TWM302867U - Heat radiator - Google Patents

Heat radiator Download PDF

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Publication number
TWM302867U
TWM302867U TW95208166U TW95208166U TWM302867U TW M302867 U TWM302867 U TW M302867U TW 95208166 U TW95208166 U TW 95208166U TW 95208166 U TW95208166 U TW 95208166U TW M302867 U TWM302867 U TW M302867U
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TW
Taiwan
Prior art keywords
heat sink
heat
base
fan
seat
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Application number
TW95208166U
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Chinese (zh)
Inventor
Yi-He Huang
Original Assignee
Cooler Master Co Ltd
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Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW95208166U priority Critical patent/TWM302867U/en
Publication of TWM302867U publication Critical patent/TWM302867U/en

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M302867 八、新型說明: 【新型所屬之技術領域】 本創作係有關一種散熱裝置,尤指一種具有風扇之散 熱器結構。 【先前技術】M302867 VIII. New description: [New technical field] This creation is related to a heat sink, especially a heat sink structure with a fan. [Prior Art]

在追求體積小型化及輕穎化的趨勢下,其熱量的大幅 增加是在所難免,而為了不讓熱源所產生的溫昇環境影響 電子元件的運作’相對之下散熱的需要也與日倶增,因此 直接將散㈣置組裝於發熱元件上成了目前最常被使用的 一種技術手段,以提高對於發熱元件的散熱效能。 -而習知技術最常見的便是風扇,藉由扇葉轉動使發熱 一牛周&之二氣產生快速流動,將發熱元件所產生之作用 2㈣㈣’以達到其散熱效果’然而其散熱效果卻因 月’、、、面積僅限於發熱元件與風扇之接觸面上而導致其散熱 不佳,使得風扇的散熱效能大打折扣。In the pursuit of volume miniaturization and lightening trend, the large increase in heat is inevitable, and in order to prevent the temperature rise environment generated by the heat source from affecting the operation of electronic components, the relative heat dissipation needs to be compared with the future. Therefore, directly assembling the dispersive (four) on the heating element has become one of the most commonly used techniques to improve the heat dissipation performance of the heating element. - The most common feature of the conventional technology is the fan. The rotation of the fan blade causes the heat to flow quickly and the second gas produces a rapid flow, and the function of the heating element is 2 (four) (four) 'to achieve its heat dissipation effect'. However, due to the month's, the area is limited to the contact surface of the heating element and the fan, resulting in poor heat dissipation, which makes the fan's heat dissipation performance greatly reduced.

雖然後續的技術手段針對上述之發熱元件的散熱面積 熱性;:=,,=複數之繼片或銘擠等具有高導 充 貝 ㈣以貼附於該發光元件上,藉此以擴 再^^、70件之散熱面積’並有效提升其散熱效率,最後 。合-己该風扇之氣冷作用,以完成該發熱元件之散熱作用 熱材^來==之技術手段中,雖然利用具有高導熱之導 率的需求 散熱面積的介f,而有效提升該散熱效 但由於受發熱元件所設置之空間影響,搭配風 5 M302867 ’扇的散熱器結構為了節省处 組成之散熱體上,開 ’、接於由複數散熱片所 裝於該凹槽,以透戶:式凹槽’並將該風扇直接安 動:藉此提高其散熱效率;但在上述:散空氣流 的裝设位置係直接由散… 中,風扇 ㈣與稷數散⑼的結構設計較為方正 J = 生的對流作用形成阻礙,無法快速 扇所產 外霉以Ψ 土 ^ 1 、肘匕吸收熱量的空氣向 卜導引出去,形成熱空氣阻塞而無 ,成為該散熱裝置未盡理想之處。 以政熱作用 【新型内容】 机於^上^之缺失,本創作之主要目的在於提供一種裝 散熱器’藉由將用以擴大散熱面積之球 /…體设汁’並將風扇設置於該散熱體中,除了擴大其 政熱面積以提升該散熱效率外,〃八 下吹送,以加速該散熱器之散熱::風扇之“量加以向 為了達到上述之目的’本創作係提供一種散熱器,並 結構係主要包括-散熱體、—風扇組、—底座及—頂座:、 其中錢熱體係呈球型,並由複數散熱片所組成,且該散 熱體内具有一封罩於内部之容置空間,用以容置該風扇植 ,又,該底座及頂座係設於散熱體之上下兩端,該底座及 頂座係由兩相同之座體對應組成,另外,該風扇底部具有 一義座’該連接座係與底座相連結,以固定該風扇之位 置’最後該底座上設有-導熱體’用以與發熱元件相貼附 ,藉此將發熱元件之作用熱傳導至散熱體,並均勻散逸至 M302867 各散熱片上,再透過風扇之 到 干 【實施方式】 …乂達到放熱需求。 心閱第圖’係為本創作之立體結構分 出,本創作之散熱器主要^Γ M # 固可看 組2、-底庚1=中包=熱體風扇 球體11a及lib所對庫纽忐4. ^ 、 糸由兩個半 吓耵應組成,並在該散熱體丨 形成對應之中空連接部12,而該半球體lla*lltJ=: 所焊接而成(亦可透過黏貼而成),且各散: 第1::緣由二:觀之係呈圓弧形狀(亦可為矩形,如 弟八圖所不),同時在該半球體11a及llb之各散敎片 111内周緣向外彎肖,並在半球體lla及llb對應电 熱體1後,其内形成-封㈣散熱體i内部之球型容置^ 間13,另外,該散熱體i之兩半球體iia及仙亦可—體 構二;又,該風扇組2係容置於上述散熱體i内部所形成 之谷置空間13中’並將其吹送方向朝下,該風扇組2具有 一殼體21 ’殼體21内部設有供其風扇組2運作之電子元件 (圖未明示’此為習知技術不再贅言),在殼體21之周緣 上亚叹有複數扇葉22,另在殼體21之底部上延伸一連接座 23,該連接座23上並設有複數定位孔231,係與底座3相 連結以固定該風扇組2之位置(之後詳述),而該風扇組 2亚電性連接於外部電源供其運作;另外,該底座3係由 兩相對應之座體31a及31b組合而成並透過鎖定元件5 ( 圖式係為螺絲)固定’係由高導熱材質所製成,又,該底 座3對應組合後具有一連接柱32,且與散熱體1底部上之 M302867 連接部12對應接合,並與散熱體1之各散熱片連結固 疋’而在座體31a上更設有複數凹孔311a,在座體31b上 則設有與複數凹孔311a位置對應之複數凸柱312b,使風扇 組2之連接座23透過定位孔231穿設於座體31b上之凸柱 312b ’该凸柱312再對應穿入凹孔311a中並將連接座23夹Although the subsequent technical means is directed to the heat dissipation area heat of the above-mentioned heating element;: =,, = a plurality of succeeding films or a squeezing or the like having a high-conducting filling (4) for attaching to the light-emitting element, thereby expanding the ^^ 70 pieces of heat dissipation area' and effectively improve its heat dissipation efficiency, and finally. In the technical means of completing the heat-dissipation of the heat-generating component, the air-cooling action of the fan is used to reduce the heat dissipation area of the heat-conducting component, thereby effectively improving the heat dissipation. However, due to the influence of the space set by the heating element, the windshield of the fan 5 M302867 'fan is used to save the heat sink formed by the fan, and is connected to the groove by the plurality of heat sinks. : type groove 'and the fan directly to move: to improve its heat dissipation efficiency; but in the above: the installation position of the diffused air flow is directly from the dispersion... The structure design of the fan (4) and the number of turns (9) is more square J = the convection effect of the living forms a hindrance, and the air that can not be quickly produced by the fan can be guided out by the air that absorbs heat from the elbow, and the air is blocked by the hot air, which makes the heat sink not ideal. . The role of political heat [new content] The lack of machine on the ^, the main purpose of this creation is to provide a radiator "by expanding the heat dissipation area of the ball / ... body juice" and set the fan In the heat sink, in addition to expanding its thermal area to enhance the heat dissipation efficiency, it is blown to speed up the heat dissipation of the heat sink: the "quantity of the fan is provided to the purpose of the above purpose". And the structure mainly includes: a heat sink, a fan group, a base, and a top seat: wherein the money heat system is spherical and composed of a plurality of heat sinks, and the heat sink body has a cover inside. The accommodating space is configured to receive the fan plant, and the base and the top seat are disposed on the upper and lower ends of the heat dissipating body, wherein the base and the top seat are composed of two identical seats, and the bottom of the fan has The connector base is coupled to the base to fix the position of the fan. Finally, the base is provided with a heat conductor for attaching to the heat generating component, thereby transferring heat from the heat generating component to the heat sink. and Evenly spread to the heat sink of M302867, and then through the fan to dry [embodiment] ... 乂 to achieve the heat demand. The heart of the picture ' is based on the three-dimensional structure of the creation, the main radiator of this creation ^ Γ M # 固Can see group 2, - bottom Geng 1 = middle package = hot body fan sphere 11a and lib on the library 忐 . 4. ^, 糸 consists of two and a half scare, and form a corresponding hollow connection in the heat sink Part 12, and the hemisphere lll*lltJ=: is welded (also made by pasting), and each is scattered: 1st:: 2: The view is in the shape of a circle (can also be a rectangle, such as At the same time, the inner periphery of each of the hemispherical sheets 111 of the hemispheres 11a and 11b is bent outward, and after the hemispheres 11a and 11b correspond to the electric heating body 1, a heat seal is formed inside the heat sink 1 The inner spherical type of the i-shaped housing 13 is provided. In addition, the two hemispheres iia and the sac of the heat dissipating body i can also be the second body; and the fan unit 2 is housed in the valley formed by the heat dissipating body i. In the space 13 and in the direction of blowing downward, the fan unit 2 has a casing 21 'the inside of the casing 21 is provided for the operation of the fan unit 2 The sub-element (not explicitly shown in the figure is no longer rumored by the prior art), a plurality of blades 22 are sighed on the periphery of the casing 21, and a connecting seat 23 is extended on the bottom of the casing 21, the connecting seat 23 And a plurality of positioning holes 231 are connected to the base 3 to fix the position of the fan group 2 (described later in detail), and the fan group 2 is electrically connected to an external power source for operation thereof; It is composed of two corresponding bases 31a and 31b and is fixed by a locking element 5 (the figure is a screw). The system is made of a highly heat-conductive material, and the base 3 has a connecting post 32 correspondingly combined. And correspondingly connected to the M302867 connecting portion 12 on the bottom of the heat sink 1, and connected to the heat sinks of the heat sink 1 and having a plurality of recesses 311a on the seat 31a, and the base 31b is provided with The plurality of protrusions 312b corresponding to the positions of the plurality of recessed holes 311a, and the connecting posts 23 of the fan group 2 are inserted through the positioning holes 231 through the protrusions 312b of the seat body 31b. The protrusions 312 are correspondingly inserted into the recessed holes 311a. Connecting seat 23 clip

掣於底座3内,藉以固定該風扇組2於散熱體1中之位置 ,而在该底座3之底部更設有一導熱塊33,用以與發熱元 件6相貼附(配合見第三圖);最後,該頂座4係設於散 熱體1頂部之連接部12,具有高導熱性質,該頂座4係由 兩形狀對應之座體41a及41b所組成,並透過鎖固元件5 (圖式係為螺絲)加以固定,同時在兩座體他及仙組 成後具有一連接柱42,且與散熱體丨連接部12之上端對應 接s,並與複散散熱片1U相連結,以固定該散熱片HI 之位置,其組合完成後即如第二圖所示;此外,上述之底 座3及頂座4亦可為一體構成。 一 請參閱第三圖,係為本創作之操作示意圖,當本創作The heat dissipation block 33 is further disposed on the bottom of the base 3 for attaching to the heat generating component 6 (see the third figure). Finally, the top seat 4 is disposed on the connecting portion 12 at the top of the heat dissipating body 1 and has high thermal conductivity. The top seat 4 is composed of two shapes corresponding to the seat bodies 41a and 41b and passes through the locking component 5 (Fig. The system is fixed by screws), and has a connecting post 42 after the two bodies and the celestial body are formed, and is connected with the upper end of the heat sink 丨 connecting portion 12, and is connected with the re-dissipating fin 1U to fix The position of the heat sink HI is as shown in the second figure after the combination is completed; in addition, the base 3 and the top seat 4 described above may be integrally formed. Please refer to the third picture, which is a schematic diagram of the operation of this creation.

遇’向設於散熱體1 内部之風扇組2 界冷空氣產生熱交換之同時,In the event of heat exchange to the cold air of the fan group 2 disposed inside the heat sink 1,

1Π將所吸收之作用熱均勻散 風扇組2,在散熱片ill與外 ’亦利用風扇組2之扇葉22轉 1Π周遭之空氣流動, 更將已吸引熱量之空氣吹送至 M302867 T處’避免熱空氣在發熱元件6之周遭產生溫升效應而損 "亥放熱為結構之散熱效果。 、另外本創作中之散熱體1除了上述之透過焊接、黏 2或一體構成該半球體lla及llb,最後再透過該底座3 ,座4之結合而組成該散熱器結構,亦可直接將複數散 二111直接焊接(或黏接)於該底座3及頂座4組成該 :,、、體1 ’而該散熱體i亦可如第四圖所示,係為一體構 二 咖’該散熱體1係由加工技術形成 ^ 1 ,並在该散熱體1中開設一容置空間12, 用以谷置該風扇組2,最後再與跟底座3及頂座4相結合 ’以完成該散熱器結構。 二翏閱m係為本創作之又—實施例結構示意圖 ^可上看出’於該散熱器結構上裝設至少—個或以上之熱管 7 ’該熱f 7係環設於該散熱體1之表面上,同時在敎管 占附之複數散熱片llla外緣向内縮短,使該被貼附之 硬政熱片Ilia實質小於兩側之複數散熱片㈣,如圖所 Z ’使該熱管7猶如容置於一容置槽中,而該熱管7係具 二:熱端η及冷凝端72,同時該吸熱端71及冷凝端72係 :亥散熱11之底座3及頂座4上’藉此,透過熱管7 j之工作流體及毛細組織’加速傳導由導熱塊33所吸收 2源來傳至頂座4,再均勾散逸至各散熱片m進行散 '、、、作用:最後經由風扇2之吹送,以加強其散熱效率。1Π The absorbed heat is evenly distributed to the fan group 2, and the air around the fins ill and the outer side is also rotated by the fan blades 22 of the fan group 2, and the air that has attracted heat is blown to the M302867T. The hot air generates a temperature rise effect around the heating element 6 and damages the heat dissipation effect of the structure. In addition, the heat dissipating body 1 of the present invention is formed by welding, bonding 2 or integrally forming the hemispheres 11a and 11b, and finally forming the heat sink structure through the combination of the base 3 and the seat 4, or directly散二111 directly soldered (or bonded) to the base 3 and the top seat 4 to form the:,, body 1 ' and the heat sink i can also be as shown in the fourth figure, which is an integrated structure The body 1 is formed by a processing technique, and an accommodating space 12 is opened in the heat dissipating body 1 for arranging the fan group 2, and finally combined with the base 3 and the top seat 4 to complete the heat dissipation. Structure. The second reading is based on the structure of the embodiment of the present invention. It can be seen that 'the heat pipe structure is provided with at least one or more heat pipes 7'. The heat f 7 system ring is disposed on the heat radiating body 1 On the surface, at the same time, the outer edge of the plurality of heat sinks 11la which are occupied by the manifold is shortened inward, so that the attached hard heat film Ilia is substantially smaller than the plurality of heat sinks (four) on both sides, as shown in the figure Z' 7 is placed in a receiving slot, and the heat pipe 7 has two: hot end η and condensing end 72, and the heat absorbing end 71 and the condensing end 72 are: the base 3 of the heat sink 11 and the top seat 4' Thereby, the working fluid and the capillary structure of the heat pipe 7j are accelerated and transmitted by the heat transfer block 33 to the top seat 4, and then the hooks are dissipated to the heat sinks m to be dispersed, and finally: The fan 2 is blown to enhance its heat dissipation efficiency.

At、准乂上所述之貫施方式,是為較佳之實施實例,當不 此以此限定本創作實施範圍’若依本創作申請專利範圍及 9 M302867 皆應屬本創作下述之 說明書内容所作之等效變化或修傳 專利涵蓋範圍。 【圖式簡單說明】 =一圖、係為本創作之立體結構分解圖。 第一圖、係為本創作之立體結構圖。 :三圖、係、為本創作之立體結構側視操作圖。 :四圖、係為本創作之散熱體另一實施例結構示意圖。The method described in At, the standard is the preferred embodiment. If this is not the case, the scope of the creation is limited. If the scope of application for this creation and 9 M302867 are the contents of the following description of the creation, The equivalent changes made or the scope of the patents covered. [Simple description of the schema] = One diagram is the exploded view of the three-dimensional structure of the creation. The first picture is a three-dimensional structure diagram of the creation. : Three drawings, series, and the three-dimensional structure side view operation diagram of the creation. Fig. 4 is a schematic view showing the structure of another embodiment of the heat sink of the present invention.

^五圖、係為本創作之又_實施例結構示意圖。 第/、圖係為本創作之另一散熱體實施例結構示意圖。 【主要元件符號說明】 1、散熱體^五图, is a schematic diagram of the structure of the creation. The figure / diagram is a schematic structural diagram of another heat sink embodiment of the creation. [Main component symbol description] 1. Heat sink

11 ( a〜b )、半球體 12 、連接部 2 、風扇組 21 、殼體 23、連接座 3 、底座 31 ( a〜b )、座體 312b、凸柱 33、導熱塊 4 、頂座 41 ( a〜b )、座體 5 、鎖固元件 6 、發熱元件 111 ( a〜b )、散熱片 13 、容置空間 22、扇葉 231 、定位孔 311a、凹孔 32、連接柱 42、連接柱 10 M302867 7 、熱管 71、吸熱端 72、冷凝端11 ( a ~ b ), hemisphere 12, connecting portion 2, fan group 21, housing 23, connecting base 3, base 31 (a ~ b), seat body 312b, stud 33, heat conducting block 4, top seat 41 (a~b), the base 5, the locking element 6, the heating element 111 (a~b), the heat sink 13, the accommodating space 22, the blade 231, the positioning hole 311a, the recess 32, the connecting post 42, and the connection Column 10 M302867 7 , heat pipe 71 , heat absorption end 72 , condensation end

Claims (1)

M302867 九、申請專利範圍: L種放熱為,用以貼附於發熱元件上,係包括: 一散熱體,係由複數環形散熱片所組成,該散熱體内具 有一封罩式容置空間; 一底座,係設於該散熱體之底部,與散熱體相結合,另 底座之底部與發熱元件相貼附; 一風扇組,係設於該散熱體之封罩式容置空間内,另該 _ 風扇組之底部具有一連接座,係與底座相連結,以固定 該風扇組之位置。 2·如申請專利範圍第丨項所述之散熱器,其中該散熱體係 由兩對應之半球體所組成。 3·如申請專利範圍第2項所述之散熱器,其中該半球體係 由複數散熱片所組成。 4·如申請專利範圍第丨項所述之散熱器,其中該散熱片之 外緣係成圓弧形。 • 5.如申請專利範圍第1項所述之散熱器,其中該散熱片之 外緣係成矩形。 6·如申請專利範圍第丨項所述之散熱器,其中該散熱體之 上下兩端分別具有一中空連接部。 7·如申請專利範圍第1項所述之散熱器,其中該散熱體之 頂部更設有一頂座。 8·如申請專利範圍第7項所述之散熱器,其中該頂座係與 連接部相連結。 9·如中請專利範圍第7項所述之散熱器,其中該頂座更具 M302867 有一連接柱。 10·如申請專利範圍第9項所述之散熱器, 與散熱體之各散熱片相結合。 11·如申請專利範圍第7項所述之散熱器, 兩對應之座體組合而成。 12·如申請專利範圍第η項所述之散熱器, 座體係由鎖固元件固定連結。 ^ 13·如申請專利範圍第7項所述之散熱器, 一體構成。 14.如申請專利範圍第7項所述之散熱器, 有高導熱性。 15·如申請專利範圍第1項所述之散熱器, 有一連接柱。 16·如申請專利範圍第15項所述之散熱器, 係與散熱體之連接部相接合。 »17·如申請專利範圍第1項所述之散熱器, 兩對應之座體所組成。 18·如申請專利範圍第17項所述之散熱器, 分別設有複數位置相對應之凸柱及凹孔 19·如申請專利範圍第1項所述之散熱器, 一體構成。 20·如申請專利範圍第1項所述之散熱器, 有南導熱性。 21·如申請專利範圍第1項所述之散熱器, 其中該連接柱係 其中该丁頁座係由 其中該兩對應之 其中該頂座係為 其中該頂座係具 其中該底座更具 其中该该連接柱 其中該底座係由 其中該兩座體上 〇 其中該底座係為 其中該底座係具 其中該底座之底 13 M302867 、部更設有一導熱塊。 22·如申明專利乾圍第1項所述之散熱器,其中該風扇组之 吹送方向係為向下吹送。 、 23·如申請專利範圍第1項所述之散熱器,其中該風扇組之 連接座係夾掣於底座中。 4·女申叫專利範圍第j項所述之散熱器,其中該風扇組之 連接座上設有複數定位孔。 φ 士申明專利範圍第24項所述之散熱器,其中該定位孔係 穿設於底座上之凸柱。 %·如申請專利範圍第丨項所述之散熱器,其中該散熱器結 構更包括至少一熱管。 27.如申請專利範圍第26項所述之散熱器,其中該熱管係環 設於散熱體之外緣。 28·如申請專利範圍第26項所述之散熱器,其中該熱管所貼 附之複數散熱片實質小於兩侧之複數散熱片。 _ 29·如申請專利範圍第26項所述之散熱器,其中該熱管之兩 端係串設於底座及頂座内。 14M302867 IX. Patent application scope: L type exotherm is attached to the heating element, and includes: a heat dissipating body, which is composed of a plurality of annular fins, and the heat dissipating body has a cover type accommodating space; a base is disposed at the bottom of the heat dissipating body, and is coupled with the heat dissipating body, and the bottom of the other base is attached to the heat generating component; a fan set is disposed in the enclosure type receiving space of the heat dissipating body, and the _ The bottom of the fan pack has a connecting base that is coupled to the base to fix the position of the fan pack. 2. The heat sink of claim 2, wherein the heat dissipation system is composed of two corresponding hemispheres. 3. The heat sink of claim 2, wherein the hemispherical system is comprised of a plurality of heat sinks. 4. The heat sink of claim 2, wherein the outer edge of the heat sink is arcuate. 5. The heat sink of claim 1, wherein the outer edge of the heat sink is rectangular. 6. The heat sink of claim 2, wherein the upper and lower ends of the heat sink respectively have a hollow connecting portion. 7. The heat sink of claim 1, wherein the top of the heat sink is further provided with a top seat. 8. The heat sink of claim 7, wherein the top seat is coupled to the connecting portion. 9. The heat sink of claim 7, wherein the top seat has a connecting post for the M302867. 10. The heat sink according to claim 9 is combined with each heat sink of the heat sink. 11. If the heat sink described in item 7 of the patent application is applied, the two corresponding seats are combined. 12. The heat sink of claim n, wherein the seat system is fixedly connected by a locking element. ^ 13· The heat sink according to item 7 of the patent application is integrally formed. 14. The heat sink of claim 7, which has high thermal conductivity. 15. The heat sink of claim 1, wherein there is a connecting post. The heat sink according to claim 15 is joined to the connecting portion of the heat sink. »17· As claimed in the scope of claim 1, the two radiators are composed of two corresponding seats. 18. The heat sink according to item 17 of the patent application, wherein the plurality of protrusions and recesses corresponding to the plurality of positions are respectively provided. 19. The heat sink according to claim 1 is integrally formed. 20. The heat sink according to item 1 of the patent application has a south thermal conductivity. The heat sink of claim 1, wherein the connecting post is wherein the pedestal is composed of the two of the top seats, wherein the top seat is the top pedestal, wherein the pedestal is more In the connecting post, the base is formed by the two bases, wherein the base is a base of the base, wherein the base 13 M302867 is further provided with a heat conducting block. The radiator of claim 1, wherein the blowing direction of the fan group is downward blowing. The heat sink of claim 1, wherein the connector set of the fan set is clamped in the base. 4. The female application is called the heat sink of the above-mentioned patent scope, wherein a plurality of positioning holes are provided in the connecting seat of the fan group. The heat sink of claim 24, wherein the positioning hole is passed through a stud on the base. The heat sink of claim 2, wherein the heat sink structure further comprises at least one heat pipe. 27. The heat sink of claim 26, wherein the heat pipe is disposed at an outer edge of the heat sink. The heat sink of claim 26, wherein the plurality of heat sinks attached to the heat pipe are substantially smaller than the plurality of heat sinks on both sides. The heat sink of claim 26, wherein the two ends of the heat pipe are arranged in the base and the top seat. 14
TW95208166U 2006-05-12 2006-05-12 Heat radiator TWM302867U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8256258B2 (en) 2007-01-15 2012-09-04 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8256258B2 (en) 2007-01-15 2012-09-04 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method

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