment, heat dissipation glue can be optionally filled between the outer surface directly above the inner chamber 122 and the heat dissipation base 110 of the temperature chamber 120 . However, even if heat dissipation glue is filled between the outer surface directly above the inner chamber 122 and the heat dissipation base 110 of the chamber 120 , since the joint area 124 of the temperature chamber 120 and the heat dissipation base 110 still use laser Welding, compared to the conventional method of gluing between the entire temperature chamber and the heat dissipation base, the heat dissipation device 100 of this embodiment is still between the joint area 124 of the temperature chamber 120 and the heat dissipation base 110 One body and direct heat conduction, so it has better heat dissipation effect.

在一實施例中，散熱裝置100更可選擇地包括一熱管130，熱管130連接於均溫板120且穿過散熱基座110。熱管130包括一內管132，內腔122連通於內管132。因此，均溫板120的內腔122內的兩相流體可流動至熱管130的內管132。In one embodiment, the heat dissipation device 100 further optionally includes a heat pipe 130 , and the heat pipe 130 is connected to the temperature chamber 120 and passes through the heat dissipation base 110 . The heat pipe 130 includes an inner tube 132 , and the inner cavity 122 communicates with the inner tube 132 . Therefore, the two-phase fluid in the inner cavity 122 of the vapor chamber 120 can flow to the inner tube 132 of the heat pipe 130 .

另外，在本實施例中，散熱裝置100更包括一鰭片組140。熱管130穿設且緊配於鰭片組140。因此，由熱源的熱能可由均溫板120傳遞至散熱基座110與熱管130，再透過熱管130傳遞至鰭片組140。In addition, in this embodiment, the heat dissipation device 100 further includes a fin set 140 . The heat pipe 130 passes through and is closely matched with the fin set 140 . Therefore, the heat energy from the heat source can be transferred from the vapor chamber 120 to the heat dissipation base 110 and the heat pipe 130 , and then transferred to the fin set 140 through the heat pipe 130 .

如圖4所示，鰭片組140位於散熱基座110的第二面118上方，鰭片組140與散熱基座110間隔一距離X，而懸空於散熱基座110。這樣的設計可增加鰭片組140與散熱基座110之間的氣流流動空間，以提升效能。As shown in FIG. 4 , the fin set 140 is located above the second surface 118 of the heat dissipation base 110 , the fin set 140 is spaced a distance X from the heat dissipation base 110 , and is suspended above the heat dissipation base 110 . Such a design can increase the air flow space between the fin set 140 and the heat dissipation base 110 to improve performance.

綜上所述，本案的散熱裝置的均溫板以雷射焊接接合於散熱基座，而與散熱基座成為一體。因此，均溫板與散熱基座之間的熱能的傳遞效率高，進而具有較佳的散熱效能。To sum up, the vapor chamber of the heat dissipation device in this case is joined to the heat dissipation base by laser welding, and integrated with the heat dissipation base. Therefore, the heat transfer efficiency between the vapor chamber and the heat dissipation base is high, thereby having better heat dissipation performance.

X:距離 100:散熱裝置 110:散熱基座 112:第一面 114:周圍區 116:凹腔 118:第二面 120:均溫板 122:內腔 124:接合區 130:熱管 132:內管 140:鰭片組 X: distance 100: cooling device 110: cooling base 112: The first side 114: surrounding area 116: concave cavity 118: The second side 120: vapor chamber 122: inner cavity 124: Junction zone 130: heat pipe 132: inner tube 140: fin group

圖1是依照本案的一實施例的一種散熱裝置的示意圖。圖2是圖1的散熱裝置的爆炸示意圖。圖3是圖2的另一視角的示意圖。圖4是圖1的散熱裝置的剖面示意圖。 FIG. 1 is a schematic diagram of a heat dissipation device according to an embodiment of the present application. FIG. 2 is an exploded schematic diagram of the cooling device in FIG. 1 . FIG. 3 is a schematic diagram of another viewing angle of FIG. 2 . FIG. 4 is a schematic cross-sectional view of the heat sink in FIG. 1 .

100:散熱裝置 100: cooling device

110:散熱基座 110: cooling base

112:第一面 112: The first side

114:周圍區 114: surrounding area

116:凹腔 116: concave cavity

118:第二面 118: The second side

120:均溫板 120: vapor chamber

124:接合區 124: Junction zone

130:熱管 130: heat pipe

140:鰭片組 140: fin group

Claims

A heat dissipation device includes: a heat dissipation base; and a uniform temperature plate, which is arranged on the heat dissipation base. The temperature equalization plate is joined to the heat dissipation base by laser welding and integrated with the heat dissipation base.

The heat dissipation device as claimed in claim 1 further includes a heat pipe connected to the vapor chamber.

The heat dissipation device according to claim 2, wherein the heat dissipation base includes a first surface and a second surface opposite to each other, the temperature chamber is located on the first surface, and the heat pipe passes through the heat dissipation base.

The heat dissipation device according to claim 2, wherein the vapor chamber includes an inner cavity, the heat pipe includes an inner tube, and the inner cavity communicates with the inner tube.

The heat dissipation device according to claim 2 further includes a fin set, wherein the heat pipe passes through and is tightly fitted to the fin set.

The heat dissipation device according to claim 5, wherein the heat dissipation base includes a first surface and a second surface opposite to each other, the temperature chamber is located on the first surface, and the fin group is located above the second surface.

The heat dissipation device as claimed in claim 5, wherein the fin group is separated from the heat dissipation base by a distance, and is suspended from the heat dissipation base.

The heat dissipation device as claimed in claim 1, wherein the temperature chamber includes an inner cavity and a joint area, and the heat chamber is bonded to the heat dissipation base through the joint area by laser welding The projection of the bonding area to the heat dissipation base is outside the projection of the inner cavity to the heat dissipation base.

The heat dissipation device as claimed in claim 8, wherein the bonding area surrounds the projection of the inner cavity to the heat dissipation base.

The heat dissipation device according to claim 1, wherein the heat dissipation base includes a first surface, the first surface includes a surrounding area and a cavity recessed in the surrounding area, and the temperature chamber is located in the cavity, and coplanar with the surrounding area.