TWM474104U - Lamp structure - Google Patents
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- TWM474104U TWM474104U TW102217152U TW102217152U TWM474104U TW M474104 U TWM474104 U TW M474104U TW 102217152 U TW102217152 U TW 102217152U TW 102217152 U TW102217152 U TW 102217152U TW M474104 U TWM474104 U TW M474104U
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Abstract
Description
本創作係關於一種燈具結構,特別是一種具有散熱效果的燈具結構。This creation is about a luminaire structure, especially a luminaire structure with a heat dissipation effect.
現有技術的發光裝置中,如白熾燈泡及鹵素燈泡皆以加熱燈芯而發光或螢光燈管以激發燈管內氣體分子發光等,運作的時候都會伴隨產生高溫。特別是以發光二極體(LED)作為光源的發光裝置,雖然大眾普遍認為發光二極體發光效率高,但發光二極體於長期運作下所產生之高溫,將使其發光效率大幅降低。因此,各種承載發光裝置的燈具結構便需要良好的散熱能力,以避免發光裝置因為高溫降低效率或減少壽命。In the prior art illuminating device, such as an incandescent bulb and a halogen bulb, the wick is heated to illuminate or the fluorescent tube is used to illuminate the gas molecules in the tube, and the high temperature is accompanied by the operation. In particular, a light-emitting device using a light-emitting diode (LED) as a light source, although it is generally believed that the light-emitting diode has high luminous efficiency, the high temperature generated by the light-emitting diode under long-term operation will greatly reduce the luminous efficiency. Therefore, various lamp structures carrying light-emitting devices require good heat dissipation capability to prevent the light-emitting device from reducing efficiency or reducing life due to high temperatures.
習知的燈具中,如我國專利號M317543號所載,都是於燈具上外加散熱鰭片,透過散熱鰭片以傳導的方式,將燈具中發光裝置於運作時產生之熱能,傳導至外部,以逸散發光裝置所產生之熱。然而,習知燈具僅透過傳導的方式,仍有不能迅速且有效的逸散熱能的問題。In the conventional luminaires, as disclosed in Chinese Patent No. M317543, heat-dissipating fins are added to the luminaire, and the heat generated by the illuminating device in the luminaire is transmitted to the outside through the heat-dissipating fins. To dissipate the heat generated by the illuminating device. However, conventional lamps are only transmitted through conduction, and there is still a problem that heat dissipation cannot be quickly and effectively performed.
有鑑於此,提供一種燈具結構,以改善上述缺失,乃為此業界極於欲達成的目標。In view of this, it is an extremely desirable goal in the industry to provide a luminaire structure to improve the above-mentioned deficiencies.
本創作之一目的在於提供一種燈具結構,不僅能夠以傳導方式對發光模組散熱,並具有可使空氣對流的孔道,藉以提高燈具結構之散熱的效率。One of the aims of the present invention is to provide a lamp structure that not only dissipates heat to the light-emitting module in a conductive manner, but also has a hole for convection of air, thereby improving the heat dissipation efficiency of the lamp structure.
為達上述目的,該燈具結構包含:一散熱體、一燈盤部、一發光模組、一電源板、一燈體部及一導電部。散熱體具有一第一端部、一第二端部及一第一側面,第一端部具有一第一開口,第二端部具有一第二開口。燈盤部具有一承載面及一第二側面,燈盤部設置於第一端部之第一開口中,且第二側面與散熱體之第一側面相接觸。發光模組設置於燈盤部之承載面上,具有複數發光二極體。電源板與發光模組電性相接。燈體部具有一本體、一第三端部及一容置空間,經由第二開口,燈體部之本體設置於散熱體中,使第三端部位於散熱體之外,並與散熱體之第二端部相接。導電部與燈體部之第三端部相接。其中,燈盤部及燈體部之至少其中之一具有複數散熱孔。藉由燈盤部與散熱體接觸,本創作之燈具結構得以傳導的方式將發光模組之熱能傳導至外界To achieve the above objective, the lamp structure comprises: a heat sink, a lamp panel, a lighting module, a power board, a lamp body and a conductive portion. The heat sink has a first end, a second end and a first side. The first end has a first opening and the second end has a second opening. The lamp disc portion has a bearing surface and a second side surface. The lamp disc portion is disposed in the first opening of the first end portion, and the second side surface is in contact with the first side surface of the heat dissipating body. The illuminating module is disposed on the bearing surface of the lamp disc portion and has a plurality of illuminating diodes. The power board is electrically connected to the light emitting module. The body of the lamp body has a body, a third end portion and an accommodating space. The body of the lamp body portion is disposed in the heat dissipating body via the second opening, so that the third end portion is located outside the heat dissipating body and is coupled to the heat dissipating body. The second ends are connected. The conductive portion is in contact with the third end of the lamp body portion. Wherein at least one of the lamp disc portion and the lamp body portion has a plurality of heat dissipation holes. By the contact between the lamp panel and the heat sink, the luminaire structure of the present invention can conduct the heat energy of the illuminating module to the outside.
為讓上述目的、技術特徵及優點能更明顯易懂,下文係以較佳之實施例配合所附圖式進行詳細說明。The above objects, technical features and advantages will be more apparent from the following description.
1‧‧‧燈具結構1‧‧‧Lighting structure
10‧‧‧散熱體10‧‧‧ Heat sink
11‧‧‧第一端部11‧‧‧ First end
111‧‧‧第一開口111‧‧‧ first opening
12‧‧‧第二端部12‧‧‧ second end
121‧‧‧第二開口121‧‧‧second opening
13‧‧‧第一側面13‧‧‧ first side
14‧‧‧內部空間14‧‧‧Internal space
20‧‧‧燈盤部20‧‧‧Lighting section
21‧‧‧承載面21‧‧‧ bearing surface
22‧‧‧第二側面22‧‧‧ second side
221‧‧‧嵌板221‧‧‧ Panel
222‧‧‧嵌孔222‧‧‧ hole
22a‧‧‧第一表面22a‧‧‧ first surface
22b‧‧‧第二表面22b‧‧‧ second surface
23‧‧‧固定孔23‧‧‧Fixed holes
30‧‧‧發光模組30‧‧‧Lighting module
31‧‧‧發光二極體31‧‧‧Lighting diode
32‧‧‧電路板32‧‧‧ boards
40‧‧‧電源板40‧‧‧Power board
50‧‧‧燈體部50‧‧‧Light body
51‧‧‧本體51‧‧‧Ontology
52‧‧‧第三端部52‧‧‧ third end
53‧‧‧容置空間53‧‧‧ accommodating space
54‧‧‧螺絲孔54‧‧‧ screw holes
60‧‧‧導電部60‧‧‧Electrical Department
70‧‧‧散熱孔70‧‧‧ vents
80‧‧‧螺絲80‧‧‧ screws
90‧‧‧燈罩部90‧‧‧shade department
X‧‧‧第一虛擬平面X‧‧‧first virtual plane
Y‧‧‧第二虛擬平面Y‧‧‧second virtual plane
A‧‧‧投影中心點A‧‧‧Project Center
B‧‧‧投影中心點B‧‧‧Project Center
z‧‧‧連線z‧‧‧Connect
第1A圖為本創作之燈具結構之第一實施例之立體圖。Fig. 1A is a perspective view of the first embodiment of the lamp structure of the present invention.
第1B圖為本創作之燈具結構之第一實施例之立體分解圖。Fig. 1B is an exploded perspective view showing the first embodiment of the lamp structure of the present invention.
第1C圖為本創作之燈具結構之第一實施例之前視圖。Figure 1C is a front elevational view of the first embodiment of the luminaire structure of the present invention.
第1D圖為本創作之燈具結構之第一實施例之剖視圖。Fig. 1D is a cross-sectional view showing the first embodiment of the lamp structure of the present invention.
第1E圖為本創作之燈具結構之第一實施例之側視圖。Figure 1E is a side elevational view of the first embodiment of the luminaire structure of the present invention.
第1F圖為本創作之燈具結構之第一實施例另一角度之側視圖。Figure 1F is a side elevational view of another perspective of the first embodiment of the luminaire structure of the present invention.
第1G圖為本創作之燈具結構之第一實施例包含燈罩部之立體分解圖。Fig. 1G is a perspective exploded view of the lampshade portion of the first embodiment of the lamp structure of the present invention.
第1H圖為本創作之燈具結構之第一實施例包含燈罩部之剖視圖。1H is a cross-sectional view of the first embodiment including the lamp cover portion of the lamp structure of the present invention.
第2圖為本創作之燈具結構之第二實施例之剖視圖。Figure 2 is a cross-sectional view showing a second embodiment of the lamp structure of the present invention.
第3圖為本創作之燈具結構之第三實施例之前視圖。Figure 3 is a front elevational view of a third embodiment of the luminaire structure of the present invention.
第4圖為本創作之燈具結構之第四實施例之前視圖。Figure 4 is a front elevational view of a fourth embodiment of the luminaire structure of the present invention.
第5圖為本創作之燈具結構之第五實施例之立體圖。Figure 5 is a perspective view of a fifth embodiment of the lamp structure of the present invention.
第6圖為本創作之燈具結構之第六實施例之立體圖。Figure 6 is a perspective view of a sixth embodiment of the lamp structure of the present invention.
首先請參考第1A圖、第1B圖及第1C圖以說明本創作之結構,第1A圖、第1B圖及第1C圖分別為本創作之燈具結構之第一實施例之立體圖、立體分解圖及前視圖。本創作揭示一燈具結構1,可包含一散熱體10、一燈盤部20、一發光模組30、一電源板40、一燈體部50及一導電部60。First, please refer to FIG. 1A, FIG. 1B and FIG. 1C to illustrate the structure of the present creation. FIG. 1A, FIG. 1B and FIG. 1C are respectively a perspective view and an exploded perspective view of the first embodiment of the lamp structure of the present invention. And front view. The present invention discloses a lamp structure 1 , which can include a heat sink 10 , a lamp panel 20 , a light module 30 , a power board 40 , a lamp body 50 , and a conductive portion 60 .
散熱體10具有一第一端部11、相對於第一端部11之一第二端部12及一第一側面13。於本實施例中,散熱體10可為一中空管體。第一端部11具有一第一開口111,第二端部12具有一第二開口121,且第一開口111可與第二開口121連通。散熱體10可定義一內部空間14,內部空間14可容納燈體部50。The heat sink 10 has a first end portion 11 , a second end portion 12 opposite to the first end portion 11 , and a first side surface 13 . In this embodiment, the heat sink 10 can be a hollow tube body. The first end portion 11 has a first opening 111, the second end portion 12 has a second opening 121, and the first opening 111 can communicate with the second opening 121. The heat sink 10 defines an interior space 14 that can house the body 50.
燈盤部20具有一承載面21及一第二側面22。發光模組30設置於承載面21上。請參第1D圖為本創作之燈具結構之第一實施例之剖視圖,第二側面22係自承載面21之一周緣斜向外延伸而出,當燈盤部20與散熱體10接合時,燈盤部20設置於散熱體10之第一端部11之第一開口111中,且第二側面22係與散熱體10之第一側面13相接觸。藉此,發光模組30於運作時所產生之熱能,便能透過承載面21傳導至第二側面22,並進一步傳導至散熱體10之第一側面13而向外界逸散發光模組30所產生之熱。The lamp panel portion 20 has a bearing surface 21 and a second side surface 22. The light emitting module 30 is disposed on the bearing surface 21 . 1D is a cross-sectional view of a first embodiment of the lamp structure of the present invention. The second side 22 extends obliquely outward from a peripheral edge of the bearing surface 21 when the lamp panel 20 is engaged with the heat sink 10. The lamp panel portion 20 is disposed in the first opening 111 of the first end portion 11 of the heat sink 10, and the second side surface 22 is in contact with the first side surface 13 of the heat sink 10. Therefore, the thermal energy generated by the light-emitting module 30 during operation can be transmitted to the second side surface 22 through the bearing surface 21 and further transmitted to the first side surface 13 of the heat sink 10 to dissipate the light-emitting module 30 to the outside. The heat generated.
更詳細而言,請參第1D圖,於本實施例中,當燈盤部20與散熱體10接合時,第二側面22係與第一側面13完全貼合,以利用傳導的方式將燈盤部20的熱量傳遞至散熱體10。In more detail, referring to FIG. 1D, in the embodiment, when the lamp panel portion 20 is engaged with the heat sink 10, the second side surface 22 is completely engaged with the first side surface 13 to conduct the lamp by conduction. The heat of the disk portion 20 is transmitted to the heat sink 10.
如第1A圖及第1D 圖所示,為使第一側面13與第二側面22保持完全貼合的接觸狀態,以達到良好的熱傳導效果,可將第一側面13與第二側面22相互固定,如以焊接、射出成形、卡合或一體成形等方式直接相互固定。或可如於本實施例中,並不使第一側面13與第二側面22直接相互固定但仍保持於接觸狀態,如:將燈盤部20與容納於散熱體10的燈體部50以螺絲80相鎖,使燈盤部20與燈體部50將散熱體10夾固時即能保持第二側面22與第一側面13之接觸狀態,此方法容於說明燈體部50之細部構造時一併敘述。As shown in FIG. 1A and FIG. 1D, in order to maintain the first side surface 13 and the second side surface 22 in a completely fitting contact state, to achieve a good heat conduction effect, the first side surface 13 and the second side surface 22 can be fixed to each other. They are directly fixed to each other by welding, injection molding, snapping or integral molding. Alternatively, in the embodiment, the first side surface 13 and the second side surface 22 are not directly fixed to each other but remain in a contact state, such as: the lamp panel portion 20 and the lamp body portion 50 housed in the heat sink body 10 are The screw 80 is interlocked to maintain the contact state between the second side surface 22 and the first side surface 13 when the lamp body portion 20 and the lamp body portion 50 sandwich the heat sink body 10. This method is convenient for explaining the detailed structure of the lamp body portion 50. Time to describe together.
承上所述,於本創作其他實施例中,第二側面22不需與第一側面13完全貼合,舉例而言,請參考第2圖,第2圖為本創作之燈具結構之第二實施例之剖視圖。於第二實施例中,第二側面22之局部係與散熱體10之第一側面13相接觸。詳言之,第二側面22可為自承載面21之一周緣斜向外延伸之一曲面,該曲面依次形成一第一表面22a及一第二表面22b,其中,第一表面22a是與第一側面13貼合的,而第二表面22b與第一側面13之間具有一空隙,因此第二側面22僅以局部接觸第一側面13,但仍能達到傳導發光模組30所產生之熱能的效果。As described above, in other embodiments of the present invention, the second side 22 does not need to be completely attached to the first side surface 13. For example, please refer to FIG. 2, and FIG. 2 is the second structure of the lamp. A cross-sectional view of an embodiment. In the second embodiment, the portion of the second side 22 is in contact with the first side 13 of the heat sink 10. In detail, the second side surface 22 may be a curved surface extending obliquely outward from a circumference of one of the bearing surfaces 21, and the curved surface sequentially forms a first surface 22a and a second surface 22b, wherein the first surface 22a is A side surface 13 is attached, and a gap is formed between the second surface 22b and the first side surface 13. Therefore, the second side surface 22 only partially contacts the first side surface 13, but still can achieve the heat energy generated by the conductive light emitting module 30. Effect.
於本創作第一實施例中,燈體部50具有一本體51、一第三端部52及一容置空間53。現進一步詳述燈體部50與散熱體10之接合方式,於組裝時,如第1A圖及第1D圖所示,燈體部50經由第二開口121,將燈體部50之本體51容置於散熱體10中,使第三端部52位於散熱體10之外而與散熱體10之第二端部12相接,亦即當本體51容置於散熱體10之內部空間14時,第三端部52是自第二開口121延伸而出,並與散熱體10之第二端部12相接。換言之,本體51之一直徑略小於第二開口121之一直徑,而第三端部52之一直徑大於第二開口121之直徑,使得本體51可穿入第二開口121並容納於內部空間14,但第三端部52被定位於第二開口121外。In the first embodiment of the present invention, the lamp body portion 50 has a body 51, a third end portion 52, and an accommodating space 53. The manner in which the lamp body portion 50 and the heat sink 10 are joined will now be described in detail. When assembled, as shown in FIGS. 1A and 1D, the lamp body portion 50 accommodates the body 51 of the lamp body portion 50 via the second opening 121. The third end portion 52 is disposed outside the heat dissipating body 10 and is in contact with the second end portion 12 of the heat dissipating body 10, that is, when the main body 51 is received in the internal space 14 of the heat dissipating body 10, The third end portion 52 extends from the second opening 121 and is in contact with the second end portion 12 of the heat sink 10 . In other words, one of the bodies 51 has a diameter slightly smaller than the diameter of one of the second openings 121, and one of the third end portions 52 has a diameter larger than the diameter of the second opening 121, so that the body 51 can penetrate the second opening 121 and be accommodated in the internal space 14 However, the third end portion 52 is positioned outside the second opening 121.
於本實施例中,請參第1A圖、第1B圖及第1D圖,燈盤部20更具有複數個固定孔23,而燈體部50更具有複數個螺絲孔54,且固定孔23的數量與螺絲孔54的數量相同。當燈盤部20設置於第一開口111、燈體部50之本體51設置於散熱體10中且第三端部52被定位於第二開口121外時,本體51恰可與燈盤部20相接觸,且固定孔23與螺絲孔54恰可連通。因此,當一螺絲80穿過固定孔23而鎖於螺絲孔54時,燈盤部20即可被夾固於螺絲80及燈體部50間,且散熱體10亦被夾固於燈盤部20與燈體部50間,同時此夾固狀態亦使燈盤部20之第二側面22與散熱體10之第一側面13間可不相互固定而保持於接觸狀態。In the present embodiment, referring to FIG. 1A, FIG. 1B and FIG. 1D, the lamp panel portion 20 further has a plurality of fixing holes 23, and the lamp body portion 50 further has a plurality of screw holes 54, and the fixing holes 23 are The number is the same as the number of screw holes 54. When the lamp panel portion 20 is disposed in the first opening 111, the body 51 of the lamp body portion 50 is disposed in the heat sink 10, and the third end portion 52 is positioned outside the second opening 121, the body 51 is just opposite to the lamp panel portion 20. The contacts are in contact with each other, and the fixing holes 23 are in communication with the screw holes 54. Therefore, when a screw 80 is inserted through the fixing hole 23 and locked to the screw hole 54, the lamp portion 20 can be clamped between the screw 80 and the lamp body portion 50, and the heat sink 10 is also clamped to the lamp portion. The gap between the second side 22 of the lamp panel 20 and the first side 13 of the heat sink 10 is maintained in a contact state.
以下說明本創作之電性關係。發光模組30具有複數個發光二極體31。發光二極體31可各別與一電源電性相接,或可一起與一電源電性相接,亦可設置於一電路板上並透過電路板與電源電性相接。本實施例中,發光模組30具有一電路板32,發光二極體31係設於電路板32上並與電路板32形成電性相接,且電路板32係設於承載面21上。然,於本創作其他實施例中,發光模組之複數發光二極體可直接設於承載面上。The following describes the electrical relationship of this creation. The light emitting module 30 has a plurality of light emitting diodes 31. The LEDs 31 can be electrically connected to a power source, or can be electrically connected to a power source, or can be disposed on a circuit board and electrically connected to the power source through the circuit board. In this embodiment, the light-emitting module 30 has a circuit board 32. The light-emitting diodes 31 are disposed on the circuit board 32 and electrically connected to the circuit board 32, and the circuit board 32 is disposed on the bearing surface 21. However, in other embodiments of the present invention, the plurality of light emitting diodes of the light emitting module may be directly disposed on the carrying surface.
燈具結構1之電源板40可為一變壓器、整流器或控制器等電子電路元件。電源板40設置於容置空間52中,且電源板40可與發光模組30電性相接,用以調整或控制通過發光二極體31之電流。The power board 40 of the luminaire structure 1 can be an electronic circuit component such as a transformer, a rectifier or a controller. The power board 40 is disposed in the accommodating space 52, and the power board 40 is electrically connected to the illuminating module 30 for adjusting or controlling the current passing through the illuminating diode 31.
燈具結構1之導電部60可為一制式燈泡接頭,如E27燈泡接頭。導電部60可與燈體部50之第三端部51相接,且導電部60可電源板40及一外加電源形成電性相接。因此電能可依序係透過導電部60、電源板40、電路板32再傳遞至發光二極體31。The conductive portion 60 of the luminaire structure 1 can be a standard bulb connector, such as an E27 bulb connector. The conductive portion 60 can be in contact with the third end portion 51 of the lamp body portion 50, and the conductive portion 60 can be electrically connected to the power board 40 and an external power source. Therefore, the electric energy can be transmitted to the light emitting diode 31 through the conductive portion 60, the power board 40, and the circuit board 32 in sequence.
於本創作中,燈盤部20及燈體部50之至少其中之一具有複數散熱孔70。以下將詳述複數散熱孔70於本創作不同實施例中的分布方式。In the present creation, at least one of the lamp panel portion 20 and the lamp body portion 50 has a plurality of heat dissipation holes 70. The manner in which the plurality of louvers 70 are distributed in different embodiments of the present invention will be described in greater detail below.
於本創作第一實施例中,請參第1A圖,複數散熱孔70是分別形成於燈盤部20及燈體部50。首先,針對形成於燈盤部20之散熱孔70作說明。如第1C圖所示,形成於燈盤部20之散熱孔70係形成於第二側面22上,因此發光模組30所產生之熱氣,可由形成於燈盤部20之散熱孔70排出進而達到散熱、降溫的效果。換言之,除了透過散熱體10以傳導的方式傳導發光模組30之熱能外,形成於燈盤部20之透過散熱孔70,燈具結構1可同時透過空氣對流的方式達到散熱效果。In the first embodiment of the present invention, referring to FIG. 1A, a plurality of heat dissipation holes 70 are formed in the lamp panel portion 20 and the lamp body portion 50, respectively. First, the heat dissipation holes 70 formed in the lamp panel portion 20 will be described. As shown in FIG. 1C, the heat dissipation holes 70 formed in the lamp panel portion 20 are formed on the second side surface 22, so that the hot air generated by the light-emitting module 30 can be discharged by the heat dissipation holes 70 formed in the lamp panel portion 20. Cooling and cooling effects. In other words, in addition to transmitting the heat energy of the light-emitting module 30 through the heat sink 10 in a conductive manner, the light-emitting hole 70 is formed in the light-dissipating hole portion 20, and the lamp structure 1 can simultaneously achieve a heat-dissipating effect by convection of air.
接著說明形成於燈體部50之第三端部52之散熱孔70。透過形成於燈體部50之散熱孔70連通外界及容置空間53,當發光模組30運作時所產生之熱充滿於燈體部50之容置空間53時,便可由位於第三端部52之散熱孔70排出而達到散熱、降溫的效果。Next, the heat dissipation hole 70 formed in the third end portion 52 of the lamp body portion 50 will be described. The heat dissipation hole 70 formed in the lamp body portion 50 communicates with the external space and the accommodating space 53. When the heat generated by the operation of the light-emitting module 30 is filled in the accommodating space 53 of the lamp body portion 50, it can be located at the third end portion. The heat dissipation hole 70 of 52 is discharged to achieve the effects of heat dissipation and temperature reduction.
於本實施例中,燈盤部20具有六個熱孔70而燈體部50具有二個熱孔70,但於本創作其他實施例中,散熱孔70之數量、大小可依實際需要進行調整。現進一步敘述各散熱孔70之相互位置關係,請參第1E圖及第1F圖,第1E圖為本創作之燈具結構之第一實施例之側視圖;第1F圖為本創作之燈具結構之第一實施例另一角度之側視圖。為清楚描述各散熱孔70間之相對關係,係定義一第一虛擬平面X垂直於該承載面21所延伸之一第二虛擬平面Y,當位於燈盤部20之至少一散熱孔70與位於燈體部50之第三端部52之至少一散熱孔70投影於第一虛擬平面X後,係分別具有一投影中心點A及一投影中心點B,且該二投影中心點(即投影中心點A及投影中心點B)之連線z將垂直於承載面21所延伸之第二虛擬平面Y,亦即,如第1E圖所示投影中心點B是位於投影中心點A的正下方的。散熱孔70藉由前述之配置方式,將可達到良好之散熱效果,也就是發光模組30所產生之熱得快速的通過燈盤部20之散熱孔70後,再通過燈體部50之散熱孔70而逸散至外界。In the embodiment, the lamp portion 20 has six heat holes 70 and the lamp body portion 50 has two heat holes 70. However, in other embodiments of the present invention, the number and size of the heat dissipation holes 70 can be adjusted according to actual needs. . The positional relationship between the heat dissipation holes 70 will be further described. Please refer to FIG. 1E and FIG. 1F. FIG. 1E is a side view of the first embodiment of the lamp structure of the present invention; FIG. 1F is the structure of the lamp of the present invention. A side view of another angle of the first embodiment. To clearly describe the relative relationship between the heat dissipation holes 70, a first virtual plane X is defined to be perpendicular to the second virtual plane Y extending from the bearing surface 21, and at least one of the heat dissipation holes 70 located at the lamp panel portion 20 is located. At least one heat dissipation hole 70 of the third end portion 52 of the lamp body portion 50 is projected on the first virtual plane X, and has a projection center point A and a projection center point B, respectively, and the two projection center points (ie, the projection center) The line z of the point A and the projection center point B) will be perpendicular to the second virtual plane Y extended by the bearing surface 21, that is, as shown in FIG. 1E, the projection center point B is located directly below the projection center point A. . The heat dissipation hole 70 can achieve a good heat dissipation effect by the foregoing arrangement, that is, the heat generated by the light-emitting module 30 can quickly pass through the heat dissipation hole 70 of the lamp panel portion 20, and then dissipate heat through the lamp body portion 50. The hole 70 escapes to the outside.
於本創作中,當燈盤部20具有散熱孔70時,散熱孔70可形成於承載面21及第二側面22之至少其中之一上。也就是說,除了本創作第一實施例是將散熱孔70形成於第二側面22上,於其他實施例中,散熱孔70亦可形成於燈盤部20的其他部分。舉例而言,請參考第3圖,第3圖為本創作之燈具結構之第三實施例之前視圖。第三實施例中,各形成於燈盤部20之散熱孔70是同時形成於承載面21及第二側面22上的,亦即各形成於燈盤部20之散熱孔70是由承載面21延伸至第二側面22的。In the present invention, when the lamp panel portion 20 has the heat dissipation holes 70, the heat dissipation holes 70 may be formed on at least one of the bearing surface 21 and the second side surface 22. That is to say, in addition to the first embodiment of the present invention, the heat dissipation holes 70 are formed on the second side surface 22. In other embodiments, the heat dissipation holes 70 may be formed in other portions of the lamp panel portion 20. For example, please refer to FIG. 3, which is a front view of a third embodiment of the luminaire structure of the present invention. In the third embodiment, the heat dissipation holes 70 formed in the lamp panel portion 20 are simultaneously formed on the bearing surface 21 and the second side surface 22, that is, the heat dissipation holes 70 formed in the lamp panel portion 20 are supported by the bearing surface 21 Extending to the second side 22 .
接著請參考第4圖,第4圖為本創作之燈具結構之第四實施例之前視圖。於第四實施例中,各形成於燈盤部20之散熱孔70直接形成於承載面21上。於本實施例中,該等發光二極體31可直接設置於承載面21上,使得形成於燈盤部20之散熱孔70直接逸散發光二極體31所產生之熱。當然,於本創作其他實施例中,若發光模組30具有電路板32,則電路板32可選擇具有複數個電路板通孔分別與各形成於燈盤部20之散熱孔70相應,以保有散熱孔70連通外界及內部空間之功能。Next, please refer to FIG. 4, which is a front view of the fourth embodiment of the lamp structure of the present invention. In the fourth embodiment, the heat dissipation holes 70 formed in the lamp panel portion 20 are directly formed on the bearing surface 21. In the present embodiment, the light-emitting diodes 31 can be directly disposed on the bearing surface 21 such that the heat dissipation holes 70 formed in the lamp panel portion 20 directly scatter the heat generated by the LEDs 31. In other embodiments of the present invention, if the light-emitting module 30 has the circuit board 32, the circuit board 32 may have a plurality of circuit board through holes corresponding to the heat dissipation holes 70 formed in the lamp panel portion 20, respectively. The heat dissipation hole 70 has a function of connecting the outside and the internal space.
請參考第5圖,為本創作之燈具結構之第五實施例之立體圖。於第五實施例中,僅燈體部50之第三端部52具有散熱孔70。請參考第6圖,為本創作之燈具結構之第六實施例之立體圖,於第六實施例中,僅燈盤部20具有散熱孔70。必須特別說明的是,本創作之第一實施例、第三實施例、第四實施例、第五實施例及第六實施例之差異在於散熱孔所形成之位置,但散熱孔所達到的功效仍相似。因此,為本領域具通常知識者所能輕易思及地,第一實施例、第三實施例、第四實施例、第五實施例及第六實施例之散熱孔可選擇地交互混用,並不應以說明書及圖示為限。Please refer to FIG. 5, which is a perspective view of a fifth embodiment of the lamp structure of the present invention. In the fifth embodiment, only the third end portion 52 of the lamp body portion 50 has the heat dissipation holes 70. Referring to FIG. 6, a perspective view of a sixth embodiment of the lamp structure of the present invention is shown. In the sixth embodiment, only the lamp panel portion 20 has a heat dissipation hole 70. It should be particularly noted that the difference between the first embodiment, the third embodiment, the fourth embodiment, the fifth embodiment and the sixth embodiment of the present invention is that the position of the heat dissipation hole is formed, but the effect of the heat dissipation hole is achieved. Still similar. Therefore, the heat dissipation holes of the first embodiment, the third embodiment, the fourth embodiment, the fifth embodiment, and the sixth embodiment are selectively interactively mixed, and can be easily mixed by those skilled in the art, and It should not be limited to the instructions and illustrations.
請續參本創作第一實施例,如第1G圖及第1H圖所示,燈具結構1更可具有一燈罩部90,而燈盤部20之第二側面22可具有複數嵌板221及複數嵌孔222。燈罩部90可包含複數卡合結構91,且卡合結構91、複數嵌板221及複數嵌孔222的數量相同。卡合結構91用以與嵌板221卡合而能固定燈盤部20上而罩蓋燈盤部20。詳言之,卡合結構91可具至少一卡勾93,且於本實例中卡合結構91為二卡勾93,當卡勾93被置入嵌孔222時,卡勾93的位置即被嵌板221限制,而使燈罩部90無法對於燈盤部20相對移動。For the first embodiment of the present invention, as shown in FIG. 1G and FIG. 1H, the lamp structure 1 may further have a lamp cover portion 90, and the second side surface 22 of the lamp panel portion 20 may have a plurality of panels 221 and plural Insert 222. The cover portion 90 can include a plurality of engaging structures 91, and the number of the engaging structures 91, the plurality of panels 221, and the plurality of holes 222 is the same. The engaging structure 91 is for engaging with the panel 221 to fix the lamp panel portion 20 and cover the lamp panel portion 20. In detail, the engaging structure 91 can have at least one hook 93, and in the present example, the engaging structure 91 is a second hook 93. When the hook 93 is inserted into the insertion hole 222, the position of the hook 93 is The panel 221 is restricted so that the shade portion 90 cannot move relative to the panel portion 20.
綜上所述,本創作之燈具結構所具有的特點在於,本創作並非如習知的燈具結構,本創作除了具有散熱體透過與傳導的方式將熱量傳導至外界,本創作燈具結構還具有散熱孔,以使空氣流入或流出的同時利用對流的方式將發光模組的熱量逸散至外界。In summary, the luminaire structure of the present invention has the feature that the creation is not a conventional luminaire structure, and the creation of the luminaire structure has heat dissipation in addition to the heat sink through the conduction and conduction. The holes are used to make the air flow in or out while convecting the heat of the light-emitting module to the outside.
上述之實施例僅用來例舉本創作之實施態樣,以及闡釋本創作之技術特徵,並非用來限制本創作之保護範疇。任何熟悉此技術者可輕易完成之改變或均等性之安排均屬於本創作所主張之範圍,本創作之權利保護範圍應以申請專利範圍為準。The above embodiments are only used to exemplify the implementation of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of protection of the present invention. Any changes or equivalences that can be easily accomplished by those skilled in the art are within the scope of this creation. The scope of protection of this creation shall be subject to the scope of the patent application.
1‧‧‧燈具結構 1‧‧‧Lighting structure
10‧‧‧散熱體 10‧‧‧ Heat sink
20‧‧‧燈盤部 20‧‧‧Lighting section
21‧‧‧承載面 21‧‧‧ bearing surface
22‧‧‧第二側面 22‧‧‧ second side
221‧‧‧嵌板 221‧‧‧ Panel
222‧‧‧嵌孔 222‧‧‧ hole
30‧‧‧發光模組 30‧‧‧Lighting module
31‧‧‧發光二極體 31‧‧‧Lighting diode
32‧‧‧電路板 32‧‧‧ boards
50‧‧‧燈體部 50‧‧‧Light body
52‧‧‧第三端部 52‧‧‧ third end
60‧‧‧導電部 60‧‧‧Electrical Department
70‧‧‧散熱孔 70‧‧‧ vents
80‧‧‧螺絲 80‧‧‧ screws
Claims (7)
一散熱體,具有一第一端部、相對於該第一端部之一第二端部及一第一側面,該第一端部具有一第一開口,該第二端部具有一第二開口;
一燈盤部,具有一承載面及一第二側面,該燈盤部設置於該第一端部之該第一開口中,且該第二側面係與該散熱體之該第一側面相接觸;
一發光模組,設置於該燈盤部之該承載面上,具有複數發光二極體;
一電源板,與該發光模組電性相接;
一燈體部,具有一本體、一第三端部及一容置空間,經由該第二開口,該本體設置於該散熱體中,使該第三端部位於該散熱體之外,並與該散熱體之該第二端部相接,該電源板容置於該容置空間中;以及
一導電部,與該燈體部之該第三端部相接;
其中,該燈盤部及該燈體部之至少其中之一具有複數散熱孔。
A luminaire structure comprising:
a heat dissipating body having a first end portion, a second end portion opposite to the first end portion, and a first side surface, the first end portion having a first opening and the second end portion having a second end Opening
a lamp disc portion having a bearing surface and a second side, the lamp disc portion being disposed in the first opening of the first end portion, wherein the second side surface is in contact with the first side surface of the heat dissipating body ;
a light-emitting module disposed on the bearing surface of the lamp disc portion, having a plurality of light-emitting diodes;
a power board electrically connected to the light emitting module;
The body of the lamp body has a body, a third end portion and an accommodating space. The body is disposed in the heat dissipating body through the second opening, so that the third end portion is located outside the heat dissipating body, and The second end of the heat sink is connected, the power board is received in the accommodating space, and a conductive portion is connected to the third end of the lamp body;
Wherein at least one of the lamp disc portion and the lamp body portion has a plurality of heat dissipation holes.
The luminaire structure of claim 1, wherein each of the heat dissipation holes is formed on at least one of the bearing surface and the second side.
The luminaire structure of claim 1, wherein each of the heat dissipation holes is formed on the third end.
The luminaire structure of claim 1, wherein the portion of the second side is in contact with the first side of the heat sink.
The luminaire structure of claim 1, wherein the second side is completely in conformity with the first side of the heat sink.
The luminaire structure of claim 1, wherein a first virtual plane is perpendicular to a second virtual plane extending from the bearing surface, and the at least one heat dissipation hole located in the lamp panel is located at the lamp body After the at least one heat dissipation hole is projected on the first virtual plane, each has a projection center point, and the connection line of the two projection center points is perpendicular to the second virtual plane extended by the bearing surface.
The luminaire structure of claim 1, wherein the illuminating module has a circuit board, and the illuminating diode system is disposed on the circuit board, and the circuit board is disposed on the bearing surface.
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