TWM619910U - Seal - Google Patents

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Publication number
TWM619910U
TWM619910U TW110206233U TW110206233U TWM619910U TW M619910 U TWM619910 U TW M619910U TW 110206233 U TW110206233 U TW 110206233U TW 110206233 U TW110206233 U TW 110206233U TW M619910 U TWM619910 U TW M619910U
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Taiwan
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seal
antenna structure
chip
layer
radio frequency
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TW110206233U
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Chinese (zh)
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柳碧芳
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財政部關務署
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Priority to TW110206233U priority Critical patent/TWM619910U/en
Publication of TWM619910U publication Critical patent/TWM619910U/en

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Abstract

A seal includes a first adhesive layer, an electronic component layer, a second adhesive layer and a protective layer. The first adhesive layer has a first thickness. The electronic component layer is arranged over the first adhesive layer and includes a first radio frequency identification tag, wherein the radio frequency identification tag includes a first antenna structure and a first chip electrically connected to the first antenna structure. The second adhesive layer is disposed over the electronic component layer and has a second thickness different from the first thickness. The protective layer is arranged over the second adhesive layer.

Description

封條Seal

本公開涉及一種封條,並且特別地涉及包含無線射頻辨識標籤的電子封條。The present disclosure relates to a seal, and particularly to an electronic seal including a radio frequency identification tag.

國際間的貿易或物品流通大部分是被放置在貨櫃中而被運送。在運送貨櫃的過程中,可能會發生貨櫃或者貨櫃內的物品被掉包和失竊等問題。因此, 對於全球的貿易及物品流通來說,貨櫃的安全監控機制是重要的課題。Most of the international trade or the circulation of goods are placed in containers and transported. In the process of shipping the container, problems such as the container or the contents of the container may be dropped and stolen. Therefore, the safety monitoring mechanism of containers is an important issue for global trade and the circulation of goods.

傳統上,貨櫃會在其門栓處被封櫃。此類封櫃通常會利用機械式的貨櫃封條。在一些情境中,機械式的貨櫃封條會被打印外露的條碼,以供海關人員比對。但是,此機械式貨櫃的封條不僅易被破壞,也易被複製,故安全性不高。Traditionally, containers are sealed at their door bolts. Such seals usually utilize mechanical container seals. In some scenarios, mechanical container seals will be printed with exposed barcodes for comparison by customs officers. However, the seal of this mechanical container is not only easy to be damaged, but also easy to be copied, so the safety is not high.

本公開的一方面提供一種封條,包括第一黏著層、電子元件層、第二黏著層及保護層。該第一黏著層具有第一厚度。該電子元件層設於該第一黏著層上,並包括第一無線射頻辨識標籤,其中該無線射頻辨識標籤包括第一天線結構,及與該天線結構電性連接的第一晶片。該第二黏著層設於該電子元件層上,並具有相異於該第一厚度的第二厚度。該保護層設於該第二黏著層上。An aspect of the present disclosure provides a seal including a first adhesive layer, an electronic component layer, a second adhesive layer, and a protective layer. The first adhesive layer has a first thickness. The electronic component layer is disposed on the first adhesive layer and includes a first radio frequency identification tag, wherein the radio frequency identification tag includes a first antenna structure and a first chip electrically connected to the antenna structure. The second adhesive layer is disposed on the electronic component layer and has a second thickness different from the first thickness. The protective layer is arranged on the second adhesive layer.

以下描述將參考附圖以更全面地描述本公開內容。附圖中所示為本公開的示例性實施例。然而,本公開可以以許多不同的形式來實施,並且不應所述被解釋為限於在此闡述的示例性實施例。提供這些示例性實施例是為了使本公開透徹和完整,並且將本公開的範圍充分地傳達給本領域技術人員。類似的附圖標記表示相同或類似的元件。The following description will refer to the accompanying drawings to more fully describe the present disclosure. The drawings show exemplary embodiments of the present disclosure. However, the present disclosure can be implemented in many different forms, and should not be construed as being limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present disclosure thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art. Similar reference numerals indicate the same or similar elements.

本文使用的術語僅用於描述特定示例性實施例的目的,而不意圖限制本公開。如本文所使用的,除非上下文另外清楚地指出,否則單數形式“一”,“一個”和“所述”旨在也包括複數形式。此外,當在本文中使用時,“包括”和/或“包含”或“包括”和/或“包括”或“具有”和/或“具有”,整數,步驟,操作,元件和/或組件,但不排除存在或添加一個或多個其它特徵,區域,整數,步驟,操作,元件,組件和/或其群組。The terminology used herein is only used for the purpose of describing specific exemplary embodiments, and is not intended to limit the present disclosure. As used herein, unless the context clearly dictates otherwise, the singular forms "a", "an" and "said" are intended to also include the plural forms. In addition, when used herein, "includes" and/or "includes" or "includes" and/or "includes" or "has" and/or "has", integers, steps, operations, elements and/or components , But does not exclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components and/or groups thereof.

除非另外定義,否則本文使用的所有術語(包括技術和科學術語)具有與本公開所屬領域的普通技術人員通常理解的相同的含義。此外,除非文中明確定義,諸如在通用字典中定義的那些術語應所述被解釋為具有與其在相關技術和本公開內容中的含義一致的含義,並且將不被解釋為理想化 或過於正式的含義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure belongs. In addition, unless clearly defined in the text, terms such as those defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the related technology and the present disclosure, and will not be interpreted as idealized or overly formal meaning.

將結合圖1至圖10中的附圖對示例性實施例進行描述。具體實施方式將參考附圖來詳細描述本案內容,其中,所描繪的元件不必然按比例示出,並且通過若干視圖,相同或相似的附圖標記由相同或相似的附圖標記表示相同或相似的元件。Exemplary embodiments will be described with reference to the drawings in FIGS. 1 to 10. DETAILED DESCRIPTION The content of this case will be described in detail with reference to the accompanying drawings, wherein the depicted elements are not necessarily shown to scale, and through several views, the same or similar reference signs are represented by the same or similar reference signs to indicate the same or similar Components.

圖1示出了根據本公開的一些實施例的封條的俯視示意圖。圖2示出了根據本公開的一些實施例的封條的剖面示意圖。在一些實施例中,圖2是沿著圖1的A-A’剖線的剖視圖。為了說明簡單和清楚起見,示例性系統的一些細節/子組件未在圖中明確標記/示出。Fig. 1 shows a schematic top view of a seal according to some embodiments of the present disclosure. Figure 2 shows a schematic cross-sectional view of a seal according to some embodiments of the present disclosure. In some embodiments, FIG. 2 is a cross-sectional view along the line A-A' of FIG. 1. For simplicity and clarity of description, some details/sub-components of the exemplary system are not clearly marked/shown in the figure.

封條的形狀允許其同時貼在已被封閉的貨櫃的兩個門板。如此,當貨櫃門被開啟,封條便可能產生視覺上可被辨識的破損,從而達到警示查驗人員的目的。以圖1所示的封條100為例,其具有大致成矩形的俯視輪廓,而可被定義出兩個側邊區域120以及一個位於該兩側邊區域120之間的中間區域110。在一些使用情境中,兩個側邊區域120會被分別黏貼在貨櫃的兩個門板上。因此,當貨櫃門被開啟, 側邊區域120便會受損。值得說明的是,中間區域110可以被黏貼在兩個門板交界處的膠條上;藉此,當貨櫃門被開啟,即便側邊區域120受損,在膠條上的中間區域110有較高的機會能維持其結構的完整性。The shape of the seal allows it to be attached to both door panels of a closed container at the same time. In this way, when the container door is opened, the seal may be damaged visually identifiable, so as to achieve the purpose of alerting the inspector. Taking the seal 100 shown in FIG. 1 as an example, it has a substantially rectangular top-view profile, and can be defined as two side regions 120 and an intermediate region 110 located between the two side regions 120. In some usage scenarios, the two side areas 120 will be attached to the two door panels of the container, respectively. Therefore, when the container door is opened, the side area 120 will be damaged. It is worth noting that the middle area 110 can be glued to the glue strip at the junction of the two door panels; by this, when the container door is opened, even if the side area 120 is damaged, the middle area 110 on the glue strip is higher. The opportunity to maintain its structural integrity.

參閱圖2,在圖示的剖面圖中,封條200設於離型層205上,並且包含第一黏著層215、設於該第一黏著層215上的電子元件層225、設於該電子元件層225上的第二黏著層235及設於該第二黏著層235上的保護層245。當封條200從離型層205被撕下,便可藉由第一黏著層215以類似貼片的形式黏著於物品例如貨櫃門板。離型層205可以是離型紙或、易碎紙、或銅版紙。在一些實施例中,該第一黏著層215包含一膠層,並具有第一厚度T1。第二黏著層235包含一膠層並具有相異於該第一厚度T1的第二厚度T2。在一些實施例中,第一黏著層215的厚度大於第二黏著層235的厚度而具有較大的黏性,故適於黏貼貨櫃門板。在一些實施例中,該第一厚度T1與第二厚度T2的比例介於6到1之間。Referring to FIG. 2, in the cross-sectional view shown, the seal 200 is disposed on the release layer 205, and includes a first adhesive layer 215, an electronic component layer 225 disposed on the first adhesive layer 215, and an electronic component The second adhesive layer 235 on the layer 225 and the protective layer 245 provided on the second adhesive layer 235. When the seal 200 is torn off from the release layer 205, the first adhesive layer 215 can be adhered to an article, such as a container door, in a form similar to a patch. The release layer 205 may be release paper, fragile paper, or coated paper. In some embodiments, the first adhesive layer 215 includes a glue layer and has a first thickness T1. The second adhesive layer 235 includes a glue layer and has a second thickness T2 different from the first thickness T1. In some embodiments, the thickness of the first adhesive layer 215 is greater than the thickness of the second adhesive layer 235 and has greater adhesion, so it is suitable for sticking to the container door. In some embodiments, the ratio of the first thickness T1 to the second thickness T2 is between 6 and 1.

電子元件層225包括無線射頻辨識(Radio Frequency Identification,  RFID)標籤,其包含晶片及電連接該晶片的天線結構。當外部RFID讀取器所發射電磁信號被天線結構接收時,晶片將儲存於內部的識別信息經由該天線結構發射出以供該外部RFID讀取器接收,從而達到資訊交換的功能。在一些實施例中,該識別信息包含對應於該貨櫃或者貨櫃內容物的唯一識別碼(Unique Identifier,UID)。The electronic component layer 225 includes a radio frequency identification (RFID) tag, which includes a chip and an antenna structure electrically connected to the chip. When the electromagnetic signal emitted by the external RFID reader is received by the antenna structure, the chip transmits the identification information stored in the internal through the antenna structure for the external RFID reader to receive, thereby achieving the function of information exchange. In some embodiments, the identification information includes a unique identifier (UID) corresponding to the container or the contents of the container.

該保護層245提供保護功能使得所述電子元件層免於接觸外部污染物。舉例來說,保護層245包含聚酯合成紙(Polypropylene (PP)合成)而具有防水特性。在一些實施例中,保護層245上可印製特定文字或圖樣(如圖1中封條100上的「封條」一語),以警示他人勿輕易撕毀。然應注意的是,圖1中封條100上的「封條」一語僅為一例示,本公開並不以此為限。封條100上亦可印製其他用語及/或圖樣,亦可不印有任何標語或圖樣。The protective layer 245 provides a protective function to prevent the electronic component layer from contacting external contaminants. For example, the protective layer 245 includes polyester synthetic paper (Polypropylene (PP) synthesis) and has waterproof properties. In some embodiments, the protective layer 245 may be printed with specific words or patterns (such as the term "seal" on the seal 100 in FIG. 1) to warn others not to tear it easily. However, it should be noted that the term "seal" on the seal 100 in FIG. 1 is only an example, and the present disclosure is not limited thereto. Other terms and/or patterns may also be printed on the seal 100, or any slogan or pattern may not be printed.

圖3示出了根據本公開的一些實施例的封條的電子元件層的俯視示意圖。為了說明簡單和清楚起見,示例性系統的一些細節/子組件未在圖中明確標記/示出。FIG. 3 shows a schematic top view of the electronic component layer of the seal according to some embodiments of the present disclosure. For simplicity and clarity of description, some details/sub-components of the exemplary system are not clearly marked/shown in the figure.

圖示的電子元件層325包括第一RFID標籤321,其中該RFID標籤321包括第一天線結構322,及與該第一天線結構322電性連接的第一晶片323。The illustrated electronic component layer 325 includes a first RFID tag 321, wherein the RFID tag 321 includes a first antenna structure 322 and a first chip 323 electrically connected to the first antenna structure 322.

當外部RFID讀取器所發射電磁信號被第一天線結構322接收而激發第一晶片323,使第一晶片323的內部相關資訊(例如,識別信息)反向以電磁信號回送到該外部RFID讀取器,從而達到資訊交換功能。When the electromagnetic signal emitted by the external RFID reader is received by the first antenna structure 322, the first chip 323 is excited, and the internal related information (for example, identification information) of the first chip 323 is reversed and sent back to the external RFID with electromagnetic signals. Reader, so as to achieve the function of information exchange.

圖3所示的封條的平面輪廓大致呈矩形。圖示的第一天線結構322具有主體部322m及六個突出部322p。當知雖然圖3所示的第一天線結構322具有六個突出部322p,但本公開並不限於此,第一天線結構322可具有任意數量的突出部。The plane profile of the seal shown in FIG. 3 is roughly rectangular. The illustrated first antenna structure 322 has a main body 322m and six protrusions 322p. It should be understood that although the first antenna structure 322 shown in FIG. 3 has six protrusions 322p, the present disclosure is not limited thereto, and the first antenna structure 322 may have any number of protrusions.

主體部322m係一多匝的環型天線結構,而突出部322p係延伸自該環型天線結構的最外匝。換言之,主體部322m連同突出部322p皆屬於第一天線結構322的金屬輻射部。因此,突出部322p的形狀、長寬皆會影響第一天線結構322的天線特性(例如,操作頻率)及/或其他電性特徵(例如,阻抗匹配特性、等效電路等)。示例性第一天線結構322可具有跨橋元件322b,用以跨接兩分離的金屬接點而使彼此電性連接,藉此形成環形天線結構。The main body portion 322m is a multi-turn loop antenna structure, and the protruding portion 322p extends from the outermost turn of the loop antenna structure. In other words, the main body portion 322m and the protruding portion 322p all belong to the metal radiating portion of the first antenna structure 322. Therefore, the shape, length and width of the protrusion 322p will affect the antenna characteristics (for example, operating frequency) and/or other electrical characteristics (for example, impedance matching characteristics, equivalent circuit, etc.) of the first antenna structure 322. The exemplary first antenna structure 322 may have a bridge element 322b for bridging two separate metal contacts to be electrically connected to each other, thereby forming a loop antenna structure.

主體部322m可設置於該平面輪廓的中間區域310,以利於封條黏貼於貨櫃門時,該主體部322m可實質對應於該貨櫃門的膠條處,進而避免該主體部322m因不當接觸該貨櫃門的金屬面而短路失效。The main body portion 322m can be arranged in the middle area 310 of the plane contour to facilitate the adhesion of the seal to the container door. The main body portion 322m can substantially correspond to the rubber strip of the container door, thereby preventing the main body portion 322m from improperly contacting the container. The metal surface of the door fails due to a short circuit.

另外,由於突出部322p屬於第一天線結構322的一部分,故若該突出部322p損壞(例如,斷裂或破裂)時,將導致第一天線結構322的天線特性及/或其他電性特徵發生變化。此時若以外部RFID讀取器對封條進行讀取,該外部RFID讀取器可能無法對該封條進行讀取,或是所得到的讀取結果會將異於第一天線結構322完好時所得到的讀取結果。查驗人員可透過無線通訊裝置上的特定應用程式(Application,APP)識別該外部RFID讀取器的讀取結果,並根據該讀取結果判斷該封條的結構是否損壞。舉例來說,當封條的突出部322p斷裂或破損,此時若以外部RFID讀取器讀取該封條,與該外部RFID讀取器連線的該特定APP將顯示該外部RFID讀取器讀取失敗、讀取異常或無法識別。因此,即便該封條的目測外觀無明顯破損,查驗人員仍能直接透過該特定APP知悉該封條是否損壞,進而強化封條的安全性。In addition, since the protrusion 322p is a part of the first antenna structure 322, if the protrusion 322p is damaged (for example, broken or cracked), the antenna characteristics and/or other electrical characteristics of the first antenna structure 322 will be caused. Changes. At this time, if an external RFID reader is used to read the seal, the external RFID reader may not be able to read the seal, or the reading result obtained will be different from when the first antenna structure 322 is intact The reading result obtained. The inspector can identify the reading result of the external RFID reader through a specific application (APP) on the wireless communication device, and judge whether the structure of the seal is damaged according to the reading result. For example, when the protrusion 322p of the seal is broken or damaged, if the seal is read by an external RFID reader, the specific APP connected to the external RFID reader will display the external RFID reader reading Fetch failed, read abnormally, or unrecognized. Therefore, even if the visual appearance of the seal is not obviously damaged, the inspector can still know whether the seal is damaged directly through the specific APP, thereby enhancing the safety of the seal.

另一方面,在圖示的實施例中,該突出部322p從該主體部322m向外延伸到該平面輪廓的邊界B附近,從而佈及側邊區域320。如此,當貨櫃門被開啟,側邊區域320以及突出部322p都會受損,進而影響外部RFID讀取器對封條的讀取結果。在一些實施例中,突出部322p與邊界B之間的距離不大於封條整體長度的5%。圖示中的六個突出部322p從該主體部322m向外延伸到側邊區域320。On the other hand, in the illustrated embodiment, the protruding portion 322p extends outward from the main body portion 322m to the vicinity of the boundary B of the plane profile, so as to extend to the side area 320. In this way, when the container door is opened, the side area 320 and the protrusion 322p will be damaged, which will affect the reading result of the seal by the external RFID reader. In some embodiments, the distance between the protrusion 322p and the boundary B is no more than 5% of the entire length of the seal. The six protrusions 322p in the figure extend outward from the main body 322m to the side area 320.

圖4示出了根據本公開的一些實施例的封條的電子元件層的俯視示意圖。為了說明簡單和清楚起見,示例性系統的一些細節/子組件未在圖中明確標記/示出。FIG. 4 shows a schematic top view of the electronic component layer of the seal according to some embodiments of the present disclosure. For simplicity and clarity of description, some details/sub-components of the exemplary system are not clearly marked/shown in the figure.

圖示的電子元件層425包括第一RFID標籤421,其中該RFID標籤421包括第一天線結構422,及與該第一天線結構422電性連接的第一晶片423。The illustrated electronic component layer 425 includes a first RFID tag 421, wherein the RFID tag 421 includes a first antenna structure 422 and a first chip 423 electrically connected to the first antenna structure 422.

圖4所示的封條的平面輪廓大致呈矩形。該第一天線結構422具有主體部422m及突出部422p。在圖示的實施例中,突出部422p的數量為二,並且分別延伸自主體部422m的最外匝而和主體部422m共同作為第一天線結構422的金屬輻射部。該主體部422m設置於該平面輪廓的中間區域410 ;該突出部422p從該主體部422m向外延伸到該平面輪廓的邊界附近,從而佈及側邊區域420。示例性第一天線結構422具有跨橋元件422b,用以跨接兩分離的金屬接點而使彼此電性連接,藉此形成環形天線結構。The plane profile of the seal shown in FIG. 4 is roughly rectangular. The first antenna structure 422 has a main body 422m and a protrusion 422p. In the illustrated embodiment, the number of the protrusions 422p is two, and they respectively extend from the outermost turn of the main body 422m and serve as the metal radiating portion of the first antenna structure 422 together with the main body 422m. The main body portion 422m is disposed in the middle area 410 of the plane contour; the protrusion 422p extends outward from the main body portion 422m to the vicinity of the boundary of the plane contour, thereby covering the side area 420. The exemplary first antenna structure 422 has a bridge element 422b for connecting two separate metal contacts to electrically connect each other, thereby forming a loop antenna structure.

類似於圖3所示的突出部322p,突出部422p屬於第一天線結構422的一部分,故若該突出部422p損壞,將導致第一天線結構422的天線特性及/或其他電性特徵發生變化。此時若以外部RFID讀取器對封條進行讀取,所得到的讀取結果將異於第一天線結構422完好時所得到的讀取結果。查驗人員及/或後台系統可透過無線通訊裝置上的特定APP識別上述讀取結果之差異(例如,識別該讀取結果是否為讀取錯誤、讀取異常或無法識別),藉此判斷該封條的結構是否損壞。Similar to the protrusion 322p shown in FIG. 3, the protrusion 422p is a part of the first antenna structure 422. Therefore, if the protrusion 422p is damaged, the antenna characteristics and/or other electrical characteristics of the first antenna structure 422 will be caused. Changes. At this time, if an external RFID reader is used to read the seal, the reading result obtained will be different from the reading result obtained when the first antenna structure 422 is intact. The inspector and/or the back-end system can identify the difference of the above-mentioned reading results through a specific APP on the wireless communication device (for example, identify whether the reading result is a reading error, reading abnormality, or unrecognized), so as to determine the seal Whether the structure is damaged.

在一些實施例中,相較於正常讀取下所取得的讀取結果,讀取異常例如是指僅能從讀取結果中取得該第一晶片423中部分或不完整的可讀取資訊。舉例來說,若該第一天線結構422之結構完整,外部RFID讀取器可對該第一晶片423作正常讀取以取得第一讀取結果,其中該第一讀取結果中可包含該第一晶片423中完整的可讀取資訊;反之,若該第一天線結構422之結構損壞(例如該突出部422p斷裂),該外部RFID讀取器雖仍可能對該第一晶片423進行讀取並取得第二讀取結果,但該第二讀取結果可能僅是該第一晶片423中部分或不完整的可讀取資訊。換言之,該第二讀取結果將相異於該第一讀取結果。無線通訊裝置上的特定APP可和該外部RFID讀取器做資訊交換,以取得該第一讀取結果以及該第二讀取結果,並識別該第一讀取結果與該第二讀取結果之差異,以判斷該封條之結構是否損壞(例如,若讀取結果對應該第二讀取結果,則判斷該封條之結構損壞)。在一些實施例中,該特定APP可透過呈現影像、播放聲音及/或發送信號等方式,將上述之判斷結果提供予查驗人員及/或後台系統。In some embodiments, compared with the reading result obtained under normal reading, the reading abnormality refers to, for example, that only partial or incomplete readable information of the first chip 423 can be obtained from the reading result. For example, if the structure of the first antenna structure 422 is complete, the external RFID reader can read the first chip 423 normally to obtain the first reading result, where the first reading result may include Completely readable information in the first chip 423; on the contrary, if the structure of the first antenna structure 422 is damaged (for example, the protrusion 422p is broken), the external RFID reader may still be able to read the first chip 423 The reading is performed and the second reading result is obtained, but the second reading result may be only partial or incomplete readable information in the first chip 423. In other words, the second reading result will be different from the first reading result. The specific APP on the wireless communication device can exchange information with the external RFID reader to obtain the first reading result and the second reading result, and to identify the first reading result and the second reading result To determine whether the structure of the seal is damaged (for example, if the reading result corresponds to the second reading result, then it is judged that the structure of the seal is damaged). In some embodiments, the specific APP can provide the above-mentioned judgment result to the inspector and/or the background system by displaying images, playing sounds, and/or sending signals.

此外,經觀察發現,當貨櫃被載運時,不同的貨櫃門扇之間常會因車輛行駛晃動而產生錯動,故當封條黏貼於貨櫃門縫時,四個角落區域C容易因為貨櫃門扇間的錯動而受損,致使貨櫃被誤認為不當開啟。如果電子元件(例如第一天線結構422或第一晶片423)佈及所述角落區域C,容易連帶受損。因此在一些應用中,封條的電子元件可以避開該等四個角落區域C設置,從而降低受損的機會。舉例而言,在圖示的第一天線結構422的該兩突出部422p皆避開該封條的平面輪廓的四個角落區域C設置(例如,約沿著封條的中央水平長軸線往兩側延伸)。在一些實施例中, 圖示的封條可更具有T字型切口T,該T字型切口T的兩個翼部大致沿著該第一天線結構422的主體部422m的外緣延伸。當封條被撕開,則T字型切口T有助於破壞封條的整體結構,容易在視覺上被辨識。In addition, it has been observed that when the container is being transported, the door leaves of different containers often move due to the shaking of the vehicle. Therefore, when the seal is stuck to the seam of the container door, the four corner areas C are prone to errors between the door leaves of the container. The container was mistakenly regarded as improperly opened. If the electronic components (such as the first antenna structure 422 or the first chip 423) are placed on the corner area C, they are easily damaged. Therefore, in some applications, the electronic components of the seal can be arranged to avoid the four corner regions C, thereby reducing the chance of damage. For example, the two protrusions 422p of the first antenna structure 422 shown in the figure are arranged to avoid the four corner regions C of the plane profile of the seal (for example, approximately along the central horizontal long axis of the seal to both sides extend). In some embodiments, the illustrated seal may further have a T-shaped notch T, and the two wings of the T-shaped notch T extend substantially along the outer edge of the main body portion 422m of the first antenna structure 422. When the seal is torn apart, the T-shaped cut T helps to destroy the overall structure of the seal and is easy to be recognized visually.

圖5示出了根據本公開的一些實施例的封條的電子元件層的俯視示意圖。為了說明簡單和清楚起見,示例性系統的一些細節/子組件未在圖中明確標記/示出。FIG. 5 shows a schematic top view of the electronic component layer of the seal according to some embodiments of the present disclosure. For simplicity and clarity of description, some details/sub-components of the exemplary system are not clearly marked/shown in the figure.

圖示的電子元件層525包括第一RFID標籤521,其中該RFID標籤521包括第一天線結構522,及與該第一天線結構522電性連接的第一晶片523。該第一天線結構522設置於該平面輪廓的中間區域510。該第一RFID標籤521更包括與該晶片電性連接的第一導電線路524。該第一導電線路524環繞該第一天線結構522設置,並延伸到該封條的平面輪廓的邊界附近,從而佈及側邊區域520。The illustrated electronic component layer 525 includes a first RFID tag 521, wherein the RFID tag 521 includes a first antenna structure 522 and a first chip 523 electrically connected to the first antenna structure 522. The first antenna structure 522 is disposed in the middle area 510 of the plane profile. The first RFID tag 521 further includes a first conductive circuit 524 electrically connected to the chip. The first conductive line 524 is arranged around the first antenna structure 522 and extends to the vicinity of the boundary of the plane profile of the seal, so as to extend to the side area 520.

圖示的該第一晶片523包括第一組腳位523a及第二組腳位523b。該第一組腳位523a電性連接該第一天線結構522。該第二組腳位523b電性連接該第一導電線路524。The illustrated first chip 523 includes a first set of pins 523a and a second set of pins 523b. The first set of pins 523a are electrically connected to the first antenna structure 522. The second set of pins 523b are electrically connected to the first conductive circuit 524.

該第一晶片523被配置以透過該第一組腳位523a對該第一天線結構522饋入訊號,並透過該第二組腳位523b偵測該第一導電線路524是否斷裂。舉例來說,該第一晶片523 可透過該第二組腳位523b偵測第一導電線路524所構成的迴路是否呈開路(open)狀態,以判斷該第一導電線路524是否斷裂(例如,若偵測到該迴路呈開路狀態,則判斷該第一導電線路524斷裂)。此外,與前述圖3或圖4所示的突出部322p或422p不同的是,該第一導電線路524並非該第一天線結構522的一部份,故該第一導電線路524的斷裂與否實質上並不會影響該第一天線結構522的天線特性或其他電性特徵。透過此設置,封條中該第一導電線路524的斷裂與否將不影響外部RFID讀取器對該封條的正常讀取。換言之,即便該第一導電線路524 斷裂,若該第一天線結構522 的結構尚維持完整,外部RFID讀取器仍可成功讀取該第一晶片523中的信息(例如,完整的可讀取資訊)。此外,該外部RFID讀取器的讀取結果更可包含該第一晶片523對該第一導電線路524的開路偵測結果,以供查驗人員或後台系統判斷該第一導電線路524是否斷裂或封條是否被破壞。舉例來說,該開路偵測結果可被提供至安裝有特定APP的無線通訊裝置,該特定APP可根據該開路偵測結果判斷封條的結構是否損壞,並透過影像、聲音及/或信號等方式,將其判斷結果提供予查驗人員及/或後台系統。The first chip 523 is configured to feed a signal to the first antenna structure 522 through the first set of pins 523a, and to detect whether the first conductive circuit 524 is broken through the second set of pins 523b. For example, the first chip 523 can detect whether the loop formed by the first conductive circuit 524 is in an open state through the second set of pins 523b to determine whether the first conductive circuit 524 is broken (for example, If it is detected that the loop is open, it is determined that the first conductive line 524 is broken). In addition, unlike the protrusion 322p or 422p shown in FIG. 3 or FIG. 4, the first conductive line 524 is not a part of the first antenna structure 522, so the fracture of the first conductive line 524 and No, it does not substantially affect the antenna characteristics or other electrical characteristics of the first antenna structure 522. Through this arrangement, whether the first conductive circuit 524 in the seal is broken or not will not affect the normal reading of the seal by the external RFID reader. In other words, even if the first conductive line 524 is broken, if the structure of the first antenna structure 522 remains intact, the external RFID reader can still successfully read the information in the first chip 523 (for example, a complete readable Get information). In addition, the reading result of the external RFID reader may further include the open detection result of the first chip 523 on the first conductive circuit 524, so that the inspector or the background system can determine whether the first conductive circuit 524 is broken or not. Whether the seal is broken. For example, the open circuit detection result can be provided to a wireless communication device installed with a specific APP, and the specific APP can determine whether the structure of the seal is damaged according to the open circuit detection result, and through video, audio, and/or signal methods. , Provide its judgment result to the inspector and/or back-end system.

圖6示出了根據本公開的一些實施例的封條的電子元件層的俯視示意圖。為了說明簡單和清楚起見,示例性系統的一些細節/子組件未在圖中明確標記/示出。FIG. 6 shows a schematic top view of the electronic component layer of the seal according to some embodiments of the present disclosure. For simplicity and clarity of description, some details/sub-components of the exemplary system are not clearly marked/shown in the figure.

圖示的電子元件層625包括第一RFID標籤621,其中該RFID標籤621包括第一天線結構622,及與該第一天線結構622電性連接的第一晶片623。該第一天線結構622設置於該平面輪廓的中間區域610。該第一RFID標籤621更包括與該晶片電性連接的第一導電線路624。該第一導電線路624環繞該第一天線結構622設置,並延伸到該封條的平面輪廓的邊界附近,從而佈及側邊區域620。示例性第一天線結構622具有跨橋元件622b,用以跨接兩分離的金屬接點而使彼此電性連接,藉此形成環形天線結構。The illustrated electronic component layer 625 includes a first RFID tag 621, wherein the RFID tag 621 includes a first antenna structure 622 and a first chip 623 electrically connected to the first antenna structure 622. The first antenna structure 622 is disposed in the middle area 610 of the plane profile. The first RFID tag 621 further includes a first conductive circuit 624 electrically connected to the chip. The first conductive line 624 is arranged around the first antenna structure 622 and extends to the vicinity of the boundary of the plane profile of the seal, so as to extend to the side area 620. The exemplary first antenna structure 622 has a bridge element 622b for bridging two separate metal contacts to be electrically connected to each other, thereby forming a loop antenna structure.

圖示的實施例中,該RFID標籤更包括第二天線結構626,與該第一晶片623電性連接。該第二天線結構626的操作頻段與該第一天線結構622的操作頻段相異。透過第二天線結構626的設置,使得封條能與不同操作頻段的使用者終端(例如智慧型手機或者讀取器)協同運作。在一些實施例中,第一天線結構622的操作頻段為高頻(High Frequency,HF)頻段(約13.56MHz),以適用於近距離傳輸(例如,約1公尺);第二天線結構626的操作頻段為超高頻(Ultra High Frequency,UHF)頻段(約860~930MHz),以適用於長距離的傳輸(例如,約5公尺或以上)。In the illustrated embodiment, the RFID tag further includes a second antenna structure 626, which is electrically connected to the first chip 623. The operating frequency band of the second antenna structure 626 is different from the operating frequency band of the first antenna structure 622. Through the arrangement of the second antenna structure 626, the seal can cooperate with user terminals (such as smart phones or readers) of different operating frequency bands. In some embodiments, the operating frequency band of the first antenna structure 622 is a high frequency (High Frequency, HF) frequency band (about 13.56 MHz), so as to be suitable for short-distance transmission (for example, about 1 meter); the second antenna The operating frequency band of the structure 626 is an Ultra High Frequency (UHF) frequency band (approximately 860-930 MHz), which is suitable for long-distance transmission (for example, approximately 5 meters or more).

圖示的該第一晶片623包括第一、二、三組腳位。第一、二、三組腳位可分別透過第一金屬部623a、第二金屬部623b以及第三金屬部623c分別電性連接(例如,透過焊接相連)至該第一天線結構622、該第一導電線路624以及該第二天線結構626。進一步說,該第一金屬部623a係對應該第一天線結構622的饋入部;該第二金屬部623b係對應該第一導電線路624前端用以與該第一晶片623電性連接的區段;該第三金屬部623c係對應該第二天線結構622的饋入部。The illustrated first chip 623 includes first, second, and third sets of pins. The first, second, and third groups of pins can be electrically connected (for example, connected by welding) to the first antenna structure 622, the first metal portion 623a, the second metal portion 623b, and the third metal portion 623c, respectively. The first conductive circuit 624 and the second antenna structure 626. Furthermore, the first metal portion 623a corresponds to the feeding portion of the first antenna structure 622; the second metal portion 623b corresponds to the area where the front end of the first conductive circuit 624 is electrically connected to the first chip 623 Section; The third metal portion 623c corresponds to the feeding portion of the second antenna structure 622.

該第一晶片623被配置以透過與該第一金屬部623a電性連接的該第一組腳位對該第一天線結構622饋入訊號(或自該第一天線結構622接收訊號),並被配置以透過與該第二金屬部623b電性連接的該第二組腳位偵測該第一導電線路624是否斷裂,以及被配置以透過與該第三金屬部623c電性連接的該第三組腳位對該第二天線結構626饋入訊號(或自該第二天線結構626接收訊號)。進一步說,該第一天線結構622、該第一導電線路624以及該第二天線結構626分別連接至該第一晶片623上的三組獨立腳位,此三組獨立腳位分別與第一組金屬部623a、第二組金屬部623b及第三組金屬部623c電性連接,其中該第一晶片623 可透過與該第二組金屬部623b電性連接的該第二組腳位偵測該第一導電線路624所構成的迴路是否呈開路狀態,以判斷該第一導電線路624是否斷裂。由於該第一導電線路624並非該第一天線結構622或該第二天線結構626的一部份,故該第一導電線路624的斷裂與否實質上並不會影響該第一天線結構622或該第二天線結構626的操作頻率或其他天線特性(如阻抗匹配)。The first chip 623 is configured to feed a signal to the first antenna structure 622 (or receive a signal from the first antenna structure 622) through the first set of pins electrically connected to the first metal portion 623a , And is configured to detect whether the first conductive circuit 624 is broken through the second set of pins electrically connected to the second metal portion 623b, and is configured to detect whether the first conductive circuit 624 is broken through the electrical connection with the third metal portion 623c The third set of pins feeds signals to the second antenna structure 626 (or receives signals from the second antenna structure 626). Furthermore, the first antenna structure 622, the first conductive circuit 624, and the second antenna structure 626 are respectively connected to three sets of independent pins on the first chip 623, and the three sets of independent pins are connected to the first chip 623 respectively. A set of metal portions 623a, a second set of metal portions 623b, and a third set of metal portions 623c are electrically connected, wherein the first chip 623 can pass through the second set of pins electrically connected to the second set of metal portions 623b It is tested whether the loop formed by the first conductive line 624 is in an open state to determine whether the first conductive line 624 is broken. Since the first conductive line 624 is not a part of the first antenna structure 622 or the second antenna structure 626, whether the first conductive line 624 is broken or not does not substantially affect the first antenna The operating frequency or other antenna characteristics (such as impedance matching) of the structure 622 or the second antenna structure 626.

類似於圖5所示的第一導電線路524,圖6中該第一導電線路624的斷裂與否將不影響外部RFID讀取器對封條的正常讀取。換言之,即便該第一導電線路624 斷裂,若該第一天線結構622 的結構尚維持完整,外部RFID讀取器仍可成功讀取該第一晶片623中的信息。此外,該外部RFID讀取器的讀取結果更可包含該第一晶片623對該第一導電線路624的開路偵測結果。該外部RFID讀取器可將該讀取結果傳送至安裝有特定APP的無線通訊裝置,該特定APP可根據該開路偵測結果判斷封條的結構是否損壞,並透過影像、聲音及/或信號等方式,將該判斷結果提供予查驗人員及/或後台系統。Similar to the first conductive circuit 524 shown in FIG. 5, whether the first conductive circuit 624 in FIG. 6 is broken or not will not affect the normal reading of the seal by the external RFID reader. In other words, even if the first conductive circuit 624 is broken, if the structure of the first antenna structure 622 remains intact, the external RFID reader can still successfully read the information in the first chip 623. In addition, the reading result of the external RFID reader may further include the open detection result of the first chip 623 on the first conductive circuit 624. The external RFID reader can transmit the reading result to a wireless communication device installed with a specific APP. The specific APP can determine whether the structure of the seal is damaged according to the open circuit detection result, and through images, sounds, and/or signals, etc. In this way, the judgment result is provided to the inspector and/or the back-end system.

圖7示出了根據本公開的一些實施例的封條的電子元件層的俯視示意圖。為了說明簡單和清楚起見,示例性系統的一些細節/子組件未在圖中明確標記/示出。FIG. 7 shows a schematic top view of the electronic component layer of the seal according to some embodiments of the present disclosure. For simplicity and clarity of description, some details/sub-components of the exemplary system are not clearly marked/shown in the figure.

圖示的電子元件層725包括第一RFID標籤721及第二RFID標籤727,與該第一RFID標籤721電性隔離設置。如此一來,當第一RFID標籤721及第二RFID標籤727其中一者受損,另一者還能夠執行與讀取器交換資訊的功能,從而提升封條的可靠性。The illustrated electronic component layer 725 includes a first RFID tag 721 and a second RFID tag 727, which are electrically isolated from the first RFID tag 721. In this way, when one of the first RFID tag 721 and the second RFID tag 727 is damaged, the other can also perform the function of exchanging information with the reader, thereby improving the reliability of the seal.

該第一RFID標籤721包括第一天線結構722,及與該第一天線結構722電性連接的第一晶片723。該第一天線結構722設置於該平面輪廓的中間區域710。該第一RFID標籤721更包括與該晶片電性連接的第一導電線路724。該第一導電線路724延伸到該封條的平面輪廓的邊界附近,從而佈及側邊區域720。示例性第一天線結構722具有跨橋元件722b,用以跨接兩分離的金屬接點而使彼此電性連接,藉此形成環形天線結構。The first RFID tag 721 includes a first antenna structure 722 and a first chip 723 electrically connected to the first antenna structure 722. The first antenna structure 722 is disposed in the middle area 710 of the plane profile. The first RFID tag 721 further includes a first conductive circuit 724 electrically connected to the chip. The first conductive line 724 extends to the vicinity of the boundary of the plane profile of the seal, so as to extend to the side area 720. The exemplary first antenna structure 722 has a bridge element 722b for bridging two separate metal contacts to electrically connect to each other, thereby forming a loop antenna structure.

該第二RFID標籤727包括第二天線結構728、第二導電線路729及第二晶片730。該第二天線結構728的操作頻段相異於該第一天線結構722的操作頻段。該第二導電線路729環繞該第二天線結構728設置,並延伸到該封條的平面輪廓的邊界附近。該第二晶片730電性連接該第二天線結構728及該第二導電線路729,且經配置以偵測該第二導電線路729是否斷裂。The second RFID tag 727 includes a second antenna structure 728, a second conductive circuit 729, and a second chip 730. The operating frequency band of the second antenna structure 728 is different from the operating frequency band of the first antenna structure 722. The second conductive line 729 is arranged around the second antenna structure 728 and extends to the vicinity of the boundary of the plane profile of the seal. The second chip 730 is electrically connected to the second antenna structure 728 and the second conductive circuit 729, and is configured to detect whether the second conductive circuit 729 is broken.

圖8示出了根據本公開的一些實施例的封條的俯視示意圖。為了說明簡單和清楚起見,示例性系統的一些細節/子組件未在圖中明確標記/示出。Figure 8 shows a schematic top view of a seal according to some embodiments of the present disclosure. For simplicity and clarity of description, some details/sub-components of the exemplary system are not clearly marked/shown in the figure.

圖示的封條800不僅具有前述的第一黏著層、電子元件層、第二黏著層、及保護層845,還包括防拆貼紙層850。該保護層845與該第二黏著層、該電子元件層、及該第一黏著層具有實質相同的平面輪廓並依序層疊而形成一組多層結構。該防拆貼紙層850係設置在該組多層結構上。換言之,該防拆貼紙層850係設置於該保護層845之上。在一些實施例中,防拆貼紙層850之一平面具有黏性,其可例如由易碎之貼紙結構來實現。The illustrated seal 800 not only has the aforementioned first adhesive layer, electronic component layer, second adhesive layer, and protective layer 845, but also includes a tamper-evident sticker layer 850. The protective layer 845, the second adhesive layer, the electronic component layer, and the first adhesive layer have substantially the same planar profile and are sequentially stacked to form a multi-layer structure. The tamper-evident sticker layer 850 is arranged on the set of multilayer structures. In other words, the tamper-evident sticker layer 850 is disposed on the protective layer 845. In some embodiments, one of the planes of the tamper-evident sticker layer 850 has adhesiveness, which can be realized by a fragile sticker structure, for example.

另外,如圖8所示,該防拆貼紙層850的平面輪廓的面積大於該保護層845的平面輪廓的面積。當該防拆貼紙層850設置在該保護層845之上,該防拆貼紙層850可完整覆蓋該保護層845,以增加封條800整體黏貼在貨櫃時的結構強度。In addition, as shown in FIG. 8, the area of the plane contour of the tamper-evident sticker layer 850 is larger than the area of the plane contour of the protective layer 845. When the tamper-evident sticker layer 850 is disposed on the protective layer 845, the tamper-evident sticker layer 850 can completely cover the protective layer 845 to increase the structural strength of the seal 800 as a whole when it is adhered to the container.

圖9示出了根據本公開的一些實施例的封條的俯視示意圖。為了說明簡單和清楚起見,示例性系統的一些細節/子組件未在圖中明確標記/示出。Figure 9 shows a schematic top view of a seal according to some embodiments of the present disclosure. For simplicity and clarity of description, some details/sub-components of the exemplary system are not clearly marked/shown in the figure.

類似於圖8所示的封條800,圖示的封條900不僅具有第一黏著層、電子元件層、第二黏著層、及保護層945,還包括防拆貼紙層950。該保護層945與該第二黏著層、該電子元件層、及該第一黏著層具有實質相同的平面輪廓並依序層疊而形成一組多層結構。該防拆貼紙層950係設置在該組多層結構之下。換言之,該防拆貼紙層950係設置在該第一黏著層之下並被該第一黏著層所黏附。防拆貼紙層950之一平面具有黏性,其可例如由易碎之貼紙結構來實現。因此,當封條900被黏貼於目標物(例如貨櫃門)上,係透過該防拆貼紙層950的黏性而貼附於該目標物上。Similar to the seal 800 shown in FIG. 8, the illustrated seal 900 not only has a first adhesive layer, an electronic component layer, a second adhesive layer, and a protective layer 945, but also includes a tamper-evident sticker layer 950. The protective layer 945, the second adhesive layer, the electronic component layer, and the first adhesive layer have substantially the same planar profile and are sequentially stacked to form a multi-layer structure. The tamper-evident sticker layer 950 is arranged under the multi-layer structure. In other words, the tamper-evident sticker layer 950 is disposed under and adhered by the first adhesive layer. One of the planes of the tamper-evident sticker layer 950 is adhesive, which can be realized by a fragile sticker structure, for example. Therefore, when the seal 900 is adhered to a target (such as a container door), it is adhered to the target through the adhesiveness of the tamper-evident sticker layer 950.

另外,如圖9所示,該防拆貼紙層950的平面輪廓的面積可大於該保護層945的平面輪廓的面積。In addition, as shown in FIG. 9, the area of the plane contour of the tamper-evident sticker layer 950 may be greater than the area of the plane contour of the protective layer 945.

圖10示出了根據本公開的一些實施例的封條內碼存取與驗證機制的流程圖。根據圖示的實施例,封條之晶片中所儲存的資料至少有一部分被加密。在此情況下,若直接以外部RFID讀取器讀取該封條之晶片,資料的該加密部分會被遮蔽而無法得知其內容,故可提高資料的保密性。另外,對應該資料的加密部分的內碼需透過後台系統所提供的封條密碼而取得。在取得該內碼後,該後台系統更對其進行解碼以驗證該封條的真偽。FIG. 10 shows a flowchart of a mechanism for accessing and verifying the internal code of a seal according to some embodiments of the present disclosure. According to the illustrated embodiment, at least a part of the data stored in the chip of the seal is encrypted. In this case, if the chip of the seal is directly read by an external RFID reader, the encrypted part of the data will be shielded and the content cannot be known, so the confidentiality of the data can be improved. In addition, the internal code corresponding to the encrypted part of the data needs to be obtained through the seal password provided by the background system. After obtaining the internal code, the background system decodes it to verify the authenticity of the seal.

如圖10所示,在步驟1002,無線通訊裝置自外部RFID讀取器取得對封條之晶片的讀取結果,該讀取結果包含該晶片的UID以及一組資料,該組資料包括一加密部分。在步驟1004,該無線通訊裝置向後台系統回傳該晶片的該UID,以要求對應的封條密碼。在步驟1006,該無線通訊裝置自該後台系統接收該封條密碼。在步驟1008,該無線通訊裝置根據該封條密碼取得對應該加密部分的內碼。舉例來說,在比對出該封條密碼匹配該加密部分後,該封條之晶片將回應於該封條密碼,回傳該加密部分的內碼。在步驟1010,該無線通訊裝置在取得該內碼後,對該後台系統回傳該內碼。在步驟1012,該後台系統對該內碼進行解碼,以驗證該封條的真偽。As shown in FIG. 10, in step 1002, the wireless communication device obtains the reading result of the chip of the seal from the external RFID reader. The reading result includes the UID of the chip and a set of data, and the set of data includes an encrypted part . In step 1004, the wireless communication device returns the UID of the chip to the background system to request the corresponding seal password. In step 1006, the wireless communication device receives the seal password from the background system. In step 1008, the wireless communication device obtains the internal code corresponding to the encrypted part according to the seal password. For example, after comparing the seal password to match the encrypted part, the chip of the seal will respond to the seal password and return the internal code of the encrypted part. In step 1010, after obtaining the internal code, the wireless communication device returns the internal code to the background system. In step 1012, the background system decodes the internal code to verify the authenticity of the seal.

在一些實施例中,上述之無線通訊裝置之操作可透過在該無線通訊裝置上安裝並運行一受該後台系統信任的特定APP來進行。該特定APP可用於與該後台系統進行資料交換。進一步說,該特定APP可根據該封條之晶片的UID自該後台系統取得該封條密碼,並透過該外部RFID讀取器把該封條密碼提供給該封條之晶片進行比對。若比對結果是匹配的,則該特定APP可自該封條的晶片取得內碼。該特定APP可進一步將取得的該內碼提供至該後台系統進行解碼。由於該後台系統本就知道加密前的資料內容為何,故可透過解碼該內碼來驗證該封條的真偽。In some embodiments, the operation of the above-mentioned wireless communication device can be performed by installing and running a specific APP trusted by the background system on the wireless communication device. The specific APP can be used to exchange data with the background system. Furthermore, the specific APP can obtain the seal code from the background system according to the UID of the seal chip, and provide the seal code to the seal chip for comparison through the external RFID reader. If the comparison result is a match, the specific APP can obtain the internal code from the chip of the seal. The specific APP can further provide the acquired internal code to the background system for decoding. Since the background system already knows the content of the data before encryption, it can verify the authenticity of the seal by decoding the internal code.

在一些實施例中,上述之無線通訊裝置與該外部RFID讀取器可整合成一單一個外部裝置,該外部裝置同時具備與後台系統進行通訊的連網能力以及RFID標籤讀取能力。在此情況下,可省去圖10中無線通訊裝置與外部RFID讀取器之間的資訊交換步驟。In some embodiments, the above-mentioned wireless communication device and the external RFID reader can be integrated into a single external device, and the external device has both the networking capability for communicating with the background system and the RFID tag reading capability. In this case, the information exchange step between the wireless communication device and the external RFID reader in FIG. 10 can be omitted.

前述的封條可以具有以下功能:(1)防偽:電子紙封條內具UID晶片,且須透過受信任之APP向後台系統取得讀取密碼,始能讀取封條內碼,具防偽效果。(2)可讀寫:電子紙封條於加封讀取時亦可寫入必要之貨櫃(物)資訊,如船掛、封條、運抵地等資料,可供離線讀取確認,以確保貨櫃(物)移動安全。(3)電子紙封條加封於櫃門開啟處,具防拆與破壞警示功能,搭配機械式或電子式其他封條使用,加強移動安全輔助效益。(4)系統與智慧型手機結合,符合全球物流發展趨勢,且透過APP操控(雙頻)可攜式讀取器可直接讀取被動式電子(紙)封條。The aforementioned seal can have the following functions: (1) Anti-counterfeiting: The electronic paper seal has a UID chip inside, and must obtain a read password from the background system through a trusted APP to read the internal code of the seal, which has an anti-counterfeiting effect. (2) Read and write: The electronic paper seal can also write necessary container (object) information when sealing and reading, such as ship hanging, seal, destination and other data, which can be read and confirmed offline to ensure that the container ( (Things) mobile security. (3) The electronic paper seal is sealed at the opening of the cabinet door, which has the function of anti-disassembly and damage warning. It can be used with other mechanical or electronic seals to enhance the auxiliary effect of mobile safety. (4) The combination of the system and smart phones is in line with the global logistics development trend, and the passive electronic (paper) seal can be directly read through the APP-controlled (dual frequency) portable reader.

至此,本公開的一方面提供了一種封條,包括第一黏著層、電子元件層、第二黏著層及保護層。該第一黏著層具有第一厚度。該電子元件層設於該第一黏著層上,並包括第一RFID標籤,其中該RFID標籤包括第一天線結構,及與該天線結構電性連接的第一晶片。該第二黏著層設於該電子元件層上,並具有相異於該第一厚度的第二厚度。該保護層設於該第二黏著層上。So far, one aspect of the present disclosure provides a seal including a first adhesive layer, an electronic component layer, a second adhesive layer, and a protective layer. The first adhesive layer has a first thickness. The electronic component layer is arranged on the first adhesive layer and includes a first RFID tag, wherein the RFID tag includes a first antenna structure and a first chip electrically connected to the antenna structure. The second adhesive layer is disposed on the electronic component layer and has a second thickness different from the first thickness. The protective layer is arranged on the second adhesive layer.

在一些實施例中,該第一厚度大於該第二厚度。舉例來說,該第一厚度與該第二厚度的比例(T1/T2)介於6到1之間。In some embodiments, the first thickness is greater than the second thickness. For example, the ratio of the first thickness to the second thickness (T1/T2) is between 6 and 1.

在一些實施例中,該封條的平面輪廓大致呈矩形。該第一天線結構具有主體部及突出部。該主體部設置於該平面輪廓的中間區域。該突出部從該主體部向外延伸到該平面輪廓的邊界附近。In some embodiments, the plane profile of the seal is substantially rectangular. The first antenna structure has a main body and a protrusion. The main body part is arranged in the middle area of the plane profile. The protrusion extends outward from the main body to the vicinity of the boundary of the plane profile.

在一些實施例中,當該第一天線結構之結構完整時,係使外部無線射頻辨識讀取器對該封條進行讀取後產生第一讀取結果;當該突出部之結構破損時,係使該外部無線射頻辨識讀取器對該封條進行讀取後產生第二讀取結果, 其中,該第一讀取結果相異於該第二讀取結果。In some embodiments, when the structure of the first antenna structure is complete, an external radio frequency identification reader is used to read the seal to generate the first reading result; when the structure of the protrusion is damaged, The external radio frequency identification reader is made to read the seal to generate a second reading result, wherein the first reading result is different from the second reading result.

在一些實施例中,該第一天線結構的該突出部避開該封條的平面輪廓的四個角落區域設置。In some embodiments, the protrusion of the first antenna structure is arranged to avoid the four corner regions of the planar contour of the seal.

在一些實施例中,該封條還形成有T字型切口,該T字型切口的兩個翼部大致沿著該第一天線結構的主體部的外緣延伸。In some embodiments, the seal is further formed with a T-shaped notch, and two wings of the T-shaped notch extend substantially along the outer edge of the main body of the first antenna structure.

在一些實施例中,該第一RFID標籤更包括與該晶片電性連接的第一導電線路。該第一導電線路環繞該第一天線結構設置,並延伸到該封條的平面輪廓的邊界附近。In some embodiments, the first RFID tag further includes a first conductive circuit electrically connected to the chip. The first conductive line is arranged around the first antenna structure and extends to the vicinity of the boundary of the plane profile of the seal.

在一些實施例中,當該第一天線結構之結構完整時,係使外部無線射頻辨識讀取器對該封條進行讀取後產生第一讀取結果;當該第一導電線路之結構破損時,係使該外部無線射頻辨識讀取器對該封條進行讀取後產生第二讀取結果。其中,該第一讀取結果相異於該第二讀取結果。In some embodiments, when the structure of the first antenna structure is complete, an external radio frequency identification reader is used to read the seal to generate the first reading result; when the structure of the first conductive circuit is damaged When the external radio frequency identification reader reads the seal, the second reading result is generated. Wherein, the first reading result is different from the second reading result.

在一些實施例中,該第一晶片包括第一組腳位及第二組腳位。該第一組腳位電性連接該第一天線結構。該第二組腳位電性連接該第一導電線路。該第一晶片被配置以透過該第一組腳位對該第一天線結構饋入訊號,並透過該第二組腳位偵測該第一導電線路是否斷裂。In some embodiments, the first chip includes a first set of pins and a second set of pins. The first set of pins are electrically connected to the first antenna structure. The second set of pins are electrically connected to the first conductive circuit. The first chip is configured to feed a signal to the first antenna structure through the first set of pins, and to detect whether the first conductive line is broken through the second set of pins.

在一些實施例中,該RFID標籤更包括:第二天線結構,與該第一晶片電性連接。該第二天線結構的操作頻段與該第一天線結構的操作頻段相異。In some embodiments, the RFID tag further includes: a second antenna structure electrically connected to the first chip. The operating frequency band of the second antenna structure is different from the operating frequency band of the first antenna structure.

在一些實施例中,該電子元件層更包括第二RFID標籤,與該第一RFID標籤電性隔離設置。該第二RFID標籤包括第二天線結構、第二導電線路及第二晶片。該第二天線結構的操作頻段相異於該第一天線結構的操作頻段。該第二導電線路環繞該第二天線結構設置,並延伸到該封條的平面輪廓的邊界附近。該第二晶片電性連接該第二天線結構及該第二導電線路,且經配置以偵測該第二導電線路是否斷裂。In some embodiments, the electronic component layer further includes a second RFID tag, which is electrically isolated from the first RFID tag. The second RFID tag includes a second antenna structure, a second conductive circuit, and a second chip. The operating frequency band of the second antenna structure is different from the operating frequency band of the first antenna structure. The second conductive line is arranged around the second antenna structure and extends to the vicinity of the boundary of the plane profile of the seal. The second chip is electrically connected to the second antenna structure and the second conductive circuit, and is configured to detect whether the second conductive circuit is broken.

在一些實施例中,該封條更包括防拆貼紙層,配置來設置在該保護層上或該第一黏著層下。該防拆貼紙層的平面輪廓的面積大於該保護層的平面輪廓的面積。In some embodiments, the seal further includes a tamper-evident sticker layer, which is configured to be disposed on the protective layer or under the first adhesive layer. The area of the plane contour of the tamper-evident sticker layer is larger than the area of the plane contour of the protective layer.

在一些實施例中,該第一晶片被配置以儲存唯一識別碼以及一組資料,該組資料包括一加密部分,該唯一識別碼用以被提供至後台系統以供無線通訊裝置取得對應於該封條的封條密碼;當該封條密碼匹配該加密部分,該第一晶片更被配置以回應於該封條密碼,傳送該加密部分的內碼以供該後台系統驗證該封條之真偽。In some embodiments, the first chip is configured to store a unique identification code and a set of data, the set of data includes an encrypted part, and the unique identification code is provided to the background system for the wireless communication device to obtain the corresponding The seal password of the seal; when the seal password matches the encrypted part, the first chip is further configured to respond to the seal password and transmit the internal code of the encrypted part for the background system to verify the authenticity of the seal.

惟以上所述者,僅為本新型之實施例而已,當不能以此限定本新型實施之範圍,凡是依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。However, the above are only examples of the present model. When the scope of implementation of the present model cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present model and the contents of the patent specification shall still belong to This new patent covers the scope.

100:封條100: seal

110:中間區域110: Middle area

120:側邊區域120: side area

205:離型層205: Release layer

215:第一黏著層215: The first adhesive layer

225:電子元件層225: Electronic component layer

235:第二黏著層235: second adhesive layer

245:保護層245: protective layer

T1:第一厚度T1: first thickness

T2:第二厚度T2: second thickness

310:中間區域310: Middle area

320:側邊區域320: side area

325:電子元件層325: Electronic component layer

321:第一無線射頻辨識標籤321: The first RFID tag

322:第一天線結構322: first antenna structure

322m:主體部322m: main body

322p:突出部322p: protrusion

322b:跨橋元件322b: Bridge element

323:第一晶片323: first chip

B:邊界B: boundary

425:電子元件層425: Electronic component layer

421:第一無線射頻辨識標籤421: The first RFID tag

422:第一天線結構422: first antenna structure

422m:主體部422m: main body

422p:突出部422p: protrusion

422b:跨橋元件422b: Bridge element

423:第一晶片423: first chip

C:角落區域C: corner area

T:T字型切口T: T-shaped incision

525:電子元件層525: Electronic component layer

521:第一無線射頻辨識標籤521: The first RFID tag

522:第一天線結構522: The first antenna structure

523:第一晶片523: first chip

523a:第一組腳位523a: The first set of pins

523b:第二組腳位523b: The second set of pins

625:電子元件層625: electronic component layer

621:第一無線射頻辨識標籤621: The first RFID tag

622:第一天線結構622: The first antenna structure

622b:跨橋元件622b: Bridge element

623:第一晶片623: first chip

623a:第一金屬部623a: The first metal part

623b:第二金屬部623b: The second metal part

623c:第三金屬部623c: The third metal part

626:第二天線結構626: second antenna structure

725:電子元件層725: Electronic component layer

721:第一無線射頻辨識標籤721: The first RFID tag

722:第一天線結構722: First antenna structure

722b:跨橋元件722b: Bridge element

723:第一晶片723: first chip

727:第二無線射頻辨識標籤727: Second RFID Tag

728:第二天線結構728: second antenna structure

729:第二導電線路729: second conductive line

730:第二晶片730: second chip

800:封條800: seal

845:保護層845: protective layer

850:防拆貼紙層850: Anti-tamper sticker layer

900:封條900: seal

945:保護層945: protective layer

950:防拆貼紙層950: Anti-tamper sticker layer

1002:步驟1002: Step

1004:步驟1004: Step

1006:步驟1006: Step

1008:步驟1008: step

1010:步驟1010: Step

1012:步驟1012: Step

為可仔細理解本案以上記載之特徵,參照實施態樣可提供簡述如上之本案的更特定描述,一些實施態樣係說明於隨附圖式中。然而,要注意的是,隨附圖式僅說明本案的典型實施態樣並且因此不被視為限制本案的範圍,因為本案可承認其他等效實施態樣。 圖1示出了根據本公開的一些實施例的封條的俯視示意圖; 圖2示出了根據本公開的一些實施例的封條的剖面示意圖; 圖3至圖7分別示出了根據本公開的一些實施例的封條的電子元件層的俯視示意圖;及 圖8示出了根據本公開的一些實施例的封條的俯視示意圖。 圖9示出了根據本公開的一些實施例的封條的俯視示意圖。 圖10示出了根據本公開的一些實施例的封條內碼存取與驗證機制的流程圖。 然而,應注意的是,附圖僅示出了本公開的示例性實施例,並且因此不應被認為是對其範圍的限制,因為本公開可以允許其他等效的實施例。 應該注意的是,這些附圖意在說明在某些示例實施例中使用的方法,結構和/或材料的一般特性,並補充下面提供的書面描述。然而,這些附圖不是按比例繪製的,並且可能不能精確地反映任何給定實施例的精確的結構或性能特徵,並且不應被解釋為定義或限制示例實施例所涵蓋的值或特性的範圍。例如,為了清楚起見,可以減小或放大層,區域和/或結構元件的相對厚度和位置。在各個附圖中使用相似或相同的附圖標記旨在指示相似或相同的元件或特徵的存在。 In order to understand the features described above in this case carefully, a more specific description of the above case can be provided by referring to the implementation aspects. Some implementation aspects are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings only illustrate the typical implementation aspects of this case and are therefore not regarded as limiting the scope of this case, because this case may recognize other equivalent implementation aspects. Figure 1 shows a schematic top view of a seal according to some embodiments of the present disclosure; Figure 2 shows a schematic cross-sectional view of a seal according to some embodiments of the present disclosure; FIGS. 3 to 7 respectively show a schematic top view of an electronic component layer of a seal according to some embodiments of the present disclosure; and Figure 8 shows a schematic top view of a seal according to some embodiments of the present disclosure. Figure 9 shows a schematic top view of a seal according to some embodiments of the present disclosure. FIG. 10 shows a flowchart of a mechanism for accessing and verifying the internal code of a seal according to some embodiments of the present disclosure. However, it should be noted that the drawings only show exemplary embodiments of the present disclosure, and therefore should not be considered as limiting the scope thereof, as the present disclosure may allow other equivalent embodiments. It should be noted that these drawings are intended to illustrate the methods, structures, and/or general characteristics of materials used in certain example embodiments, and to supplement the written description provided below. However, these drawings are not drawn to scale, and may not accurately reflect the precise structure or performance characteristics of any given embodiment, and should not be construed as defining or limiting the range of values or characteristics covered by example embodiments . For example, for clarity, the relative thickness and location of layers, regions, and/or structural elements may be reduced or enlarged. The use of similar or identical reference signs in various drawings is intended to indicate the presence of similar or identical elements or features.

310:中間區域 310: Middle area

320:側邊區域 320: side area

325:電子元件層 325: Electronic component layer

321:第一無線射頻辨識標籤 321: The first RFID tag

322:第一天線結構 322: first antenna structure

322m:主體部 322m: main body

322p:突出部 322p: protrusion

322b:跨橋元件 322b: Bridge element

323:第一晶片 323: first chip

B:邊界 B: boundary

Claims (13)

一種封條,包括:第一黏著層,具有第一厚度;電子元件層,設於該第一黏著層上,並包括第一無線射頻辨識標籤,其中該第一無線射頻辨識標籤包括第一天線結構,及第一晶片,與該第一天線結構電性連接;第二黏著層,設於該電子元件層上,並具有相異於該第一厚度的第二厚度;及保護層,設於該第二黏著層上。 A seal includes: a first adhesive layer having a first thickness; an electronic component layer, arranged on the first adhesive layer, and including a first radio frequency identification tag, wherein the first radio frequency identification tag includes a first antenna The structure and the first chip are electrically connected to the first antenna structure; the second adhesive layer is provided on the electronic component layer and has a second thickness different from the first thickness; and a protective layer, provided On the second adhesive layer. 如請求項1所述的封條,其中,該第一厚度與第二厚度的比例介於6到1之間。 The seal according to claim 1, wherein the ratio of the first thickness to the second thickness is between 6 and 1. 如請求項1所述的封條,其中,該封條的平面輪廓大致呈矩形;及其中,該第一天線結構具有主體部,設置於該平面輪廓的中間區域,及突出部,從該主體部向外延伸到該平面輪廓的邊界附近。 The seal according to claim 1, wherein the plane profile of the seal is substantially rectangular; and wherein, the first antenna structure has a main body part, which is arranged in the middle area of the plane profile, and a protruding part from the main body part Extend to the vicinity of the boundary of the plane profile. 如請求項3所述的封條,其中,當該第一天線結構之結構完整時,係使外部無線射頻辨識讀取器對該封條進行讀取後產生第一讀取結果, 當該突出部之結構破損時,係使該外部無線射頻辨識讀取器對該封條進行讀取後產生第二讀取結果,其中,該第一讀取結果相異於該第二讀取結果。 The seal according to claim 3, wherein when the structure of the first antenna structure is complete, an external radio frequency identification reader is made to read the seal to generate a first reading result, When the structure of the protrusion is damaged, the external RFID reader is made to read the seal to generate a second reading result, wherein the first reading result is different from the second reading result . 如請求項3所述的封條,其中,該第一天線結構的該突出部避開該封條的平面輪廓的四個角落區域設置。 The seal according to claim 3, wherein the protrusion of the first antenna structure is arranged to avoid four corner regions of the plane profile of the seal. 如請求項3所述的封條,其中,該封條還形成有T字型切口,該T字型切口的兩個翼部大致沿著該第一天線結構的主體部的外緣延伸。 The seal according to claim 3, wherein the seal is further formed with a T-shaped notch, and two wings of the T-shaped notch extend substantially along the outer edge of the main body of the first antenna structure. 如請求項1所述的封條,其中該第一無線射頻辨識標籤更包括:第一導電線路,與該第一晶片電性連接,其中,該第一導電線路環繞該第一天線結構設置,並延伸到該封條的平面輪廓的邊界附近。 The seal according to claim 1, wherein the first radio frequency identification tag further comprises: a first conductive circuit electrically connected to the first chip, wherein the first conductive circuit is arranged around the first antenna structure, And it extends to the vicinity of the boundary of the plane profile of the seal. 如請求項7所述的封條,其中,當該第一天線結構之結構完整時,係使外部無線射頻辨識讀取器對該封條進行讀取後產生第一讀取結果,當該第一導電線路之結構破損時,係使該外部無線射頻辨識讀取器對該封條進行讀取後產生第二讀取結果,其中,該第一讀取結果相異於該第二讀取結果。 The seal according to claim 7, wherein when the structure of the first antenna structure is complete, an external radio frequency identification reader is made to read the seal to generate a first reading result, and when the first antenna structure is complete When the structure of the conductive circuit is damaged, the external radio frequency identification reader is made to read the seal to generate a second reading result, wherein the first reading result is different from the second reading result. 如請求項7所述的封條,其中該第一晶片包括: 第一組腳位,電性連接該第一天線結構;及第二組腳位,電性連接該第一導電線路,其中,該第一晶片被配置以透過該第一組腳位對該第一天線結構饋入訊號,並透過該第二組腳位偵測該第一導電線路是否斷裂。 The seal according to claim 7, wherein the first chip includes: The first set of pins are electrically connected to the first antenna structure; and the second set of pins are electrically connected to the first conductive circuit, wherein the first chip is configured to connect to the first antenna structure through the first set of pins. The first antenna structure feeds a signal, and detects whether the first conductive line is broken through the second set of pins. 如請求項9所述的封條,其中該第一無線射頻辨識標籤更包括:第二天線結構,與該第一晶片電性連接,其中,該第二天線結構的操作頻段與該第一天線結構的操作頻段相異。 The seal according to claim 9, wherein the first radio frequency identification tag further comprises: a second antenna structure electrically connected to the first chip, wherein the operating frequency band of the second antenna structure is the same as that of the first chip. The operating frequency band of the antenna structure is different. 如請求項7所述的封條,其中該電子元件層更包括:第二無線射頻辨識標籤,與該第一無線射頻辨識標籤電性隔離設置,其中該第二無線射頻辨識標籤包括:第二天線結構,該第二天線結構的操作頻段相異於該第一天線結構的操作頻段;第二導電線路,環繞該第二天線結構設置,並延伸到該封條的平面輪廓的邊界附近;及第二晶片,電性連接該第二天線結構及該第二導電線路,且經配置以偵測該第二導電線路是否斷裂。 The seal according to claim 7, wherein the electronic component layer further includes: a second radio frequency identification tag electrically isolated from the first radio frequency identification tag, wherein the second radio frequency identification tag includes: the next day Line structure, the operating frequency band of the second antenna structure is different from the operating frequency band of the first antenna structure; the second conductive line is arranged around the second antenna structure and extends to the vicinity of the boundary of the plane profile of the seal And a second chip, electrically connected to the second antenna structure and the second conductive circuit, and is configured to detect whether the second conductive circuit is broken. 如請求項1所述的封條,更包括:防拆貼紙層,配置來設置在該保護層上或該第一黏著層下,其中,該防拆貼紙層的平面輪廓的面積大於該保護層的平面輪廓的面積。 The seal according to claim 1, further comprising: a tamper-evident sticker layer configured to be disposed on the protective layer or under the first adhesive layer, wherein the area of the plane outline of the tamper-evident sticker layer is larger than that of the protective layer The area of the plane profile. 如請求項1所述的封條,其中該第一晶片被配置以: 儲存唯一識別碼以及一組資料,該組資料包括一加密部分,該唯一識別碼用以被提供至後台系統以供無線通訊裝置取得對應於該封條的封條密碼;以及當該封條密碼匹配該加密部分,回應於該封條密碼,傳送該加密部分的內碼以供該後台系統驗證該封條之真偽。 The seal according to claim 1, wherein the first chip is configured to: Store a unique identification code and a set of data, the set of data includes an encrypted part, the unique identification code is provided to the background system for the wireless communication device to obtain the seal password corresponding to the seal; and when the seal password matches the encryption Part, in response to the seal password, transmit the encrypted part of the internal code for the background system to verify the authenticity of the seal.
TW110206233U 2021-05-28 2021-05-28 Seal TWM619910U (en)

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