TWM447499U - Cooling circulation testing module - Google Patents

Description

Cooling cycle test module

The present invention relates to a cooling cycle test module, in particular to a cooling cycle test module that can be placed on different test arms, and the cooling cycle test module can replace different types of test fixtures and can be used for the test head front end. The test fixtures are heat exchanged by the heat generated by the electronic components to be tested that are in contact with the test during the test to dissipate heat.

The test head generally used for testing is mounted on a robot arm, and the following pressing method presses the electronic component to be tested into the test area of the electrical or hierarchical test equipment, but due to the heat dissipation mechanism of the conventional test head High-performance integrated circuit components to be tested have their shortcomings. Therefore, when conducting electrical testing or hierarchical testing, due to insufficient heat dissipation capability of the test head, the heat dissipation benefits that can be generated after multiple tests will be reduced. Moreover, the heat generated by the integrated circuit components to be tested is not easily dissipated, thereby causing damage to the integrated circuit components to be tested.

In order to solve the above problems, there is an industry additionally preparing a cooling machine to be connected to the test head to reduce the heat energy accumulated on the test head, but the additional cooling machine is not only expensive but also costly. It will increase due to the purchase of the cooling machine. In addition, since the cooling machine must be connected to multiple lines to the test head, the generated heat energy can be effectively exchanged for heat exchange, but the circuit is complicated. The more complicated the line is, it is easy to cause troubles in operation and maintenance. Therefore, adding additional cooling machine to heat dissipation will lead to many non-essential problems.

In addition, since different electronic components to be tested have different sizes, when testing different sizes of electronic components to be tested, the entire test head must be replaced, and the test fixture at the front end of the replaced test head must conform to the size of the electronic component to be tested. However, when testing different components, test The personnel need to change the test head repeatedly, which will cause trouble and trouble for the tester.

Therefore, in order to solve the problem of heat dissipation during the test, a cooling cycle test module can be disposed on the test arm, wherein the cooling cycle test module has a test head, and the test head front end of the test fixture is tested. The thermal energy generated by the electronic component to be tested that is in contact with the process can be heat exchanged by the cooling cycle test module to dissipate thermal energy, and the test fixture at the front end of the test head can be further determined according to different types of electronic components to be tested. To replace different types of test fixtures, this should be an optimal solution.

The present invention provides a cooling cycle test module capable of dissipating heat energy by heat exchange of the heat generated by the electronic components to be tested which are in contact with the test fixture at the front end of the test head.

Another purpose of the present invention is to provide a cooling cycle test module. The test fixture at the front end of the test head can replace different types of test fixtures according to different types of electronic components to be tested, so as to improve the efficiency of the test.

A cooling cycle test module capable of achieving the above-mentioned novel purpose, for testing an electronic component to be tested and controlling temperature, comprising a body; a cooling device disposed inside the body; a set of fans disposed inside the body; a test head connected to the front end of the body, the front end of the test head is assembled with a set of test fixtures; a channel formed inside the body and including an output end and an input end, the channel is connected to the cooling device and has internal working a fluid, wherein the output end and the input end are respectively connected to the test head; and a driving source for driving the working fluid; wherein the cooling cycle test module passes the channel to cyclically exchange the test head front end The thermal energy generated by the electronic components to be tested that are in contact with the test process is subjected to heat exchange, and the air is driven by the fans to exchange heat with the cooling device to dissipate thermal energy.

More specifically, the front end of the test head is a set of test fixtures that are detachable, and different types of test fixtures are replaced according to different types of electronic components to be tested.

More specifically, the test fixture has a plurality of locking holes.

More specifically, the side of the test head extends with a side plate having a locking hole, and the plurality of locking elements pass through the locking hole of the side plate and are locked in the locking hole of the test fixture.

More specifically, the bottom of the test head has a plurality of locking holes, and the plurality of locking elements pass through the locking holes of the test fixture and are locked in the locking holes at the bottom of the test head.

More specifically, at least one set of heat dissipation fins is formed between the output end and the channel of the input end.

More specifically, the workflow system within the channel circulates between the test head, the output of the channel, the input, and the cooling device.

More specifically, the set of fans is disposed in a parallel direction with respect to the cooling device.

The foregoing and other technical features, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

Please refer to FIG. 1A and FIG. 1B, which are schematic diagrams showing the overall structure of the first implementation of the cooling cycle test module and the overall structure of the second implementation. As can be seen from the figure, the cooling cycle test module of the present invention has an ontology. As shown in FIG. 3, the housing 11 of the main body 1 has a cooling device 12, a fan 13 disposed in a parallel direction with respect to the cooling device, and an output end 14 and an input end 15. Channels (not shown) and at least one set of heat sink fins 16 between the output 14 and the channels of the input 15 , and the present application provides an embodiment of two different types of test fixtures, Figure 1 As shown in FIG. 1B, the front end of the body 1 further has a test head 2, 3, as shown in FIG. 3A and FIG. 3B, the front end of the test head 2, 3 can be assembled with a set of test fixtures 4, 5.

In addition, since the channel is connected to the cooling device 12 and has a working fluid inside, the output end 14 and the input end 15 are respectively connected to the test heads 2, 3, so in the actual test process, the pipe body 6 is connected. The working fluid flowing through the test heads 2, 3 enters the cooling device 12 from the input terminal 15 for heat dissipation work, and then the cooling device 12 flows the cooled working fluid into a driving source 17 (for example, a motor, a water pump) Then, the output terminal 14 re-enters the test head 2, and the test heads 2, 3 are repeatedly used to perform heat dissipation and heat exchange on the object to be tested. However, for those skilled in the art, the same effect can be achieved by directing the flow of the working fluid in the opposite direction as described above.

When the working fluid enters the passage in the cooling device 12 from the input end 15, the heat energy generated by the test process is absorbed by the working fluid, and the cooling cycle test module cyclically exchanges the test heads 2, 3 of the test fixtures 4, 5 The thermal energy generated by the electronic component to be tested that is in contact with the test process is exchanged, and the thermal energy is exchanged and dissipated by the heat dissipating fins 16 disposed between the output end 14 and the channel of the input end 15 by the fan. 13 drives the airflow to dissipate heat.

In addition, as shown in FIG. 3A and FIG. 3B, the front ends of the test heads 2 and 3 can be disassembled according to different types of electronic components to be tested to replace different types of test fixtures 4, 5; and different test heads and different test heads The test fixture has a variety of fixed locking modes. The present invention proposes the following two embodiments, but the implementation is not limited to the structures mentioned in the following two embodiments.

As shown in FIG. 3A, the bottom of the test head 2 has a plurality of locking holes 21, and the test fixture 4 has a plurality of locking holes 41 corresponding to the plurality of locking holes 21 at the bottom of the test head 2, therefore, The plurality of locking elements 7 can pass through the locking holes 41 of the test fixture 4 and are locked in the locking holes 21 at the bottom of the test head 2 to fix the test fixture 4 to the front end of the test head 2.

FIG. 3B is a second embodiment of the present invention, wherein the structure of the test fixture 5 is different from that of FIG. 3A, and corresponding to the test fixture 5, the side of the test head 3 extends with a locking hole 311. The side plate 31, therefore, can be passed through the locking hole 311 of the side plate 31 by the plurality of locking elements 7 and The locking hole 32 at the bottom of the test head 3 is locked in the locking hole 51 of the test fixture 5 for fixing the test fixture 5 to the front end of the test head 3.

The cooling cycle test module of the present invention can be mounted on a test arm 8, as shown in FIG. 4A and FIG. 4B, wherein the body 1 is mounted on one side of the test arm 8, and the test head 2, 3 is connected to the front end of the test arm 8, so that when the test arm 8 is lowered to test the test heads 2, 3 of the test heads 2, 3, the cooling cycle test module can be cyclically exchanged during the test of the electronic component to be tested. The test fixtures 2, 3 of the test heads 2, 3 are heated by the electronic components to be tested that are in contact with the test.

The cooling cycle test module provided by this creation has the following advantages when compared with other conventional technologies:

1. This creation can heat the heat generated by the electronic components to be tested that are tightly touched by the test process, and directly exchange heat generated by the cooling cycle test module.

2. In the process of testing, if you need to replace different types of electronic components to be tested, you only need to replace different types of test fixtures, instead of replacing the entire test head, so this creation will be able to improve the test different types. The efficiency of different test fixtures needs to be replaced when the electronic components to be tested are tested.

The features and spirit of the present invention are more clearly described in the above detailed description of the preferred embodiments, and the scope of the present invention is not limited by the preferred embodiments disclosed herein. On the contrary, it is intended to cover all kinds of changes and equivalences within the scope of the patent application to which the present invention is intended.

1‧‧‧ Ontology

11‧‧‧Shell

12‧‧‧Cooling device

13‧‧‧Fan

14‧‧‧ Output

15‧‧‧ input

16‧‧‧Heat fins

17‧‧‧Driver

2‧‧‧Test head

21‧‧‧Lock hole

3‧‧‧Test head

31‧‧‧ side panels

311‧‧‧Lock hole

32‧‧‧Lock hole

4‧‧‧Test fixture

41‧‧‧Lock hole

5‧‧‧Test fixture

51‧‧‧Lock hole

6‧‧‧pipe body

7‧‧‧Locking components

8‧‧‧ test arm

Figure 1A is a schematic diagram showing the overall structure of the first implementation of the creation cooling cycle test module; Figure 1B is a schematic diagram of the overall structure of the second implementation of the creation cooling cycle test module; Figure 2 is a schematic diagram of the body structure of the creation cooling cycle test module; Figure 3A is the first implementation of the creation cooling cycle test module Schematic diagram of the test head and the test fixture decomposition structure; Figure 3B is a schematic diagram of the decomposition structure of the test head and the test fixture of the second implementation of the creation cooling cycle test module; Figure 4A is the first of the creation cooling cycle test module The application schematic diagram is implemented; and FIG. 4B is a schematic diagram of the second implementation application of the creation cooling cycle test module.

1‧‧‧ Ontology

11‧‧‧Shell

12‧‧‧Cooling device

16‧‧‧Heat fins

2‧‧‧Test head

6‧‧‧pipe body

Claims (8)

A cooling cycle test module for testing an electronic component to be tested and controlling temperature comprises: a body; a cooling device disposed inside the body; a set of fans disposed inside the body; and a set connected to the front end of the body a test head, the front end of the test head is assembled with a set of test fixtures; a passage formed inside the body and including an output end and an input end, the passage is connected to the cooling device and has a working fluid inside, wherein the test head The output end and the input end are respectively connected to the test head; and a driving source for driving the working fluid; wherein the cooling cycle test module passes the channel to cyclically exchange the test head front end of the set of test fixtures in the testing process The thermal energy generated by the electronic component to be tested is contacted, and the air is driven by the fans to exchange heat with the cooling device to dissipate thermal energy. The cooling cycle test module of claim 1, wherein the test head of the front end of the test head is detachable, and different types of test fixtures are replaced according to different types of electronic components to be tested. The cooling cycle test module of claim 2, wherein the test fixture has a plurality of locking holes. The cooling cycle test module of claim 3, wherein the side of the test head extends with a side plate having a locking hole, and the plurality of locking elements pass through the locking hole of the side plate and are locked in the test. With a locking hole inside. The cooling cycle test module of claim 3, wherein the bottom of the test head The system has a plurality of locking holes, and the plurality of locking elements pass through the locking holes of the test fixture and are locked in the locking holes at the bottom of the test head. The cooling cycle test module of claim 1, wherein at least one set of heat dissipation fins is formed between the output end and the channel of the input end. The cooling cycle test module of claim 1, wherein the workflow system in the channel circulates between the test head, the output end of the channel, the input end, and the cooling device. The cooling cycle test module of claim 1, wherein the set of fans is disposed in a parallel direction with respect to the cooling device.